Chip wire bonding fixture

Abstract

The present application provides a chip wire bonding fixture, comprising: a carrier and a fixing body. The carrier is used to carry a tube shell, and the tube shell is fixedly connected with a chip. When the chip wire bonding fixture fixes the chip and the tube shell, the wire bonding of the metal leads between the chip and the tube shell is achieved by another welding device. The chip wire bonding fixture involved in the present application can simultaneously fix multiple circuits during the wire bonding stage, and when it is necessary to fix multiple other circuits, only some parts need to be replaced to complete the task, which is convenient to use. Compared with manually tightening the screw rod, the circuit can be fixed faster. The wire bonding efficiency of the fixture provided by the present application is greatly improved, thereby improving the efficiency of semiconductor packaging.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a chip wire bonding fixture, which is used to fix a tube shell when it is necessary to electrically connect the pins of the chip with the leads of the tube shell. Background Art

[0002] With the progress of society and the rapid development of science and technology, higher requirements have been put forward for my country's semiconductor industry, not only more advanced manufacturing processes, but also more efficient packaging processes. Among them, wire bonding is one of the key links in semiconductor packaging. At present, there are still single chip wire bonding fixtures on the market, which have low packaging efficiency and cannot meet the needs of fast and large-scale shipments.

[0003] In addition, most of the fixtures on the market currently use screw rods to fix the cover plate and squeeze the circuit tray to fix the circuit. The existing fixtures use the method of manually tightening the screw rods during use, which takes a long time to operate and has low work efficiency. In addition, problems such as aging of the screw rods will have a certain impact on the accuracy of the fixture, resulting in deviations in the chip lead bonding, which will have an adverse effect on the subsequent use of the chip, such as easy occurrence of cold solder joints, short circuits and other phenomena. Summary of the invention

[0004] In order to improve the efficiency of semiconductor packaging, this application proposes a chip wire bonding fixture that can simultaneously fix multiple circuits during the wire bonding stage. Compared with manually tightening screws, it can also fix the circuit faster. The wire bonding efficiency of the fixture provided by this application has been greatly improved. In addition, this application uses a liftable cylinder as a braking component, that is, this application uses gas braking for the cover plate, and the force of the cover plate on the circuit can be known according to the gas pressure gauge to prevent the circuit from being pinched.

[0005] The purpose of the present application is to provide a chip wire bonding fixture, which is used to fix the tube shell when the pins of the chip need to be electrically connected to the leads of the tube shell. The chip wire bonding fixture includes: a carrier and a fixing body;

[0006] The carrier is used to carry the tube shell, and the tube shell is fixedly connected with a chip; after the chip wire bonding fixture fixes the tube shell, another welding device is used to achieve welding between the chip and the tube shell.

[0007] The carrier comprises:

[0008] Base plate;

[0009] At least one liftable cylinder, disposed on the base plate;

[0010] A bearing platform, arranged on the bottom plate;

[0011] A top plate is disposed on the liftable cylinder, the liftable cylinder drives the top plate to move along a first direction, and the top plate has an opening; and

[0012] A tray is movably disposed between the carrier platform and the top plate, and is used to fix at least one chip and at least one tube shell, wherein the chip and the tube shell are connected by colloid;

[0013] Wherein, when placing the tray: the liftable cylinder drives the top plate to move along the first direction to a first preset position; the tray is inserted from the gap formed between the carrier platform and the top plate; the liftable cylinder drives the top plate to move along the first direction to a second preset position; when the top plate is at the second preset position, all the chips and all the tube shells in the tray leak out from the opening; the first preset position is the position where the top plate rises to the position where the tray can be inserted, and the second preset position is the position where the top plate descends to the position where the top plate contacts the tray;

[0014] The fixing body is used to fix the tray on which at least one chip and at least one tube shell are placed.

[0015] In one embodiment, the carrier includes: four of the liftable cylinders;

[0016] The bottom plate is a quadrilateral, and the four liftable cylinders are respectively arranged at the four corners of the bottom plate.

[0017] In one embodiment, the carrier further comprises: four side plates fixedly arranged on the bottom plate, the extension planes of the side plates being perpendicular to the extension plane of the bottom plate, and the area of ​​the space region enclosed by the four side plates being larger than the maximum area of ​​the top plate;

[0018] Among them, two opposite side panels among the four side panels have grooves for inserting the tray. The four side panels can be named as the first side panel, the second side panel, the third side panel and the fourth side panel in a clockwise direction. The two opposite side panels with the grooves can be the first side panel and the third side panel, or the second side panel and the fourth side panel, which are not specifically limited here, and can facilitate the entry and exit of the tray. In this embodiment, the provision of the groove can shorten the distance that the lifting cylinder moves upward, that is, the height of the first preset position can be set lower. After the lifting cylinder drives the top plate to move upward to the first preset position, the tray can be inserted and removed from the groove more conveniently and quickly.

[0019] The bottom plate is a quadrilateral, and the four liftable cylinders are respectively arranged at the four corners of the bottom plate.

[0020] In one embodiment, the carrier further comprises: a cylinder driving member connected to the liftable cylinder and used to drive the liftable cylinder to move;

[0021] The cylinder driving component includes: a compressed air tank, a compressed air inlet, a compressed air pipeline, and a compressed air switch;

[0022] The compressed gas tank is used to provide compressed air, wherein a first hole is provided at the center of the bottom plate, and the compressed gas tank is provided below the first hole;

[0023] The compressed air inlet is arranged on a side of the bottom plate, one end of the compressed air inlet is connected to the compressed air tank; the other end of the compressed air inlet is connected to the compressed air switch through a pipeline;

[0024] The compressed air switch is arranged on another side of the bottom plate, wherein the side on which the compressed air inlet is arranged and the side on which the compressed air switch is arranged are adjacent to each other;

[0025] Wherein, the compressed air switch is a pneumatic regulating valve, which is used to divide the compressed air entering from the compressed air inlet into two paths, namely a first air path and a second air path; the first air path is connected to the four liftable cylinders respectively through the four compressed air pipelines; the second air path is connected to the four liftable cylinders respectively through the four compressed air pipelines; the first air path is connected to the upper air port of the liftable cylinder through the compressed air pipeline, and the second air path is connected to the lower air port of the liftable cylinder through the compressed air pipeline;

[0026] The compressed air switch is used to realize the lifting and lowering control of the liftable cylinder.

[0027] In one embodiment, the fixing body comprises: a cover plate, the cover plate is arranged above the top plate and connected to the top plate by screws; a first area of ​​the cover plate is located at the opening, a second area of ​​the cover plate has a connection with the top plate, the first area is used to expose the area to be welded between the chip and the tube shell in the tray, and the second area is used to fix the chip and the tube shell on the tray;

[0028] Wherein, the tray is provided with a chip limiting block and / or a tube shell limiting block, which are used to limit the position of the chip and / or the tube shell;

[0029] The first area of ​​the cover plate has an alignment hole for exposing the area to be welded between the chip and the tube shell, so as to facilitate welding of metal leads between the chip and the tube shell under the fixation of the chip lead bonding fixture.

[0030] In one embodiment, the fixing body comprises: a magnet adsorption block, arranged on the tray and used for adsorbing the tube shell;

[0031] Wherein, the tray is provided with a chip limiting block and / or a tube shell limiting block, which are used to limit the position of the chip and / or the tube shell;

[0032] The magnet adsorption block is arranged on the chip limiting block and / or the tube shell limiting block, and an area outside the chip placement area.

[0033] In one embodiment, the fixing body comprises: a vacuum adsorption member;

[0034] The vacuum adsorption component includes: a vacuum access port, a vacuum pipeline and a vacuum switch;

[0035] The vacuum inlet is arranged on a side of the bottom plate, one end of the vacuum inlet is connected to an external vacuum generating device, and the other end of the vacuum inlet is connected to one end of the vacuum switch through a pipeline;

[0036] The vacuum switch is arranged on the other side of the bottom plate, wherein the side where the vacuum access port is arranged and the side where the vacuum switch is arranged are adjacent to each other; the other end of the vacuum switch is connected to the vacuum pipe, and the vacuum switch is used to form a vacuum environment.

[0037] In one embodiment, the carrier platform has a vacuum air hole connected to the vacuum inlet; the vacuum air hole has a plurality of surrounding adsorption holes;

[0038] Each chip placement position in the tray has a vacuum adsorption hole.

[0039] In one embodiment, the tray has a handle, which is arranged outside the supporting plane and is used to hold the tray.

[0040] In one embodiment, the loading platform includes: a tray limit block, which is arranged on the loading plane of the loading platform, and the highest plane of the tray limit block is higher than the highest plane of the loading platform; the tray limit block is located at the rear end of the tray insertion direction.

[0041] The chip wire bonding fixture of the present application has at least the following advantages or beneficial effects:

[0042] 1. The chip wire bonding fixture involved in this application can fix multiple circuits at the same time during the wire bonding stage, and when it is necessary to fix multiple other circuits, only some parts need to be replaced, which is convenient to use. Compared with manually tightening the screw rod, the wire bonding efficiency of the fixture provided by this application is greatly improved, thereby improving the efficiency of semiconductor packaging.

[0043] 2. The chip wire bonding fixture involved in this application uses a liftable cylinder as a braking component, that is, this application uses gas braking for the cover plate. The force of the cover plate acting on the circuit can be known based on the gas pressure gauge to prevent the circuit from being pinched.

[0044] 3. The chip wire bonding fixture involved in this application can fix the tube shell, avoiding displacement of the tube shell during the movement of the fixture, which would cause deviation in chip wire bonding, and avoid cold soldering, short circuit and other phenomena during subsequent welding between the chip and the tube shell.

[0045] 4. In the chip wire bonding fixture involved in the present application, the chip and the tube shell itself are fixed by colloid. The chip and the tube shell as a whole are fixed on the tray by the chip limit block and / or the tube shell limit block, and the tray is fixed on the carrier table by the cover plate or the fixed body of the vacuum adsorption component. Alternatively, the chip and the tube shell as a whole are fixed on the tray by the magnet adsorption block. There can be many ways to fix the chip and the tube shell involved in the present application, such as using a cover plate, a magnet adsorption block or a vacuum adsorption component to fix the chip and the tube shell.

[0046] 4.1 The chip wire bonding fixture involved in this application, the chip and the tube shell are placed on a tray, and the chip and the tube shell are fixed by colloid. The chip wire bonding fixture is used to fix the tube shell when it is necessary to electrically connect the pins of the chip with the pins of the tube shell through metal leads (for example, the metal leads can be aluminum wires). The tray and the cover plate are set in pairs, and the tray and the cover plate can be replaced according to the size and shape of the tube shell and chip to be welded.

[0047] 4.2 The chip wire bonding fixture involved in the present application has two horizontal chip limit blocks and two vertical tube shell limit blocks on the tray. Four magnet adsorption blocks are respectively arranged on the four sides of the virtual quadrilateral surrounded by the center of the chip limit block and the center line of the tube shell limit block. Four magnet adsorption blocks are respectively arranged at the positions corresponding to the tube shell of the quadrilateral. By adsorbing the tube shell by the magnet adsorption block, the chip and the tube shell can be fixed without causing damage to the internal circuit of the chip, which is safe and efficient. The purpose of magnetically fixing the tube shell and chip to be welded is achieved by changing the specific structure of the tray. The structure is simple, the fixation is stable, and it will not affect the internal circuit of the chip.

[0048] 4.3 The chip wire bonding fixture involved in this application has two pneumatic devices. The first pneumatic device is a cylinder drive component, which drives the lifting cylinder to drive the top plate to rise and / or fall. The second pneumatic device is a vacuum adsorption component, which is used to adsorb the tray and / or chip. Using gas as power, you only need to adjust the vacuum switch and compressed air switch. The operation is simple and convenient. By setting the size of the gas, you can control the power size to avoid pinching the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0050] Figure 1a This is a schematic diagram of a structure in which a chip and a tube shell provided in an embodiment of the present application are placed on a tray;

[0051] Figure 1b A schematic diagram of the connection relationship between a chip, a tube shell and metal leads provided in one embodiment of the present application;

[0052] Figure 2a A schematic diagram of the structure of a carrier in a chip wire bonding fixture provided in the first embodiment of the present application;

[0053] Figure 2b A schematic diagram of a state of a cylinder driving component provided in the first embodiment of the present application;

[0054] Figure 2c Another schematic diagram of the cylinder driving component provided in the first embodiment of the present application;

[0055] Figure 2d A schematic diagram of the lifting cylinder provided in the first embodiment of the present application rising in position;

[0056] Figure 2e A schematic diagram of the lowering position of the liftable cylinder provided in the first embodiment of the present application;

[0057] Figure 3 A schematic diagram of the structure of a carrier platform in a chip wire bonding fixture provided in the first embodiment of the present application;

[0058] Figure 4 A schematic diagram of the installation of a partial structure of a carrier in a chip wire bonding fixture provided in the first embodiment of the present application;

[0059] Figure 5 A schematic diagram of the tray structure in the chip wire bonding fixture provided in the first embodiment of the present application;

[0060] Figure 6 A schematic diagram of the structure after a tray is installed in a carrier in a chip wire bonding fixture provided in the first embodiment of the present application;

[0061] Figure 7 A schematic diagram of the structure after a top plate is installed in a carrier in a chip wire bonding tooling fixture provided in the first embodiment of the present application;

[0062] Figure 8 This is a schematic diagram of the assembly of the chip wire bonding fixture provided in the first embodiment of the present application after the top plate is installed in the carrier;

[0063] Fig. 9 A schematic diagram of the structure of a chip wire bonding fixture provided in the first embodiment of the present application after a fixing body is installed on a carrier body;

[0064] Fig.10 A schematic structural diagram of a cover plate in a chip wire bonding fixture provided in the first embodiment of the present application;

[0065] Fig.11 A schematic diagram of the structure of the cover plate and the tray in the chip wire bonding fixture provided in the first embodiment of the present application after being combined;

[0066] Fig.12 A schematic diagram of the tray structure in a chip wire bonding fixture provided in the second embodiment of the present application;

[0067] Fig.13 A schematic diagram of the structure after a top plate is installed in a carrier in a chip wire bonding tooling fixture provided in the second embodiment of the present application;

[0068] Fig.14 This is a schematic assembly diagram of a chip wire bonding tooling fixture according to the second embodiment of the present application after a top plate is installed in a carrier;

[0069] Fig.15 A schematic diagram of the structure of a carrier in a chip wire bonding fixture provided in the third embodiment of the present application;

[0070] Fig.16 A schematic diagram of the structure of a carrier platform in a chip wire bonding fixture provided in the third embodiment of the present application;

[0071] Fig.17 A schematic diagram of the installation of a partial structure of a carrier in a chip wire bonding fixture provided in the third embodiment of the present application;

[0072] Fig.18 A schematic diagram of the tray structure in a chip wire bonding fixture provided in the third embodiment of the present application;

[0073] Fig.19 A schematic diagram of the structure after the chip and the tube shell are installed in the tray of the chip wire bonding fixture provided in the third embodiment of the present application;

[0074] Fig. 20 A schematic diagram of another tray structure in a chip wire bonding fixture provided in the third embodiment of the present application;

[0075] Fig.21 This is a schematic assembly diagram of a chip wire bonding tooling fixture provided in the third embodiment of the present application after another tray and a top plate are installed in the carrier.

[0076] Description of reference numerals:

[0077] Chip wire bonding fixture 100:

[0078] Carrier 10: bottom plate 11, liftable cylinder 12, carrier 13, tray stopper 13a, vacuum air hole 13b, slide 13c, top plate 14, tray 15, chip stopper 15a, tube shell stopper 15b, vacuum adsorption hole 15c, handle 15d, side plate 16, groove 16a, cylinder drive member 17, compressed air inlet 17a, compressed air pipeline 17b, compressed air switch 17c;

[0079] Fixed body: cover plate 21, alignment hole 21a, clamping part 21b, fixing part 21c, magnet adsorption block 22, vacuum adsorption member 23, vacuum inlet 23a, vacuum pipe 23b, vacuum switch 23c;

[0080] Chip 210 , tube shell 220 , metal lead 230 . DETAILED DESCRIPTION

[0081] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0082] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0083] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0084] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the invented product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0085] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0086] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0087] The present application provides a chip wire bonding fixture 100. Figure 1a It is a schematic diagram of a structure in which a chip 210 and a tube shell 220 provided in an embodiment of the present application are placed on a tray 15 . Figure 1b The figure is a schematic diagram of the connection relationship between the chip 210, the tube shell 220 and the metal lead 230 provided in one embodiment of the present application. The chip lead bonding fixture 100 provided in the present application is used to fix the tube shell 220. Specifically, the chip lead bonding fixture 100 is used to fix the tube shell 220 when the pins of the chip 210 need to be electrically connected to the leads of the tube shell 220.

[0088] like Figures 2a to 11Schematic diagram of the structure of each part of the chip wire bonding fixture 100 provided in the first embodiment of the present application. In the first embodiment, the cover plate 21 is used to fix the tube shell 220. The chip 210 and the tube shell 220 are limited by setting a tray 15 with a chip limit block 15a and / or a tube shell limit block 15b. The tray 15 and the cover plate 21 are arranged in pairs, and the tray 15 and the cover plate 21 can be replaced according to the size and shape of the tube shell 220 and the chip 210 to be welded.

[0089] Figure 12-14 Schematic diagram of the structure of each part of the chip wire bonding fixture 100 provided in the second embodiment of the present application. In the second embodiment, the chip 210 and the tube shell 220 are fixedly placed by a magnet adsorption block 22. The magnet adsorption block 22 is provided on the tray 15, and is used to magnetically attract the tube shell 220 to achieve the fixed placement of the chip 210 and the tube shell 220.

[0090] Figure 15-Figure 21 Schematic diagram of the structure of each part of the chip wire bonding fixture 100 provided in the third embodiment of the present application. In the third embodiment, the chip 210 and the tube shell 220 are fixedly placed by a vacuum adsorption member 23. The vacuum adsorption fixation of the entire tray 15 is achieved by setting a vacuum air hole 13a on the carrier 13, or by setting a vacuum adsorption hole 15c on the tray 15 to achieve vacuum adsorption fixation of each chip 210.

[0091] In one embodiment, the chip wire bonding fixture 100 includes: a carrier 10 and a fixing body. The carrier 10 is used to carry a tube shell 220, and the tube shell 220 is fixedly connected with a chip 210. When the chip wire bonding fixture 100 fixes the chip 210 and the tube shell 220, the metal lead 230 between the chip 210 and the tube shell 220 is welded by another welding device, that is, the wire bonding is completed. The metal lead 230 can be an aluminum wire.

[0092] The carrier 10 is used to carry the chip 210 and the tube shell 220. The carrier 10 includes: a bottom plate 11, at least one lifting cylinder 12, a carrying platform 13, a top plate 14, and a tray 15. The bottom plate 11 can be set as a wooden board with a certain thickness and is set at the bottom of the carrier 10.

[0093] At least one liftable cylinder 12 is disposed on the bottom plate 11. In one embodiment, two liftable cylinders 12 may be provided, and in another embodiment, four liftable cylinders 12 may be provided. The liftable cylinder 12 is used as a braking member, that is, gas braking is used for the tray 15, and the force of the top plate 14 and / or the cover plate 21 in the third embodiment on the chip 210 can be known according to the gas pressure gauge, so as to prevent the circuit in the chip 210 from being pinched.

[0094] The carrier 13 is disposed on the bottom plate 11 for carrying the tray 15. The tray 15 is provided with a plurality of chips 210, each chip corresponding to a tube shell 220. In one embodiment, Figure 3 As shown, a tray stopper 13a may be provided on one side of the carrier 13 to limit the further outward movement of the tray 15. Slideways 13c are provided on the two side edges adjacent to the side where the tray stopper 13a is provided. The tray 15 is inserted / pushed along the slideways 13c toward the side where the tray stopper 13a is provided. In another embodiment, as Fig.16 The upper surface of the carrier platform 13 is provided with vacuum air holes 13 b for fixing the tray 15 by vacuum adsorption.

[0095] The top plate 14 is disposed on the liftable cylinder 12 , and the liftable cylinder 12 drives the top plate 14 to move along a first direction, and the top plate 14 has an opening, and a part of the tray 15 can leak out from the opening of the top plate 14 .

[0096] The tray 15 is movably disposed between the carrier 13 and the top plate 14. Specifically, the movability means that the tray 15 can be inserted and withdrawn from between the carrier 13 and the top plate 14. The tray 15 is used to fix at least one chip 210 and at least one tube shell 220, and the chip 210 and the tube shell 220 are connected by colloid. In order to improve the packaging efficiency of semiconductor chips, multiple chips are generally arranged on the tray 15. In some embodiments, such as Figure 1a The tray 15 shown has a groove. The position where the chip 210 and the tube shell 220 are placed on the tray 15 can be set as a groove, that is, the plane where the chip 210 and the tube shell 220 are placed on the tray 15 is lower than the plane where the chip 210 and the tube shell 220 are not placed on the tray 15. In some embodiments, as Figure 1b The tray 15 shown is flat as a whole, with only the chip limiting block 15a and / or the tube shell limiting block 15b being protruding.

[0097] When placing the tray 15, the lifting cylinder 12 drives the top plate 14 to move along the first direction to the first preset position. The first direction is the up-down direction. The tray 15 is inserted from the gap formed between the carrier 13 and the top plate 14. The lifting cylinder 12 drives the top plate 14 to move along the first direction to the second preset position. When the top plate 14 is at the second preset position, all the chips 210 and all the tube shells 220 in the tray 15 leak out from the opening of the top plate 14. The first preset position is the position where the top plate 14 rises to the position where the tray 15 can be inserted, and the second preset position is the position where the top plate 14 descends to the position where the top plate 14 contacts the tray 15.

[0098] The fixing body is used to fix the tray 15 on which at least one chip 210 and at least one tube shell 220 are placed. In this embodiment, the fixing body can be in various forms, which are not specifically limited here, as long as it can fix the tube shell 220.

[0099] In this embodiment, the chip 210 and the tube shell 220 are both placed on the tray 15, and the chip 210 and the tube shell 220 are fixed by colloid. The chip lead bonding fixture 100 is used to fix the tube shell 220 when it is necessary to electrically connect the pins of the chip 210 with the leads of the tube shell 220, such as aluminum wire connection.

[0100] In this embodiment, the chip wire bonding fixture 100 can simultaneously fix multiple circuit chips 210 during the wire bonding stage. The chip wire bonding fixture 100 in this embodiment can also fix the circuit faster than the traditional manual screwing. The chip wire bonding fixture 100 in this embodiment has a greatly improved wire bonding efficiency, thereby improving the semiconductor packaging efficiency.

[0101] In this embodiment, the chip wire bonding fixture 100 uses a liftable cylinder as a braking component, that is, by using gas braking on the top plate 14 and / or the cover plate 21, the force of the top plate 14 and / or the cover plate 21 on the chip 210 can be known according to the gas pressure gauge, thereby preventing the circuit in the chip 210 from being pinched.

[0102] In the present embodiment, in the chip wire bonding fixture 100 involved, the chip 210 and the tube shell 220 are fixed by colloid. The chip 210 and the tube shell 220 are fixed on the tray 15 by the chip limit block 15a and / or the tube shell limit block 15b, and the tray 15 is fixed on the carrier 13 by a fixed body, which can be a cover plate 21 or a vacuum adsorption member 23. Alternatively, the chip 210 and the tube shell 220 are fixed on the tray 15 by a magnet adsorption block 22. There can be multiple forms of fixing the chip 210 and the tube shell 220 involved in different embodiments of the present application, such as using a cover plate 21, a magnet adsorption block 22 or a vacuum adsorption member 23 to fix the chip 210 and the tube shell 220. During the movement of the chip wire bonding fixture 100 of the present application, the golden tube shell 220 (the material of the tube shell 220 is metal, such as gold, silver, aluminum, or other alloys) will not move, and no deviation will occur when the splitting knife is cut during the welding process. Therefore, the chip wire bonding fixture 100 of the present application can ensure that the golden tube shell 220 does not move, and the semiconductor chip packaging accuracy is higher.

[0103] like Figure 2a , Figure 4 , Figure 6and Figure 7 As shown, in one embodiment, the carrier 10 includes: four liftable cylinders 12. The bottom plate 11 is a quadrilateral, and the four liftable cylinders 12 are respectively arranged at the four corners of the bottom plate 11. In the finished product of the chip lead bonding fixture 100, the four liftable cylinders 12 and the top plate 14 with an opening are fixedly connected.

[0104] In this embodiment, four lifting cylinders 12 are provided. First, they can ensure that the top plate 14 can be lifted and lowered more smoothly; second, they can increase the buffering force during the lifting and lowering of the top plate 14, maintain the stability of the entire chip wire bonding fixture 100, and avoid welding errors between the chip 210 and the tube shell 220 caused by the uneven surface of the top plate 14.

[0105] like Figure 2a , Figure 4 , Figure 6 and Figure 7 As shown, in one embodiment, the carrier 10 further includes: four side panels 16. The four side panels 16 are fixedly disposed on the bottom plate 11, the extension planes of the side panels 16 are perpendicular to the extension plane of the bottom plate 11, and the area of ​​the space region enclosed by the four side panels 16 is larger than the maximum area of ​​the top plate 14.

[0106] Among them, two opposite side panels 16 among the four side panels 16 have grooves 16a for inserting the tray 15. The four side panels 16 can be named as the first side panel, the second side panel, the third side panel and the fourth side panel in a clockwise direction. The two opposite side panels 16 with the grooves 16a can be the first side panel and the third side panel, or the second side panel and the fourth side panel, which are not specifically limited here, and can facilitate the entry and exit of the tray 15. In this embodiment, the provision of the grooves 16a can shorten the distance that the liftable cylinder 12 moves upward, that is, the height of the first preset position can be set lower. After the liftable cylinder 12 drives the top plate 14 to move upward to the first preset position, the tray 15 can be inserted and withdrawn from the grooves 16a more conveniently and quickly.

[0107] In this embodiment, the specific structure of the carrier 10 is refined, so that pneumatic control is easier to achieve, and the structure of the entire chip wire bonding fixture 100 is simple and more operable.

[0108] like Figure 2a As shown, in one embodiment, the carrier 10 further includes: a cylinder driving component 17. The cylinder driving component 17 includes: a compressed air tank, a compressed air inlet 17a, a compressed air pipeline 17b, and a compressed air switch 17c.

[0109] The compressed gas tank is used to provide compressed air, wherein a first hole is provided in the center of the bottom plate 11, and the compressed gas tank is provided below the first hole.

[0110] The compressed air inlet 17a is provided at a side of the bottom plate 11, and one end of the compressed air inlet 17a is connected to the compressed air tank. The other end of the compressed air inlet 17a is connected to the compressed air switch 17c through a pipe. The pipe here can be made of the same material as the compressed air pipe 17b, which is not shown in the figure. The pipe can be provided below the bottom plate 11, or it can be embedded in the bottom plate 11, which is not specifically limited.

[0111] The compressed air switch 17c is disposed on another side of the bottom plate 11, wherein the side on which the compressed air inlet 17a is disposed and the side on which the compressed air switch 17c is disposed are adjacent to each other.

[0112] like Figure 2b and Figure 2c As shown, the compressed air switch 17c is a pneumatic regulating valve, which is used to divide the compressed air entering from the compressed air inlet 17a into two paths, namely the first gas path and the second gas path. The first gas path is connected to the four liftable cylinders 12 through four compressed air pipes 17b. The second gas path is connected to the four liftable cylinders 12 through four compressed air pipes 17b. The first gas path is connected to the upper gas port of the liftable cylinder 12 through the compressed air pipe 17b, and the second gas path is connected to the lower gas port of the liftable cylinder 12 through the compressed air pipe 17b.

[0113] The compressed air switch 17c is used to realize the lifting and lowering control of the liftable cylinder 12. Figure 2b and Figure 2e As shown, when the compressed air switch 17c is deflected to the first direction, the first air path is the air outlet path (relative to the air outlet path of the pneumatic regulating valve), the second air path is the air inlet path (relative to the air inlet path of the pneumatic regulating valve), and the compressed air in the compressed air tank enters the liftable cylinder 12 through the compressed air inlet 17a, and the liftable cylinder 12 rises. Figure 2c and Figure 2d As shown, when the compressed air switch 17c is deflected to the second direction, the first air path is the air inlet path, the second air path is the air outlet path, and the compressed air in the compressed air tank enters the liftable cylinder 12 through the compressed air inlet 17a, and the position of the liftable cylinder 12 is lowered.

[0114] In this embodiment, the specific structure of the cylinder driving member 17 is detailed. The cylinder driving member 17 is used to provide power for one or more liftable cylinders 12, making pneumatic control easier to implement, and the structure of the entire chip wire bonding fixture 100 is simple and more operable.

[0115] like Figure 2a-Figure 11 As shown, in the first embodiment, the fixed body is a cover plate 21, as shown in FIG. Fig.10As shown, the cover plate 21 has a positioning hole 21a, a clamping portion 21b and a fixing portion 21c. The positioning hole 21a is used to expose the chip 210 and the chip limiting block 15a. The clamping portion 21b is used to expose the tube shell limiting block 15b. The fixing portion 21c is used to achieve the fixing of the tray 15 and the cover plate 21. Fig.10 The fixing portion 21c shown in the figure is a screw hole, and the tray 15 and the cover plate 21 can be fixed by passing a screw through the fixing portion 21c.

[0116] In the first embodiment, the fixing body includes: a cover plate 21. The cover plate 21 is disposed above the top plate 14 and connected to the top plate 14 by screws. The first area of ​​the cover plate 21 is located at the opening, and the second area of ​​the cover plate 21 has a connection with the top plate 14. The first area is used to expose the area to be welded between the chip 210 and the tube shell 220 in the tray 15, and the second area is used to fix the tray 15 and the top plate 14.

[0117] The tray 15 has a chip stopper 15a and / or a tube shell stopper 15b for limiting the position of the chip 210 and / or the tube shell 220. The first area of ​​the cover plate 21 has an alignment hole 21a for exposing the area to be welded between the chip 210 and the tube shell 220, so as to facilitate welding of the metal lead 230 between the chip 210 and the tube shell 220 under the fixation of the chip lead bonding fixture 100. The metal lead 230 can be an aluminum wire.

[0118] In the first embodiment, the tray 15 and the cover plate 21 are arranged in pairs, and the tray 15 and the cover plate 21 can be replaced according to the size and shape of the tube shell 220 and the chip 210 to be welded. In the first embodiment, the chip wire bonding fixture 100 involved can simultaneously fix multiple circuit chips 210 during the wire bonding stage. The chip wire bonding fixture 100 involved in the first embodiment can also fix the circuit faster than the traditional manual screwing rod. The wire bonding efficiency of the chip wire bonding fixture 100 involved in the first embodiment is greatly improved, thereby improving the efficiency of semiconductor packaging.

[0119] In the first embodiment, the chip wire bonding fixture 100 involves a liftable cylinder as a braking component, that is, by using gas braking on the top plate 14 and / or the cover plate 21, the force of the top plate 14 and / or the cover plate 21 acting on the chip 210 can be known based on the gas pressure gauge, thereby preventing the circuit in the chip 210 from being pinched and damaged.

[0120] like Figure 12-14 As shown, in the second embodiment, the fixed body is a magnet adsorption block 22. The magnet adsorption block 22 adsorbs the tube shell 220 without affecting the internal circuit of the chip 210. Fig.12As shown, the magnetic adsorption block 22 is arranged on the tray 15, and the number of the magnetic adsorption blocks 22 is not limited, as long as it can well adsorb and fix the tube shell 220. For example, the magnetic adsorption blocks 22 can be set to two or four, respectively arranged on the periphery of the tube shell 220, to avoid affecting the internal circuit of the chip 210.

[0121] In one embodiment, the fixed body includes: a magnet adsorption block 22, which is arranged on the tray 15 and is used to adsorb the tube shell 220. The number of the magnet adsorption blocks 22 is not specifically limited, and can be two, three, four, six or other numbers. Among them, the tray 15 has a chip limit block 15a and / or a tube shell limit block 15b, which are used to limit the position of the chip 210 and / or the tube shell 220. Among them, the magnet adsorption block 22 is set in the chip limit block 15a and / or the tube shell limit block 15b, and the area outside the chip 210 placement area.

[0122] like Fig.12 As shown, two horizontal chip stop blocks 15a and two vertical tube shell stop blocks 15b are provided on the tray 15. In one embodiment, four magnet adsorption blocks 22 are respectively provided on the four sides of the virtual quadrilateral formed by the center of the chip stop block 15a and the center of the tube shell stop block 15b. In one embodiment, four magnet adsorption blocks 22 are respectively provided at the positions corresponding to the quadrilateral tube shell 220.

[0123] In this embodiment, the chip 210 and the tube shell 220 are fixed by magnet adsorbing the tube shell 220. The magnet adsorption block 22 mainly adsorbs the metal part of the tube shell 220, and will not affect the internal circuit of the chip 210. In this embodiment, the purpose of magnetically fixing the tube shell and the chip to be welded is achieved by changing the specific structure of the tray 15. The structure is simple, stable and fixed, and will not affect the internal circuit of the chip.

[0124] like Figure 15-Figure 21 As shown, in the third embodiment, the fixed body is a vacuum adsorption member 23. Fig.15As shown, the vacuum adsorption component 23 includes a vacuum access port 23a, a vacuum pipe 23b and a vacuum switch 23c. In the third embodiment, there are two pneumatic devices. The first pneumatic device is a cylinder drive component 17. The cylinder drive component 17 drives the liftable cylinder 12 to drive the top plate 14 to rise and / or fall. The second pneumatic device is a vacuum adsorption component 23, which is used to provide vacuum adsorption force. The chip wire bonding fixture 100 provided in the third embodiment of the present application can realize the simultaneous fixing of multiple chip circuits for wire bonding. When other chip circuits need to be fixed, only some parts need to be replaced to complete the task, which is convenient to use. The chip wire bonding fixture 100 provided in the third embodiment of the present application uses gas as power. It only needs to adjust the vacuum switch 23c and the compressed air switch 17c. The operation is simple and convenient. By setting the size of the gas, the power size can be controlled to avoid clamping the circuit.

[0125] In the third embodiment, the fixed body includes: a vacuum adsorption member 23. The vacuum adsorption member 23 is used to provide a vacuum adsorption force. The vacuum adsorption member 23 realizes vacuum adsorption of the tray 15 through the carrier 13. The vacuum adsorption member 23 includes: a vacuum inlet 23a, a vacuum pipe 23b, and a vacuum switch 23c.

[0126] The vacuum access port 23a is provided on a side of the bottom plate 11. One end of the vacuum access port 23a is connected to an external vacuum generating device. The other end of the vacuum access port 23a is connected to one end of a vacuum switch 23c through a pipe. The pipe here can be made of the same material as the vacuum pipe 23b, which is not shown in the figure. The pipe can be provided below the bottom plate 11, or the pipe can be embedded in the bottom plate 11, which is not specifically limited. The vacuum switch 23c is provided on the other side of the bottom plate 11, wherein the side where the vacuum access port 23a is provided and the side where the vacuum switch 23c is provided are adjacent to each other. The other end of the vacuum switch 23c is connected to the vacuum pipe 23b, and the vacuum switch 23c is used to form a vacuum environment. When the vacuum switch 23c is turned on, the vacuum adsorption member 23 can form a vacuum environment.

[0127] In the third embodiment, the vacuum adsorption member 23 also includes a vacuum pump, which is connected to the vacuum inlet 23a through a vacuum pipe to generate a vacuum environment. The vacuum switch 23c is arranged in the vacuum pipe 23b, and the vacuum pipe 23b is connected to the vacuum air hole 13b of the carrier 13 (the interior of the carrier 13 is hollow). The vacuum adsorption force generated by the vacuum adsorption member 23 acts on the tray 15 through the vacuum air hole 13b. The tray 15 is provided with a vacuum adsorption hole 15c for achieving vacuum adsorption of each chip 210. Alternatively, in another embodiment, the end of the vacuum pipe 23b is directly connected to the vacuum air hole 13b of the carrier 13, and the vacuum adsorption member 23 achieves the adsorption of the tray 15. Further, a magnet adsorption block can be arranged on the tray 15, and the magnet adsorption block can fix and adsorb the chip 210. In this embodiment, the adsorption of the chip 210 is achieved by the vacuum adsorption member 23, and / or the adsorption of the tray 15 is achieved by the vacuum adsorption member 23.

[0128] The chip wire bonding fixture 100 provided in the third embodiment can realize the simultaneous fixing of multiple chip circuits for wire bonding. When other chip circuits need to be fixed, only some parts need to be replaced to complete the task, which is convenient to use. The chip wire bonding fixture 100 provided in the third embodiment of the present application has two pneumatic devices. The first pneumatic device is a cylinder driving component 17. The cylinder driving component 17 drives the lifting cylinder 12 to drive the top plate 14 to rise and / or fall. The second pneumatic device is a vacuum adsorption component 23, which is used to adsorb the tray 15 and / or the chip 210. Using gas as the power, it is only necessary to adjust the vacuum switch 23c and the compressed air switch 17c. The operation is simple and convenient. By setting the size of the gas, the power size can be controlled to avoid clamping the circuit.

[0129] like Fig.16 As shown, in one embodiment, the carrier 13 has a vacuum air hole 13b connected to the vacuum inlet 23a. The vacuum air hole 13b can be set as a plurality of adsorption rings, and the plurality of adsorption rings are arranged one on top of the other. The vacuum air hole 13b provided on the carrier 13 is used to adsorb the tray 15. In this embodiment, the tray 15 is successfully adsorbed by vacuum, and the fixing method of the tube shell 220 on the tray 15 can be further implemented by providing a cover plate, or by providing a magnetic adsorption block on the tray 15.

[0130] like Fig.18 , Fig.19 , Fig. 20 , Fig.21 As shown, in another embodiment, each chip placement position in the tray 15 has a vacuum adsorption hole 15c, and each vacuum adsorption hole 15c can adsorb a chip 210. In this embodiment, as shown in FIG. Fig.18As shown, a plurality of vacuum adsorption holes 15c are provided on the tray 15 to adsorb and fix the chip 210. Since the chip 210 and the tube shell 220 are fixedly connected by colloid, the tube shell 220 is also fixed.

[0131] like Fig.16 As shown, in another embodiment, the carrier 13 has a vacuum air hole 13b, and each chip placement position in the tray 15 has a vacuum adsorption hole 15c. In this embodiment, the vacuum air hole 13b is used to adsorb and fix the tray 15, and the vacuum adsorption hole 15c is used to adsorb and fix the chip 210, and indirectly fix the tube shell 220.

[0132] like Figure 5 , Fig.11 , Fig.12 , Fig.18 , Fig. 20 As shown, in one embodiment, the tray 15 has a handle 15d, which is disposed outside the supporting plane and is used to hold the tray 15. In this embodiment, the handle 15d is disposed outside the supporting plane of the tray 15 to facilitate the insertion and extraction of the tray 15, further improving the packaging efficiency of the semiconductor chips.

[0133] like Figure 3 , Fig.16 As shown, in one embodiment, the carrier 13 includes: a tray stopper 13a is arranged on the carrier plane of the carrier 13, and the highest plane of the tray stopper 13a is higher than the highest plane of the carrier 13. The tray stopper 13a is located at the rear end of the insertion direction of the tray 15. In this embodiment, the arrangement of the tray stopper 13a can well avoid the phenomenon of excessive insertion of the tray 15, and on the basis of limiting the insertion position of the tray 15, the insertion speed of the tray 15 is guaranteed, and the packaging efficiency of the semiconductor chip is indirectly improved.

[0134] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip wire bonding fixture, characterized in that: The chip wire bonding fixture (100) is used to fix the tube shell (220) when it is necessary to electrically connect the pins of the chip (210) with the leads of the tube shell (220). The chip wire bonding fixture (100) comprises: a carrier (10) and a fixing body; The carrier (10) is used to carry the tube shell (220), and the tube shell (220) is fixedly connected to the chip (210); The carrier (10) comprises: Bottom plate (11); At least one liftable cylinder (12) disposed on the bottom plate (11); A bearing platform (13) arranged on the bottom plate (11); A top plate (14) is arranged on the liftable cylinder (12), the liftable cylinder (12) drives the top plate (14) to move along a first direction, and the top plate (14) has an opening; and a tray (15) movably disposed between the carrier platform (13) and the top plate (14), the tray (15) being used to fixedly place at least one chip (210) and at least one tube shell (220), the chip (210) and the tube shell (220) being connected via a colloid; Wherein, when placing the tray (15): the liftable cylinder (12) drives the top plate (14) to move along the first direction to a first preset position; the tray (15) is inserted from a gap formed between the carrier platform (13) and the top plate (14); the liftable cylinder (12) drives the top plate (14) to move along the first direction to a second preset position; when the top plate (14) is at the second preset position, all the chips (210) and all the tube shells (220) in the tray (15) leak out from the opening; the first preset position is the position where the top plate (14) rises to the position where the tray (15) can be inserted, and the second preset position is the position where the top plate (14) descends to the position where the top plate (14) contacts the tray (15); The fixing body is used to fix the tray (15) on which at least one chip (210) and at least one tube shell (220) are placed; the structure of the fixing body comprises: a cover plate (21), a magnetic adsorption block (22) or a vacuum adsorption component (23).

2. The chip wire bonding fixture according to claim 1, characterized in that: The carrier (10) comprises: four liftable cylinders (12); The bottom plate (11) is a quadrilateral, and the four liftable cylinders (12) are respectively arranged at the four corners of the bottom plate (11).

3. The chip wire bonding fixture according to claim 2, characterized in that: The carrier (10) further comprises: four side panels (16) fixedly arranged on the bottom panel (11), the extension planes of the side panels (16) being perpendicular to the extension plane of the bottom panel (11), and the area of ​​the space region enclosed by the four side panels (16) being larger than the maximum area of ​​the top panel (14); Among the four side panels (16), two opposite side panels (16) have grooves (16a) for inserting the tray (15).

4. The chip wire bonding fixture according to claim 3, characterized in that: The carrier (10) further comprises: a cylinder driving component (17), connected to the liftable cylinder (12) and used for driving the liftable cylinder (12) to move; The cylinder driving component (17) comprises: a compressed air tank, a compressed air inlet (17a), a compressed air pipeline (17b), and a compressed air switch (17c); The compressed gas tank is used to provide compressed air, wherein a first hole is provided at the center of the bottom plate (11), and the compressed gas tank is provided below the first hole; The compressed air inlet (17a) is arranged on a side of the bottom plate (11), and one end of the compressed air inlet (17a) is connected to the compressed air tank; the other end of the compressed air inlet (17a) is connected to the compressed air switch (17c) via a pipeline; The compressed air switch (17c) is arranged on another side of the bottom plate (11), wherein the side on which the compressed air inlet (17a) is arranged and the side on which the compressed air switch (17c) is arranged are adjacent to each other; The compressed air switch (17c) is a pneumatic regulating valve, which is used to divide the compressed air entering from the compressed air inlet (17a) into two paths, namely a first air path and a second air path; the first air path is connected to the four liftable cylinders (12) respectively through the four compressed air pipes (17b); the second air path is connected to the four liftable cylinders (12) respectively through the four compressed air pipes (17b); the first air path is connected to the upper air port of the liftable cylinder (12) through the compressed air pipe (17b), and the second air path is connected to the lower air port of the liftable cylinder (12) through the compressed air pipe (17b); The compressed air switch (17c) is used to realize the lifting and lowering control of the liftable cylinder (12).

5. The chip wire bonding fixture according to claim 4, characterized in that: The fixing body comprises: a cover plate (21), the cover plate (21) being arranged above the top plate (14) and connected to the top plate (14) by means of screws; a first area of ​​the cover plate (21) being located at the opening, a second area of ​​the cover plate (21) being connected to the top plate (14), the first area being used to expose an area to be welded between the chip (210) and the tube shell (220) in the tray (15), and the second area being used to fix the tray (15) and the top plate (14); The tray (15) is provided with a chip limiting block (15a) and / or a tube shell limiting block (15b) for limiting the position of the chip (210) and / or the tube shell (220); The first region of the cover plate (21) is provided with an alignment hole (21a) for exposing a region to be welded between the chip (210) and the tube shell (220), thereby facilitating welding of the metal lead wires (230) between the chip (210) and the tube shell (220) under the fixation of the chip lead bonding fixture (100).

6. The chip wire bonding fixture according to claim 4, characterized in that: The fixed body comprises: a magnetic adsorption block (22), arranged on the tray (15) and used for adsorbing the tube shell (220); The tray (15) is provided with a chip limiting block (15a) and / or a tube shell limiting block (15b) for limiting the position of the chip (210) and / or the tube shell (220); The magnet adsorption block (22) is arranged in an area outside the chip limiting block (15a) and / or the tube shell limiting block (15b), and the chip (210) placement area.

7. The chip wire bonding fixture according to claim 4, characterized in that: The fixed body comprises: a vacuum adsorption component (23); The vacuum adsorption component (23) comprises: a vacuum inlet (23a), a vacuum pipe (23b) and a vacuum switch (23c); The vacuum access port (23a) is arranged on a side of the bottom plate (11), one end of the vacuum access port (23a) is connected to an external vacuum generating device, and the other end of the vacuum access port (23a) is connected to one end of the vacuum switch (23c) via a pipeline; The vacuum switch (23c) is arranged on another side of the bottom plate (11), wherein the side on which the vacuum access port (23a) is arranged and the side on which the vacuum switch (23c) is arranged are adjacent to each other; the other end of the vacuum switch (23c) is connected to the vacuum pipe (23b), and the vacuum switch (23c) is used to form a vacuum environment.

8. The chip wire bonding fixture according to claim 7, characterized in that: The carrier platform (13) has a vacuum air hole (13b) connected to the vacuum inlet (23a); and / or each chip placement position in the tray (15) has a vacuum adsorption hole (15c).

9. The chip wire bonding fixture according to any one of claims 1 to 8, characterized in that: The tray (15) has a handle (15d), and the handle (15d) is arranged outside the supporting plane and is used to hold the tray (15).

10. The chip wire bonding fixture according to any one of claims 1 to 8, characterized in that: The bearing platform (13) comprises: a tray limiting block (13a) arranged on the bearing plane of the bearing platform (13), and the highest plane of the tray limiting block (13a) is higher than the highest plane of the bearing platform (13); the tray limiting block (13a) is located at the rear end of the insertion direction of the tray (15).

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