Silicon-based liquid crystal display device capable of increasing low-temperature starting speed and vehicle

Abstract

The invention discloses a silicon-based liquid crystal display device capable of improving low-temperature starting speed and a vehicle, the silicon-based liquid crystal display device comprises a temperature adjusting module and a silicon-based liquid crystal display chip module, and the temperature adjusting module is arranged on the silicon-based liquid crystal display chip module. The temperature adjusting module comprises a semiconductor refrigerating element capable of refrigerating and heating, a heating element used for heating and a power supply circuit, the semiconductor refrigerating element and the heating element are arranged on the power supply circuit in parallel, and a circuit branch where the heating element is located is provided with a diode. By the adoption of the silicon-based liquid crystal display device, the silicon-based liquid crystal display device of the vehicle can be started at a higher speed in a low-temperature environment, quick response is achieved, and the temperature adjusting module enables the silicon-based liquid crystal display device to adapt to a wider environment temperature range.

Description

Technical Field

[0001] The present invention relates to a silicon-based liquid crystal display device, and in particular to a silicon-based liquid crystal display device and a vehicle capable of improving a low-temperature startup speed. Background Art

[0002] In the prior art, silicon-based liquid crystal display devices are widely used in the automotive field. Generally, the temperature range in which silicon-based liquid crystal display chips can work normally is -10 to 70 degrees. Some silicon-based liquid crystal display devices are heated or cooled by semiconductor refrigeration elements to control the temperature of silicon-based liquid crystal display chips, so that the temperature of silicon-based liquid crystal display chips is also within the normal operating temperature range in low-temperature or high-temperature environments. However, due to the limitation of the heating power of semiconductor refrigeration elements, it takes a long time for silicon-based liquid crystal display devices to reach normal operating temperature in low-temperature environments, and the startup speed is slow. For example, it usually takes more than 10 seconds for existing silicon-based liquid crystal display devices to reach normal operating temperature in a low-temperature environment of -40 degrees Celsius. The low-temperature startup speed of existing silicon-based liquid crystal display devices needs to be further improved. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a silicon-based liquid crystal display device capable of improving low-temperature startup speed.

[0004] The present invention also provides a vehicle comprising the above-mentioned silicon-based liquid crystal display device capable of improving the low-temperature starting speed.

[0005] According to an embodiment of the present invention, a silicon-based liquid crystal display device capable of improving low-temperature startup speed includes a temperature adjustment module and a silicon-based liquid crystal display chip module. The temperature adjustment module is arranged on the silicon-based liquid crystal display chip module. The temperature adjustment module includes a semiconductor refrigeration element capable of cooling and heating, a heating element for heating and a power supply circuit. The semiconductor refrigeration element and the heating element are arranged in parallel on the power supply circuit, and a diode is arranged on the circuit branch where the heating element is located. The heating element and the semiconductor refrigeration element can heat and raise the temperature of the silicon-based liquid crystal display chip module at the same time. When the semiconductor refrigeration element cools and cools the silicon-based liquid crystal display chip module, the diode makes the circuit branch where the heating element is located in an open circuit state.

[0006] A silicon-based liquid crystal display device capable of improving the low-temperature startup speed according to an embodiment of the present invention has at least the following beneficial effects: when the silicon-based liquid crystal display device provided by the present invention is started in a low-temperature environment, the heating element of the temperature adjustment module and the semiconductor refrigeration element can perform heating work at the same time to compensate for the problem of low heating power of a single semiconductor refrigeration element, increase the heating power, thereby increasing the speed at which the temperature of the silicon-based liquid crystal display chip module reaches the normal operating temperature from the ambient low temperature, so that the silicon-based liquid crystal display chip module can enter the normal operating state more quickly, thereby achieving the improvement of the low-temperature startup speed of the silicon-based liquid crystal display device. In addition, the present invention utilizes the unidirectional conductivity of the diode so that the heating element and the semiconductor refrigeration element can perform heating work at the same time, and the heating element cannot work when the semiconductor refrigeration element performs cooling work. Therefore, the temperature adjustment device only needs a diode to realize the operation switching between the heating element and the semiconductor refrigeration element, so that the overall circuit of the temperature adjustment device is simple, convenient for production and control, and the temperature adjustment device has higher reliability.

[0007] According to some embodiments of the present invention, the silicon-based liquid crystal display chip module is located on the temperature adjustment module, the semiconductor refrigeration element and the heating element are stacked together, a first heat-conducting medium layer is arranged between the semiconductor refrigeration element and the heating element, and a second heat-conducting medium layer is arranged between the silicon-based liquid crystal display chip module and the temperature adjustment module.

[0008] According to some embodiments of the present invention, the temperature regulating module includes a first housing, the semiconductor refrigeration element and the heating element are installed in the first housing, and the liquid crystal on silicon display chip module is installed above the first housing.

[0009] According to some embodiments of the present invention, the semiconductor refrigeration element is a TEC refrigeration sheet.

[0010] According to some embodiments of the present invention, the heating element is a PTC heater.

[0011] According to some embodiments of the present invention, the silicon-based liquid crystal display chip module includes a chip substrate, a frame, a transparent protective plate and a silicon-based liquid crystal display chip, the chip substrate is installed on the upper surface of the temperature adjustment module, the frame is arranged above the chip substrate, the frame and the chip substrate are enclosed to form a packaging groove, the frame is sealed and connected to the chip substrate, the silicon-based liquid crystal display chip is installed on the upper surface of the chip substrate and is located in the packaging groove, the silicon-based liquid crystal display chip is electrically connected to the external wiring through the built-in circuit layer of the chip substrate, the transparent protective plate covers the opening of the packaging groove and a glue sealing layer is filled between the transparent protective plate and the side wall of the packaging groove, or the transparent protective plate and the frame are formed as one body and the transparent protective plate closes the packaging groove.

[0012] According to some embodiments of the present invention, a second heat-conducting medium layer is filled between the chip substrate and the upper surface of the temperature adjustment module.

[0013] According to some embodiments of the present invention, a second shell, a transparent protective plate and an external cable are included, the second shell is installed on the upper surface of the temperature regulating module, the second shell is provided with a packaging groove with an opening facing upward, the outer wall of the second shell is provided with a wire hole connected to the packaging groove, the silicon-based liquid crystal display chip is arranged in the packaging groove, the transparent protective plate covers the opening of the packaging groove, the external cable is electrically connected to the silicon-based liquid crystal display chip through the wire hole, and a glue sealing layer is filled between the transparent protective plate and the side wall of the packaging groove and in the wire hole.

[0014] According to some embodiments of the present invention, a second heat-conducting medium layer is filled between the bottom of the second housing and the temperature adjustment module, and a third heat-conducting medium layer is filled between the bottom wall of the packaging groove and the liquid crystal on silicon display chip.

[0015] A vehicle according to an embodiment of the second aspect of the present invention includes the above-mentioned liquid crystal on silicon display device capable of improving low-temperature starting speed.

[0016] A vehicle according to an embodiment of the present invention has at least the following beneficial effects: by adopting the above-mentioned silicon-based liquid crystal display device, the silicon-based liquid crystal display device of the vehicle can be started at a faster speed in a low temperature environment to achieve a rapid response.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 A schematic diagram of a liquid crystal on silicon display device capable of improving low temperature startup speed according to an embodiment of the present invention;

[0020] Figure 2 A schematic diagram of a liquid crystal on silicon display device capable of improving low temperature startup speed according to an embodiment of the present invention;

[0021] Figure 3 for Figure 1 A circuit schematic diagram of a temperature regulating module of a liquid crystal on silicon display device capable of improving a low-temperature startup speed is shown in an embodiment of the present invention.

[0022] Reference numerals:

[0023] Temperature regulating module 100, semiconductor refrigeration element 110, heating element 120, diode 130, first shell 140, first heat-conducting medium layer 210, second heat-conducting medium layer 220, third heat-conducting medium layer 230, silicon-based liquid crystal display chip module 300, silicon-based liquid crystal display chip 310, chip substrate 320, frame 330, transparent protective plate 340, second shell 350, wire hole 351, packaging groove 360, glue sealing layer 400, external cable 510, connecting wire 520. DETAILED DESCRIPTION

[0024] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0025] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0027] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0028] Reference Figures 1 to 3According to an embodiment of the present invention, a silicon-based liquid crystal display device capable of improving low-temperature startup speed includes a temperature adjustment module 100 and a silicon-based liquid crystal display chip module 300. The temperature adjustment module 100 is arranged in the silicon-based liquid crystal display chip module 300. The temperature adjustment module 100 includes a semiconductor refrigeration element 110 capable of cooling and heating, a heating element 120 for heating, and a power supply circuit. The semiconductor refrigeration element 110 and the heating element 120 are arranged in parallel in the power supply circuit, and a diode 130 is arranged on the circuit branch where the heating element 120 is located. When the power supply circuit supplies power in the forward direction, the diode 130 is in a conducting state. At this time, the heating element 120 and the semiconductor refrigeration element 110 can heat the silicon-based liquid crystal display chip module 300 at the same time. When the power supply circuit supplies power in the reverse direction, the semiconductor refrigeration element 110 cools the silicon-based liquid crystal display chip module 300. At this time, the diode 130 makes the circuit branch where the heating element 120 is located in an open circuit state, so that the heating element 120 cannot perform heating work.

[0029] The silicon-based liquid crystal display device provided by the present invention can perform heating work simultaneously through the heating element 120 of the temperature adjustment module 100 and the semiconductor refrigeration element 110 when starting in a low-temperature environment, so as to compensate for the problem of low heating power of a single semiconductor refrigeration element 110, increase the heating power, and thus increase the speed at which the temperature of the silicon-based liquid crystal display chip module 300 reaches the normal operating temperature from the ambient low temperature, so that the silicon-based liquid crystal display chip module 300 can enter the normal operating state more quickly, thereby achieving an improvement in the low-temperature startup speed of the silicon-based liquid crystal display device. In addition, the present invention utilizes the unidirectional conductivity of the diode 130, so that the heating element 120 and the semiconductor refrigeration element 110 can perform heating work simultaneously, and the heating element 120 cannot work when the semiconductor refrigeration element 110 performs cooling work. Therefore, the temperature adjustment device only needs the diode 130 to realize the operation switching between the heating element 120 and the semiconductor refrigeration element, so that the overall circuit of the temperature adjustment device is simple, convenient for production and control, and the temperature adjustment device has higher reliability.

[0030] In the specific implementation process, the silicon-based liquid crystal display device provided by the present invention, through the above-mentioned temperature adjustment module 100, the silicon-based liquid crystal display chip module 300 can work normally in an ambient temperature of -40 to 110 degrees Celsius, adapt to a wider range of ambient temperatures, and can have a higher startup speed in a low-temperature environment. In an environment of -40 degrees Celsius, the silicon-based liquid crystal display chip module 300 can complete startup within 6 seconds.

[0031] Reference Figure 1 and Figure 2According to some embodiments of the present invention, the LCOS chip module 300 is located on the temperature adjustment module 100, the semiconductor cooling element 110 and the heating element 120 are stacked together, a first heat-conducting medium layer 210 is arranged between the semiconductor cooling element 110 and the heating element 120, and a second heat-conducting medium layer 220 is arranged between the LCOS chip module 300 and the temperature adjustment module 100. The arrangement of the first heat-conducting medium layer 210 and the second heat-conducting medium layer 220 can improve the heat transfer efficiency between the LCOS chip module 300 and the semiconductor cooling element 110 and the heating element 120, and further improve the low-temperature startup speed of the LCOS device.

[0032] Reference Figure 1 and Figure 2 According to some embodiments of the present invention, the temperature adjustment module 100 includes a first housing 140, the semiconductor cooling element 110 and the heating element 120 are installed in the first housing 140, and the silicon-based liquid crystal display chip module 300 is installed above the first housing 140. Therefore, the first housing 140 can contain components such as the semiconductor cooling element 110 and the heating element 120. At the same time, through the first housing 140, the semiconductor cooling element 110, the heating element 120 and other components of the temperature adjustment module 100 are integrated into a module, so that the temperature adjustment module 100 and the silicon-based liquid crystal display chip module 300 can be assembled independently and then installed together, thereby improving production efficiency.

[0033] According to some embodiments of the present invention, the semiconductor cooling element 110 is a TEC cooling sheet, which can perform cooling and heating.

[0034] According to some embodiments of the present invention, the heating element 120 is a PTC heater. The PTC heater has the advantages of low thermal resistance and high heat exchange efficiency, and is an automatic constant temperature and power-saving electric heater.

[0035] It is conceivable that in other embodiments, the heating element 120 may be configured in other ways, for example, the heating element 120 may be configured as a graphene heater.

[0036] Reference Figure 1According to some embodiments of the present invention, a silicon-based liquid crystal display chip module 300 includes a chip substrate 320, a frame 330, a transparent protective plate 340 and a silicon-based liquid crystal display chip 310. The chip substrate 320 is mounted on the upper surface of the temperature adjustment module 100, the frame 330 is arranged above the chip substrate 320, the frame 330 and the chip substrate 320 are enclosed to form a packaging groove 360, the frame 330 and the chip substrate 320 are sealed and connected, the silicon-based liquid crystal display chip 310 is mounted on the upper surface of the chip substrate 320 and is located in the packaging groove 360, the silicon-based liquid crystal display chip 310 is electrically connected to the external wiring 510 through the built-in circuit layer of the chip substrate 320, the transparent protective plate 340 covers the opening of the packaging groove 360 ​​and a glue sealing layer 400 is filled between the transparent protective plate 340 and the side wall of the packaging groove 360, or the transparent protective plate 340 and the frame 330 are formed as one body and the transparent protective plate 340 closes the packaging groove 360. Through the above arrangement, the LCOS chip 310 can be packaged into a closed packaging groove 360, so that the LCOS device has a good waterproof effect and meets the automotive regulations.

[0037] In a specific implementation process, the external cable 510 can be electrically connected to a driving circuit board on the vehicle, and the liquid crystal on silicon display device can be controlled by the driving circuit board to perform display work.

[0038] Reference Figure 1 According to some embodiments of the present invention, a second thermal conductive medium layer 220 is filled between the chip substrate 320 and the upper surface of the temperature regulating module 100 to improve the heat transfer efficiency between the chip substrate 320 and the temperature regulating module 100 .

[0039] Reference Figure 1 In some embodiments, the edge of the chip substrate 320 is connected to the temperature regulating module 100 by glue, thereby enabling the chip substrate 320 to be firmly mounted on the temperature regulating module 100 .

[0040] Reference Figure 2It is conceivable that the silicon-based liquid crystal display device can also adopt other structures for waterproof packaging. For example, in some other embodiments, the silicon-based liquid crystal display chip module 300 includes a second shell 350, a transparent protective plate 340, an external cable 510 and a silicon-based liquid crystal display chip 310. The second shell 350 is installed on the upper surface of the temperature adjustment module 100. The second shell 350 is provided with a packaging groove 360 ​​with an opening facing upward. The outer wall of the second shell 350 is provided with a wire hole 351 connected to the packaging groove 360. The silicon-based liquid crystal display chip 310 is arranged in the packaging groove 360. The transparent protective plate 340 covers the opening of the packaging groove 360. The external cable 510 is electrically connected to the silicon-based liquid crystal display chip 310 through the wire hole 351. The glue sealing layer 400 is filled between the transparent protective plate 340 and the side wall of the packaging groove 360 ​​and in the wire hole 351. Through the above arrangement, the LCOS chip 310 can be packaged into a closed packaging groove 360, so that the LCOS device has a good waterproof effect and meets the reliability requirements of vehicle regulations.

[0041] Reference Figure 2 According to some embodiments of the present invention, a second heat-conducting medium layer 220 is filled between the bottom of the second housing 350 and the temperature adjustment module 100, and a third heat-conducting medium layer 230 is filled between the bottom wall of the packaging groove 360 ​​and the silicon-based liquid crystal display chip 310. Thus, the heat transfer efficiency between the silicon-based liquid crystal display chip 310 and the temperature adjustment module 100 can be improved through the second heat-conducting medium layer 220 and the third heat-conducting medium layer 230.

[0042] Reference Figure 2 In a specific implementation process, the bottom of the second shell 350 and the upper end of the first shell 140 can be connected by glue, or by snaps or other methods.

[0043] In the specific implementation process, refer to Figure 1 The glue sealing layer 400 between the transparent guard plate 340 and the side wall of the packaging groove 360 ​​can be formed by a dispensing process or a glue pouring process. When the dispensing process is adopted, the glue is mainly filled between the transparent guard plate 340 and the side wall of the packaging groove 360. The connecting wire 520 between the silicon-based liquid crystal display chip 310 and the chip substrate 320 is fixed by a gold wire glue; Figure 2 When the glue filling process is adopted, the packaging groove 360 ​​is also filled with glue, and the silicon-based liquid crystal display chip 310 and the connecting wire 520 between the silicon-based liquid crystal display chip 310 and the chip substrate 320 can be fixed by the glue sealing layer 400 in the packaging groove 360.

[0044] According to some embodiments of the present invention, the silicon-based liquid crystal display chip 310 is configured with a temperature sensor, and the temperature adjustment module 100 is electrically connected to the driving circuit board. Therefore, the silicon-based liquid crystal display chip 310 can use the built-in temperature sensor to detect its own temperature, and the signal of the temperature sensor can be transmitted to the driving circuit board through the external cable 510, and then the driving circuit board controls the operation of the temperature adjustment module 100 according to the signal of the temperature sensor.

[0045] A vehicle according to an embodiment of the second aspect of the present invention includes the above-mentioned silicon-based liquid crystal display device capable of improving the low-temperature startup speed. By adopting the above-mentioned silicon-based liquid crystal display device, the silicon-based liquid crystal display device of the vehicle can be started at a faster speed in a low-temperature environment to achieve a rapid response.

[0046] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A liquid crystal on silicon display device capable of improving low temperature startup speed, characterized in that: include: Liquid crystal on silicon display chip module (300); A temperature regulating module (100) is provided in the silicon-based liquid crystal display chip module (300). The temperature regulating module (100) comprises a semiconductor refrigeration element (110) capable of cooling and heating, a heating element (120) for heating, and a power supply circuit. The semiconductor refrigeration element (110) and the heating element (120) are arranged in parallel in the power supply circuit, and a diode (130) is arranged on the circuit branch where the heating element (120) is located. The heating element (120) and the semiconductor refrigeration element (110) can heat the silicon-based liquid crystal display chip module (300) module at the same time. When the semiconductor refrigeration element (110) cools the silicon-based liquid crystal display chip module (300), the diode (130) makes the circuit branch where the heating element (120) is located in an open circuit state.

2. A liquid crystal on silicon display device capable of improving low temperature startup speed according to claim 1, characterized in that: The silicon-based liquid crystal display chip module (300) is located on the temperature adjustment module (100), the semiconductor refrigeration element (110) and the heating element (120) are stacked together, a first heat-conducting medium layer (210) is provided between the semiconductor refrigeration element (110) and the heating element (120), and a second heat-conducting medium layer (220) is provided between the silicon-based liquid crystal display chip module (300) and the temperature adjustment module (100).

3. The liquid crystal on silicon display device capable of improving low temperature startup speed according to claim 1, characterized in that: The temperature adjustment module (100) comprises a first housing (140), the semiconductor refrigeration element (110) and the heating element (120) are installed in the first housing (140), and the silicon-based liquid crystal display chip module (300) is installed on the first housing (140).

4. The liquid crystal on silicon display device capable of improving low temperature startup speed according to claim 1, characterized in that: The semiconductor refrigeration element (110) is a TEC refrigeration sheet.

5. The liquid crystal on silicon display device capable of improving low temperature startup speed according to claim 1, characterized in that: The heating element (120) is a PTC heater.

6. The liquid crystal on silicon display device capable of improving low temperature startup speed according to claim 1, characterized in that: The silicon-based liquid crystal display chip module (300) comprises a chip substrate (320), a frame (330), a transparent protective plate (340) and a silicon-based liquid crystal display chip (310), wherein the chip substrate (320) is mounted on the upper surface of the temperature adjustment module (100), the frame (330) is arranged above the chip substrate (320), the frame (330) and the chip substrate (320) are enclosed to form a packaging groove (360), the frame (330) and the chip substrate (320) are sealed and connected, and the silicon-based liquid crystal display chip (310) is mounted on the upper surface of the temperature adjustment module (100). The upper surface of the chip substrate (320) is located in the packaging groove (360), the silicon-based liquid crystal display chip (310) is electrically connected to the external wiring (510) through the built-in circuit layer of the chip substrate (320), the transparent protective plate (340) is covered on the opening of the packaging groove (360), and a glue sealing layer (400) is filled between the transparent protective plate (340) and the side wall of the packaging groove (360), or the transparent protective plate (340) and the frame (330) are formed as a whole and the transparent protective plate (340) closes the packaging groove (360).

7. The liquid crystal on silicon display device capable of improving low temperature startup speed according to claim 6, characterized in that: A second heat-conducting medium layer (220) is filled between the chip substrate (320) and the upper surface of the temperature adjustment module (100).

8. The liquid crystal on silicon display device capable of improving low temperature startup speed according to claim 1, characterized in that: The silicon-based liquid crystal display chip module (300) comprises a second housing (350), a transparent protective plate (340), an external wiring (510) and a silicon-based liquid crystal display chip (310); the second housing (350) is mounted on the upper surface of the temperature adjustment module (100); the second housing (350) is provided with a packaging groove (360) with an opening facing upward; the outer side wall of the second housing (350) is provided with a wire hole (360) communicating with the packaging groove (360); The silicon-based liquid crystal display chip (310) is arranged in the packaging groove (360), the transparent protective plate (340) is covered on the opening of the packaging groove (360), the external wiring (510) is electrically connected to the silicon-based liquid crystal display chip (310) through the wire hole (351), and a glue sealing layer (400) is filled between the transparent protective plate (340) and the side wall of the packaging groove (360) and in the wire hole (351).

9. The liquid crystal on silicon display device capable of improving low temperature startup speed according to claim 8, characterized in that: A second heat-conducting medium layer (220) is filled between the bottom of the second housing (350) and the temperature adjustment module (100), and a third heat-conducting medium layer (230) is filled between the bottom wall of the packaging groove (360) and the silicon-based liquid crystal display chip (310).

10. A vehicle, characterized in that: The invention comprises a liquid crystal on silicon display device capable of improving low temperature startup speed as described in any one of claims 1 to 9.

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