Test seat, cooling system and test system

Abstract

The invention discloses a testing seat which is used for bearing cooling liquid and comprises a base, a plurality of elastic metal pieces arranged in the base and a conductive elastic piece arranged above the base, the cooling liquid and the elastic metal pieces are isolated through the conductive elastic piece, and the problem that the cooling liquid affects the testing result of the testing seat can be avoided. The invention also discloses a cooling system which combines the test seat with a cooling device and is used for cooling an object to be tested in the test process of the test seat. The invention also discloses a test system which prevents the cooling liquid from influencing the operation of the chip on the object to be tested through the pressure adjustment of the input gas and the cooling liquid.

Description

Technical Field

[0001] The present invention relates to semiconductor testing technology, and more particularly to a test socket, a cooling system and a test system. Background Art

[0002] Semiconductor packaging testing usually places an object to be tested, such as a semiconductor package or chip, into a test socket with multiple probes. After each probe is electrically connected to the object to be tested, a test signal is transmitted to the object to be tested through each probe to achieve the purpose of testing. However, the object to be tested generates a lot of waste heat during the testing process, and therefore needs to be cooled.

[0003] In the past, when cooling the object to be tested, the cooling head of the temperature control device was brought into contact with the surface of the object to be tested, so that the high-temperature waste heat generated by the object to be tested was transferred to the cooling head. Through the sealed flow channel inside the cooling head, the liquid in the flow channel transferred the heat to the radiator. The radiator has a fan that can dissipate the heat carried by the liquid in the radiator into the air, thereby achieving the heat dissipation of the object to be tested.

[0004] With the rapid development of artificial intelligence (AI) and high performance computing (HPC), integrated circuits (ICs) are trending towards high power, which is accompanied by high heat generation of the chip. However, the existing cooling heads can only contact part of the surface of the object to be tested, so the heat dissipation effect is not good. In the face of high-performance and high-power chips, it is really difficult to cope with it alone.

[0005] In view of the above problems, how to provide a testing device or system with a good cooling mechanism, especially one that can provide a better heat dissipation effect than the existing temperature control equipment, has become a goal that people in this technical field are eager to pursue. Summary of the invention

[0006] In order to solve the above-mentioned problems of the prior art, the present invention discloses a test socket for carrying a coolant, the test socket comprising: a base, including a first surface and a second surface opposite to each other and a plurality of through holes connecting the first surface and the second surface; a plurality of elastic metal parts, respectively disposed in each of the through holes; and a conductive elastic sheet, located above the base, for carrying the coolant and isolating the coolant from the plurality of elastic metal parts.

[0007] In one embodiment, the test seat of the present invention further includes a frame combined with the conductive elastic sheet and disposed on the first surface, wherein the frame has at least one first guide channel for the coolant to flow into or a second guide channel for the coolant to flow out of the test seat.

[0008] In a specific embodiment, the frame is disposed on the base through a plurality of guide pins, so that the frame and the conductive elastic sheet are adapted to move relative to the base between two ends of each of the guide pins.

[0009] In yet another embodiment, the frame and the conductive elastic sheet are fixed on the first surface of the base, so that the conductive elastic sheet seals each of the through holes.

[0010] The present invention also discloses a cooling system for cooling an object to be tested, the cooling system comprising: a cooling device, suitable for providing a coolant; and a test seat, connected to the cooling device, the test seat comprising: a base; a plurality of elastic metal parts, respectively arranged in the base; and a conductive elastic sheet, located above the base, suitable for forming a flow channel between the test object and the test object when carrying the test object for the coolant to pass through.

[0011] In another embodiment, the base includes a first surface and a second surface opposite to each other and a plurality of through holes connecting the first surface and the second surface and used for respectively arranging the elastic metal parts, and the flow channel is not connected to the through holes.

[0012] In another embodiment, the test seat further includes a frame disposed on the base and combined with the peripheral side of the conductive elastic sheet so that the conductive elastic sheet can be fixed to the base through the frame. The frame and the conductive elastic sheet are suitable for moving relative to the base so that during testing, the conductive elastic sheet can contact and electrically connect each of the elastic metal parts.

[0013] In another embodiment, the frame includes a first flow guiding channel or a second flow guiding channel connected to the flow channel.

[0014] In another embodiment, the cooling system of the present invention also includes a controller connected to the cooling device and used to control the cooling device to provide the coolant, wherein the controller controls the coolant to enter the flow channel from the cooling device through the first diversion channel, and to be led back to the cooling device from the flow channel through the second diversion channel.

[0015] The present invention also discloses a testing system for testing an object to be tested, the testing system comprising: a test seat, comprising a base, a plurality of elastic metal parts arranged in the base, and a conductive elastic sheet arranged on the base, wherein the conductive elastic sheet is suitable for forming a flow channel between the object to be tested and the object to be tested when carrying the object to be tested; and a temperature control head, comprising a flow guide member having a first flow guide channel, wherein the temperature control head is arranged corresponding to the test seat and is suitable for combining with the test seat to connect the first flow guide channel with the flow channel.

[0016] In one embodiment, the base includes a first surface and a second surface opposite to each other and a plurality of through holes connecting the first surface and the second surface and used for respectively arranging the elastic metal parts, and the flow channel is not connected to the through holes.

[0017] In another embodiment, the test seat further includes a frame located on the periphery of the conductive elastic sheet and having a second flow guide channel, through which the conductive elastic sheet is arranged on the base, and the frame and the conductive elastic sheet are suitable for moving relative to the base, so that when the temperature control head is combined with the test seat for testing, the conductive elastic sheet is electrically connected to each of the elastic metal parts, and the first flow guide channel, the flow channel and the second flow guide channel are connected.

[0018] In one embodiment, a horizontal position of the second air guiding channel is lower than a horizontal position of the first air guiding channel.

[0019] In another embodiment, the object to be tested has a substrate, a chip arranged on the substrate, and a support member arranged on the substrate and surrounding the chip, and the guide member has a corresponding upper surface and a lower surface, a accommodating space connecting the upper surface and the lower surface and corresponding to the chip, and a third guide channel connecting the accommodating space and the outside.

[0020] In another embodiment, the temperature control head further includes a cover portion provided on the upper surface of the guide member and covering the accommodating space, and a crimping member extending from the cover portion to the accommodating space to contact a pressing portion of the chip. When the crimping member presses against the chip, a chamber connected to the third guide channel is formed between the cover portion, the outer wall of the pressing portion, the inner wall of the accommodating space and the substrate.

[0021] In another embodiment, the temperature control head further includes a sealing member disposed between the flow guide member and the support member.

[0022] In another embodiment, the testing system of the present invention further includes a first fluid located in the third flow channel and a second fluid located in the first flow channel, the flow channel and the second flow channel, wherein the fluid pressure of the first fluid is greater than the fluid pressure of the second fluid.

[0023] In another embodiment, the testing system of the present invention also includes a controller and a cooling device connected to the controller and used to provide the second fluid, and the controller is used to control the second fluid to enter the flow channel from the cooling device through the first flow guide channel, and to be led back to the cooling device from the flow channel through the second flow guide channel.

[0024] In another embodiment, the first fluid is a gas, and the second fluid is a non-conductive coolant.

[0025] In yet another embodiment, the testing system of the present invention further comprises an air blowing device connected to the third flow channel to provide the first fluid.

[0026] As can be seen from the above, the test seat of the present invention also isolates the coolant from the elastic metal part through the conductive elastic sheet to achieve the purpose of preventing the coolant from affecting the test results of the test seat; furthermore, the cooling system of the present invention forms a flow channel for the coolant to flow between the conductive elastic sheet and the object to be tested, so as to have the effect of providing cooling for the object to be tested; in addition, the test system of the present invention forms a flow channel between the conductive elastic sheet and the object to be tested in the test seat, so that when the temperature control head is combined with the test seat, the first guide channel of the temperature control head is connected to the flow channel to provide a cooling function during the test of the object to be tested, and by maintaining the pressure balance between the chamber and the flow channel, or making the air pressure in the chamber greater than the hydraulic pressure in the flow channel, the coolant is prevented from entering the chamber and affecting the operation of the chip or the temperature control effect of the temperature control head. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural exploded view of the test socket of the present invention.

[0028] Figure 2 It is a three-dimensional structural diagram of the test socket of the present invention.

[0029] Figure 3 For along Figure 2 Section view of the AA section line.

[0030] Figure 4A and Figure 4B It is a schematic structural diagram of a frame of another embodiment of a test socket of the present invention.

[0031] Figure 5 Schematic diagram of the cooling system of the present invention.

[0032] Figure 6 Schematic diagram of the testing system of the present invention.

[0033] Figure 7 It is a top view of the object to be tested.

[0034] Figure 8 For along Figure 7 Section view along section line BB.

[0035] Main component symbols

[0036] 1 Test socket

[0037] 10 Cooling System

[0038] 100 test systems

[0039] 11. Base

[0040] 111 First Surface

[0041] 112 Second Surface

[0042] 113 Through Hole

[0043] 12 Elastic metal parts

[0044] 13 Conductive elastic sheet

[0045] 14 Framework

[0046] 141 First diversion channel

[0047] 142 Second diversion channel

[0048] 15 Guide pin

[0049] 16 Runner

[0050] 17 Capping

[0051] 21 Cooling device

[0052] 22 Controller

[0053] 23. Air blowing device

[0054] 3 Temperature control head

[0055] 31 Drainage piece

[0056] 311 First diversion channel

[0057] 312 The third diversion channel

[0058] 313 Accommodation Space

[0059] Room 314

[0060] 315 upper surface

[0061] 316 Lower surface

[0062] 32 Crimp

[0063] 321 cover

[0064] 322 Pressing part

[0065] 33 Seals

[0066] 4 First Fluid

[0067] 5 Second Fluid

[0068] 6 Coolant

[0069] 7 Gap

[0070] 8 Objects to be tested

[0071] 81 substrate

[0072] 82 Chip

[0073] 83 Support

[0074] 84 Viscose

[0075] AA Hatch

[0076] BB Hatch

[0077] D distance. DETAILED DESCRIPTION

[0078] The technical content of the present invention is described below by using specific embodiments, and those skilled in the art can easily understand the advantages and effects of the present invention from the contents disclosed in this specification. However, the present invention can also be implemented or applied by other different specific embodiments.

[0079] Figure 1 This is a structural exploded view of the test socket of the present invention. Figure 2 is a three-dimensional structural diagram of the test socket of the present invention, Figure 3 For along Figure 2 Please refer to the cross-sectional view of the AA section line of the embodiment. As shown in the figure, the test seat 1 of the present invention includes a base 11, a plurality of elastic metal parts 12 and a conductive elastic sheet 13, wherein the test seat 1 of the present case can carry a test object and a coolant 6, and provide a function of cooling the test object by guiding the flow of the coolant 6. The detailed description of the test seat 1 of the present invention is as follows.

[0080] The base 11 includes a first surface 111 and a second surface 112 opposite to each other and a plurality of through holes 113 connecting the first surface 111 and the second surface 112 . Accordingly, the test seat 1 is disposed on a test substrate with the second surface 112 of the base 11 .

[0081] Each of the elastic metal members 12 is disposed in each of the through holes 113 . In a specific embodiment, each of the elastic metal members 12 can be a probe or other conductive metal structure with elasticity to electrically contact the test substrate and receive a test signal from the test substrate.

[0082] The conductive elastic sheet 13 is located above the base 11 and is fixed to the base 11 by screws or adhesive, for example. The conductive elastic sheet 13 is used to carry the coolant 6 and isolate the coolant 6 from the elastic metal member 12 . The coolant 6 in this embodiment is a non-conductive liquid.

[0083] In a specific embodiment, the conductive elastic sheet 13 may have a plurality of conductive elastic areas corresponding to each of the elastic metal parts 12 and a plurality of conductive particles respectively located in each of the conductive elastic areas, so as to electrically conduct the object to be tested and each of the elastic metal parts 12 when the object to be tested and each of the elastic metal parts 12 are pressed against each other during the testing process.

[0084] As described above, the test socket 1 of the present invention isolates the coolant 6 from the through holes 113 through the conductive elastic sheet 13, so as to provide a cooling effect for the object to be tested when carrying and guiding the flow of the coolant 6. Moreover, since the coolant 6 will not flow into the through holes 113, the purpose of preventing the multiple elastic metal parts 12 from being immersed in the coolant 6 and affecting the electrical properties and test results can be achieved.

[0085] like Figure 3 As shown, the test seat 1 of the present invention includes a frame 14, which is combined with the conductive elastic sheet 13 and is disposed above the first surface 111 of the base 11, so that when the conductive elastic sheet 13 carries the coolant 6, the coolant 6 is located in the space defined by the conductive elastic sheet 13 and the frame 14. Specifically, the frame 14 is located on the peripheral side of the conductive elastic sheet 13 and is combined with the conductive elastic sheet 13, wherein the frame 14 has at least one first flow guide channel 141 for the coolant 6 to flow in and / or at least one second flow guide channel 142 for flowing out of the test seat 1, as shown in the figure, so taking a first flow guide channel 141 and a second flow guide channel 142 as an example, in other embodiments, one of the flow guide channels may be provided in other components (there will be other examples later), accordingly, as shown by the arrow in the figure, the test seat 1 of the present invention uses the first flow guide channel 141 as a water inlet to introduce the coolant 6 from the first flow guide channel 141 into the test seat 1 to flow, and the coolant 6 can be discharged from the second flow guide channel 142, and the object to be tested is cooled through a continuous and continuous flow guide process. It is worth mentioning that the coolant 6 of this embodiment flows between the lower surface of the object to be tested and the upper surface of the conductive elastic sheet 13 (as shown later) Figure 4B ), to cool the heat generated by the increase of contact impedance when the electrical contacts of the object to be tested (such as solder balls) contact the conductive elastic sheet 13.

[0086] Figure 4A and Figure 4B FIG. 1 is a schematic diagram of the structure of a frame of another embodiment of the test socket of the present invention. Figure 4A As shown, the frame 14 is arranged on the base 11 through a plurality of guide pins 15, so that the frame 14 and the conductive elastic sheet 13 can move freely between the two ends of each guide pin 15, that is, the conductive elastic sheet 13 is suitable for moving relative to the base 11, and accordingly, the external pipeline (not shown) connected to the first guide channel 141 and the second guide hole 142 can also move accordingly. In addition, before the test, each elastic metal piece 12 is slightly in contact with the conductive elastic sheet 13 or separated by a distance D. In addition, during the test, if Figure 4BAs shown, the object to be tested 8 is pressed against the conductive elastic sheet 13 and moved toward the base 11 to contact and electrically connect each of the elastic metal pieces 12, wherein each of the elastic metal pieces 12 is immersed in the conductive elastic sheet 13, thereby increasing the contact area between the two, thereby reducing the contact resistance. In a specific embodiment, the frame 14 may have a plurality of through holes corresponding to each of the guide pins 15, and an elastic piece may be provided between the lower surface and the first surface 111 of the base 11, so as to move toward the base 11 and press against the elastic piece when a force is applied, so that after the force disappears, the elastic piece is resiliently reset to a position separated from the base 11 by the distance D due to the rebound force of the elastic piece.

[0087] In the aforementioned embodiment, the frame 14 and the conductive elastic sheet 13 are fixed by guide pins 15 so that there is a distance D between the conductive elastic sheet 13 and the elastic metal member 12. In another embodiment, the frame 14 and the conductive elastic sheet 13 can be directly fixed on the first surface 111 of the base 11, that is, the frame 14 and the conductive elastic sheet 13 are directly placed on the first surface 111, so that the conductive elastic sheet 13 can seal the through holes 113 in the base 11.

[0088] Figure 5 As shown in the figure, the cooling system 10 of the present invention is used to cool a test object 8, and includes a test seat 1 and a cooling device 21 connected to the test seat 1, as described below.

[0089] The cooling device 21 is suitable for providing a cooling liquid 6 into the test socket 1 to cool and reduce the temperature of the test object 8 during the test process.

[0090] The test seat 1 includes a base 11, a plurality of elastic metal parts 12 respectively arranged in the base 11, and a conductive elastic sheet 13 located above the base 11, wherein the test seat 1 can be used to carry the object under test 8 to test the object under test 8, and the conductive elastic sheet 13 is suitable for forming a flow channel 16 for the flow of coolant 6 between the object under test 8 and the object under test 8 when carrying the object under test 8, so as to allow the coolant 6 to pass through.

[0091] In summary, the cooling system 10 of the present invention continuously delivers the coolant 6 to the test socket 1 through the cooling device 21, so that the coolant 6 flows through the flow channel 16 between the conductive elastic sheet 13 and the object under test 8, and at the same time guides the coolant 6 back from the test socket 1, and continues this reciprocating process, thereby cooling the object under test 8.

[0092] In one embodiment, the base 11 includes a first surface 111 and a second surface 112 relative to each other and a plurality of through holes 113 connecting the first surface 111 and the second surface 112 and used to respectively provide each of the elastic metal parts 12, and the flow channel 16 is not connected to each of the through holes 113 to prevent the coolant 6 from flowing into each of the through holes 113 and causing adverse effects on each of the elastic metal parts 12.

[0093] Furthermore, the test seat 1 further includes a frame 14 having a first flow guide channel 141 connected to the flow channel 16, wherein the frame 14 is arranged on the base 11 and combined with the peripheral side of the conductive elastic sheet 13, and the conductive elastic sheet 13 is firmly fixed on the base 11 through the frame 14; Furthermore, the first flow guide channel 141 can be used as a water inlet and is connected to the flow channel 16 to receive the coolant 6 delivered from the cooling device 21 and guide the coolant 6 to the test seat 1 In the seat 1, the coolant 6 flows through the flow channel 16; in addition, the frame 14 may also have a second guide channel 142 connected to the flow channel 16, so that the second guide channel 142 serves as an outlet, that is, the frame 14 has a first guide channel 141 and a second guide channel 142 connected to the flow channel 16. Accordingly, when the first guide channel 141, the flow channel 16 and the second guide channel 142 are connected, the coolant 6 passes through in sequence (as shown by the arrows in the figure).

[0094] In one embodiment, the cooling system 10 of the present invention further includes a cover 17 for covering and sealing the periphery of the frame 14 , so that a sealed space is formed between the cover 17 , the frame 14 and the conductive elastic sheet 13 .

[0095] In another embodiment, the frame 14 and the conductive elastic sheet 13 are suitable for moving relative to the base 11, that is, the frame 14 and the conductive elastic sheet 13 can be separated from the first surface 111 of the base 11 when not tested, and during testing, the frame 14 and the conductive elastic sheet 13 are subjected to force and move toward the base 11, thereby electrically connecting each of the elastic metal parts 12 and connecting the first guide channel 141 and the flow channel 16.

[0096] In another embodiment, the cooling system 10 of the present invention may further include a controller 22 connected to the cooling device 21 and used to control the cooling device 21 to provide the coolant 6, wherein the controller 22 controls the coolant 6 to enter the flow channel 16 from the cooling device 21 through the first guide channel 141, and to be led back to the cooling device 21 from the flow channel 16 through the second guide channel 142. Accordingly, the present invention can continuously provide low-temperature coolant 6 to the test socket 1, and remove the coolant 6 in the test socket 1 that has been heated up by cooling the object to be tested 8 from the test socket 1, so as to effectively dissipate heat from the object to be tested 8.

[0097] Figure 6 Schematic diagram of the test system of the present invention. As shown in the figure, the test system 100 of the present embodiment is used to perform packaging test on the object to be tested 8, and includes a test seat 1 and a temperature control head 3. In addition, a cooling device 21 and a controller 22 can be added as required, wherein the test seat 1, the cooling device 21 and the controller 22 are substantially the same as the above-mentioned cooling system, so they are not described in detail. The relevant description of the test system 100 of the present invention is described in detail below.

[0098] The temperature control head 3 is arranged corresponding to the test socket 1 and is suitable for being combined with the test socket 1. Specifically, the temperature control head 3 and the test socket 1 are arranged relative to each other up and down, so that the temperature control head 3 can be driven to move toward the test socket 1, and then press against the object under test 8 carried on the test socket 1, and then combine with the test socket 1 to test the object under test 8, and provide the function of heat dissipation for the object under test 8 during the test process.

[0099] In a specific embodiment, the temperature control head 3 includes a flow guide member 31 having a first flow guide channel 311. In an embodiment, the flow guide member 31 may also include a third flow guide channel 312, and the test system 100 of the present invention may include a first fluid 4 provided to the third flow guide channel 312 and a second fluid 5 (such as a coolant) provided to the first flow guide channel 311. In this embodiment, the first flow guide channel 311 is not located at the frame 14, but is instead opened in the flow guide member 31 and connected to the flow channel 16. Accordingly, after the temperature control head 3 is combined with the test socket 1, the conductive elastic sheet 13 is electrically connected to each of the elastic metal parts 12, and the first flow guide channel 311, the flow channel 16 and the second flow guide channel 142 are connected.

[0100] In this embodiment, since the first flow guide channel 311 is located in the flow guide member 31, the horizontal position of the first flow guide channel 311 is higher than the horizontal position of the second flow guide channel 142 of the frame 14, thereby utilizing the potential energy difference between the first flow guide channel 311 and the second flow guide channel 142 to achieve the purpose of improving the fluidity of the coolant.

[0101] In practical application, the object to be tested 8 has a substrate 81, a chip 82 disposed on the substrate 81, and a support member 83, wherein the support member 83 surrounds the chip 82, and can provide an effect of strengthening the package, or provide a support function when a heat sink is disposed on the package. In this regard, the flow guide 31 also has an upper surface 315 and a lower surface 316 corresponding to each other, and a receiving space 313 connecting the upper surface 315 and the lower surface 316 and corresponding to the chip 82, wherein the third flow guide channel 312 connects the receiving space 313 with the outside, and the third flow guide channel 312 is used to guide the first fluid 4 (such as air) into the receiving space 313. In a specific embodiment, the test system 100 of the present invention also includes a blowing device 23 connected to the third flow guide channel 312 and providing the first fluid 4. In another embodiment, the blowing device 23 can be further connected to the controller 22. After the test is completed, the valve is switched by the controller 22 to allow the gas to flow into the first flow channel 311 and the second flow channel 142, thereby driving the second fluid 5 (such as coolant) remaining in the first flow channel 311 and the second flow channel 142 to be discharged to the outside.

[0102] Furthermore, the temperature control head 3 also includes a cover portion 321 provided on the upper surface 315 of the guide member 31 and covering the accommodating space 313, and a crimping member 32 extending from the cover portion 321 to the accommodating space 313 to contact the pressing portion 322 of the chip 82, wherein when the crimping member 32 presses the chip 82 with the pressing portion 322, the cover portion 321, the outer wall of the pressing portion 322, the inner wall of the accommodating space 313 and the substrate 81 are sealed into a chamber 314, thereby constituting the aforementioned accommodating space 313 for allowing the first fluid 4 to enter, and the chamber 314 is connected to the third guide channel 312, so that the first fluid 4, such as air, can enter the chamber 314 from the third guide channel 312.

[0103] Taking gas as an example of the first fluid 4, the testing system 100 of the present invention can blow gas into the chamber 314 through the third flow channel 312, wherein the air pressure in the chamber 314 should be maintained within a set value range. Therefore, the blowing device 23 can continuously provide gas with a fixed air pressure, or when the air pressure in the chamber 314 reaches the set value range, the third flow channel 312 can be closed to ensure that the air pressure in the chamber 314 is within the set value range.

[0104] Figure 7 is the top view of the object to be tested, Figure 8 For along Figure 7 The cross-section of the BB section line. As shown in the figure, please also refer to Figure 6When the object to be tested 8 is provided with a support 83, glue 84 is filled between the support 83 and the substrate 81 to fix the support 83 on the substrate 81 and provide a sealing effect between the support 83 and the substrate 81. However, in the actual process, a gap 7 is designed at the glue filling point between the support 83 and the substrate 81. However, this gap 7 will cause the coolant to flow into the chamber 314 and affect the operation of the chip 82 or the temperature control effect of the temperature control head 3. Therefore, gas is provided to the chamber 314 through the third guide channel 312 to maintain the fluid pressure in the chamber 314 within the set value range, and the pressure of the coolant is equal to or less than the fluid pressure in the chamber 314, so as to prevent the coolant from flowing into the chamber 314 through the gap 7.

[0105] In addition, if Figure 6 As shown, the test system 100 of the present invention may also be provided with a sealing member 33 between the flow guide member 31 and the support member 83 to ensure the sealing between the flow guide member 31 and the support member 83, so that the coolant will not cool the crimping member 32 and affect the temperature control. In addition, similar sealing members may be provided between the crimping member 32 and the flow guide member 31, and between the flow guide member 31 and the frame 14 to ensure the sealing of the fluid.

[0106] In summary, the test socket of the present invention isolates the coolant from the elastic metal part through the conductive elastic sheet, so that the coolant cannot affect the test results of the test socket; furthermore, the cooling system of the present invention forms a flow channel between the conductive elastic sheet and the object to be tested, so that the coolant flows through the flow channel to provide a cooling effect for the object to be tested; and the test system of the present invention forms a flow channel between the conductive elastic sheet and the object to be tested in the test socket, so that when the temperature control head is combined with the test socket, the first guide channel of the temperature control head is connected to the flow channel to provide a cooling function during the testing process of the object to be tested, and by maintaining the pressure balance between the chamber for inputting gas and the flow channel for the coolant to pass through, or making the air pressure in the chamber greater than the hydraulic pressure in the flow channel, the coolant is prevented from entering the chamber and affecting the operation of the chip or the temperature control effect of the temperature control head.

[0107] The above embodiments are only illustrative and are not intended to limit the present invention. Those skilled in the art may modify and change the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is defined by the claims attached to the present invention, and as long as it does not affect the effect and implementation purpose of the present invention, it should be included in this disclosed technical content.

Claims

1. A test seat for carrying a cooling liquid, the test seat comprising: A base, comprising a first surface and a second surface opposite to each other and a plurality of through holes connecting the first surface and the second surface; A plurality of elastic metal parts are respectively disposed in each of the through holes; as well as The conductive elastic sheet is located above the base and is used for carrying the cooling liquid and isolating the cooling liquid from the plurality of elastic metal parts.

2. The test socket as claimed in claim 1, further comprising a frame combined with the conductive elastic sheet and disposed on the first surface, wherein: The frame has at least one first flow guiding channel for the coolant to flow in or a second flow guiding channel for the coolant to flow out of the test seat.

3. The test socket according to claim 2, wherein: The frame is arranged on the base through a plurality of guide pins, so that the frame and the conductive elastic sheet are suitable for moving relative to the base between the two ends of each of the guide pins.

4. The test socket according to claim 2, wherein: The frame and the conductive elastic sheet are fixed on the first surface of the base so that the conductive elastic sheet seals each of the through holes.

5. A cooling system for cooling an object to be tested, the cooling system comprising: A cooling device adapted to provide a cooling liquid; and A test socket is connected to the cooling device, and the test socket comprises: Pedestal; A plurality of elastic metal parts are respectively disposed in the base; and The conductive elastic sheet is located above the base and is suitable for forming a flow channel between the conductive elastic sheet and the object to be tested when the object to be tested is carried so as to allow the cooling liquid to pass through.

6. The cooling system according to claim 5, wherein: The base comprises a first surface and a second surface which are opposite to each other and a plurality of through holes which are connected with the first surface and the second surface and are used for arranging the elastic metal parts respectively, and the flow channel is not connected with the through holes.

7. The cooling system according to claim 5, wherein: The test seat also includes a frame arranged on the base and combined with the peripheral side of the conductive elastic sheet so that the conductive elastic sheet is fixed to the base through the frame. The frame and the conductive elastic sheet are suitable for moving relative to the base so that the conductive elastic sheet contacts and electrically connects each of the elastic metal parts during testing.

8. The cooling system of claim 7, wherein: The frame comprises a first flow guiding channel or a second flow guiding channel connected to the flow channel.

9. The cooling system according to claim 8, further comprising a controller connected to the cooling device and used to control the cooling device to provide the coolant, wherein: The controller controls the cooling liquid to enter the flow channel from the cooling device through the first flow guide channel, and to be led back to the cooling device from the flow channel through the second flow guide channel.

10. A test system for testing an object to be tested, the test system comprising: A test seat, comprising a base, a plurality of elastic metal parts disposed in the base, and a conductive elastic sheet disposed on the base, wherein the conductive elastic sheet is suitable for forming a flow channel with the object to be tested when carrying the object to be tested; and The temperature control head comprises a flow guide member having a first flow guide channel, wherein the temperature control head is arranged corresponding to the test seat and is suitable for combining with the test seat to make the first flow guide channel communicate with the flow channel.

11. The test system of claim 10, wherein: The base comprises a first surface and a second surface which are opposite to each other and a plurality of through holes which are connected with the first surface and the second surface and are used for arranging the elastic metal parts respectively, and the flow channel is not connected with the through holes.

12. The test system of claim 10, wherein: The test seat also includes a frame located on the periphery of the conductive elastic sheet and having a second flow guide channel. The conductive elastic sheet is arranged on the base through the frame, and the frame and the conductive elastic sheet are suitable for moving relative to the base, so that when the temperature control head is combined with the test seat for testing, the conductive elastic sheet is electrically connected to each of the elastic metal parts, and the first flow guide channel, the flow channel and the second flow guide channel are connected.

13. The test system of claim 12, wherein: The horizontal position of the second flow guiding channel is lower than the horizontal position of the first flow guiding channel.

14. The test system of claim 12, wherein: The object to be tested has a substrate, a chip arranged on the substrate, and a support member arranged on the substrate and surrounding the chip, and the guide member has a corresponding upper surface and a lower surface, a containing space connecting the upper surface and the lower surface and corresponding to the chip, and a third guide channel connecting the containing space and the outside.

15. The test system of claim 14, wherein: The temperature control head also includes a cover portion provided on the upper surface of the guide member and covering the accommodating space, and a crimping member extending from the cover portion to the accommodating space to contact a pressing portion of the chip. When the crimping member presses against the chip, a chamber connected to the third guide channel is formed between the cover portion, the outer wall of the pressing portion, the inner wall of the accommodating space and the substrate. 16 . The testing system as claimed in claim 14 , wherein the temperature control head further comprises a sealing member disposed between the flow guide member and the support member.

17. The test system as claimed in claim 14, further comprising a first fluid in the third flow guiding channel and a second fluid in the first flow guiding channel, the flow channel and the second flow guiding channel, wherein: The fluid pressure of the first fluid is greater than the fluid pressure of the second fluid.

18. The test system as described in claim 17 further includes a controller and a cooling device connected to the controller and used to provide the second fluid, the controller is used to control the second fluid to enter the flow channel from the cooling device through the first guide channel, and to be led back to the cooling device from the flow channel through the second guide channel.

19. The test system of claim 17, wherein: The first fluid is a gas, and the second fluid is a non-conductive cooling liquid. 20 . The testing system as claimed in claim 17 , further comprising an air blowing device connected to the third flow channel to provide the first fluid.

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