LED lamp bead for physiotherapy lamp

Abstract

The present invention discloses an LED lamp bead for a physiotherapy lamp, which belongs to the technical field of semiconductor electrical components. The LED lamp bead for a physiotherapy lamp includes a packaging structure and two light-emitting chips. The two light-emitting chips are connected in series with a negative electrode sheet and a positive electrode sheet through a gold wire. A lens is provided at the packaging structure corresponding to the light-emitting chip. A pin is built into the packaging structure. The negative electrode sheet, the positive electrode sheet and the pin are respectively provided with welding blocks fixedly connected to the gold wire and the light-emitting chip. The present invention provides pins and welding blocks. When the gold wire supplies power to the light-emitting chip, the light-emitting chip is mounted on the pins. The slit of the pins is located at the positive and negative electrodes of the light-emitting chip. The gold wire is clamped in the slit. A welding block is provided at the slit position. After the welding block is melted, it contacts the gold wire and the light-emitting chip. After the welding block is solidified, the light-emitting chip is riveted to the pin, thereby improving the mechanical strength and heat dissipation capacity of the welding point between the gold wire and the light-emitting chip.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor electrical components, and in particular relates to an LED lamp bead used for a physiotherapy lamp. Background Art

[0002] The physiotherapy lamp emits red light and far-infrared light mainly based on the therapeutic and rehabilitative effects of these two light waves on the human body. Red light can penetrate the surface of the skin, reach the dermis, stimulate blood circulation, and help improve local poor blood circulation. Far-infrared light can penetrate deeper tissues and produce a thermal effect. This heat can increase blood circulation and help relieve muscle tension and pain.

[0003] The core components of a therapy lamp are LED lamp beads that can emit red light and far-infrared light. These lamp beads are welded on a PCB board to provide power and light for therapy. Gold wires are directly welded on a light-emitting chip using a hot pressing process. The contact points are small, and high welding precision is required. In addition, solder cannot be coated on the light-emitting chip. The light-emitting chip that emits red light and far-infrared light generates a lot of heat. High operating temperatures and vibrations during use can easily cause virtual connections that cause the light-emitting chip to not work properly. In view of this, an LED lamp bead for a therapy lamp is provided. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the disadvantages of the above-mentioned prior art and provide an LED lamp bead for a physiotherapy lamp.

[0005] The technical solution adopted to solve the above technical problems is:

[0006] An LED lamp bead for a physiotherapy lamp, comprising a packaging structure and two light-emitting chips, wherein the two light-emitting chips are connected in series with a cathode sheet and a cathode sheet via a gold wire, a lens is provided at a position of the packaging structure corresponding to the light-emitting chip, a pin is built into the packaging structure, and welding blocks fixedly connected to the gold wire and the light-emitting chip are respectively provided on the cathode sheet, the cathode sheet and the pin;

[0007] The pins include a main frame 1 and a main frame 2, wherein the main frame 1 and the main frame 2 are respectively provided with slits at the positive and negative electrodes of the light-emitting chip, the negative electrode sheet and the positive electrode sheet are provided with slits at the positions of the gold wires, and the welding block is arranged at the slits;

[0008] A substrate is installed between the negative electrode sheet, the positive electrode sheet and the pins, and the substrate includes a main body, and an arc groove is opened at the main body corresponding to the welding block, and the top opening of the arc groove is arranged opposite to the slit;

[0009] The welding block includes a welding portion, a relay portion in the slit, and a riveting portion in the arc groove, and an extension portion is formed between the welding portion and the positive and negative electrodes of the light-emitting chip;

[0010] The circular plate is provided with a transparent sealing block at the light emitting chip, the top surface of the transparent sealing block protrudes away from the light emitting chip to form an arc surface, and the transparent sealing block fixes and wraps the light emitting chip, two welding blocks connected to the positive and negative electrodes of the light emitting chip, and the gold wires connected to the two welding blocks near the light emitting chip.

[0011] During assembly, a substrate is cast between the negative electrode sheet, the positive electrode sheet and the pins. The substrate can fix the negative electrode sheet, the positive electrode sheet and the pins into a whole, which is convenient for subsequent processing operations. The welding block is melted by heating at the welding station, and the light-emitting chip is mounted on the corresponding positions of the main frame 1 and the main frame 2. The molten solder is dripped on the slit position and a welding block is formed after cooling and solidification. The end of the gold wire is directly inserted into the slit by pressure. There is no need to weld the gold wire directly on the positive and negative electrodes of the light-emitting chip. It can be welded on the welding blocks around the positive and negative electrodes. The difficulty of welding positioning and welding pressure control can be reduced, the amount of solder used can be increased, and the welding firmness can be improved. After solidification, the relay part and the riveting part will weld the welding block It is firmly clamped in the slit position, and is shock-resistant and anti-falling during the curing process. The molten sealing material drips at the position of the light-emitting chip to form a transparent sealing block. After the sealing material is cured, the connection between the gold wire and the welding block is strengthened. The shape of the transparent sealing block can play a magnifying role, which is convenient for the detection of defects such as virtual connection and fracture at the welding position after welding. When in use, one of the two light-emitting chips generates red light and the other generates far-infrared light, which ensures the therapeutic effect of the surface and deep layers, and can reduce the power consumption of a single light-emitting chip. The two light-emitting chips can be installed in a larger range, and the heat of the dispersed lamp beads is transferred to the larger pins for dissipation, avoiding virtual connection of solder joints caused by excessive local temperature.

[0012] Furthermore, a circular plate is provided at the ends of the main frame one and the main frame two, and two slits are provided on the circular plate. The light-emitting chip is arranged at the center of the circular plate and is located on the same straight line with the two slits, and the gap between the two slits is equal to the size of the light-emitting chip.

[0013] Through the above technical solution, the circular plate has a partially horizontal surface and a center, and the regular shape facilitates the identification and positioning of the patch equipment during the patch operation of the light-emitting chip. During the welding process, the solidification of the welding part will guide the light-emitting chip for positioning welding through surface tension, thereby reducing the requirements for the precision of the light-emitting chip patch and improving the success rate of light-emitting chip welding.

[0014] Furthermore, the connection between the main frame 1 and the circular plate and the connection between the main frame 2 and the circular plate are both extended along the tangent of the circular plate, and the slit is opened through the middle of the circular plate.

[0015] Through the above technical solution, the circular plate is a perfect circle with a large diameter, which can disperse the heat at the light-emitting chip to a larger area of ​​the circular plate during welding and use, reduce the concentrated area of ​​thermal stress, and prevent stress deformation at the installation position of the light-emitting chip. Because the main frame one and the main frame two are smaller in size, there will be a smaller angle at the connection position with the circular plate. The sharp angle is prone to breakage due to stress, so the connection is widened and strengthened, and the angle transition is smoother, which effectively improves the structural strength of the connection.

[0016] Furthermore, the main frame one and the main frame two are arranged front to back, the negative electrode sheet and the positive electrode sheet are arranged front to back and are located on the same side of the main frame one and the main frame two, the slit is rectangular in shape, and the extension direction of the slit is consistent with the extension direction of the gold wire.

[0017] Through the above technical solution, main frame one and main frame two are arranged one after the other with a gap in the middle, which widens the gap between the two light-emitting chips and reduces the heat superposition effect when the light-emitting chips are working. The negative electrode and the positive electrode are located on the pins on the same side. The moving path span of the welding equipment is shorter when welding the gold wire, and the welding equipment moves back and forth within a shorter range to perform welding operations faster. The rectangular slit is consistent with the extension direction of the gold wire, preventing the gold wire from being unable to be stuck in the slit due to the large angle of the extension direction, thereby ensuring that the end of the strip of gold wire is more smoothly clamped with the inner wall of the slit.

[0018] Furthermore, the slit is in an I-shaped shape, and two spring pieces are formed in the middle of the circular plate. The two spring pieces are fixedly connected to the circular plate at one end away from each other, and the gap between the two spring pieces is smaller than the outer diameter of the gold wire, and the gap between the two spring pieces is parallel to the extension direction of the gold wire.

[0019] Through the above technical solution, two spring sheets can be formed by using an I-shaped slit, and only one side of the spring sheet is fixedly connected to the circular plate, and the other three sides of the spring sheet are suspended. When the gold wire is inserted into the gap between the spring sheets, although the gap between the two spring sheets is smaller than the outer diameter of the gold wire, the spring sheet will undergo elastic deformation so that the gold wire can be smoothly inserted. The elastic deformation of the spring sheet can clamp the gold wire more stably, preventing it from falling off due to vibration caused by conveying displacement and other actions of the equipment when the gold wire and the welding block are cooled, and the welding is more firm.

[0020] Furthermore, a connecting frame is installed on the circular plate located on the opposite side of the light-emitting chip, and a sub-frame one is fixedly installed on the circular plate fixed to the main frame one through the connecting frame, and a sub-frame two is fixedly installed on the circular plate fixed to the main frame two through the connecting frame, and the ends of the main frame one, main frame two, sub-frame one and sub-frame two are folded and bent to form contact pieces, and the contact pieces are located outside the packaging structure.

[0021] Through the above technical solution, the connecting frame is a good strip-shaped thermal conductor, which can transfer the heat absorbed by the main frame one and the main frame two to the auxiliary frame one and the auxiliary frame two positions, and the contact piece can contact the PCB board, and the contact area with the PCB board is larger, so the heat can be dispersed to the PCB board position more quickly, and the light-emitting chip can be efficiently dissipated during use.

[0022] Furthermore, the main body is provided with limit pins at the center line of the negative electrode sheet, the center line of the positive electrode sheet, the center line of the sub-frame one and the center line of the sub-frame two, and the negative electrode sheet, the positive electrode sheet, the sub-frame one and the sub-frame two are provided with through holes that cooperate with the limit pins. The main body is provided with limit plates at the vertical side walls of the main frame one and the main frame two, and the main body is formed with a accommodating groove at the corresponding connecting frame.

[0023] Through the above technical scheme, after the main body is cast and solidified, a protruding limit pin will be formed in the through hole, and a limit plate will be formed on both sides of the main frame one and the main frame two, and a receiving groove for wrapping the connecting frame will be formed at the connecting frame position, so that the main body and the negative electrode sheet, the positive electrode sheet and the pin form a fixed whole, and there will be no relative displacement in the subsequent processing, which can avoid the position deviation between the welding blocks, resulting in virtual connection or even breakage at the welding position, thereby improving the stability of welding.

[0024] Furthermore, the connecting frame includes a reinforcement member, which is fixedly connected to the circular plate. Two extension plates are fixedly mounted on the reinforcement member, and the two extension plates are fixedly connected to the sub-frame one and the sub-frame two respectively.

[0025] Through the above technical solution, the design of the reinforcement can form a supporting structure between the two extension plates at the position of the circular plate, so as to ensure that the circular plate is supported during patching and welding to avoid deformation. In addition, the reinforcement has a large contact area with the circular plate, and with the two extension plates, the heat at the center of the circular plate can be quickly transferred to the sub-frame one and sub-frame two positions for dissipation, thereby improving the heat dissipation effect.

[0026] Furthermore, the reinforcement member adopts an I-shaped structure, and a horizontal gap is provided in the middle of the reinforcement member to form a buckle groove.

[0027] Through the above technical solution, the I-shaped structure of the reinforcement can be supported at the center position of the light-emitting chip and the positive and negative poles of the light-emitting chip, and can provide targeted support for the stress-bearing position, and form a buckle groove in the middle of the reinforcement. After the main body is cast and solidified, it will penetrate the reinforcement at the buckle groove position to form support, thereby further improving the position stability of the reinforcement.

[0028] Furthermore, the reinforcement adopts a truncated cone shape, a through hole is provided in the middle of the reinforcement, the reinforcement is fixedly connected to the end face of the circular plate at the smallest outer diameter, the reinforcement gradually increases as it moves away from the outer diameter of the circular plate, and a buckle groove is formed between the outer wall of the reinforcement and the end face of the circular plate.

[0029] Through the above technical solution, in order to adapt to the requirements of long-term use, the heat accumulation at the position of the light-emitting chip is serious, and more efficient heat dissipation is required. At this time, a truncated cone-shaped reinforcement is used to increase the contact area and conductor volume, so that the heat can be transferred to the sub-frame one and sub-frame two positions more quickly and dissipated. In addition, the buckle groove shape makes the main body and the reinforcement clamped to each other, and the annular structure can ensure the stable position of the reinforcement.

[0030] The beneficial effects of the present invention are as follows:

[0031] The present invention provides pins and welding blocks. When the gold wire supplies power to the light-emitting chip, the light-emitting chip is mounted on the pins. The slits of the pins are located at the positive and negative electrodes of the light-emitting chip. The gold wire is clamped in the slits. A welding block is provided at the slit position. After the welding block is melted, it contacts the gold wire and the light-emitting chip. After the welding block is solidified, the light-emitting chip is riveted to the pins, thereby improving the mechanical strength and heat dissipation capacity of the welding point between the gold wire and the light-emitting chip.

[0032] The present invention improves the structure of the pin. The pin does not have the ability to conduct electricity, but can directly contact the PCB when the lamp bead is welded on the PCB. The pin has a plurality of dispersed contact pieces, which can conduct the heat inside the lamp bead to the position of the PCB for dissipation. The pin is provided with a connecting frame to structurally strengthen the welding position of the light-emitting chip, prevent the pin from being deformed when welding the gold wire and the light-emitting chip, ensure the flatness of the pin, and prevent the component from falling off or being poorly connected.

[0033] The present invention arranges a transparent sealing block, the refractive index of which is between that of the lens and the light-emitting chip, so that light can be emitted from the light-emitting chip more smoothly, and the heat caused by total reflection is reduced. The arc surface allows the light to be diverged through the lens to a larger range, thereby improving the light coverage and uniformity of the therapy lamp. The arc surface is used to magnify the details of the welding position, which facilitates the detection of defects such as virtual joints and fractures at the welding position after welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is the overall structural diagram of the present invention;

[0035] Figure 2 It is a schematic diagram of the structure of the present invention when the packaging structure is removed;

[0036] Figure 3 It is a schematic diagram of the positions of the positive electrode sheet, the negative electrode sheet, the light-emitting chip, the welding block and the pins of the present invention;

[0037] Figure 4 It is a schematic diagram of a normal state of one of the pins of the present invention;

[0038] Figure 5It is a schematic diagram of an inverted state of one of the pins of the present invention;

[0039] Figure 6 is a schematic structural diagram of a substrate of the present invention;

[0040] Figure 7 It is a schematic diagram of another pin of the present invention in a normal state;

[0041] Figure 8 It is a schematic diagram of the structure between the light-emitting chip, the welding block and the gold wire of the present invention;

[0042] Fig. 9 is a schematic cross-sectional view of the present invention located at the light emitting chip;

[0043] Fig.10 It is a schematic diagram of the inverted state of another pin of the present invention.

[0044] Figure numerals: 1. packaging structure; 11. lens; 2. negative electrode sheet; 3. pin; 31. main frame one; 32. main frame two; 33. sub-frame two; 34. sub-frame one; 35. through hole; 36. connecting frame; 361. extension plate; 362. reinforcement; 363. buckle groove; 37. circular plate; 38. slit; 39. spring; 4. positive electrode sheet; 5. substrate; 51. main body; 52. limit pin; 53. limit plate; 54. accommodating groove; 55. arc groove; 6. welding block; 61. welding part; 62. relay part; 63. riveting part; 64. extension part; 7. gold wire; 8. transparent sealing block; 9. light-emitting chip; 10. contact sheet. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0046] like Figure 1-Figure 10 As shown, this embodiment provides an LED lamp bead for a physiotherapy lamp, including a packaging structure 1 and two light-emitting chips 9. The packaging structure 1 is made of insulating plastic material for insulation protection. Fig. 9 The packaging structure 1 is provided with a lens 11 at the position corresponding to the light emitting chip 9 to ensure that the light emitting chip 9 emits light smoothly, wherein, with reference to Figure 3 , two light-emitting chips 9 are connected in series with the negative electrode sheet 2 and the positive electrode sheet 4 through a gold wire 7 to power the light-emitting chips 9. One of the two light-emitting chips 9 generates red light and the other generates far-infrared light. While meeting the needs of the physiotherapy equipment, the light-emitting power of a single light-emitting chip 9 can be reduced, thereby controlling the heat generation of a single light-emitting chip 9;

[0047] It should be emphasized that the lamp beads of the existing physiotherapy lamp need to emit red light and far-infrared light. The lamp beads that emit light of this wavelength will generate a lot of heat. Long-term operation will cause the lamp beads to be in a high-temperature state. The gold wire 7 of the lamp bead is directly welded to the positive and negative positions of the light-emitting chip 9. The contact point is small and cannot be coated with solder. Due to the high working temperature and vibration of the red light lamp bead and the far-infrared light lamp bead during use, virtual connection is easily generated. Therefore, the structure of the welding point between the gold wire 7 and the light-emitting chip 9 is improved. Figure 2 and Figure 3 , the packaging structure 1 has a built-in pin 3, and the pin 3 provides an installation position for the light-emitting chip 9, and the negative electrode sheet 2, the positive electrode sheet 4 and the pin 3 are respectively provided with a welding block 6 fixedly connected to the gold wire 7 and the light-emitting chip 9, and the welding block 6 is placed at the positive and negative electrode positions of the light-emitting chip 9 by a spot coating process, and is used to fix the gold wire 7 and the light-emitting chip 9 after melting. The welding block 6 is not set on the top surface of the light-emitting chip 9, but is arranged near the positive and negative electrodes of the light-emitting chip 9, and the coverage area can be set larger. When welding the gold wire 7 and the light-emitting chip 9, the positioning difficulty and welding difficulty are reduced, and the welding block 6 uses silver solder with an internal silver content of more than 96%, which can provide a connection with higher strength and heat resistance. The light-emitting chip 9 will not melt and fall off after working for a long time, and can also increase the heat conduction between the light-emitting chip 9 and the pin 3, quickly disperse the heat at the light-emitting chip 9 to the pin 3, and reduce the temperature at the light-emitting chip 9;

[0048] For pin 3, refer to Figure 3 The pin 3 includes a main frame 1 31 and a main frame 2 32. The main frame 1 31 and the main frame 2 32 are made of heat-conducting insulating material or coated with an insulating layer on the surface to prevent the light-emitting chip 9 from short-circuiting itself. Figure 4 , main frame 1 31 and main frame 2 32 are respectively provided with slits 38 at the positive and negative electrodes of the light-emitting chip 9, and at the same time, the negative electrode sheet 2 and the positive electrode sheet 4 are provided with slits 38 (not shown in the figure) at the positions of the gold wire 7, and the slits 38 can act as a cursor, which is convenient for the visual module of the patch equipment to perform mounting positioning when the light-emitting chip 9 is mounted, and the gold wire 7 can be pressed into the slit 38 and clamped, and the friction force between the pin 3 and the gold wire 7 is used to improve the installation stability of the gold wire 7, and the welding block 6 is set at the slit 38, and the slit 38 can improve the roughness of the connection between the welding block 6 and the pin 3, and the connection is more firm, and the welding block 6 is used to increase the installation firmness of the light-emitting chip 9;

[0049] Regarding the substrate 5, refer to Figure 2 A substrate 5 is installed between the negative electrode sheet 2, the positive electrode sheet 4 and the pin 3. The substrate 5 serves as a connector to connect the negative electrode sheet 2, the positive electrode sheet 4 and the pin 3 into a whole. Figure 6The substrate 5 includes a main body 51, and an arc groove 55 is opened at the main body 51 corresponding to the welding block 6. The arc groove 55 opens upward, and the top opening of the arc groove 55 is arranged opposite to the slit 38. The opening size of the arc groove 55 is larger than the size of the slit 38, and the slit 38 is covered, so that the molten welding block 6 can enter the arc groove 55;

[0050] Regarding the welding block 6, the welding block 6 is a hard solder. Figure 8 and Fig. 9 The welding block 6 includes a welding portion 61, which can be heated and melted to facilitate welding of the gold wire 7 and the light-emitting chip 9. The portion of the welding block 6 in the slit 38 forms a relay portion 62. At the same time, the portion of the welding block 6 in the arc groove 55 forms a riveting portion 63. After the welding block 6 is solidified, it can be riveted to the slit 38 of the pin 3 to improve the installation firmness of the welding block 6, and wrap the end of the gold wire 7 for a distance to improve the installation firmness of the gold wire 7. The heat of the gold wire 7 can also be transferred to the position of the pin 3. At the same time, the welding portion 61 has fluidity in a molten state, and will contact and diffuse with the outer walls of the positive and negative electrodes of the light-emitting chip 9. After solidification, an extension portion 64 can be formed to increase the effective contact area between the pin 3 and the light-emitting chip 9, and the light-emitting chip 9 can be stably riveted to the pin 3;

[0051] Regarding the transparent sealing block 8, refer to Figure 2 and Fig. 9 The circular plate 37 is provided with a transparent sealing block 8 at the light emitting chip 9. The transparent sealing block 8 is made of transparent plastic material with high light transmittance and low light refractive index. The top surface of the transparent sealing block 8 protrudes away from the light emitting chip 9 to form an arc surface. The low light refractive index makes the total reflectivity of the contact position between the transparent sealing block 8 and the light emitting chip 9 low, so that the light inside the light emitting chip 9 can be emitted more smoothly. The refractive index of the lens 11 is close to that of the transparent sealing block 8. In addition, the arc surface allows the light to be diverged through the lens 11 to a larger range, thereby improving the light coverage range of the physiotherapy lamp. Surrounding, two light-emitting chips 9 are each provided with a transparent sealing block 8, which can disperse the emission of red light and far-infrared light to ensure the uniformity of the divergence of the two light rays. At the same time, the transparent sealing block 8 fixes and wraps the light-emitting chip 9, two welding blocks 6 connected to the positive and negative electrodes of the light-emitting chip 9, and the gold wire 7 connected to the two welding blocks 6 near the light-emitting chip 9, which can further improve the firmness of the welding position between the gold wire 7 and the light-emitting chip 9, and can also use the arc surface to magnify the details of the welding position between the gold wire 7 and the light-emitting chip 9, so as to facilitate the detection of defects such as virtual connection and fracture at the welding position after welding.

[0052] In a further embodiment, in order to improve the thermal stress stability of the pin 3, the structure of the pin 3 connecting the light emitting chip 9 is optimized, referring to Figure 3The ends of the main frame 1 31 and the main frame 2 32 are both provided with a circular plate 37. The circular plate 37 has a local horizontal surface and a center. The regular shape facilitates the identification and positioning of the patch equipment during the patch operation of the light-emitting chip 9. At the same time, during the welding process, the solidification of the welding part 61 will guide the light-emitting chip 9 to perform positioning welding through the surface tension, reduce the requirements for the patch accuracy of the light-emitting chip 9, and improve the success rate of the welding of the light-emitting chip 9. Figure 4 There are two slits 38 on the circular plate 37, the light emitting chip 9 is arranged at the center of the circular plate 37 and is located on the same straight line with the two slits 38, the gap between the two slits 38 is equal to the size of the light emitting chip 9, when the welding block 6 melts, the welding part 61 contacts the positive and negative electrodes of the light emitting chip 9, and when the welding part 61 solidifies, the surface tension is used to guide the light emitting chip 9 to complete the center welding, thereby ensuring the center welding of the light emitting chip 9 and compensating the chip mounting error of the light emitting chip 9.

[0053] In a further embodiment, since the connection with the light emitting chip 9 needs to withstand a large temperature difference, the corresponding position of the pin 3 is structurally strengthened, referring to Figure 4 The connection between the main frame 1 31 and the circular plate 37 and the connection between the main frame 2 32 and the circular plate 37 are both extended along the tangent transition of the circular plate 37. The circular plate 37 is a large-diameter perfect circle. The main frame 1 31 and the main frame 2 32 are small in size. This design can disperse the heat at the light-emitting chip 9 to the circular plate 37 with a larger area during welding and use, reduce the concentrated area of ​​thermal stress, and prevent stress deformation at the installation position of the light-emitting chip 9. At the same time, the main frame 1 31 and the main frame 2 32 are directly connected to the circular plate 37, and there will be a smaller angle. The sharp angle position is prone to fracture due to stress, so the connection is widened and strengthened, and the angle transition is smoother, which effectively improves the structural strength of the connection. The slit 38 is opened through the middle of the circular plate 37. The design close to the middle can transfer the high heat in the center to the surrounding areas, and the heat dissipation efficiency is good.

[0054] In a further embodiment, targeted improvements are made to the specific structure of the pin 3 to reduce the difficulty of the welding operation and increase the welding firmness of the gold wire 7. Figure 3 , the main frame 1 31 and the main frame 2 32 are arranged front to back, the main frame 1 31 and the main frame 2 32 are arranged one before the other, with a gap in the middle, the gap between the two light-emitting chips 9 is opened, and the heat superposition effect of the light-emitting chips 9 is reduced when the light-emitting chips 9 are working. At the same time, the negative electrode sheet 2 and the positive electrode sheet 4 are arranged front to back and are located on the same side of the main frame 1 31 and the main frame 2 32. The negative electrode sheet 2 and the positive electrode sheet 4 are located on the same side of the pin 3. When the gold wire 7 is welded, the moving path span of the welding equipment is shorter, and the welding equipment moves back and forth in a shorter range to perform welding operations faster. It should be emphasized that, with reference to Figure 4The slit 38 is rectangular in shape, and the extension direction of the slit 38 is consistent with the extension direction of the gold wire 7, so as to prevent the gold wire 7 from being unable to be inserted into the slit 38 due to a large angle in the extension direction, and ensure that the end of the strip-shaped gold wire 7 is more smoothly clamped with the inner wall of the slit 38.

[0055] In a further embodiment, during the welding of the gold wire 7, the welding block 6 needs time to cool down. In order to prevent the gold wire 7 from rebounding and falling off due to its own bending stress during the solidification process, Figure 7 The slit 38 adopts an I-shaped shape, and the slit 38 forms two spring pieces 39 in the middle of the circular plate 37. Only one side of the spring piece 39 is fixedly connected to the circular plate 37, and the two spring pieces 39 are fixedly connected to the circular plate 37 at one end away from each other. Therefore, the other three sides of the spring piece 39 are suspended in the air and can be bent and deformed to a large extent. At this time, the gap between the two spring pieces 39 is smaller than the outer diameter of the gold wire 7. When the gold wire 7 is inserted into the gap between the spring pieces 39, the gap between the two spring pieces 39 is parallel to the extension direction of the gold wire 7. The spring piece 39 will undergo elastic deformation so that the gold wire 7 can be smoothly inserted. The gold wire 7 can be clamped more stably through the elastic deformation of the spring piece 39 to prevent it from falling off due to vibration caused by conveying displacement and other actions of the equipment when the gold wire 7 and the welding block 6 are cooled, and the welding is more firm.

[0056] In a further embodiment, in order to efficiently dissipate heat from the light emitting chip 9, refer to Figure 4 and Figure 5 The circular plate 37 is located on the opposite side of the light-emitting chip 9 and is installed with a connecting frame 36. The connecting frame 36 is a strip-shaped good heat conductor. The circular plate 37 fixed to the main frame 1 31 is fixedly installed with a sub-frame 1 34 through the connecting frame 36, and the circular plate 37 fixed to the main frame 2 32 is fixedly installed with a sub-frame 2 33 through the connecting frame 36. The heat absorbed by the main frame 1 31 and the main frame 2 32 can be transferred to the positions of the sub-frame 1 34 and the sub-frame 2 33, and the heat can be dispersed to different positions and simultaneously dissipated from multiple positions on the front and back sides. At the same time, the ends of the main frame 1 31, the main frame 2 32, the sub-frame 1 34 and the sub-frame 2 33 are folded and bent to form a contact sheet 10. The contact sheet 10 is located outside the packaging structure 1, and the contact sheet 10 can contact the PCB board. The contact area with the PCB board is larger, and the heat can be dispersed to the PCB board position more quickly, further performing efficient heat dissipation on the light-emitting chip 9.

[0057] In a further embodiment, in order to ensure the relative position stability of the negative electrode sheet 2, the positive electrode sheet 4 and the pin 3 when welding the gold wire 7 and the light-emitting chip 9, the structure is optimized, referring to Figure 3 and Figure 6The main body 51 is provided with a limit pin 52 at the center line of the negative electrode sheet 2, the center line of the positive electrode sheet 4, the center line of the sub-frame 1 34 and the center line of the sub-frame 2 33. The negative electrode sheet 2, the positive electrode sheet 4, the sub-frame 1 34 and the sub-frame 2 33 are provided with a through hole 35 that cooperates with the limit pin 52. After the main body 51 is cast and solidified, a protruding limit pin 52 will be formed in the through hole 35 to fix the position of the negative electrode sheet 2, the positive electrode sheet 4 and the right part of the pin 3. At the same time, the main body 51 is provided with a limit plate 53 at the vertical side wall of the main frame 1 31 and the main frame 2 32, so that the main body 51 and the negative electrode The sheet 2, the positive electrode sheet 4 and the pin 3 form a fixed whole, and there will be no relative displacement in the subsequent processing, which can avoid the position deviation between the welding blocks 6, resulting in a virtual connection or even a break in the welding position, thereby improving the stability of welding. It should be noted that a receiving groove 54 is formed at the main body 51 corresponding to the connecting frame 36, and a receiving groove 54 is formed at the position of the connecting frame 36 to wrap the connecting frame 36. The position stability of the main frame 1 31 and the main frame 2 32 can be improved by embedding the connecting frame 36 and the main body 51, thereby ensuring the stability of the position of the light-emitting chip 9.

[0058] In a further embodiment, a specific configuration of the connecting frame 36 is disclosed, referring to Figure 5 The connecting frame 36 includes a reinforcement member 362, which is fixedly connected to the circular plate 37. The design of the reinforcement member 362 can form a supporting structure between the two extension plates 361 at the position of the circular plate 37 to ensure that the circular plate 37 is supported during patching and welding to avoid deformation. At the same time, two extension plates 361 are fixedly installed on the reinforcement member 362, and the two extension plates 361 are respectively fixedly connected to the sub-frame 1 34 and the sub-frame 2 33. The reinforcement member 362 has a large contact area with the circular plate 37. With the two extension plates 361, the heat at the center of the circular plate 37 can be quickly transferred to the sub-frame 1 34 and the sub-frame 2 33 for dissipation, thereby improving the heat dissipation effect.

[0059] In a further embodiment, the welding position of the light emitting chip 9 is supported to prevent deformation, and the connecting frame 36 is optimized in a targeted manner. Figure 5 The reinforcement member 362 adopts an I-shaped structure. The I-shaped structure of the reinforcement member 362 can support the center position of the light-emitting chip 9 and the positive and negative poles of the light-emitting chip 9, and can provide targeted support for the force-bearing position. At the same time, the middle part of the reinforcement member 362 has a horizontal gap to form a buckle groove 363. After the main body 51 is cast and solidified, it will penetrate the reinforcement member 362 at the buckle groove 363 to form a support, thereby further improving the position stability of the reinforcement member 362.

[0060] In a further embodiment, another type of connecting frame 36 is disclosed, which is used for high-power and high-heat lamp beads. Fig.10The reinforcement 362 adopts a truncated cone shape. The truncated cone shape reinforcement 362 can increase the contact area and the conductor volume, so that the heat can be transferred to the sub-frame 1 34 and the sub-frame 2 33 positions more quickly and dissipated, which can meet the requirements of long-term use. The heat accumulation at the position of the light-emitting chip 9 is serious, and more efficient heat dissipation is required. At the same time, a through hole is provided in the middle of the reinforcement 362, and the reinforcement 362 is fixedly connected to the end face of the circular plate 37 at the smallest outer diameter. The outer diameter of the reinforcement 362 gradually increases as it moves away from the circular plate 37. A buckle groove 363 is formed between the outer wall of the reinforcement 362 and the end face of the circular plate 37. The shape of the buckle groove 363 makes the main body 51 and the reinforcement 362 clamped to each other, and the annular structure can ensure the stability of the position of the reinforcement 362.

[0061] The working principle of this embodiment is as follows:

[0062] During assembly, a substrate 5 is cast between the negative electrode sheet 2, the positive electrode sheet 4 and the pin 3. The substrate 5 can fix the negative electrode sheet 2, the positive electrode sheet 4 and the pin 3 into a whole, which is convenient for subsequent processing operations. The welding block 6 is melted by heating at the welding station, and the light-emitting chip 9 is mounted on the corresponding positions of the main frame 1 31 and the main frame 2 32. The molten solder is dripped on the slit 38 and the welding block 6 is formed after cooling and solidification. The end of the gold wire 7 is directly inserted into the slit 38 by pressure, and the welding block 6 is firmly clamped at the slit 38. The welding block 6 is shock-resistant and prevents falling off during the solidification process;

[0063] At the same time, it is not necessary to directly weld the gold wire 7 to the positive and negative electrodes of the light-emitting chip 9, but it is sufficient to weld it to the welding blocks 6 around the positive and negative electrodes, which can reduce the difficulty of welding positioning and welding pressure control, increase the amount of solder used, and improve the welding firmness;

[0064] After the welding block 6 is solidified, the relay part 62 and the riveting part 63 rivet the light-emitting chip 9 at the position of the slit 38, and then the molten sealing material is dripped to form a transparent sealing block 8. After the sealing material is solidified, the connection between the gold wire 7 and the welding block 6 is strengthened. The arc surface allows the light to be dispersed through the lens 11 to a larger range, thereby improving the light coverage of the physiotherapy lamp. At the same time, the shape of the transparent sealing block 8 can play a magnifying role, which is convenient for the detection of defects such as virtual connection and fracture at the welding position after welding;

[0065] When in use, one of the two light-emitting chips 9 generates red light and the other generates far-infrared light, which ensures the therapeutic effects on the surface and deep layers, and can reduce the power consumption of a single light-emitting chip 9. The two light-emitting chips 9 can be installed in a dispersed manner in a larger range, and the heat generated by the dispersed lamp beads is transferred to the larger pins 3 for dissipation. The main frame 1 31 and the main frame 2 32 of the pins 3 are directly connected to the light-emitting chip 9, and the heat of the main frame 1 31 and the main frame 2 32 is transferred to the sub-frame 1 34 and the sub-frame 2 33 through the connecting frame 36. The main frame 1 31 and the main frame 2 32 as well as the sub-frame 1 34 and the sub-frame 2 33 are made of insulating thermal conductive materials such as ceramics, and the large-volume multi-contact pins 3 can be used to quickly transfer the heat of the light-emitting chip 9 to different positions of the PCB board to avoid long-term operation due to excessive local temperature resulting in virtual connection of the solder joints of the light-emitting chip 9.

[0066] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention.

Claims

1. An LED lamp bead for a physiotherapy lamp, comprising a packaging structure (1) and two light-emitting chips (9), wherein the two light-emitting chips (9) are connected in series with a negative electrode sheet (2) and a positive electrode sheet (4) via a gold wire (7), and a lens (11) is provided at a position of the packaging structure (1) corresponding to the light-emitting chips (9), characterized in that: The packaging structure (1) has a built-in pin (3), and the negative electrode sheet (2), the positive electrode sheet (4) and the pin (3) are respectively provided with a welding block (6) fixedly connected to the gold wire (7) and the light-emitting chip (9); The pin (3) comprises a main frame 1 (31) and a main frame 2 (32), wherein the main frame 1 (31) and the main frame 2 (32) are respectively provided with slits (38) at the positive and negative electrodes corresponding to the light-emitting chip (9), the negative electrode sheet (2) and the positive electrode sheet (4) are provided with slits (38) at the positions corresponding to the gold wires (7), and the welding block (6) is arranged at the slits (38); A substrate (5) is installed between the negative electrode sheet (2), the positive electrode sheet (4) and the pin (3), the substrate (5) comprising a main body (51), an arc groove (55) being provided on the main body (51) at a position corresponding to the welding block (6), and a top opening of the arc groove (55) being arranged opposite to the slit (38); The welding block (6) comprises a welding portion (61), a relay portion (62) located in the slit (38), and a riveting portion (63) located in the arc groove (55); when the welding portion (61) is melted, an extension portion (64) is formed between the welding portion (61) and the positive and negative electrodes of the light-emitting chip (9); The circular plate (37) is provided with a transparent sealing block (8) located at the light-emitting chip (9), the top surface of the transparent sealing block (8) protruding in a direction away from the light-emitting chip (9) to form an arc-shaped surface, and the transparent sealing block (8) fixes and wraps the light-emitting chip (9), two welding blocks (6) connected to the positive and negative electrodes of the light-emitting chip (9), and the gold wires (7) connected to the two welding blocks (6) near the light-emitting chip (9); The ends of the main frame 1 (31) and the main frame 2 (32) are both provided with a circular plate (37), the circular plate (37) is provided with two slits (38), the light-emitting chip (9) is arranged at the center of the circular plate (37) and is located on the same straight line as the two slits (38), and the gap between the two slits (38) is equal to the size of the light-emitting chip (9); The connection between the main frame 1 (31) and the circular plate (37) and the connection between the main frame 2 (32) and the circular plate (37) are both extended along the tangent transition of the circular plate (37), and the slit (38) is opened through the middle of the circular plate (37), and the extension direction of the slit (38) is consistent with the extension direction of the gold wire (7).

2. The LED lamp bead for a physiotherapy lamp according to claim 1, characterized in that: The main frame one (31) and the main frame two (32) are arranged front to back, the negative electrode sheet (2) and the positive electrode sheet (4) are arranged front to back and are located on the same side of the main frame one (31) and the main frame two (32), and the slit (38) is rectangular in shape.

3. The LED lamp bead for a physiotherapy lamp according to claim 1, characterized in that: The slit (38) is of an I-shaped design. The slit (38) forms two spring sheets (39) in the middle of the circular plate (37). The two spring sheets (39) are fixedly connected to the circular plate (37) at one end away from each other. The gap between the two spring sheets (39) is smaller than the outer diameter of the gold wire (7). The gap between the two spring sheets (39) is parallel to the extension direction of the gold wire (7).

4. The LED lamp bead for a physiotherapy lamp according to claim 1, characterized in that: The circular plate (37) is located on the opposite side of the light-emitting chip (9) and is installed with a connecting frame (36); the circular plate (37) fixed to the main frame one (31) is fixedly installed with a sub-frame one (34) via the connecting frame (36); the circular plate (37) fixed to the main frame two (32) is fixedly installed with a sub-frame two (33) via the connecting frame (36); the ends of the main frame one (31), the main frame two (32), the sub-frame one (34) and the sub-frame two (33) are folded and bent to form a contact sheet (10); the contact sheet (10) is located outside the packaging structure (1).

5. The LED lamp bead for a physiotherapy lamp according to claim 4, characterized in that: The main body (51) is provided with a limit pin (52) at the center line of the negative electrode sheet (2), the center line of the positive electrode sheet (4), the center line of the auxiliary frame one (34) and the center line of the auxiliary frame two (33); the negative electrode sheet (2), the positive electrode sheet (4), the auxiliary frame one (34) and the auxiliary frame two (33) are provided with a through hole (35) that cooperates with the limit pin (52); the main body (51) is provided with a limit plate (53) at the vertical side wall of the main frame one (31) and the main frame two (32); and the main body (51) is formed with a receiving groove (54) at the location corresponding to the connecting frame (36).

6. The LED lamp bead for a physiotherapy lamp according to claim 5, characterized in that: The connecting frame (36) comprises a reinforcing member (362), the reinforcing member (362) being fixedly connected to the circular plate (37), two extension plates (361) being fixedly mounted on the reinforcing member (362), and the two extension plates (361) being fixedly connected to the sub-frame one (34) and the sub-frame two (33), respectively.

7. The LED lamp bead for a physiotherapy lamp according to claim 6, characterized in that: The reinforcing member (362) adopts an I-shaped structure, and a horizontal gap is provided in the middle of the reinforcing member (362) to form a buckle groove (363).

8. The LED lamp bead for a physiotherapy lamp according to claim 6, characterized in that: The reinforcing member (362) is truncated in shape, a through hole is provided in the middle of the reinforcing member (362), the part with the smallest outer diameter of the reinforcing member (362) is fixedly connected to the end face of the circular plate (37), the outer diameter of the reinforcing member (362) gradually increases as it moves away from the circular plate (37), and a buckle groove (363) is formed between the outer wall of the reinforcing member (362) and the end face of the circular plate (37).

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