Display screen, display module and manufacturing process thereof

Abstract

The present invention provides a display screen, a display module, and a manufacturing process thereof. The display module includes a control circuit board and a lamp bead. The control circuit board includes a board body and a solder pad provided on the board body. A mounting groove is provided on the surface of the board body. The solder pad includes a recessed portion and an extension portion. The recessed portion is provided in the mounting groove. One side of the recessed portion is open and the interior is hollow to form a groove structure. The opening direction of the recessed portion is the same as the notch direction of the mounting groove. The extension portion is connected to the outer periphery of the recessed portion opening. The lamp bead includes a light-emitting body and a pin connected to the light-emitting body. The pin includes a main body and a pillar. The main body is electrically connected to the light-emitting body. The pillar is connected to the side of the main body facing away from the light-emitting body. The outer edge of the main body extends outwardly beyond the circumference of the pillar. The pillar is passed through and fixed inside the recessed portion. The portion of the main body that extends beyond the pillar is fixed to the surface of the extension portion, thereby increasing the connection area between the pin and the solder pad, improving the stability of the connection between the lamp bead and the control circuit board, and enhancing the thrust of the lamp bead.

Description

Technical Field

[0001] The present invention relates to the technical field of display screens, and in particular to a display screen, a display module and a manufacturing process thereof. Background Art

[0002] LED (Light Emitting Diode) display screens have the characteristics of high brightness, bright colors, high luminous efficiency, high contrast, short response time, wide operating temperature range, and low energy consumption. They are widely used in stage display equipment, advertising display equipment, data visualization display equipment, and commercial display equipment.

[0003] As LED displays become increasingly popular, the requirements for stage rental displays are also becoming increasingly demanding. Existing LED displays use LED lamps that are directly soldered to the PCB (printed circuit board) using solder paste, resulting in a relatively low thrust force (the strength of the LED lamps' adhesion to the PCB during soldering).

[0004] In this way, since rental display screens are often disassembled and assembled, collisions are prone to occur during the disassembly and assembly process. If the thrust of the LED lamp beads is small, it is easy to cause the LED lamp beads of the display screen to fall off, thereby affecting the effect of the entire LED display screen. Summary of the Invention

[0005] The purpose of the present invention is to provide a display screen with high lamp bead thrust, a display module and a manufacturing process thereof.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] According to one aspect of the present application, the present application provides a display module, comprising:

[0008] A control circuit board includes a board body and a solder pad disposed on the board body, wherein a mounting groove is disposed on a surface of the board body, and the solder pad includes a recessed portion and an extension portion, wherein the recessed portion is disposed within the mounting groove; one side of the recessed portion is open and hollow inside to form a groove structure, and the direction of the recessed portion opening is the same as the direction of the notch of the mounting groove; and the extension portion is connected to the outer periphery of the recessed portion opening;

[0009] A lamp bead includes a light-emitting body and a pin connected to the light-emitting body; the pin includes a main body and a pillar, the main body is electrically connected to the light-emitting body, and the pillar is connected to the side of the main body away from the light-emitting body; the outer edge of the main body extends outward beyond the circumference of the pillar, the pillar is passed through and fixed inside the recessed portion, and the portion of the main body that extends beyond the pillar is fixed to the surface of the extension portion.

[0010] In some embodiments, the extension portion is disposed around the outer periphery of the opening of the recessed portion;

[0011] The outer periphery of the main body extends outwardly beyond the peripheral side of the pillar along the circumferential direction;

[0012] The outer periphery of the end portion of the main body close to the pillar is flush with the outer periphery of the extension portion, or the outer periphery of the extension portion extends outwardly beyond the main body portion.

[0013] In some embodiments, the surface of the extension portion facing away from the plate body transitions smoothly to the inner peripheral wall of the recessed portion.

[0014] In some embodiments, the cross-sectional area of ​​the pillar is 0.6 to 0.9 times the cross-sectional area of ​​the main body;

[0015] The relationship between the height h of the pillar and the height H of the main body is: 1.2H≤h≤2H.

[0016] In some embodiments, the shape of the pillar matches the shape of the recess;

[0017] The cross-sectional area of ​​the structure enclosed by the inner peripheral wall of the recessed portion is 1 to 1.2 times the cross-sectional area of ​​the pillar; the relationship between the height h of the pillar and the depth m of the recessed portion is: h≤m.

[0018] In some embodiments, the control circuit board includes a solder resist ink layer, which is disposed on the surface of the board body and located at the periphery of the extension portion;

[0019] The surface of the solder resist ink layer facing away from the board body is flush with the surface of the extension portion facing away from the board body.

[0020] In some embodiments, a first welding layer is provided between the recessed portion and the outer periphery of the pillar, and the first welding layer is used for welding and fixing the recessed portion and the pillar;

[0021] A second welding layer is provided between the main body and the extension portion, and the second welding layer is used for welding and fixing the extension portion and the main body.

[0022] According to another aspect of the present application, the present application also provides a display screen, comprising a back panel and a display module as described in any one of the above items, wherein the display module is connected and fixed to the back panel.

[0023] According to another aspect of the present application, the present application also provides a process for manufacturing a display module, comprising the following steps:

[0024] A lamp bead to be mounted and a control circuit board are provided. The lamp bead includes a light-emitting body and a pin connected to the light-emitting body. The pin includes a main body portion and a support. The main body portion is electrically connected to the light-emitting body, and the support is connected to a side of the main body portion facing away from the light-emitting body. The outer edge of the main body portion extends outwardly beyond the periphery of the support. A mounting groove is formed on the plate body of the control circuit board.

[0025] A soldering pad is provided on the inner peripheral wall of the mounting groove of the plate body and on the outer periphery of the groove opening thereof, wherein the soldering pad includes a recessed portion with one side open and a hollow interior forming a groove structure and an extension portion connected to the outer periphery of the recessed portion opening;

[0026] Solder paste is provided on the soldering pad of the control circuit board, and the lamp beads are placed on the soldering pad of the control circuit board, so that the control circuit board and the lamp beads form a unit structure to be soldered;

[0027] The unit structure to be welded is welded so that the solder paste is combined between the pillar and the recessed portion and between the main body and the extending portion, thereby completing the welding to obtain a display module.

[0028] In some embodiments, solder paste is disposed in the recessed portion to form a solder paste layer; a distance between a surface of the solder paste layer facing the extension portion and a surface of the extension portion facing away from the board body is less than or equal to a height of the pillar.

[0029] It can be seen from the above technical solutions that the present invention has at least the following advantages and positive effects:

[0030] In the display module of the present application, the pad includes a recessed portion and an extension portion, and the pin includes a main portion and a support. The support of the pin is inserted into the recessed portion and fixedly connected to the recessed portion, and the main portion can be fixedly attached to the extension portion.

[0031] Compared to existing technologies, the present invention's solution connects the perimeter of the pillar to the recessed portion, increasing the connection area between the pin and the pad, thereby increasing soldering force by 20% to 50%. Furthermore, the method of inserting the pillar into the recessed portion and securing it there generates a fixed thrust, thereby improving the stability of the connection between the pins of the lamp bead and the control circuit board, enhancing the thrust of the lamp bead, and improving the stability of the overall structure of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematic diagram of the structure of the display module in this embodiment.

[0033] Figure 2 yes Figure 1 Schematic diagram along the AA direction.

[0034] Figure 3 yes Figure 2 Enlarged structural diagram at point B in the middle.

[0035] Figure 4 yes Figure 2 Enlarged structural diagram at point C in the middle.

[0036] Figure 5 Schematic diagram of the structure of the lamp bead in this embodiment.

[0037] Figure 6 FIG. 1 is a flow chart of the manufacturing process of the display module in this embodiment.

[0038] Figure 7 It is a structural diagram of the manufacturing process of the display module in this embodiment.

[0039] The following are the descriptions of the reference numerals:

[0040] 1. Control circuit board; 11. Board body; 111. Mounting slot; 12. Solder pad; 121. Recessed portion; 122. Extension portion; 13. Solder resist ink layer; 2. Lamp beads; 21. Pins; 211. Main body; 212. Pillar; 22. Injection molding body; 31. First soldering layer; 32. Second soldering layer; 4. Solder paste layer. DETAILED DESCRIPTION

[0041] Typical embodiments embodying the features and advantages of the present invention are described in detail in the following description. It should be understood that the present invention is capable of various variations in different embodiments without departing from the scope of the present invention, and that the descriptions and illustrations herein are intended to be illustrative rather than limiting.

[0042] In the description of this application, it should be understood that in the embodiments shown in the drawings, indications of directions or positional relationships (such as up, down, left, right, front, and back) are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions will also change accordingly.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0044] The present application provides a display module that can be used for a display screen.

[0045] The following describes in detail the specific embodiments of the display module of the present application with reference to the accompanying drawings.

[0046] Figure 1 is a schematic diagram of the structure of the display module in this embodiment, Figure 2 for Figure 1 Schematic diagram along the AA direction, Figure 3 for Figure 2 Enlarged structural diagram at point B in the middle.

[0047] refer to Figures 1 to 3 The display module includes a control circuit board 1 and a lamp bead 2. The control circuit board 1 includes a board body 11 and a solder pad 12 provided on the board body 11. A mounting groove 111 is provided on the surface of the board body 11. The solder pad 12 includes a recessed portion 121 and an extension portion 122. The recessed portion 121 is provided in the mounting groove 111. One side of the recessed portion 121 is open and the interior is hollow to form a groove structure. The opening direction of the recessed portion 121 is the same as the notch direction of the mounting groove 111. The extension portion 122 is connected to the outer periphery of the opening of the recessed portion 121. The lamp bead 2 includes a light-emitting body and a pin 21 connected to the light-emitting body. The pin 21 includes a main body 211 and a pillar 212. The main body 211 is electrically connected to the light-emitting body, and the pillar 212 is connected to the side of the main body 211 facing away from the light-emitting body. The outer edge of the main body 211 extends outward beyond the peripheral side of the pillar 212. The support post 212 is fixedly disposed inside the recessed portion 121 , and the portion of the main body 211 extending beyond the support post 212 is fixedly attached to the surface of the extending portion 122 .

[0048] In the above display module, the pad 12 includes a recessed portion 121 and an extension portion 122, and the pin 21 includes a main portion 211 and a support 212. The support 212 of the pin 21 is disposed within the recessed portion 121 and is connected and fixed to the recessed portion 121, while the main portion 211 can be fixedly attached to the extension portion 122.

[0049] Compared to the prior art, the technical solution of this application connects the circumference of the pillar 212 to the recess 121, thereby increasing the connection area between the pin 21 and the pad 12 and improving the welding thrust by 20% to 50%. Furthermore, the method of extending the pillar 212 into the recess 121 and fixing it to the recess 121 can also generate a fixed thrust, thereby improving the stability of the connection between the pin 21 of the lamp bead 2 and the control circuit board 1, enhancing the thrust of the lamp bead 2, and improving the stability of the overall structure of the display module.

[0050] refer to Figure 2 and Figure 3 The control circuit board 1 includes a board body 11 and a solder pad 12 provided on the board body 11 .

[0051] A mounting groove 111 with one side open is defined on the surface of the plate 11 .

[0052] In this embodiment, there are multiple mounting slots 111 , and the multiple mounting slots 111 are distributed on the plate body 11 in an array.

[0053] There are multiple solder pads 12 , which are distributed in an array, and the solder pads 12 are arranged in a one-to-one correspondence with the mounting slots 111 .

[0054] Figure 4 for Figure 2 Enlarged structural diagram at point C in the middle.

[0055] refer to Figure 3 and Figure 4 In this embodiment, the pad 12 includes a recessed portion 121 and an extended portion 122 .

[0056] The recessed portion 121 is disposed within the mounting groove 111. In this embodiment, the recessed portion 121 is adapted to the mounting groove 111 in shape and size, so that the outer periphery of the recessed portion 121 can fit closely with the inner peripheral wall of the mounting groove 111. This improves the stability of the connection between the recessed portion 121 and the plate body 11 after the recessed portion 121 is fixedly connected to the plate body 11, and makes the structure formed after the recessed portion 121 and the plate body 11 connected compact.

[0057] In this embodiment, the cross section of the recessed portion 121 may be in a regular shape such as a circle or a rectangle, so that the recessed portion 121 has a simple structure and is easy to manufacture.

[0058] In other embodiments, the recessed portion 121 may also be in the form of other irregular polygons. The specific configuration depends on the actual needs and is not limited here.

[0059] In this embodiment, one side of the recessed portion 121 is open and hollow, forming a groove structure. The opening of the recessed portion 121 is oriented in the same direction as the notch of the mounting slot 111. In other words, the interior of the recessed portion 121 is connected to the exterior through the opening. The interior of the recessed portion 121 is used to store solder paste. Solder paste is used as a soldering material. When heated to a high temperature, it melts to form liquid tin, which then cools to form a solder layer.

[0060] The extension portion 122 is connected to the outer periphery of the opening of the recessed portion 121 and is fixedly attached to the surface of the plate body 11 .

[0061] In this embodiment, the extension portion 122 is disposed around the outer periphery of the opening of the recessed portion 121. The surface of the extension portion 122 facing away from the plate body 11 forms a smooth transition with the inner circumferential wall of the recessed portion 121, thereby improving the continuity of the junction between the surface of the extension portion 122 facing away from the plate body 11 and the inner circumferential wall of the recessed portion 121. In other words, the extension portion 122 has an annular structure with an opening.

[0062] In this embodiment, the outer contour of the extension portion 122 can be a regular shape such as a circle or a rectangle, which has a simple structure and is easy to manufacture. The shape of the inner peripheral wall is consistent with the shape of the outer peripheral wall at the opening of the recessed portion 121.

[0063] In other embodiments, the outer contour of the extension portion 122 may also be other irregular polygonal shapes. The specific configuration depends on the actual needs and is not limited here.

[0064] In this embodiment, the extension portion 122 and the recessed portion 121 are integrally formed. For example, the extension portion 122 and the recessed portion 121 can be integrally formed by injection molding, which has a simple manufacturing process and is easy to operate.

[0065] refer to Figures 2 to 4 In this embodiment, the control circuit board 1 also includes a solder resist ink layer 13, which is provided on the surface of the board body 11 and located at the periphery of the extension portion 122, and is used to protect the circuit on the board body 11 and prevent the board body 11 from corrosion.

[0066] In this embodiment, the surface of the solder resist ink layer 13 facing away from the board body 11 is flush with the surface of the extension portion 122 facing away from the board body 11 , which can improve the flatness of the surface of the control circuit board 1 .

[0067] refer to Figure 1 、 Figure 2 There are multiple lamp beads 2, and the multiple lamp beads 2 are distributed in an array on the control circuit board 1.

[0068] Figure 5 Schematic diagram of the structure of the lamp bead 2 in this embodiment.

[0069] refer to Figures 1 to 3 、 Figure 5 The lamp bead 2 includes a light-emitting body and pins 21. The light-emitting body is used to emit light. Pins 21 are connected to the light-emitting body and are used to electrically connect to the control circuit board 1, thereby achieving an electrical connection between the light-emitting body and the control circuit board 1, allowing the control circuit board 1 to power the light-emitting body and enable the light-emitting body to emit light.

[0070] In this embodiment, each lamp bead 2 has four pins 21 , which are distributed in an array and are connected one-to-one with four adjacent solder pads 12 of the control circuit board 1 that are distributed in an array.

[0071] In other embodiments, the number of pins 21 of each lamp bead 2 may also be one, two, three, or five or more, and the specific setting depends on the needs.

[0072] refer to Figure 2 、 Figure 3 and Figure 5In this embodiment, each pin 21 includes a main body 211 and a support 212. The main body 211 is electrically connected to the light-emitting body, and the support 212 is connected to the side of the main body 211 facing away from the light-emitting body. The outer edge of the main body 211 extends outwardly beyond the peripheral side of the support 212.

[0073] In this embodiment, the outer periphery of the main body 211 extends outwardly along the circumferential direction beyond the circumferential side of the support 212. Specifically, the support 212 is located in the middle of the main body 211.

[0074] In other embodiments, a portion of the outer edge of the main body 211 extends outward beyond the periphery of the support 212, and another portion of the outer edge of the main body 211 is flush with the periphery of the support 212. The specific configuration depends on the needs.

[0075] Specifically, in this embodiment, the cross-sectional area of ​​the support 212 is 0.6 to 0.9 times the cross-sectional area of ​​the main body 211. The relationship between the height h of the support 212 and the height H of the main body 211 is: 1.2H ≤ h ≤ 2H. This design ensures that the outer edge of the main body 211 extends outwardly beyond the perimeter of the support 212 while also ensuring the strength of the support 212, resulting in a larger outer peripheral area for the support 212.

[0076] In this embodiment, the support 212 is fixedly positioned within the recessed portion 121. Specifically, a first soldering layer 31 is provided between the outer periphery of the support 212 and the recessed portion 121. The first soldering layer 31 is used to securely secure the recessed portion 121 to the support 212. In this embodiment, the first soldering layer 31 is formed by cooling liquid tin formed by melting solder paste.

[0077] Since the cross-sectional area of ​​the pillar 212 is 0.6 to 0.9 times the cross-sectional area of ​​the main body 211, and since the relationship between the height h of the pillar 212 and the height H of the main body 211 is: 1.2H≤h≤2H, the pillar 212 has a larger peripheral area, thereby ensuring a larger connection area between the pillar 212 and the recessed portion 121, thereby enhancing the connection strength and stability between the pillar 212 and the recessed portion 121.

[0078] The shape of the support 212 is adapted to the shape of the recessed portion 121 , so that the support 212 can extend into the recessed portion 121 and be adapted to be connected with the recessed portion 121 .

[0079] In this embodiment, the cross-sectional area of ​​the structure formed by the inner circumferential wall of the recess 121 is 1 to 1.2 times the cross-sectional area of ​​the pillar 212. This ensures that the pillar 212 can extend into the recess 121 while also ensuring that the distance of the gap between the pillar 212 and the recess 121 is of appropriate size.

[0080] The relationship between the height h of the support 212 and the depth m of the recess 121 is: h≤m. This ensures that the support 212 extends out of the recess 121 when the support 212 extends into the recess 121 .

[0081] In this embodiment, the cross section of the pillar 212 can be a regular shape such as a circle or a rectangle, so that the structure of the recessed portion 121 is simple and easy to manufacture.

[0082] In other embodiments, the pillars 212 may also be in the form of other irregular polygons. The specific configuration depends on the actual needs and is not limited here.

[0083] In this embodiment, the portion of the main body 211 that extends beyond the support 212 is fixedly connected to the extension 122. Specifically, a second soldering layer 32 is provided between the main body 211 and the extension 122. The second soldering layer 32 is used to solder the extension 122 to the main body 211. The first soldering layer 31 is formed by cooling liquid tin formed by melting solder paste.

[0084] Because the main body 211 extends outwardly beyond the support 212 in the circumferential direction and corresponds to the annular extension 122, a connection between the main body 211 and the extension 122 exists along the periphery of the support 212, thereby improving the connection strength and stability between the lead 21 and the pad 12. Specifically, the support 212 is located in the middle of the main body 211, which helps to balance the connection stability between the portion of the main body 211 located on the periphery of the support 212 and the extension 122.

[0085] Moreover, since the relationship between the height h of the pillar 212 and the depth m of the recessed portion 121 is: h≤m, when the pillar 212 is inserted into the recessed portion 121, the end of the pillar 212 close to the main body 211 can extend out of the recessed portion 121, thereby creating a gap of an appropriate distance between the main body 211 and the extension portion 122.

[0086] In this embodiment, the outer periphery of the end of the main body 211 close to the pillar 212 is flush with the outer periphery of the extension portion 122, or the outer periphery of the extension portion 122 extends outward from the main body 211, so that the surface of the part of the main body 211 that extends outward from the peripheral side of the pillar 212 and is away from the light-emitting body can be completely fitted and fixed with the surface of the extension portion 122, so as to ensure that there is a larger contact area and connection area between the main body 211 and the extension portion 122.

[0087] In this embodiment, the outer contour of the main body 211 can be a regular shape such as a circle or a rectangle, which is simple in structure and easy to manufacture. In other embodiments, the outer contour of the main body 211 can also be other irregular polygons. The specific configuration is determined according to needs and is not limited here.

[0088] Among them, the outer contour of the main body 211 can be the same as or different from the outer contour of the extension part 122. The specific setting depends on the needs, ensuring that the outer periphery of the main body 211 is flush with the outer periphery of the extension part 122 or the outer periphery of the extension part 122 extends outward beyond the main body 211.

[0089] In this embodiment, the lamp bead 2 further includes an injection molded body 22, which is used to encapsulate the light-emitting body. That is, the light-emitting body is disposed inside the injection molded body 22. At this time, one end of the main body 211 of the pin 21 extends into the injection molded body 22 and connects to the light-emitting body, and the other end extends out of the injection molded body 22 in a direction away from the light-emitting body.

[0090] According to another aspect of the present application, a display screen is provided, comprising the display module described above. The display screen further comprises a back plate to which the display module is fixedly connected. The back plate can enhance the structural strength of the display screen and protect the display module.

[0091] Figure 6 shows a flow chart of the manufacturing process of the display module, Figure 7 FIG. 1 is a structural diagram of the manufacturing process of the display module in this embodiment.

[0092] refer to Figure 6 and Figure 7 According to another aspect of the present application, the present application also provides a process for manufacturing a display module, comprising the following steps:

[0093] S1. Provide a lamp bead 2 to be mounted and a control circuit board 1. The lamp bead 2 includes a light-emitting element and pins 21 connected to the light-emitting element. Pins 21 include a main body 211 and a support 212. The main body 211 is electrically connected to the light-emitting element, and the support 212 is connected to the side of the main body 211 facing away from the light-emitting element. The outer edge of the main body 211 extends outwardly beyond the perimeter of the support 212. The control circuit board 1 has a mounting groove 111 formed on the board body 11.

[0094] S2. A soldering pad 12 is arranged on the inner wall of the mounting groove 111 of the plate body 11 and on the outer periphery of the groove opening, so that the soldering pad 12 includes a recessed portion 121 with an open side and a hollow interior to form a groove structure, and an extension portion 122 connected to the outer periphery of the opening of the recessed portion 121.

[0095] S3. Place solder paste on the pad 12 of the control circuit board 1 and place the lamp bead 2 on the pad 12 of the control circuit board 1 so that the control circuit board 1 and the lamp bead 2 form a unit structure to be soldered.

[0096] S4. Solder the unit structure to be soldered so that the solder paste is combined between the pillar 212 and the recessed portion 121 and between the main body 211 and the extending portion 122, thereby completing the soldering to obtain a display module.

[0097] refer to Figure 6 and Figure 7 In step S1, the cross-sectional area of ​​the pillar 212 of the pin 21 is 0.6 to 0.9 times the cross-sectional area of ​​the main body 211. The relationship between the height h of the pillar 212 and the height H of the main body 211 is: 1.2H≤h≤2H.

[0098] In some embodiments, after completing step S1 and before proceeding to step S2, the solder pad 12 can be formed by integral injection molding according to the shape and size of the mounting groove 111, and then step S2 is performed to fix the solder pad 12 to the inner wall of the mounting groove 111 of the board body 11 and the outer periphery of the groove.

[0099] In other embodiments, after completing step S1 , step S2 may be directly performed, that is, a plate-like structure may be directly pressed onto the inner peripheral wall of the mounting groove 111 of the board body 11 and the outer periphery of the groove opening by pressing technology to form the solder pad 12 .

[0100] In this embodiment, the cross-sectional area of ​​the structure enclosed by the inner peripheral wall of the recessed portion 121 is 1 to 1.2 times the cross-sectional area of ​​the support 212 of the lead 21 of the lamp bead 2. The relationship between the height h of the support 212 and the depth m of the recessed portion 121 is: h ≤ m. This design ensures that the outer edge of the main body 211 extends outwardly beyond the perimeter of the support 212 while also ensuring the strength of the support 212, resulting in a larger outer peripheral area for the support 212.

[0101] In step S2, the outer periphery of the recessed portion 121 is fitted and fixed to the inner peripheral wall of the mounting groove 111 on the plate body 11, and the extension portion 122 is fitted and fixed to the plate body 11 at the outer periphery of the notch of the mounting groove 111. In this way, after the recessed portion 121 and the extension portion 122 are fixedly connected to the plate body 11, the stability of the connection between the recessed portion 121 and the plate body 11 can be improved, and the stability of the connection between the extension portion 122 and the plate body 11 can also be improved, and the compactness of the structure formed after the recessed portion 121 and the extension portion 122 are connected to the plate body 11 can be achieved.

[0102] After completing step S2 , step S3 is performed to place solder paste in the recessed portion 121 so as to form a solder paste layer 4 in the recessed portion 121 .

[0103] The distance between the surface of the solder paste layer 4 formed in step S3 facing the extension portion 122 and the surface of the extension portion 122 facing away from the board 11 is less than or equal to the height of the pillar 212 .

[0104] In step S3 , the lamp bead 2 is mounted on the pad 12 by a mounting device.

[0105] In the unit structure to be soldered formed in step S3, the cross-sectional area of ​​the structure enclosed by the inner peripheral wall of the recessed portion 121 of the soldering pad 12 of the control circuit board 1 is 1 to 1.2 times the cross-sectional area of ​​the support 212 of the pin 21 of the lamp bead 2. This ensures that the support 212 can extend into the recessed portion 121 while also ensuring that the distance between the support 212 and the recessed portion 121 is appropriately sized. At the same time, since the relationship between the height h of the support 212 and the depth m of the recessed portion 121 is: h≤m, when the support 212 extends into the recessed portion 121, it can ensure that the support 212 extends out of the recessed portion 121 and ensures that the distance between the main body 211 and the extension portion 122 is appropriately sized.

[0106] After completing step S3, step S4 is performed to perform reflow soldering on the unit structure to be soldered in a reflow furnace.

[0107] During the reflow soldering process, the solder paste in the recessed portion 121 melts into liquid tin. Under the pressure of the lamp bead 2 and because there is a gap of appropriate distance between the pillar 212 and the recessed portion 121, the liquid tin in the recessed portion 121 climbs along the gap between the pillar 212 and the recessed portion 121, filling the gap between the pillar 212 and the recessed portion 121, and after cooling, a first soldering layer 31 is formed between the pillar 212 and the recessed portion 121, thereby fixing the pillar 212 and the recessed portion 121. At the same time, due to the appropriate gap between the main body 211 and the extension 122, the liquid tin can creep along the gap between the pillar 212 and the recessed portion 121 to the gap between the main body 211 and the extension 122, and continue to creep along the gap between the main body 211 and the extension 122, thereby filling the gap between the main body 211 and the edge portion. After cooling, a second solder layer 32 is formed between the main body 211 and the extension 122, thereby fixing the main body 211 and the extension 122. At this point, the welding and fixing of the unit structure to be welded is completed.

[0108] It can be seen from the above technical solutions that the present invention has at least the following advantages and positive effects:

[0109] In the display module of the present application, the pad includes a recessed portion and an extension portion, and the pin includes a main portion and a support. The support of the pin is inserted into the recessed portion and fixedly connected to the recessed portion, and the main portion can be fixedly attached to the extension portion.

[0110] Compared to existing technologies, the present invention's solution connects the perimeter of the pillar to the recessed portion, increasing the connection area between the pin and the pad, thereby increasing soldering force by 20% to 50%. Furthermore, the method of inserting the pillar into the recessed portion and securing it there generates a fixed thrust, thereby improving the stability of the connection between the pins of the lamp bead and the control circuit board, enhancing the thrust of the lamp bead, and improving the stability of the overall structure of the display module.

[0111] While the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are intended to be illustrative and exemplary rather than restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope of the appended claims. All changes and modifications that fall within the scope of the claims or their equivalents are intended to be covered by the appended claims.

Claims

1. A display module, characterized in that: include: A control circuit board includes a board body and a solder pad disposed on the board body, wherein a mounting groove is disposed on a surface of the board body, and the solder pad includes a recessed portion and an extension portion, wherein the recessed portion is disposed within the mounting groove; one side of the recessed portion is open and hollow inside to form a groove structure, and the direction of the recessed portion opening is the same as the direction of the notch of the mounting groove; and the extension portion is connected to the outer periphery of the recessed portion opening; A lamp bead includes a light-emitting body and a pin connected to the light-emitting body; the pin includes a main body and a pillar, the main body is electrically connected to the light-emitting body, and the pillar is connected to the side of the main body away from the light-emitting body; the outer edge of the main body extends outward beyond the circumference of the pillar, the pillar is passed through and fixed inside the recessed portion, and the portion of the main body that extends beyond the pillar is fixed to the surface of the extension portion.

2. The display module according to claim 1, wherein: The extension portion is arranged around the outer periphery of the opening of the recessed portion; The outer periphery of the main body extends outwardly beyond the peripheral side of the pillar along the circumferential direction; The outer periphery of the end portion of the main body portion close to the pillar is flush with the outer periphery of the extension portion, or the outer periphery of the extension portion extends outwardly beyond the main body portion.

3. The display module according to claim 1, wherein: The surface of the extension portion facing away from the plate body transitions smoothly to the inner peripheral wall of the recessed portion.

4. The display module according to claim 1, wherein: The cross-sectional area of ​​the pillar is 0.6 to 0.9 times the cross-sectional area of ​​the main body; The relationship between the height h of the pillar and the height H of the main body is: 1.2H≤h≤2H.

5. The display module according to claim 1, wherein: The shape of the pillar is adapted to the shape of the recessed portion; The cross-sectional area of ​​the structure enclosed by the inner peripheral wall of the recessed portion is 1 to 1.2 times the cross-sectional area of ​​the pillar; the relationship between the height h of the pillar and the depth m of the recessed portion is: h≤m.

6. The display module according to claim 1, wherein: The control circuit board includes a solder resist ink layer, which is provided on the surface of the board body and located at the periphery of the extension portion; The surface of the solder resist ink layer facing away from the board body is flush with the surface of the extension portion facing away from the board body.

7. The display module according to claim 1, wherein: A first welding layer is provided between the recessed portion and the outer periphery of the pillar, and the first welding layer is used for welding and fixing the recessed portion and the pillar; A second welding layer is provided between the main body and the extension portion, and the second welding layer is used for welding and fixing the extension portion and the main body.

8. A display screen, characterized in that: It comprises a back plate and the display module according to any one of claims 1 to 7, wherein the display module is fixedly connected to the back plate.

9. A process for manufacturing a display module, characterized in that: The steps include: A lamp bead to be mounted and a control circuit board are provided. The lamp bead includes a light-emitting body and a pin connected to the light-emitting body. The pin includes a main body portion and a support. The main body portion is electrically connected to the light-emitting body, and the support is connected to a side of the main body portion facing away from the light-emitting body. The outer edge of the main body portion extends outwardly beyond the periphery of the support. A mounting groove is formed on the plate body of the control circuit board. A soldering pad is provided on the inner peripheral wall of the mounting groove of the plate body and on the outer periphery of the groove opening thereof, wherein the soldering pad includes a recessed portion with one side open and a hollow interior forming a groove structure and an extension portion connected to the outer periphery of the recessed portion opening; Solder paste is provided on the soldering pad of the control circuit board, and the lamp beads are placed on the soldering pad of the control circuit board, so that the control circuit board and the lamp beads form a unit structure to be soldered; The unit structure to be welded is welded so that the solder paste is combined between the pillar and the recessed portion and between the main body and the extending portion, thereby completing the welding to obtain a display module.

10. The manufacturing process of the display module according to claim 9, characterized in that: The solder paste is arranged in the recessed portion to form a solder paste layer; the distance between the surface of the solder paste layer facing the extension portion and the surface of the extension portion facing away from the plate body is less than or equal to the height of the pillar.

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