Cleaning equipment, transmission equipment, testing equipment and process platform

Abstract

The present disclosure provides a clean device, a transmission device, a detection device and a process platform, which relate to the field of semiconductor processing technology. The clean device includes: a gas inlet member, provided with a first air hole for connecting to an air inlet pipeline; a gas collecting member, provided with a second air hole for connecting to a collecting pipeline; when the gas inlet member is in a state of being connected to the gas collecting member, the gas inlet member and the gas collecting member enclose a receiving space, and the receiving space is used to accommodate a workpiece; the receiving space is respectively connected to the first air hole and the second air hole; at least one of the gas collecting member and the gas inlet member is provided with a mounting portion, and the mounting portion is used to fix the clean device in a preset mounting position. The present disclosure ensures that the workpiece can be purged by gas during the transmission process, reducing or even avoiding the risk of the workpiece being contaminated during the transmission process.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor processing technology, and in particular to a clean device, a transmission device, a detection device and a process platform. Background Art

[0002] Wafer transfer equipment is a module that transfers wafers to reaction chambers or detection devices through a robot. It is an essential module in the process platform for preparing wafers. However, there is a risk of wafer contamination during the transfer process. Summary of the invention

[0003] The present invention provides a cleaning device, a transmission device, a detection device and a process platform.

[0004] According to one aspect of the present disclosure, a cleaning device is provided, comprising: a gas inlet member, provided with a first air hole for connecting to an air inlet pipeline; a gas collecting member, provided with a second air hole for connecting to a collecting pipeline; wherein, when the gas inlet member is in a state of being connected to the gas collecting member, the gas inlet member and the gas collecting member form a receiving space, and the receiving space is used to accommodate a workpiece; the receiving space is communicated with the first air hole and the second air hole, respectively, so that the gas entering the receiving space from the first air hole can enter the gas collecting member from the second air hole after purging the workpiece, and be discharged to the outside of the cleaning device through the gas collecting member; at least one of the gas collecting member and the gas inlet member is provided with a mounting portion, and the mounting portion is used to fix the cleaning device at a preset mounting position.

[0005] In some embodiments, when the gas inlet member is in a state of being connected to the gas collecting member, the gas inlet member is butted against the gas collecting member along a thickness direction of the workpiece.

[0006] In some embodiments, the surface of the gas collecting member facing the containing space has a bearing area and a peripheral area, the bearing area is used to place the workpiece, and the peripheral area is located on the outside of the bearing area away from the vertical center line of the cleaning device; the second air hole is located in the peripheral area; the surface of the gas inlet member facing the containing space has a first area corresponding to the bearing area, and the first air hole is located in the first area.

[0007] In some embodiments, the gas inlet member includes: a first plate body and a second plate body, the first plate body is located on a side of the second plate body away from the receiving space, the first plate body is connected to the second body to enclose a first space; the second plate body is provided with the first air hole, and the first air hole is connected to the first space.

[0008] In some embodiments, the first plate body or the second plate body is provided with a plurality of first guide grooves, and the plurality of first guide grooves are radially distributed with the vertical center line of the clean device as the center, and at least one first guide groove is used to guide the gas entering the first space to flow in a direction away from the vertical center line of the clean device.

[0009] In some embodiments, the first guide groove includes: a first type of groove and a second type of groove, the width of the first type of groove is smaller than the width of the second type of groove; the gas inlet member is used to rotate under the action of a driving force so that the second type of groove corresponds to a preset area of ​​the workpiece.

[0010] In some embodiments, the gas collecting member includes: a third plate and a fourth plate, the fourth plate is located on a side of the third plate away from the receiving space, the fourth plate is connected to the third body to enclose a second space; the third plate is provided with the second air hole, and the second air hole is connected to the second space.

[0011] In some embodiments, the third plate body or the fourth plate body is provided with a plurality of second guide grooves, and the plurality of second guide grooves are radially distributed with the vertical center line of the clean device as the center, and at least one second guide groove is used to guide the gas entering the second space to flow in a direction toward the vertical center line of the clean device.

[0012] In some embodiments, the gas collecting piece is connected to the mounting portion, and the gas collecting piece is further provided with an electrode, which is used to generate an electric charge with opposite polarity to the corresponding position of the gas inlet piece, so as to fix the gas inlet piece and the gas collecting piece together through electrostatic adsorption force.

[0013] According to another aspect of the present disclosure, there is provided a transmission device, comprising: a robot arm and a cleaning device as described in any one of the above; wherein the robot arm is connected to a mounting portion in the cleaning device.

[0014] According to another aspect of the present disclosure, a detection device is provided, comprising: a detection device and a cleaning device as described in any one of the above items; wherein the detection device is connected to a mounting portion in the cleaning device.

[0015] According to another aspect of the present disclosure, a process platform is provided, comprising: a chamber, a manipulator, a detection device, and a clean device as described in any of the above; wherein at least one of the manipulator and the detection device is connected to a mounting portion in the clean device.

[0016] In some embodiments, the process platform further includes: a driving mechanism, wherein the driving mechanism is connected to the gas inlet member in the cleaning device to provide a driving force to the gas inlet member so that the gas inlet member can rotate under the driving force.

[0017] The cleaning device provided in this embodiment ensures that the workpiece can be purged with gas during the transmission process, reduces or even avoids the risk of the workpiece being contaminated during the transmission process, and helps save gas resources.

[0018] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure.

[0020] Figure 1 is a schematic structural diagram of a cleaning device according to an embodiment of the present disclosure;

[0021] Figure 2 is a schematic structural diagram of a cleaning device (the installation portion is located on the side of the cleaning device) according to an embodiment of the present disclosure;

[0022] Figure 3 is a schematic structural diagram of a cleaning device (the installation portion is located at the lower part of the cleaning device) according to an embodiment of the present disclosure;

[0023] Figure 4 is a schematic structural diagram of a gas inlet member according to an embodiment of the present disclosure;

[0024] Figure 5 is a distribution diagram of the first guide groove according to an embodiment of the present disclosure;

[0025] Figure 6 is a schematic structural diagram of a gas collecting member according to an embodiment of the present disclosure;

[0026] Figure 7 is a schematic diagram of the distribution of the second guide groove according to an embodiment of the present disclosure;

[0027] Figure 8 is a schematic diagram of the structure of a transmission device according to an embodiment of the present disclosure;

[0028] Fig. 9 is a schematic structural diagram of a detection device according to an embodiment of the present disclosure;

[0029] Fig.10 is a schematic diagram of the structure of a process platform according to an embodiment of the present disclosure;

[0030] Fig.11 The structure of the storage chamber according to the embodiment of the present disclosure is shown in FIG. Figure 1 ;

[0031] Fig.12 The structure of the storage chamber according to the embodiment of the present disclosure is shown in FIG. Figure 2 .

[0032] Explanation of reference numerals: 100-cleaning device; 100a-accommodating space; 110-gas inlet; 110a-first air hole; 110b-first space; 110c-first guide groove; 110d-first area; 110e-second area; 111-first plate; 112-second plate; 130-gas collecting member; 130a-second air hole; 130b-bearing area; 130c-peripheral area; 130d-second guide groove; 130e-second space; 131-installation part; 132-third plate; 133-fourth plate; 200-workpiece; 300-manipulator; 400-detection device; 401-calibration motion table; 402-calibration Quasi-platform; 500-fuselage; 501-gas inlet; 502-gas processing area; 503-gas purge area; 504-gas recovery channel; 505-gas exhaust port; 507-first temperature control module; 508-first homogenization module; 600-storage cavity; 601-storage shelf; 602-storage bottom plate; 603-gas inlet pipeline; 604-second temperature control module; 605-second homogenization module; 606-gas recovery module; 607-gas recovery pipeline; 608-gas intake pressure detection module; 609-gas intake switch; 610-gas intake adjustment module; 611-gas recovery pressure detection module; 612-gas exhaust pipeline. DETAILED DESCRIPTION

[0033] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0034] The cleaning device provided by the embodiment of the present disclosure cooperates with the gas inlet member and the gas collecting member so that the gas enters the receiving space where the workpiece is located from the gas inlet member and purges the workpiece, and then the gas enters the gas collecting member and is discharged to the outside of the cleaning device, completing the purge of the workpiece in the receiving space. This embodiment not only ensures that the workpiece can be purged with gas during the transmission process, reduces or even avoids the risk of the workpiece being contaminated during the transmission process, but also helps to save gas resources. This embodiment can be applied to wafer transmission scenarios, detection scenarios, positioning scenarios, and scenarios with higher cleanliness requirements, and meet the cleanliness requirements of a single wafer or a small number of wafers in a smaller range.

[0035] The structure and implementation process of the cleaning device of the embodiment of the present disclosure are described below with reference to the accompanying drawings. It can be understood that the workpiece in the present embodiment includes a wafer and other semiconductor workpieces. For ease of description, the vertical direction of the cleaning device (i.e., the thickness direction of the workpiece) is taken as the up and down direction, specifically the gravity direction is taken as the down direction, and the vertical center line O of the cleaning device is taken as the inner side.

[0036] Figure 1 is a schematic diagram of the structure of a cleaning device according to an embodiment of the present disclosure, specifically a schematic diagram after being cut with a cutting plane parallel to a vertical center line O of the cleaning device; Figure 2 is a schematic structural diagram of a cleaning device (the installation portion is located on the side of the cleaning device) according to an embodiment of the present disclosure; Figure 3 It is a schematic structural diagram of a cleaning device (the installation portion is located at the lower part of the cleaning device) according to an embodiment of the present disclosure.

[0037] Please refer to Figures 1 to 3 The cleaning device 100 provided by the embodiment of the present disclosure includes: a gas inlet member 110 and a gas collecting member 130. The gas inlet member 110 is selectively connected to the gas collecting member 130. Specifically, when the gas inlet member 110 and the gas collecting member 130 are in a connected state, the gas inlet member 110 and the gas collecting member 130 can enclose a receiving space 100a for accommodating the workpiece 200. When the cleaning device 100 is in a non-connected state, the gas inlet member 110 and the gas collecting member 130 are separated from each other.

[0038] In order to facilitate the placement of the workpiece 200, the gas inlet 110 is connected to the gas collecting member 130 in the up-down direction, and the gas inlet 110 is located above the gas collecting member 130. This example will be used for description below. In other examples, the gas inlet 110 is located below the gas collecting member 130.

[0039] The gas inlet member 110 is provided with a plurality of first air holes 110a, and the plurality of first air holes 110a can be evenly distributed, for example, the plurality of first air holes 110a are distributed in a dot matrix. In some examples, the gas inlet member 110 may include two connected thin plates, the thin plate located at the bottom is provided with the first air holes 110a, and the other thin plate is provided with an air inlet interface, the air inlet interface is connected to the first air holes 110a, and the air inlet interface is connected to the air inlet pipeline. In other examples, the gas inlet member 110 may include a first plate-like structure with a preset thickness, the first air holes 110a are provided on the lower surface of the first plate-like structure, and the air inlet interface is provided on the other surface of the first plate-like structure.

[0040] The gas collecting member 130 is provided with second pores 130a, and the second pores 130a can be distributed in a lattice pattern, or the second pores 130a can be evenly distributed along a preset closed curve. In some examples, the gas collecting member 130 may include a double-layer thin plate connected to each other, the thin plate located on the upper side is provided with the second pores 130a, and the other thin plate is provided with a collecting interface, the collecting interface is connected to the second pores 130a, and the collecting interface is connected to the collecting pipeline. In other examples, the gas collecting member 130 may include a second plate-like structure with a preset thickness, the upper surface of the second plate-like structure is provided with the second pores 130a, the other surface of the second plate-like structure is provided with a collecting interface, and the collecting interface is connected to the collecting pipeline.

[0041] At least one of the lower surface of the gas inlet member 110 and the upper surface of the gas collecting member 130 is provided with a receiving groove, and the space corresponding to the receiving groove forms a receiving space 100a for accommodating the workpiece 200. For example, part of the upper surface of the gas collecting member 130 is recessed downward to form a receiving groove, and the space defined by the receiving groove is the receiving space 100a. For another example, both the lower surface of the gas inlet member 110 and the upper surface of the gas collecting member 130 are provided with a receiving groove, and the two receiving grooves are connected to define the receiving space 100a together.

[0042] The shape of the receiving space 100a is adapted to the shape of the workpiece 200. For example, when the workpiece 200 is circular, the receiving space 100a is also circular; when the workpiece 200 is polygonal, the receiving space 100a is also polygonal. The shapes of the gas inlet 110 and the gas collection member 130 are adapted to the shape of the receiving space 100a.

[0043] In other examples, the gas inlet member 110 is connected to the gas collecting member 130 in the horizontal direction. The horizontal direction is perpendicular to the up-down direction. The gas inlet member 110 and the gas collecting member 130 are respectively provided with mounting grooves, and the two mounting grooves together form a mounting space. For example, when the workpiece 200 is circular, the two mounting grooves can be semicircular grooves.

[0044] In other examples, according to the size of the workpiece 200 , for example, when the thickness of the workpiece 200 is relatively large, one of the gas inlet member 110 and the gas collecting member 130 is a box body with an opening, and the other is a cover body matched with the box body.

[0045] When the gas inlet 110 and the gas collecting member 130 are in a connected state, the gas inlet 110 and the gas collecting member 130 are detachably connected, so as to facilitate the taking and placing of the workpiece 200. Exemplarily, the gas inlet 110 and the gas collecting member 130 are plugged, or the gas inlet 110 and the gas collecting member 130 are snapped, or the gas inlet 110 and the gas collecting member 130 are connected by magnetic attraction, or the gas inlet 110 and the gas collecting member 130 are connected by electrostatic attraction.

[0046] Please refer to Figure 8 and Fig. 9 , and continue to refer to Figures 1 to 3 At least one of the gas collecting member 130 and the gas inlet member 110 is provided with a mounting portion 131, and the mounting portion 131 is used to fix the cleaning device 100 in a preset mounting position. The preset mounting position may include at least one of the following: the manipulator 300 is used to grasp one end of the workpiece 200, and the detection device 400 is used to carry one end of the workpiece 200. The specific position of the preset mounting position can be set according to actual needs.

[0047] The mounting portion 131 may refer to a portion of the gas collecting component 130 that is connected to a component at a preset mounting position, or may refer to a component that is fixedly connected to the gas collecting component 130 in a fixed connection manner.

[0048] Taking the gas collecting part 130 provided with the mounting part 131 as an example, in some examples, the mounting part 131 is a mounting hole opened on the side or bottom of the gas collecting part 130, and accordingly, the component at the preset mounting position is provided with a mounting shaft that matches the mounting hole. Alternatively, the mounting part 131 is a mounting shaft provided on the side or bottom of the gas collecting part 130, and accordingly, the component at the preset mounting position is provided with a mounting hole that matches the mounting shaft. In this way, the structure of the component at the preset mounting position itself is used to match the gas collecting part 130, thereby reducing the modification of the structure of the existing components in the process platform, and in the scenario where the clean device 100 is not needed, it will not affect the normal function of the component at the preset mounting position.

[0049] In other examples, the mounting portion 131 is a seat body, and the specific structure of the seat body is set according to actual needs. The seat body can be fixedly connected to the gas collecting member 130 by welding, screwing, plugging, or snapping, or the seat body and the gas collecting member 130 are integrally set by an integrated molding process. The seat body is fixedly connected to a component of a preset mounting position by welding, screwing, plugging, or snapping, or the seat body and the component of a preset mounting position are integrally set by an integrated molding process. For example, the mounting portion 131 includes a mounting shaft, and the two ends of the mounting shaft are respectively plugged with the gas collecting member 130 and the component of the preset mounting position. For another example, the gas collecting member 130, the seat body, and the component of the preset mounting position are integrally set. In other examples, the gas collecting member 130 is provided with a mounting portion 131, and its implementation process is similar to the above examples.

[0050] In the working process of the cleaning device 100 provided in this embodiment, a workpiece 200 is provided; the workpiece 200 is placed on the upper surface of the gas collecting member 130; the gas inlet member 110 is connected to the gas collecting member 130 so that the workpiece 200 is accommodated in the receiving space 100a; gas (or clean gas) is introduced into the receiving space 100a through the first air hole 110a, and the gas is blown to the workpiece 200 and then discharged from the second air hole 130a. When the workpiece 200 needs to be taken out, the gas inlet member 110 is separated from the gas collecting member 130; and the workpiece 200 is taken away.

[0051] Wherein, at the current position, when the workpiece 200 is placed on the upper surface of the gas collecting member 130, the gas inlet member 110 is located in the storage area, and the storage area is located near the current position. For example, when the current position is located in the chamber of the process platform, the storage area is also located in the chamber, and the storage area is set close to the current position. The storage area may be provided with a storage member, and the storage member is used to place the gas inlet member 110 separated from the gas collecting member 130; the storage member may include a tray or a hanging bracket, etc. Accordingly, at the current position, after the gas inlet member 110 is separated from the gas collecting member 130, the gas inlet member 110 is placed in the storage area.

[0052] The cleaning device 100 provided in this embodiment cooperates with the gas inlet member 110 and the gas collecting member 130, so that the gas enters the receiving space 100a where the workpiece 200 is located from the gas inlet member 110 and purges the workpiece 200, and then the gas enters the gas collecting member 130 and is discharged to the outside of the cleaning device 100, completing the purge of the workpiece 200 in the receiving space 100a, thereby ensuring that the workpiece 200 can be purged by the gas during the transmission process, reducing or even avoiding the risk of the workpiece 200 being contaminated during the transmission process, and the receiving space 100a can be set relatively small, which is conducive to saving gas resources.

[0053] Please refer to Figure 1 and Figure 4 In some embodiments, the upper surface of the gas collecting member 130 facing the receiving space 100a has a bearing area 130b and a peripheral area 130c, the bearing area 130b is used to place the workpiece 200, and the peripheral area 130c is located outside the bearing area 130b; the second air hole 130a is located in the peripheral area 130c; the lower surface of the gas inlet member 110 facing the receiving space 100a has a first area 110d corresponding to the bearing area 130b, and the first air hole 110a is located in the first area 110d.

[0054] The shape of the bearing area 130b is adapted to the shape of the workpiece 200, and the size of the bearing area 130b along the horizontal direction is slightly larger than the size of the workpiece 200 along the horizontal direction, so as to prevent the workpiece 200 from affecting the gas entering the second air hole 130a. Taking the workpiece 200 as an example, the bearing area 130b is a circular area, and the diameter of the bearing area 130b is slightly larger than the diameter of the workpiece 200.

[0055] In some examples, the second pores 130a may be evenly distributed in the peripheral region 130c; for example, along the circumference of the gas collecting member 130, the distance between two adjacent second pores 130a is equal. In other examples, the peripheral region 130c may include a first sub-region and a second sub-region, and the density of the second pores 130a in the first sub-region is greater than the density of the second pores 130a in the second sub-region, that is, the distance between two adjacent second pores 130a in the first sub-region is less than the distance between two adjacent second pores 130a in the second sub-region, so that the gas outflow speeds in different sub-regions are different, which can be applied to the scene where different regions of the workpiece 200 have different cleanliness requirements.

[0056] In the upward direction, the upper surface of the gas collecting member 130 is located in the portion of the bearing area 130b, which is higher than the portion where the second air hole 130a is located, so that the gas after the workpiece 200 is purged enters the second air hole 130a. In addition, the portion of the upper surface of the gas collecting member 130 outside the second air hole 130a is higher than the portion where the second air hole 130a is located. In other examples, in order to simplify the preparation process of the gas collecting member 130, the upper surface of the gas collecting member 130 is located in the portion of the bearing area 130b, and is arranged flush with the portion where the second air hole 130a is located.

[0057] Please refer to Figure 4 and Figure 1, the lower surface of the gas inlet member 110 has a first area 110d corresponding to the bearing area 130b, and a second area 110e corresponding to the peripheral area 130c. The first air hole 110a is located in the first area 110d. In some examples, the plurality of first air holes 110a can be evenly distributed in the first area 110d, for example, along the circumference of the gas inlet member 110, the spacing between two adjacent first air holes 110a is equal. In other examples, the first area 110d includes a third sub-area and a fourth sub-area, and the density of the first air holes 110a in the third sub-area is greater than the density of the first air holes 110a in the fourth sub-area, that is, the distance between two adjacent first air holes 110a in the third sub-area is less than the distance between two adjacent first air holes 110a in the fourth sub-area, so that the speed at which the gas enters the receiving space 100a in different sub-areas is different, which can be applied to the scene where different areas of the workpiece 200 have different clean requirements.

[0058] In the upward direction, the portion of the upper surface of the gas inlet member 110 located in the first area 110d is higher than the portion of the upper surface of the gas inlet member 110 located in the second area 110e, so that the gas flow can flow to the area where the workpiece 200 is located, ensuring the cleaning effect. In other examples, in order to simplify the preparation process of the gas inlet member 110, the portion of the upper surface of the gas inlet member 110 located in the first area 110d is flush with the portion of the upper surface of the gas inlet member 110 located in the second area 110e.

[0059] In other embodiments, at least one second air hole 130a is located in the bearing area 130b; the bearing area 130b on the upper surface of the gas collecting member 130 is provided with a plurality of supporting protrusions, and the plurality of supporting protrusions are used to support the workpiece 200, so that there is a preset distance between the workpiece 200 and the second air hole 130a, which is conducive to the gas after purging the workpiece 200 to flow out from the second air hole 130a.

[0060] Please refer to Figure 4 and Figure 1 In some embodiments, the gas inlet member 110 includes: a first plate body 111 and a second plate body 112, wherein the first plate body 111 is located above the second plate body 112, and the first plate body 111 is connected to the second body to enclose a first space 110b. The second plate body 112 is provided with a first air hole 110a, wherein the second air hole 130a is provided through the second plate body 112 in the up-down direction, so that the first air hole 110a is connected to the first space 110b.

[0061] The first plate 111 and the second plate 112 may be circular plates. The first plate 111 is used for a portion corresponding to the workpiece 200 and has a preset distance between the corresponding portions of the second plate 112, so that the first plate 111 and the second body can enclose a first space 110b.

[0062] Exemplarily, a portion of the first plate body 111 near the outer edge is bent downward to facilitate the connection between the first plate body 111 and the second plate body 112; or, a portion of the second plate body 112 near the outer edge is bent upward to facilitate the connection between the first plate body 111 and the second plate body 112; or, portions of the first plate body 111 and the second plate body 112 near the outer edges are both bent downward to facilitate the connection between the first plate body 111 and the second plate body 112, and to facilitate the connection between the gas inlet member 110 and the gas collecting member 130.

[0063] The first plate body 111 and the second plate body 112 can be fixedly connected by bonding, melting, welding, snapping, plugging, etc., and the connection between the first plate body 111 and the second plate body 112 can be sealed to prevent gas leakage from the connection between the first plate body 111 and the second plate body 112; or the first plate body 111 and the second plate body 112 can be integrally arranged by an integrated molding process.

[0064] The first plate 111 or the second plate 112 is also provided with an air inlet interface (not shown in the figure). Exemplarily, the air inlet interface is provided on the first plate 111, or the air inlet interface is provided at the connection between the first plate 111 and the second plate 112. The air inlet interface is connected to the air inlet pipeline, and the air inlet pipeline is connected to the air source. Among them, a seal is provided at the connection between the air inlet interface and the air inlet pipeline; a seal is also provided at the connection between the air inlet pipeline and the air source. When the cleaning device 100 is connected to the manipulator 300, at least part of the air inlet pipeline can be provided in the gripper of the manipulator 300 to simplify the structure. In addition, an air inlet regulating valve is provided in the air inlet pipeline, and the air inlet regulating valve is used to adjust the flow rate of gas entering the first space 110b.

[0065] Figure 5 is a distribution diagram of the first guide groove according to an embodiment of the present disclosure; Figure 5 This is a schematic diagram of the structure when the first plate body is viewed from bottom to top, and the arrows in the figure are used to indicate the flow direction of the gas.

[0066] Please refer to Figure 1 , Figure 4 and Figure 5In some examples, the first plate 111 or the second plate 112 is provided with a plurality of first guide grooves 110c, and the plurality of first guide grooves 110c are radially distributed with the vertical center line of the cleaning device 100 as the center, and at least one first guide groove 110c is used to guide the gas entering the first space 110b to flow in a direction away from the vertical center line of the cleaning device 100, so as to facilitate the gas to fill the receiving space 100a and purge the entire workpiece 200.

[0067] The second plate 112 is provided with a first guide groove 110c, which extends downward from the upper surface of the second plate 112; wherein at least one first air hole 110a is located in the first guide groove 110c. Alternatively, the first plate 111 is provided with a first guide groove 110c, which extends upward from the lower surface of the first plate 111. Alternatively, the first plate 111 and the second plate 112 are respectively provided with the first guide groove 110c.

[0068] The first guide groove 110c is arranged corresponding to the first area 110d. For the first guide grooves 110c located on the same plate body, at least two first guide grooves 110c are connected to each other at one end facing the vertical center line of the cleaning device 100 to form a diversion channel. Exemplarily, two adjacent first guide grooves 110c have facing side walls, and the inner ends of the two facing side walls facing the vertical center line of the cleaning device 100 have a preset distance from the vertical center line of the cleaning device 100, and the inner ends of the two facing side walls are connected.

[0069] When the air inlet interface is close to the edge of the first plate body 111, at least one of the first guide grooves 110c is used to guide the gas to the diversion channel, so that the gas flows from the diversion channel to the multiple first guide grooves 110c and enters the receiving space 100a through the first air hole 110a. In other examples, the air inlet interface can be set close to the diversion channel. The specific position of the air inlet interface can be set according to actual needs, so that the air inlet interface is connected to the air inlet pipeline, and the air inlet pipeline is prevented from affecting the layout or operation of other components.

[0070] In some examples, the first guide groove 110c includes: a first type of groove and a second type of groove, the width of the first type of groove is smaller than the width of the second type of groove; the gas inlet member 110 is used to rotate under the action of a driving force so that the second type of groove corresponds to a preset area of ​​the workpiece 200.

[0071] Wherein, along the circumference of the gas inlet member 110 , the first guide groove 110 c has two side walls distributed at intervals, and the width of the first guide groove 110 c refers to the straight-line distance between the two side walls of the first guide groove 110 c .

[0072] The gas inlet 110 is connected to a driving mechanism, and the driving structure includes a motor, which provides a driving force for driving the gas inlet 110 to rotate. An axial hole is provided on the upper surface of the first plate 111 of the gas inlet 110. The axial hole is matched with the output shaft of the motor; or, the output shaft of the motor is installed with a driving gear, the driving gear is meshed with the driven gear, and the transmission shaft for installing the driven gear is matched with the axial hole.

[0073] Through the above-mentioned setting, the flow rate of the gas in the first type of groove is greater than the flow rate of the gas in the second type of groove, so that the purge force of the gas flowing out from the area where the first type of groove is located is greater than the purge force of the gas flowing out from the area where the second type of groove is located, thereby making the cleaning force of the preset area corresponding to the workpiece 200 and the first type of groove greater than the cleaning force of the remaining areas, which can be used in scenarios where different areas of the workpiece 200 have different cleanliness requirements.

[0074] Please refer to Figure 1 and Figure 6 In some embodiments, the gas collecting member 130 includes: a third plate 132 and a fourth plate 133, the fourth plate 133 is located on a side of the third plate 132 away from the receiving space 100a, the fourth plate 133 is connected to the third plate 132 to enclose a second space 130e; the third plate 132 is provided with a second air hole 130a, and the second air hole 130a is connected to the second space 130e.

[0075] The third plate 132 and the fourth plate 133 may be circular plates. The third plate 132 is used for a portion corresponding to the workpiece 200 and has a preset distance with a corresponding portion of the fourth plate 133, so that the third plate 132 and the fourth plate 133 can enclose the second space 130e.

[0076] The portion of the fourth plate 133 near the outer edge is bent upward to facilitate the connection between the fourth plate 133 and the third plate 132; or, the portion of the third plate 132 near the outer edge is bent downward to facilitate the connection between the third plate 132 and the fourth plate 133; or, the portions of the third plate 132 and the fourth plate 133 near the outer edges are both bent upward to facilitate the connection between the third plate 132 and the fourth plate 133, and to facilitate the connection between the gas collecting component 130 and the gas inlet component 110.

[0077] The third plate body 132 and the fourth plate body 133 can be fixedly connected by bonding, melting, welding, snapping, plugging, etc., and the connection between the third plate body 132 and the fourth plate body 133 can be sealed to prevent gas leakage from the connection between the third plate body 132 and the fourth plate body 133; or the third plate body 132 and the fourth plate body 133 can be integrally arranged by an integrated molding process.

[0078] The third plate 132 or the fourth plate 133 is also provided with a collection interface (not shown in the figure). Exemplarily, the collection interface is provided on the fourth plate 133, or the collection interface is provided at the connection between the third plate 132 and the fourth plate 133. The collection interface is connected to the collection pipeline, and the collection pipeline is connected to the collection device. Among them, a seal is provided at the connection between the collection interface and the collection pipeline; and a seal is also provided at the connection between the collection pipeline and the collection device. When the cleaning device 100 is connected to the manipulator 300, at least part of the collection pipeline can be provided in the gripper of the manipulator 300, or the collection pipeline can be provided on the gripper to simplify the structure. In addition, an exhaust regulating valve is provided in the collection pipeline, and the exhaust regulating valve is used to adjust the flow rate of the gas discharged from the second space 130e.

[0079] Figure 7 is a schematic diagram of the distribution of the second guide groove according to an embodiment of the present disclosure; Figure 7 The middle is a schematic diagram of the structure when looking at the third plate from bottom to top, and the arrows in the figure are used to indicate the flow direction of the gas.

[0080] Please refer to Figure 1 , Figure 6 and Figure 7 In some embodiments, the third plate 132 or the fourth plate 133 is provided with a plurality of second guide grooves 130d, and the plurality of second guide grooves 130d are radially distributed with the vertical center line of the clean device 100 as the center, and at least one second guide groove 130d is used to guide the gas entering the second space 130e to flow in a direction toward the vertical center line of the clean device 100.

[0081] The fourth plate 133 is provided with a second guide groove 130d, which extends downward from the upper surface of the fourth plate 133; wherein at least one second air hole 130a is located in the second guide groove 130d. Alternatively, the third plate 132 is provided with a second guide groove 130d, which extends upward from the lower surface of the third plate 132. Alternatively, the fourth plate 133 and the third plate 132 are respectively provided with the second guide groove 130d.

[0082] The second guide groove 130d is arranged corresponding to the bearing area 130b. For the second guide grooves 130d located on the same plate body, at least two second guide grooves 130d are connected to one end of the vertical center line of the cleaning device 100 to form a confluence channel. Exemplarily, two adjacent second guide grooves 130d have facing side walls, and the inner ends of the two facing side walls facing the vertical center line of the cleaning device 100 have a preset distance from the vertical center line of the cleaning device 100, and the inner ends of the two facing side walls are connected.

[0083] When the collection interface is close to the edge of the fourth plate 133, at least one of the second guide grooves 130d is used to guide the gas to the confluence channel, so that the gas flows from the confluence channel to the collection interface and is discharged to the outside of the cleaning device 100. In other examples, the collection interface can be arranged close to the confluence channel. The specific position of the collection interface can be set according to actual needs, so that the collection interface is connected to the collection pipeline, and the collection pipeline is prevented from affecting the layout or operation of other components.

[0084] In some examples, the width of a portion of the second guide groove 130d may be smaller than the width of another portion of the guide groove, so as to be applicable to scenarios where different areas of the workpiece 200 have different cleanliness requirements.

[0085] In some embodiments, in order to simplify the connection between the gas inlet 110 and the gas collecting member 130, the gas collecting member 130 is connected to the mounting portion 131, and the gas collecting member 130 is also provided with an electrode, which is used to generate an electric charge with opposite polarity to the corresponding position of the gas inlet 110, so as to fix the gas inlet 110 and the gas collecting member 130 by electrostatic adsorption force.

[0086] In some examples, the gas collecting member 130 has a connection surface for connecting with the gas inlet member 110, and the gas collecting member 130 may be embedded with an electrode, and the upper surface of the electrode is a part of the connection surface. Alternatively, the electrode may be in the form of a thin sheet, and the electrode is arranged in the area of ​​the gas collecting member 130 for connecting with the gas inlet member 110, so that the upper surface of the electrode serves as the connection surface.

[0087] In this way, after the workpiece 200 is placed in the bearing area 130b of the gas collecting member 130, the electrodes in the gas collecting member 130 can be controlled to be energized, so that the electrodes and the gas inlet member 110 generate charges of opposite polarity, thereby attracting the gas inlet member 110 to move toward the gas collecting member 130 through electrostatic adsorption force until the gas inlet member 110 is connected to the gas collecting member 130. When it is necessary to separate the gas collecting member 130 from the gas inlet member 110, the electrodes are controlled to be de-energized, and the gas collecting member 130 is taken away by the nearby manipulator 300 and placed in the temporary storage area.

[0088] In other examples, the driving mechanism is also used to drive the gas inlet member 110 to move toward the gas collecting member 130 until the gas inlet member 110 and the gas collecting member 130 are plugged into place. Taking the insertion of the gas inlet member 110 into the gas collecting member 130 as an example, one of the outer side surface of the gas inlet member 110 and the inner side surface of the gas collecting member 130 is provided with a guide groove, and the other is provided with a block, and the guide groove includes a vertical section and a horizontal section, the vertical section extends along the vertical direction of the clean device 100, and the horizontal section extends along the circumferential direction of the clean device 100; when the driving mechanism drives the gas inlet member 110 to move downward, the block slides in the vertical section, and after the gas inlet member 110 moves downward to the position, the driving mechanism drives the gas inlet member 110 to rotate, so that the block enters the horizontal section and slides a preset distance in the horizontal section. When it is necessary to separate the gas collecting member 130 from the gas inlet member 110, the driving mechanism drives the gas inlet member 110 to rotate in the opposite direction, so that the block enters the vertical section from the horizontal section, and then the driving mechanism drives the gas inlet member 110 to move upward.

[0089] Alternatively, one of the outer side surface of the gas inlet member 110 and the inner side surface of the gas collecting member 130 is provided with a clamping hole, and the other is provided with an elastic protrusion. When the gas inlet member 110 and the gas collecting member 130 are plugged into place, the elastic protrusion is clamped into the clamping hole, thereby reliably connecting the gas inlet member 110 and the gas collecting member 130. When it is necessary to separate the gas collecting member 130 from the gas inlet member 110, the driving mechanism overcomes the force of the elastic protrusion and drives the gas inlet member 110 to move upward.

[0090] This embodiment is applicable to wafer transmission scenarios, detection scenarios, positioning scenarios, and some scenarios with higher requirements on the cleanliness of the workpiece 200, and can meet the cleanliness requirements of the workpiece 200 within a small range. When a small range of workpieces 200 needs to be purged, there is no need to purge the interior of the entire process platform, which is conducive to saving gas resources and reducing process costs.

[0091] Please refer to Figure 8 , and continue to refer to Figures 1 to 7 The embodiment of the present disclosure further provides a transmission device, including a manipulator 300 and a cleaning device 100 in any of the above embodiments; wherein the manipulator 300 is connected to the mounting portion 131 in the cleaning device 100. Specifically, the wrist of the manipulator 300 is connected to the mounting portion 131 in the cleaning device 100.

[0092] Exemplarily, the manipulator 300 includes: a wrist and a gripper, the wrist and the gripper are connected, and the gripper is used to grab the workpiece 200. The mounting portion 131 can be connected to the wrist of the manipulator 300, the gas collection member 130 is connected to the mounting portion 131, and the gas collection member 130 is located below the gripper to prevent the cleaning device 100 from interfering with the gripping operation of the gripper.

[0093] During the transmission process, the manipulator 300 moves to the current position of the workpiece 200, the gripper of the manipulator 300 grabs the workpiece 200, and places the workpiece 200 on the gas collecting member 130; the gas inlet member 110 is docked with the gas collecting member 130 by using the electrostatic adsorption force, so that the workpiece 200 is located in the receiving space 100a; the gas is introduced into the receiving space 100a through the first air hole 110a, and the gas entering the receiving space 100a purges the workpiece 200, and the purged gas leaves the receiving space 100a through the second air hole 130a, so as to achieve the purge of the workpiece 200. After the workpiece 200 is transported to the target position, the electrostatic adsorption force is canceled, and the gas inlet member 110 is separated from the gas collecting member 130 by another manipulator 300 or other mechanism, and the workpiece 200 is placed in the corresponding position. It can be understood that the implementation of the transmission process is not limited to this, and this embodiment is only used as an example here.

[0094] Please refer to Fig. 9 , and continue to refer to Figures 1 to 7 The embodiment of the present disclosure further provides a detection device, including: a detection device 400 and a cleaning device 100 as in any of the aforementioned embodiments; wherein the detection device 400 is connected to the mounting portion 131 in the cleaning device 100 .

[0095] Exemplarily, the detection device 400 includes a calibration moving table 401 and a calibration platform 402 . The calibration moving table 401 is installed on the calibration platform 402 . The calibration moving table 401 is connected to the gas collecting component 130 via the mounting portion 131 . The gas collecting component 130 can be used as a supporting platform for supporting the workpiece 200 .

[0096] During the detection process, the workpiece 200 is placed on the gas collecting part 130 by using the manipulator 300; the gas inlet part 110 is docked with the gas collecting part 130 by using the electrostatic adsorption force, so that the workpiece 200 is located in the receiving space 100a; the gas is introduced into the receiving space 100a through the first air hole 110a, and the gas entering the receiving space 100a purges the workpiece 200, and the purged gas leaves the receiving space 100a through the second air hole 130a, so as to achieve the purge of the workpiece 200; the calibration motion table 401 is controlled to start working and the calibration platform 402 to perform the detection and calibration operation; after the calibration is completed, the electrostatic adsorption force is cancelled, and the gas inlet part 110 is separated from the gas collecting part 130 by using another manipulator 300 or other mechanism, and the workpiece 200 is taken away by the manipulator 300. It can be understood that the implementation of the detection process is not limited to this, and this embodiment is only used as an example here.

[0097] Please refer to Fig.10 and Fig.11 , and continue to refer to Figures 1 to 7The embodiment of the present disclosure further provides a process platform, including: a chamber, a manipulator 300, a detection device 400 and the clean device 100 in any of the above embodiments. At least one of the manipulator 300 and the detection device 400 is connected to the mounting portion 131 in the clean device 100.

[0098] In a possible implementation, the cleaning device 100 is connected to one of the manipulator 300 and the detection device 400. In some examples, the cleaning device 100 can be selectively connected to one of the manipulator 300 and the detection device 400. For example, when the workpiece 200 needs to be transported from the current location to another location, the cleaning device 100 is connected to the manipulator 300. When the workpiece 200 needs to be detected, the cleaning device 100 is connected to the detection device 400.

[0099] In another possible implementation, in order to improve the efficiency of the process platform, the clean device 100 has multiple. The manipulator 300 is connected to the mounting portion 131 in one of the clean devices 100, and the manipulator 300 is used to transfer the workpiece 200 contained in the clean device 100 from the current position to another position. For example, the manipulator 300 is used to transfer the workpiece 200 contained in the clean device 100 to the chamber, and the manipulator 300 is also used to transfer the workpiece 200 in the clean device 100 to the outside of the chamber. The detection device 400 is connected to the mounting portion 131 in another clean device 100, and the detection device 400 is used to detect the workpiece 200 contained in the clean device 100.

[0100] In some embodiments, the process platform also includes: a driving mechanism, which is connected to the gas inlet 110 in the cleaning device 100 to provide a driving force to the gas inlet 110, so that the gas inlet 110 can rotate under the action of the driving force, so that the area with a high air flow velocity in the gas inlet 110 corresponds to the area on the workpiece 200 with a high cleaning force requirement.

[0101] In some examples, in the scenario where the gas inlet member 110 needs to be driven to move vertically, the driving mechanism is also used to drive the gas inlet member 110 to move vertically. Exemplarily, the driving mechanism includes a first motor, and the first motor is used to drive the gas inlet member 110 to rotate. The driving mechanism also includes a second motor, a lead screw and a nut, and the second motor drives the nut to move vertically through the lead screw, and the nut is connected to the gas inlet member 110 to drive the gas inlet member 110 to move vertically; or, the driving mechanism may also include a linear motor, and the linear motor is connected to the gas inlet member 110 to drive the gas inlet member 110 to move vertically.

[0102] In addition, the process platform also includes: a body 500 and a first clean equipment, the first clean equipment is used to purge the workpiece 200 or space within a larger range, for example, to purge the internal space of the body 500. The first clean equipment includes: a first temperature adjustment module 507 and a first homogenization module 508. The body 500 is provided with a gas inlet 501, a gas processing area 502, a gas purge area 503, a gas recovery channel 504 and a gas outlet 505 from top to bottom, wherein the gas inlet 501 is used to supply gas to enter the body 500, the first temperature adjustment module 507 is arranged near the gas processing area 502, the first temperature adjustment module 507 is used to heat or cool the gas entering the gas processing area 502, the temperature-adjusted gas enters the gas purge area 503, and is homogenized by the first homogenization module 508, and the homogenized gas enters the chamber for purging; wherein the chamber may include at least one of the following: a transmission chamber, a reaction chamber, and a storage chamber 600. In addition, the first clean equipment may also include a module for adjusting the gas flow rate, a detection module for detecting the gas pressure, etc. The first clean equipment can evenly purge the space in the fuselage 500 at the required cleanliness, gas temperature or gas flow rate, thereby meeting the corresponding requirements.

[0103] The process platform also includes a second clean device, which is used to purge the workpiece 200 or space within a larger range, such as purging the workpiece 200 or space in the chamber. Taking the second clean equipment for purging the storage chamber 600 as an example, a storage rack 601 and a storage bottom plate 602 are provided in the chamber, the storage rack 601 is installed on the storage bottom plate 602, and the storage rack 601 is used to store the workpiece 200; the second clean equipment is installed on the storage bottom plate 602; the second clean equipment includes: a gas inlet pipeline 603, a second temperature adjustment module 604, a second homogenization module 605, a gas recovery module 606, a gas recovery pipeline 607, a gas intake pressure detection module 608, a gas intake switch 609, a gas intake adjustment module 610, and a gas recovery pressure detection module 611; the gas enters the second temperature adjustment module 604 through the gas inlet pipeline 603, the second temperature adjustment module 604 heats or cools the gas, and the temperature-adjusted gas enters the second homogenization module 605 for homogenization treatment, The homogenized gas is used to purge the workpieces 200 stored in the storage rack 601. The gas recovery module 606 is used to recover the gas used to purge the storage rack 601. The recovered gas enters the gas recovery pipeline 607 and is discharged to the outside of the storage chamber 600 through the gas discharge pipeline 612. The gas intake pressure detection module 608 is used to detect the pressure of the gas entering the storage chamber 600. When the gas intake switch 609 is in the on state, the gas can enter the area where the storage rack 601 is located. When the gas intake switch 609 is in the off state, the gas stops entering the area where the storage rack 601 is located. The gas intake adjustment module 610 is used to control the flow of the gas entering the area where the storage rack 601 is located. The gas recovery pressure detection module 611 is used to detect the pressure of the gas discharged from the storage chamber 600. The second clean equipment can evenly purge the storage chamber 600 with the required cleanliness, gas temperature or gas flow rate, thereby meeting the corresponding requirements.

[0104] It is understood that the specific structure and implementation process of the first clean equipment and the second clean equipment are not limited to this, and this embodiment is only used as an example. In addition, the unexplained parts of the process platform in this embodiment are known to those skilled in the art, and are not described here to reduce redundancy.

[0105] In the process platform of this embodiment, the first clean equipment is used to purge the workpiece 200 or space within a larger range such as the whole machine. The purge range of the second clean equipment can be equal to or smaller than the purge range of the first clean equipment, and the second clean equipment is used to purge the workpiece 200 in the chamber such as the storage chamber 600. The purge range of the clean device 100 can be smaller than the purge range of the second clean equipment. The clean device 100 can purge the workpiece 200 grasped by the manipulator 300, and the clean device 100 can also purge the workpiece 200 detected by the detection device 400. The clean device 100 can also purge the workpiece 200 with higher cleanliness requirements or the workpiece 200 in a smaller range.

[0106] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0107] In the description of the present disclosure, it is necessary to understand that the orientations or positional relationships indicated by terms such as “center”, “vertical”, “width”, “thickness”, “up”, “down”, “horizontal”, “inside”, “outside”, and “circumferential” are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present disclosure and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0108] In addition, the terms "first", "second", etc. used in the embodiments of the present disclosure are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features defined by the terms "first", "second", etc. in the embodiments of the present disclosure may explicitly or implicitly indicate that at least one of the features is included in the embodiment. In the description of the present disclosure, the word "multiple" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.

[0109] In the present disclosure, unless otherwise clearly specified or limited in the embodiments, the terms "installed", "connected", "connected" and "fixed" etc. appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or an integrated connection. It can be understood that it can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements, or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific implementation situation.

[0110] In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0111] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A cleaning device, comprising: The gas inlet member is provided with a first air hole for connecting with the air inlet pipeline; A gas collecting member is provided with a second gas hole for connecting with a collecting pipeline; Wherein, when the gas inlet member is in a state of being connected to the gas collecting member, the gas inlet member and the gas collecting member enclose a receiving space, and the receiving space is used to accommodate the workpiece; the receiving space is communicated with the first air hole and the second air hole respectively, so that the gas entering the receiving space from the first air hole can enter the gas collecting member from the second air hole after purging the workpiece, and be discharged to the outside of the cleaning device through the gas collecting member; At least one of the gas collecting member and the gas inlet member is provided with a mounting portion, and the mounting portion is used to fix the cleaning device at a preset mounting position; The gas inlet member comprises: a first plate body and a second plate body, the first plate body is located at a side of the second plate body away from the receiving space, the first plate body is connected to the second body to enclose a first space; the second plate body is provided with the first air hole, and the first air hole is connected to the first space; The first plate body or the second plate body is provided with a plurality of first guide grooves, and the plurality of first guide grooves are radially distributed with the vertical center line of the clean device as the center, and at least one first guide groove is used to guide the gas entering the first space to flow in a direction away from the vertical center line of the clean device.

2. The cleaning device according to claim 1, wherein: The surface of the gas collecting member facing the receiving space has a bearing area and a peripheral area, the bearing area is used to place the workpiece, and the peripheral area is located outside the bearing area away from the vertical center line of the cleaning device; the second air hole is located in the peripheral area; The surface of the gas inlet member facing the accommodating space has a first area corresponding to the bearing area, and the first air hole is located in the first area.

3. The cleaning device according to claim 1, wherein: The first guide groove comprises: a first type groove and a second type groove, wherein the width of the first type groove is smaller than the width of the second type groove; Wherein, the gas inlet member is used to rotate under the action of a driving force so that the second type of groove corresponds to a preset area of ​​the workpiece.

4. The cleaning device according to claim 1, wherein: The gas collecting member comprises: a third plate and a fourth plate, wherein the fourth plate is located on a side of the third plate away from the receiving space, and the fourth plate is connected to the third body to enclose a second space; the third plate is provided with the second air hole, and the second air hole is connected to the second space.

5. The cleaning device according to claim 4, wherein: The third plate body or the fourth plate body is provided with a plurality of second guide grooves, and the plurality of second guide grooves are radially distributed with the vertical center line of the clean device as the center, and at least one second guide groove is used to guide the gas entering the second space to flow in a direction toward the vertical center line of the clean device.

6. The cleaning device according to claim 1, wherein: When the gas inlet member is in a state of being connected to the gas collecting member, the gas inlet member is butted against the gas collecting member along the thickness direction of the workpiece.

7. The cleaning device according to claim 1, wherein: The gas collecting member is connected to the mounting portion and is further provided with an electrode for generating an electric charge with a polarity opposite to that of a corresponding position of the gas inlet member so as to fix the gas inlet member and the gas collecting member together through electrostatic adsorption force.

8. A transmission device comprising: A robot and a cleaning device as described in any one of claims 1 to 7; wherein the robot is connected to a mounting portion in the cleaning device.

9. A detection device comprising: A detection device and a cleaning device as described in any one of claims 1 to 7; wherein the detection device is connected to a mounting portion in the cleaning device.

10. A process platform comprising: A chamber, a manipulator, a detection device, and a clean device as described in any one of claims 1 to 7; wherein at least one of the manipulator and the detection device is connected to a mounting portion in the clean device.

11. The process platform according to claim 10, further comprising: A driving mechanism is connected to the gas inlet member in the cleaning device to provide a driving force to the gas inlet member so that the gas inlet member can rotate under the action of the driving force.

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