Display panel

Abstract

The application provides a display panel; the display panel comprises a substrate substrate, an inorganic insulating layer, an isolation structure, an organic light-emitting layer, a first inorganic packaging layer and a second inorganic packaging layer; wherein the substrate substrate comprises a display area and a non-display area located on one side of the display area; the inorganic insulating layer is arranged on the non-display area and protrudes from the substrate substrate; the projection of the organic light-emitting layer on the substrate substrate along the stacking direction is located in the projection of the first inorganic packaging layer on the substrate substrate along the stacking direction; the second inorganic packaging layer is arranged on the side of the first inorganic packaging layer away from the substrate substrate and covers the surface of part of the first inorganic packaging layer located on the non-display area; wherein the projection of the organic light-emitting layer on the substrate substrate along the stacking direction is located in the projection of the inorganic insulating layer on the substrate substrate along the stacking direction; the second inorganic packaging layer overlaps the inorganic insulating layer and covers the end face of the organic light-emitting layer and the end face of the first inorganic packaging layer. The display panel effectively improves the packaging reliability.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel. BACKGROUND

[0002] Organic light emitting diode (OLED) display panel is widely used in various fields due to its lightness, wide viewing angle, fast response, low temperature resistance, high luminous efficiency and the ability to prepare a curved flexible display screen. The OLED display panel includes a display area for displaying images and a non-display area surrounding the display area.

[0003] In the prior art, when the non-display area is encapsulated, the organic light emitting layer has a risk of falling off during the encapsulation process, which affects the encapsulation reliability of the display panel. SUMMARY

[0004] The display panel provided by the present application aims to solve the problem of the risk of falling off of the organic light emitting layer in the existing OLED display panel during the encapsulation process, which affects the encapsulation reliability.

[0005] To solve the above technical problems, one technical solution adopted by the present application is to provide a display panel, comprising:

[0006] a substrate substrate; the substrate substrate includes a display area and a non-display area located on one side of the display area;

[0007] an inorganic insulating layer disposed in the non-display area and protruding from the substrate substrate;

[0008] an isolation structure disposed on the side surface of the inorganic insulating layer away from the substrate substrate;

[0009] an organic light emitting layer disposed on one side of the substrate substrate facing the inorganic insulating layer;

[0010] a first inorganic encapsulation layer disposed on the side surface of the organic light emitting layer away from the substrate substrate; and the projection of the organic light emitting layer on the substrate substrate along the stacking direction is located within the projection of the first inorganic encapsulation layer on the substrate substrate along the stacking direction;

[0011] a second inorganic encapsulation layer disposed on the side of the first inorganic encapsulation layer away from the substrate substrate and covering the surface of the part of the first inorganic encapsulation layer located on the non-display area;

[0012] The projection of the organic light-emitting layer on the substrate substrate along the stacking direction is located within the projection of the inorganic insulating layer on the substrate substrate along the stacking direction; the second inorganic encapsulation layer overlaps the inorganic insulating layer and covers the end surface of the organic light-emitting layer and the end surface of the first inorganic encapsulation layer.

[0013] In a specific embodiment, the organic light-emitting layer is separated by the isolation structure, and covers at least part of the surface of the inorganic insulating layer not covered by the isolation structure; the first inorganic encapsulation layer covers the isolation structure;

[0014] The end surface of the organic light-emitting layer is flush with the end surface of the first inorganic encapsulation layer;

[0015] The minimum distance between the edge of the projection of the organic light-emitting layer on the substrate substrate and the edge of the projection of the isolation structure on the substrate substrate is greater than or equal to 1 microns and less than or equal to 10 microns.

[0016] In a specific embodiment, the width of the inorganic insulating layer gradually decreases along the substrate substrate towards the inorganic insulating layer; wherein the width of the inorganic insulating layer is the size of the inorganic insulating layer along the first direction; the first direction is perpendicular to the stacking direction;

[0017] The inorganic insulating layer has oppositely arranged first and second surfaces, and a third surface connecting the first and second surfaces; wherein the first surface is located on the side of the inorganic insulating layer away from the display area;

[0018] The edge of the projection of the organic light-emitting layer on the substrate substrate is located within the projection of the first surface on the substrate substrate; the second inorganic encapsulation layer overlaps the first surface and covers the end surface of the organic light-emitting layer and the end surface of the first inorganic encapsulation layer.

[0019] In a specific embodiment, further comprising:

[0020] An organic encapsulation layer is arranged between the first inorganic encapsulation layer and the second inorganic encapsulation layer on the display area.

[0021] In a specific embodiment, further comprising:

[0022] An overhanging structure is arranged near the edge of the display area close to the non-display area;

[0023] The organic light-emitting layer covers one side surface of the overhanging structure; the projection of the overhanging structure on the substrate substrate along the stacking direction is located within the projection of the organic light-emitting layer on the substrate substrate along the stacking direction;

[0024] The organic encapsulation layer overlaps with the substrate; the projection of the organic light-emitting layer on the substrate along the stacking direction is located within the projection of the organic encapsulation layer on the substrate along the stacking direction; the organic encapsulation layer covers the end face of the organic light-emitting layer and the end face of the first inorganic encapsulation layer.

[0025] In one specific embodiment, the minimum distance between the edge of the projection of the organic light-emitting layer on the substrate and the edge of the projection of the dangling structure on the substrate is greater than or equal to 1 micrometer and less than or equal to 10 micrometers.

[0026] In one specific embodiment, it further includes:

[0027] A third inorganic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer, and covers the surface of the first inorganic encapsulation layer; the third inorganic encapsulation layer extends from the display area to the non-display area; and the third inorganic encapsulation layer overlaps with the inorganic insulating layer and covers the end face of the organic light-emitting layer and the end face of the first inorganic encapsulation layer.

[0028] The second inorganic encapsulation layer covers a portion of the third inorganic encapsulation layer located on the non-display area.

[0029] In one specific embodiment, the end face of the second inorganic encapsulation layer intersects with the end face of the third inorganic encapsulation layer; and the projection of the second inorganic encapsulation layer on the substrate is within the projection of the third inorganic encapsulation layer on the substrate.

[0030] In one specific embodiment, it further includes:

[0031] A boss is disposed between the substrate and the inorganic insulating layer; the inorganic insulating layer covers the surface of the boss and overlaps with the substrate.

[0032] In one specific embodiment, the protrusion includes a first protrusion and a second protrusion spaced apart; and the first protrusion is located on the side of the non-display area away from the display area, and the second protrusion is located on the side of the non-display area closer to the display area;

[0033] The inorganic insulating layer includes a first insulating layer disposed on the first protrusion and a second insulating layer disposed on the second protrusion;

[0034] The isolation structure includes a first isolation structure disposed on the first insulating layer and a second isolation structure disposed on the second insulating layer.

[0035] The beneficial effects of the embodiments of this application are as follows: Unlike the prior art, this application provides a display panel; the display panel includes a substrate, an inorganic insulating layer, an isolation structure, an organic light-emitting layer, a first inorganic encapsulation layer, and a second inorganic encapsulation layer; wherein, the substrate includes a display area and a non-display area located on one side of the display area; the inorganic insulating layer is disposed in the non-display area and protrudes from the substrate; the isolation structure is disposed on the surface of the inorganic insulating layer away from the substrate; the organic light-emitting layer is disposed on the side of the substrate facing the inorganic insulating layer; the first inorganic encapsulation layer is disposed on the surface of the organic light-emitting layer away from the substrate; and the projection of the organic light-emitting layer on the substrate along the stacking direction is located within the projection of the first inorganic encapsulation layer on the substrate along the stacking direction; the second inorganic encapsulation layer is disposed on the side of the first inorganic encapsulation layer away from the substrate and covers a portion of the surface of the first inorganic encapsulation layer located in the non-display area; wherein, the projection of the organic light-emitting layer on the substrate along the stacking direction is located within the projection of the inorganic insulating layer on the substrate along the stacking direction; the second inorganic encapsulation layer overlaps with the inorganic insulating layer and covers the end face of the organic light-emitting layer and the end face of the first inorganic encapsulation layer. By setting an inorganic insulating layer protruding from the substrate in the non-display area, the organic light-emitting layer and the first inorganic encapsulation layer are disconnected on the inorganic insulating layer, and the second inorganic encapsulation layer covers the ends of the organic light-emitting layer and the first inorganic encapsulation layer to seal them, reducing the risk of the organic light-emitting layer falling off during the encapsulation process. At the same time, the disconnection of the organic light-emitting layer and the first inorganic encapsulation layer on the inorganic insulating layer can also reduce the length of the organic light-emitting layer along the first direction X, further improving the sealing effect of the second inorganic encapsulation layer on the organic light-emitting layer and the first inorganic encapsulation layer, further reducing the risk of the organic light-emitting layer falling off during the encapsulation process, thereby effectively improving the encapsulation reliability. Attached Figure Description

[0036] Figure 1a This is a schematic diagram of the structure of the display panel provided in the first embodiment of this application;

[0037] Figure 1b for Figure 1a A magnified view of a section at point A in the middle;

[0038] Figure 2a This is a schematic diagram of the structure of the display panel provided in the second embodiment of this application;

[0039] Figure 2b for Figure 2a A magnified view of a section at point B in the middle;

[0040] Figure 3a This is a schematic diagram of the structure of the display panel provided in the third embodiment of this application;

[0041] Figure 3b for Figure 3a A magnified view of a section at point C;

[0042] Figure 4a This is a schematic diagram of the structure of the display panel provided in the fourth embodiment of this application;

[0043] Figure 4b for Figure 4a A magnified view of a section at point D;

[0044] Figure 5 This is a schematic diagram of the structure of the display panel provided in the fifth embodiment of this application;

[0045] Figure 6 This is a schematic diagram of the structure of the display panel provided in the sixth embodiment of this application.

[0046] Explanation of icon numbers:

[0047] 1-Substrate; 2-Inorganic insulating layer; 3-Isolation structure; 4-Organic light-emitting layer; 5-First inorganic encapsulation layer; 6-Second inorganic encapsulation layer; 7-Suspended structure; 8-Boss; 9-Third inorganic encapsulation layer; 10-Organic encapsulation layer; 101-Display area; 102-Non-display area; 11-Glass substrate; 12-Buffer layer; 13-Dielectric layer; 14-Source / drain metal layer; 15-Gate insulating layer; 210-First surface; 220-Second surface; 230-Third surface; 21-First insulating layer; 22-Second insulating layer; 31-First isolation structure; 32-Second isolation structure; 71-Conductive part; 72-Insulating part; 81-First boss; 82-Second boss. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0049] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0050] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0051] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0052] See Figure 1a and Figure 1b , Figure 1a This is a schematic diagram of the structure of the display panel provided in the first embodiment of this application; Figure 1b for Figure 1a A partial enlarged view at point A. This application provides a display panel, which can be an OLED display panel; the display panel may include a substrate 1, an inorganic insulating layer 2, an isolation structure 3, an organic light-emitting layer 4, a first inorganic encapsulation layer 5, and a second inorganic encapsulation layer 6.

[0053] The substrate 1 includes a display area 101 and a non-display area 102 located on one side of the display area 101. Specifically, the substrate 1 may also include a hole area (not shown). The non-display area 102 may be located inside the display area 101 and surrounding the hole area, or it may be located outside the display area 101 and surrounding it. The area of ​​the display panel corresponding to the display area 101 includes multiple pixel units for displaying images; the area of ​​the display panel corresponding to the hole area can be used to house a camera; the area of ​​the display panel corresponding to the non-display area 102 includes circuits, pads, and a frame, wherein the frame is used to cover the circuits and pads.

[0054] An inorganic insulating layer 2 is disposed on the non-display area 102 of the substrate 1 and protrudes from the substrate 1 to form a raised structure. An isolation structure 3 is disposed on the surface of the inorganic insulating layer 2 away from the substrate 1 to block the film layer disposed on the display area 101, preventing the film layer disposed on the display area 101 from overflowing into the non-display area 102 during the manufacturing process. Furthermore, by disposing of the inorganic insulating layer 2 between the isolation structure 3 and the substrate 1, the height of the isolation structure 3 can be increased to enhance its blocking ability. Specifically, the inorganic insulating layer 2 can be a multilayer structure.

[0055] Combination Figure 1a and Figure 1b An organic light-emitting layer 4 is disposed on the side of the substrate 1 facing the inorganic insulating layer 2, and the organic light-emitting layer 4 at least partially covers the inorganic insulating layer 2. Specifically, the organic light-emitting layer 4 can be deposited on the substrate 1 by vapor deposition of organic light-emitting materials. The projection of the organic light-emitting layer 4 along the stacking direction Y on the substrate 1 lies within the projection of the inorganic insulating layer 2 along the stacking direction Y on the substrate 1.

[0056] The first inorganic encapsulation layer 5 is disposed on the side surface of the organic light-emitting layer 4 away from the substrate 1, and the projection of the organic light-emitting layer 4 on the substrate 1 along the stacking direction Z of the display panel is located within the projection of the first inorganic encapsulation layer 5 on the substrate 1 along the stacking direction Z. Specifically, the projection of the end face of the organic light-emitting layer 4 is located within the projection of the first inorganic encapsulation layer 5, and the projection of the end face of the first inorganic encapsulation layer 5 is located within the projection of the inorganic insulating layer 2. It should be noted that, in this embodiment, the end face of the organic light-emitting layer 4 is the side surface of the end of the organic light-emitting layer 4 away from the display area 101 along the first direction X, and the end face of the first inorganic encapsulation layer 5 is the side surface of the end of the first inorganic encapsulation layer 5 away from the display area 101 along the first direction X.

[0057] It is understandable that during the manufacturing process, after the organic light-emitting layer 4 is deposited, a first inorganic encapsulation layer 5 needs to be formed on the surface of the organic light-emitting layer 4 immediately to protect the organic light-emitting layer 4 from damage. After the first inorganic encapsulation layer 5 is formed, the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 are etched simultaneously, which means that the end face of the organic light-emitting layer 4 is not covered by the first inorganic encapsulation layer 5. As a result, the end face of the organic light-emitting layer 4 is exposed together with the end face of the first inorganic encapsulation layer 5, so an additional encapsulation layer is needed for protection.

[0058] The second inorganic encapsulation layer 6 is disposed on the side of the first inorganic encapsulation layer 5 away from the substrate 1 and covers part of the surface of the first inorganic encapsulation layer 5 located on the non-display area 102; the second inorganic encapsulation layer 6 overlaps with the inorganic insulating layer 2 to form a sealing structure that can cover the end face of the organic light-emitting layer 4 and the end face of the first inorganic encapsulation layer 5, thereby further encapsulating the organic light-emitting layer 4.

[0059] Thus, by providing an inorganic insulating layer 2 protruding from the substrate 1 in the non-display area 102, the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 are disconnected on the inorganic insulating layer 2, and the second inorganic encapsulation layer 6 covers the ends of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 to seal the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, reducing the risk of the organic light-emitting layer 4 falling off during the encapsulation process. At the same time, the disconnection of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 on the inorganic insulating layer 2 can also reduce the length of the organic light-emitting layer 4 along the first direction X, further improving the sealing effect of the second inorganic encapsulation layer 6 on the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, further reducing the risk of the organic light-emitting layer 4 falling off during the encapsulation process, thereby effectively improving the encapsulation reliability.

[0060] In a specific embodiment, the substrate 1 may include a glass substrate 11, a buffer layer 12, a dielectric layer 13, a source / drain metal layer 14, a gate insulating layer 15, and other film layers. The specific structure and function of these film layers are the same as or similar to the structure and function of film layers in the prior art. For details, please refer to the prior art, which will not be repeated here.

[0061] like Figure 1a As shown, in a specific embodiment, the organic light-emitting layer 4 is separated by the isolation structure 3 and at least covers a portion of the surface of the inorganic insulating layer 2 not covered by the isolation structure 3. Specifically, the organic light-emitting layer 4 extends from the surface of the display area 101 of the substrate 1 to the surface of the non-display area 102 and covers the side of the isolation structure 3 away from the substrate 1; wherein, the organic light-emitting layer 4 is discontinuous between the surface of the isolation structure 3 and the surface of the inorganic insulating layer 2.

[0062] The first inorganic encapsulation layer 5 covers the isolation structure 3 to increase the adhesion area of ​​the first inorganic encapsulation layer 5, allowing it to adhere better to the surface of the organic light-emitting layer 4 and preventing it from detaching from the surface of the organic light-emitting layer 4. Specifically, the overhanging structure 7 may include a support portion disposed on the surface of the inorganic insulating layer 2 and an eaves portion located on the side of the support portion away from the inorganic insulating layer 2. The eaves portion protrudes from both sides of the support portion along the first direction X to form an eaves structure. The first direction X is perpendicular to the lamination direction Y.

[0063] Thus, when the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 are deposited by vapor deposition, the evaporation angle can be changed by the eaves structure so that the first inorganic encapsulation layer 5 covers the surface of the isolation structure 3 that is not covered by the organic light-emitting layer 4; that is, the first inorganic encapsulation layer 5 covers the side of the support and the side of the eaves, as well as the part of the eaves facing the support and not covered by the support.

[0064] like Figure 1b As shown, preferably, the end face of the first inorganic encapsulation layer 5 is flush with the end face of the organic light-emitting layer 4, so that the second inorganic encapsulation layer 6 can directly cover the end face of the organic light-emitting layer 4, avoiding the situation where there is a gap between the end face of the organic light-emitting layer 4 and the second inorganic encapsulation layer 6, which would affect the encapsulation reliability of the second inorganic encapsulation layer 6.

[0065] The minimum distance 'a' between the edge of the projection of the organic light-emitting layer 4 onto the substrate 1 and the edge of the projection of the isolation structure 3 onto the substrate 1 is greater than or equal to 1 micrometer and less than or equal to 10 micrometers; for example, 'a' can be any value among 1 micrometer, 3 micrometers, 5 micrometers, 8 micrometers, or 10 micrometers. It can be understood that the end face of the organic light-emitting layer 4 is flush with the end face of the first inorganic encapsulation layer 5, that is, the minimum distance 'a' between the edge of the first inorganic encapsulation layer 5 onto the substrate 1 and the edge of the projection of the isolation structure 3 onto the substrate 1. If 'a' is too small, it will affect the sealing effect of the first inorganic encapsulation layer 5 on the isolation structure 3, thereby affecting the encapsulation reliability; if 'a' is too large, it will increase the risk of the organic light-emitting layer 4 detaching. Therefore, ensuring that the minimum distance 'a' between the edge of the projection of the organic light-emitting layer 4 onto the substrate 1 and the edge of the projection of the isolation structure 3 onto the substrate 1 is greater than or equal to 1 micrometer and less than or equal to 10 micrometers can reduce the risk of the organic light-emitting layer 4 detaching while ensuring encapsulation reliability.

[0066] like Figure 1a As shown, in a specific embodiment, the width of the inorganic insulating layer 2 gradually decreases along the direction from the substrate 1 toward the inorganic insulating layer 2; wherein, the width of the inorganic insulating layer 2 is the dimension of the inorganic insulating layer 2 along the first direction X; that is, the cross-section of the inorganic insulating layer 2 is a trapezoid.

[0067] Specifically, the inorganic insulating layer 2 has a first surface 210 and a second surface 220 disposed opposite to each other along the first direction X, and a third surface 230 connecting the first surface 210 and the second surface 220. The first surface 210 is located on the side of the inorganic insulating layer 2 away from the display area 101 along the first direction X; the second surface 220 is located on the side of the inorganic insulating layer 2 close to the display area 101 along the first direction X; and the third surface 230 is located on the side of the inorganic insulating layer 2 away from the substrate 1 along the stacking direction Y, and the isolation structure 3 is disposed on the third surface 230.

[0068] Combination Figure 1b The edge of the projection of the organic light-emitting layer 4 on the substrate 1 is located within the projection of the first surface 210 on the substrate 1, so that the minimum distance a between the edge of the projection of the organic light-emitting layer 4 on the substrate 1 and the edge of the projection of the isolation structure 3 on the substrate 1 is greater than or equal to 1 micrometer and less than or equal to 10 micrometers, thereby reducing the risk of the organic light-emitting layer 4 falling off while ensuring the reliability of the packaging.

[0069] The second inorganic encapsulation layer 6 overlaps with the first surface 210 and covers the end faces of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, so that the second inorganic encapsulation layer 6 and the first surface 210 of the inorganic insulating layer 2 cooperate to form a sealed structure to encapsulate the organic light-emitting layer 4 and the first inorganic encapsulation layer 5. Specifically, the second inorganic encapsulation layer 6 can also extend from the first surface 210 to the surface of the substrate 1 to further improve the encapsulation reliability.

[0070] Of course, in other embodiments, the edge of the projection of the organic light-emitting layer 4 on the substrate 1 can also be located within the projection of the third surface 230 on the substrate 1, as long as the minimum distance a between the edge of the projection of the organic light-emitting layer 4 on the substrate 1 and the edge of the projection of the isolation structure 3 on the substrate 1 is greater than or equal to 1 micrometer and less than or equal to 10 micrometers.

[0071] Continue reading Figure 1a In a specific embodiment, the display panel may further include a protrusion 8 disposed between the substrate 1 and the inorganic insulating layer 2; wherein the inorganic insulating layer 2 covers the surface of the protrusion 8 and overlaps with the substrate 1 to form a sealing structure to seal the protrusion 8. The protrusion 8 may be an organic planarization layer, specifically a single-layer structure or a multi-layer structure. By providing the protrusion 8, the height of the isolation structure 3 is further increased, thereby enhancing the blocking capability of the isolation structure 3.

[0072] In a specific embodiment, the protrusion 8 may include a first protrusion 81 and a second protrusion 82 spaced apart; and along the first direction X, the first protrusion 81 is located on the side of the non-display area 102 away from the display area 101, and the second protrusion 82 is located on the side of the non-display area 102 closer to the display area 101. The inorganic insulating layer 2 may include a first insulating layer 21 disposed on the first protrusion 81 and a second insulating layer 22 disposed on the second protrusion 82. The isolation structure 3 may include a first isolation structure 31 disposed on the first insulating layer 21 and a second isolation structure 32 disposed on the second insulating layer 22. Thus, by providing two isolation structures 3, the blocking effect of the isolation structure 3 on the film layer on the display area 101 is further enhanced, and the packaging reliability is further improved.

[0073] The second inorganic encapsulation layer 6 overlaps with the first surface 210 of the first insulating layer 21 and covers the end face of the organic light-emitting layer 4 and the end face of the first inorganic encapsulation layer 5.

[0074] like Figure 1a As shown, in a specific embodiment, the display panel may further include an organic encapsulation layer 10 disposed on the display area 101 to encapsulate the pixel areas on the display area 101, thereby protecting the organic light-emitting layer 4 of the pixel areas and preventing damage during the manufacturing process. Specifically, the organic encapsulation layer 10 may be disposed between the first inorganic encapsulation layer 5 and the second inorganic encapsulation layer 6; the organic encapsulation layer 10 covers a portion of the first inorganic encapsulation layer 5 located on the display area 101 and is covered by a portion of the second inorganic encapsulation layer 6 located on the display area 101.

[0075] See Figure 2a and Figure 2b , Figure 2a This is a schematic diagram of the structure of the display panel provided in the second embodiment of this application; Figure 2b for Figure 2a A partial enlarged view at point B. The structure of the display panel provided in the second embodiment of this application is basically the same as that of the display panel provided in the first embodiment of this application. The difference is that, in this embodiment, the display panel may further include a hanging structure 7; the hanging structure 7 is disposed on the display area 101 and located at the edge of the display area 101 near the non-display area 102. Specifically, an inorganic insulating layer 2 may also be disposed between the hanging structure 7 and the substrate 1.

[0076] In this design, the organic light-emitting layer 4 covers the side of the hanging structure 7 away from the substrate 1; and the projection of the hanging structure 7 along the stacking direction Y onto the substrate 1 lies within the projection of the organic light-emitting layer 4 along the stacking direction Y onto the substrate 1. Specifically, the hanging structure 7 includes a conductive portion 71 close to the substrate 1 and an insulating portion 72 away from the substrate 1; an inorganic insulating layer 2 may also be disposed between the hanging structure 7 and the substrate 1, and the conductive portion 71 is electrically connected to the substrate 1 through a through-hole in the inorganic insulating layer 2. The organic light-emitting layer 4 is interrupted at the edge of the hanging structure 7, and the organic light-emitting layer 4 is discontinuous between the surface of the hanging structure 7 and the surface of the inorganic insulating layer 2.

[0077] Furthermore, along the first direction X, the insulating portion 72 protrudes from the conductive portion 71 to form an eaves structure, so that when the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 are deposited by vapor deposition, the evaporation angle can be changed through the eaves structure so that the first inorganic encapsulation layer 5 covers the surface of the hanging structure 7 that is not covered by the organic light-emitting layer 4; that is, the first inorganic encapsulation layer 5 covers the side of the conductive portion 71 and the side of the insulating portion 72, as well as the part of the insulating portion 72 facing the conductive portion 71 that is not covered by the conductive portion 71.

[0078] like Figure 2a As shown, the organic encapsulation layer 10 overlaps with the substrate 1 in the display area 101 and covers the inorganic insulating layer 2 on the display area 101 to form a sealed structure, encapsulating the organic light-emitting layer 4 and the first inorganic encapsulation layer 5. Specifically, in conjunction with... Figure 2b The projection of the organic light-emitting layer 4 along the stacking direction Y onto the substrate 1 lies within the projection of the organic encapsulation layer 10 along the stacking direction Y onto the substrate 1. The organic encapsulation layer 10 covers the end face of the organic light-emitting layer 4 and the end face of the first inorganic encapsulation layer 5. Thus, by reducing the length of the organic light-emitting layer 4 located at the edge of the display area 101 and sealing the end faces of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 using the organic encapsulation layer 10, the risk of the organic light-emitting layer 4 detaching during the encapsulation process is reduced, thereby effectively improving encapsulation reliability.

[0079] like Figure 2b As shown, further, the minimum distance b between the edge of the projection of the organic light-emitting layer 4 onto the substrate 1 and the edge of the projection of the overhanging structure 7 onto the substrate 1 is greater than or equal to 1 micrometer and less than or equal to 10 micrometers; for example, b can be any value among 1 micrometer, 3 micrometers, 5 micrometers, 8 micrometers, or 10 micrometers. In this way, the risk of the organic light-emitting layer 4 falling off is reduced while ensuring the reliability of the packaging.

[0080] See Figure 3a , Figure 3a This is a schematic diagram of the structure of the display panel provided in the third embodiment of this application; Figure 3b for Figure 3aA partial enlarged view at point C. The structure of the display panel provided in the third embodiment of this application is basically the same as that of the display panel provided in the first embodiment of this application. The difference is that, in this embodiment, the display panel may further include a third inorganic encapsulation layer 9 disposed between the first inorganic encapsulation layer 5 and the second inorganic encapsulation layer 6.

[0081] like Figure 3a As shown, the third inorganic encapsulation layer 9 covers the surface of the first inorganic encapsulation layer 5. It should be noted that the third inorganic encapsulation layer 9 completely covers the surface of the first inorganic encapsulation layer 5, that is, the third inorganic encapsulation layer 9 covers all surfaces of the first inorganic encapsulation layer 5 located on the display area 101 and on the non-display area 102.

[0082] Combination Figure 3b The third inorganic encapsulation layer 9 extends from the display area 101 to the surface of the inorganic insulating layer 2 on the non-display area 102. The third inorganic encapsulation layer 9 overlaps with the inorganic insulating layer 2 and covers the end faces of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, forming a sealed structure that covers the end faces of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5. It can be understood that in the manufacturing process of the display panel, after etching the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, the third inorganic encapsulation layer 9 is deposited on the surface of the first inorganic encapsulation layer 5 to pre-seal the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, further improving encapsulation reliability.

[0083] The second inorganic encapsulation layer 6 covers a portion of the third inorganic encapsulation layer 9 located on the non-display area 102, and the organic encapsulation layer 10 covers a portion of the third inorganic encapsulation layer 9 located on the display area 101.

[0084] In a specific embodiment, the end face of the second inorganic encapsulation layer 6 and the end face of the third inorganic encapsulation layer 9 can intersect, so that the second inorganic encapsulation layer 6 and the third inorganic encapsulation layer 9 can be formed by a single etching process. Specifically, the end face of the second inorganic encapsulation layer 6 is the side surface of the end of the second inorganic encapsulation layer 6 away from the display area 101 along the first direction X; the end face of the third inorganic encapsulation layer 9 is the side surface of the end of the third inorganic encapsulation layer 9 away from the display area 101 along the first direction X. Specifically, the end faces of the second inorganic encapsulation layer 6 and the third inorganic encapsulation layer 9 can be flush; the projection of the second inorganic encapsulation layer 6 onto the substrate 1 can be within the projection of the third inorganic encapsulation layer 9 onto the substrate 1; that is, the end faces of the second inorganic encapsulation layer 6 and the third inorganic encapsulation layer 9 can form a sloped structure.

[0085] Of course, in other embodiments, considering that the materials of the second inorganic encapsulation layer 6 and the third inorganic encapsulation layer 9 may be different, resulting in different degrees of etching, the end faces of the second inorganic encapsulation layer 6 and the third inorganic encapsulation layer 9 may not be flush. That is, the end faces of the second inorganic encapsulation layer 6 and the third inorganic encapsulation layer 9 may intersect and form an angle, which may be greater than 180° or less than 180°; the specific size of the angle is determined by the materials of the second inorganic encapsulation layer 6 and the third inorganic encapsulation layer 9.

[0086] See Figure 4a , Figure 4a This is a schematic diagram of the structure of the display panel provided in the fourth embodiment of this application; Figure 4b for Figure 4a A partial enlarged view at point D. The structure of the display panel provided in the fourth embodiment of this application is basically the same as that of the display panel provided in the second embodiment of this application. The difference is that, in this embodiment, the display panel may further include a third inorganic encapsulation layer 9 disposed between the first inorganic encapsulation layer 5 and the second inorganic encapsulation layer 6.

[0087] Combination Figure 4a and Figure 4b The third inorganic encapsulation layer 9 extends from the display area 101 to the surface of the inorganic insulating layer 2 on the non-display area 102. The third inorganic encapsulation layer 9 covers the surface of the first inorganic encapsulation layer 5 located on the display area 101, overlaps with the inorganic insulating layer 2 on the display area 101, and covers the end faces of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 to form a sealed structure. This pre-seales the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, further improving encapsulation reliability.

[0088] like Figure 4a As shown, the third inorganic encapsulation layer 9 directly covers the surface of the isolation structure 3, so that the third inorganic encapsulation layer 9 can better adhere to the surface of the inorganic insulating layer 2. Furthermore, the end face of the second inorganic encapsulation layer 6 and the end face of the third inorganic encapsulation layer 9 can be flush, so that the second inorganic encapsulation layer 6 and the third inorganic encapsulation layer 9 can be formed by a single etching process.

[0089] See Figure 5 , Figure 5This is a schematic diagram of the structure of a display panel provided in the fifth embodiment of this application. The structure of the display panel provided in the fifth embodiment of this application is basically the same as that of the display panel provided in the third embodiment of this application. The difference is that, in this embodiment, the second inorganic encapsulation layer 6 directly covers the surface of the inorganic insulating layer 2 on the non-display area 102 of the display panel. It can be understood that, in specific embodiments, the organic light-emitting layer 4 is only disposed on the display area 101, and the isolation structure 3 is not required on the non-display area 102 to isolate the organic light-emitting layer 4; thus, by omitting the isolation structure 3, the manufacturing cost of the display panel is effectively reduced.

[0090] See Figure 6 , Figure 6 This is a schematic diagram of the structure of the display panel provided in the sixth embodiment of this application. The structure of the display panel provided in the sixth embodiment of this application is basically the same as that of the display panel provided in the fourth embodiment of this application. The difference is that in this embodiment, on the non-display area 102 of the display panel, the third inorganic encapsulation layer 9 directly covers the surface of the inorganic insulating layer 2, so as to omit the isolation structure 3 and effectively reduce the manufacturing cost of the display panel.

[0091] This application provides a display panel; the display panel includes a substrate 1, an inorganic insulating layer 2, an isolation structure 3, an organic light-emitting layer 4, a first inorganic encapsulation layer 5, and a second inorganic encapsulation layer 6; wherein, the substrate 1 includes a display area 101 and a non-display area 102 located on one side of the display area 101; the inorganic insulating layer 2 is disposed in the non-display area 102 and protrudes from the substrate 1; the isolation structure 3 is disposed on the surface of the inorganic insulating layer 2 away from the substrate 1; the organic light-emitting layer 4 is disposed on the side of the substrate 1 facing the inorganic insulating layer 2; the first inorganic encapsulation layer 5 is disposed on the surface of the organic light-emitting layer 4 away from the substrate 1. One side surface; and the projection of the organic light-emitting layer 4 along the stacking direction Z on the substrate 1 is located within the projection of the first inorganic encapsulation layer 5 along the stacking direction Z on the substrate 1; the second inorganic encapsulation layer 6 is disposed on the side of the first inorganic encapsulation layer 5 away from the substrate 1 and covers part of the surface of the first inorganic encapsulation layer 5 located on the non-display area 102; wherein, the projection of the organic light-emitting layer 4 along the stacking direction Y on the substrate 1 is located within the projection of the inorganic insulating layer 2 along the stacking direction Y on the substrate 1; the second inorganic encapsulation layer 6 overlaps with the inorganic insulating layer 2 and covers the end face of the organic light-emitting layer 4 and the end face of the first inorganic encapsulation layer 5. By providing an inorganic insulating layer 2 protruding from the substrate 1 in the non-display area 102, the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 are disconnected on the inorganic insulating layer 2, and the second inorganic encapsulation layer 6 covers the ends of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 to seal the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, thereby reducing the risk of the organic light-emitting layer 4 falling off during the encapsulation process. At the same time, the disconnection of the organic light-emitting layer 4 and the first inorganic encapsulation layer 5 on the inorganic insulating layer 2 can also reduce the length of the organic light-emitting layer 4 along the first direction X, further improving the sealing effect of the second inorganic encapsulation layer 6 on the organic light-emitting layer 4 and the first inorganic encapsulation layer 5, further reducing the risk of the organic light-emitting layer 4 falling off during the encapsulation process, thereby effectively improving the encapsulation reliability.

[0092] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate; the substrate comprises a display area and a non-display area located on one side of the display area; an inorganic insulating layer disposed on the non-display area and protruding from the substrate; an isolation structure disposed on the side surface of the inorganic insulating layer away from the substrate; an organic light-emitting layer disposed on the side of the substrate facing the inorganic insulating layer; a first inorganic encapsulating layer disposed on the side surface of the organic light-emitting layer away from the substrate; and the projection of the organic light-emitting layer on the substrate along the stacking direction is located within the projection of the first inorganic encapsulating layer on the substrate along the stacking direction; a second inorganic encapsulating layer disposed on the side of the first inorganic encapsulating layer away from the substrate and covering the surface of the first inorganic encapsulating layer located on the non-display area; wherein the projection of the organic light-emitting layer on the substrate along the stacking direction is located within the projection of the inorganic insulating layer on the substrate along the stacking direction; the second inorganic encapsulating layer overlaps with the inorganic insulating layer and covers the end surface of the organic light-emitting layer and the end surface of the first inorganic encapsulating layer; an organic encapsulating layer disposed between the first inorganic encapsulating layer and the second inorganic encapsulating layer on the display area; an overhanging structure disposed near the edge of the display area close to the non-display area; wherein the organic light-emitting layer covers the side surface of the overhanging structure; the projection of the overhanging structure on the substrate along the stacking direction is located within the projection of the organic light-emitting layer on the substrate along the stacking direction; the organic encapsulating layer overlaps with the substrate; the projection of the organic light-emitting layer on the substrate along the stacking direction is located within the projection of the organic encapsulating layer on the substrate along the stacking direction; the organic encapsulating layer covers the end surface of the organic light-emitting layer and the end surface of the first inorganic encapsulating layer.

2. The display panel of claim 1, wherein: the organic light-emitting layer is separated by the isolation structure and covers at least part of the surface of the inorganic insulating layer not covered by the isolation structure; the first inorganic encapsulating layer covers the isolation structure; the end surface of the organic light-emitting layer is flush with the end surface of the first inorganic encapsulating layer; the minimum distance between the edge of the projection of the organic light-emitting layer on the substrate and the edge of the projection of the isolation structure on the substrate is greater than or equal to 1 microns and less than or equal to 10 microns.

3. The display panel of claim 2, wherein: the width of the inorganic insulating layer gradually decreases along the substrate towards the inorganic insulating layer; wherein the width of the inorganic insulating layer is the size of the inorganic insulating layer along a first direction; the first direction is perpendicular to the stacking direction; the inorganic insulating layer has oppositely arranged first and second surfaces, and a third surface connecting the first and second surfaces; wherein the first surface is located on the side of the inorganic insulating layer away from the display area. An edge of a projection of the organic light-emitting layer on the substrate substrate is located within a projection of the first surface on the substrate substrate; the second inorganic encapsulation layer overlaps the first surface and covers an end surface of the organic light-emitting layer and an end surface of the first inorganic encapsulation layer.

4. The display panel of claim 1, wherein, An edge of a projection of the organic light-emitting layer on the substrate substrate is greater than or equal to 1 microns and less than or equal to 10 microns from an edge of a projection of the overhang structure on the substrate substrate.

5. The display panel according to any one of claims 1-4, characterized in that, Further comprising: A third inorganic encapsulation layer disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer and covering a surface of the first inorganic encapsulation layer; the third inorganic encapsulation layer extending from the display area to the non-display area; and the third inorganic encapsulation layer overlapping the inorganic insulating layer and covering an end surface of the organic light-emitting layer and an end surface of the first inorganic encapsulation layer. The second inorganic encapsulation layer covers a portion of the third inorganic encapsulation layer on the non-display area.

6. The display panel of claim 5, wherein, An end surface of the second inorganic encapsulation layer intersects an end surface of the third inorganic encapsulation layer; and a projection of the second inorganic encapsulation layer on the substrate substrate is within a projection of the third inorganic encapsulation layer on the substrate substrate.

7. The display panel of claim 1, wherein, Further comprising: A boss disposed between the substrate substrate and the inorganic insulating layer; the inorganic insulating layer covering a surface of the boss and overlapping the substrate substrate.

8. The display panel of claim 7, wherein, The boss comprises a first boss and a second boss disposed at intervals; and the first boss is located on a side of the non-display area away from the display area, and the second boss is located on a side of the non-display area close to the display area; The inorganic insulating layer comprises a first insulating layer disposed on the first boss and a second insulating layer disposed on the second boss; The isolation structure comprises a first isolation structure disposed on the first insulating layer and a second isolation structure disposed on the second insulating layer.

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