Heater control device

Abstract

A heater control device includes: a programmable controller (PLC) with a first communication port; a power regulator with a second communication port, the first and second communication ports being signal-connected; multiple series-connected electrical connectors, each connector including a printed circuit board (PCB) and a conductive post electrically connected to one end of the PCB, with adjacent connectors' PCBs electrically connected via the conductive post, and the other end of the PCB closest to the power regulator electrically connected to the power regulator; and an electrostatic chuck, with the conductive post closest to the chuck electrically connected to it. The electrical connectors are physical hardware devices. The power regulator is electrically connected to the electrostatic chuck via a hard connection, improving the stability of the heater control device. The power regulator and the electrostatic chuck are electrically connected via multiple series-connected electrical connectors, avoiding the risk of cable routing affecting system impedance and further improving the stability of the heater control device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a heater control device. Background Technology

[0002] In the manufacturing process of semiconductor devices such as integrated circuits, wafers undergo various processes such as film deposition and etching. In the wafer processing and manufacturing process using a heater control device, the wafer needs to be heated to a specific temperature, and the uniformity of the wafer temperature is subject to very strict requirements. This is because the uniformity of wafer temperature has a significant impact on the quality of semiconductor chips. Operating in environments such as vacuum, plasma, and chemical gases, the heater control device requires the use of ceramic heaters.

[0003] Typically, a ceramic heater includes a ceramic substrate with a wafer mounting surface on top and a cylindrical support body that provides support on the back side. Inside or on the surface of the ceramic substrate, in addition to a resistive heating element circuit for heating, there are also conductive bodies such as radio frequency electrodes and electrostatic chuck electrodes.

[0004] Currently, the stability of the heater control device still needs to be improved. Summary of the Invention

[0005] The problem solved by the embodiments of the present invention is to provide a heater control device to improve the stability of the heater control device.

[0006] To address the aforementioned problems, embodiments of the present invention provide a heater control device, comprising: a programmable controller including a first communication port; a power regulator including a second communication port, wherein the first communication port and the second communication port are signal-connected; a plurality of interconnected electrical connectors, each electrical connector including a printed circuit board and a conductive post electrically connected to one end of the printed circuit board, wherein the printed circuit boards of adjacent electrical connectors are electrically connected through the conductive post, and the other end of the printed circuit board closest to the power regulator is electrically connected to the power regulator; and an electrostatic chuck, wherein the conductive post closest to the electrostatic chuck is electrically connected to the electrostatic chuck.

[0007] Optionally, the heater control device further includes: an RF power supply having a third communication port, the third communication port being signal-connected to the first communication port, and the RF power supply being electrically connected to the electrostatic chuck; the programmable controller including a first I / O port; the heater control device further includes: a filter box, the power input terminal of the filter box being electrically connected to the power regulator, the power output terminal of the filter being electrically connected to the printed circuit board closest to the filter, and the filter box including a second I / O port, the second I / O port being signal-connected to the first I / O port.

[0008] Optionally, the heater control device further includes: a host computer having a fourth communication port connected to the first communication port; an electrostatic chuck including a bearing surface for supporting and heating the wafer, the bearing surface having multiple independent heating circuits; a conductive pillar including multiple sub-conductive pillars, each sub-conductive pillar being electrically connected to a corresponding heating circuit; and the host computer having an upper-level application for human-computer interaction, the upper-level application including a parameter setting unit capable of setting corresponding heating parameters for different heating circuits through the sub-conductive pillars.

[0009] Optionally, the printed circuit board includes a main board and sub-boards soldered to the surfaces of both ends of the main board. The main board includes a first insulating layer and a first conductive layer located in the first insulating layer. The sub-board includes a second insulating layer, a second conductive layer located in the second insulating layer, and a plurality of conductive plugs protruding from the surface of the second conductive layer. The first conductive layer is electrically connected to the second conductive layer, and the conductive plugs are electrically connected to the second conductive layer. The conductive plug of the printed circuit board closest to the electrostatic chuck is electrically connected to the conductive post.

[0010] Optionally, the first conductive layer includes a plurality of first sub-conductive layers extending in the same direction and evenly spaced apart; the second conductive layer includes a plurality of second sub-conductive layers extending in the same direction and evenly spaced apart, the number of second sub-conductive layers being the same as the number of first sub-conductive layers, and the first sub-conductive layers being electrically connected to the second sub-conductive layers.

[0011] Optionally, the thickness of the first sub-conductive layer ranges from 1.98 ounces to 2.02 ounces; the thickness of the second sub-conductive layer ranges from 1.98 ounces to 2.02 ounces.

[0012] Optionally, the width of the first sub-conductive layer is 4 mm to 4.05 mm in a direction perpendicular to and parallel to the extension direction of the first sub-conductive layer and the motherboard surface; the width of the second sub-conductive layer is 4 mm to 4.05 mm in a direction perpendicular to and parallel to the extension direction of the second sub-conductive layer and the motherboard surface.

[0013] Optionally, the extension direction of the conductive plug is the same as the extension direction of the conductive post.

[0014] Optionally, the conductive plug is a banana plug.

[0015] Optionally, the conductive post includes a conductive body post and conductive sockets electrically connected to both ends of the conductive body post; the conductive sockets are electrically connected to the conductive plug.

[0016] Optionally, the conductive socket is a banana socket.

[0017] Optionally, the heater control device further includes a protective cover disposed outside the plurality of interconnected electrical connectors and surrounding the plurality of electrical connectors.

[0018] Optionally, the material of the protective cover includes aluminum.

[0019] Optionally, the filter box is provided with a position switch, which is used to send a position signal to the programmable controller through the second I / O port.

[0020] Optionally, the power regulator includes a detection module, which is used to detect whether the multiple interconnected electrical connectors and the electrostatic chuck are in a closed state. If they are in a closed state, the detection module sends a heating preparation signal to the programmable controller through the second communication port. If they are in an open state, the detection module does not send a heating preparation signal.

[0021] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages:

[0022] The heater control device provided in this embodiment of the invention includes multiple interconnected electrical connectors. Each electrical connector includes a printed circuit board and a conductive post electrically connected to one end of the printed circuit board. Printed circuit boards of adjacent electrical connectors are electrically connected through the conductive post, and the other end of the printed circuit board closest to the power regulator is electrically connected to the power regulator. The conductive post closest to the electrostatic chuck is electrically connected to the electrostatic chuck. In other words, the power regulator and the electrostatic chuck are electrically connected through multiple interconnected electrical connectors. Compared to using cables to achieve electrical connection between the power regulator and the electrostatic chuck, the electrical connectors in this embodiment of the invention are physical hardware devices, enabling the power regulator to achieve electrical connection with the electrostatic chuck through a hard connection. This improves the stability of the heater control device. Furthermore, the interconnection of the power regulator and the electrostatic chuck through multiple interconnected electrical connectors avoids the risk of cable routing affecting the system impedance, thereby further improving the stability of the heater control device. Attached Figure Description

[0023] Figure 1 This is a communication network connection diagram of the heater control device of the present invention;

[0024] Figure 2 This is a connection diagram of the various components of the heater control device of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the electrostatic chuck, electrical connector, and filter box of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the electrical connector of the present invention;

[0027] Figure 5 This is a schematic diagram of the main board structure in the printed circuit board of the present invention. Detailed Implementation

[0028] As can be seen from the background technology, the stability of the heater control device still needs to be improved. Specifically, in the process of heating the wafer, the heater control device places the wafer on an electrostatic chuck and controls the output power of the power regulator through the host computer to achieve the purpose of heating the wafer. However, the power regulator and the electrostatic chuck are electrically connected by a cable. However, the cable routing is subject to the risk of bending and derailment, which greatly reduces the stability of the heater control device.

[0029] To address the aforementioned technical problems, embodiments of the present invention provide a heater control device, comprising: a programmable controller including a first communication port; a power regulator including a second communication port, wherein the first communication port and the second communication port are signal-connected; a plurality of interconnected electrical connectors, each electrical connector including a printed circuit board and a conductive post electrically connected to one end of the printed circuit board, wherein the printed circuit boards of adjacent electrical connectors are electrically connected through the conductive post, and the other end of the printed circuit board closest to the power regulator is electrically connected to the power regulator; and an electrostatic chuck, wherein the conductive post closest to the electrostatic chuck is electrically connected to the electrostatic chuck.

[0030] The heater control device provided in this embodiment of the invention includes multiple interconnected electrical connectors. Each electrical connector includes a printed circuit board and a conductive post electrically connected to one end of the printed circuit board. Printed circuit boards of adjacent electrical connectors are electrically connected through the conductive post, and the other end of the printed circuit board closest to the power regulator is electrically connected to the power regulator. The conductive post closest to the electrostatic chuck is electrically connected to the electrostatic chuck. In other words, the power regulator and the electrostatic chuck are electrically connected through multiple interconnected electrical connectors. Compared to using cables to achieve electrical connection between the power regulator and the electrostatic chuck, the electrical connectors in this embodiment of the invention are physical hardware devices, enabling the power regulator to achieve electrical connection with the electrostatic chuck through a hard connection. This improves the stability of the heater control device. Furthermore, the interconnection of the power regulator and the electrostatic chuck through multiple interconnected electrical connectors avoids the risk of cable routing affecting the system impedance, thereby further improving the stability of the heater control device.

[0031] To make the above-mentioned objects, features, and advantages of the embodiments of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Figure 1 This is a communication network connection diagram of the heater control device of the present invention; Figure 2 This is a connection diagram of the various components of the heater control device of the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of the electrostatic chuck, electrical connector, and filter box of the present invention; Figure 4 This is a schematic diagram of the structure of the electrical connector of the present invention; Figure 5 This is a schematic diagram of the main board structure in the printed circuit board of the present invention.

[0033] refer to Figures 1 to 5 The heater control device includes: a programmable controller, including a first communication port 102; a power regulator, including a second communication port 105, wherein the first communication port 102 and the second communication port 105 are signal-connected; a plurality of interconnected electrical connectors 124, each electrical connector 124 including a printed circuit board 122 and a conductive post 123 electrically connected to one end of the printed circuit board 122, wherein the printed circuit boards 122 of adjacent electrical connectors 124 are electrically connected through the conductive post 123, and the other end of the printed circuit board 122 closest to the power regulator is electrically connected to the power regulator; and an electrostatic chuck 120, wherein the conductive post 123 closest to the electrostatic chuck 120 is electrically connected to the electrostatic chuck 120.

[0034] It should be noted that the power regulator and the electrostatic chuck 120 are electrically connected through multiple series-connected electrical connectors 124. Compared to the use of cables to achieve electrical connection between the power regulator and the electrostatic chuck 120, the electrical connectors 124 in this embodiment are physical hardware devices, enabling the power regulator to achieve electrical connection with the electrostatic chuck 120 through a hard connection, which improves the stability of the heater control device. Furthermore, the connection between the power regulator and the electrostatic chuck 120 through multiple series-connected electrical connectors 124 avoids the risk of cable routing affecting the system impedance, thereby further improving the stability of the heater control device.

[0035] It should also be noted that the power regulator and the electrostatic chuck 120 are electrically connected by multiple interconnected electrical connectors 124, which reduces the difficulty of setting up electrical connections between the power regulator and the electrostatic chuck 120, and reduces the equipment space occupied by the electrical connectors 124 between the power regulator and the electrostatic chuck 120, thereby further reducing the equipment space occupied by the heater control device.

[0036] Specifically, the programmable logic controller (PLC) is used to exchange data with the power regulator, the filter box 126, and the interface (i.e., the host computer). At the same time, the PLC outputs control signals to control the power output of the power regulator, thereby adjusting the temperature of the electrostatic chuck 120 according to the wafer fabrication process requirements, and thus improving the wafer formation quality.

[0037] It should be noted that the first communication port 102 is used to form a communication network with other communication ports, thereby enabling data exchange within the communication network.

[0038] In this embodiment, the first communication port 102 supports the EtherCAT communication protocol. The first communication port 102 is used to enable the programmable controller to establish an EtherCAT communication network with the power regulator, the filter box 126 and the user interface (i.e., the host computer), so that the programmable controller can exchange data and communicate with the power regulator, the filter box 126 and the user interface (i.e., the host computer).

[0039] In this embodiment, the programmable controller includes a first I / O port 103.

[0040] It should be noted that the first I / O port 103 is used to receive the digital signal (DI) emitted by the filter box 126, and the programmable controller can send the received digital signal to the host computer.

[0041] In this embodiment, the heater control device further includes a host computer, which has a fourth communication port 101 and is signal-connected to the first communication port 102.

[0042] Specifically, the host computer is responsible for collecting and processing the data signals output by the programmable controller, as well as sending control commands to control the programmable controller.

[0043] As an example, the fourth communication port 101 supports the EtherCAT communication protocol.

[0044] It should be noted that the host computer has a fourth communication port 101, which supports the EtherCAT communication protocol. The fourth communication port 101 is connected to the first communication port 102, thereby enabling the host computer and the programmable controller to exchange data and communicate.

[0045] In this embodiment, the power regulator includes a second communication port 105, and the first communication port 102 is signal-connected to the second communication port 105.

[0046] Specifically, the power regulator has a second communication port 105, and the first communication port 102 is signal-connected to the second communication port 105, thereby enabling the power regulator and the programmable controller to exchange data and communicate.

[0047] In this embodiment, the second communication port 105 supports the EtherCAT communication protocol.

[0048] As an example, the first communication port 102 and the second communication port 105 are connected via EtherCAT communication protocol signals.

[0049] Specifically, the second communication port 105 supports the EtherCAT communication protocol, and the first communication port 102 and the second communication port 105 are connected via EtherCAT communication protocol signals, thereby enabling the power regulator and the programmable controller to form an EtherCAT communication network and realize the function of data exchange.

[0050] As an example, the host computer sends a heating preparation command to the programmable controller. After receiving the heating preparation command, the programmable controller sends a control command to the power regulator through the first communication port 102. The power regulator can adjust its output power according to the input control signal.

[0051] In this embodiment, the power regulator adjusts its output power by changing the phase angle of the alternating current or adjusting the effective value of the input voltage.

[0052] As an example, the power regulator contains a thyristor, which is used as a power control element to control the output power by triggering the thyristor to turn on and off.

[0053] In this embodiment, the power regulator includes a detection module. The detection module is used to detect whether the filter box 126, the multiple interconnected electrical connectors 124, and the electrostatic chuck 120 are in a closed state. If they are in a closed state, the detection module sends a heating preparation signal to the programmable controller through the second communication port 105. If they are in an open state, the detection module does not send a heating preparation signal.

[0054] It should be noted that the detection module sends a heating preparation signal to the programmable controller through the second communication port 105. The programmable controller sends the received heating preparation signal to the host computer, so that the host computer can output a heating preparation command to the programmable controller according to the received heating preparation signal.

[0055] It should also be noted that the detection module can also detect the status data of the electrostatic chuck 120 in real time, and feed back real-time voltage, current and power data to the programmable controller through the second communication port 105. The programmable controller then feeds back to the host computer, so that the host computer can determine the status of the wafer on the bearing surface 121 under the current process in real time.

[0056] In this embodiment, the heater control device further includes: a radio frequency power supply, the radio frequency power supply having a third communication port 106, the third communication port 106 being signal-connected to the first communication port 102, and the radio frequency power supply being electrically connected to the electrostatic chuck 120.

[0057] It should be noted that radio frequency power supplies are essential devices in semiconductor manufacturing processes, ensuring the stability of the manufacturing process and product quality.

[0058] Specifically, the third communication port 106 supports the EtherCAT communication protocol.

[0059] As an example, the third communication port 106 and the first communication port 102 are connected via the EtherCAT communication protocol.

[0060] It should be noted that in this embodiment, the programmable controller, power regulator, RF power supply, and user layer (i.e., host computer) all support the EtherCAT communication protocol, thereby enabling the construction of an EtherCAT communication network. Compared with other communication protocols, the data transmission rate of the EtherCAT communication network is very high, allowing communication data to be transmitted in a very short time. This gives the EtherCAT communication network strong anti-interference capabilities, reduces the probability of the EtherCAT communication network being affected by RF interference, and thus improves the anti-interference capability of the heater control device.

[0061] In this embodiment, the heater control device further includes a filter box 126, the power input terminal of the filter box 126 is electrically connected to the power regulator, the power output terminal of the filter is electrically connected to the printed circuit board 122 closest to the filter, and the filter box 126 includes a second I / O port 104, the second I / O port 104 is signal-connected to the first I / O port 103.

[0062] It should be noted that the filter box 126 is used to filter radio frequency interference (RFI) in a specific frequency range, which can reduce the probability of RFI causing damage to the power regulator, thereby further improving the stability of the heater control device.

[0063] As an example, select the appropriate filter box type 126 according to the required frequency range to be filtered.

[0064] Specifically, the filter box 126 includes low-pass filter box 126, high-pass filter box 126, band-pass filter box 126, or band-stop filter box 126.

[0065] In this embodiment, the filter box 126 is disposed between the power regulator and the radio frequency interference source (e.g., radio frequency power supply).

[0066] In this embodiment, the power input terminal of the filter box 126 is electrically connected to the power regulator, and the power output terminal of the filter is electrically connected to the printed circuit board 122 closest to the filter, which means that the filter box 126 is located between the power regulator and the electrical connector 124.

[0067] It should be noted that the filter box 126 is relatively large. The filter box 126 is located between the power regulator and the electrical connector 124, which can reduce the difficulty of setting the filter box 126 in the heater control device and improve the stability of the heater control device.

[0068] In this embodiment, a position switch is provided in the filter box 126. The position switch is used to send a position signal to the programmable controller through the second I / O port 104.

[0069] Specifically, by setting a position switch in the filter box 126, when the filter box 126 is installed in the correct position, the position switch will send a position signal to the programmable controller through the second I / O port 104, and the programmable controller will send the received position signal to the host computer.

[0070] It should be noted that in this embodiment, after the programmable controller sends the received arrival signal and the received heating preparation signal to the host computer, the host computer can determine that the heater control device is in the preparation state. Accordingly, the host computer outputs a heating preparation command to the programmable controller, so that the programmable controller controls the output power of the power regulator to achieve the purpose of heating the wafer on the carrier surface 121.

[0071] In this embodiment, a cooling fan is provided in the filter box 126. When the filter box 126 is in working condition, the cooling fan is activated to reduce the temperature of the filter box 126, thereby reducing the probability that the function of filtering radio frequency interference in a specific frequency range will be affected due to excessive temperature. This further improves the stability and anti-interference capability of the heater control device.

[0072] In this embodiment, the heater control device further includes an AC power supply box, which is electrically connected to the power regulator.

[0073] It should be noted that the AC power supply box is used to provide AC power to the power regulator.

[0074] In this embodiment, the heater control device further includes a DC power supply box, which is electrically connected to the filter box 126.

[0075] Specifically, the DC power supply box is used to provide operating power to the cooling fan in the filter box 126.

[0076] As an example, the DC power supply box is used to provide 24V DC power to the cooling fan in the filter box 126.

[0077] It should be noted that the electrostatic chuck 120 is used to carry the wafer.

[0078] As an example, the electrostatic chuck 120 includes a bearing surface 121 for bearing and heating a wafer.

[0079] In this embodiment, the bearing surface 121 has multiple independent heating circuits.

[0080] Specifically, the carrier surface 121 has multiple independent heating circuits, which can independently control the temperature of different areas of the carrier surface 121, so that the host computer can control each heating circuit individually according to the wafer processing requirements.

[0081] It should be noted that the heating circuit is a resistive heating element circuit.

[0082] It should also be noted that the conductive post 123 closest to the electrostatic chuck 120 is electrically connected to the electrostatic chuck 120, thereby enabling the electrostatic chuck 120 to form a heating path with the power regulator and multiple electrical connectors 124. The output power of the power regulator can enter the electrostatic chuck 120 through the conductive post 123, so that the heating circuit in the bearing surface 121 of the electrostatic chuck 120 can achieve the heating effect.

[0083] Specifically, the filter box 126 and the electrostatic chuck 120 are electrically connected through multiple series-connected electrical connectors 124. Compared to the solution of using cable routing to achieve electrical connection between the filter box 126 and the electrostatic chuck 120, the electrical connectors 124 in this embodiment are physical hardware devices, enabling the filter box 126 to achieve electrical connection with the electrostatic chuck 120 through a hard connection, which improves the stability of the heater control device. Furthermore, the connection between the filter box 126 and the electrostatic chuck 120 through multiple series-connected electrical connectors 124 avoids the risk of cable routing affecting the system impedance, thereby further improving the stability of the heater control device.

[0084] Meanwhile, the filter box 126 and the electrostatic chuck 120 are electrically connected by multiple interconnected electrical connectors 124, which reduces the operational difficulty of setting up electrical connections between the filter box 126 and the electrostatic chuck 120, and reduces the equipment space occupied by the electrical connectors 124 between the filter box 126 and the electrostatic chuck 120, thereby further reducing the equipment space occupied by the heater control device.

[0085] It should be noted that the electrical connector 124 includes a printed circuit board 122 and a conductive post 123 electrically connected to one end of the printed circuit board 122. This facilitates production standardization and provides good product unit interchangeability. It can be designed in a standardized manner. Furthermore, compared to using cable routing for electrical connection, the printed circuit board 122 and the conductive post 123 electrically connected to one end of the printed circuit board 122 are more conducive to miniaturization of the heater control device and improve its reliability. In this embodiment, the printed circuit board 122 includes a main board 132 and a sub-board 131 soldered to the surfaces of both ends of the main board 132. The main board 132 includes a first insulating layer and a first conductive layer 141 located within the first insulating layer. The sub-board 131 includes a second insulating layer, a second conductive layer located within the second insulating layer, and a plurality of conductive plugs 130 protruding from the surface of the second conductive layer. The first conductive layer 141 is electrically connected to the second conductive layer, and the conductive plugs 130 are electrically connected to the second conductive layer.

[0086] It should be noted that motherboard 132 is used to provide a current path for the output power of the power regulator.

[0087] In this embodiment, the motherboard 132 includes a first insulating layer and a first conductive layer 141 located in the first insulating layer.

[0088] Specifically, the first insulating layer is used to provide electrical isolation for the first conductive layer 141.

[0089] In this embodiment, the material of the first insulating layer includes one or more of epoxy resin glass fiber, polyimide, and polytetrafluoroethylene.

[0090] Specifically, epoxy resin glass fiber, polyimide and polytetrafluoroethylene are all commonly used insulating materials in printed circuit boards 122, and they are characterized by low cost and suitability for mass production.

[0091] It should be noted that the first conductive layer 141 is used to electrically connect with the second conductive layer, and the conductive plug 130 is electrically connected with the second conductive layer, so that the first conductive layer 141 can be electrically connected with the filter box 126.

[0092] In this embodiment, the first conductive layer 141 includes a plurality of first sub-conductive layers 140 that extend in the same direction and are evenly spaced apart.

[0093] It should be noted that the first conductive layer 141 includes multiple first sub-conductive layers 140 extending in the same direction and evenly spaced apart, so that the host computer can independently control the output power of each first sub-conductive layer 140. Correspondingly, after the first conductive layer 141 is electrically connected to the conductive post 123, the output power of each first sub-conductive layer 140 is input to the bearing surface 121 of the electrostatic chuck 120. Since the bearing surface 121 has multiple independent heating circuits, the power of different heating circuits of the bearing surface 121 can be independently controlled by controlling the output power of the first sub-conductive layer 140.

[0094] Specifically, the thickness of the first sub-conductive layer 140 should not be too large or too small. If the thickness of the first sub-conductive layer 140 is too large, it will easily lead to an excessively large overall thickness of the printed circuit board 122, increasing the difficulty of manufacturing the printed circuit board 122; if the thickness of the first sub-conductive layer 140 is too small, it will easily lead to the maximum current carrying capacity of the first sub-conductive layer 140 not meeting the design requirements, resulting in an unsatisfactory heating effect of the electrostatic chuck 120 on the wafer. Therefore, in this embodiment, the thickness of the first sub-conductive layer 140 is in the range of 1.98 ounces to 2.02 ounces.

[0095] It should be noted that, in the direction perpendicular to the extension direction of the first sub-conductive layer 140 and parallel to the surface of the motherboard 132, the width of the first sub-conductive layer 140 should not be too large or too small. If the width of the first sub-conductive layer 140 is too large, with the number of first sub-conductive layers 140 remaining constant, it is easy to cause the width of the printed circuit board 122 to be too large, resulting in an excessively large space occupied by the heater control device; if the width of the first sub-conductive layer 140 is too small, it is easy to cause the maximum current carrying capacity of the first sub-conductive layer 140 to fail to meet the design requirements, resulting in an unsatisfactory heating effect of the electrostatic chuck 120 on the wafer. Therefore, in this embodiment, in the direction perpendicular to the extension direction of the first sub-conductive layer 140 and parallel to the surface of the motherboard 132, the width of the first sub-conductive layer 140 is 4mm to 4.05mm.

[0096] In this embodiment, the material of the first conductive layer 141 includes copper.

[0097] Specifically, copper has good electrical conductivity and low resistivity, which can reduce the probability of the printed circuit board 122 overheating during operation and improve the stability of the heater control device.

[0098] Specifically, the sub-board 131 soldered to the two ends of the main board 132 is used to determine the plug direction of the conductive plug 130. That is, the current path between adjacent printed circuit boards 122 determines the plug direction of the conductive plug 130.

[0099] In this embodiment, the sub-board 131 includes a second insulating layer, a second conductive layer located in the second insulating layer, and a plurality of conductive plugs 130 protruding from the surface of the second conductive layer. The first conductive layer 141 is electrically connected to the second conductive layer, and the conductive plugs 130 are electrically connected to the second conductive layer.

[0100] Specifically, the second insulating layer serves to electrically isolate the second conductive layer.

[0101] In this embodiment, the material of the second insulating layer includes one or more of epoxy resin glass fiber, polyimide, and polytetrafluoroethylene.

[0102] Specifically, epoxy resin glass fiber, polyimide and polytetrafluoroethylene are all commonly used insulating materials in printed circuit boards 122, and they are characterized by low cost and suitability for mass production.

[0103] It should be noted that the second conductive layer is used to electrically connect with the first conductive layer 141 and the conductive plug 130. The conductive plug 130 is electrically connected with the filter box 126, thereby enabling the first conductive layer 141 to be electrically connected with the filter box 126.

[0104] In this embodiment, the second conductive layer includes a plurality of second sub-conductive layers that extend in the same direction and are evenly spaced apart.

[0105] It should be noted that the second conductive layer includes multiple second sub-conductive layers that extend in the same direction and are evenly spaced, so that the host computer can independently control the output power of each second sub-conductive layer. Correspondingly, after the second sub-conductive layer is electrically connected to its corresponding first sub-conductive layer 140, the output power of each second sub-conductive layer is input to the first sub-conductive layer 140. Since the bearing surface 121 has multiple independent heating circuits, the power of different heating circuits of the bearing surface 121 can be independently controlled by controlling the output power of the first sub-conductive layer 140.

[0106] As an example, the number of second sub-conductive layers is the same as the number of first sub-conductive layers 140, and the first sub-conductive layer 140 is electrically connected to the second sub-conductive layer.

[0107] Specifically, the number of second sub-conductive layers is the same as the number of first sub-conductive layers 140, so that the second sub-conductive layer can be electrically connected to its corresponding first sub-conductive layer 140.

[0108] Specifically, the thickness of the second sub-conductive layer should not be too large or too small. If the thickness of the second sub-conductive layer is too large, it will easily lead to an excessively large overall thickness of the printed circuit board 122, increasing the difficulty of manufacturing the printed circuit board 122; if the thickness of the second sub-conductive layer is too small, it will easily lead to the maximum current carrying capacity of the second sub-conductive layer not meeting the design requirements, resulting in an unsatisfactory heating effect of the electrostatic chuck 120 on the wafer. Therefore, in this embodiment, the thickness of the second sub-conductive layer is in the range of 1.98 ounces to 2.02 ounces.

[0109] It should be noted that, in the direction perpendicular to and parallel to the surface of the sub-plate 131, the width of the second sub-conductive layer should not be too large or too small. If the width of the second sub-conductive layer is too large, with the number of second sub-conductive layers remaining constant, it can easily lead to an excessively large width of the printed circuit board 122, resulting in an excessively large space occupied by the heater control device. If the width of the second sub-conductive layer is too small, it can easily lead to the maximum current carrying capacity of the second sub-conductive layer not meeting the design requirements, resulting in an unsatisfactory heating effect of the electrostatic chuck 120 on the wafer. Therefore, in this embodiment, in the direction perpendicular to and parallel to the surface of the sub-plate 131, the width of the second sub-conductive layer is 4 mm to 4.05 mm.

[0110] In this embodiment, the material of the second conductive layer includes copper.

[0111] Specifically, copper has good electrical conductivity and low resistivity, which can reduce the probability of the printed circuit board 122 overheating during operation and improve the stability of the heater control device.

[0112] It should be noted that the conductive plug 130 protruding from the surface of the second conductive layer is used to electrically connect with the conductive post 123, and the other end of the printed circuit board 122 closest to the power regulator is also provided with a conductive plug 130, which is electrically connected to the filter box 126.

[0113] In this embodiment, the extension direction of the conductive plug 130 is the same as the extension direction of the conductive post 123.

[0114] Specifically, the extension direction of the conductive plug 130 is the same as the extension direction of the conductive post 123. After the conductive plug 130 and the conductive post 123 are electrically connected, the current path between the conductive plug 130 and the conductive post 123 can be minimized, thereby improving the heating efficiency of the heater control device.

[0115] In this embodiment, the conductive plug 130 is a banana plug.

[0116] It should be noted that the banana plug facilitates quick connection or disconnection from the conductive post 123, making it convenient for users to maintain or install the electrical connector 124. At the same time, the banana plug has high electrical contact performance, which can reduce the contact resistance between the banana plug and the conductive post 123, thereby reducing the probability that the temperature of the wafer on the bearing surface 121 will be affected during the heating process.

[0117] In this embodiment, the conductive plug 130 of the printed circuit board 122 closest to the electrostatic chuck 120 is electrically connected to the conductive post 123.

[0118] It should be noted that the conductive post 123 is used to realize the electrical connection between the printed circuit board 122 and the electrostatic chuck 120, as well as to realize the electrical connection between adjacent printed circuit boards 122.

[0119] In this embodiment, the conductive post 123 includes a conductive body post 135 and a conductive socket 136 electrically connected to both ends of the conductive body post 135.

[0120] Specifically, the conductive socket 136 facilitates quick disassembly and installation with the conductive plug 130 and the electrostatic chuck 120, and the conductive socket 136 enables electrical connection with the conductive plug 130 and the electrostatic chuck 120.

[0121] As an example, a conductive plug 130 is provided on the printed circuit board 122, and a conductive socket 136 is electrically connected to the conductive plug 130, thereby realizing the electrical connection between the conductive post 123 and the printed circuit board 122.

[0122] In this embodiment, the conductive socket 136 is a banana socket.

[0123] It should be noted that the banana socket facilitates quick connection or disconnection from the conductive plug 130, making it convenient for users to maintain or install the electrical connector 124. At the same time, the banana socket has high electrical contact performance, which can reduce the contact resistance between the conductive socket 136 and the conductive plug 130, thereby reducing the probability that the temperature of the wafer on the bearing surface 121 will be affected during the heating process.

[0124] In this embodiment, the conductive post 123 includes a plurality of sub-conductive posts 150, and each sub-conductive post 150 is electrically connected to the corresponding heating circuit.

[0125] Specifically, each sub-conductive post 150 is electrically connected to the corresponding heating circuit, thereby enabling the host computer to independently control the output power of each sub-conductive post 150 according to the actual requirements of the wafer heating process, and thus achieve independent control of the temperature of different areas of the bearing surface 121.

[0126] In this embodiment, the host computer has an upper-layer application for human-computer interaction. The upper-layer application includes a parameter setting unit, which can set corresponding heating parameters for different heating circuits through the sub-conductive post 150.

[0127] In this embodiment, the heater control device further includes a protective cover disposed outside the plurality of interconnected electrical connectors 124 and surrounding the plurality of electrical connectors 124.

[0128] Specifically, the protective cover protects multiple electrical connectors 124, reduces the probability of multiple electrical connectors 124 being interfered with by radio frequency interference sources (i.e., radio frequency power supply), and can further improve the anti-interference capability of the heater control device.

[0129] As an example, the protective shield is made of aluminum.

[0130] It should be noted that aluminum, being a good conductor of electricity, can effectively shield external radio frequency interference and protect the multiple internal electrical connectors 124 from radio frequency interference.

[0131] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A heater control device, characterized in that, include: A programmable controller, including a first communication port and a first I / O port; The power regulator includes a second communication port, and the first communication port is signal-connected to the second communication port; Multiple interconnected electrical connectors, each connector including a printed circuit board and a conductive post electrically connected to one end of the printed circuit board, the printed circuit boards of adjacent electrical connectors being electrically connected through the conductive post, and the other end of the printed circuit board closest to the power regulator being electrically connected to the power regulator. An electrostatic chuck, wherein the conductive post closest to the electrostatic chuck is electrically connected to the electrostatic chuck; The radio frequency power supply has a third communication port, which is signal-connected to the first communication port, and the radio frequency power supply is electrically connected to the electrostatic chuck. The filter box has a power input terminal electrically connected to the power regulator and a power output terminal electrically connected to the printed circuit board closest to the filter box. The filter box also includes a second I / O port, which is signal-connected to the first I / O port.

2. The heater control device as described in claim 1, characterized in that, The heater control device further includes: a host computer, which has a fourth communication port and is signal-connected to the first communication port; The electrostatic chuck includes a bearing surface for supporting and heating a wafer, and the bearing surface has multiple independent heating circuits. The conductive pillar includes multiple sub-conductive pillars, and each sub-conductive pillar is electrically connected to the corresponding heating circuit. The host computer has an upper-level application for human-computer interaction. The upper-level application includes a parameter setting unit, which can set corresponding heating parameters for different heating circuits through sub-conductive pillars.

3. The heater control device as described in claim 1, characterized in that, The printed circuit board includes a main board and sub-boards soldered to the surfaces of both ends of the main board. The main board includes a first insulating layer and a first conductive layer located in the first insulating layer. The sub-board includes a second insulating layer, a second conductive layer located in the second insulating layer, and a plurality of conductive plugs protruding from the surface of the second conductive layer. The first conductive layer is electrically connected to the second conductive layer, and the conductive plugs are electrically connected to the second conductive layer. The conductive plug of the printed circuit board closest to the electrostatic chuck is electrically connected to the conductive post.

4. The heater control device as described in claim 3, characterized in that, The first conductive layer includes a plurality of first sub-conductive layers that extend in the same direction and are evenly spaced apart; The second conductive layer includes a plurality of second sub-conductive layers that extend in the same direction and are evenly spaced apart. The number of the second sub-conductive layers is the same as the number of the first sub-conductive layers, and the first sub-conductive layers are electrically connected to the second sub-conductive layers.

5. The heater control device as described in claim 4, characterized in that, The thickness of the first sub-conductive layer ranges from 1.98 ounces to 2.02 ounces; The thickness of the second sub-conductive layer ranges from 1.98 ounces to 2.02 ounces.

6. The heater control device as described in claim 4, characterized in that, The width of the first sub-conductive layer is 4 mm to 4.05 mm, which is perpendicular to and parallel to the extension direction of the first sub-conductive layer and the surface of the motherboard. The width of the second sub-conductive layer is 4 mm to 4.05 mm, which is perpendicular to and parallel to the extension direction of the second sub-conductive layer and the surface of the sub-plate.

7. The heater control device as described in claim 4, characterized in that, The conductive plug extends in the same direction as the conductive post.

8. The heater control device as described in claim 3, characterized in that, The conductive plug is a banana plug.

9. The heater control device as described in claim 3, characterized in that, The conductive post includes a conductive body post and conductive sockets electrically connected to both ends of the conductive body post. The conductive socket is electrically connected to the conductive plug.

10. The heater control device as claimed in claim 9, characterized in that, The conductive socket is a banana socket.

11. The heater control device as claimed in claim 1, characterized in that, The heater control device further includes a protective cover disposed outside the plurality of interconnected electrical connectors and surrounding the plurality of electrical connectors.

12. The heater control device as claimed in claim 11, characterized in that, The protective cover is made of aluminum.

13. The heater control device as claimed in claim 1, characterized in that, The filter box is equipped with a position switch, which is used to send a position signal to the programmable controller through the second I / O port.

14. The heater control device as claimed in claim 1, characterized in that, The power regulator includes a detection module, which is used to detect whether the multiple interconnected electrical connectors and the electrostatic chuck are in a closed state. If they are in a closed state, the detection module sends a heating preparation signal to the programmable controller through the second communication port. If they are in an open state, the detection module does not send a heating preparation signal.

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