Refrigerating and heating device and cold and heat control method

Abstract

The invention discloses a refrigerating and heating device and a cold and heat control method. The refrigerating and heating device comprises a driver, a refrigerating and heating generator and a medium circulation unit. The refrigerating and heating generator comprises a flow cavity, a medium and a solid elastic clamping material unit. The medium circulating unit comprises a pipeline and a heat exchange unit, and the pipeline communicates with the flow cavity; during heating, the solid elastic clamping material unit is loaded, heat is generated during phase change, a medium in the flow cavity is heated, the heated medium is conveyed to the heat exchange unit for heat supply through the pipeline, and the medium enters the flow cavity through the pipeline; when the solid elastic clamping material unloading unit generates reverse phase change, cold energy is generated to cool the medium in the flow cavity, the cooled medium is conveyed away through the pipeline, and the medium enters the flow cavity through the pipeline; or during refrigeration, the solid elastic clamping material unit is unloaded, the cooled medium is conveyed to the heat exchange unit through the pipeline for cooling, and the medium enters the flow cavity through the pipeline; and the solid elastic clamping material unit is loaded, the heating medium is conveyed away through the pipeline, and the medium enters the flow cavity through the pipeline.

Description

Technical Field

[0001] The present invention belongs to the technical field of refrigeration and heating, and in particular relates to a refrigeration and heating device and a cooling and heating control method. Background Art

[0002] The development of space cooling and heating technology is an important guarantee for people to maintain a high quality of life in modern times. Common space cooling and heating systems include using air conditioners to lower or raise the temperature of the surrounding space, using refrigerators to keep items stored inside at low temperatures, and using heating equipment to maintain a constant temperature in the local space.

[0003] In the existing technology, the control of space temperature is often achieved through gas compression refrigerators. However, in the context of the strategy of sustainable development, this cooling and heating method has exposed many problems: First, the refrigerants used in gas compression refrigerators (such as chlorine- and bromine-containing refrigerants) will be discharged into the environment in large quantities, causing a sharp drop in the ozone content in the atmosphere and causing irreversible damage to the atmosphere; and although the existing environmentally friendly refrigerants (such as fluorine- and ammonia-containing refrigerants) have reduced harm to the environment, they have the disadvantages of being flammable and explosive, and there are great safety risks when using them. Second, the energy conversion rate of cooling and heating through gas compression is very low, and most of the electrical energy cannot be effectively converted, resulting in energy waste. Summary of the invention

[0004] The embodiment of the present application provides a cooling and heating device, comprising: a driver, a cooling and heating generator, and a medium circulation unit; wherein: The cooling and heating generator comprises: a flow cavity, a medium and a solid spring material unit; The medium circulation unit comprises: a pipeline and a heat exchange unit, wherein the pipeline is in communication with the flow cavity; When heating, the driver loads the solid-state spring-stuck material unit, and when the solid-state spring-stuck material unit undergoes a phase change, heat is generated to increase the temperature of the medium in the flow cavity, and the medium circulation unit transports the heated medium to the heat exchange unit through the pipeline for heating, and the medium in the medium circulation unit enters the flow cavity through the pipeline; and when the driver unloads the solid-state spring-stuck material unit and an inverse phase change occurs, cold is generated to cool the medium in the flow cavity, and the medium circulation unit transports the cooled medium away through the pipeline, and the medium in the medium circulation unit enters the flow cavity through the pipeline; Or, when cooling, the driver unloads the solid-state ejection material unit, the medium circulation unit transports the cooled medium to the heat exchange unit through the pipeline for cooling, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline; and, the driver loads the solid-state ejection material unit, the medium circulation unit transports the heated medium through the pipeline, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline.

[0005] Further, the pipeline includes a first pipeline and a second pipeline, and the first pipeline and the second pipeline are arranged at two ends of the cooling and heating generator; The first pipeline is used to transport the heated medium to the heat exchange unit for heating, and to allow the heated medium in the heat exchange unit to enter the flow cavity; The second pipeline is used to transport the cooled medium to the heat exchange unit for cooling, and to allow the cooled medium in the heat exchange unit to enter the flow cavity.

[0006] Furthermore, the heat exchange unit includes: a first heat exchange unit and / or a second heat exchange unit; the first pipeline is connected to the first heat exchange unit, and is used to transport the heated medium to the first heat exchange unit for heating or transportation; the second pipeline is connected to the second heat exchange unit, and is used to transport the cooled medium to the second heat exchange unit for cooling or transportation.

[0007] Further, the medium circulation unit includes: an energy exchanger; The energy exchanger is directly or indirectly connected to the pipeline, and is used to transport the cold of the cooling medium during heating or to transport the heat of the heating medium during cooling.

[0008] Furthermore, the energy exchanger is also used to store the cooled medium or the heated medium.

[0009] Further, the pipeline includes a liquid outlet pipeline and a liquid inlet pipeline, and the liquid inlet pipeline is connected to the energy exchanger; The liquid outlet pipeline is used to transport the heated or cooled medium to the heat exchange unit, and allows the medium in the energy exchanger to flow into the flow cavity.

[0010] Further, the medium circulation unit comprises: a first liquid outlet pipeline and a second liquid outlet pipeline; The first liquid outlet pipeline and the second liquid outlet pipeline are respectively arranged at two ends of the cooling and heating generator, and are used to transport the heated medium and the cooled medium respectively; The liquid inlet pipeline is arranged at any end of the refrigeration and heating generator and is connected with the energy exchanger to allow the medium to enter the flow cavity.

[0011] Furthermore, the medium circulation unit further comprises: a first liquid inlet pipeline and a second liquid inlet pipeline; The first liquid inlet pipeline and the second liquid inlet pipeline are both in communication with the energy exchanger; During heating, the second liquid outlet pipeline transports the cooled medium to the energy exchanger, and allows the medium to flow into the flow cavity through the second liquid inlet pipeline; or, during cooling, the first liquid outlet pipeline transports the heated medium to the energy exchanger, and allows the medium to flow into the flow cavity through the first liquid inlet pipeline.

[0012] Further, The first liquid outlet pipeline and the first liquid inlet pipeline are both connected to the heat exchange unit, the first liquid outlet pipeline is used to transport the heated medium or the cooled medium to the heat exchange unit for heating or cooling, and the first liquid inlet pipeline is used to allow the medium after heat exchange to flow into the flow cavity; The second liquid outlet pipeline and the second liquid inlet pipeline are both connected to the energy exchanger, and are used to transport the cooling medium to the energy exchanger during heating, or to transport the heating medium to the energy exchanger during cooling.

[0013] Furthermore, it also includes: a pump body, which is arranged on the pipeline.

[0014] Furthermore, it also includes: a flow controller, which is arranged at the connection between the pipeline and the heat exchange unit, and at the connection between the pipeline and the energy exchanger.

[0015] Furthermore, it also includes: a controller, wherein the controller is used to control the start and stop of the driver, the pump body and the flow controller.

[0016] Furthermore, the heat exchange unit includes: a blower.

[0017] Furthermore, there are multiple solid-state spring-loaded material units in the cooling and heating generator, each of which is a hollow structure and is arranged in sequence, wherein the hollow structures in the multiple solid-state spring-loaded material units are connected to form a first flow cavity.

[0018] Furthermore, the cooling and heating generator also includes: a cylinder, a plurality of the solid spring material units arranged in sequence are placed in the cylinder, and the gap between the solid spring material unit and the cylinder forms a second flow cavity, and the first flow cavity and the second flow cavity are connected through a through hole.

[0019] Furthermore, the cooling and heating generator is multiple, including a first cooling and heating generator and a second cooling and heating generator; the driver includes: a motor and a rotating wheel, and the rotating wheel includes a protrusion; The motor drives the rotating wheel to rotate, so that the protrusion on the rotating wheel applies stress to the first cooling and heating generator, and at the same time, the part other than the protrusion relieves the stress from the second cooling and heating generator.

[0020] The refrigeration and heating device provided by the present invention is applied to an air conditioner, a refrigerator or a heat pump.

[0021] The present invention provides a cooling and heating control method, which is applied to the cooling and heating device as described above, comprising: Get the set temperature and ambient temperature; Determine the operating frequency of the driver loading or unloading the solid-state ejection material unit and the thermal conductivity parameter for conducting the heat or cold according to the set temperature and the ambient temperature; The operation of the cooling and heating generator is controlled according to the operating frequency and the thermal conductivity parameter so that the ambient temperature reaches the set temperature.

[0022] Furthermore, it also includes: Acquire historical data, the historical data including: duration of cooling or heating to a preset temperature and operating frequency and thermal conductivity parameters of a driver corresponding to the duration, wherein the thermal conductivity parameters include: thermal conductivity, specific heat capacity, cross-sectional area, specific surface area and pump pressure parameters of the medium; The historical data is input into a preset neural network model for training to obtain an optimal parameter model for cooling and heating, and the optimal operating frequency corresponding to each preset temperature and the thermal conductivity parameter matching the optimal operating frequency are determined according to the optimal parameter model for cooling and heating.

[0023] Further, the step of determining the operating frequency of the driver and the thermal conductivity parameter for conducting the heat or cold according to the set temperature and the ambient temperature includes: When the temperature difference between the set temperature and the ambient temperature is greater than a first preset temperature, determining a preset maximum operating frequency as the operating frequency of the driver; The optimal thermal conductivity parameter that matches the maximum operating frequency is searched for as the thermal conductivity parameter.

[0024] Further, the step of determining the operating frequency of the driver and the thermal conductivity parameter for conducting the heat or cold according to the set temperature and the ambient temperature includes: When the temperature difference between the set temperature and the ambient temperature is less than the first preset temperature and greater than the second preset temperature, the optimal operating frequency and the thermal conductivity parameter matching the optimal operating frequency are searched according to the set temperature as the operating frequency and the thermal conductivity parameter.

[0025] Furthermore, it also includes: When the temperature difference between the set temperature and the ambient temperature is less than the second preset temperature, searching for the optimal operating frequency and thermal conductivity parameters according to the set temperature; The optimal operating frequency and the pump pressure parameter in the heat transfer parameter are kept unchanged, and the cross-sectional area of ​​the flow cavity is adjusted until the ambient temperature reaches the set temperature.

[0026] The refrigeration and heating device provided by the present invention comprises: a driver, a refrigeration and heating generator and a medium circulation unit; wherein the refrigeration and heating generator comprises: a flow cavity, a medium and a solid-state spring-stuck material unit; the medium circulation unit comprises: a pipeline and a heat exchange unit, and the pipeline is connected to the flow cavity; when heating, the driver loads the solid-state spring-stuck material unit, and the solid-state spring-stuck material unit generates heat when a phase change occurs to heat up the medium in the flow cavity, and the medium circulation unit transports the heated medium to the heat exchange unit through the pipeline for heating, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline; and the driver unloads the solid-state spring-stuck material unit When the reverse phase change occurs, cold energy is generated to cool the medium in the flow cavity, and the medium circulation unit transports the cooled medium through the pipeline, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline; or, when cooling, the driver unloads the solid-state spring-stuck material unit, and the medium circulation unit transports the cooled medium to the heat exchange unit through the pipeline for cooling, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline; and, the driver loads the solid-state spring-stuck material unit, and the medium circulation unit transports the heated medium through the pipeline, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline.

[0027] The refrigeration and heating device in the present invention uses a medium circulation unit to transport the heated medium in the flow cavity and the cooled medium through a pipeline to the heat exchange unit for cooling or heating. Since the generation of heat and cold is based on the phase change of the solid spring card, it does not involve harmful substances, is safe and efficient, and can be applied to various fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 A schematic diagram of a refrigeration and heating device is provided for the present invention; Figure 2A schematic diagram of a refrigeration and heating device is provided for the present invention; Figure 3 A schematic diagram of a refrigeration and heating device is provided for the present invention; Figure 4 A schematic diagram of a refrigeration and heating device is provided for the present invention; Figure 5 A schematic diagram of a refrigeration and heating device is provided for the present invention; Figure 6 A schematic diagram of a refrigeration and heating device is provided for the present invention; Figure 7 The present invention provides a flow chart of a cooling and heating control method. DETAILED DESCRIPTION

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0031] The present invention provides a refrigeration and heating device, such as Figure 1 The figure shows a schematic diagram of a cooling and heating device, including: a driver, a cooling and heating generator and a medium circulation unit; wherein, The refrigeration and heating generator includes: a flow cavity, a medium and a solid spring material unit; The medium circulation unit comprises: a pipeline and a heat exchange unit, wherein the pipeline is connected with the flow cavity; When heating, the driver loads the solid-state spring-loaded material unit, and when the solid-state spring-loaded material unit undergoes a phase change, heat is generated to increase the temperature of the medium in the flow cavity, and the medium circulation unit transports the heated medium to the heat exchange unit through a pipeline for heating, and the medium in the medium circulation unit enters the flow cavity through the pipeline; and when the driver unloads the solid-state spring-loaded material unit and an inverse phase change occurs, cold is generated to cool the medium in the flow cavity, and the medium circulation unit transports the cooled medium away through a pipeline, and the medium enters the flow cavity through the pipeline; Or, when cooling, the driver unloads the solid-state spring-loaded material unit, and the medium circulation unit transports the cooled medium to the heat exchange unit through the pipeline for cooling, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline; and the driver loads the solid-state spring-loaded material unit, and the medium circulation unit transports the heated medium through the pipeline, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline.

[0032] Specifically, in the cooling and heating generator, the solid spring card material is a solid material that can release or absorb heat during the phase change process. Shape memory alloys, natural rubber, synthetic polymers, plastic crystals, etc. can be selected. Preferably, it is one of nickel-titanium alloy, copper-aluminum-manganese alloy, nickel-manganese-titanium alloy, nickel-titanium-copper alloy, nickel-titanium-copper-cobalt alloy and nickel-iron-gallium alloy. The cooling and heating device is manufactured by utilizing the principle of heat release during the phase change process from austenite to martensite of shape memory alloy and heat absorption during the reverse phase change from martensite to austenite.

[0033] The solid-state spring card material unit made of the spring card material can be one or more. In order to avoid material buckling, it can also be made into a sheet. In order to facilitate implementation and expand heat conduction, the solid-state spring card material is set to a tubular shape (for example, spiral, honeycomb, radial, etc.), that is, the solid-state spring card material unit includes a hollow part, and multiple solid-state spring card material units are connected in sequence so that the respective hollow parts form a first flow cavity. In another embodiment, in order to increase heat conduction by expanding the flow cavity, a sleeve is set outside the solid-state spring card material unit so that the inner wall of the sleeve and the outer wall of the solid-state spring card material unit form a second flow cavity. In some embodiments, one or more groups of sequentially connected solid-state spring card units can be set in the sleeve, or a cooling and heating generator composed of multiple sleeves. In some embodiments, a through hole is set on the solid-state spring card material unit so that the first flow cavity and the second flow cavity are connected, so that the medium increases heat conduction when flowing in the flow cavity. In another embodiment, an inlet and an outlet for facilitating the flow of the medium are set on the solid-state spring card material unit or the sleeve, and a driving element connected to the solid-state spring card material unit is convenient for loading or unloading the driver. In some other embodiments, a fixing device such as a bracket is also included to fix the solid-state spring-cage material unit, which is not limited here, as long as the solid-state spring-cage material unit can realize the loading of the driver. In this embodiment, the medium can be a liquid medium or a fluid medium, such as water, alcohol, liquid metal, organic matter, etc.

[0034] In the embodiment of the present invention, the motor in the driver can be selected from DC motors, stepper motors, permanent magnet synchronous motors, servo motors, AC synchronous motors or torque motors, etc., which are not limited here. In this embodiment, the motor drive is used to control the loading assembly thereon to apply pressure or tension to the solid-state spring-stuck material unit in the cooling and heating generator, and unload the tension or pressure to achieve loading and unloading of the solid-state spring-stuck material unit. In one embodiment, the loading assembly includes: a main shaft, a turntable coaxially connected to one end of the main shaft, a rotating drive component connected to the turntable, a plurality of groups of solid-state spring-stuck material units and a lifting member; the rotating drive component drives the turntable to rotate relative to the main shaft, and the rotating axis of the turntable coincides with the central axis of the main shaft, and the plurality of groups of solid-state spring-stuck material units are arranged at intervals on the outside of the main shaft around the central axis of the main shaft, one end of the lifting member is connected to the solid-state spring-stuck material unit, and the other end is abutted against the side of the turntable, and a plurality of protrusions are arranged on the turntable, and as the turntable rotates, each protrusion abuts against one of the lifting members, so that the lifting member moves downward under pressure. In actual use, each solid spring material unit is in an unloading state when the lifting member abuts against the lower side of the turntable, and is in a loading state when the lifting member abuts against the protrusion.

[0035] In this embodiment, the medium circulation unit is a unit for managing the cooling and heating of the refrigeration and heating device, which includes a pipeline and a heat exchange unit, that is, the medium that is heated or cooled is transported to the heat exchange unit through the pipeline to realize heating or cooling. In some embodiments, the refrigeration and heating device also includes a controller, and the medium circulation unit also includes: a pump body and a flow controller, wherein the pump body is arranged on the pipeline, and the flow controller is arranged at the connection between the pipeline and the heat exchange unit, or at the connection between the pipeline and other equipment, and is used to control the connection and closure of the pipeline and the flow rate of the medium, wherein the controller can be a chip, a microprocessor, a single-chip microcomputer, etc., and sends signals to the pump body and the flow controller wirelessly or wiredly, the pump body can be a pressure pump or a vacuum pump, and the flow controller can be an expansion valve, a wind valve, etc.

[0036] It should be noted that when the cooling and heating device is working, the driver periodically loads and unloads the solid-state spring-loaded material unit, that is, the solid-state spring-loaded material unit is always periodically releasing and absorbing heat. Therefore, in order to achieve cooling or heating, the medium circulation unit cooperates with the cooling and heating generator. For example, when heating, the driver loads the solid-state spring-loaded material unit, and the solid-state spring-loaded material unit releases heat when a phase change from austenite to martensite occurs, so that the medium in the flow cavity is heated. After a preset time period (the medium can be heated to a preset temperature and the loading is not completed), the controller in the medium circulation unit sends a signal to the first pump body arranged in the pipeline to start, and the pipeline transports the heated medium to the heat exchange unit for heating. When the loading is completed, the controller sends a signal to the first pump body to shut down, and the second pump body to start so that the medium quickly flows into the flow cavity from the pipeline; when the driver is unloaded, the solid-state spring-loaded material unit absorbs heat when a reverse phase change from martensite to austenite occurs. Similarly, the controller sends a signal to the first pump body to start and to the second pump body to shut down, and the pipeline transports the cooled medium away. For example, cyclic heating, heat exchange or storage can be performed. After a preset time period (the cooled medium in the flow cavity is transported away), the controller sends a signal to the first pump body to shut down and to the second pump body to start, then the medium quickly flows into the flow cavity from the liquid inlet pipe, and the driver is unloaded.

[0037] When in the refrigeration function, the driver unloads the solid-state card material unit, the solid-state card material unit absorbs heat, and the medium in the flow cavity cools down. At this time, the controller in the medium circulation unit sends a signal to the first pump body arranged on the pipeline to start, and the pipeline transports the cooled medium to the heat exchange unit for cooling. When the cooled medium in the flow cavity is transported away, the controller sends a signal to the first pump body to shut down and sends a signal to the second pump body to start. Then the medium quickly flows into the flow cavity from the pipeline, and the driver unloading is completed; when the driver is loaded, the solid-state card material unit absorbs heat, the controller sends a signal to the first pump body to start, sends a signal to the second pump body to shut down, and the pipeline transports the heated medium. For example, cyclic cooling, heat exchange or storage can be performed. When the heated medium in the flow cavity is transported away, the controller sends a signal to the first pump body to shut down and sends a signal to the second pump body to start. Then the medium quickly flows into the flow cavity from the pipeline, and the driver unloading is completed.

[0038] It should be noted that the first pump body and the second pump body can adopt a vacuum pump, a magnetic pump, a mechanical pump, etc., and their installation positions are determined according to the selected type. There is no limitation here, as long as the above-mentioned technical effects can be achieved.

[0039] In an embodiment of the present invention, when the pipeline transports the heated or cooled medium out of the flow cavity, the flow controller can be used to connect the heat exchange unit, the device for recovering the medium or the device for direct discharge, that is, when heating, the controller sends a signal to the flow controller to connect the heat exchange unit, disconnect other connected devices, and transport the heated medium to the heat exchange unit. When the first pump body is closed and the second pump body is opened, the medium after heat exchange in the heat exchange unit is transported to the flow cavity by the pipeline; and after the pipeline is connected to other devices for transport, the medium for reflux (for example, the medium source, the cooling tower, etc.) is refluxed to the flow cavity through the pipeline. In this embodiment, the first pump body on the pipeline is used to transport the medium in the flow cavity to the heat exchange unit, and the second pump body is used to transport the medium back to the flow cavity. In this embodiment, the controller can refer to the above-mentioned operation logic and send a signal to the first pump body and the second pump body according to the preset time period to turn on or off.

[0040] In some embodiments, Figure 2 As shown, the pipeline includes a first pipeline and a second pipeline, and the first pipeline and the second pipeline are arranged at both ends of the cooling and heating generator; the first pipeline is used to transport the heated medium to the heat exchange unit for heating, and allow the medium after heating (after heat exchange) in the heat exchange unit to enter the flow cavity; the second pipeline is used to transport the cooled medium to the heat exchange unit for cooling, and allow the medium after cooling (after heat exchange) in the heat exchange unit to enter the flow cavity.

[0041] It should be noted that the first pipeline and the second pipeline can be connected to a device for recovering the medium or a device for direct discharge to transport the cooling medium during heating and the heating medium during cooling.

[0042] In some embodiments, Figure 3As shown, the heat exchange unit includes: a first heat exchange unit and a second heat exchange unit; the first pipeline is connected to the first heat exchange unit, and is used to transport the heated medium to the first heat exchange unit for heating or transporting away, and the second pipeline is connected to the second heat exchange unit, and is used to transport the cooled medium to the second heat exchange unit for cooling or transporting away. The first pipeline and the second pipeline are respectively connected to the first heat exchange unit and the second heat exchange unit, and both are provided with a first pump body and a second pump body. When heating, the first pump body is controlled to start to transport the heated medium to the first heat exchange unit, and the second pump body is controlled to start to return the medium in the first heat exchange unit to the flow cavity, and the first pump body on the second pipeline is controlled to transport the cooled medium to the second heat exchange unit, and the second pump body on the second pipeline is controlled to return the medium in the second heat exchange unit to the flow cavity. In this embodiment, the first heat exchange unit and the second heat exchange unit can be units formed by longer pipelines, and can be fins for heat dissipation, which are not specifically limited, and their specific shapes and forms can be the same or different. For example, in a heating application scenario, the first heat exchange unit can be set as a fin installed in the environment to be heated, and the second heat exchange unit can be set as a longer pipe. In this way, the heated medium can release heat through the fins, and the cooled medium can exchange heat with the environment through the pipe.

[0043] In order to more conveniently manage the heat of the refrigeration and heating device, the device can also be used for circulation or utilization. In one embodiment of the present invention, the medium circulation unit also includes: an energy exchanger, which is directly or indirectly connected to the liquid outlet pipeline and the liquid inlet pipeline, and is used to transport the cold of the cooling medium during heating or the heat of the heated medium during cooling. In practical applications, the energy exchanger can be a sufficiently long liquid outlet pipeline. When the medium achieves the purpose of heat exchange during the flow process, the energy exchanger can be a heat dissipation device, such as a fin, or a cooling circulation pool, which is not limited here, as long as the purpose of heat exchange can be achieved. In order to save resources, the energy exchanger is also used to store the cooling medium or the heated medium. Further, the energy exchanger includes: a heat storage tank and a cold storage tank; the heat storage tank is used to store the heated medium; the cold storage tank is used to store the cooled medium. In this embodiment, the shape and state of the heat storage tank and the cold storage tank are not limited, and they can be containers or pipelines, as long as the heat or cold can be reused for a second time.

[0044] In some embodiments, the first pipeline and the second pipeline are also connected to the energy exchanger, respectively, wherein a flow controller is provided on the first pipeline and the second pipeline, and during the heating process, when the heated medium is transported, the first pipeline is connected to the heat exchange unit, disconnected from the energy exchanger, and the heated medium is transported to the heat exchange unit by the first pipeline, and the second pipeline is disconnected from the heat exchange unit and connected to the energy exchanger, so that after the heated medium is transported, the cold generated by the next unloading of the solid-state card material unit can be transported to the energy exchanger by the second pipeline along with the cooled medium. Similarly, during the cooling process, when the cooled medium is transported, the second pipeline is connected to the heat exchange unit, disconnected from the energy exchanger, and the cooled medium is transported to the heat exchange unit by the second pipeline, and the first pipeline is disconnected from the heat exchange unit and connected to the energy exchanger, so that the heat generated by the next loading of the solid-state card material unit can be transported to the energy exchanger by the first pipeline along with the cooled medium. It should be noted that in this embodiment, the flow controller connecting the first pipeline and the second pipeline to the heat exchange unit and the flow controller connecting the first pipeline and the second pipeline to the energy exchanger are controlled by the controller. The control logic can refer to the above-mentioned cooling and heating control logic and will not be repeated here.

[0045] In some embodiments, in order to adapt to the internal structure of the refrigeration and heating device, the pipelines set in some scenarios include a liquid outlet pipeline and a liquid inlet pipeline, and the liquid inlet pipeline is connected to the energy exchanger; when the temperature of the medium approaches room temperature after the heat exchange unit supplies cooling or heating to the environment, at this time, the heat exchange unit can also be connected to the liquid inlet pipeline so that the medium that has completed heating or cooling can flow back to the flow cavity to replenish the medium.

[0046] Specifically, please refer to the following embodiments for the connection relationship between the energy exchanger and the liquid outlet pipeline and the liquid inlet pipeline. Among them, the energy exchanger is respectively connected to the liquid inlet pipeline, the liquid outlet pipeline and the heat exchange unit, and a flow controller is set at the connection. At this time, when heating, after the medium is heated up, the liquid outlet pipeline is controlled to be disconnected from the interface of the energy exchanger, and connected to the interface of the heat exchange unit, so that the heated medium flows into the heat exchange unit for heating. After the heating is completed, it is connected to the energy exchanger to allow the medium to flow into the energy exchanger. After that, after the medium cools down, the liquid outlet pipeline is controlled to be connected to the interface of the energy exchanger, and disconnected from the interface of the heat exchange unit, so that the cooled medium flows into the energy exchanger. At the same time, the liquid inlet pipeline transports the medium in the energy exchanger to the flow cavity; please refer to the above working principle when cooling. In other embodiments, the heat exchange unit can also be connected to the liquid inlet pipeline, and the liquid inlet pipeline and the liquid outlet pipeline can be set on both sides of the flow cavity.

[0047] like Figure 3The figure shows a structural schematic diagram of another cooling and heating device provided by the present invention, wherein the medium circulation unit includes: a first liquid outlet pipeline and a second liquid outlet pipeline; the first liquid outlet pipeline and the second liquid outlet pipeline are respectively arranged at both ends of the cooling and heating generator and are both connected to the heat exchange unit through a flow controller, and are respectively used to transport the heated medium and the cooled medium, and the flow controller controls the heat exchange unit to be disconnected from the second liquid outlet pipeline when it is connected to the first liquid outlet pipeline, or controls the heat exchange unit to be connected to the second liquid outlet pipeline when it is closed to the first liquid outlet pipeline; the liquid inlet pipeline is arranged at either end of the cooling and heating generator and is connected to the energy exchanger to allow the medium to enter the flow cavity.

[0048] like Figure 4 The figure is a schematic diagram of the structure of a cooling and heating device provided by the present invention. As shown in the figure, the medium circulation unit also includes: a first liquid inlet pipeline and a second liquid inlet pipeline; the first liquid inlet pipeline and the second liquid inlet pipeline are both connected to the energy exchanger through a flow controller, and the flow controller controls the energy exchanger to be connected to the first liquid inlet pipeline or the second liquid inlet pipeline; when heating, the second liquid outlet pipeline transports the cooled medium to the energy exchanger, and the medium flows into the flow cavity through the second liquid inlet pipeline; or, when cooling, the first liquid outlet pipeline transports the heated medium to the energy exchanger, and the medium flows into the flow cavity through the first liquid inlet pipeline.

[0049] like Figure 5 As shown, it is a structural schematic diagram of a cooling and heating device provided by the present invention, the first liquid outlet pipeline and the first liquid inlet pipeline are both connected to the heat exchange unit, the first liquid outlet pipeline is used to transport the heated medium or the cooled medium to the heat exchange unit for heating or cooling, and the first liquid inlet pipeline is used to allow the medium after heat exchange to flow into the flow cavity; the second liquid outlet pipeline and the second liquid inlet pipeline are both connected to the energy exchanger, and are used to transport the cooled medium to the energy exchanger during heating, or, during cooling, to transport the heated medium to the energy exchanger.

[0050] The present invention also provides a cooling device for an air conditioner, a refrigerator, a heat pump, and an energy storage device, all of which include the refrigeration and heating equipment described above.

[0051] like Figure 5 As shown, the present invention provides a cooling and heating control method, which is applied to the above-mentioned cooling and heating device, comprising: S1. Obtain the set temperature and ambient temperature; In an embodiment of the present invention, a user inputs a set temperature into a controller in a cooling and heating device through voice, button, touch or other means, wherein the set temperature is the temperature reached by the cooling and heating device after cooling or heating, and the ambient temperature is the temperature of a target space (such as a room, a compartment, a machine room, etc.) or a target object (such as a battery, electronic components, IT equipment, drinks, food, etc.) for which the cooling and heating device is intended to perform temperature regulation. The ambient temperature represented varies according to the different fields in which the cooling and heating device is applied. When the cooling and heating device is applied to an air conditioner, the ambient temperature is the indoor temperature of the air conditioner; when the cooling and heating device is applied to a refrigerated truck, the ambient temperature is the temperature inside the refrigerated truck; and when the cooling and heating device is applied to electronic components, the ambient temperature is the temperature of the electronic components to be cooled.

[0052] S2, determining the frequency of the driver loading or unloading the solid-state card material unit and the thermal conductivity parameter of the heat or cold conduction according to the set temperature and the ambient temperature; In this embodiment, each operation cycle of the driver includes: the loading time, heat maintenance time, unloading time and cold maintenance time of the solid card material unit, wherein the heat maintenance time and cold maintenance time are the time when the driver stops working, that is, the time taken by the medium circulator to transfer heat and cold to the heat exchange unit through the pipeline and add new medium to the flow cavity. The thermal conductivity parameter is a parameter that affects the speed of the medium to transfer heat or cold, including: the specific heat capacity of the medium, the hollow cross-sectional area of ​​the flow cavity and the pump pressure parameter.

[0053] The cooling and heating device can change the heat or cold it generates by changing the operating frequency of the driver and the thermal conductivity parameters of the heat or cold conduction so that the temperature reaches a steady state. It should be noted that the faster the driver operates, the more times the driver loads or unloads the solid-state spring card material unit per unit time. Under the same loading or unloading intensity, the heat or cold generated at a single time is constant. The more times, the more heat or cold the solid-state spring card material unit generates per unit time. In addition, during the driver operation cycle, the heat maintenance time and the cold maintenance time also have an important influence on the heat or cold obtained by the medium. The shorter the heat / cold maintenance time, the less heat or cold the medium obtains. The longer the heat / cold maintenance time, the more heat or cold the medium obtains. However, when the heat / cold maintenance time is too long, the more heat or cold is lost. Therefore, the operating frequency of the driver (the inverse of the operating cycle) has an important influence on both the heating and cooling capacity.

[0054] On the other hand, the thermal conductivity parameters of the heat or cold conduction also have a great influence on the temperature of the refrigeration and heating device. When the generated heat or cold is constant, the thermal conductivity parameters are small, and the medium cannot timely transfer the heat and cold to the heat exchange unit for heat exchange; or when the thermal conductivity parameters are large, the medium transfers faster and the heat or cold generated by the solid spring card material obtained is less. In both cases, the refrigeration and heating device works at a low efficiency. Therefore, in one embodiment of the present invention, for each set temperature, the operating frequency of the driver and the thermal conductivity parameters matching the operating frequency need to be determined to reduce energy loss and conduct heat and cold to the greatest extent.

[0055] To solve the above problems, the present invention provides a method for determining the operating frequency of a driver loading or unloading a solid-state ejection material unit and the thermal conductivity parameters of the heat or cold conduction, comprising: Step 1, obtaining historical data, the historical data including: the duration of cooling or heating to a preset temperature and the operating frequency and thermal conductivity parameters of the driver corresponding to the duration, wherein the thermal conductivity parameters include: thermal conductivity, specific heat capacity, hollow cross-sectional area of ​​the flow cavity, specific surface area and pump pressure parameters of the medium; Step 2: Input historical data into a preset neural network model for training to obtain an optimal parameter model for cooling and heating, and determine the optimal operating frequency corresponding to each preset temperature and the thermal conductivity parameters matching the optimal operating frequency based on the optimal parameter model for cooling and heating.

[0056] In practical applications, in order to determine the cooling capacity or heating capacity to reach the preset temperature, in this embodiment, the time for cooling or heating to the preset temperature is set as a parameter characterizing the heating or cooling efficiency. A short time means a large cooling capacity and high efficiency, while a long time means a small cooling capacity and low efficiency. In the acquired historical data, the driver operating frequency, the specific heat capacity of the medium, the hollow cross-sectional area of ​​the flow cavity, and the pump pressure parameters all correspond to the time from a certain temperature to a certain set temperature, which are respectively used as the input data and output data of the training neural network model, and finally the optimal parameter model is obtained, that is, the driving frequency and the thermal conductivity parameters are input into the optimal parameter model, and the time from a certain temperature to a certain set temperature can be obtained.

[0057] Through the above optimal parameter model, the driver operating frequency and the matching thermal conductivity parameters when the time from a certain temperature to a certain set temperature is the smallest can be determined, and the relevant corresponding relationship can be stored for application in the following embodiments.

[0058] In one embodiment of the present invention, when the set temperature differs greatly from the ambient temperature, in order to make the ambient temperature reach the set temperature as quickly as possible, the operating frequency of the driver and the thermal conductivity parameters of the heat or cold conduction are determined according to the set temperature and the ambient temperature, including the following steps: Step 1: When the temperature difference between the set temperature and the ambient temperature is greater than the first preset temperature, a preset maximum operating frequency is determined as the operating frequency of the driver; Step 2: Find the optimal thermal conductivity parameter that matches the maximum operating frequency as the thermal conductivity parameter.

[0059] In this embodiment, it can be seen from the above that the greater the operating frequency, the more times of loading or unloading per unit time, the greater the heat or cold generated. In order to make the ambient temperature reach the set temperature as soon as possible, the maximum operating frequency obtained by the optimal parameter model is used as the operating frequency of the driver, and the thermal conductivity parameter matching the maximum operating frequency is used as the thermal conductivity parameter of this embodiment. It should be noted that for the prepared refrigeration and heating device, the specific heat capacity of the medium is generally a fixed parameter, and the hollow cross-sectional area of ​​the flow cavity and the pump pressure parameter can be used as a variable parameter.

[0060] It should be noted that the cooling and heating device also includes a temperature sensor, which compares the temperature in the current environment with the set temperature in real time to determine the temperature difference between the set temperature and the ambient temperature and the size of the preset temperature.

[0061] In some embodiments, when the set temperature is not much different from the ambient temperature, in order to reduce the temperature overload (the amount exceeding the set temperature), the operating frequency of the driver and the thermal conductivity parameters of the heat or cold conduction are determined according to the set temperature and the ambient temperature, including: When the temperature difference between the set temperature and the ambient temperature is less than the first preset temperature and greater than the second preset temperature, the optimal operating frequency and the thermal conductivity parameter matching the optimal operating frequency are searched according to the set temperature as the operating frequency and the thermal conductivity parameter.

[0062] In this embodiment, when the set temperature is not much different from the ambient temperature, the optimal operating frequency and thermal conductivity parameters matching the set temperature are used as operating parameters, which can reduce energy consumption on the one hand and prevent temperature overload on the other.

[0063] In some embodiments, there may be a temperature overload phenomenon or the ambient temperature may fluctuate greatly above or below the set temperature. In order to keep the ambient temperature constant within a preset range, in this case, the following steps are also included: Step 1: when the temperature difference between the set temperature and the ambient temperature is less than the second preset temperature, searching for the optimal operating frequency and thermal conductivity parameters according to the set temperature; Step 2: Keep the optimal operating frequency and the pump pressure parameters in the thermal conductivity parameters unchanged, and adjust the cross-sectional area of ​​the flow cavity until the ambient temperature reaches the set temperature.

[0064] It should be noted that when adjusting the pump pressure parameters, when the temperature exceeds the set temperature, the amount of cold or heat is too much, and the heat conduction parameters can be fine-tuned by reducing the cross-sectional area of ​​the flow cavity. When the temperature does not reach the constant temperature range of the set temperature within a preset time, it can be fine-tuned by increasing the cross-sectional area of ​​the flow cavity. In the above embodiments, since the control of cooling and heating is dynamic, in practical applications, the solid-state spring-cage material unit can be designed to include multiple layers of sheets. Since the cross-sectional area of ​​the flow cavity is fine-tuned, one of the solid-state spring-cage material units is used as an adjustable unit, and a fixing is set on its outside. When adjusting the cross-sectional area of ​​the flow cavity, the fixing is used to apply force to the sheet-like spring-cage material unit to make it staggered, thereby reducing the cross-sectional area of ​​the flow cavity of the solid-state spring-cage material unit or increasing the cross-sectional area.

[0065] S3. Control the operation of the cooling and heating generator according to the operating frequency and thermal conductivity parameters so that the ambient temperature reaches the set temperature.

[0066] The cooling and heating control method of the present invention determines the operating frequency and thermal conductivity parameters of the driver by setting the temperature and the ambient temperature, so that the medium transfers the heat and cold of the solid-state spring card material unit to the heat exchange unit to the maximum extent for heating or cooling. The heat generation in this method is based on the phase change of the solid-state spring card, does not involve harmful substances, is safe and efficient, and can be applied to various fields.

[0067] The above content is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A cooling and heating device, characterized in that: include: Driver, refrigeration and heating generator and medium circulation unit; wherein, The cooling and heating generator comprises: a flow cavity, a medium and a solid spring material unit; The medium circulation unit comprises: a pipeline and a heat exchange unit, wherein the pipeline is in communication with the flow cavity; When heating, the driver loads the solid-state spring-stuck material unit, and when the solid-state spring-stuck material unit undergoes a phase change, heat is generated to increase the temperature of the medium in the flow cavity, and the medium circulation unit transports the heated medium to the heat exchange unit through the pipeline for heating, and the medium in the medium circulation unit enters the flow cavity through the pipeline; and when the driver unloads the solid-state spring-stuck material unit and an inverse phase change occurs, cold is generated to cool the medium in the flow cavity, and the medium circulation unit transports the cooled medium away through the pipeline, and the medium in the medium circulation unit enters the flow cavity through the pipeline; Or, when cooling, the driver unloads the solid-state ejection material unit, the medium circulation unit transports the cooled medium to the heat exchange unit through the pipeline for cooling, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline; and, the driver loads the solid-state ejection material unit, the medium circulation unit transports the heated medium through the pipeline, and allows the medium in the medium circulation unit to enter the flow cavity through the pipeline.

2. The refrigeration and heating device according to claim 1, characterized in that: The pipeline includes a first pipeline and a second pipeline, wherein the first pipeline and the second pipeline are arranged at two ends of the cooling and heating generator; The first pipeline is used to transport the heated medium to the heat exchange unit for heating, and to allow the heated medium in the heat exchange unit to enter the flow cavity; The second pipeline is used to transport the cooled medium to the heat exchange unit for cooling, and to allow the cooled medium in the heat exchange unit to enter the flow cavity.

3. The refrigeration and heating device according to claim 2, characterized in that: The heat exchange unit includes: a first heat exchange unit and / or a second heat exchange unit; the first pipeline is connected to the first heat exchange unit, and is used to transport the heated medium to the first heat exchange unit for heating or for transporting away; the second pipeline is connected to the second heat exchange unit, and is used to transport the cooled medium to the second heat exchange unit for cooling or for transporting away.

4. The refrigeration and heating device according to claim 1, characterized in that: The medium circulation unit comprises: an energy exchanger; The energy exchanger is directly or indirectly connected to the pipeline, and is used to transport the cold of the cooling medium during heating or to transport the heat of the heating medium during cooling.

5. The refrigeration and heating device according to claim 4, characterized in that: The pipeline includes a liquid outlet pipeline and a liquid inlet pipeline, and the liquid inlet pipeline is connected to the energy exchanger; The liquid outlet pipeline is used to transport the heated or cooled medium to the heat exchange unit, and allows the medium in the energy exchanger to flow into the flow cavity.

6. The refrigeration and heating device according to claim 5, characterized in that: The medium circulation unit comprises: a first liquid outlet pipeline and a second liquid outlet pipeline; The first liquid outlet pipeline and the second liquid outlet pipeline are respectively arranged at two ends of the cooling and heating generator, and are used to transport the temperature-increasing medium and the temperature-reducing medium respectively; The liquid inlet pipeline is arranged at any end of the refrigeration and heating generator and is connected with the energy exchanger to allow the medium to enter the flow cavity.

7. The refrigeration and heating device according to claim 6, characterized in that: The medium circulation unit further comprises: a first liquid inlet pipeline and a second liquid inlet pipeline; The first liquid inlet pipeline and the second liquid inlet pipeline are both in communication with the energy exchanger; During heating, the second liquid outlet pipeline transports the cooled medium to the energy exchanger, and allows the medium to flow into the flow cavity through the second liquid inlet pipeline; or, during cooling, the first liquid outlet pipeline transports the heated medium to the energy exchanger, and allows the medium to flow into the flow cavity through the first liquid inlet pipeline.

8. The cooling and heating device according to claim 7, characterized in that: The first liquid outlet pipeline and the first liquid inlet pipeline are both connected to the heat exchange unit, the first liquid outlet pipeline is used to transport the heated medium or the cooled medium to the heat exchange unit for heating or cooling, and the first liquid inlet pipeline is used to allow the medium after heat exchange to flow into the flow cavity; The second liquid outlet pipeline and the second liquid inlet pipeline are both connected to the energy exchanger, and are used to transport the cooling medium to the energy exchanger during heating, or to transport the heating medium to the energy exchanger during cooling.

9. The refrigeration and heating device according to claim 1, characterized in that: Also includes: A pump body disposed in the pipeline; A flow controller disposed at the connection between the pipeline and the heat exchange unit, and disposed at the connection between the pipeline and the energy exchanger; A controller for controlling the activation and deactivation of the driver, the pump body and the flow controller; There are multiple solid-state spring-loaded material units in the cooling and heating generator, each of which is a hollow structure and arranged in sequence, wherein the hollow structures in the multiple solid-state spring-loaded material units are connected to form a first flow cavity; and a second flow cavity is formed by a gap between the outside of the solid-state spring-loaded material unit and the cylinder, and the first flow cavity and the second flow cavity are connected through a through hole; The cooling and heating generator includes: a first cooling and heating generator and a second cooling and heating generator. The motor of the driver drives the wheel on the driver to rotate, so that the protrusion on the wheel applies stress to the first cooling and heating generator, and at the same time, the part other than the protrusion unloads the stress on the second cooling and heating generator.

10. A cooling and heating control method, applied to the cooling and heating device according to any one of claims 1 to 9, characterized in that: include: Get the set temperature and ambient temperature; Determine the operating frequency of the driver loading or unloading the solid-state ejection material unit and the thermal conductivity parameter for conducting the heat or cold according to the set temperature and the ambient temperature; The cooling and heating generator is controlled to operate according to the frequency and the thermal conductivity parameter so that the ambient temperature reaches the set temperature.

11. The cooling and heating control method according to claim 10, characterized in that: Also includes: Acquire historical data, the historical data including: duration of cooling or heating to a preset temperature and operating frequency and thermal conductivity parameters of a driver corresponding to the duration, wherein the thermal conductivity parameters include: thermal conductivity, specific heat capacity, cross-sectional area, specific surface area and pump pressure parameters of the medium; The historical data is input into a preset model for training to obtain a cooling and heating optimal parameter model, and the optimal frequency corresponding to each preset temperature and the thermal conductivity parameter matching the optimal frequency are determined according to the cooling and heating optimal parameter model.

12. The method for controlling heating and cooling according to claim 10, characterized in that: The step of determining the operating frequency of the driver and the thermal conductivity parameter for conducting the heat or cold according to the set temperature and the ambient temperature includes: When the temperature difference between the set temperature and the ambient temperature is greater than a first preset temperature, determining a preset maximum operating frequency as the operating frequency of the driver, and searching for a matching optimal thermal conductivity parameter according to the maximum operating frequency as the thermal conductivity parameter; When the temperature difference between the set temperature and the ambient temperature is less than the first preset temperature and greater than the second preset temperature, the optimal operating frequency and the thermal conductivity parameters matching the optimal operating frequency are searched according to the set temperature as the operating frequency and the thermal conductivity parameters of the driver.

13. The cooling and heating control method according to claim 12, characterized in that: Also includes: When the temperature difference between the set temperature and the ambient temperature is less than the second preset temperature, searching for the optimal operating frequency and thermal conductivity parameters according to the set temperature; The optimal operating frequency and the pump pressure parameter in the heat conduction parameter are kept unchanged, and the cross-sectional area of ​​the flow cavity is adjusted until the ambient temperature reaches the set temperature.

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