Chip detection device and method

Abstract

The invention discloses a chip detection device and method, and belongs to the field of chip detection. A chip detection device comprises a vertical cabinet and a detection probe arranged on one side of the vertical cabinet in a sliding mode and further comprises a detection assembly rotationally installed on one side of the vertical cabinet, a clamping assembly used for fixing a chip is arranged on the detection assembly, and the detection probe is arranged over the clamping assembly; the dust removal assembly is used for cleaning the surface of the chip, the dust removal assembly is arranged in the detection assembly in a sliding mode, the detection assembly comprises a detection disc and a positioning ring, a through hole is formed in the detection disc, and the positioning ring is installed on the upper surface of the detection disc and located above the through hole; according to the invention, the possibility of chip damage is reduced, the detection accuracy is improved, and the detection quality of the to-be-detected chip is ensured; the detection accuracy is ensured, and the detection efficiency is improved; the electrical control is saved, the structure cost is reduced, the surface of the chip is ensured to be cleaned before detection each time, and the detection precision is improved.

Description

Technical Field

[0001] The present invention relates to the field of chip detection technology, and in particular to a chip detection device and method. Background Art

[0002] Chip inspection is an important step to ensure the quality of chip substrates, involving multiple aspects of inspection. These inspections include but are not limited to: Appearance inspection: Check whether there are scratches, stains, particles, warping and other problems on the surface of the chip substrate; Dimension inspection: Measure whether the size of the chip substrate meets the requirements, including length, width, thickness, etc. Structural inspection: Check the internal structure of the chip substrate, such as whether there are cracks, voids, uneven fillings and other problems; Performance inspection: Test the electrical properties of the chip substrate, such as insulation resistance, thermal conductivity, pressure resistance, etc. These inspections are usually carried out using automated equipment, such as automatic optical inspection equipment (AOI), automatic X-ray inspection equipment (AXI), etc.

[0003] When performing appearance inspection on chips, the chip substrate is usually placed on the inspection end of the automatic optical inspection equipment. After one side of the inspection is completed, manual or robotic cooperation is required to take out the chip substrate and flip it over for inspection on the other side. During the flipping process, manual or robotic contact with the chip can easily damage the chip, affecting the inspection quality; the chip needs to be cleaned before inspection, which reduces the inspection efficiency. Summary of the invention

[0004] The purpose of the present invention is to solve the problem in the prior art that during the flipping process, the chip is easily contaminated with dust due to contact between manual or mechanical hands and the chip, and to propose a chip detection device and method.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A chip detection device and method, including a cabinet and a detection probe slidably arranged on one side of the cabinet, and also including a detection component rotatably installed on one side of the cabinet, the detection component is provided with a clamping component for fixing the chip, and the detection probe is arranged directly above the clamping component; a dust removal component for cleaning the surface of the chip, and the dust removal component is slidably arranged in the detection component.

[0007] Preferably, the detection assembly comprises a detection disk and a positioning ring, a through hole is provided in the detection disk, and the positioning ring is mounted on the upper surface of the detection disk and is located above the through hole.

[0008] In order to make the detection tray flip automatically, further, flip frames are symmetrically arranged on both sides of the detection tray, and a flip shaft is connected to the center of one side of the flip frame. One group of the flip shafts is transmission-connected to the second motor, and the other group of the flip shafts is rotationally connected to one side of the cabinet.

[0009] During the flipping process of the detection plate, in order to avoid interference with the detection probe, further, a base is provided at the bottom of the cabinet, the second motor is fixedly installed on one side above the base, two sets of electric slides are symmetrically provided on one side of the cabinet, and the detection probe is fixedly installed on the slider of the electric slide.

[0010] Since the positioning ring is a bearing platform of the cylinder, in order to facilitate the inspection and replacement of the pneumatic components, a suction cup is fixedly installed on the bottom of the positioning ring, and the positioning ring is detachably mounted on the upper surface of the detection plate through the suction cup.

[0011] Preferably, the clamping assembly includes four groups of cylinders and clamping plates arranged in a circular equidistant array on the outer wall of the positioning ring. A screw is rotatably installed on one side of the clamping plate. One end of the screw is threadedly connected to the telescopic shaft end of the cylinder through a fastening nut. The telescopic shaft end of the cylinder passes through the positioning ring and extends into the positioning ring.

[0012] Preferably, the dust removal assembly includes two groups of brush cleaning frames, a guide groove is provided in the positioning ring, the brush cleaning frames are slidably connected in the guide groove, and a brush cleaning disc is rotatably mounted on one end of the brush cleaning frame extending into the positioning ring.

[0013] In order to clean the chip in time, further, a driving assembly is provided at one end of the cleaning brush rack away from the cleaning brush disk, and the driving assembly includes a first motor fixedly mounted on the detection disk and an active shaft transmission-connected to the output shaft end of the first motor, the active shaft is connected to the passive shaft through a transmission belt transmission, a synchronous rack is fixedly mounted on the detection disk, the active shaft and the passive shaft are both rotatably connected to the synchronous rack, and one end of the active shaft and the passive shaft are both connected to a lead screw through a driving wheel and a pulley transmission, one end of the lead screw is threadedly connected to an internal threaded sleeve, a connecting plate is slidably mounted on one side of the cleaning brush rack, and the internal threaded sleeve is rotationally connected to the connecting plate through a bearing.

[0014] To ensure that the chip can be cleaned in time before the detection probe works, further, a linkage assembly is arranged between the driving shaft and the flip shaft, and the linkage assembly includes a first transmission rod and a second transmission rod, and the first transmission rod is fixedly installed at one end of the first transmission rod, and a first bevel gear is fixedly installed at one end of the driving shaft, and the first bevel gear and the second bevel gear are meshed, and a first bevel gear is fixedly installed at one end of the second transmission rod, and one end of the flip shaft is meshed with a first gear through a second gear, and the first gear is coaxially connected with a second bevel gear, and the second bevel gear is meshed with the first bevel gear, and a reversing connection assembly is connected between the first transmission rod and the second transmission rod, and the reversing connection assembly includes a first transition plate and a second transition plate, and the first transition plate and the second transition plate are connected by eight groups of reversing rods.

[0015] The present invention also provides a method, including a chip detection device, comprising the following steps:

[0016] Step 1: Fix the chip in the positioning ring through the clamping assembly, and drive the clamping plate to clamp the chip through the cylinder;

[0017] Step 2: Start the electric slide to drive the detection probe close to the chip to the detection set distance, and then control the detection probe to detect the top of the chip through the control panel;

[0018] Step 3: After completing the above steps, start the second motor to drive the detection disk to rotate, flip the chip, and repeat step 2 to complete the detection.

[0019] Compared with the prior art, the present invention provides a chip detection device and method, which have the following beneficial effects:

[0020] 1. The chip detection device and method realizes front / back detection of the chip by setting a rotatable detection disk to drive the internal positioning ring to flip under the detection probe, and does not require manual or mechanical hands to pick up and place the chip, thereby reducing the possibility of chip damage, improving detection accuracy and ensuring the detection quality of the chip to be detected;

[0021] 2. The chip detection device and method are provided with two sets of brush cleaning racks symmetrically arranged in the positioning ring, and a brush cleaning plate is arranged at one end of the brush cleaning rack close to the chip. The brush cleaning rack slides in the guide groove to complete dust removal and cleaning of the front and back sides of the chip, thereby ensuring detection accuracy and improving detection efficiency;

[0022] 3. The chip detection device and method link the flipping action of the detection component and the sliding structure of the dust removal component, so that the chip can be directly dusted and cleaned during the flipping process, which not only saves electrical control and reduces structural costs, but also ensures that the chip surface is cleaned before each detection, thereby improving detection accuracy.

[0023] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. The present invention reduces the possibility of chip damage, improves the accuracy of detection and ensures the detection quality of the chip to be detected; and ensures the detection accuracy and improves the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the three-dimensional structure of a chip detection device proposed by the present invention;

[0025] Figure 2 A schematic diagram of the three-dimensional structure of a detection component of a chip detection device proposed by the present invention;

[0026] Figure 3A schematic diagram of a partial three-dimensional structure of a clamping assembly of a chip detection device proposed by the present invention;

[0027] Figure 4 A chip detection device proposed by the present invention Figure 2 The enlarged structural diagram of part A in the middle;

[0028] Figure 5 This is a schematic diagram of the three-dimensional structure of a second embodiment of a chip detection device proposed by the present invention;

[0029] Figure 6 A chip detection device proposed by the present invention Figure 5 The enlarged structural diagram of part B in the middle;

[0030] Figure 7 A schematic diagram of the three-dimensional structure of a reversing connection component of a chip detection device proposed by the present invention.

[0031] In the figure: 1, detection probe; 2, control panel; 3, cabinet; 4, base; 5, detection plate; 6, cylinder; 7, brush rack; 8, brush rack; 9, electric slide; 10, clamping plate; 11, positioning ring; 12, screw; 13, turning shaft; 14, guide groove; 15, suction cup; 16, turning frame; 17, screw; 18, internal thread sleeve; 19, connecting plate; 20, driving shaft; 21, transmission belt; 22, passive shaft; 23, synchronous frame; 24, driving wheel; 25, first motor;

[0032] 26. Pulley; 27. First bevel gear; 28. Second bevel gear; 29. ​​First transmission rod;

[0033] 30. First transition plate; 31. Second transition plate; 32. Reversing rod; 33. Second transmission rod; 34. First bevel gear; 35. Second bevel gear; 36. First gear; 37. Second gear; 38. Second motor. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0035] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] Embodiment:

[0037] Referring to Figure 1-Figure 7 , a chip detection device and method, including a vertical cabinet 3 and a detection probe 1 slidably arranged on one side of the vertical cabinet 3, further including a detection component rotatably installed on one side of the vertical cabinet 3. The detection component includes a detection disk 5 and a positioning ring 11. A through hole is formed in the detection disk 5, and the positioning ring 11 is installed on the upper surface of the detection disk 5 and above the through hole.

[0038] In this embodiment, the chip is fixed in the positioning ring 11, and the detection probe 1 is started to detect the front side of the chip. A through hole is formed in the detection disk 5. After the detection component is flipped, the detection probe 1 can directly detect the back side of the chip through the through hole.

[0039] It should be noted that a detector is provided in the detection probe 1 in this embodiment. This structure is prior art, so the structure and working principle of the detection probe 1 will not be described in detail.

[0040] Flip frames 16 are symmetrically arranged on both sides of the detection disk 5. A rotation shaft 13 is connected to the middle position on one side of the flip frame 16. One group of the rotation shafts 13 is drivingly connected to a second motor 38, and the other group of the rotation shafts 13 is rotatably connected to one side of the vertical cabinet 3.

[0041] In this embodiment, flip frames 16 are installed on both sides of the detection disk 5. One flip frame 16 is rotatably installed in the vertical cabinet 3 through the rotation shaft 13, and the other flip frame 16 is fixedly connected to the output shaft end of the second motor 38 through the rotation shaft 13. Therefore, by starting the second motor 38, the detection disk 5 and the chip in the detection disk 5 can be driven to flip.

[0042] A base 4 is arranged at the bottom of the vertical cabinet 3. The second motor 38 is fixedly installed above one side of the base 4. Two groups of electric sliding tables 9 are symmetrically arranged on one side of the vertical cabinet 3. The detection probe 1 is fixedly installed on the slider of the electric sliding table 9.

[0043] In this embodiment, the distance between the detection probe 1 and the chip is H, and the flipping radius of the detection disk 5 is D, and H < D. Therefore, to ensure that the detection probe 1 will not interfere with the flipping of the detection disk 5, two groups of electric sliding tables 9 are arranged between the detection probe 1 and the vertical cabinet 3, and the lifting of the detection probe 1 is controlled according to the detection operation of the detection device.

[0044] The detection component is provided with a clamping component for fixing the chip, and the detection probe 1 is arranged directly above the clamping component; the clamping component includes four groups of cylinders 6 and a clamping plate 10 arranged in a circular equidistant array on the outer wall of the positioning ring 11, and a screw 12 is rotatably installed on one side of the clamping plate 10, and one end of the screw 12 is threadedly connected to the telescopic shaft end of the cylinder 6 through a fastening nut, and the telescopic shaft end of the cylinder 6 passes through the positioning ring 11 and extends into the positioning ring 11.

[0045] In this embodiment, there are four groups of cylinders 6 in an annular equidistant array inside the positioning ring 11, and the telescopic rod ends of the cylinders 6 penetrate the side wall of the positioning ring 11. In order to expand the adjustable range of clamping the chip, a group of screws 12 are threadedly connected to the telescopic rod ends of the cylinders 6. By adjusting the clamping position of the clamping plate 10, for chips of different sizes, the extension length of the screws 12 can be adjusted first, and after adjustment, they can be locked by tightening the nuts. When clamping, the four groups of cylinders 6 are started at the same time to drive the clamping plate 10 to move closer to the center of the positioning ring 11, and the chip can be clamped.

[0046] A suction cup 15 is fixedly mounted on the bottom of the positioning ring 11 , and the positioning ring 11 is detachably mounted on the upper surface of the detection plate 5 via the suction cup 15 .

[0047] In this embodiment, the positioning ring 11 is fixed to the upper surface of the detection plate 5 by using a suction cup 15. The suction cup 15 is pneumatically controlled to adsorb or loosen, so that the positioning ring 11 can be taken out to inspect the cylinder 6 and its accessories, and the air pipe connected to the cylinder 6 can also be disassembled and assembled.

[0048] The device also includes a dust removal component for cleaning the surface of the chip, and the dust removal component is slidably arranged in the detection component. The dust removal component includes two sets of cleaning brush racks 7, and a guide groove 14 is provided in the positioning ring 11. The cleaning brush rack 7 is slidably connected in the guide groove 14, and a cleaning brush disc 8 is rotatably installed at one end of the cleaning brush rack 7 extending into the positioning ring 11.

[0049] In this embodiment, a cleaning brush rack 7 is provided to drive the cleaning brush plate 8 to slide in the guide groove 14. The cleaning brush rack 7 symmetrically arranged up and down is used to simultaneously remove dust from both sides of the chip, thereby ensuring detection accuracy and improving detection efficiency.

[0050] The brush cleaning frame 7 is provided with a driving assembly at one end away from the brush cleaning disk 8, and the driving assembly includes a first motor 25 fixedly mounted on the detection disk 5 and a driving shaft 20 drivingly connected to the output shaft end of the first motor 25, the driving shaft 20 is connected to the passive shaft 22 through a transmission belt 21, a synchronous frame 23 is fixedly mounted on the detection disk 5, the driving shaft 20 and the passive shaft 22 are both rotatably connected to the synchronous frame 23, and one end of the driving shaft 20 and the passive shaft 22 are connected to a lead screw 17 through a driving wheel 24 and a pulley 26, one end of the lead screw 17 is threadedly connected to an internal threaded sleeve 18, a connecting plate 19 is slidably mounted on one side of the brush cleaning frame 7, and the internal threaded sleeve 18 is rotatably connected to the connecting plate 19 through a bearing.

[0051] In this embodiment, the active shaft 20 and the passive shaft 22 are rotatably connected to the detection disk 5 by using the synchronization frame 23, and the first motor 25 is started to drive the active shaft 20 to rotate. Since the active shaft 20 and the passive shaft 22 are connected by a transmission belt 21, the passive shaft 22 and the active shaft 20 rotate synchronously. The active shaft 20 and the passive shaft 22 drive the two sets of screw rods 17 to rotate through the driving wheel 24. The threaded connection between the screw rod 17 and the internal threaded sleeve 18 is used to drive the connecting plate 19 and the brush frame 7 to slide in the guide groove 14, thereby driving the brush plate 8 to clean and remove dust on the front / back side of the chip to ensure the detection accuracy.

[0052] Specifically, in this embodiment, the cleaning disk 8 is configured as an electrostatic cleaning structure, which can not only remove the accumulation of large particles, but also absorb the dust that is easy to float to prevent it from falling back onto the chip.

[0053] Embodiment 2:

[0054] Based on the detection probe 1 of the embodiment, the cleaning of the two groups of brush cleaning racks 7 depends on the start-up of the first motor 25, and electrical control is required to cooperate with the first motor 25 to implement cleaning. Before each detection, it is necessary to control the first motor 25 to drive the brush cleaning rack 7 to slide, which not only increases the structural cost but also increases the design cost of the electrical control. Therefore, in this embodiment, the sliding and flipping of the brush cleaning rack 7 are linked through a linkage component. Specifically, a linkage component is provided between the active shaft 20 and the flip shaft 13, and the linkage component includes a first transmission rod 29 and a second transmission rod 33. The first transmission rod 29 is fixedly installed at one end of the first transmission rod 29, and the active shaft 20 is fixedly installed at one end of the first transmission rod 29. A first bevel gear 27 is fixedly mounted on one end, and the first bevel gear 27 is meshed with a second bevel gear 28. A first bevel gear 34 is fixedly mounted on one end of the second transmission rod 33. A first gear 36 is meshed with a second gear 37 at one end of the flip shaft 13. The first gear 36 is coaxially connected with a second bevel gear 35, and the second bevel gear 35 is meshed with the first bevel gear 34. A reversing connection assembly is connected between the first transmission rod 29 and the second transmission rod 33, and the reversing connection assembly includes a first transition plate 30 and a second transition plate 31. The first transition plate 30 and the second transition plate 31 are connected by eight groups of reversing rods 32.

[0055] In this embodiment, the second gear 37 is fixedly connected to one side of the cabinet 3, and the second gear 37 and the flip shaft 13 are concentrically arranged. The surface of the detection disk 5 is rotatably provided with a coaxially connected first gear 36 and a second bevel gear 35. When the detection disk 5 rotates around the flip shaft 13, the first gear 36 rotates around the second gear 37 and rotates on itself, driving the second bevel gear 35 and the first bevel gear 34 to engage, thereby driving the second transmission rod 33 to rotate. The second transmission rod 33 drives the first transmission rod 29 on one side of the first transition plate 30 to rotate through the second transition plate 31 and the reversing rod 32, and finally drives the driving shaft 20 to rotate through the engagement of the second bevel gear 28 and the first bevel gear 27. The first motor 25 is replaced by a linkage assembly, and the dust removal assembly can be controlled to operate during the flipping process without the need for the first motor 25 and electrical control, thereby ensuring the cleaning of the chip detection surface before detection.

[0056] It should be noted that the eight groups of reversing rods 32 arranged in the linkage assembly are not of equal length. During the rotation of the first transition plate 30 and the second transition plate 31, the two ends of the reversing rod 32 will slide in the first transition plate 30 and the second transition plate 31, thereby ensuring the blockage caused by the reversing angle and ensuring the smooth rotation of the reversing transmission.

[0057] The present invention discloses a method, including a chip detection device, comprising the following steps:

[0058] Step 1: Fix the chip in the positioning ring 11 through the clamping assembly, and drive the clamping plate 10 to clamp the chip through the cylinder 6;

[0059] Step 2: Start the electric slide 9 to drive the detection probe 1 close to the chip to the detection set distance, and then control the detection probe 1 to detect the top of the chip through the control panel 2;

[0060] Step 3: After completing the above steps, start the second motor 38 to drive the detection plate 5 to rotate, turn the chip over, and repeat step 2 to complete the detection.

[0061] In the present invention, the electric slide 9 is started to drive the detection probe 1 to move up, and a space for installing the chip is reserved. The chip is placed in the positioning ring 11, and the clamping plate 10 is driven to move closer to the center of the positioning ring 11 by starting the cylinder 6, so that the chip can be clamped; at this time, the second motor 38 can be started to drive the detection disk 5 to rotate, and the active shaft 20 is driven through the linkage component. Since the active shaft 20 and the passive shaft 22 are connected by a transmission belt 21, the passive shaft 22 and the active shaft 20 rotate synchronously, and the active shaft 20 and the passive shaft 22 drive the two sets of screw rods 17 to rotate through the driving wheel 24, and the threaded connection between the screw rod 17 and the internal threaded sleeve 18 is used to drive the connecting plate 19 and the brush cleaning frame 7 to slide in the guide groove 14, thereby driving the brush cleaning disk 8 to clean and remove dust on the front / back side of the chip to ensure the detection accuracy;

[0062] The electric slide 9 is started again to drive the detection probe 1 to move close to the chip to the detection height, and then the detection probe 1 is controlled by the control panel 2 to detect the chip.

[0063] By repeating the above working process, the chip can be dusted and inspected multiple times.

[0064] It should be noted that by setting a rotatable test disk 5 to drive the internal positioning ring 11 to flip under the test probe 1, the front / back side detection of the chip can be realized, and there is no need for manual or robotic arm to pick up and place the chip, which reduces the possibility of chip damage, improves the accuracy of the test, and ensures the detection quality of the chip to be tested.

[0065] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip detection device and method, comprising a cabinet (3) and a detection probe (1) slidably arranged on one side of the cabinet (3), characterized in that: Also includes: A detection component is rotatably mounted on one side of the cabinet (3), wherein the detection component is provided with a clamping component for fixing the chip, and the detection probe (1) is arranged directly above the clamping component; A dust removal component is used for cleaning the surface of a chip, and the dust removal component is slidably arranged in the detection component.

2. A chip detection device and method according to claim 1, characterized in that: The detection assembly comprises a detection disk (5) and a positioning ring (11); a through hole is provided in the detection disk (5); and the positioning ring (11) is mounted on the upper surface of the detection disk (5) and is located above the through hole.

3. A chip detection device and method according to claim 2, characterized in that: Flip frames (16) are symmetrically arranged on both sides of the detection plate (5), and a flip shaft (13) is connected to the center of one side of the flip frame (16). One group of the flip shafts (13) is transmission-connected to a second motor (38), and the other group of the flip shafts (13) is rotationally connected to one side of the cabinet (3).

4. A chip detection device and method according to claim 3, characterized in that: A base (4) is provided at the bottom of the cabinet (3); the second motor (38) is fixedly mounted on one side above the base (4); two sets of electric slides (9) are symmetrically arranged on one side of the cabinet (3); and the detection probe (1) is fixedly mounted on a slider of the electric slide (9).

5. A chip detection device and method according to claim 2, characterized in that: A suction cup (15) is fixedly mounted on the bottom of the positioning ring (11), and the positioning ring (11) is detachably mounted on the upper surface of the detection plate (5) via the suction cup (15).

6. A chip detection device and method according to claim 2, characterized in that: The clamping assembly comprises four groups of cylinders (6) and a clamping plate (10) arranged in an annular equidistant array on the outer wall of a positioning ring (11); a screw rod (12) is rotatably mounted on one side of the clamping plate (10); one end of the screw rod (12) is threadedly connected to the telescopic shaft end of the cylinder (6) through a fastening nut; the telescopic shaft end of the cylinder (6) penetrates the positioning ring (11) and extends into the positioning ring (11).

7. A chip detection device and method according to claim 6, characterized in that: The dust removal assembly comprises two groups of brush racks (7), a guide groove (14) is provided in the positioning ring (11), the brush rack (7) is slidably connected in the guide groove (14), and a brush disc (8) is rotatably mounted on one end of the brush rack (7) extending into the positioning ring (11).

8. A chip detection device and method according to claim 7, characterized in that: A drive assembly is arranged at one end of the brush cleaning frame (7) away from the brush cleaning disc (8), the drive assembly comprising a first motor (25) fixedly mounted on the detection disc (5) and a driving shaft (20) drivingly connected to the output shaft end of the first motor (25), the driving shaft (20) drivingly connected to a passive shaft (22) via a transmission belt (21), a synchronous frame (23) fixedly mounted on the detection disc (5), the driving shaft (20) and the passive shaft (22) both being rotationally connected to the synchronous frame (23), and one end of the driving shaft (20) and the passive shaft (22) both being transmissionly connected to a screw rod (17) via a driving wheel (24) and a pulley (26), one end of the screw rod (17) being threadedly connected to an internal thread sleeve (18), a connecting plate (19) being slidably mounted on one side of the brush cleaning frame (7), the internal thread sleeve (18) being rotationally connected to the connecting plate (19) via a bearing.

9. A chip detection device and method according to claim 8, characterized in that: A linkage assembly is provided between the driving shaft (20) and the flip shaft (13), and the linkage assembly comprises a first transmission rod (29) and a second transmission rod (33). The first transmission rod (29) is fixedly mounted on one end of the first transmission rod (29). A first bevel gear (27) is fixedly mounted on one end of the driving shaft (20), and the first bevel gear (27) and the second bevel gear (28) are meshed. A first bevel gear (34) is fixedly mounted on one end of the second transmission rod (33). A first gear (36) is meshed with a second gear (37), the first gear (36) is coaxially connected with a second bevel gear (35), the second bevel gear (35) is meshed with the first bevel gear (34), a reversing connection assembly is connected between the first transmission rod (29) and the second transmission rod (33), the reversing connection assembly comprises a first transition plate (30) and a second transition plate (31), and the first transition plate (30) and the second transition plate (31) are connected via eight groups of reversing rods (32).

10. A method, comprising a chip detection device according to any one of claims 1 to 9, characterized in that: The steps include: Step 1: fix the chip in the positioning ring (11) by means of a clamping assembly, and drive the clamping plate (10) to clamp the chip by means of a cylinder (6); Step 2: Start the electric slide (9) to drive the detection probe (1) close to the chip to the detection set distance, and then control the detection probe (1) to detect the top of the chip through the control panel (2); Step 3: After completing the above steps, start the second motor (38) to drive the detection plate (5) to rotate, turn the chip over, and repeat step 2 to complete the detection.

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