Substrate processing apparatus

Abstract

A substrate processing apparatus for processing a substrate is provided with the following elements: a batch-type processing unit for processing a plurality of substrates together in a vertical posture state; a single sheet type processing unit that processes one substrate in a horizontal posture state; a posture conversion unit that converts the plurality of substrates, which have been processed by the batch processing unit, from a vertical posture to a horizontal posture; a first transport unit that transports the plurality of substrates, which have been processed by the batch processing unit, to the posture conversion unit; and a second transport unit that transports the plurality of substrates in the horizontal orientation by the orientation conversion unit to the sheet-fed processing unit, the orientation conversion unit holding the plurality of substrates in a state in which the space above the upper surfaces of the plurality of substrates is narrow when the orientation conversion of the plurality of substrates is performed, and the second transport unit transporting the plurality of substrates in the horizontal orientation by the orientation conversion unit to the sheet-fed processing unit. The plurality of substrates are held in a state in which the space above the upper surfaces of the plurality of substrates is wide when the plurality of substrates are joined after being brought into a horizontal posture.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for performing predetermined processing on substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates such as liquid crystal display or organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. Background Art

[0002] In the past, such devices include a batch module, a single-sheet module, and a rotating mechanism. For example, refer to Japanese Gazette No. 2016-502275. The batch module processes multiple substrates at once. The single-sheet module processes one substrate at a time. Generally, the drying process performed by the single-sheet module has a smaller space for the processing atmosphere affected by the substrate than the drying process performed by the batch module, and the particle performance is higher. Therefore, it is easier to improve the drying performance of the single-sheet module than the batch module. Therefore, for example, sometimes after the etching process and the rinsing process are performed by the batch module, the drying process is performed by the single-sheet module.

[0003] In the batch type module, a plurality of substrates are processed in a vertical position. On the other hand, in the single type module, the substrates are processed in a horizontal position. Therefore, the vertical position substrates processed in the batch type module are converted to a horizontal position by a rotating mechanism before being transported to the single type module. The rotating mechanism includes a reversing chuck having a groove formed therein for clamping the substrate.

[0004] Specifically, the groove of the flip chuck has a guide groove on the front side and a locking groove on the back side. The guide groove is configured to be V-shaped to guide the periphery of the substrate. The locking groove has a shape with a thickness slightly larger than the thickness of the substrate, so as to suppress the substrate from moving significantly in the thickness direction and to lock the end face of the substrate. Thus, when the flip chuck clamps the substrate, the periphery of the substrate is guided by the guide groove, and the end face of the substrate is held by the locking groove. Therefore, the substrate can be rotated stably.

[0005] However, in the case of the conventional example having such a structure, there are the following problems.

[0006] That is, in the conventional device, the distance that the substrate can rise in the locking groove of the reversing chuck is very short. Therefore, although the posture can be stably changed, there is a problem that it is difficult to control the robot that receives the substrate in a horizontal posture. Summary of the invention

[0007] The present invention has been made in view of such a situation, and an object thereof is to provide a substrate processing apparatus that can perform stable posture change and easily transfer substrates by providing a gap that allows the substrate to be sufficiently raised when being transferred.

[0008] In order to achieve such an object, the present invention adopts the following structure.

[0009] That is, the present invention is a substrate processing device for processing substrates, the substrate processing device comprising: a batch processing unit that processes a plurality of substrates at a time in a vertical posture; a single-sheet processing unit that processes a single substrate in a horizontal posture; a posture changing unit that changes the posture of the plurality of substrates that have been processed in the batch processing unit from a vertical posture to a horizontal posture; a first conveying unit that conveys the plurality of substrates that have been processed in the batch processing unit to the posture changing unit; and a second conveying unit that conveys the plurality of substrates that have been in a horizontal posture in the posture changing unit to the single-sheet processing unit, the posture changing unit holding the plurality of substrates in a narrow interval above the upper surfaces of the plurality of substrates when performing posture changes on the plurality of substrates, and holding the plurality of substrates in a wide interval above the upper surfaces of the plurality of substrates when handing over the plurality of substrates after the plurality of substrates have been in a horizontal posture.

[0010] According to the present invention, after the plurality of substrates processed by the batch processing unit are transported to the posture changing unit by the first conveying unit, the posture changing unit changes the plurality of substrates from a vertical posture to a horizontal posture. The plurality of substrates changed to a horizontal posture are handed over one by one by the second conveying unit, and then processed by the single-sheet processing unit. When the posture changing unit changes the postures of the plurality of substrates, the plurality of substrates are held in a narrow interval above the upper surfaces of the plurality of substrates. Therefore, the plurality of substrates can be held stably and the postures can be changed stably. When the plurality of substrates in a horizontal posture are handed over, the posture changing unit holds the plurality of substrates in a wide interval above the upper surfaces of the plurality of substrates. Therefore, the second conveying unit can easily hand over each of the plurality of substrates.

[0011] In addition, preferably, in the present invention, the posture changing section comprises: a flip chuck, which is arranged opposite to the plurality of substrates in the radial direction and clamps the peripheral edge portions of the plurality of substrates; a driving mechanism, which moves the flip chuck in the horizontal direction between at least two locations, namely a first interval and a second interval, wherein the first interval is an interval for the plurality of substrates to be handed over between the first conveying portion and the second conveying portion, and the second interval is narrower than the first interval and is an interval for clamping the plurality of substrates; and a rotating mechanism, which rotates the flip chuck in the surface direction of the plurality of substrates, wherein the flip chuck comprises: a first groove, which allows the plurality of substrates to move in the thickness direction; and a second groove, which is formed closer to the first groove than to the first groove. The flip chuck is positioned at the outer sides of the plurality of substrates, limiting the movement of the plurality of substrates in the thickness direction and clamping the plurality of substrates in the radial direction. When the flip chuck receives the plurality of substrates from the first conveying portion, the driving mechanism causes the flip chuck to be in the first interval so that the plurality of substrates are respectively accommodated in the first grooves. When the plurality of substrates are rotated to a horizontal posture by the rotating mechanism, the driving mechanism causes the flip chuck to be in the second interval so that the plurality of substrates are respectively clamped by the second grooves. When the second conveying portion receives the plurality of substrates from the flip chuck, the driving mechanism causes the flip chuck to be in the first interval so that the first grooves abut against and support the lower surfaces of the plurality of substrates.

[0012] When the flip chuck receives multiple substrates from the first conveying unit, the driving mechanism is used to make it into the first interval and the multiple substrates are respectively accommodated in the first groove. When the multiple substrates are rotated to a horizontal posture by the rotating mechanism, the driving mechanism is used to make it into the second interval and the multiple substrates are respectively clamped by the second groove. Therefore, when the posture is changed, the movement of the substrate in the thickness direction is restricted. As a result, the multiple substrates can be stably held and the posture can be stably changed. When the second conveying unit receives multiple substrates from the flip chuck, the driving mechanism is used to make it into the first interval and the lower surface of the multiple substrates is supported by the first groove. Therefore, when the substrates are handed over, the substrates are allowed to move in the thickness direction. As a result, the second conveying unit can pull up the multiple substrates separately and hand them over easily. The posture changing unit can clamp or loosely hold the substrate only by moving the flip chuck in the horizontal direction through the driving mechanism.

[0013] In addition, preferably, in the present invention, the second groove comprises: a top where the end faces of the multiple substrates are located; and an inner inclined surface that extends from the top toward the center side of the multiple substrates, and the first groove has an opening on the center side of the multiple substrates, and has a near front inclined surface that extends from the inner inclined surface toward the opening.

[0014] The flip chuck is formed with two levels of grooves, namely, a first groove and a second groove. The second groove holds the end surface of the substrate with the top, and supports the lower surface of the substrate with the inner inclined surface. Therefore, the substrate can be stably clamped. The first groove connected to the second groove abuts against the lower surface of the supporting substrate with the near-front inclined surface extending toward the front end of the opening. Therefore, a sufficient gap can be formed on the upper surface of the substrate.

[0015] Furthermore, in the present invention, preferably, the back side inclined surface and the front side inclined surface have inclined surfaces at positions facing the front and back surfaces of the plurality of substrates.

[0016] In a substrate processing device, a batch consisting of a plurality of substrates whose surfaces are opposite to each other is sometimes processed (so-called face to face). When such a batch is processed, a plurality of substrates whose surfaces face a predetermined direction are held by a flip chuck and flipped, or a plurality of substrates whose surfaces face a direction opposite to the predetermined direction are held by a flip chuck and flipped in a direction opposite to the substrates whose surfaces face the predetermined direction. Thereafter, the lower surface of the substrate slides on the inner side inclined surface and is supported by the near front side inclined surface. Therefore, regardless of the direction in which the surfaces of the plurality of substrates face, they can reliably move from the inner side inclined surface to the near front side inclined surface and be supported by the near front side inclined surface.

[0017] Furthermore, in the present invention, preferably, the inclination of the near-side inclined surface is gentler than the inclination of the back-side inclined surface.

[0018] When the flip chuck changes from the second interval to the first interval, the substrate moves from the inner inclined surface to the near-front inclined surface. At this time, the impact applied to the lower surface of the substrate can be reduced, thereby suppressing the generation of particles when changing from the second interval to the first interval.

[0019] In addition, preferably, in the present invention, the posture changing portion further includes an alignment rod, which is capable of moving between a restriction position for restricting the horizontal movement of the multiple substrates and an allowable position for allowing the multiple substrates to move in the horizontal direction when the multiple substrates are placed in a horizontal posture by the flip chuck, and the alignment rod is moved to the restriction position before the flip chuck expands from the second interval to the first interval.

[0020] Before the flip chuck expands from the second interval to the first interval, the alignment rod is moved to the limiting position. Therefore, when the flip chuck moves, the plurality of substrates can be prevented from shifting in the horizontal direction. As a result, when the second conveying unit is used for handover, the substrates can be reliably handed over.

[0021] Furthermore, in the present invention, preferably, the alignment bar is provided on a receiving side of the second conveying portion on which the plurality of substrates are received and on an opposite side of the receiving side across the plurality of substrates in a plan view.

[0022] The horizontal position of the substrate on the side where the second conveying unit moves forward and backward can be restricted. Therefore, the front and rear positions of the substrate can be restricted when viewed from the second conveying unit. As a result, when the substrate is transferred using the second conveying unit, the substrate can be transferred reliably.

[0023] Furthermore, in the present invention, preferably, after the second interval is expanded toward the first interval, when the second transport unit receives the plurality of substrates from the reverse chuck, the alignment rod on the receiving side of the alignment rods is moved to the allowing position.

[0024] After the alignment rod on the receiving side of the alignment rod is moved to the permissive position, the substrate is transferred by the second conveying unit. Therefore, the substrate can be transferred smoothly by the second conveying unit.

[0025] Furthermore, in the present invention, preferably, the alignment bar is formed with a plurality of grooves corresponding to positions of end surfaces of the plurality of substrates.

[0026] When the flip chuck moves from the second interval to the first interval, the plurality of substrates move downward from the back inclined surface to the front inclined surface, thereby limiting the large horizontal movement and preventing the generation of particles due to friction of the end surfaces of the plurality of substrates.

[0027] In addition, in the present invention, preferably, a lifting mechanism for lifting and lowering the reversal chuck is further provided, and when the second transport unit receives the plurality of substrates from the reversal chuck, the lifting and lowering mechanism lowers the reversal chuck.

[0028] By lowering the inversion chuck by the lifting mechanism without raising or lowering the second conveying unit, the substrate can be delivered to the second conveying unit. Therefore, the structure of the second conveying unit can be simplified.

[0029] In addition, preferably, in the present invention, when the first conveying part delivers the multiple substrates to the flip chuck, the lifting mechanism causes the flip chuck forming the first interval to drop from a receiving height near the upper edge of the multiple substrates conveyed by the first conveying part to a clamping height near the side edge of the multiple substrates.

[0030] When the lifting mechanism lowers the inverting chuck forming the first interval from the receiving height to the clamping height, a plurality of substrates can be delivered to the inverting chuck. Therefore, a plurality of substrates can be delivered with simple control. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a plan view showing the overall structure of the substrate processing apparatus according to the embodiment.

[0032] Figure 2 yes Figure 1 AA section view in.

[0033] Figure 3 It is a top view showing the structure of 25 chucks and a reversing chuck.

[0034] Figure 4 This is a front view of the flip chuck in the first interval state.

[0035] Figure 5 This is a front view of the state where the flip chuck is in the second interval.

[0036] Figure 6 It is a cross-sectional view when the flip chuck is in the first interval state.

[0037] Figure 7 It is a cross-sectional view when the chuck is turned over to the second interval state.

[0038] Figure 8 The figure shows the structure of the posture changing unit and is a front view showing a state where the substrate is held in a vertical posture.

[0039] Fig. 9 The figure shows the structure of the posture changing unit and is a front view showing a state where the substrate is held in a horizontal posture.

[0040] Fig.10 It is a top view of the posture changing unit.

[0041] Fig.11 It is a diagram for explaining the posture changing operation of the substrate.

[0042] Fig.12 It is a diagram for explaining the posture changing operation of the substrate.

[0043] Fig.13 It is a diagram for explaining the posture changing operation of the substrate.

[0044] Fig.14 It is a diagram for explaining the posture changing operation of the substrate.

[0045] Fig.15 It is a diagram for explaining the posture changing operation of the substrate.

[0046] Fig.16 It is a diagram for explaining the posture changing operation of the substrate.

[0047] Fig.17 It is a diagram for explaining the posture changing operation of the substrate.

[0048] Fig.18 It is a diagram for explaining the posture changing operation of the substrate.

[0049] Fig.19 It is a diagram for explaining the posture changing operation of the substrate.

[0050] Fig. 20 It is a diagram for explaining the posture changing operation of the substrate.

[0051] Fig.21 It is a longitudinal sectional view showing the action of turning over the chuck.

[0052] Fig. 22 It is a diagram for explaining the posture changing operation of the substrate.

[0053] Fig.23 It is a diagram for explaining the posture changing operation of the substrate.

[0054] Fig.24 It is a diagram for explaining the posture changing operation of the substrate.

[0055] Fig.25 It is a diagram for explaining the posture changing operation of the substrate.

[0056] Fig.26 It is a diagram for explaining the posture changing operation of the substrate.

[0057] Fig. 27 It is a diagram for explaining the posture changing operation of the substrate.

[0058] Fig.28 It is a diagram for explaining the posture changing operation of the substrate.

[0059] Fig.29 This figure shows a modified example of the inversion chuck, and shows a state during transfer.

[0060] Fig.30 This figure shows a modified example of the inversion chuck, and is a diagram showing a state when the posture is changed. DETAILED DESCRIPTION

[0061] Hereinafter, preferred embodiments of the present invention will be described in detail based on the accompanying drawings.

[0062] Figure 1 It is a plan view showing the overall structure of the substrate processing apparatus according to the embodiment. Figure 2 yes Figure 1 AA section view in.

[0063] <1. Overall structure>

[0064] The substrate processing device 1 processes the substrate W. The substrate processing device 1 performs, for example, liquid treatment, cleaning treatment, drying treatment, etc. on the substrate W. The substrate processing device 1 adopts a processing method that includes both a batch method and a single-sheet method (a so-called hybrid method). The batch method processes a plurality of substrates W at once in a vertical posture. The single-sheet method processes a single substrate W in a horizontal posture.

[0065] The substrate processing apparatus 1 includes a batch processing apparatus 3 and a single-sheet processing apparatus 5. In this embodiment, the single-sheet processing apparatus 5 is disposed adjacent to the batch processing apparatus 3. The batch processing apparatus 3 and the single-sheet processing apparatus 5 are disposed separately. The batch processing apparatus 3 and the single-sheet processing apparatus 5 are connected by a bridge 7.

[0066] <2. Batch processing device>

[0067] The batch processing apparatus 3 processes a plurality of substrates W at a time. The batch processing apparatus 3 includes a loading block 9 , a storage block 11 , a transfer block 13 , a posture changing block 15 , and a processing block 17 .

[0068] In this specification, for convenience, the direction in which the loading block 9, the storage block 11, the transfer block 13 and the processing block 17 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. The direction from the storage block 11 toward the loading block 9 in the front-rear direction X is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, the front, rear, right, left, top and bottom are appropriately shown for reference.

[0069] <3. Move in block>

[0070] The loading block 9 includes an input section 19. The input section 19 is arranged at the front X of the batch processing device 3. The carrier C stores multiple (for example, 25) substrates W in a horizontal posture at fixed intervals along the vertical direction Z. The carrier C separates the surfaces of the substrates W from each other, forming a plurality of grooves (not shown) for accommodating the substrates W one by one. As the carrier C, there is, for example, a FOUP (FrontOpening Unify Pod). FOUP is a closed container. Regardless of the type, the carrier C can also be an open container. The input section 19 includes, for example, two loading tables 21 for loading the carriers C. The two loading tables 21 are arranged, for example, along the width direction Y. The input section 19 is also called a loading port.

[0071] <4. Storage Block>

[0072] The material storage block 11 is disposed adjacent to the rear X of the carrying-in block 9 . The material storage block 11 includes a conveyance storage section ACB. The conveyance storage section ACB includes a conveyance mechanism 23 and a shelf 25 .

[0073] The transport mechanism 23 transports the carrier C. The transport and storage section ACB has a plurality of shelves 25. Among the shelves 25, there are shelves that only temporarily mount the carrier C and shelves that mount the carrier C for the handover with the first transport mechanism HTR. The transport and storage section ACB takes in the carrier C storing the unprocessed substrates W from the input section 19 and places it on the shelf 25. The transport and storage section ACB transports the carrier C and places it on the handover shelf 25 according to a schedule that specifies the processing sequence. The transport and storage section ACB transports the empty carrier C placed on the handover shelf 25 and places it on the shelf 25. The transport and storage section ACB carries the empty carrier C placed on the shelf 25 to the stage 21 according to the vacancy status of the stage 21. The empty carrier C is transported to the single-sheet processing section 5. In the empty carrier C conveyed to the sheet-by-sheet processing section 5 , for example, substrates W that were stored in the carrier C before processing and have completed processing are stored by the sheet-by-sheet processing section 5 .

[0074] <5. Transfer block>

[0075] The transfer block 13 is disposed adjacent to the rear X of the material storage block 11. The transfer block 13 includes a transfer mechanism CTC. The transfer mechanism CTC includes a first transport mechanism HTR, a conversion mechanism HVC, a push rod PH, and a second transport mechanism WTR.

[0076] The first transport mechanism HTR is arranged at the right Y in the rear X of the transport and storage section ACB. The first transport mechanism HTR transports a plurality of substrates W at a time. In other words, the first transport mechanism HTR has a plurality of robots (not shown). One robot supports one substrate W. The first transport mechanism HTR can also transport only one substrate W. The first transport mechanism HTR takes out a plurality of substrates W (for example, 25) at a time from the carrier C placed on the transfer shelf 25 in the transport and storage section ACB, and transports them to the conversion mechanism HVC while maintaining a horizontal posture. At this time, the conversion mechanism HVC changes the posture of the substrate W from a horizontal posture to a vertical posture.

[0077] The conversion mechanism HVC and the push rod PH are sequentially arranged on the left side Y of the first transport mechanism HTR. The conversion mechanism HVC delivers a plurality of substrates W to the push rod PH. After receiving a plurality of substrates W from the conversion mechanism HVC, the push rod PH moves to the second transport mechanism WTR in the width direction Y. At this time, the conversion mechanism HVC and the push rod PH assemble or release a batch lot. The push rod PH delivers a plurality of substrates W to the second transport mechanism WTR.

[0078] The transfer mechanism CTC combines, for example, a plurality of substrates W constituting a batch taken out from a certain carrier C and a plurality of substrates W constituting another batch taken out from another carrier C into a batch. This is the assembly of the batch. The batch is composed of twice the number of substrates W of a batch. The batch arranges the substrates W of another batch in a manner adjacent to the substrates W of a batch. That is, the substrates W of one batch are arranged as odd numbers, and the substrates W of another batch are arranged as even numbers. Usually, the interval between the plurality of substrates W taken out from the carrier C is the same as that of the carrier C. This interval is called the full pitch. In a batch, for example, the interval between the plurality of substrates W is half of the full pitch. This interval is called the half pitch. The batch combines one batch with another batch as described above, but there are two types of surface alignment (also called Face to Face) and surface back alignment (also called Back to Face) according to the combination method. The combination method of the batch is determined by the action of the push rod PH. In addition, the details of the action are omitted for easy understanding of the present invention. In the following description, a plurality of substrates W are referred to as a batch. However, when a description specific to a batch lot is required, a plurality of substrates W are referred to as a batch lot.

[0079] The second transport mechanism WTR is arranged on the left side Y of the transfer mechanism CTC. The second transport mechanism WTR is configured to be movable between the transfer block 13 and the processing block 17. The second transport mechanism WTR is configured to be movable in the front-to-back direction X. The second transport mechanism WTR includes a pair of robots 27 for transporting the batch. The pair of robots 27 includes, for example, a rotation axis facing the width direction Y. The pair of robots 27 swings around the rotation axis. The pair of robots 27 clamps the side end surfaces of the plurality of substrates W constituting the batch in the front-to-back direction X. The second transport mechanism WTR delivers the plurality of substrates W constituting the batch to the transfer mechanism CTC. The second transport mechanism WTR delivers the plurality of unprocessed substrates W constituting the batch to the processing block 17. The second transport mechanism WTR delivers the plurality of substrates W processed by the processing block 17 to the posture change block 15.

[0080] Here, the processing block 17 will be described before the posture changing block 15 .

[0081] <6. Processing Block>

[0082] The processing block 17, for example, includes a batch processing unit BPU. For example, the batch processing unit BPU includes 6 processing units. Specifically, the batch processing unit BPU includes a first batch processing unit BPU1, a second batch processing unit BPU2, a third batch processing unit BPU3, a fourth batch processing unit BPU4, a fifth batch processing unit BPU5, and a sixth batch processing unit BPU6. In addition, the number of the batch processing units BPU is not limited to 6. That is, the batch processing units BPU may be less than 6 or may be 7 or more.

[0083] The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are arranged in a row in the front-to-back direction X. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are respectively equipped with a processing tank BB and a lifter LF. The processing tank BB stores a processing liquid. The processing liquid is pure water or a chemical liquid. The chemical liquid is, for example, an organic solvent or an etching liquid. The organic solvent is, for example, IPA (isopropyl alcohol). The etching liquid is, for example, a phosphoric acid solution.

[0084] The lifter LF is lifted and lowered between the processing position inside the processing tank BB, that is, the processing position and the handover position above the liquid surface of the processing tank BB. At the handover position, the lifter LF hands over a plurality of substrates W to the second transport mechanism WTR. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are established correspondingly, for example, in pairs. Specifically, the first batch processing unit BPU1 and the second batch processing unit BPU2 form a pair, the third batch processing unit BPU3 and the fourth batch processing unit BPU4 form a pair, and the fifth batch processing unit BPU5 and the sixth batch processing unit BPU6 form a pair. A pair shares roles in, for example, liquid treatment and cleaning treatment. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 can, for example, process up to 50 substrates W at a time. In other words, the first batch processing unit BPU1 to the sixth batch processing unit BPU6 can, for example, process up to one batch at a time.

[0085] Each processing tank BB is supplied with a processing liquid from below. The processing liquid in each processing tank BB is discharged over the upper edge. Each processing tank BB immerses a plurality of substrates W placed on the lifter LF in the processing liquid. Each lifter LF contacts and holds the lower edge of the substrate W. Each lifter LF delivers a plurality of substrates W to the second transport mechanism WTR.

[0086] <7. Posture change block>

[0087] like Figure 2 As shown, the posture conversion block 15 includes 25 chucks TFC, a standby tank 31, and a posture conversion tank 33. In the drawings referred to in the standby tank 31 and the posture conversion tank 33, the liquid surface is not shown and omitted for easy viewing of each structure.

[0088] The standby tank 31 includes a processing tank BB0 and an elevator LF0. The processing tank BB0 has the same structure as the processing tank BB included in the first batch processing unit BPU1 to the sixth batch processing unit BPU6. The elevator LF0 is raised and lowered between the interior of the processing tank BB0, i.e., the standby position and the junction position above the liquid level of the processing tank BB0. The standby tank BB0 stores a processing liquid. The processing liquid is, for example, pure water. At the standby position, the substrate W placed on the elevator LF0 is completely immersed in the processing liquid.

[0089] Here, refer to Figure 3 . Figure 3 It is a top view showing the structure of the 25-card chuck and the flip chuck.

[0090] The 25 chucks TFC as a whole only move horizontally in the width direction Y. The 25 chucks TFC do not rise or fall in the vertical direction Z. The 25 chucks TFC do not move horizontally in the front-to-back direction X. However, the 25 chucks TFC opens and closes the robot 35 between the holding position PC and the passing position PT. At the holding position PC, the 25 chucks TFC hold a plurality of substrates W. At the passing position PT, the 25 chucks TFC do not hold a plurality of substrates W. In other words, the passing position PT allows the lifter LF0 holding a plurality of substrates W to move between the handover position and the standby position. For example, the 25 chucks TFC moves in the width direction Y between three positions: the first handover position P1, the second handover position P2, and the third handover position P3.

[0091] The 25-piece chuck TFC has a locking portion 37. The locking portion 37 is provided on the inner side of the robot 35. The locking portion 37 is formed in the width direction Y at intervals of the full pitch described above. The first handover position P1 and the second handover position P2 differ in position in the width direction Y by a distance equivalent to half the pitch. The third handover position P3 is a position for handing over a plurality of substrates W to the posture change groove 33. The 25-piece chuck TFC receives only one batch from the lifter LF0 at the first handover position P1. Specifically, only a plurality of odd-numbered substrates W constituting the initial batch of the two batches constituting the batch are received. The 25-piece chuck TFC receives only another batch from the lifter LF0 at the second handover position P2. Specifically, only a plurality of even-numbered substrates W constituting the next batch of the two batches constituting the batch are received.

[0092] Here, in addition to Figure 2 and Figure 3 In addition, refer to Figure 4 to Figure 7 . Figure 4 This is a front view of the flip chuck in the first interval state. Figure 5 This is a front view of the state where the flip chuck is in the second interval. Figure 6 It is a cross-sectional view when the flip chuck is in the first interval state. Figure 7It is a cross-sectional view when the chuck is turned over to the second interval state.

[0093] like Figure 2 As shown, the posture change tank 33 includes a dipping tank DB and a posture change unit 41 .

[0094] First, the main part is described. The posture change tank 33 changes the posture of multiple substrates W at a time in the immersion tank DB by using the reversing chuck 43. Specifically, the reversing chuck 43 changes the posture of multiple substrates W from a vertical posture to a horizontal posture. The reversing chuck 43 changes the posture of, for example, half of the substrates W constituting a batch. The reversing chuck 43 changes the posture of, for example, 25 substrates W. The reversing chucks 43 are arranged opposite to each other in the radial direction of the substrates W, clamping the peripheral edge of the substrates W. The immersion tank DB stores a processing liquid. The processing liquid is, for example, pure water.

[0095] like Figure 4 and Figure 5 As shown, the reversing chuck 43 includes a pair of chuck members 45. When the chuck members 45 receive or hold the substrate W in a vertical posture, the length in the vertical direction Z is shorter than the radius of the substrate W. Figure 3 As shown, the length in the width direction Y of the chuck member 45 when receiving or holding the substrate W in the vertical posture is slightly longer than the length in the arrangement direction of the plurality of substrates W in the batch.

[0096] like Figures 4 to 6 As shown, each chuck member 45 has a groove 47 on the opposing surface. Figure 4 and Figure 5 As shown in FIG. 1 , in the vertical position of receiving or holding the substrate W in the vertical position, the groove 47 has an arc shape when viewed from the width direction Y. The arc shape of the groove 47 is a shape along the outer edge of the substrate W.

[0097] like Figure 6 As shown, the groove portion 47 includes a first groove SL1 and a second groove SL2. The first groove SL1 allows the plurality of substrates W to move in the thickness direction. The second groove SL2 is formed at a position radially outside the plurality of substrates W than the first groove SL1, restricts the plurality of substrates W from moving in the thickness direction, and clamps the plurality of substrates W in the radial direction.

[0098] The second slot SL2 includes: a top 49 where the end faces of the plurality of substrates W are located; and an inner inclined surface 51 extending from the top 49 toward the center of the plurality of substrates W. The top 49 is formed at the narrowest portion of the inner inclined surfaces 51 on both sides. The top 49 has a size capable of accommodating the end faces of the substrates W. The inner inclined surface 51 is formed at positions facing the front and back surfaces of the substrates W.

[0099] The first slot SL1 has an opening 53 at the center of the plurality of substrates W. The first slot SL1 has a near-front inclined surface 55 extending from the inner inclined surface 51 toward the opening 53. The near-front inclined surface 55 is formed at a position facing the front and back of the substrate W. The dimension of the opening 53 in the width direction Y is several times larger than the thickness of the substrate W, for example.

[0100] The near-front inclined surface 55 is formed to have a gentler inclination than the rear-side inclined surface 51. In other words, the rear-side inclined surface 51 is formed to have a steeper inclination toward the top 49 than the near-front inclined surface 55.

[0101] The pair of chuck members 45 moves in the front-to-back direction X over the first interval WD1 and the second interval WD2. The pair of chuck members 45 can change the distance between the opposing grooves 47. The first interval WD1 is an interval for transferring substrates between the 25-sheet chuck TFC and the bridge portion 7. The second interval WD2 is an interval that is narrower in the front-to-back direction X than the first interval WD1 and is used to clamp a plurality of substrates W.

[0102] Here, refer to Figure 8 to Figure 10 , the posture changing unit 41 is explained. Figure 8 The figure shows the structure of the posture changing unit and is a front view showing a state where the substrate is held in a vertical posture. Fig. 9 The figure shows the structure of the posture changing unit and is a front view showing a state where the substrate is held in a horizontal posture. Fig.10 It is a top view of the posture changing unit.

[0103] The posture changing unit 41 includes a lifting mechanism 61, a driving mechanism 63, a rotating mechanism 65, and an aligning mechanism 67. The lifting mechanism 61 lifts and lowers the inversion chuck 43. The driving mechanism 63 opens and closes the inversion chuck 43. The rotating mechanism 65 rotates the inversion chuck 43.

[0104] The lifting mechanism 61 is arranged outside the immersion tank DB. The lifting mechanism 61 includes, for example, an actuator 61a and a support 61b. The actuator 61a drives the support 61b to rise and fall. The actuator 61a causes the flip chuck 43 to rise and fall together with the support 61b. The lifting mechanism 61 is lifted and lowered by the actuator 61a between the receiving height HP1 of the flip chuck 43, the clamping height HP2, the locking height HP3, and the immersion height HP4. The receiving height HP1 is a height for receiving the substrate W in a vertical posture into the flip chuck 43. The clamping height HP2 is a height for clamping the substrate W in a vertical posture by the flip chuck 43. The locking height HP3 is a height for locking the substrate W in a vertical posture clamped by the flip chuck 43. The immersion height HP4 is a height for immersing the substrate W in a vertical posture locked by the flip chuck 43 in the processing liquid in the immersion tank DB.

[0105] The driving mechanism 63 is arranged across the edge of the immersion tank DB. The driving mechanism 63 includes, for example, an actuator 63a and a connecting member 63b. The actuator 63a is arranged on the upper surface of the support 61b. The driving direction of the actuator 63a is toward the front-back direction X. The actuator 63a drives the connecting member 63b in the front-back direction X. The connecting member 63b is connected to the rotating mechanism 65 described later. The driving mechanism 63 moves the inverting chuck 43 along the front-back direction X according to the rotating mechanism 65. The driving mechanism 63 moves the chuck members 45 of the inverting chuck 43 in directions opposite to each other. The driving mechanism 63 adjusts the intervals between the chuck members 45 in the front-back direction X to a first interval WD1 and a second interval WD2.

[0106] The rotating mechanism 65 is arranged inside the immersion tank DB when viewed from above. The rotating mechanism 65 includes, for example, a cantilever arm 65a and a motor 65b. The cantilever arm 65a extends from the upper surface of the support 61b in the front-to-back direction X, and extends downward in the vertical direction Z along the inner wall of the immersion tank DB. The cantilever arm 65a moves in the front-to-back direction X by the driving mechanism 63. The lower part of the cantilever arm 65a is immersed in the processing liquid stored in the immersion tank DB. The rotating shaft of the motor 65b is connected to the inverting chuck 43. The motor 65b rotates the inverting chuck 43 around the axis AX1. The rotating mechanism 65 can rotate the inverting chuck 43 in either the counterclockwise or clockwise direction around the axis AX1 through the motor 65b.

[0107] The alignment mechanism 67, for example, includes four actuators 67a, four arms 67b, and four alignment rods 67c. The actuator 67a is built into the arm 65a. The rotation axis of the actuator 67a is oriented upward in the vertical direction Z. The arm 67b is arranged in a horizontal plane in the front-to-back direction X and the width direction Y. The base end of the arm 67b is connected to the rotation axis of the actuator 67a. The upper end of the alignment rod 67c is connected to the front end of the arm 67b. The base end of the arm 67b rotates around the axis AX2 through the actuator 67a. Fig.10 As shown, the alignment rods 67 c are arranged on the 25-sheet chucks TFC side and the bridge portion 7 side.

[0108] The alignment rod 67c extends in the vertical direction Z. Fig. 9 As shown, the alignment rod 67c has a length along all sides of the plurality of substrates W held by the flip chuck 43 when the flip chuck 43 is in a state of being long in the vertical direction Z. The alignment rod 67c preferably has a groove 67d formed at a position opposite to the end surface of each substrate W. Each alignment rod 67c is independently operated by each actuator 67a. The alignment rod 67c is driven between the restriction position AP1 and the allowable position AP2. The restriction position AP1 restricts the plurality of substrates W in a horizontal posture from moving within a horizontal plane including the front-rear direction X and the width direction Y. The allowable position AP2 allows the plurality of substrates W in a horizontal posture to move within a horizontal plane including the front-rear direction X and the width direction Y.

[0109] Here, return Figure 1 and Figure 2 .

[0110] <8. Bridge>

[0111] The bridge portion 7 connects the batch processing device 3 and the single-sheet processing device 5. The bridge portion 7 is connected only to the batch processing device 3 and the single-sheet processing device 5. The bridge portion 7 includes a bridge robot BR. The bridge robot BR is configured to be movable only in the width direction Y. The bridge robot BR does not rise or fall in the vertical direction Z. The bridge robot BR includes a manipulator 71. The manipulator 71 is configured to be rotatable in a horizontal plane including the front-rear direction X and the width direction Y. The manipulator 71 is configured to be retractable in the horizontal direction. The bridge robot BR moves the manipulator 71 forward and backward to receive a substrate in a horizontal posture from the posture change block 15. The bridge robot BR delivers the substrate in a horizontal posture to the single-sheet processing device 5.

[0112] <9. Single-sheet processing device>

[0113] The single-sheet processing apparatus 5 includes a carrying-out block 81 , a loading block 83 , and a processing block 85 .

[0114] <10. Move out the block>

[0115] The unloading block 81 includes an unloading section 87. The unloading section 87 is disposed in front X of the sheet-by-sheet processing device 5. The unloading section 87 places the carrier C. The unloading block 81 includes, for example, four unloading sections 87. The four unloading sections 87 are disposed along the width direction Y. The unloading section 87 is also called a load port.

[0116] <11. Loading Block>

[0117] The loading block 83 is provided with a loading robot IR. The loading robot IR is provided with, for example, a multi-joint arm 89 and a robot 91. The loading robot IR does not move in the width direction Y and the front-rear direction X. The loading robot IR bends the multi-joint arm 89 to move the robot 91. The loading robot IR raises and lowers the robot 91 in the vertical direction Z. The loading robot IR can access each crystal box C placed on the four unloading sections 87. The loading robot IR transports a substrate W by means of the robot 91. The loading robot IR transports a substrate W from the processing block 85 to the unloading section 87.

[0118] <12. Processing Block>

[0119] The processing block 85 includes four towers TW1 to TW4 and a central robot CR.

[0120] The tower TW1 is arranged in front of the loading block 83 X. The tower TW1 is arranged adjacent to the loading block 83. The tower TW1 includes processing chambers MPC stacked in the vertical direction Z. The tower TW1 includes, for example, three processing chambers MPC. The processing chambers MPC process substrates W one by one. The processing chambers PMC dry the substrates W, for example.

[0121] The tower TW2 is arranged at the rear X of the tower TW1. The tower TW2 is arranged adjacent to the tower TW1. The tower TW2 has the same structure as the tower TW1. That is, the tower TW2 includes three processing chambers MPC stacked in the vertical direction Z.

[0122] The tower TW3 is arranged on the left side Y of the tower TW2. The tower TW3 is arranged on the left side Y of the tower TW2 via the central robot CR. The tower TW3 also has the same structure as the towers TW1 and TW2. That is, the tower TW3 includes three processing chambers MPC stacked in the vertical direction Z.

[0123] The structure of a part of the tower TW4 is different from that of the towers TW1 to TW4. That is, the tower TW4 has processing chambers MPC at the bottom and the top in the vertical direction Z. The tower TW4 has a delivery portion 93 in the center in the vertical direction Z. The delivery portion 93 carries a substrate W. The delivery portion 93 has lifting pins 93a. The lifting pins 93a are raised and lowered when receiving the substrate W from the bridge robot BR. The delivery portion 93 carries a substrate W from the bridge robot BR. The delivery portion 93 receives the carried substrate W through the central robot CR.

[0124] The central robot CR is configured to be movable in the front-rear direction X. The central robot CR includes a robot 95. The robot 95 is raised and lowered in the vertical direction Z. The robot 95 is configured to be rotatable within a plane including the front-rear direction X and the width direction Y. The robot 95 moves in a manner that allows access to the processing chambers MPC of the towers TW1 to TW4 and the delivery portion 93. That is, the central robot CR can freely move the robot 95 in the vertical direction Z, the front-rear direction X, and the width direction Y. The central robot CR delivers the processed substrate W to the loading robot 83.

[0125] <13. Action Description>

[0126] Reference Figure 1 and Figure 2 , an example of processing by the substrate processing apparatus 1 is described.

[0127] First, the overall processing flow is described.

[0128] <14. Batch Processing>

[0129] A carrier C containing a plurality of unprocessed substrates W is placed in the input section 19. The carrier C is input into the storage block 11 by the transport mechanism 23. The two groups of multiple substrates W are assembled into a batch by the first transport mechanism HTR and the transfer mechanism CTC. The multiple substrates W constituting the batch are transported to the processing block 17 by the second transport mechanism WTR. In the processing block 17, for example, a phosphoric acid-based etching process is performed by the second batch processing unit BPU2. Thereafter, the multiple substrates W constituting the batch are subjected to a pure water cleaning process by the first batch processing unit BPU1. Next, the multiple substrates W constituting the batch are transported to the posture change block 15 by the second transport mechanism WTR. In the posture change block 15, only one of the batches is transported to the posture change tank 33. In the posture change tank 33, only one of the batches transforms the multiple substrates W in a vertical posture into a horizontal posture in the liquid. Thereafter, the multiple substrates W constituting one of the batches are transported one by one to the single-sheet processing device 5 in sequence. Thereafter, another batch in the batch is similarly changed in posture and then conveyed to the single-sheet processing device 5 .

[0130] <15. Single sheet processing>

[0131] A substrate W transformed into a horizontal posture is transported to the single-sheet processing device 5 by the bridge robot BR. Specifically, a substrate W is placed on the delivery portion 93. A substrate W placed on the delivery portion 93 is received by the central robot CR. The central robot CR moves a substrate W, for example, into the processing chamber MPC of the tower TW1. In the processing chamber MPC, for example, the substrate W is subjected to a drying process. Specifically, for example, pure water is supplied while the substrate W is rotated. Thereafter, IPA is supplied to the substrate W, and the pure water in the substrate W is replaced with IPA. Then, the substrate W is rotated at a high speed for drying. In addition, as required, it is preferred to perform a drying process using supercritical fluid carbon dioxide in other processing chambers MPC. The substrate W is finally dried by the drying process using the supercritical fluid. As a result, the substrate W is completely dried, but the collapse of the pattern formed on the substrate W is suppressed.

[0132] One substrate W that has completed the drying process is carried out to the carrying-out unit 87 via the central robot CR and the loader robot IR. The loader robot IR stores one substrate W in a carrier C placed in the carrying-out unit 87. Substrates W constituting the same batch to be processed next are stored in the same carrier C.

[0133] <16. Posture Change Processing>

[0134] The above is a general processing flow of the substrate processing apparatus 1. Next, the details of the posture change will be described. Figures 11 to 28 . Figures 11 to 20 , Figure 22 to Figure 28It is a diagram for explaining the posture changing operation of the substrate. Fig.21 It is a longitudinal sectional view showing the action of turning over the chuck.

[0135] Reference Fig.11 .

[0136] The plurality of substrates W constituting the batch batch that has finished the batch processing are delivered to the lifter LF0 of the standby tank 31 by the second transport mechanism WTR. The lifter LF0 moves the plurality of substrates W constituting the batch batch to the inside of the standby tank 31, that is, the standby position. In this state, the plurality of substrates W constituting the batch batch are on standby, so drying can be prevented. That is, the pattern formed on the substrate W after the batch processing can be prevented from collapsing. In addition, the alignment rod 67c is located at the permissible position.

[0137] Reference Fig.12 .

[0138] The 25 chucks TFC are located at the first delivery position P1. The 25 chucks TFC release the robot 35. That is, the robot 35 of the 25 chucks TFC is at the passing position PT (refer to Figure 3 ). The lifter LF0 is raised to the handover position above the liquid level of the standby tank BB0. At this time, the robot 35 of the 25 chucks TFC is in the passing position PT, so that the plurality of substrates W can pass between the 25 chucks TFC and rise. In addition, the posture change unit 41 in the posture change tank 33 is used to raise the flip chuck 43 to the receiving height HP1.

[0139] Reference Fig.13 .

[0140] The robot arm 35 of the 25-piece chuck TFC is closed. That is, the robot arm 35 of the 25-piece chuck TFC is in the holding position PC (refer to Figure 3 ). In this state, the lifter LF0 descends to the standby position. Thus, among the multiple substrates W in the batch placed on the lifter LF0, only the multiple odd-numbered substrates W constituting one batch are placed on the 25-piece chucks TFC. Among the multiple substrates W in the batch placed on the lifter LF0, the multiple even-numbered substrates W constituting another batch are descended together with the lifter LF0 to the inside of the standby slot BB0. Thus, the robot 35 of the 25-piece chucks TFC is in the second handover position PT2, and can stand by in a state of preventing drying until the even-numbered substrates W move to the posture change slot 33. Therefore, pattern collapse caused by drying of the multiple substrates W constituting another batch can also be prevented.

[0141] Reference Fig.14 .

[0142] The 25-sheet chuck TFC causes the robot 35 to move to the right direction Y to the third transfer position P3. At this time, the reverse chuck 43 is located at the receiving height HP1, so that no interference with the substrate W occurs.

[0143] Reference Fig.15 .

[0144] The flip chuck 43 is set to the first interval WD1 (refer to Figure 4 ). In this state, the flip chuck 43 is lowered toward the plurality of substrates W placed on the 25-sheet chuck TFC. Specifically, the flip chuck 43 is lowered to the clamping height HP2. The state of the flip chuck 43 and the substrate W at this time becomes Figure 4 and Figure 6 That is, the edge of the substrate W is only located near the first groove SL1 of the reverse chuck 43 and does not contact the reverse chuck 43. In other words, the plurality of substrates W are accommodated in the reverse chuck 43 in a non-contact state.

[0145] Reference Fig.16 .

[0146] The inverting chuck 43 is set to the second width WD2 (refer to Figure 5 ). Thus, the substrate W received in the flip chuck 43 is clamped in a non-contact manner. Figure 7 As shown, the end face of the substrate W is clamped by the second groove SL2 of the flip chuck 43. In other words, the end face of the substrate W is supported by the top 49 of the second groove SL21. And the flip chuck 43 is raised to the locking height HP3. As a result, the lower edge of the end face of the substrate W clamped by the flip chuck 43, which is lower than the side, abuts against the second groove SL2 and is locked. In addition, although the illustration is omitted, in the state where the flip chuck 43 is temporarily raised to the receiving height HP1, the 25 chucks TFC are moved to the second delivery position P2. As a result, the 25 chucks TFC can be ready to receive a plurality of substrates W constituting another batch placed on the lifter LF0.

[0147] Reference Fig.17 .

[0148] The reversing chuck 43 is lowered to the immersion height HP4. Thus, the plurality of substrates W clamped by the reversing chuck 43 are immersed in the processing liquid in the immersion tank DB. The plurality of substrates W are completely immersed in the processing liquid in the immersion tank DB. In the posture changing block 15, the plurality of substrates W constituting one batch are in a state of being exposed from the liquid during the short time from rising from the standby tank BB0 to being immersed in the immersion tank DB.

[0149] Reference Fig.18 and Fig.19 .

[0150] The flip chuck 43 is rotated 90°. Specifically, in this example, it is rotated 90° clockwise. The direction of rotation can be determined according to the direction in which the processing surface (surface) of the substrate W is located. In other words, the direction of rotation can be determined in such a way that the processing surface of the substrate W faces upward. Thus, the plurality of substrates W are transformed into a horizontal posture.

[0151] Reference Fig. 20 .

[0152] The alignment rod 67c is moved to the restricted position by the alignment mechanism 67. Fig. 20 As shown in the partially enlarged view shown by the double-dashed arrow in FIG. 1 , the outer edges of the plurality of substrates W are restricted in position by the alignment rods 67 c. Specifically, the movement in the horizontal plane including the front-rear direction X and the width direction Y is restricted.

[0153] Reference Fig.21 .

[0154] The flip chuck 43 is expanded to the first width WD1. As a result, the position of the end face of the substrate W moves from the second groove SL2 to the first groove SL1. Therefore, the interval US between the upper surface of the processing surface (surface) of the substrate W and the upper surface of the groove portion 47 becomes wider. At this time, the lower surface of the substrate W moves while sliding from the inner side inclined surface 51 of the second groove SL2 to the near front side inclined surface 55 of the first groove SL1. The inclination of the near front side inclined surface 55 of the first groove SL1 is gentler than the inner side inclined surface 51 of the second groove SL2. Therefore, the impact applied to the lower surface of the substrate W can be reduced. Therefore, the generation of particles when the flip chuck 43 is set to the first width WD1 can be suppressed. In addition, due to friction, the substrate W is stretched in the moving direction of the flip chuck 43. At this time, since the alignment rod 67c is located in the limiting position, the horizontal position deviation of the substrate W can be prevented. Therefore, the handling error of the bridge robot BR described later can be prevented, and the substrate W can be reliably transferred.

[0155] Furthermore, the alignment rod 67c has a groove 67d formed at a position corresponding to the end surface of the substrate W. Therefore, it is possible to suppress the generation of particles due to friction between the end surface of the substrate W and the alignment rod 67c when the substrate W moves downward.

[0156] Reference Fig. 22 .

[0157] The reversing chuck 43 is raised. Specifically, the reversing chuck 43 is raised so that only the substrate W clamped by the uppermost groove portion 47 of the reversing chuck 43 is exposed from the liquid in the immersion tank DB. The height of the reversing chuck 43 is such that the robot hand 71 of the bridge robot BR can enter a position slightly below the lower surface of the substrate W exposed from the liquid.

[0158] Reference Fig.23 .

[0159] The hand 71 of the bridge robot BR is moved into the posture changing unit 41. The hand 71 moves into a position slightly below the lower surface of the substrate W.

[0160] Reference Fig.24 .

[0161] The invert chuck 43 is moved downward. The moving distance is smaller than the sum of the interval US and the interval between the robot 71 that has entered and the lower surface of the substrate W. The substrate W is transferred to the robot 71 by the movement of the invert chuck 43 .

[0162] Reference Fig.25 .

[0163] Before the bridge robot BR moves the hand 71 to the right direction Y, the alignment rod 67c located in the right direction Y is moved to the permissive position AP2.

[0164] Reference Fig.26 .

[0165] The bridge robot BR moves the robot hand 71 to the right direction Y, and pulls out the uppermost substrate W from the reverse chuck 43. Since the alignment bar 67c located in the right direction Y is moved to the permissive position AP2, the substrate W can be smoothly transferred.

[0166] Reference Fig. 27 .

[0167] After the uppermost substrate W is removed from the reversing chuck 43, the two alignment bars 67c on the right side Y are moved to the limiting position. This prevents the horizontal position of the substrate W from being moved due to disturbances such as vibration of the device, thereby preventing the next transfer from being adversely affected.

[0168] Reference Fig.28 .

[0169] The bridge robot BR rotates the robot hand 71 to position the substrate W in the right direction Y. Specifically, the robot hand 71 rotates to move the substrate W to the delivery portion 93 . Then, one substrate W is delivered to the delivery portion 93 .

[0170] By the operation of the above-described posture changing block 15 , one substrate W is conveyed from the batch processing apparatus 3 to the single-sheet processing apparatus 5 in a horizontal posture.

[0171] In addition, the corresponding relationship between the present invention and the above-mentioned embodiments is as follows.

[0172] The batch processing device 3 corresponds to the "batch processing unit" in the present invention. The single-sheet processing device 5 corresponds to the "single-sheet processing unit" in the present invention. The 25-sheet chuck TFC corresponds to the "first conveying unit" in the present invention. The bridge robot BR corresponds to the "second conveying unit" in the present invention.

[0173] According to the present embodiment, after the plurality of substrates W processed by the batch processing device 3 are transported to the posture change unit 41 by the 25-piece chuck TFC, they are changed from a vertical posture to a horizontal posture by the posture change unit 41. The plurality of substrates W changed to a horizontal posture are handed over one by one by the bridge robot BR, and then processed by the single-sheet processing device 5. When the posture change unit 41 performs posture change of the plurality of substrates W, the plurality of substrates are held in a state where the intervals above the upper surfaces of the plurality of substrates W are narrow. Therefore, the plurality of substrates W can be held stably and the posture can be changed stably. When the plurality of substrates W are handed over in a horizontal posture, the posture change unit 41 holds the plurality of substrates W in a state where the intervals US above the processing surfaces of the plurality of substrates W are wide. Therefore, the bridge robot BR can easily hand over each of the plurality of substrates W.

[0174] In addition, when the flip chuck 43 receives multiple substrates W from the 25-sheet chuck TFC, the driving mechanism 61 makes it the first interval WD1 and the multiple substrates are respectively accommodated in the first groove SL1. When the multiple substrates W are rotated to a horizontal posture by the rotating mechanism 65, the driving mechanism 63 makes it the second interval WD2 and the multiple substrates W are respectively clamped by the second groove SL2. Therefore, when the posture is changed, the movement of the substrate W in the thickness direction is restricted. As a result, the multiple substrates W can be stably held and the posture can be stably changed. When the bridge robot BR receives multiple substrates W from the flip chuck 43, the driving mechanism 63 makes it the first interval WD1 and the first groove SL1 abuts against the lower surface of the multiple substrates W. Therefore, when the substrate W is handed over, the substrate W is allowed to move in the thickness direction. As a result, the bridge robot BR can pull up the multiple substrates W separately and hand them over easily. The posture changing section 41 can clamp or loosely hold the substrate W simply by moving the inversion chuck 43 in the horizontal direction using the driving mechanism 63 .

[0175] The present invention is not limited to the above-described embodiment, and can be implemented in the following modified forms.

[0176] (1) In the above-mentioned embodiment, the flip chuck 43 has the first groove SL1 and the second groove SL2 on the front side and the back side in the radial direction of the substrate W. However, the present invention is not limited to such a structure. Fig.29 and Fig.30 The flip chuck 43A is shown.

[0177] Fig.29This figure shows a modified example of the inversion chuck, and shows a state during transfer. Fig.30 This figure shows a modified example of the inversion chuck, and is a diagram showing a state when the posture is changed.

[0178] The reversing chuck 43A includes a pair of chuck members 45A. The chuck member 45A includes, for example, a first slot piece 97 and two second slot pieces 99. The first slot piece 97 includes a first slot SL1. The second slot piece 99 includes a second slot SL2. The second slot pieces 99 are respectively arranged in the vertical direction Z of the first slot piece 97. The second slot piece 99 is provided on the chuck member 45A in a manner that it can move forward and backward in the center direction of the substrate W along the front-back direction X.

[0179] When receiving the substrate W, the inverting chuck 43A configured in this way moves the second groove piece 99 away from the substrate W ( Fig.29 When the posture of the substrate W is changed, the second groove piece 99 is moved toward the center side of the substrate W ( Fig.30 ). Such a flip chuck 43A may also be used. According to this structure, compared with the flip chuck 43 described above, which has two levels of inclination on the inner side, the first slot piece 97 and the second slot piece 99 have only one level of inclination slots SL1 and SL2. Therefore, there is an advantage that the chuck member 45A can be easily processed. In addition, when processing substrates W of different thickness specifications, only the second slot piece 99 needs to be replaced, and the specifications of the substrate W can be flexibly handled.

[0180] (2) In the above-mentioned embodiment, the inversion chucks 43 and 43A have inclined surfaces on both surfaces of the substrate W. However, when the batch is aligned with the front and back surfaces (also called back to face), only the inclined surface in the direction corresponding to the lower surface of the substrate W is sufficient.

[0181] (3) In the above-mentioned embodiment, the posture changing unit 41 changes the posture while immersing the plurality of substrates W in the immersion tank DB. However, the present invention is not limited to such a mode. That is, the posture changing unit 41 may also change the posture in a gas. Examples of the gas in this case include air and inert gas.

[0182] (4) In the above-mentioned embodiment, the alignment rod 67c has the groove 67d, but the present invention does not necessarily need to have this structure. In addition, the posture changing unit 41 does not necessarily need to have the alignment rod 67c.

[0183] (5) In the above-mentioned embodiment, after the manipulator 71 of the bridge robot BR enters the flip chuck 43, the alignment rod 67c on the receiving side is moved to the permissible position. However, the present invention is not limited to the timing of moving the alignment rod 67c to the permissible position. That is, the alignment rod 67c may be moved to the permissible position when the manipulator 71 enters the flip chuck 43. Thus, even if the position accuracy in the front-to-back direction X when the manipulator 71 enters the flip chuck 43 is slightly reduced, interference between the manipulator 71 and the alignment rod 67c can be prevented. As a result, the control load can be suppressed.

[0184] (6) In the above-mentioned embodiment, when receiving a plurality of substrates W on the reversing chuck 43, the reversing chuck 43 is lowered from the receiving height HP1 to the clamping height HP2. However, the present invention is not limited to such a clamping method. For example, a plurality of substrates W may be received in a state where the chuck members 45 of the reversing chuck 43 are extended to each other, and then the plurality of substrates W may be clamped by narrowing the intervals between the chuck members 45.

[0185] (7) In the above-mentioned embodiment, when the bridge robot BR receives the substrate W, the reversing chuck 43 is lowered. However, the present invention is not limited to such a method. That is, the reversing chuck 43 may not be lowered, but the manipulator 71 of the bridge robot BR may be raised to receive the substrate W. In this way, the control of the posture changing unit 41 can be simplified.

[0186] (8) In the above-mentioned embodiment, the structure in which the batch processing apparatus 3 and the single-sheet processing apparatus 5 are connected to each other via the bridge portion 7 is described as an example. However, the present invention can be applied even to a single substrate processing apparatus 1 including the batch processing apparatus 3 and the single-sheet processing apparatus 5 in the same housing.

Claims

1. A substrate processing device for processing a substrate, characterized in that: The substrate processing device comprises the following elements: A batch processing section that processes a plurality of substrates at a time in a vertical position; A single-sheet processing section processes a single substrate in a horizontal position; A posture changing section that changes the plurality of substrates that have been processed in the batch processing section from a vertical posture to a horizontal posture; a first transport unit that transports the plurality of substrates processed in the batch processing unit to the posture changing unit; as well as a second conveying unit that conveys the plurality of substrates in the horizontal posture at the posture changing unit to the single-sheet processing unit, The posture changing unit holds the multiple substrates in a state where the intervals above the upper surfaces of the multiple substrates are narrow when changing the postures of the multiple substrates, and holds the multiple substrates in a state where the intervals above the upper surfaces of the multiple substrates are wide when handing over the multiple substrates after making the multiple substrates into a horizontal posture.

2. The substrate processing device according to claim 1, characterized in that: The posture changing unit comprises: flip chucks, which are arranged opposite to each other in the radial direction of the plurality of substrates and clamp the peripheral edges of the plurality of substrates; a driving mechanism that moves the flip chuck in a horizontal direction between at least two locations, namely, a first interval and a second interval, wherein the first interval is an interval for transferring the plurality of substrates between the first conveying portion and the second conveying portion, and the second interval is narrower than the first interval and is an interval for clamping the plurality of substrates; and a rotating mechanism that rotates the flip chuck in the surface direction of the plurality of substrates, The flip chuck has: A first groove allowing the plurality of substrates to move in a thickness direction; and The second groove is formed at a position outside the plurality of substrates than the first groove, restricts movement of the plurality of substrates in the thickness direction, and clamps the plurality of substrates in the radial direction. When the inverting chuck receives the plurality of substrates from the first transporting portion, the driving mechanism causes the inverting chuck to be at the first interval so that the plurality of substrates are respectively accommodated in the first grooves. When the plurality of substrates are rotated to a horizontal posture by the rotating mechanism, the reversing chuck is moved to the second interval by the driving mechanism so as to clamp the plurality of substrates respectively by the second groove. When the second transport unit receives the plurality of substrates from the reverse chuck, the drive mechanism causes the reverse chuck to be at the first interval so that the first groove contacts and supports the lower surface of the plurality of substrates.

3. The substrate processing device according to claim 2, characterized in that: The second tank comprises: The top portion where the end surfaces of the plurality of substrates are located; and A back inclined surface extending from the top toward the center of the plurality of substrates. The first groove has an opening at the center side of the plurality of substrates, and has a front side inclined surface that expands from the back side inclined surface toward the front end of the opening.

4. The substrate processing device according to claim 3, characterized in that: The back side inclined surface and the front side inclined surface have inclined surfaces at positions facing the front and back surfaces of the plurality of substrates.

5. The substrate processing device according to claim 3, characterized in that: The inclination of the near-front inclined surface is gentler than the inclination of the rear-side inclined surface.

6. The substrate processing device according to claim 2, characterized in that: The posture changing unit further includes an alignment rod, which is movable between a restriction position for restricting the horizontal movement of the plurality of substrates and an allowable position for allowing the plurality of substrates to move in the horizontal direction when the plurality of substrates are in a horizontal posture by the flip chuck. The alignment rod is moved to the restricted position before the flip chuck is extended from the second interval to the first interval.

7. The substrate processing device according to claim 6, characterized in that: The alignment bar is provided on a receiving side of the second conveying portion on which the plurality of substrates are received and on an opposite side of the receiving side across the plurality of substrates in a plan view.

8. The substrate processing device according to claim 7, characterized in that: After the second interval is expanded toward the first interval, when the second transport unit receives the plurality of substrates from the reverse chuck, the second transport unit moves the alignment rod on the receiving side of the alignment rods to the allowing position.

9. The substrate processing device according to claim 6, characterized in that: The alignment bar is formed with a plurality of grooves corresponding to positions of end surfaces of the plurality of substrates.

10. The substrate processing apparatus according to claim 2, wherein: The substrate processing device further comprises a lifting mechanism for lifting and lowering the flip chuck. When the second transport unit receives the plurality of substrates from the reverse chuck, the reverse chuck is lowered by the lifting mechanism.

11. The substrate processing apparatus according to claim 10, wherein: When the first transport unit delivers the plurality of substrates to the reversal chuck, the lifting mechanism lowers the reversal chuck forming the first interval from a receiving height near the upper edge of the plurality of substrates transported by the first transport unit to a clamping height near the side edge of the plurality of substrates.

Images