Laser additive manufacturing equipment for multi-layer circuit boards and working method thereof

Abstract

The present invention discloses a laser additive manufacturing device for multi-layer circuit boards and a working method thereof. The laser additive manufacturing device includes a laser micro-cutting component, which includes a laser micro-cutting component, a laser fuse spraying component, a gripping component and a station switching component. The laser micro-cutting component is used to laser-etch the mold to form slots, and the laser fuse spraying component is used to laser-additive the substrate, and the molten wire is attached to the surface of the substrate through the slots on the mold. The gripping component is used to grab the substrate and lift it to achieve stacking installation of multiple substrates. The station switching component is used to drive the substrate and the mold to move between various stations. The present invention uses the laser micro-cutting component to complete the opening of the mold slots, and uses the laser fuse spraying component to perform laser additive manufacturing, so that the circuit manufacturing accuracy on the substrate is higher; and the gripping component is used to lift the substrate after the circuit forming is completed, so as to achieve automated production of multi-layer circuit boards.

Description

Technical Field

[0001] The present invention relates to the technical field of additive manufacturing, and in particular to a laser additive manufacturing device for a multi-layer circuit board and a working method thereof. Background Art

[0002] Metal additive manufacturing, as an advanced manufacturing technique, rapidly fabricates complex metal parts by depositing metal powder or wire layer by layer and then melting and shaping them using methods such as laser melting or electron beam melting. This technology offers advantages such as high manufacturing flexibility, short production cycles, reduced material waste, and the ability to create complex structures. It is widely used in aerospace, automotive, and medical device manufacturing, among other fields. It also has significant potential in the electronics industry for PCB circuit board manufacturing and microelectronic device packaging.

[0003] Traditional circuit board manufacturing methods typically rely on chemical etching or mechanical processing, which are complex, time-consuming, and costly. Laser additive manufacturing, on the other hand, simplifies production equipment, improves processing efficiency, and meets the precision requirements of circuit boards. Consequently, laser additive manufacturing equipment is becoming increasingly popular in PCB manufacturing and microelectronic device packaging.

[0004] However, when the filament is sprayed out after melting, excessive nozzle force can easily cause the filament to be sprayed onto other non-sprayed areas of the substrate, resulting in a decrease in the accuracy of the circuit board's formed circuit. Furthermore, current PCB circuits are becoming increasingly complex, and the circuit board structure has become multi-layered. After laser ablation and laser additive manufacturing of each layer of the circuit board, the layers need to be stacked and installed. Current laser additive manufacturing equipment does not have the automated manufacturing and assembly capabilities for multi-layer circuit boards. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a laser additive manufacturing device for multi-layer circuit boards, which can improve the accuracy of laser additive manufacturing of circuit boards and stack and install each layer of circuit boards.

[0006] The present invention also proposes a working method based on the above-mentioned laser additive manufacturing equipment for multi-layer circuit boards, which can complete additive manufacturing and stacking installation of multi-layer circuit boards.

[0007] According to a first embodiment of the present invention, a laser additive manufacturing device for a multilayer circuit board includes:

[0008] A laser micro-cutting assembly, comprising a laser micro-cutting scanning galvanometer, wherein the laser micro-cutting scanning galvanometer is capable of focusing a laser on a mold to etch a slot into the mold;

[0009] The laser fuse spraying assembly includes a movable platform and an air-jet mechanism. The movable platform is equipped with a laser fuse scanning galvanometer and a wire-feeding mechanism. The wire fed by the wire-feeding mechanism is melted by the laser emitted from the laser fuse scanning galvanometer. The air-jet mechanism ejects gas to blow out the molten wire. The molten wire passes through the slots of the mold and adheres to the surface of the substrate.

[0010] A gripping assembly, comprising a gripping mechanism and a lifting mechanism, wherein the lifting mechanism drives the gripping mechanism to move along the z direction, and the gripping mechanism is used to grip the substrate to drive it to move;

[0011] A station switching assembly, comprising a translation mechanism and a base, wherein the translation mechanism drives the base to move along the x-direction to the laser micro-cutting assembly, the laser fuse spraying assembly, or the gripping assembly, and the base is used to place a substrate and a mold;

[0012] Among them, after the grasping component grasps the completed substrate, the workstation switching component carries the next layer of substrate for laser additive manufacturing and transports it to the grasping component, and the grasping mechanism puts down the previous layer of substrate to complete the stacking connection of the two layers of substrate.

[0013] The laser additive manufacturing equipment for multi-layer circuit boards according to the embodiment of the present invention has at least the following beneficial effects: the mold slots are opened using a laser micro-cutting component, and laser additive manufacturing is performed using a laser fuse spraying component, so that the circuit manufacturing accuracy on the substrate is higher; and the substrate on which the circuit forming is completed is lifted using a gripping component, and after the subsequent other substrates complete the circuit forming, the various substrates can be stacked and connected, thereby realizing the automated production of multi-layer circuit boards.

[0014] According to some embodiments of the present invention, the laser micro-cutting component and the laser fuse spraying component also include a lifting mechanism. The lifting mechanism in the laser micro-cutting component drives the laser micro-cutting scanning galvanometer to move along the z direction, and the lifting mechanism in the laser fuse spraying component drives the moving platform to move along the z direction.

[0015] According to some embodiments of the present invention, the lifting mechanism includes a slide rail, a slider, a screw mechanism and a motor. The slider is slidably connected to the slide rail. The slider is used to connect to the laser micro-cutting scanning galvanometer, the mobile platform or the grasping mechanism. The motor drives the slider to move through the screw mechanism.

[0016] According to some embodiments of the present invention, the jet mechanism includes a bracket and a gas nozzle, the gas nozzle is externally connected to a gas storage tank, and the gas nozzle is hinged to the bracket so that the jet angle of the gas nozzle can be adjusted.

[0017] According to some embodiments of the present invention, the wire feeding mechanism is rotatably connected to the movable platform, and can adjust the feeding direction of the wire.

[0018] According to some embodiments of the present invention, the wire feeding mechanism includes a driving wheel and a driven wheel, the driving wheel and the driven wheel jointly clamp the wire, and the rotation of the driving wheel can drive the wire to move.

[0019] According to some embodiments of the present invention, the gripping mechanism includes a suction cup and an air pump, the suction cup is connected to the air pump, the suction cup can be in contact with the surface of the substrate, and the air pump extracts the air between the suction cup and the substrate to achieve suction and fixation of the substrate.

[0020] According to some embodiments of the present invention, the translation mechanism includes a slide rail, a slider, a screw mechanism and a motor. The slider is slidably connected to the slide rail, the slider is used to connect to the base, and the motor drives the slider to move through the screw mechanism.

[0021] According to some embodiments of the present invention, the translation mechanism includes a guide rod, a fixed pulley group, a transmission belt and a translation drive motor, the base is slidably connected to the guide rod, the transmission belt is wrapped around each fixed pulley of the fixed pulley group and the transmission belt is fixedly connected to the base, and the translation drive motor drives one of the fixed pulleys of the fixed pulley group to rotate.

[0022] The working method according to the second aspect of the present invention is based on the above-mentioned laser additive manufacturing equipment for multi-layer circuit boards and includes the following steps:

[0023] fixing the substrate and the mold to the base;

[0024] The translation mechanism drives the base to reach the laser micro-cutting assembly;

[0025] The laser micro-cutting scanning galvanometer focuses the laser on the mold surface, etches slots on the mold, and etches mounting holes on the substrate;

[0026] The translation mechanism drives the base to reach the laser fuse spraying assembly;

[0027] The wire feeding mechanism feeds the wire, the laser fuse scanning galvanometer melts the wire, and the gas injection mechanism ejects gas to spray the molten wire into the slots of the substrate, and the wire is formed on the surface of the substrate through the slots;

[0028] The translation mechanism drives the base to reach the grabbing assembly and take away the mold;

[0029] The grabbing mechanism grabs the substrate and drives the substrate to rise through the lifting mechanism;

[0030] The base is returned to its initial position, a new substrate and mold are installed, and the above steps are repeated;

[0031] The lifting mechanism drives the substrate to descend, so that the two layers of substrates overlap each other and are connected.

[0032] The working method according to the embodiment of the present invention has at least the following beneficial effects: realizing automated laser additive manufacturing of multi-layer circuit boards and improving production efficiency.

[0033] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0035] Figure 1 A three-dimensional diagram of a laser additive manufacturing apparatus for a multi-layer circuit board according to an embodiment of the first aspect of the present invention;

[0036] Figure 2 This is a front view of a laser micro-cutting assembly 100 in a laser additive manufacturing device for a multi-layer circuit board according to an embodiment of the first aspect of the present invention;

[0037] Figure 3 This is a front view of a laser fuse spraying assembly 200 in a laser additive manufacturing device for a multi-layer circuit board according to an embodiment of the first aspect of the present invention;

[0038] Figure 4 This is a front view of a gripping assembly 300 in a laser additive manufacturing apparatus for a multi-layer circuit board according to an embodiment of the first aspect of the present invention;

[0039] Figure 5 This is a three-dimensional diagram of the station switching component 500 in the laser additive manufacturing equipment for multi-layer circuit boards according to the first embodiment of the present invention.

[0040] Figure markings: 100-laser micro-cutting assembly, 110-laser micro-cutting scanning galvanometer, 200-laser fuse spraying assembly, 210-moving platform, 220-jet mechanism, 221-bracket, 222-gas nozzle, 230-laser fuse scanning galvanometer, 240-wire feeding mechanism, 241-driving wheel, 242-driven wheel, 300-grabbing assembly, 310-grabbing mechanism, 400-lifting mechanism, 410-slide rail, 420-slider, 430-screw mechanism, 440-motor, 500-station switching assembly, 510-translation mechanism, 511-guide rod, 512-fixed pulley group, 513-transmission belt, 514-translation drive motor, 520-base. DETAILED DESCRIPTION

[0041] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0042] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0043] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0044] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0045] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0046] Traditional circuit board manufacturing methods typically rely on chemical etching or mechanical processing, which are complex, time-consuming, and costly. Laser additive manufacturing, on the other hand, simplifies production equipment, improves processing efficiency, and meets the precision requirements of circuit boards. Consequently, laser additive manufacturing equipment is becoming increasingly popular in PCB manufacturing and microelectronic device packaging.

[0047] However, when the filament is sprayed out after melting, excessive nozzle force can easily cause the filament to be sprayed onto other non-sprayed areas of the substrate, resulting in a decrease in the accuracy of the circuit board's formed circuit. Furthermore, current PCB circuits are becoming increasingly complex, and the circuit board structure has become multi-layered. After laser ablation and laser additive manufacturing of each layer of the circuit board, the layers need to be stacked and installed. Current laser additive manufacturing equipment does not have the automated manufacturing and assembly capabilities for multi-layer circuit boards.

[0048] In response to this, the present application proposes a laser additive manufacturing device for multi-layer circuit boards. The device utilizes a laser micro-cutting assembly 100 to create mold slots and a laser fuse spraying assembly 200 for laser additive manufacturing, thereby increasing the precision of circuit manufacturing on the substrate. Furthermore, a gripping assembly 300 is used to lift the substrate after circuit formation has been completed. Once other substrates have completed circuit formation, the substrates can be stacked and connected, enabling automated production of multi-layer circuit boards. Furthermore, the present application also proposes a working method based on the aforementioned laser additive manufacturing device for multi-layer circuit boards, enabling automated laser additive manufacturing of multi-layer circuit boards and improving production efficiency.

[0049] Reference Figure 1 The laser additive manufacturing equipment for multi-layer circuit boards in the embodiment of the first aspect of the present application includes a laser micro-cutting component 100, a laser fuse spraying component 200, a gripping component 300 and a station switching component 500. The laser micro-cutting component 100 is used to laser etch the mold to form slots, the laser fuse spraying component 200 is used to laser additively manufacture the substrate, and the molten wire is attached to the surface of the substrate through the slots on the mold, and the wire splashing to other positions can be blocked by the slots on the mold. The gripping component 300 is used to grab the substrate and lift it to achieve stacking installation of multiple substrates. The station switching component 500 is used to drive the substrate and the mold to move between various stations.

[0050] Specifically, refer to Figure 2 The laser micro-cutting assembly 100 includes a laser micro-cutting scanning galvanometer 110. An external laser generator emits laser light to the laser micro-cutting scanning galvanometer 110. The laser micro-cutting scanning galvanometer 110 can focus the laser light on the mold to etch slots in the mold.

[0051] Reference Figure 3 The laser fuse spraying assembly 200 includes a mobile platform 210 and an air jet mechanism 220. A laser fuse scanning galvanometer 230 and a wire feed mechanism 240 are mounted on the mobile platform 210. The wire fed by the wire feed mechanism 240 is melted by the laser light emitted from the laser fuse scanning galvanometer 230. The air jet mechanism 220 ejects gas to blow out the molten wire. The molten wire passes through the slots of the mold and adheres to the substrate surface, completing additive manufacturing of the substrate surface.

[0052] Reference Figure 4 The gripping assembly 300 includes a gripping mechanism 310 and a lifting mechanism 400. The lifting mechanism 400 drives the gripping mechanism 310 to move along the z direction. The gripping mechanism 310 is used to grip the substrate and drive it to move. In this application, the z direction is specifically the vertical direction.

[0053] Reference Figure 5 The workstation switching assembly 500 includes a translation mechanism 510 and a base 520. The translation mechanism 510 drives the base 520 to move along the x-direction to the laser micro-cutting assembly 100, the laser fuse spraying assembly 200, or the gripper assembly 300. The base 520 is used to place the substrate and mold. Thus, the workstation switching assembly 500 drives the substrate and mold to different workstations. In this application, the x-direction is specifically the horizontal direction.

[0054] Among them, after the grasping component 300 grasps the completed substrate, the workstation switching component 500 carries the next layer of substrate for laser additive manufacturing and transports it to the grasping component 300, and the grasping mechanism 310 puts down the previous layer of substrate so that the two layers of substrates are stacked and connected.

[0055] Furthermore, the laser micro-cutting assembly 100 and the laser fuse spraying assembly 200 also include a lifting mechanism 400. The lifting mechanism 400 in the laser micro-cutting assembly 100 drives the laser micro-cutting scanning galvanometer 110 to move in the z-direction, thereby focusing the laser on the mold surface to achieve higher dimensional accuracy of the etched slots. The lifting mechanism 400 in the laser fuse spraying assembly 200 drives the movable platform 210 to move in the z-direction, thereby ensuring that the ejected wire more accurately passes through the mold slots and adheres to the substrate surface.

[0056] Optionally, in some embodiments, the lifting mechanism 400 can be driven by a driving member such as an electric telescopic rod, a hydraulic telescopic rod, or a pneumatic telescopic rod. In this embodiment, the lifting mechanism 400 includes a slide rail 410, a slider 420, a screw mechanism 430, and a motor 440. The slider 420 is slidably connected to the slide rail 410. The slider 420 is used to connect to the laser micro-cutting scanning galvanometer 110, the mobile platform 210, or the grasping mechanism 310. The motor 440 drives the slider 420 to move through the screw mechanism 430. The screw mechanism 430 enables the lifting mechanism 400 to withstand the lifting of heavier objects, and has a self-locking function and higher lifting accuracy.

[0057] Furthermore, the gas injection mechanism 220 includes a bracket 221 and a gas nozzle 222. The gas nozzle 222 is connected to an external gas tank to eject gas. The gas nozzle 222 is hingedly connected to the bracket 221 to adjust the injection angle of the gas nozzle 222, so that the gas nozzle 222 can accurately spray the gas onto the substrate surface. Specifically, the gas ejected by the gas nozzle 222 is an inert gas, including but not limited to argon and helium, to prevent the gas from reacting under the influence of the high heat of the laser.

[0058] Furthermore, the wire feeding mechanism 240 is rotatably connected to the mobile platform 210, thereby adjusting the feeding direction of the wire and thus adjusting the contact position between the wire and the laser, so that the wire can be ejected by the ejection mechanism 220 in a timely manner after being contacted and melted by the laser.

[0059] Specifically, the wire feeding mechanism 240 includes a driving wheel 241 and a driven wheel 242. The driving wheel 241 and the driven wheel 242 jointly clamp the wire. When the driving wheel 241 rotates, the driven wheel 242 rotates accordingly. The two jointly drive the wire to move, completing the feeding of the wire.

[0060] Optionally, with respect to the specific gripping method of the gripping mechanism 310, in some embodiments, the gripping mechanism 310 uses two claws that can be brought close to each other to clamp the substrate, thereby driving the substrate to move. In other embodiments, the gripping mechanism 310 can be provided with an electromagnet that uses magnetic attraction to adsorb the substrate to drive it to move. In this embodiment, the gripping mechanism 310 specifically includes a suction cup and an air pump. The suction cup is connected to the air pump, and the suction cup can be attached to the surface of the substrate. The air pump extracts the air between the suction cup and the substrate to enable the suction cup to absorb and fix the substrate.

[0061] Alternatively, regarding the specific movement of the translation mechanism 510, in some embodiments, the translation mechanism 510 is similar to the lifting mechanism 400 and also includes a slide rail 410, a slider 420, a screw mechanism 430, and a motor 440. The slider 420 is slidably connected to the slide rail 410, and the slider 420 is used to connect to the base 520. The motor 440 drives the slider 420 to move via the screw mechanism 430.

[0062] In this embodiment, the translation mechanism 510 specifically includes a guide rod 511, a fixed pulley assembly 512, a transmission belt 513, and a translation drive motor 514. The base 520 is slidably connected to the guide rod 511. The transmission belt 513 is wound around each fixed pulley of the fixed pulley assembly 512 and is fixedly connected to the base 520. The translation drive motor 514 drives one of the fixed pulleys of the fixed pulley assembly 512 to rotate. Therefore, when the translation drive motor 514 is activated, each fixed pulley in the fixed pulley assembly 512 begins to rotate, driving the transmission belt 513 and the base 520 on it to move, completing the conveyance of the base 520.

[0063] A working method in an embodiment of the second aspect of the present application is performed based on the above-mentioned laser additive manufacturing equipment for multi-layer circuit boards, including the following steps:

[0064] S100. The substrate and the mold are fixed to the base 520;

[0065] S200. The translation mechanism 510 drives the base 520 to reach the laser micro-cutting assembly 100;

[0066] S300 laser micro-cut scanning galvanometer 110 focuses the laser on the mold surface, etches a slot on the mold, and etches a mounting hole on the substrate;

[0067] S400. The translation mechanism 510 drives the base 520 to reach the laser fuse spraying assembly 200;

[0068] S500. The wire feeding mechanism 240 feeds the wire, the laser fuse scanning galvanometer 230 melts the wire, the jet mechanism 220 ejects gas to spray the molten wire into the slot of the substrate, and the wire is formed on the surface of the substrate through the slot;

[0069] S600. The translation mechanism 510 drives the base 520 to reach the grab assembly 300 and remove the mold;

[0070] S700. The grabbing mechanism 310 grabs the substrate and drives the substrate up through the lifting mechanism 400;

[0071] S800. The base returns to its initial position, a new substrate and mold are installed, and the above steps are repeated;

[0072] S900. The lifting mechanism 400 drives the substrate to descend, so that the two layers of substrates overlap and connect them.

[0073] Furthermore, two adjacent substrates can be aligned and connected to each other through the mounting holes, and the connection methods include but are not limited to welding, bonding and bolting.

[0074] While the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to the embodiments described above. Various modifications may be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof may be combined with one another unless there is a conflict.

Claims

1. A laser additive manufacturing device for multi-layer circuit boards, characterized in that: include: A laser micro-cutting assembly, comprising a laser micro-cutting scanning galvanometer, wherein the laser micro-cutting scanning galvanometer is capable of focusing a laser on a mold to etch a slot into the mold; The laser fuse spraying assembly includes a movable platform and an air-jet mechanism. The movable platform is equipped with a laser fuse scanning galvanometer and a wire-feeding mechanism. The wire fed by the wire-feeding mechanism is melted by the laser emitted from the laser fuse scanning galvanometer. The air-jet mechanism ejects gas to blow out the molten wire. The molten wire passes through the slots of the mold and adheres to the surface of the substrate. A gripping assembly, comprising a gripping mechanism and a lifting mechanism, wherein the lifting mechanism drives the gripping mechanism to move along the z direction, and the gripping mechanism is used to grip the substrate to drive it to move; A station switching assembly, comprising a translation mechanism and a base, wherein the translation mechanism drives the base to move along the x-direction to the laser micro-cutting assembly, the laser fuse spraying assembly, or the gripping assembly, and the base is used to place a substrate and a mold; The laser micro-cutting assembly and the laser fuse spraying assembly also include a lifting mechanism, the lifting mechanism in the laser micro-cutting assembly drives the laser micro-cutting scanning galvanometer to move along the z direction, and the lifting mechanism in the laser fuse spraying assembly drives the moving platform to move along the z direction; Among them, after the grasping component grasps the completed substrate, the workstation switching component carries the next layer of substrate for laser additive manufacturing and transports it to the grasping component, and the grasping mechanism puts down the previous layer of substrate to complete the stacking connection of the two layers of substrate.

2. The laser additive manufacturing equipment for multi-layer circuit boards according to claim 1, characterized in that: The lifting mechanism includes a slide rail, a slider, a screw mechanism and a motor. The slider is slidably connected to the slide rail. The slider is used to connect to the laser micro-cutting scanning galvanometer, the mobile platform or the grasping mechanism. The motor drives the slider to move through the screw mechanism.

3. The laser additive manufacturing equipment for multi-layer circuit boards according to claim 1, characterized in that: The jet mechanism comprises a bracket and a gas nozzle. The gas nozzle is externally connected to a gas storage tank. The gas nozzle is hinged to the bracket so that the jet angle of the gas nozzle can be adjusted.

4. The laser additive manufacturing equipment for multi-layer circuit boards according to claim 3, characterized in that: The wire feeding mechanism is rotatably connected to the mobile platform and can adjust the feeding direction of the wire.

5. The laser additive manufacturing equipment for multi-layer circuit boards according to claim 1, characterized in that: The wire feeding mechanism includes a driving wheel and a driven wheel. The driving wheel and the driven wheel clamp the wire together. The rotation of the driving wheel can drive the wire to move.

6. The laser additive manufacturing equipment for multi-layer circuit boards according to claim 1, characterized in that: The gripping mechanism includes a suction cup and an air pump. The suction cup is connected to the air pump. The suction cup can be in contact with the surface of the substrate. The air pump extracts the air between the suction cup and the substrate to achieve suction and fixation of the substrate.

7. The laser additive manufacturing equipment for multi-layer circuit boards according to claim 1, characterized in that: The translation mechanism includes a slide rail, a slider, a screw mechanism and a motor. The slider is slidably connected to the slide rail, the slider is used to be connected to the base, and the motor drives the slider to move through the screw mechanism.

8. The laser additive manufacturing equipment for multi-layer circuit boards according to claim 1, characterized in that: The translation mechanism includes a guide rod, a fixed pulley set, a transmission belt and a translation drive motor. The base is slidably connected to the guide rod, the transmission belt is wound around each fixed pulley of the fixed pulley set and the transmission belt is fixedly connected to the base, and the translation drive motor drives one of the fixed pulleys of the fixed pulley set to rotate.

9. A working method of the laser additive manufacturing equipment for multi-layer circuit boards according to any one of claims 1 to 8, characterized in that: include: fixing the substrate and the mold to the base; The translation mechanism drives the base to reach the laser micro-cutting assembly; The laser micro-cutting scanning galvanometer focuses the laser on the mold surface, etches slots on the mold, and etches mounting holes on the substrate; The translation mechanism drives the base to reach the laser fuse spraying assembly; The wire feeding mechanism feeds the wire, the laser fuse scanning galvanometer melts the wire, and the gas injection mechanism ejects gas to spray the molten wire into the slots of the substrate, and the wire is formed on the surface of the substrate through the slots; The translation mechanism drives the base to reach the grabbing assembly and take away the mold; The grabbing mechanism grabs the substrate and drives the substrate to rise through the lifting mechanism; The base is returned to its initial position, a new substrate and mold are installed, and the above steps are repeated; The lifting mechanism drives the substrate to descend, so that the two layers of substrates overlap each other and are connected.

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