Turnover device and wafer bonding equipment

Abstract

The invention relates to the technical field of semiconductor manufacturing, and particularly discloses a turnover device and wafer bonding equipment, the turnover device comprises a support frame, a driving mechanism, a turnover clamping mechanism and a transmission mechanism; the supporting frame is arranged on the side wall of the vacuum chamber and located outside the vacuum chamber. The driving mechanism is arranged on the supporting frame; the turnover clamping mechanism is positioned in the vacuum chamber; the turnover clamping mechanism comprises a turnover mounting seat and a clamping assembly, and the clamping assembly is movably arranged on the turnover mounting seat; the transmission mechanism comprises an inner transmission shaft and an outer transmission shaft arranged outside the inner transmission shaft in a sleeving mode. The driving mechanism is completely arranged outside the vacuum chamber, and power is transmitted through the transmission mechanism, so that a mechanical structure in the vacuum chamber can be optimized, arrangement of components such as cables and a driving source in the vacuum chamber is reduced, the number of the components in the vacuum chamber is reduced, occupied space in the vacuum chamber is reduced, and meanwhile particle pollution is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a flipping device and a wafer bonding equipment. Background Art

[0002] With the rapid development of high-end technologies such as wafer manufacturing and wafer bonding, higher technical requirements are put forward for process equipment in vacuum environments. The requirements for the actuators of process actions in vacuum environments are extremely high, so it is particularly important to use reliable mechanical mechanisms to complete high-precision process actions. In the wafer bonding process, the wafer itself needs to be flipped in a vacuum environment before bonding to adjust the front and back of the wafer.

[0003] In the prior art, the wafer is generally flipped by a handling robot finger with electrostatic adsorption or a gripper with a driven clamping function, and the above-mentioned flipping mechanisms require the installation of components such as cables and drive sources in the vacuum chamber. As a result, a large number of components are installed in the vacuum chamber, a large space is occupied, and more particle pollution is generated. Summary of the invention

[0004] The purpose of the present invention is to provide a flipping device and a wafer bonding device to solve the problem in the prior art that the flipping mechanism needs to be equipped with components such as cables and drive sources in the vacuum chamber, resulting in a large number of components in the vacuum chamber, occupying a large space and generating more particle pollution.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] In one aspect, the present invention provides a flipping device for flipping a wafer in a vacuum chamber, the flipping device comprising:

[0007] A support frame, the support frame is arranged on the side wall of the vacuum chamber and is located outside the vacuum chamber;

[0008] A driving mechanism, wherein the driving mechanism is arranged on the supporting frame;

[0009] A flip clamping mechanism, the flip clamping mechanism is located in the vacuum chamber; the flip clamping mechanism comprises a flip mounting seat and a clamping assembly, the clamping assembly is movably arranged on the flip mounting seat;

[0010] A transmission mechanism, the transmission mechanism includes an inner transmission shaft and an outer transmission shaft sleeved outside the inner transmission shaft; the two ends of the outer transmission shaft are respectively connected to the driving end of the driving mechanism and the flip mounting seat, so that the driving mechanism can drive the flip mounting seat to rotate through the outer transmission shaft; the two ends of the inner transmission shaft are respectively connected to the driving end of the driving mechanism and the clamping assembly, so that the driving mechanism can drive the clamping assembly to clamp the wafer through the inner transmission shaft.

[0011] As an optional scheme for the above-mentioned flipping device, the clamping assembly includes a transmission mounting seat, a finger mounting seat and a clamping finger, the transmission mounting seat is slidably arranged on the flipping mounting seat, the finger mounting seat is arranged on the transmission mounting seat, and the clamping finger is arranged on the finger mounting seat; the transmission mounting seat, the finger mounting seat and the clamping finger are each provided with two, and the two transmission mounting seats, the two finger mounting seats and the two clamping fingers are arranged in a one-to-one correspondence; the inner transmission shaft can pass through the flipping mounting seat to drive and connect the two transmission mounting seats, and is used to drive the two transmission mounting seats to move so that the two clamping fingers are close to or away from each other.

[0012] As an optional solution of the above-mentioned flipping device, a gear is provided at the end of the inner transmission shaft, a rack is provided on the transmission mounting seat, and the gear is meshingly connected to the racks of the two transmission mounting seats to drive the two transmission mounting seats to move in opposite directions.

[0013] As an optional solution of the above-mentioned flipping device, the finger mounting seat is extended with a shielding ridge, and the shielding ridges of two finger mounting seats can be stacked on each other to shield the gear and the rack.

[0014] As an optional solution of the above-mentioned flipping device, a flexible buffer block is provided on one of the two finger mounting seats, and the flexible buffer block is located between the two finger mounting seats.

[0015] As an optional scheme of the above-mentioned flipping device, the driving mechanism includes a first driving component and a second driving component, the first driving component is arranged on the supporting frame; the driving end of the first driving component is connected to the second driving component and the outer transmission shaft, and is used to drive the second driving component and the outer transmission shaft to rotate synchronously; the driving end of the second driving component is connected to the inner transmission shaft, and is used to drive the inner transmission shaft to rotate.

[0016] As an optional scheme for the above-mentioned flipping device, the first driving component includes a flipping motor, a driving wheel, a synchronous belt and a driven wheel, and the flipping motor is arranged on the support frame; the driving end of the flipping motor is connected to the driving wheel, the second driving component and the external transmission shaft are both connected to the driven wheel, and the synchronous belt is sleeved on the outside of the driving wheel and the driven wheel.

[0017] As an optional solution of the above-mentioned turning device, the second driving component is a driving cylinder.

[0018] As an optional solution of the above-mentioned flipping device, the transmission mechanism also includes a magnetic fluid sealing jacket, which is sleeved outside the outer transmission shaft and sealed to the side wall of the vacuum chamber.

[0019] On the other hand, the present invention provides a wafer bonding device, comprising the flipping device as described above, wherein the wafer bonding device further comprises a vacuum chamber, and the support frame of the flipping device is mounted on the side wall of the vacuum chamber.

[0020] The beneficial effects of the present invention are:

[0021] The flipping device includes a support frame, a driving mechanism, a flipping clamping mechanism and a transmission mechanism. The support frame is arranged on the side wall of the vacuum chamber and is located outside the vacuum chamber, and the driving mechanism is arranged on the support frame, so that the driving mechanism is also located outside the vacuum chamber. Among them, the flipping clamping mechanism is located in the vacuum chamber, the flipping clamping mechanism includes a flipping mounting seat and a clamping assembly, the clamping assembly is movably arranged on the flipping mounting seat, the transmission mechanism includes an inner transmission shaft and an outer transmission shaft sleeved outside the inner transmission shaft, and the two ends of the outer transmission shaft are respectively connected to the driving end of the driving mechanism and the flipping mounting seat, so that the driving mechanism can drive the flipping mounting seat to rotate through the outer transmission shaft, so that the clamping assembly can also flip under the drive of the flipping mounting seat, and at the same time, the two ends of the inner transmission shaft are respectively connected to the driving end of the driving mechanism and the clamping assembly, so that the driving mechanism can drive the clamping assembly to clamp the wafer through the inner transmission shaft, so that the wafer can be flipped under the drive of the clamping assembly. In the flipping device, the driving mechanism is completely arranged outside the vacuum chamber and transmits power through the transmission mechanism, so that the mechanical structure inside the vacuum chamber can be optimized to reduce the arrangement of components such as cables and driving sources in the vacuum chamber, thereby reducing the number of components in the vacuum chamber, reducing the space occupied in the vacuum chamber, and reducing particle pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a flipping device provided by an embodiment of the present invention;

[0023] Figure 2 A schematic diagram of the structure of the flip clamping mechanism provided by an embodiment of the present invention;

[0024] Figure 3 A schematic diagram of the structure of a partial flip clamping mechanism provided in an embodiment of the present invention Figure 1 ;

[0025] Figure 4 A schematic diagram of the structure of a partial flip clamping mechanism provided in an embodiment of the present invention Figure 2 ;

[0026] Figure 5 A schematic diagram of the structure of a driving mechanism provided by an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the structure of a transmission mechanism provided by an embodiment of the present invention.

[0028] In the figure:

[0029] 1. Support frame; 2. Driving mechanism; 21. First driving assembly; 211. Flipping motor; 212. Driving wheel; 213. Synchronous belt; 214. Driven wheel; 22. Second driving assembly; 3. Flipping clamping mechanism; 31. Flipping mounting seat; 32. Clamping assembly; 321. Transmission mounting seat; 3211. Rack; 322. Finger mounting seat; 3221. Blocking convex edge; 323. Clamping finger; 324. Flexible buffer block; 4. Transmission mechanism; 41. Inner transmission shaft; 411. Gear; 42. Outer transmission shaft; 43. Magnetic fluid sealing jacket; 5. Vacuum chamber. DETAILED DESCRIPTION

[0030] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] This embodiment provides a flipping device for flipping the wafer in the vacuum chamber 5 .

[0035] like Figure 1 to Figure 6 As shown, the flipping device includes a support frame 1, a driving mechanism 2, a flipping clamping mechanism 3 and a transmission mechanism 4. The support frame 1 is arranged on the side wall of the vacuum chamber 5 and is located outside the vacuum chamber 5, and the driving mechanism 2 is arranged on the support frame 1, so that the driving mechanism 2 is also located outside the vacuum chamber 5.

[0036] Among them, the flipping clamping mechanism 3 is located in the vacuum chamber 5, and the flipping clamping mechanism 3 includes a flipping mounting seat 31 and a clamping assembly 32. The clamping assembly 32 can be movably arranged on the flipping mounting seat 31. The transmission mechanism 4 includes an inner transmission shaft 41 and an outer transmission shaft 42 sleeved outside the inner transmission shaft 41. The two ends of the outer transmission shaft 42 are respectively connected to the driving end of the driving mechanism 2 and the flipping mounting seat 31, so that the driving mechanism 2 can drive the flipping mounting seat 31 to rotate through the outer transmission shaft 42, so that the clamping assembly 32 can also be flipped under the drive of the flipping mounting seat 31. At the same time, the two ends of the inner transmission shaft 41 are respectively connected to the driving end of the driving mechanism 2 and the clamping assembly 32, so that the driving mechanism 2 can drive the clamping assembly 32 to clamp the wafer through the inner transmission shaft 41, so that the wafer is flipped under the drive of the clamping assembly 32.

[0037] In the flipping device, the driving mechanism 2 is completely arranged outside the vacuum chamber 5, and the power is transmitted through the transmission mechanism 4, so that the mechanical structure in the vacuum chamber 5 can be optimized to reduce the arrangement of components such as cables and driving sources in the vacuum chamber 5, thereby reducing the number of components in the vacuum chamber 5, reducing the space occupied in the vacuum chamber 5, and reducing particle pollution.

[0038] like Figure 1 to Figure 4 As shown, the clamping assembly 32 includes a transmission mounting seat 321, a finger mounting seat 322 and a clamping finger 323. The transmission mounting seat 321 is slidably arranged on the flip mounting seat 31, the finger mounting seat 322 is arranged on the transmission mounting seat 321, and the clamping finger 323 is arranged on the finger mounting seat 322, so that when the transmission mounting seat 321 moves on the flip mounting seat 31, the clamping finger 323 can follow the movement, wherein the transmission mounting seat 321, the finger mounting seat 322 and the clamping finger 323 are each provided with two, and the two transmission mounting seats 32 1. Two finger mounting seats 322 and two clamping fingers 323 are arranged in one-to-one correspondence, and the inner transmission shaft 41 can pass through the flip mounting seat 31 to drive and connect the two transmission mounting seats 321, and is used to drive the two transmission mounting seats 321 to move, so that the two clamping fingers 323 are close to each other or away from each other, so that after the two clamping fingers 323 are close to each other, the wafer can be clamped, so that the wafer can be flipped with the flip mounting seat 31, and the wafer can be detached when the two clamping fingers 323 are away from each other, so as to facilitate other processes. Specifically, a slide rail is arranged on the flip mounting seat 31, and the transmission mounting seat 321 is connected to a slide table, and the slide table is slidably arranged on the slide rail, so that the stability of the transmission mounting seat 321 when moving is improved by setting the slide rail of the slide table.

[0039] Further, a gear 411 is provided at the end of the inner transmission shaft 41, and a rack 3211 is provided on the transmission mounting seat 321. The gear 411 is meshedly connected to the racks 3211 of the two transmission mounting seats 321, and is used to drive the two transmission mounting seats 321 to move in opposite directions, so that the inner transmission shaft 41 can transmit the power of the driving mechanism 2 outside the vacuum chamber 5, so that the gear 411 drives the rack 3211 to move, so as to achieve the two transmission mounting seats 321 to move closer to or farther away from each other. Optionally, a fixed bearing is provided on the support frame 1, and the other end of the inner transmission shaft 41 away from the gear 411 is rotatably provided on the fixed bearing. Further optionally, the finger mount 322 is extended with a shielding flange 3221, and the shielding flanges 3221 of two finger mounts 322 can be stacked on each other to shield the gear 411 and the rack 3211. Thus, through the setting of the shielding flange 3221, at least two layers of physical isolation can be maintained between the wafer and the gear 411 and the rack 3211, thereby effectively reducing the particle contamination of the wafer caused by the movement of the gear 411 and the rack 3211.

[0040] At the same time, a flexible buffer block 324 is provided on one of the two finger mounts 322, and the flexible buffer block 324 is located between the two finger mounts 322, so that in the process of the two clamping fingers 323 approaching each other to clamp the wafer, the flexible buffer block 324 can be squeezed by the two finger mounts 322, and then provide a reaction force to the two finger mounts 322, thereby realizing flexible clamping and solving the hidden dangers caused by excessive or insufficient clamping force on the wafer.

[0041] like Figure 1 and Figure 5 As shown, the driving mechanism 2 includes a first driving component 21 and a second driving component 22. The first driving component 21 is arranged on the support frame 1. The driving end of the first driving component 21 is connected to the second driving component 22 and the outer transmission shaft 42, and is used to drive the second driving component 22 and the outer transmission shaft 42 to rotate synchronously. The driving end of the second driving component 22 is connected to the inner transmission shaft 41, and is used to drive the inner transmission shaft 41 to rotate, so that the flipping clamping mechanism 3 can realize the overall flipping, wherein the flipping of the flip mounting seat 31 can be individually controlled by the first driving component 21, and the clamping of the clamping component 32 can be individually controlled by the second driving component 22.

[0042] Specifically, the first drive assembly 21 includes a flip motor 211, a driving wheel 212, a synchronous belt 213 and a driven wheel 214. The flip motor 211 is arranged on the support frame 1, the driving end of the flip motor 211 is connected to the driving wheel 212, the second drive assembly 22 and the outer transmission shaft 42 are both connected to the driven wheel 214, and the synchronous belt 213 is sleeved outside the driving wheel 212 and the driven wheel 214, so that the flip motor 211 provides power, and the driving wheel 212, the synchronous belt 213 and the driven wheel 214 are used to realize the overall flipping of the second drive assembly 22 and the outer transmission shaft 42. Among them, by controlling the gear ratio of the driving wheel 212 and the driven wheel 214, the actual working condition requirements can be met. When the gear ratio of the driving wheel 212 and the driven wheel 214 is small, on the one hand, the load of the flip motor 211 can be effectively reduced, which is convenient for selecting a flip motor 211 with a smaller power, and on the other hand, the flipping accuracy can be more accurately controlled.

[0043] At the same time, the second driving component 22 is a driving cylinder. When the driving cylinder is used, the clamping force of the clamping component 32 can be adjusted by air pressure, so that the clamping force can be adjusted steplessly and the use of a motor with a torque adjustment function can be avoided, thereby reducing the cost. The driving cylinder has an air buffer structure. When the flip clamping mechanism 3 is about to flip into place, the air buffer structure can slow down the action, so that the clamping force is slowly increased, thereby reducing the impact on the wafer.

[0044] like Figure 1 and Figure 6 As shown, the transmission mechanism 4 also includes a magnetic fluid sealing jacket 43, which is sleeved on the outside of the outer transmission shaft 42 and sealed to the side wall of the vacuum chamber 5. Thus, through the magnetic fluid sealing jacket 43, and the outer transmission shaft 42 and the inner transmission shaft 41 nested in sequence, the sealing between the inside of the vacuum chamber 5 and the outside of the vacuum chamber 5 can be ensured, thereby ensuring the vacuum condition of the vacuum chamber 5.

[0045] The present embodiment also provides a wafer bonding device, including the flipping device as described above, and the wafer bonding device also includes a vacuum chamber 5, and the support frame 1 of the flipping device is arranged on the side wall of the vacuum chamber 5, so that the wafer bonding device can optimize the mechanical structure in the vacuum chamber 5 by using the flipping device as described above, so as to reduce the arrangement of components such as cables and drive sources in the vacuum chamber 5, thereby reducing the number of components in the vacuum chamber 5, reducing the space occupied in the vacuum chamber 5, and reducing particle contamination.

[0046] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A flipping device for flipping a wafer in a vacuum chamber (5), characterized in that: The turning device comprises: A support frame (1), the support frame (1) being arranged on a side wall of the vacuum chamber (5) and being located outside the vacuum chamber (5); A driving mechanism (2), wherein the driving mechanism (2) is arranged on the supporting frame (1); A flip clamping mechanism (3), the flip clamping mechanism (3) being located in the vacuum chamber (5); the flip clamping mechanism (3) comprising a flip mounting seat (31) and a clamping assembly (32), the clamping assembly (32) being movably disposed on the flip mounting seat (31); A transmission mechanism (4), the transmission mechanism (4) comprising an inner transmission shaft (41) and an outer transmission shaft (42) sleeved outside the inner transmission shaft (41); two ends of the outer transmission shaft (42) are respectively connected to a driving end of the driving mechanism (2) and the flip mounting seat (31), so that the driving mechanism (2) can drive the flip mounting seat (31) to rotate through the outer transmission shaft (42); two ends of the inner transmission shaft (41) are respectively connected to the driving end of the driving mechanism (2) and the clamping assembly (32), so that the driving mechanism (2) can drive the clamping assembly (32) to clamp the wafer through the inner transmission shaft (41).

2. The turning device according to claim 1, characterized in that: The clamping assembly (32) comprises a transmission mounting seat (321), a finger mounting seat (322) and a clamping finger (323); the transmission mounting seat (321) is slidably arranged on the flip mounting seat (31), the finger mounting seat (322) is arranged on the transmission mounting seat (321), and the clamping finger (323) is arranged on the finger mounting seat (322); two transmission mounting seats (321), two finger mounting seats (322) and two clamping fingers (323) are each provided, and the two transmission mounting seats (321), the two finger mounting seats (322) and the two clamping fingers (323) are arranged in a one-to-one correspondence; the inner transmission shaft (41) can pass through the flip mounting seat (31) to transmission-connect the two transmission mounting seats (321), and is used to drive the two transmission mounting seats (321) to move, so that the two clamping fingers (323) are close to or away from each other.

3. The turning device according to claim 2, characterized in that: A gear (411) is provided at the end of the inner transmission shaft (41), a rack (3211) is provided on the transmission mounting seat (321), and the gear (411) is meshingly connected to the racks (3211) of the two transmission mounting seats (321) for driving the two transmission mounting seats (321) to move in opposite directions.

4. The turning device according to claim 3, characterized in that: The finger mounting seat (322) is extended with a shielding ridge (3221), and the shielding ridges (3221) of two finger mounting seats (322) can be stacked on top of each other to shield the gear (411) and the rack (3211).

5. The turning device according to claim 2, characterized in that: A flexible buffer block (324) is provided on one of the two finger mounting seats (322), and the flexible buffer block (324) is located between the two finger mounting seats (322).

6. The turning device according to claim 1, characterized in that: The driving mechanism (2) comprises a first driving component (21) and a second driving component (22), wherein the first driving component (21) is arranged on the support frame (1); a driving end of the first driving component (21) is connected to the second driving component (22) and the outer transmission shaft (42), and is used to drive the second driving component (22) and the outer transmission shaft (42) to rotate synchronously; and a driving end of the second driving component (22) is connected to the inner transmission shaft (41), and is used to drive the inner transmission shaft (41) to rotate.

7. The turning device according to claim 6, characterized in that: The first driving assembly (21) comprises a flip motor (211), a driving wheel (212), a synchronous belt (213) and a driven wheel (214); the flip motor (211) is arranged on the support frame (1); the driving end of the flip motor (211) is connected to the driving wheel (212); the second driving assembly (22) and the external transmission shaft (42) are both connected to the driven wheel (214); and the synchronous belt (213) is sleeved outside the driving wheel (212) and the driven wheel (214).

8. The turning device according to claim 6, characterized in that: The second driving component (22) is a driving cylinder.

9. The turning device according to any one of claims 1 to 8, characterized in that: The transmission mechanism (4) further comprises a magnetic fluid sealing jacket (43), wherein the magnetic fluid sealing jacket (43) is sleeved outside the outer transmission shaft (42) and is sealedly connected to the side wall of the vacuum chamber (5).

10. A wafer bonding device, characterized in that: The wafer bonding device comprises a flipping device as claimed in any one of claims 1 to 9, wherein the wafer bonding equipment further comprises a vacuum chamber (5), and the support frame (1) of the flipping device is arranged on the side wall of the vacuum chamber (5).

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