A high-strength PCB circuit board production and processing equipment and method

Abstract

The present invention relates to a high-strength PCB circuit board production and processing equipment and method, including a feeding mechanism, a carrying mechanism, a filling mechanism and a drilling mechanism arranged on a frame, the filling mechanism including a winding assembly arranged on the frame and used to release a sheet, a dispensing assembly arranged on the winding assembly and used to intermittently apply rows of glue dots on a single surface of the sheet, a pressing assembly arranged on the winding assembly and used to press the glue dots on the sheet to different heights, and a reinforcement assembly arranged on the frame; the present invention can fill wavy sheets between two layers of substrates to form a circuit board, thereby improving the strength of the circuit board, reducing the probability of the circuit board being broken, and increasing the seismic resistance of the circuit board, reducing the vibration to which the circuit board is subjected during operation, preventing damage to electronic components, and increasing the service life, thereby solving the technical problem that the circuit board is subjected to vibration during operation and the electronic components are easily damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to a high-strength PCB circuit board production and processing equipment and method. Background Art

[0002] PCB, whose Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component. It is the support body of electronic components and the carrier for the electrical connection of electronic components. Because it is made by electronic printing technology, it is called "printed" circuit board.

[0003] The patent document with patent number CN2021109503580 discloses a PCB circuit board, including a base and a bracket; there are two bases; two brackets are installed on the base; the cross-section of the bracket is L-shaped; the bracket is provided with a clamping groove on the horizontal part; a plurality of springs are evenly fixedly connected to the upper surface of the clamping groove; a first clamping block is fixedly connected to the other end of the spring; a second clamping block is fixedly connected to the lower surface of the clamping groove; the vertical part of the bracket is provided with a groove in the length direction of the base at one end close to the clamping groove; a mounting plate is installed in the groove; the upper surface of the mounting plate is evenly fixedly connected to a plurality of plastic heat pipes in the length direction of the base.

[0004] However, during actual use, the inventors discovered that the PCB circuit board is generally fixed directly on the mounting plate, and the PCB circuit board is subjected to vibration during operation, which can easily damage the electronic components. Summary of the Invention

[0005] The purpose of the present invention is to address the shortcomings of the existing technology. By setting up a high-strength PCB circuit board production and processing equipment and method, it is possible to fill a wavy sheet between two layers of substrates to form a circuit board. This not only improves the strength of the circuit board and reduces the chance of the circuit board breaking, but also increases the seismic performance of the circuit board, reduces the vibration of the circuit board during operation, prevents damage to electronic components, and increases the service life, thereby solving the technical problem that the circuit board is easily damaged by vibration during operation and the electronic components are easily damaged.

[0006] In response to the above technical problems, the technical solutions adopted are as follows:

[0007] A high-strength PCB circuit board production and processing equipment, including a blanking mechanism, a carrying mechanism, a filling mechanism and a drilling mechanism arranged on a frame;

[0008] The filling mechanism includes a reeling assembly provided on the frame and used to release the sheet, a glue dispensing assembly provided on the reeling assembly and used to intermittently apply rows of glue dots on a single surface of the sheet, a pressure bonding assembly provided on the reeling assembly and used to press the glue dots on the sheet down to different heights, and a reinforcement assembly provided on the frame;

[0009] The circuit board is formed by bonding an upper substrate and a lower substrate, the sheet is filled between the upper substrate and the lower substrate in a wavy shape, and the bonding surface of the upper substrate and the bonding surface of the lower substrate are respectively alternately provided with rows of punched columns and protrusions;

[0010] The unloading mechanism releases a single lower substrate onto the carrying mechanism, the carrying mechanism positions the lower substrate, the winding assembly releases a sheet of specified length, the gluing assembly intermittently applies rows of glue dots to a single side of the sheet, the pressing assembly alternately presses the glue dots on the sheet down onto the punching columns and protrusions of the lower substrate, the reinforcing assembly rolls the bonding points between the sheet and the punching columns and protrusions in turn, and applies glue strips to the upper surface of the sheet, the upper substrate is bonded to the wavy sheet, and the punching columns of the upper substrate are connected to the protrusions of the lower substrate, and the protrusions of the upper substrate are connected to the punching columns of the lower substrate, and the drilling mechanism drills along each punching column according to actual needs.

[0011] Preferably, the carrying mechanism includes a conveyor belt arranged on the frame, several groups of base boxes arranged on the conveyor belt, a carrying plate arranged on the top of the base box and used for placing the lower substrate, several groups of chip holes arranged on the carrying plate and used for drilling, several groups of first vacuum suction cups arranged on the carrying plate and used for positioning the lower substrate, and a vacuum generator arranged inside the base box.

[0012] Preferably, the unloading mechanism includes a first unloading assembly provided on the frame and used for releasing the lower substrate, and a second unloading assembly provided on the frame and used for releasing the upper substrate;

[0013] The first blanking assembly includes a barrel arranged on the frame through a bracket and equipped with a lower substrate, a first baffle arranged horizontally on the side of the bracket and located at the lower end of the barrel, a second baffle arranged horizontally on the side of the bracket and extending into the interior of the barrel, a first rack arranged at the end of the first baffle, a second rack arranged at the end of the second baffle, a gear arranged on the bracket and used to drive the first rack and the second rack to move in opposite directions, and a first motor arranged on the bracket.

[0014] Preferably, the winding assembly comprises a mounting frame provided on the frame and a winding roller rotatably provided on the mounting frame and wound with the sheet;

[0015] The glue dispensing assembly includes a clamping roller rotatably arranged on the mounting frame, a hollow glue coating roller rotatably arranged on the mounting frame and filled with glue, several groups of glue coating columns arranged on the outer wall of the hollow glue coating roller, a sponge head arranged at the end of the glue coating column, and a steering roller rotatably arranged on the mounting frame and used to pull the sheet material in a steering direction.

[0016] Preferably, the pressure bonding assembly includes a hollow pressure roller rotatably arranged on the mounting frame, several groups of through holes opened on the outer wall of the hollow pressure roller, several groups of U-shaped frames arranged on the inner wall of the hollow pressure roller, a suspension rod penetrating and slidingly arranged on the U-shaped frame, a strip plate arranged at one end of the suspension rod, several groups of top rods arranged on the strip plate and corresponding to the positions of the through holes respectively, an end block arranged at the other end of the suspension rod, an elastic member arranged between the end block and the U-shaped frame, a fixed rod arranged on the mounting frame and one end of which passes through the interior of the hollow pressure roller, an elliptical block arranged at one end of the fixed rod and used to drive the end block to lift and lower the suspension rod, and a second motor arranged on the mounting frame and used to drive the hollow pressure roller.

[0017] Preferably, the reinforcement assembly includes a first hydraulic component arranged on the mounting frame, a hanging plate arranged on the output shaft of the first hydraulic component, several groups of second vacuum suction cups arranged at the bottom of the hanging plate, a cutter arranged at the bottom of the hanging plate and used to cut the sheet, a hanger arranged on the frame, a first screw rod rotatably arranged on the hanger, a first threaded block threaded on the first screw rod, a glue box arranged at the bottom of the first threaded block, several groups of glue coating wheels arranged at the bottom of the glue box, and a third motor arranged on the hanger and used to drive the first screw rod.

[0018] Preferably, the drilling mechanism includes a pressing assembly provided on the frame, a drilling assembly provided on the pressing assembly, and an output assembly provided on the frame;

[0019] The pressing assembly includes a portal arranged on the frame, a second hydraulic component arranged on the portal, a top plate arranged at the output end of the second hydraulic component, and a pressing plate arranged below the top plate through a connecting rod.

[0020] Preferably, the drilling assembly includes a fourth motor arranged on the top plate, a frame arranged on the output shaft of the fourth motor, a second screw rod rotatably arranged inside the frame, a second threaded block threaded on the second screw rod, a drilling machine arranged at the bottom of the second threaded block, a fifth motor arranged on the frame and used to drive the second screw rod, and several groups of avoidance holes arranged on the pressure plate and used for drilling.

[0021] Preferably, the output assembly includes an output channel arranged on the frame and a collection box arranged at an end of the output channel.

[0022] Preferably, a processing method for high-strength PCB circuit board production and processing equipment comprises the following steps:

[0023] Step 1, blanking process, the first blanking assembly automatically releases a single lower substrate onto the carrying mechanism, and the carrying mechanism positions the lower substrate with the perforated columns and protrusions of the lower substrate facing upwards;

[0024] Step 2: Filling process: The rewinding assembly releases a sheet of specified length, the dispensing assembly intermittently applies rows of glue dots to one side of the sheet, the pressing assembly alternately presses the glue dots on the sheet onto the perforated columns and protrusions of the lower substrate, and the reinforcing assembly sequentially rolls the bonding points between the sheet and the perforated columns and protrusions, and applies glue strips to the upper surface of the sheet;

[0025] Step 3: Lamination process: the second blanking assembly automatically releases a single upper substrate onto the wavy sheet, the perforated columns of the upper substrate engage with the protrusions of the lower substrate, and the protrusions of the upper substrate engage with the perforated columns of the lower substrate. The lamination assembly presses the upper substrate onto the wavy sheet to bond them, completing the bonding of the upper and lower substrates.

[0026] Step 4 is the drilling process. The drilling assembly drills holes along each punching column according to actual needs. Finally, the circuit boards enter the collection box from the output channel for unified assembly.

[0027] Beneficial effects of the present invention:

[0028] (1) The present invention cooperates with the carrying mechanism and the filling mechanism. On the one hand, the two layers of substrates can be bonded together to form a hollow circuit board, and the wavy sheet can be filled between the two layers of substrates. This not only improves the strength of the circuit board and reduces the probability of the circuit board being broken, but also increases the seismic performance of the circuit board, reduces the vibration of the circuit board during operation, prevents damage to electronic components, and increases the service life. On the other hand, a punching column and a protrusion are provided between the two layers of substrates for docking. The protrusion also has a shock-absorbing effect on the circuit board, and the punching column facilitates the drilling of the circuit board, preventing direct perforation on the wavy sheet, thereby improving the strength of the wavy sheet and preventing the wavy sheet from collapsing.

[0029] (2) The carrying mechanism provided in the present invention can, on the one hand, carry the lower substrate forward intermittently for a specified distance, thereby facilitating the filling, bonding, and drilling of the circuit board. It can also position the lower substrate to prevent the lower substrate from shifting on the carrying plate, facilitate the butt bonding of the lower substrate and the upper substrate, and improve the drilling accuracy of the circuit board. On the other hand, it can collect the waste chips generated during the drilling of the circuit board, thereby improving the cleanliness of the surface of the carrying plate, preventing the waste chips from splashing and scattering, and improving the sanitary environment of the workshop.

[0030] (3) The present invention cooperates with the dispensing assembly and the pressing assembly. On the one hand, it can automatically release a sheet of a certain length and intermittently apply rows of glue dots to one side of the sheet, so that the sheet can be bonded to the perforated columns and protrusions of the lower substrate. On the other hand, it can alternately press the rows of glue dots on the sheet down to different heights, so that the rows of glue dots on the sheet alternately bond to the perforated columns and protrusions of the lower substrate, thereby bending the sheet into a wavy shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic diagram of the circuit board structure.

[0033] Figure 2 This is a structural diagram of a high-strength PCB circuit board production and processing equipment.

[0034] Figure 3 This is a structural diagram of the present invention from another perspective.

[0035] Figure 4 Schematic diagram of the structure of the transport mechanism.

[0036] Figure 5 Schematic diagram of the structure of the load-bearing plate.

[0037] Figure 6 It is a structural schematic diagram of the first blanking component.

[0038] Figure 7 Schematic diagram of the filling mechanism.

[0039] Figure 8 This is a structural diagram of the filling mechanism from another perspective.

[0040] Figure 9 Schematic diagram of the working of the filling mechanism.

[0041] Figure 10 Schematic diagram of the structure of the pressure-bonded component.

[0042] Figure 11 A structural diagram of the reinforcement component.

[0043] Figure 12 It is a structural diagram of the rubber coating wheel.

[0044] Figure 13 Schematic diagram of the structure of the press-fit assembly.

[0045] Figure 14 Schematic diagram of the structure of the drilling component.

[0046] Figure 15 The figure is a flow chart of a method for producing and processing a high-strength PCB circuit board. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the accompanying drawings.

[0048] Example 1

[0049] like Figures 1-14 As shown, a high-strength PCB circuit board production and processing equipment includes a blanking mechanism 2, a carrying mechanism 3, a filling mechanism 4 and a drilling mechanism 5 arranged on a frame 1;

[0050] The filling mechanism 4 includes a reeling assembly 41 provided on the frame 1 and used to release the sheet 6, a glue dispensing assembly 42 provided on the reeling assembly 41 and used to intermittently apply a row of glue dots on a single surface of the sheet 6, a pressing assembly 43 provided on the reeling assembly 41 and used to press the glue dots on the sheet 6 down to different heights, and a reinforcing assembly 44 provided on the frame 1;

[0051] The circuit board is formed by bonding an upper substrate 7 and a lower substrate 8. The sheet 6 is filled between the upper substrate 7 and the lower substrate 8 in a wavy shape. The bonding surfaces of the upper substrate 7 and the lower substrate 8 are respectively provided with rows of perforated columns 91 and protrusions 92 alternately.

[0052] It should be noted that the sheet 6 and the protrusion 92 are both made of elastic hard rubber;

[0053] The unloading mechanism 2 releases a single lower substrate onto the carrying mechanism 3, and the carrying mechanism 3 positions the lower substrate. The winding component 41 releases a sheet of specified length, and the glue dispensing component 42 intermittently applies rows of glue dots to a single side of the sheet. The pressing component 43 presses the glue dots on the sheet alternately down to the punching columns and protrusions of the lower substrate. The reinforcing component 44 rolls the bonding points between the sheet and the punching columns and protrusions in turn, and applies glue strips to the upper surface of the sheet. The upper substrate is bonded to the wavy sheet, and the punching columns of the upper substrate are connected to the protrusions of the lower substrate, and the protrusions of the upper substrate are connected to the punching columns of the lower substrate. The drilling mechanism 5 drills along each punching column according to actual needs.

[0054] In this embodiment, by cooperating with the provided carrying mechanism 3 and the filling mechanism 4, on the one hand, the two layers of substrates can be bonded and combined into a hollow circuit board, and the wavy sheet can be filled between the two layers of substrates, which not only improves the strength of the circuit board and reduces the chance of breakage of the circuit board, but also increases the seismic resistance of the circuit board, reduces the vibration of the circuit board during operation, prevents damage to electronic components, and improves the service life; on the other hand, punching columns and protrusions are provided between the two layers of substrates for docking, the protrusions also have a shock-absorbing effect on the circuit board, and the punching columns facilitate the drilling of the circuit board, prevent direct perforation on the wavy sheet, improve the strength of the wavy sheet, and avoid the collapse of the wavy sheet.

[0055] In detail, first, the conveyor belt 31 carries the bottom box 32 and advances intermittently for a specified distance. When the bottom box 32 moves to the position directly below the first unloading component 21, it stops running, and the barrel 212 automatically releases a lower substrate onto the carrier plate 33. The first vacuum suction cup 35 fixes the position of the lower substrate, and the conveyor belt 31 carries the lower substrate and continues to advance intermittently for a specified distance. After the lower substrate begins to move to the position below the hollow pressure roller 431, the winding component 41 releases a sheet of specified length, and the glue dispensing component 42 intermittently applies rows of glue dots to one side of the sheet, and the pressure bonding component 43 alternately presses the glue dots on the sheet down to the punched columns and protrusions of the lower substrate. When the lower substrate begins to leave the position below the hollow pressure roller 431, the first hydraulic component 441 drives the second vacuum suction cup 443 to descend and suck the sheet. At the same time, the cutter 444 cuts The sheet is then rolled by the glue coating wheel 449 at the bonding points between the sheet and the punching columns and protrusions in turn, and the glue strip is applied to the upper surface of the sheet. Then, when the conveyor belt 31 carrying the lower substrate moves to the position directly below the second blanking component 22, it stops operating. The second blanking component 22 automatically releases a single upper substrate onto the wavy sheet. The punching columns of the upper substrate are connected to the protrusions of the lower substrate, and the protrusions of the upper substrate are connected to the punching columns of the lower substrate. When the conveyor belt 31 carrying the lower substrate moves to the position directly below the pressing component 51, it stops operating. The pressing component 51 presses the upper substrate onto the wavy sheet for bonding, completing the bonding and combination of the upper and lower substrates. At the same time, the drilling component 52 drills holes along each punching column according to actual needs. Finally, the circuit board enters the collection box 532 from the output channel 531 for unified assembly.

[0056] Further, if Figure 2-Figure 5 As shown, the carrying mechanism 3 includes a conveyor belt 31 arranged on the frame 1, several groups of bottom boxes 32 arranged on the conveyor belt 31, a carrying plate 33 arranged on the top of the bottom box 32 and used for placing the lower substrate, several groups of chip holes 34 arranged on the carrying plate 33 and used for drilling, several groups of first vacuum suction cups 35 arranged on the carrying plate 33 and used for positioning the lower substrate, and a vacuum generator arranged inside the bottom box 32.

[0057] It should be noted that the first vacuum suction cup 35 can fix the position of the lower substrate on the carrier plate 33 so that the punching columns and protrusions of the lower substrate correspond to the positions of the chip leakage holes 34 respectively.

[0058] In this embodiment, the carrying mechanism 3 is provided, on the one hand, it can carry the lower substrate forward intermittently for a specified distance, which is convenient for filling, bonding, and drilling of the circuit board. It can also position the lower substrate to avoid displacement of the lower substrate on the carrying plate 33, facilitate the docking and bonding of the lower substrate and the upper substrate, and improve the accuracy of drilling holes in the circuit board; on the other hand, it can collect the waste chips generated during drilling of the circuit board, improve the cleanliness of the surface of the carrying plate 33, avoid the splashing and scattering of waste chips, and improve the sanitary environment of the workshop.

[0059] In detail, the conveyor belt 31 carries the bottom box 32 and advances intermittently for a specified distance. When the bottom box 32 moves to the position directly below the first unloading component 21, it stops operating. The barrel 212 automatically releases a lower substrate to the carrier plate 33. The first vacuum suction cup 35 fixes the position of the lower substrate on the carrier plate 33 under the drive of the vacuum generator. When the conveyor belt 31 carries the lower substrate and moves to the position directly below the pressing component 51, it stops operating. The drilling component 52 drills along each punching column according to actual needs. The waste chips generated by drilling fall into the bottom box 32 from the chip leakage hole 34.

[0060] Further, if Figure 2 and Figure 6 As shown, the unloading mechanism 2 includes a first unloading assembly 21 provided on the frame 1 and used to release the lower substrate, and a second unloading assembly 22 provided on the frame 1 and used to release the upper substrate;

[0061] The first blanking component 21 includes a barrel 212 which is arranged on the frame 1 through a bracket 211 and has a lower substrate installed therein, a first baffle 213 which is horizontally arranged on the side of the bracket 211 and located at the lower end of the barrel 212, a second baffle 214 which is horizontally arranged on the side of the bracket 211 and extends into the interior of the barrel 212, a first rack 215 which is arranged at the end of the first baffle 213, a second rack 216 which is arranged at the end of the second baffle 214, a gear 217 which is arranged on the bracket 211 and is used to drive the first rack 215 and the second rack 216 to move in opposite directions, and a first motor which is arranged on the bracket 211 and is used to drive the gear 217.

[0062] It should be noted that the structure of the second blanking component 22 is the same as that of the first blanking component 21. The lower substrate is stacked in the barrel 212 of the first blanking component 21, with the punching columns and protrusions of the lower substrate facing upward, and the upper substrate is stacked in the barrel of the second blanking component 22, with the punching columns and protrusions of the upper substrate facing downward.

[0063] It is worth mentioning that the second baffle 214 is located between the first lower substrate and the second lower substrate at the lower end of the barrel 212 and can be inserted between the punching columns and the protrusions of the lower substrates, so that the second baffle 214 can support the second lower substrate at the lower end of the barrel 212.

[0064] In this embodiment, the first blanking assembly 21 is provided to automatically release a lower substrate onto the carrying plate 33 .

[0065] In detail, the conveyor belt 31 carrying the bottom box 32 moves to the position just below the first unloading assembly 21 and stops, the first motor drives the gear 217 to move the first rack 215 and the second rack 216 in the opposite direction, so that the first rack 215 and the first stop 213 gradually move away from the lower end of the barrel 212, and at the same time, the second rack 216 and the second stop 214 are inserted between the first lower base plate and the second lower base plate of the lower end of the barrel 212, supporting the second lower base plate of the lower end of the barrel 212. The first lower substrate at the lower end of the barrel 212 falls onto the carrying plate 33, and the conveyor belt 31 continues to carry the bottom box 32 forward. Then, the first motor drives the gear 217 to rotate in the opposite direction, so that the first rack 215 and the second rack 216 respectively bring the first stop bar 213 and the second stop bar 214 to reset, so that the first stop bar 213 is located at the lower end of the barrel 212 again, and the second stop bar 214 is separated from the barrel 212. The lower substrate in the barrel 212 drops as a whole onto the first stop bar 213, ready for next use.

[0066] Further, if Figure 2-Figure 3 and Figure 7-10 As shown, the winding assembly 41 includes a mounting frame 411 provided on the frame 1 and a winding roller 412 rotatably provided on the mounting frame 411 and wound with a sheet;

[0067] The glue dispensing assembly 42 includes a clamping roller 421 rotatably mounted on the mounting frame 411, a hollow glue coating roller 422 rotatably mounted on the mounting frame 411 and filled with glue, a plurality of glue coating posts 423 mounted on the outer wall of the hollow glue coating roller 422, a sponge head mounted at the end of the glue coating post 423, and a steering roller 424 rotatably mounted on the mounting frame 411 and used to pull the sheet material in a steering direction.

[0068] The pressure bonding assembly 43 includes a hollow pressure roller 431 rotatably arranged on the mounting frame 411, several groups of through holes 432 opened on the outer wall of the hollow pressure roller 431, several groups of U-shaped frames 433 arranged on the inner wall of the hollow pressure roller 431, a suspension rod 434 that passes through and slides on the U-shaped frame 433, a strip plate 435 arranged at one end of the suspension rod 434, several groups of top rods 436 arranged on the strip plate 435 and corresponding to the positions of the through holes 432, an end block arranged at the other end of the suspension rod 434, an elastic member 437 arranged between the end block and the U-shaped frame 433, a fixed rod 438 arranged on the mounting frame 411 and one end of which passes through the interior of the hollow pressure roller 431, an elliptical block 439 arranged at one end of the fixed rod 438 and used to drive the end block to move the suspension rod 434 up and down, and a second motor 4391 arranged on the mounting frame 411 and used to drive the hollow pressure roller 431.

[0069] In this embodiment, by cooperating with the dispensing component 42 and the pressing component 43, on the one hand, a sheet of a certain length can be automatically released, and rows of glue dots can be intermittently coated on one side of the sheet, so that the sheet can be bonded to the perforated columns and protrusions of the lower substrate; on the other hand, the rows of glue dots on the sheet can be alternately pressed down to different heights, so that the rows of glue dots on the sheet can be alternately bonded to the perforated columns and protrusions of the lower substrate, thereby bending the sheet into a wavy shape.

[0070] In detail, after the conveyor belt 31 carries the lower substrate and starts to move to the position below the hollow pressure roller 431, the first hydraulic component 441 drives the second vacuum suction cup 443 to descend and adhere the cut end of the sheet to the lower substrate, the winding roller 412 begins to release the sheet, the hollow glue roller 422 and the clamping roller 421 are clamped together, and the glue column 423 of the hollow glue roller 422 intermittently applies rows of glue dots to one side of the sheet, and the steering roller 424 pulls the vertically descending sheet to the bottom of the horizontal hollow pressure roller 431, and the second The motor 4391 drives the hollow pressure roller 431 to rotate at a constant speed, so that the outer wall of the hollow pressure roller 431 presses a row of glue dots on the sheet material onto the end of the punched column of the lower substrate. Then, the suspension rod 434, driven by the elliptical block 439, slides out of the through hole 432 of the hollow pressure roller 431 with the push rod 436, so that the push rod 436 presses the next row of glue dots on the sheet material onto the raised end of the lower substrate, thereby alternately bonding the rows of glue dots on the sheet material to the punched columns and the raised end of the lower substrate, bending the sheet material into a wavy shape, and completing the filling work.

[0071] Further, if Figure 2 and Figure 11-12As shown, the reinforcement assembly 44 includes a first hydraulic component 441 arranged on the mounting frame 411, a hanger 442 arranged on the output shaft of the first hydraulic component 441, several groups of second vacuum suction cups 443 arranged at the bottom of the hanger 442, a cutter 444 arranged at the bottom of the hanger 442 and used to cut the sheet, a hanger 445 arranged on the frame 1, a first screw rod 446 rotatably arranged on the hanger 445, a first threaded block 447 threadedly arranged on the first screw rod 446, a glue box 448 arranged at the bottom of the first threaded block 447, several groups of glue coating wheels 449 arranged at the bottom of the glue box 448, and a third motor arranged on the hanger 445 and used to drive the first screw rod 446.

[0072] It should be noted that there are three groups of glue coating wheels 449 distributed at the bottom of the glue box 448. The glue coating wheels 449 in the middle group are lower in height and are used to press the raised bonding points between the sheet and the lower substrate. The glue coating wheels 449 on the same horizontal plane on both sides are higher and are used to press the bonding points between the sheet and the perforated columns of the lower substrate.

[0073] In this embodiment, the reinforcement component 44 is set up, on the one hand, the sheet can be automatically cut and the cut end of the sheet can be positioned to facilitate the continuous use of the sheet next time; on the other hand, the bonding points between the sheet and the punched columns and protrusions can be rolled in sequence, and the upper surface of the sheet can be coated with adhesive strips.

[0074] In detail, after the sheet filling work is completed, when the conveyor belt 31 carrying the lower substrate begins to leave the position below the hollow pressure roller 431, the first hydraulic component 441 drives the second vacuum suction cup 443 to descend and suck the sheet, and at the same time, the cutter 444 cuts the sheet. Then, after the conveyor belt 31 carrying the lower substrate begins to move to the position of the glue box 448, the third motor drives the first screw rod 446 to move the first thread block 447 and the glue box 448 horizontally, so that the glue coating wheel 449 at the bottom of the glue box 448 simultaneously rolls the bonding points between the sheet and the raised bonding points of the lower substrate and the bonding points between the sheets on both sides and the perforated columns of the lower substrate, and coats the rolling tracks on the sheet with glue until the glue coating wheel 449 horizontally separates from the sheet, and the conveyor belt 31 continues to carry the lower substrate forward for a specified distance and then stops, and the third motor drives the first screw rod 446 to move the first thread block 447 and the glue box 448 horizontally again, and the glue coating wheel 449 rolls and coats the sheet with glue again.

[0075] Further, if Figure 2-Figure 3 and Figure 13-14 As shown, the drilling mechanism 5 includes a pressing assembly 51 provided on the frame 1, a drilling assembly 52 provided on the pressing assembly 51, and an output assembly 53 provided on the frame 1;

[0076] The pressing assembly 51 includes a door frame 511 provided on the frame 1, a second hydraulic component 512 provided on the door frame 511, a top plate 513 provided at the output end of the second hydraulic component 512, and a pressing plate 514 provided below the top plate 513 via a connecting rod.

[0077] The drilling assembly 52 includes a fourth motor arranged on the top plate 513, a frame 521 arranged on the output shaft of the fourth motor, a second screw rod 522 rotatably arranged inside the frame 521, a second threaded block 523 threadedly arranged on the second screw rod 522, a drill 524 arranged at the bottom of the second threaded block 523, a fifth motor arranged on the frame 521 and used to drive the second screw rod 522, and several groups of avoidance holes 525 arranged on the pressure plate 514 and used for drilling.

[0078] In this embodiment, the drilling mechanism 5 is provided to press the upper substrate onto the wavy sheet for bonding, thereby completing the assembly of the upper and lower substrates, and drilling can be performed along each punching column according to actual needs.

[0079] In detail, when the conveyor belt 31 carrying the lower substrate moves to the position directly below the second blanking component 22, it stops operating, and the second blanking component 22 automatically releases a single upper substrate onto the wavy sheet, and the punching column of the upper substrate is connected to the protrusion of the lower substrate, and the protrusion of the upper substrate is connected to the punching column of the lower substrate. When the conveyor belt 31 carrying the lower substrate moves to the position directly below the pressing component 51, it stops operating, and the second hydraulic component 512 drives the top plate 513 and the pressure plate 514 to descend, and the pressure plate 514 presses the upper substrate on the wavy sheet for bonding, completing the bonding and combination of the upper and lower substrates. At the same time, the fourth motor drives the frame 521 to rotate, and the fifth motor drives the second threaded block 523 through the second screw rod 522 to move the drilling machine 524, and adjusts the position of the drilling machine 524 so that the drilling machine 524 drills along each avoidance hole 525 and the punching column according to actual needs.

[0080] Further, if Figure 2-Figure 3 As shown, the output assembly 53 includes an output channel 531 provided on the frame 1 and a collection box 532 provided at the end of the output channel 531 .

[0081] In this embodiment, the output component 53 is provided to automatically output the assembled circuit boards and collect them in a unified manner.

[0082] In detail, after the conveyor belt 31 carries the lower substrate to the position of the output channel 531, the first vacuum suction cup 35 releases the lower substrate and no longer positions the lower substrate. The assembled circuit boards slide along the output channel 531 into the collection box 532 for unified collection.

[0083] Example 2

[0084] like Figures 1-15 As shown, a processing method for high-strength PCB circuit board production and processing equipment includes the following steps:

[0085] Step 1, blanking process, the first blanking assembly 21 automatically releases a single lower substrate onto the carrying mechanism 3, and the carrying mechanism 3 positions the lower substrate with the perforated columns and protrusions of the lower substrate facing upwards;

[0086] Step 2: Filling process: The rewinding assembly 41 releases a sheet of a specified length, the glue dispensing assembly 42 intermittently applies rows of glue dots to one side of the sheet, the pressing assembly 43 alternately presses the glue dots on the sheet onto the perforated columns and protrusions of the lower substrate, and the reinforcing assembly 44 sequentially rolls the bonding points between the sheet and the perforated columns and protrusions, and applies glue strips to the upper surface of the sheet;

[0087] Step 3: Lamination process: The second blanking assembly 22 automatically releases a single upper substrate onto the wavy sheet. The perforated columns of the upper substrate mate with the protrusions of the lower substrate, and the protrusions of the upper substrate mate with the perforated columns of the lower substrate. The lamination assembly 51 presses the upper substrate onto the wavy sheet to bond them, completing the bonding of the upper and lower substrates.

[0088] Step 4 is a drilling process, in which the drilling assembly 52 drills holes along each punching column according to actual needs. Finally, the circuit boards enter the collection box 532 from the output channel 531 for unified assembly.

[0089] In the description of the present invention, it should be understood that the terms "front and back", "left and right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the equipment or components referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the invention.

[0090] Of course, in this technical solution, those skilled in the art should understand that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0091] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art based on the technical guidance of the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A high-strength PCB circuit board production and processing equipment, characterized in that: It includes a feeding mechanism, a carrying mechanism, a filling mechanism and a drilling mechanism arranged on a frame; The filling mechanism includes a reeling assembly provided on the frame and used to release the sheet, a glue dispensing assembly provided on the reeling assembly and used to intermittently apply rows of glue dots on a single surface of the sheet, a pressure bonding assembly provided on the reeling assembly and used to press the glue dots on the sheet down to different heights, and a reinforcement assembly provided on the frame; The circuit board is formed by bonding an upper substrate and a lower substrate, the sheet is filled between the upper substrate and the lower substrate in a wavy shape, and the bonding surface of the upper substrate and the bonding surface of the lower substrate are respectively alternately provided with rows of punched columns and protrusions; The unloading mechanism releases a single lower substrate onto the carrying mechanism, the carrying mechanism positions the lower substrate, the winding assembly releases a sheet of specified length, the gluing assembly intermittently applies rows of glue dots to a single side of the sheet, the pressing assembly alternately presses the glue dots on the sheet down onto the punching columns and protrusions of the lower substrate, the reinforcing assembly rolls the bonding points between the sheet and the punching columns and protrusions in turn, and applies glue strips to the upper surface of the sheet, the upper substrate is bonded to the wavy sheet, and the punching columns of the upper substrate are connected to the protrusions of the lower substrate, and the protrusions of the upper substrate are connected to the punching columns of the lower substrate, and the drilling mechanism drills along each punching column according to actual needs.

2. The high-strength PCB circuit board production and processing equipment according to claim 1, characterized in that: The carrying mechanism includes a conveyor belt arranged on the frame, several groups of bottom boxes arranged on the conveyor belt, a carrying plate arranged on the top of the bottom box and used for placing the lower substrate, several groups of chip leakage holes arranged on the carrying plate and used for drilling, several groups of first vacuum suction cups arranged on the carrying plate and used for positioning the lower substrate, and a vacuum generator arranged inside the bottom box.

3. The high-strength PCB circuit board production and processing equipment according to claim 2, characterized in that: The unloading mechanism includes a first unloading assembly provided on the frame and used to release the lower substrate, and a second unloading assembly provided on the frame and used to release the upper substrate; The first blanking assembly includes a barrel arranged on the frame through a bracket and equipped with a lower substrate, a first baffle arranged horizontally on the side of the bracket and located at the lower end of the barrel, a second baffle arranged horizontally on the side of the bracket and extending into the interior of the barrel, a first rack arranged at the end of the first baffle, a second rack arranged at the end of the second baffle, a gear arranged on the bracket and used to drive the first rack and the second rack to move in opposite directions, and a first motor arranged on the bracket.

4. The high-strength PCB circuit board production and processing equipment according to claim 3, characterized in that: The winding assembly includes a mounting frame provided on the frame and a winding roller rotatably provided on the mounting frame and wound with a sheet; The glue dispensing assembly includes a clamping roller rotatably arranged on the mounting frame, a hollow glue coating roller rotatably arranged on the mounting frame and filled with glue, several groups of glue coating columns arranged on the outer wall of the hollow glue coating roller, a sponge head arranged at the end of the glue coating column, and a steering roller rotatably arranged on the mounting frame and used to pull the sheet material in a steering direction.

5. The high-strength PCB circuit board production and processing equipment according to claim 4, characterized in that: The pressure bonding assembly includes a hollow pressure roller rotatably arranged on the mounting frame, several groups of through holes opened on the outer wall of the hollow pressure roller, several groups of U-shaped frames arranged on the inner wall of the hollow pressure roller, a suspension rod that passes through and slides on the U-shaped frame, a strip plate arranged at one end of the suspension rod, several groups of top rods arranged on the strip plate and corresponding to the positions of the through holes respectively, an end block arranged at the other end of the suspension rod, an elastic member arranged between the end block and the U-shaped frame, a fixed rod arranged on the mounting frame and one end of which passes through the interior of the hollow pressure roller, an elliptical block arranged at one end of the fixed rod and used to drive the end block to lift and lower the suspension rod, and a second motor arranged on the mounting frame and used to drive the hollow pressure roller.

6. The high-strength PCB circuit board production and processing equipment according to claim 5, characterized in that: The reinforcement assembly includes a first hydraulic component arranged on the mounting frame, a hanging plate arranged on the output shaft of the first hydraulic component, several groups of second vacuum suction cups arranged at the bottom of the hanging plate, a cutter arranged at the bottom of the hanging plate and used for cutting sheet materials, a hanger arranged on the frame, a first screw rod rotatably arranged on the hanger, a first threaded block threadedly arranged on the first screw rod, a glue box arranged at the bottom of the first threaded block, several groups of glue coating wheels arranged at the bottom of the glue box, and a third motor arranged on the hanger and used for driving the first screw rod.

7. The high-strength PCB circuit board production and processing equipment according to claim 6, characterized in that: The drilling mechanism includes a pressing assembly arranged on the frame, a drilling assembly arranged on the pressing assembly, and an output assembly arranged on the frame; The pressing assembly includes a portal arranged on the frame, a second hydraulic component arranged on the portal, a top plate arranged at the output end of the second hydraulic component, and a pressing plate arranged below the top plate through a connecting rod.

8. The high-strength PCB circuit board production and processing equipment according to claim 7, characterized in that: The drilling assembly includes a fourth motor arranged on the top plate, a frame arranged on the output shaft of the fourth motor, a second screw rod rotatably arranged inside the frame, a second threaded block threaded on the second screw rod, a drilling machine arranged at the bottom of the second threaded block, a fifth motor arranged on the frame and used to drive the second screw rod, and several groups of avoidance holes arranged on the pressure plate and used for drilling.

9. The high-strength PCB circuit board production and processing equipment according to claim 8, characterized in that: The output assembly includes an output channel arranged on the frame and a collection box arranged at the end of the output channel.

10. The processing method of a high-strength PCB circuit board production and processing equipment according to claim 9, characterized in that: The following steps are involved: Step 1, blanking process, the first blanking assembly automatically releases a single lower substrate onto the carrying mechanism, and the carrying mechanism positions the lower substrate with the perforated columns and protrusions of the lower substrate facing upwards; Step 2: Filling process: The rewinding assembly releases a sheet of specified length, the dispensing assembly intermittently applies rows of glue dots to one side of the sheet, the pressing assembly alternately presses the glue dots on the sheet onto the perforated columns and protrusions of the lower substrate, and the reinforcing assembly sequentially rolls the bonding points between the sheet and the perforated columns and protrusions, and applies glue strips to the upper surface of the sheet; Step 3: Lamination process: the second blanking assembly automatically releases a single upper substrate onto the wavy sheet, the perforated columns of the upper substrate engage with the protrusions of the lower substrate, and the protrusions of the upper substrate engage with the perforated columns of the lower substrate. The lamination assembly presses the upper substrate onto the wavy sheet to bond them, completing the bonding of the upper and lower substrates. Step 4 is the drilling process. The drilling assembly drills holes along each punching column according to actual needs. Finally, the circuit boards enter the collection box from the output channel for unified assembly.

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