Resistance body for plating device and plating device

Abstract

The present application provides a resistor capable of improving the uniformity of a plating film formed on a substrate. The present application provides a plating device resistor for adjusting an electric field, which is arranged between an anode and a holder that holds an object to be plated in a plating device. In the plating device resistor, a first resistor member having a first surface and a plurality of first through holes opened in the first surface is provided, and a second resistor member having a second surface and a plurality of second through holes opened in the second surface is provided. The plating device resistor is configured such that the first resistor member and the second resistor member are arranged in a manner that the first surface and the second surface face each other, and the size of the overlap of the plurality of first through holes and the plurality of second through holes is variable.

Description

TECHNICAL FIELD

[0001] The present application relates to a resistance body for a plating device and a plating device. BACKGROUND

[0002] Conventionally, a wiring, a bump (a protrusion-shaped electrode), or the like is formed on the surface of an object such as a semiconductor wafer or a printed board. As a method of forming the wiring and the bump or the like, an electrolytic plating method is known.

[0003] In order to improve the uniformity of the thickness of plating formed on an object, it is known that a resistance body for adjusting an electric field is disposed between a circular substrate such as a wafer and an anode in a plating device based on the electrolytic plating method (see Patent Literature 1). Further, in order to more freely adjust the electric field, a plating device in which the size or shape of a hole of a resistance body is made variable is proposed (see Patent Literature 2).

[0004] Patent Literature 1: Japanese Patent Application Publication No. 2021-138995

[0005] Patent Literature 2: Japanese Patent No. 4027491

[0006] In the plating device of Patent Literature 1, it is required to provide a resistance body in which the size or disposition of a hole is appropriately set according to the specifications of an object. Therefore, there arise work and costs for procurement and replacement of the resistance body. In the plating device of Patent Literature 2, although a throttle mechanism capable of changing the size of a hole in the central portion of a resistance body is described, there is a restriction in the range in which the size or shape of the hole is changed in terms of configuration. The thickness of plating formed on an object can depend on the position in the object, and thus it is desirable to flexibly change the size or shape of at least a part of a plurality of through holes formed in a resistance body. SUMMARY

[0007] The present application has been achieved in view of the above-described problems. One of the objects is to provide a resistance body for a plating device and a plating device, which can improve the uniformity of the thickness of plating formed on an object without removing the resistance body from the plating device and adjusting the resistance body having a plurality of through holes.

[0008] According to one embodiment of the present application, a resistance body for a plating device is disposed between an anode and a holder that holds an object to be plated in a plating device for adjusting an electric field. The resistance body for a plating device includes a first resistance member having a first surface and a plurality of first through holes opened in the first surface, and a second resistance member having a second surface and a plurality of second through holes opened in the second surface. The first resistance member and the second resistance member are disposed so that the first surface and the second surface face each other. The size of the overlap of the plurality of first through holes and the plurality of second through holes is variable.

[0009] According to another aspect of the present application, there is provided a plating apparatus. The plating apparatus includes a plating tank, an anode disposed in the plating tank, a holder that holds an object to be plated, and a resistance body for the plating apparatus. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a perspective view showing the overall structure of the plating apparatus of the present embodiment.

[0011] Figure 2 is a plan view showing the overall structure of the plating apparatus of the present embodiment.

[0012] Figure 3 is a longitudinal sectional view schematically showing the structure of the plating module of the present embodiment.

[0013] Figure 4 is a plan view schematically showing the resistance body of the present embodiment.

[0014] Figure 5 is a bottom view schematically showing the resistance body of the present embodiment.

[0015] Figure 6 is a side view schematically showing the resistance body of the present embodiment.

[0016] Figure 7 is an exploded view schematically showing the resistance body of the present embodiment.

[0017] Figure 8 is a side view schematically showing a first resistance member included in the resistance body of the present embodiment.

[0018] Figure 9 is a perspective view schematically showing the first resistance member.

[0019] Figure 10 is a plan view schematically showing the resistance body in a state where a first through-hole is partially closed.

[0020] Figure 11 is a schematic view showing the first through-hole in a partially closed state.

[0021] Figure 12 is a graph showing the relationship between the area of the opening of the first through-hole and the thickness of plating formed on the outer peripheral portion of the substrate.

[0022] Figure 13 is a perspective view schematically showing the resistance body of Modification 1.

[0023] Figure 14 is an exploded view schematically showing the resistance body of Modification 1.

[0024] Figure 15 is a bottom view schematically showing the electric resistance body of Modification 1.

[0025] Figure 16 is a perspective view schematically showing the first electric resistance member included in the electric resistance body of Modification 1.

[0026] Figure 17 is a plan view schematically showing the state in which the first through-hole is partially closed.

[0027] Figure 18 is a side view schematically showing the electric resistance body of Modification 2.

[0028] Figure 19 is a plan view schematically showing the first electric resistance member included in the electric resistance body of Modification 2.

[0029] Figure 20 is a plan view schematically showing the second electric resistance member included in the electric resistance body of Modification 2.

[0030] Figure 21 is a plan view schematically showing the state in which the first through-hole is partially closed.

[0031] Figure 22 is a longitudinal sectional view schematically showing the structure of the plating module of Modification 3. DETAILED DESCRIPTION

[0032] Hereinafter, an embodiment of the present application will be described with reference to the drawings. In the drawings described below, the same or corresponding structural elements are denoted by the same reference numerals, and repetitive description will be omitted.

[0033] <Overall structure of plating apparatus>

[0034] Figure 1 is a perspective view showing the overall structure of the plating apparatus 1000 of the present embodiment. Figure 2 is a plan view showing the overall structure of the plating apparatus 1000. As shown in Figure 1 and Figure 2 , the plating apparatus 1000 is provided with a loading port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-dip module 300, a plating module 400, a cleaning module 500, a spin dryer 600, a transfer device 700, and a control module 800.

[0035] The load port 100 is a module for carrying in or out of a box such as a FOUP or the like, which houses a substrate as an object of plating, to or from a plating device 1000. In the present embodiment, four load ports 100 are arranged in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring a substrate, and is configured to hand over the substrate between the load port 100, the aligner 120, and the transfer device 700. The transfer robot 110 and the transfer device 700 can hand over the substrate via a temporary placement table, which is not shown, when handing over the substrate between the transfer robot 110 and the transfer device 700.

[0036] The aligner 120 is a module for matching the position of the orientation plane, notch, or the like of the substrate with a prescribed direction. In the present embodiment, two aligners 120 are arranged in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The pre-wetting module 200 wets the plating surface of the substrate before plating processing with a treatment liquid such as pure water or degassed water (pre-wetting liquid), thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The pre-wetting module 200 is configured to perform a pre-wetting process, which is a process for easily supplying plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with plating liquid at the time of plating. In the present embodiment, two pre-wetting modules 200 are arranged in the vertical direction, but the number and arrangement of the pre-wetting modules 200 are arbitrary.

[0037] The pre-dip module 300 is configured to perform a pre-dip process, which is a process for cleaning or activating the plating base surface by etching and removing an oxide film, which has a large resistance and exists on the surface of a seed layer or the like formed on the plating surface of the substrate before plating processing, with a treatment liquid such as sulfuric acid or hydrochloric acid. In the present embodiment, two pre-dip modules 300 are arranged in the vertical direction, but the number and arrangement of the pre-dip modules 300 are arbitrary. The plating module 400 performs a plating process on the substrate. In the present embodiment, there are two groups of twelve plating modules 400, which are arranged in the vertical direction in three and arranged in the horizontal direction in four, so that a total of twenty-four plating modules 400 are provided, but the number and arrangement of the plating modules 400 are arbitrary.

[0038] The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove plating solution or the like remaining on the substrate after the plating process. In the present embodiment, two cleaning modules 500 are arranged in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module for rotating and drying the substrate at high speed after the cleaning process. In the present embodiment, two spin dryers are arranged in the vertical direction, but the number and arrangement of the spin dryers are arbitrary. The conveyance device 700 is a device for conveying the substrate between the plurality of modules in the plating apparatus 1000. The control module 800 is configured to control the plurality of modules of the plating apparatus 1000, and can be constituted by a general-purpose computer or a dedicated computer provided with an input / output interface with an operator, for example.

[0039] An example of a series of plating processes in the plating apparatus 1000 will be described. First, a substrate housed in a cassette is carried into the loading port 100. Next, the substrate is taken out of the cassette of the loading port 100 by the conveyance robot 110, and is conveyed to the aligner 120. The aligner 120 matches the positions of the orientation plane, notch, or the like of the substrate with a prescribed direction. The conveyance robot 110 hands over the substrate whose direction has been matched by the aligner 120 to the conveyance device 700.

[0040] The conveyance device 700 conveys the substrate received from the conveyance robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting process on the substrate. The conveyance device 700 conveys the substrate on which the pre-wetting process has been performed to the pre-dip module 300. The pre-dip module 300 performs a pre-dip process on the substrate. The conveyance device 700 conveys the substrate on which the pre-dip process has been performed to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0041] The conveyance device 700 conveys the substrate on which the plating process has been performed to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The conveyance device 700 conveys the substrate on which the cleaning process has been performed to the spin dryer 600. The spin dryer 600 performs a drying process on the substrate. The conveyance device 700 hands over the substrate on which the drying process has been performed to the conveyance robot 110. The conveyance robot 110 conveys the substrate received from the conveyance device 700 to the cassette of the loading port 100. Finally, the cassette in which the substrate is housed is carried out from the loading port 100.

[0042] <Structure of Plating Module>

[0043] Next, the structure of the plating module 400 will be described. The 24 plating modules 400 in the present embodiment are of the same structure, and therefore only one plating module 400 will be described. Figure 3 is a longitudinal sectional view schematically showing the structure of the plating module 400 of the present embodiment. As shown in FIG. 4, the plating module 400 includes a plating bath 410, a substrate support 420, a substrate support 430, a substrate support 440, a substrate support 450, a substrate support 460, a substrate support 470, a substrate support 480, and a substrate support 490. Figure 3As shown, the plating module 400 has a plating bath 410 for housing a plating solution. The plating bath 410 is configured to include a cylindrical inner bath 412 having an upper surface opening, and an outer bath 414 provided around the inner bath 412 in a manner to retain the plating solution overflowing from an upper edge of the inner bath 412.

[0044] The plating module 400 has a support 440 for holding the substrate Wf in a state where the plating surface Wf-a faces downward. In addition, the support 440 has power supply contacts for supplying power to the substrate Wf from a power source not shown. The plating module 400 has a lifting mechanism 442 for lifting the support 440. In addition, in one embodiment, the plating module 400 has a rotating mechanism 448 for rotating the support 440 about a vertical axis. The lifting mechanism 442 and the rotating mechanism 448 can be implemented by known mechanisms such as a motor.

[0045] The plating module 400 of the present embodiment is a cup-type electrolytic plating device in which the substrate Wf (e.g., a semiconductor wafer) held by the support 440 in a state where the plating surface Wf-a faces downward is immersed in the plating solution, and a voltage is applied between the substrate Wf and the anode 430, thereby causing a conductive film to be deposited on the surface of the substrate Wf. In the case where the plating module 400 has the rotating mechanism 448, in order to form a plating layer uniformly on the substrate Wf, the plating process is performed while the substrate Wf is rotated, and the thickness of the plating formed on the substrate Wf becomes more uniform.

[0046] The plating module 400 has a partition 420 that partitions the inside of the inner bath 412 in the vertical direction. The inside of the inner bath 412 is partitioned by the partition 420 into a cathode region 422 and an anode region 424. The cathode region 422 and the anode region 424 are each filled with the plating solution. In the present embodiment, one example in which the partition 420 is provided is shown, but the partition 420 can not be provided.

[0047] The anode 430 is provided on the bottom surface of the inner bath 412 in the anode region 424. In addition, an anode mask 426 for adjusting electrolysis between the anode 430 and the substrate Wf is disposed in the anode region 424. The anode mask 426 is, for example, a substantially plate-shaped member made of a dielectric material, and is disposed in front of (above) the anode 430. The anode mask 426 has an opening through which a current flowing between the anode 430 and the substrate Wf passes. In the present embodiment, one example in which the anode mask 426 is provided is shown, but the anode mask 426 can not be provided. In addition, the partition 420 described above can be provided in the opening of the anode mask 426.

[0048] An electric resistor 450 is arranged between the cathode region 422 and the anode 430 and the holder 440. In the example of the embodiment, the electric resistor 450 is opposed to the separator 420. The electric resistor 450 is a member for adjusting an electric field in the plating solution, and achieves uniformity of the plating treatment in the plated surface Wf-a of the substrate Wf.

[0049] Figure 4 is a plan view schematically showing the electric resistor 450 of the embodiment. Figure 5 is a bottom view schematically showing the electric resistor 450. Figure 6 is a side view schematically showing the electric resistor 450. Figure 7 is an exploded view schematically showing the electric resistor 450. The electric resistor 450 is a plating device electric resistor for adjusting an electric field arranged between the anode 430 and the holder 440 holding the substrate Wf as a plating target in the plating device 1000.

[0050] The electric resistor 450 includes a first electric resistor member 10 and a second electric resistor member 20. The first electric resistor member 10 and the second electric resistor member 20 are members having a higher electric resistivity than the plating solution, and are preferably dielectrics. The first electric resistor member 10 and the second electric resistor member 20 can be formed of a metal or a resin. A plurality of first through holes 911 and a plurality of third through holes 912 are formed in the first electric resistor member 10. The first through holes 911 and the third through holes 912 pass through between a front surface and a back surface of the first electric resistor member 10, and constitute paths through which the plating solution and ions in the plating solution pass. A plurality of second through holes 920 are formed in the second electric resistor member 20. The second through holes 920 pass through between a front surface and a back surface of the second electric resistor member 20, and constitute paths through which the plating solution and ions in the plating solution pass.

[0051] When the electric resistor 450 is arranged in the plating device 1000, the cathode region 422 on the anode side of the electric resistor 450 and the cathode region 422 on the holder side of the electric resistor 450 are connected in a manner that enables movement of the plating solution and ions in the plating solution via the third through holes 912.

[0052] In the present embodiment, the first resistance member 10 is rotated with respect to the second resistance member 20 around the center axis Ax of the resistance body 450, whereby the size of the overlap of the first through-hole 911 and the second through-hole 920 as viewed in the axial direction is changed. Thus, the first through-hole 911 and the second through-hole 920 are selectively connected. The "connection" of the through-holes to other elements means connection in a manner that allows movement of the plating liquid and ions in the plating liquid. When the first through-hole 911 and the second through-hole 920 are connected, the resistance body 450 connects the cathode region 422 on the anode side of the resistance body 450 and the cathode region 422 on the support side of the resistance body 450 in a manner that allows movement of the plating liquid and ions in the plating liquid via the first through-hole 911 and the second through-hole 920. Note that, hereinafter, the "axial direction" refers to the direction of the center axis Ax.

[0053] In the example of the present embodiment, the second resistance member 20 is disposed along the outer side surface 451 of the resistance body 450. In a plating apparatus including a resistance body having a plurality of through-holes, there are cases where the uniformity of the thickness of plating formed in the outer peripheral portion of the substrate decreases in association with, for example, changes in the size of the substrate, the resist opening ratio of the substrate, or the processing recipe of the plating process. In the present embodiment, by changing the size of the overlap of the first through-hole 911 and the second through-hole 920 formed in the outer peripheral portion of the resistance body 450, the electric field around the first through-hole 911 and the second through-hole 920 can be adjusted. Thus, the thickness of plating formed in the substrate Wf can be made more uniform.

[0054] In the illustrated example, the resistance body 450 is formed in a cylindrical shape with the center axis Ax as the axis. In the resistance body 450, the end surface on one side in the axial direction is set as the first outer surface S10, and the end surface on the other side is set as the second outer surface S20. The first resistance member 10 is disposed on the first outer surface side of the resistance body 450, and the second resistance member 20 is disposed on the second outer surface side (see FIG. 2). Figure 6 Note that, if the size of the overlap of the first through-hole 911 and the second through-hole 920 can be changed, the shape of the resistance body 450 is not particularly limited.

[0055] In this embodiment, the first outer surface S10 is configured to face the support 440, and the second outer surface S20 is configured to face the anode 430 within the inner groove 412, with the first resistor 10 rotating relative to the second resistor 20 fixed to the inner groove 412. However, it is also possible to configure the first outer surface S10 to face the anode 430, and the second outer surface S20 to face the support 440 within the inner groove 412, with the second resistor 20 rotating relative to the first resistor 10 fixed to the inner groove 412. Furthermore, the resistor on the anode side of either the first resistor 10 or the second resistor 20 may be fixed, while the resistor on the support side may rotate. However, this is not a limitation; the resistor on the support side may also be fixed, while the resistor on the anode side may rotate. In this design, considering that the upper end of the inner groove 412 is open to allow the insertion of the support 440 (substrate Wf), the resistor component disposed on the support side is configured to be rotatable. This simplifies the mechanical mechanism for rotating the resistor component or allows for manual rotation. Both the first resistor component 10 and the second resistor component 20 can be rotatable. The method of rotation is not particularly limited and can be manual. Furthermore, one of the first resistor component 10 and the second resistor component 20 may have its outer surface 451 fixed to the inner surface of the inner groove 412. Particularly in this case, it is preferable that, when viewing the support 440 side from the anode 430 or the anode 430 side from the support 440 side, the dimension of the rotating component of the first resistor component 10 and the second resistor component 20 is smaller than the dimension of the fixed component.

[0056] like Figure 4 As shown, the first through hole 911 and the third through hole 912 open on the first outer surface S10 of the resistor 450. The first through hole 911 is selectively connected to the second through hole 920 of the second resistor 20 disposed on the second outer surface side of the first resistor 10. The third through hole 912 extends from the first outer surface S10 to the second outer surface S20, connecting the cathode region 422 on the first outer surface side and the cathode region 422 on the second outer surface side. The first through hole 911, the second through hole 920, and the third through hole 912 extend along the central axis Ax.

[0057] As an example, in the first outer surface S10, the first through hole 911 is arranged rotationally symmetrically about the central axis Ax. A plurality of first through holes 911 are preferably arranged on three or more imaginary reference circles that are concentric and have different diameters, and preferably arranged at equal intervals along the circumferential direction on the reference circles. The first through holes 911 are formed in the radial range for the second resistor component 20 to be disposed. Hereinafter, unless otherwise specified, "radial" and "circumferential" refer to the radial and circumferential directions in a rotational coordinate system with the central axis Ax as the axis, respectively. A third through hole 912 is formed inside the first through hole 911 and is arranged rotationally symmetrically about the central axis Ax. Similar to the first through hole 911, a plurality of third through holes 912 are preferably arranged on three or more imaginary reference circles that are concentric and have different diameters, and preferably arranged at equal intervals along the circumferential direction on the reference circles. Wherein, if the plating can be uniformly formed on the substrate Wf to the desired degree, the number and arrangement pattern of the first through-hole 911 and the third through-hole 912 are not particularly limited. For example, a plurality of randomly arranged third through-holes 912 may also be formed on the resistor 450.

[0058] like Figure 5 As shown, the second through-hole 920 and the third through-hole 912 open on the second outer surface S20 of the resistor 450. The second outer surface S20 includes the third surface S3 of the first resistor member 10 and the outer surface S22 of the second resistor member 20 formed on the outer periphery of the third surface S3. The third through-hole 912 opens on the third surface S3 of the first resistor member 10. The second through-hole 920 opens on the outer surface S22 of the second resistor member 20. The second through-hole 920 and the third through-hole 912 are formed rotationally symmetrically about the central axis Ax. If the plating can be uniformly formed on the substrate Wf to the desired degree, the number and arrangement pattern of the second through-hole 920 and the third through-hole 912 are not particularly limited. In addition, in this embodiment, the third through-hole 912 is approximately circular, and the first through-hole 911 and the second through-hole 920 are elongated holes in the circumferential direction. However, this is not limited to such examples. For instance, the first through hole 911 and the second through hole 920 can also be approximately circular, and the first through hole 911 and the second through hole 920 can also be different shapes.

[0059] In the illustrated example, the second resistance member 20 is a ring-shaped member arranged on the second outer surface side of the resistance body 450. The shape and position of the second resistance member 20 are not particularly limited if the size of the overlap of the first through-hole 911 and the second through-hole 920 can be changed. In the example of the present embodiment, the second resistance member 20 is arranged at the outer peripheral portion in such a manner that the second through-hole 920 is formed at the outer peripheral portion in the resistance body 450. The position of the second resistance member 20 in the resistance body 450 can be appropriately changed depending on the position at which the thickness of the plating to be adjusted is formed. The side on which the first resistance member 10 is arranged of the second resistance member 20 is set as a second surface S2 (see FIG. 9). Figure 7 ) The second through-hole 920 penetrates from the second surface S2 to an outer surface S22 of the second resistance member 20.

[0060] The range of the outer peripheral portion of the first resistance member 10 on which the second resistance member 20 is arranged can be outside by 50% or more, 60% or more, 70% or more, or 80% or more from the center axis Ax to the outer peripheral end of the first resistance member 10 in the radial direction. Alternatively, the range of the outer peripheral portion of the first resistance member 10 on which the second resistance member 20 is arranged can be outside by 50% or more, 60% or more, 70% or more, or 80% or more from the outer peripheral end of the substrate Wf when the holder 440 side is observed from the anode 430. Thus, with respect to the region that is likely to be a cause of reduction in uniformity of the thickness of the plating, the electric field can be efficiently adjusted, and the uniformity of the thickness of the plating formed on the substrate Wf can be further improved.

[0061] Figure 8 is a side view schematically showing the first resistance member 10, Figure 9 is a perspective view schematically showing the first resistance member 10. In Figure 8 , the upper side of the drawing becomes the first outer surface side, but in Figure 9 , the lower side of the drawing becomes the first outer surface side.

[0062] The first resistance member 10 includes a first portion 11 and a second portion 12. The first portion 11 has the first outer surface S10 on one side in the axial direction, and the second portion 12 and the first surface S1 are arranged on the other side. The third surface S3 is formed on the side of the second portion 12 opposite the first portion 11. The first portion 11 and the second portion 12 are arranged in line along the axial direction. The first portion 11 has a first outer diameter L1 in the radial direction. The second portion 12 has a second outer diameter L2 in the radial direction. The second outer diameter L2 is smaller than the first outer diameter L1. Thus, in the side surface S13 on the side of the first resistance member 10 on which the second resistance member 20 is arranged, the surface on which the second portion 12 is not arranged becomes the first surface S1. In other words, the side surface S13 includes the first surface S1 and the third surface S3.

[0063] The second resistive member 20 is formed to cover a portion of the side surface S13 of the first resistive member 10 on which the second resistive member 20 is arranged. Thereby, the electric field around the portion can be adjusted, and the thickness of plating formed on the substrate Wf can be adjusted locally. The third through-hole 912 is opened in the third surface S3 of the first resistive member 10 which is not covered by the second resistive member 20 in the above-described side surface S13. Thereby, for a portion of the plurality of through-holes in the resistive body 450, the electric field around the portion can be adjusted, and the thickness of plating formed on the substrate Wf can be adjusted according to the position.

[0064] In the resistive body 450, the first resistive member 10 and the second resistive member 20 are arranged so that the first surface S1 of the first resistive member 10 and the second surface S2 of the second resistive member 20 face each other. Figure 7 The second portion 12 of the first resistive member 10 is inserted into the hollow portion of the annular second resistive member 20, and supports the second resistive member 20 from the inside. Thereby, the alignment of the first resistive member 10 and the second resistive member 20 becomes easy, and the adjustment of the size of the overlap of the first through-hole 911 and the second through-hole 920 can be performed more precisely. Further, in the resistive body 450, the length of the through-hole can be made the same in the portion where the second resistive member 20 is provided and the portion where the second resistive member 20 is not provided. In addition, if the adjustment of the size of the overlap of the first through-hole 911 and the second through-hole 920 is possible, the shape and arrangement of the first resistive member 10 and the second resistive member 20 are not particularly limited. For example, the first resistive member 10 and the second resistive member 20 can each be a flat plate.

[0065] Figure 10 is a plan view of the resistive body 450 schematically showing a state in which the plurality of first through-holes 911 are partially closed, Figure 11 is a schematic view of the first through-hole 911 showing a partially closed state. The opening area of the first through-hole 911 among the first through-hole 911 and the third through-hole 912 which are opened in the first outer surface S10 of the resistive body 450 changes by the rotation of the second resistive member 20 with respect to the first resistive member 10. In the example shown in the drawing, a portion of the first through-hole 911 which corresponds to less than half of the maximum opening area is covered by the second surface S2 of the second resistive member 20. In the present embodiment, it is possible to continuously change from a state in which the first through-hole 911 is not completely covered by the second resistive member 20 to a state in which the first through-hole 911 is completely covered by the second resistive member 20, but it is not limited thereto. It is also possible to appropriately set the range of the opening of the first through-hole 911 to be obtained by physically limiting the position of the second resistive member 20 which can be arranged with respect to the first resistive member 10.

[0066] Here, the plating processing of the plating module 400 of the present embodiment is described in more detail. The substrate Wf is exposed to the plating solution by immersing the substrate Wf in the plating solution of the cathode region 422 using the lifting mechanism 442. The plating module 400 applies a voltage between the anode 430 and the substrate Wf in this state, whereby the plating processing can be performed on the plated surface Wf-a of the substrate Wf. In one embodiment, the plating processing is performed while rotating the holder 440 using the rotating mechanism 448. By the plating processing, a conductive film (plating film) is deposited on the plated surface Wf-a of the substrate Wf. Also, in the present embodiment, by employing the resistor body 450 described above, the opening area of the first through-hole 911 can be adjusted, and the uniformity of the thickness of the plating formed on the substrate Wf can be improved.

[0067] As described above, in the resistor body 450 of the present embodiment, one of the first resistor member 10 and the second resistor member 20 is configured to be rotatable with respect to the other along the first surface S1 or the second surface S2. Thus, without removing the resistor body 450 from the plating device 1000, the opening area of the first through-hole 911 can be adjusted simply, and thus a plating device 1000 in which plating is formed more uniformly can be provided. In addition, if the opening area of the first through-hole 911 can be changed, one of the first resistor member 10 and the second resistor member 20 can not be rotated with respect to the other. For example, the first resistor member 10 can be lifted slightly from the second resistor member 20, and then disposed on the second resistor member 20 after the angle is changed.

[0068] The resistor body 450 of the present embodiment includes the first resistor member 10 having the first surface S1 and formed with a plurality of first through-holes 911 that open in the first surface S1, and the second resistor member 20 having the second surface S2 and formed with a plurality of second through-holes 920 that open in the second surface S2, and the first resistor member 10 and the second resistor member 20 are disposed so that the first surface S1 and the second surface S2 face each other, and thus configured so that the size of the overlap of the plurality of first through-holes 911 and the plurality of second through-holes 920 is variable. Thus, without removing the resistor body 450 from the plating device 1000, the resistor body 450 having a plurality of through-holes (the first through-holes 911, the second through-holes 920, and the third through-holes 912) can be adjusted, and thus the uniformity of the thickness of the plating formed on the substrate Wf as the object can be improved.

[0069] The inventors conducted simulation in which a model of a plating device including a resistor body was made, and plating was formed on a substrate, the resistor body having a first resistor member formed with a plurality of first through holes and a plurality of third through holes, and a second resistor member formed with a plurality of second through holes. The plurality of first through holes and the plurality of second through holes were formed in the outer peripheral portion of the resistor body. The second resistor member was rotated with respect to the first resistor member, and the thickness of the plating film formed in the outer peripheral portion of the substrate was obtained by simulation.

[0070] Figure 12 is a graph showing the result of simulation. The horizontal axis shows a value x obtained by dividing the opening area of the first through hole by the maximum opening area of the first through hole, as a percentage. The vertical axis shows the thickness y (μm) of the plating film formed in the outer peripheral portion of the substrate. The solid line of the graph is a broken line connecting the measured points. The dotted line of the graph is a regression line based on the least squares method. As shown in Figure 12 , it is shown that there is a strong correlation between the opening area of the first through hole of the outer peripheral portion and the thickness of the plating film formed in the outer peripheral portion of the substrate.

[0071] The following modifications are also within the scope of the present application, and can be combined with the above-described embodiments or other modifications. In the following modification examples, with respect to the same configuration, the part that represents the function, and the like as in the above-described embodiments, the same reference numerals are used for reference, and the description is appropriately omitted.

[0072] (Modification Example 1)

[0073] In the above-described embodiments, the resistor body can also have a plurality of second resistor members.

[0074] Figure 13 is a perspective view schematically showing the resistor body 450A of the present modification example. Figure 14 is an exploded view schematically showing the resistor body 450A. Figure 15 is a bottom view schematically showing the resistor body 450A. Figure 16 is a perspective view showing the first resistor member 10A included in the resistor body 450A.

[0075] As shown in Figure 14As shown, the resistor body 450A includes the first resistor member 10A and a plurality of second resistor members 20A, 20B, 20C. In the resistor body 450A, the plurality of second resistor members 20A, 20B, 20C are arranged so as to oppose the first surface S1 of one first resistor member 10. Thus, the opening area of the first through-hole 911A, 911B, 911C opposing each second resistor member 20A, 20B, 20C can be adjusted more flexibly, and plating can be formed more uniformly on the substrate Wf. From this viewpoint, it is preferable that the second resistor members 20A, 20B, 20C be independently rotatable from each other. In the illustrated example, the second resistor member 20B is arranged on the outer periphery side of the second resistor member 20A in the first surface S1, and the second resistor member 20C is arranged on the outer periphery side of the second resistor member 20B. In the illustrated example, three second resistor members are arranged on one first resistor member 10A, but the number of second resistor members is not particularly limited, and can be two or more than four.

[0076] The first resistor member 10A includes a first portion 11A and a second portion 12A. The first portion 11A is formed on the first outer surface side of the second portion 12A. The outer diameter of the first portion 11A is larger than the outer diameter of the second portion 12A. The first resistor member 10A is formed with a plurality of first through-holes 911A, 911B, 911C that pass through from the first outer surface S10 to the first surface S1. The first resistor member 10A is further formed with a third through-hole 912A that passes through from the first outer surface S10 to the third surface S3.

[0077] The second resistor member 20A is formed in a ring shape around the center axis Ax and is formed with a plurality of second through-holes 920A arranged rotationally symmetrically about the center axis Ax. The second through-hole 920A passes through from the second surface S2 of the second resistor member 20A to the outer surface S22A of the second resistor member 20A. The plurality of second through-holes 920A are respectively formed at positions that can be connected to the plurality of first through-holes 911A formed on the outermost side of the first resistor member 10A when the second resistor member 20A is rotated relative to the first resistor member 10A. The second resistor member 20A is configured such that, if the second resistor member 20A is rotated relative to the first resistor member 10A, the size of the overlap of the first through-hole 911A and the second through-hole 920A as viewed from the axis changes.

[0078] The second resistance member 20B is formed in a ring shape around the central axis Ax, and is formed with a plurality of second through-holes 920B arranged rotationally symmetrically about the central axis Ax. The second through-holes 920B penetrate from the second surface S2 of the second resistance member 20B to the outer surface S22B of the second resistance member 20B. The plurality of second through-holes 920B are respectively formed at positions that can be connected to the plurality of first through-holes 911B formed inside the first through-holes 911A in the first resistance member 10A when the second resistance member 20B is rotated relative to the first resistance member 10A. The second resistance member 20B is configured such that, if the second resistance member 20B is rotated relative to the first resistance member 10A, the size of the overlap of the first through-holes 911B and the second through-holes 920B as viewed from the axis changes.

[0079] The second resistance member 20C is formed in a ring shape around the central axis Ax, and is formed with a plurality of second through-holes 920C arranged rotationally symmetrically about the central axis Ax. The second through-holes 920C penetrate from the second surface S2 of the second resistance member 20C to the outer surface S22C of the second resistance member 20C. The plurality of second through-holes 920C are respectively formed at positions that can be connected to the plurality of first through-holes 911C formed inside the first through-holes 911B in the first resistance member 10A when the second resistance member 20C is rotated relative to the first resistance member 10A. The second resistance member 20C is configured such that, if the second resistance member 20C is rotated relative to the first resistance member 10A, the size of the overlap of the first through-holes 911C and the second through-holes 920C as viewed from the axis changes.

[0080] Figure 17 FIG. 45 is a plan view schematically showing a state in which each of the first through-holes 911A, 911B, and 911C is partially closed. In this modification, it is possible to independently change the opening area of each of the first through-holes 911A, 911B, and 911C. In this case, as in the example shown in the figure, it is also possible to make the opening area of each of the first through-holes 911A, 911B, and 911C different, and thereby it is possible to more precisely adjust the electric field in the vicinity of the first through-holes 911A, 911B, and 911C. Therefore, it is possible to more uniformly form plating on the substrate Wf.

[0081] (Modification 2)

[0082] In the above-described embodiment, it is also possible to change the opening area of the first through-holes by moving one of the first resistance member and the second resistance member parallel relative to the other. This modification is preferably applied in the case where the substrate Wf is a square substrate, but can also be applied in the case where the substrate Wf is a circular substrate or the like.

[0083] Figure 18is a side view schematically showing the electric resistance body 450B of the present modification example. The electric resistance body 450B is provided with the first electric resistance member 10B and the second electric resistance member 20D. The first electric resistance member 10B is plate-shaped, and is formed with the first outer surface S10 on one side and the first surface S1 on the other side. The second electric resistance member 20D is plate-shaped, and is formed with the second surface S2 on one side and the second outer surface S20 on the other side.

[0084] Figure 19 is a schematic view showing the first surface S1 of the first electric resistance member 10B. The first electric resistance member 10B is formed with a plurality of first through-holes 911D. The first through-holes 911D pass through from the first outer surface S10 to the first surface S1.

[0085] Figure 20 is a schematic view showing the second surface S2 of the second electric resistance member 20D. The second electric resistance member 20D is formed with a plurality of second through-holes 920D. The second through-holes 920D pass through from the second outer surface S20 to the second surface S2.

[0086] Figure 21 is a plan view schematically showing a state in which the plurality of first through-holes 911D are each partially closed. In the electric resistance body 450B, the first electric resistance member 10B and the second electric resistance member 20D are disposed so that the first surface S1 and the second surface S2 face each other. By moving one of the first electric resistance member 10B and the second electric resistance member 20D relative to the other along the first surface S1 or the second surface S2, the opening area of the first through-holes 911D can be changed. Alternatively, if the opening area of the first through-holes 911D can be changed, the movement along the first surface S1 or the second surface S2 is not necessary. For example, the first electric resistance member 10B can be slightly lifted from the second electric resistance member 20D, and then disposed on the second electric resistance member 20D after the position is changed. Further, the size of the second electric resistance member 20D relative to the first electric resistance member 10B and the disposition of the second through-holes 920D can be adjusted so that the opening area of a part of the plurality of first through-holes 911D is changed.

[0087] (Modification Example 3)

[0088] In the above-described embodiment, the plating device can further be provided with a driving mechanism that rotates one of the first electric resistance member and the second electric resistance member relative to the other. The plating device of the present modification example has the same structure as the plating device 1000 of the above-described embodiment, but is different from the plating device 1000 in that the plating module 400 is replaced with a plating module 400A.

[0089] Figure 22is a longitudinal sectional view schematically showing the plating module 400A of the present modification example. The plating module 400A has the same structure as the plating module 400 of the above-described embodiment, but differs from the plating module 400 in that it is provided with a driving mechanism 452, a sensor 460, and a sensor support 468.

[0090] The driving mechanism 452 is a driving mechanism for rotating one of the first resistive member 10 and the second resistive member 20 relative to the other. The driving mechanism 452 is not particularly limited in the manner in which it drives the rotation, and can be provided with an electrically driven device such as a motor. The driving mechanism 452 can be controlled by the control module 800.

[0091] The sensor 460 is a film thickness sensor that measures the thickness of plating formed on the substrate Wf. The sensor support 468 that supports the sensor 460 is provided in the plating bath 410. In the present modification example, a plurality of sensors 460 are arranged at different distances from the rotation axis of the rotation mechanism 448, and the film thickness is measured over a large area of the substrate Wf by rotating the substrate Wf relative to the plurality of sensors 460. However, the arrangement of the sensors 460 is not particularly limited, and the sensor 460 can be one or any number of two or more. The sensor 460 can also be movable or scanable. The sensor 460 is not particularly limited in kind or the like as long as it can measure the thickness of plating formed on the substrate Wf. The sensor 460 is preferably not a structure that utilizes a change in resistance in the plating solution. Specifically, as the sensor 460, for example, an optical sensor such as a white confocal type, a potential sensor, a magnetic field sensor, or an eddy current type sensor can be used. The detection signal of the sensor 460 is input to the control module 800 and processed.

[0092] In the present modification example, the opening area of the first through-hole 911 can be adjusted by the driving mechanism 452 based on the uniformity of the thickness of plating obtained using the sensor 460. Thus, the resistive body 450 can be easily adjusted while confirming the uniformity of the thickness of plating formed, and a more uniform plating film can be formed. In addition, the plating module 400A can not be provided with the sensor 460. In this case, the opening area of the first through-hole 911 can also be easily adjusted by the driving mechanism 452, and adjustment during plating processing can also be performed. Furthermore, in Modification Example 2, the driving mechanism 452 can also move one of the first resistive member 10B and the second resistive member 20D relative to the other.

[0093] (Modification Example 4)

[0094] In the above-described embodiment, as in Patent Literature 2, the substrate Wf, the resistor, and the anode can also be arranged in the vertical direction in the plating apparatus. In this modification, the same effects as those of the above-described embodiment can be obtained.

[0095] The present application can also be described as follows.

[0096] [Mode 1] According to Mode 1, there is provided a plating apparatus resistor for adjusting an electric field, which is arranged in a plating apparatus between an anode and a holder that holds an object to be plated. Such a plating apparatus resistor includes: a first resistor member having a first surface and formed with a plurality of first through-holes that open in the first surface; and a second resistor member having a second surface and formed with a plurality of second through-holes that open in the second surface. The plating apparatus resistor is configured such that the first resistor member and the second resistor member are arranged so as to face each other with the first surface and the second surface, and the size of the overlap of the plurality of first through-holes and the plurality of second through-holes is variable. According to Mode 1, the plating apparatus resistor having a plurality of through-holes can be adjusted without removing the resistor from the plating apparatus, and the uniformity of the thickness of plating formed on the object can be improved.

[0097] [Mode 2] According to Mode 2, on the basis of Mode 1, one of the first resistor member and the second resistor member is configured to be movable or rotatable relative to the other along the first surface or the second surface. According to Mode 2, the plating apparatus resistor can be adjusted more easily and more precisely.

[0098] [Mode 3] According to Mode 3, on the basis of Mode 1 or 2, the second resistor member is arranged so as to cover a part of the side surface of the first resistor member on the side where the second resistor member is arranged. According to Mode 3, the electric field around the part can be adjusted, and the thickness of plating formed on the object can be adjusted locally.

[0099] [Mode 4] According to Mode 4, on the basis of any one of Modes 1 to 3, a third surface that is not covered by the second resistor member is formed with a third through-hole in the side surface of the first resistor member. According to Mode 4, the electric field around a part of the plurality of through-holes of the plating apparatus resistor can be adjusted, and the thickness of plating formed on the object can be adjusted according to the position.

[0100] [Mode 5] According to Mode 5, on the basis of Mode 4, in the above-mentioned first resistance member, the above-mentioned first surface is formed on the outer peripheral side of the above-mentioned third surface. According to Mode 5, it is possible to adjust the thickness of plating formed on the outer peripheral side of the object. Since there is a case where the formation speed of plating depends on the distance from the center of the object, in such a case, it is possible to particularly improve the uniformity of the thickness of plating formed.

[0101] [Mode 6] According to Mode 6, on the basis of Mode 5, the above-mentioned first resistance member has a first portion having a first outer diameter, and a second portion having a second outer diameter smaller than the above-mentioned first outer diameter, the above-mentioned first surface is formed in the above-mentioned first portion, and the above-mentioned third surface is formed in the above-mentioned second portion. According to Mode 6, the alignment of the first resistance member and the second resistance member becomes easy. Further, it is possible to more precisely perform adjustment of the opening area of the first through-hole, and it is possible to further improve the uniformity of the thickness of plating formed on the object.

[0102] [Mode 7] According to Mode 7, on the basis of any one of Modes 1 to 6, a plurality of the above-mentioned second resistance members are provided in a manner opposed to the above-mentioned first surface of one of the above-mentioned first resistance members. According to Mode 7, it is possible to more precisely adjust the electric field in the vicinity of each of the second resistance members. Therefore, it is possible to further improve the uniformity of the thickness of plating formed on the object.

[0103] [Mode 8] According to Mode 8, a plating device is provided with: a plating bath; an anode provided in the above-mentioned plating bath; a holder that holds an object of plating; and a resistance body for a plating device according to any one of Modes 1 to 7. According to Mode 8, without taking out the resistance body from the plating device, it is possible to improve the uniformity of the thickness of plating formed on the object by adjusting the resistance body for a plating device having a plurality of through-holes.

[0104] [Mode 9] According to Mode 9, on the basis of Mode 8, a drive mechanism that moves or rotates one of the above-mentioned first resistance member and the above-mentioned second resistance member with respect to the other is further provided. According to Mode 9, it is possible to more easily adjust the resistance body for a plating device, and adjustment in plating processing is also easy.

[0105] The above-described embodiments of the application are used for easy understanding of the application, and are not intended to limit the application. The application can of course be changed and improved without departing from the gist thereof, and the application includes equivalents. Further, in the range where at least a part of the above-described problems can be solved or at least a part of the effects can be obtained, any combination of the embodiments and modified examples can be made, and any combination or omission of the respective structural elements described in the claims and the specification can be made.

[0106] Explanation of Reference Signs

[0107] 10, 10A, 10B... 1st resistance member; 11, 11A... 1st part; 12, 12A... 2nd part; 20, 20A, 20B, 20C, 20D... 2nd resistance member; 400, 400A... plating module; 410... plating bath; 420... diaphragm; 422... cathode region; 424... anode region; 430... anode; 440... support; 442... lifting mechanism; 448... rotating mechanism; 450, 450A, 450B... resistance body; 452... driving mechanism; 800... control module; 911, 911A, 911B, 911C, 911D... 1st through-hole; 912, 912A... 3rd through-hole; 920, 920A, 920B, 920C, 920D... 2nd through-hole; 1000... plating apparatus; Ax... center axis; L1... 1st outer diameter; L2... 2nd outer diameter; S1... 1st face; S2... 2nd face; S3... 3rd face; S13... side face of 1st resistance member on which 2nd resistance member is arranged; S10... 1st outer surface; S20... 2nd outer surface; Wf... substrate.

Claims

1. A resistive element for a plating apparatus, which is a resistive element for adjusting the electric field disposed between an anode and a support holding the object to be plated in the plating apparatus. The resistive element used in the plating apparatus is characterized by having: A first resistive component, the first resistive component having a first surface and forming a plurality of first through holes opening on the first surface; and The second resistor component has a second surface and is formed with a plurality of second through holes opening on the second surface. The plating apparatus uses a resistive element configured such that the first resistive component and the second resistive component are arranged facing each other with the first surface and the second surface facing each other, and the overlap size of the plurality of first through holes and the plurality of second through holes is variable. The second resistor component is configured to cover a portion of the surface of the first resistor component on which the second resistor component is configured. A third through hole is formed on a third surface of the first resistor component that is not covered by the second resistor component, in the surface on which the second resistor component is disposed. The first resistive component includes a first portion having a first outer diameter and a second portion having a second outer diameter smaller than the first outer diameter. A first surface is formed on the first portion, and a third surface is formed on the second portion. The second resistor is ring-shaped, and the second part of the first resistor is inserted into the hollow part of the ring-shaped second resistor.

2. The resistive element for the plating apparatus according to claim 1, characterized in that, The device is configured to allow one of the first resistive component and the second resistive component to move or rotate relative to the other along the first surface or the second surface.

3. The resistive element for the plating apparatus according to claim 2, characterized in that, In the first resistor component, the first surface is formed on the outer peripheral side of the third surface.

4. The resistive element for the plating apparatus according to claim 1, characterized in that, It includes a plurality of second resistors configured to face the first face of one of the first resistors.

5. A plating apparatus, characterized in that, have: Plating tank; Anode, wherein the anode is disposed in the plating tank; A support, which holds the object to be plated; and The resistive element for the plating apparatus according to any one of claims 1 to 4.

6. The plating apparatus according to claim 5, characterized in that, It further includes a drive mechanism that allows one of the first resistor component and the second resistor component to move or rotate relative to the other.

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