An automated testing device and method for chip bonding tension and shear force

Abstract

The present application provides an automated testing device and method for chip bonding tension and shear force, belonging to the field of microelectronics reliability testing and failure technology. The device and method comprise a three-dimensional scanning unit that determines the spatial distribution of bonding wires and bonding points of a chip to be processed, generating a 3D image of the spatial distribution; a path acquisition unit that identifies and judges the 3D image of the spatial distribution, and calculates the motion path of a puller or pusher; a push-pull force application unit equipped with pullers or pusher tooling of different sizes and ranges that applies tension to the bonding wires of the chip to be processed or shear force to the bonding points, and records the force value that the chip to be processed can accept through a force sensor; a mobile control unit that transports the push-pull force application unit to a designated location along the path planned by the path acquisition unit, and performs a push-pull force test. The present application greatly enhances the ability to test bonding tension and shear force for smaller advanced packaged chips.

Description

Technical Field

[0001] The present application belongs to the field of microelectronic reliability testing and failure technology, and more specifically, relates to an automated testing device and method for chip bonding tension and shear force. Background Art

[0002] Chip bond tensile and shear force testing is essential for verifying chip bond and shear strength. Chip bond strength refers to the bond strength between the internal leads and the chip and package at the component's internal package bonding point, while chip shear strength refers to the strength of the adhesive bond between the chip and the tube shell or substrate. Chip bond tensile and shear force testing generates corresponding test data, which can be compared with the corresponding standards to verify whether the chip bond and shear strength meet the standards. Chip bond and shear strength are important indicators for measuring the semiconductor packaging process and are of great significance for chip reliability evaluation and failure analysis.

[0003] At present, the main method for testing the chip bonding tension and shear force is to use a bond shear force tester, select appropriate pullers and pushers, apply tension to the bonding wire on the chip, or apply push force to the bonding point, and monitor the push or pull force value at the same time.

[0004] Conventional bond shear force testers are mainly composed of a microscope, a push or pull module with a force sensor and its mobile control unit, a sample stage, and a control computer for mechanical data collection and processing. During use, under the observation of a microscope, the controller moves the hook or push knife in the push-pull module to the initial position corresponding to the chip and hovers, such as the bottom of the bonding wire or the side of the bonding point. It is required that the push knife or hook does not touch the chip during hovering, otherwise it will affect the test force value. At the same time, during the entire movement process, the push knife or hook should not cause destructive damage to the chip structure itself. Finally, the program is set to move the hook or push knife in a certain direction so that it contacts the chip bonding wire or bonding point. At the same time, the tension or push force during the contact process is measured to obtain the bonding and shear strength data of the chip.

[0005] As chip integration increases and manufacturing processes become more sophisticated, the size of produced chips is shrinking. These small, high-density chips pose a significant challenge to bonding and shear strength testing. Even under a microscope, testers struggle to avoid chip collisions when moving a retractor or pusher. When the density of bond wires and bond points is too high, it can be challenging to keep the retractor or pusher in place. Bond and shear strength testing of small chips requires significant time and effort, and is also prone to human errors that can affect test results. Summary of the Invention

[0006] In response to the defects of the existing technology, the purpose of this application is to provide an automated testing device and method for chip bonding tension and shear force, aiming to solve the current problems of low efficiency and poor operability of chip bonding tension and shear force caused by the reduction of chip size.

[0007] To achieve the above-mentioned purpose, the present application provides an automated testing device for chip bonding tension and shear force, comprising: a sample stage, a three-dimensional scanning unit, a path acquisition unit, a push-pull force applying unit, and a movement control unit;

[0008] A push-pull force applying unit is provided above the sample stage; the movement control unit is connected to the push-pull force applying unit; the three-dimensional scanning unit is connected to the path acquisition unit;

[0009] The sample table is used to fix the chip to be processed; the three-dimensional scanning unit is used to determine the spatial distribution of the bonding wires and bonding points of the chip to be processed, generate a 3D imaging map of the spatial distribution, and transmit it to the path acquisition unit; the path acquisition unit is used to identify and judge the 3D imaging map of the spatial distribution of the bonding wires and bonding points of the chip to be processed, and calculate the movement path of the puller or pusher; the push-pull force applying unit is equipped with pullers or pusher tooling of different sizes and ranges, which is used to apply tension to the bonding wires of the chip to be processed or shear force to the bonding points, and record the force value that the chip to be processed can accept through the force sensor; the mobile control unit is used to transport the push-pull force applying unit along the path planned by the path acquisition unit to the designated position, and perform push-pull force testing actions.

[0010] Further preferably, the path acquisition unit is used to use a trained path acquisition model to identify and judge the 3D imaging diagram of the spatial distribution of the bonding wires and bonding points of the chip to be processed; wherein the path acquisition model is obtained by learning and training based on samples to obtain the path acquisition capability for different chips.

[0011] On the other hand, the present application provides an automated testing method for chip bonding tension and shear force, comprising the following steps:

[0012] Step S1: determining the spatial distribution of bonding wires and bonding points of the chip to be processed by three-dimensional scanning, and generating a 3D imaging map of the spatial distribution;

[0013] Step S2: Using the trained path acquisition model, the spatial distribution 3D image of the chip to be processed is identified and judged, and the motion path of the retractor or pusher is calculated so that the retractor or pusher hovers at the corresponding position between the bonding wire and the bonding point;

[0014] Step S3: Determine whether the motion path of the retractor or pusher calculated in step S2 meets the requirements. If so, go to step S4; otherwise, change the size of the retractor or pusher and go to step S2.

[0015] Step S4: According to the material and diameter of the bonding wire, set the push-pull force applied, move the hook or push knife, make the hook or push knife contact the bonding wire or bonding point of the chip to be processed, and measure the push or pull force during the contact process to obtain the bonding and shear strength data of the chip to be processed.

[0016] Further preferably, the path acquisition model is obtained by learning and training based on samples to achieve the path acquisition capability for different chips.

[0017] Further preferably, the requirements that the motion path in step S3 needs to meet are:

[0018] The pull hook or the push knife does not touch the chip to be processed while moving along the motion path, and the pull hook or the push knife can hover just below the bonding wire or on the side of the bonding point.

[0019] Further preferably, step S3 specifically includes the following steps:

[0020] Determine whether the pull hook or push knife touches the chip to be processed during the movement along the motion path, and whether the pull hook or push knife can hover directly below the bonding wire or on the side of the bonding point. If all of these conditions are met, determine whether the path acquisition model has calculated a motion path that meets the requirements. Otherwise, select a smaller pull hook or push knife and execute step S2. If the motion path that meets the requirements still cannot be obtained, continue to reduce the size of the pull hook or push knife and execute step S2 until a motion path that meets the requirements is obtained. If the smallest pull hook or push knife is used to execute step S2 and the obtained motion path cannot meet the requirements, terminate the push-pull force test.

[0021] Further preferably, the path acquisition model utilizes big data processing and machine learning technology to perform sample collection and model training to obtain an AI recognition model.

[0022] In general, the above technical solutions conceived by this application have the following beneficial effects compared with the existing technologies:

[0023] The present application provides an automated testing device for chip bonding tension and shear force. The chip to be processed is fixed by a sample table, and then the chip to be tested is scanned by a three-dimensional scanning unit. This can ensure that the spatial position of the chip to be processed itself does not change during the push-pull force test. The three-dimensional scanning generates a 3D imaging diagram of the spatial distribution of the chip to be processed, which can accurately point out the distribution of bonding wires and bonding points of the chip to be tested, as well as the sizes of various spatial parts, reducing human errors caused by naked eye observation through a microscope.

[0024] The present application provides an automated testing device for the tensile and shear forces of chip bonding. The device utilizes a trained path acquisition model to identify and judge the spatial distribution 3D image of the chip. Combined with the size of the pull hook or push knife, the device calculates the movement path of the pull hook or push knife above the chip, thereby accurately avoiding damage caused by the pull hook or push knife colliding with the bonding wires and bonding points on the chip during manual operation, thereby improving production efficiency and reducing unnecessary damage.

[0025] The present application provides an automated testing method for chip bonding tension and shear force, which uses a trained path acquisition model to calculate the movement path of a puller or pusher above the chip. If the size of the puller or pusher cannot calculate a motion path that meets the requirements, a smaller puller or pusher is selected and the path acquisition model is used again for calculation. This method greatly improves the ability to test the bonding tension and shear force of smaller advanced packaging chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the structure of the automated testing device for chip bonding tension and shear force provided in an embodiment of the present application;

[0027] Figure 2 Schematic diagram of a push-pull force applying unit in a chip bonding tension and shearing automated testing device provided in an embodiment of the present application;

[0028] Figure 3 Schematic diagram of the process of the automated testing method for chip bonding tension and shear force provided in the embodiment of the present application. DETAILED DESCRIPTION

[0029] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0030] like Figure 1 As shown, the embodiment of the present application provides an automatic testing device for chip bonding tension and shear force, comprising:

[0031] The sample stage is used to fix the chip to be processed to ensure that the spatial position of the sample itself does not change during the push-pull test;

[0032] A three-dimensional scanning unit is used to determine the spatial distribution of bonding wires and bonding points of the chip to be processed, generate a 3D image of the spatial distribution, and transmit it to the path acquisition unit;

[0033] A path acquisition unit is used to use the trained path acquisition model to identify and judge the spatial distribution 3D imaging of the chip bonding wires and bonding points to calculate the movement path of the puller or pusher;

[0034] The push-pull force application unit is equipped with pull hooks or push knife tools of different sizes and ranges, which are used to apply tension to the bonding wires of the chip to be processed or shear force to the bonding points. The mechanical sensor records the force value that the chip to be processed can withstand for the purpose of collecting bonding and shear strength data.

[0035] The mobile control unit is used to transport the push-pull force applying unit to the designated location along the path planned by the path acquisition unit and perform push-pull force testing actions, such as Figure 2 shown.

[0036] like Figure 3 As shown, the present application also provides a chip bonding tensile force and shear force automated testing method, comprising the following steps:

[0037] Step 1: Fix the chip to be processed on the sample stage to ensure that the spatial position of the sample itself does not change during the push-pull test;

[0038] Step 2: Determine the spatial distribution of bonding wires and bonding points of the chip to be processed through three-dimensional scanning, and generate a 3D image of the spatial distribution;

[0039] Step 3: Using the trained path acquisition model, the 3D image of the chip's spatial distribution is identified and judged, and the motion path of the retractor or pusher is calculated so that it can hover at a specified position near the bonding wire and bonding point;

[0040] Step 4: Determine whether the motion path of the retractor or pusher calculated in step 3 meets the requirements. If so, go to step 5; otherwise, change the size of the retractor or pusher and repeat the calculation in step 3.

[0041] Step 5: According to the material and diameter of the bonding wire, set the push and pull force according to the corresponding standard specifications, start the test program to move the hook or push knife to make it contact the chip bonding wire or bonding point, and measure the pulling force or pushing force during the contact process to obtain the bonding and shear strength data of the chip.

[0042] Further preferably, the path acquisition model is obtained by learning and training based on a large number of samples to obtain the model's path acquisition capability for different chips; these samples come from a large number of physical chips to be tested.

[0043] Further preferably, a trained path acquisition model is used to identify the spatial distribution 3D image generated by the three-dimensional scanning of the chip to be tested, and the optimal path for moving a pusher or retractor of a certain size to a fixed point to be tested is calculated and planned; when the pusher or retractor is actually moved along the planned path, whether it collides with the internal structure of the chip can be used to determine whether the path acquisition has achieved the target requirements. More specifically, the following steps are included:

[0044] It is required that during the entire movement of the pull hook or push knife along the motion path, the push knife or pull hook must avoid contacting the chip itself, thereby causing destructive damage to the chip structure itself;

[0045] Ultimately, the puller or pusher can hover at a specified position near the bonding wire and bonding point, such as directly below the bonding wire or flush with the side of the bonding point. It is required that the pusher or puller does not touch the chip during hovering, otherwise it will affect the test force value.

[0046] Further preferably, the present application provides a chip bonding tensile force and shear force automated testing method, further comprising the following steps:

[0047] If the path acquisition model cannot calculate a motion path that meets the requirements, it proves that the hook or pusher of that size cannot be used for the bonding and shear strength tests of the chip to be processed. Then, a smaller hook or pusher is selected and the path acquisition model is used again to calculate the appropriate motion path for the hook or pusher.

[0048] If you still cannot get an effective hook or pusher motion path, repeat the above steps and continue to change the hook or pusher size and calculate until you get a path that meets the requirements.

[0049] If there is no smaller puller or pusher size available and the ideal movement path of the puller or pusher is still not obtained, it means that it is impossible to perform bonding and shear strength tests on the chip to be processed. The test is terminated and a smaller puller or pusher tooling needs to be evaluated and customized later.

[0050] It should be further explained that the path acquisition model uses big data processing and machine learning technology to collect samples and train models to obtain an AI recognition model. The specific training process can be implemented using conventional model training methods, and there is no specific limitation.

[0051] In summary, compared with the prior art, this application has the following advantages:

[0052] This application fixes the chip to be processed by a sample table, and then uses a three-dimensional scanning unit to scan the chip to be tested, which can ensure that the spatial position of the chip to be processed itself does not change during the push-pull force test. The three-dimensional scanning generates a 3D imaging diagram of the spatial distribution of the chip to be processed, which can accurately point out the distribution of bonding wires and bonding points of the chip to be tested, as well as the size of each part of the space, reducing the human error caused by naked eye observation through a microscope.

[0053] This application uses a trained path acquisition model to identify and judge the spatial distribution 3D image of the chip, and combines the size of the pull hook or push knife to calculate the movement path of the pull hook or push knife above the chip, accurately avoiding damage caused by the pull hook or push knife colliding with the bonding wires and bonding points on the chip during manual operation, thereby improving production efficiency and reducing unnecessary damage.

[0054] This application uses a trained path acquisition model to calculate the movement path of a puller or pusher above the chip. If the size of the puller or pusher cannot calculate a movement path that meets the requirements, a smaller puller or pusher is selected and the path acquisition model is used again for calculation. This method greatly improves the ability to test the bonding tension and shear force of smaller advanced packaging chips.

[0055] It should be understood that expressions such as "include" and "may include" used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "include" and "have" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0056] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense.

[0057] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A chip bonding tensile and shear force automated testing method based on a chip bonding tensile and shear force automated testing device, characterized in that: The following steps are involved: Step S1: determining the spatial distribution of bonding wires and bonding points of the chip to be processed by three-dimensional scanning, and generating a 3D imaging map of the spatial distribution; Step S2: Using the trained path acquisition model, the spatial distribution 3D image of the chip to be processed is identified and judged, and the motion path of the retractor or pusher is calculated so that the retractor or pusher hovers at the corresponding position between the bonding wire and the bonding point; Step S3: Determine whether the motion path of the retractor or pusher calculated in step S2 meets the requirements. If so, go to step S4; otherwise, change the size of the retractor or pusher and go to step S2. Step S4: According to the material and diameter of the bonding wire, the push and pull forces are set, and the hook or push knife is moved to contact the bonding wire or bonding point of the chip to be processed. The push or pull force during the contact process is measured to obtain the bonding and shear strength data of the chip to be processed. Step S3 specifically includes the following steps: Determine whether the hook or pusher contacts the chip to be processed during its movement along the motion path, and whether the hook or pusher can hover directly below the bonding wire or on the side of the bonding point. If all of these conditions are met, determine whether the path acquisition model has calculated a motion path that meets the requirements. Otherwise, select a smaller hook or pusher and execute step S2. If the motion path that meets the requirements still cannot be obtained, continue to reduce the size of the hook or pusher and execute step S2 until a motion path that meets the requirements is obtained. If the smallest hook or pusher is used to execute step S2 and the obtained motion path cannot meet the requirements, terminate the push-pull force test. Among them, the automated testing device for chip bonding tension and shear force includes: a sample stage, a three-dimensional scanning unit, a path acquisition unit, a push-pull force applying unit and a movement control unit; A push-pull force applying unit is provided above the sample stage; the movement control unit is connected to the push-pull force applying unit; the three-dimensional scanning unit is connected to the path acquisition unit; The sample table is used to fix the chip to be processed; the three-dimensional scanning unit is used to determine the spatial distribution of the bonding wires and bonding points of the chip to be processed, generate a 3D image of the spatial distribution, and transmit it to the path acquisition unit; the path acquisition unit is used to identify and judge the 3D image of the spatial distribution of the bonding wires and bonding points of the chip to be processed, and calculate the movement path of the puller or pusher; the push-pull force applying unit is equipped with pullers or pusher tooling of different sizes and ranges, which is used to apply tension to the coupling wires of the chip to be processed or shear force to the bonding points, and record the force value that the chip to be processed can accept through the force sensor; the mobile control unit is used to transport the push-pull force applying unit to the designated position along the path planned by the path acquisition unit, and perform push-pull force testing actions.

2. The automated testing method according to claim 1, wherein: The path acquisition model is learned and trained based on samples to achieve the path acquisition capabilities of different chips.

3. The automated testing method according to claim 2, wherein: The path acquisition model uses big data processing and machine learning technology to collect samples and train models to obtain an AI recognition model.

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