Connector structure and preparation method

Abstract

The present application provides a connector structure and preparation method, which relates to the field of circuit connection technology. The structure includes: a circuit board and at least one cable; the circuit board includes a laminate assembly and a pad assembly, the laminate assembly includes at least two functional layers and at least one prepreg, the prepreg is arranged between the two functional layers, the pad assembly is arranged on the functional layer and is electrically connected to the routing structure of the functional layer; the cable has a crimping portion, the crimping portion is arranged on the pad assembly, both are sandwiched between the functional layer and the prepreg, and the functional layer opposite to the crimping portion has an avoidance portion, and the avoidance portion is arranged corresponding to the crimping portion. Since the surface welding cable is prone to structural unevenness, resulting in inconsistent impedance at the welding point, the crimping portion and the pad assembly are arranged between the functional layer and the prepreg to avoid direct welding of the cable to the surface; pressing the prepreg to make the crimping portion and the pad assembly uniformly crimped, make the impedance consistent, and improve the quality and stability of the signal.

Description

Technical Field

[0001] The present application relates to the field of circuit connection technology, and in particular to a connector structure and a preparation method thereof. Background Art

[0002] Within servers, high-speed cables connect various components, such as processors, storage devices, network interfaces, and expansion cards. Data cables within these cables enable rapid data transmission and communication. The primary component of a high-speed cable is the data cable, which transmits data signals. Both ends of a high-speed cable are typically equipped with connectors, which can be plug-in cards, which are circuit boards containing circuitry, to connect the various components within the server.

[0003] Conventional technology often uses surface soldering to secure the cable to the card. This involves applying solder to the card's surface and applying heat to the interface between the card and cable, causing the solder to melt and secure the connection. To further strengthen the connection, glue is applied. After soldering, a special glue is applied to the connection.

[0004] However, the surface soldering impedance is large, and the solder and adhesive are easily unevenly distributed, causing uneven impedance of the cable and affecting the quality and stability of the signal. Summary of the Invention

[0005] The present application provides a connector structure and preparation method to solve the technical problem that the surface welding cable has a large impedance and the solder and glue are easily unevenly distributed, resulting in uneven impedance of the cable and affecting the quality and stability of the signal.

[0006] In a first aspect, the present application provides a connector structure comprising: a circuit board and at least one cable; the circuit board comprises a laminate assembly and a pad assembly, the laminate assembly comprises at least two functional layers and at least one prepreg, the prepreg is arranged between the two functional layers, the pad assembly is arranged on the functional layer and electrically connected to the routing structure of the functional layer; the end of the cable has a crimping portion, the crimping portion and the pad assembly are both sandwiched between the functional layer and the prepreg, the crimping portion is arranged on the pad assembly, and an avoidance portion is provided on the functional layer opposite to the crimping portion, and the avoidance portion is arranged corresponding to the crimping portion.

[0007] In some possible implementations, in the connector structure provided by the embodiments of the present application, the two functional layers include a core board group and at least one copper layer; or the two functional layers include two core board groups.

[0008] In some possible implementations, in the connector structure provided by the embodiments of the present application, the core plate group includes at least two core plates, and a prepreg is provided between the two core plates.

[0009] In some possible implementations, the connector structure provided by the embodiments of the present application, the crimping portion includes at least two first electrical connection portions and at least two second electrical connection portions, the first electrical connection portion is electrically connected to the signal line of the cable, and the second electrical connection portion is electrically connected to the ground line of the cable; the pad assembly includes at least two signal pads and at least two ground pads, each ground pad is relatively arranged on both sides of at least two signal pads, the first electrical connection portion is correspondingly connected to the signal pad, the second electrical connection portion is correspondingly connected to the ground pad, and the signal pad corresponds to the avoidance portion.

[0010] In some possible implementations, the connector structure provided in the embodiment of the present application, the signal pad includes a welding portion and a buffer portion, the first electrical connection portion is correspondingly arranged on the welding portion, one end of the buffer portion is connected to the welding portion, and the other end is connected to the routing structure.

[0011] In some possible implementations, the connector structure provided in the embodiment of the present application has a buffer portion having a length of 28 mil-32 mil, a welding portion having a width of 11 mil-13 mil, a welding portion having a length of 52 mil-56 mil, and a first electrical connection portion having a width of 5 mil-7 mil.

[0012] In some possible implementations, in the connector structure provided in the embodiments of the present application, the width of the buffer portion toward the crimping portion is greater than the width of the buffer portion toward the routing structure.

[0013] In some possible implementations, in the connector structure provided by the embodiments of the present application, the width of the welding portion is greater than or equal to the width of the first electrical connection portion, and the length of the welding portion is greater than or equal to the length of the first electrical connection portion.

[0014] In some possible implementations, in the connector structure provided by the embodiments of the present application, a tin layer is provided between the crimping portion and the pad assembly.

[0015] In the second aspect, an embodiment of the present application also provides a method for preparing a connector structure, which is used to prepare the connector structure in any of the above embodiments, the method comprising: placing a functional layer on a pressing device, arranging a welding assembly on the functional layer, and placing a crimping portion on the welding assembly; placing a semi-cured sheet on the functional layer to cover the welding assembly and the crimping portion, and placing another functional layer having an avoidance portion on the semi-cured sheet, the avoidance portion being opposite to the crimping portion; the pressing device performs pressing to connect the functional layer, the crimping portion and the welding assembly through the semi-cured sheet.

[0016] The connector structure and preparation method provided by the present application include a circuit board and at least one cable; the circuit board includes a laminate assembly and a pad assembly, the laminate assembly includes at least two functional layers and at least one prepreg, the prepreg is arranged between the two functional layers, the pad assembly is arranged on the functional layer and is electrically connected to the routing structure of the functional layer; the end of the cable has a crimping portion, the crimping portion and the pad assembly are both sandwiched between the functional layer and the prepreg, the crimping portion is arranged on the pad assembly, and the functional layer opposite to the crimping portion has an avoidance portion, and the avoidance portion is arranged corresponding to the crimping portion. The pad assembly provides a connection basis for the crimping portion, the crimping portion and the pad assembly are both sandwiched between the functional layer and the prepreg, forming a laminate structure of functional layers, pad assemblies, crimping portions, prepregs and functional layers arranged in sequence, and the crimping portion is arranged in the inner layer of the laminate structure to avoid direct welding on the surface of the circuit board. Since the surface welding cable is prone to structural unevenness, it will cause inconsistent impedance at the welding point. Through pressing, the prepreg makes the crimping portion and the pad assembly uniformly crimped, thereby making the impedance consistent, thereby improving the quality and stability of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0018] Figure 1 A schematic diagram of a simulation structure of a connector structure provided in an embodiment of the present application;

[0019] Figure 2 It is a schematic diagram of the simulation structure of the existing connector structure;

[0020] Figure 3 A schematic structural diagram of a pad assembly and a crimping portion in a connector structure provided in an embodiment of the present application;

[0021] Figure 4 for Figure 3 A structural diagram of the middle pad assembly and the crimping portion from another perspective;

[0022] Figure 5 A schematic structural diagram of the avoidance portion in the connector structure provided in an embodiment of the present application;

[0023] Figure 6 for Figure 3 Schematic diagram of the structure of the middle buffer part;

[0024] Figure 7 Schematic diagram of the structure of a multi-layer circuit board;

[0025] Figure 8 This is a flow chart of a method for connecting a high-speed cable and a circuit board provided in an embodiment of the present application.

[0026] Description of reference numerals:

[0027] 100-cable;

[0028] 110-crimping portion; 111-first electrical connection portion; 112-second electrical connection portion;

[0029] 120-Signal line;

[0030] 130-ground wire;

[0031] 140-protective layer;

[0032] 200-Laminated components;

[0033] 210-core board assembly; 211-wiring structure;

[0034] 220-copper layer; 221-avoidance portion;

[0035] 230-prepreg;

[0036] 300-pad assembly;

[0037] 310- signal pad; 311- welding portion; 312- buffer portion;

[0038] 320-Ground pad.

[0039] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0040] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0041] Generally speaking, terms should be understood, at least in part, based on the context in which they are used. For example, as used herein, the term "one or more" can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense, depending at least in part on the context. Similarly, terms such as "a," "an," or "the" can also be understood to convey either singular or plural usage, depending at least in part on the context.

[0042] Within servers, high-speed cables connect various components, such as processors, storage devices, network interfaces, and expansion cards. Data cables within these cables enable rapid data transmission and communication. The primary component of a high-speed cable is the data cable, which transmits data signals. Both ends of a high-speed cable are typically equipped with connectors, which can be plug-in cards, which are circuit boards containing circuitry, to connect the various components within the server.

[0043] In the prior art, when connecting cables and plug-in cards, surface soldering technology is often used. That is, solder is applied to the surface of the plug-in card, and heat is applied to the interface between the plug-in card and the cable to melt the solder at high temperature, thus fixing the connection between the cable and the card. In order to further strengthen the connection, glue fixation is performed. That is, after the soldering is completed, a layer of special glue is applied to the connection, such as Figure 2 However, soldering on the surface makes the cable impedance larger, and the solder and glue are easily unevenly distributed, resulting in uneven cable impedance, affecting the quality and stability of the signal.

[0044] For example, the coating thickness of adhesive can vary due to application techniques or uneven material distribution, which can lead to inconsistent cable impedance. Similarly, the solder paste used during soldering can also be inconsistent, affecting the impedance consistency of the cable. Impedance consistency is critical to the electrical performance of the cable. Inconsistent impedance can cause reflections, attenuation, or distortion during signal transmission, affecting signal quality and stability. Especially in high-frequency or high-speed data transmission applications, impedance inconsistency can significantly degrade system performance.

[0045] In view of this, an embodiment of the present application provides a connector structure and a preparation method, including: a circuit board and at least one cable; the circuit board includes a laminate assembly and a pad assembly, the laminate assembly includes at least two functional layers and at least one semi-cured sheet, the semi-cured sheet is arranged between the two functional layers, and the pad assembly is arranged on the functional layer and electrically connected to the routing structure of the functional layer; the end of the cable has a crimping portion, the crimping portion and the pad assembly are both sandwiched between the functional layer and the semi-cured sheet, the crimping portion is arranged on the pad assembly, and an avoidance portion is provided on the functional layer opposite to the crimping portion, and the avoidance portion is arranged corresponding to the crimping portion. The pad assembly provides a connection basis for the crimping part, and the crimping part and the pad assembly are both sandwiched between the functional layer and the prepreg to form a stacked structure of the functional layer, pad assembly, crimping part, prepreg and functional layer arranged in sequence. The crimping part is arranged in the inner layer of the stacked structure to avoid direct welding on the surface of the circuit board. Since the surface welding cable is prone to structural unevenness, it will cause inconsistent impedance at the welding point. Through pressing, the prepreg makes the crimping part and the pad assembly evenly crimped, so that the impedance is consistent, thereby improving the quality and stability of signal transmission.

[0046] The following specific embodiments are used to describe in detail the technical solution of the present application and how the technical solution of the present application solves the above technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 The connector structure and preparation method of the present application are described with reference to specific embodiments.

[0047] In the first aspect, the present application provides a connector structure, comprising: a circuit board and at least one cable 100; the circuit board comprises a laminate assembly 200 and a pad assembly 300, the laminate assembly 200 comprises at least two functional layers and at least one semi-cured sheet 230, the semi-cured sheet 230 is arranged between the two functional layers, the pad assembly 300 is arranged on the functional layer and is electrically connected to the routing structure 211 of the functional layer; the end of the cable 100 has a crimping portion 110, the crimping portion 110 and the pad assembly 300 are both sandwiched between the functional layer and the semi-cured sheet 230, the crimping portion 110 is arranged on the pad assembly 300, and an avoidance portion 221 is provided on the functional layer opposite to the crimping portion 110, and the avoidance portion 221 is arranged corresponding to the crimping portion 110.

[0048] Specifically, the stack assembly 200 includes two functional layers and a prepreg 230, which is arranged between the two functional layers to connect the two functional layers. It is understandable that the prepreg 230 is used to achieve interlayer bonding. A pad assembly 300 is provided on one of the functional layers. For example, one end of the pad assembly 300 is flush with the edge of the functional layer. The pad assembly 300 is used to connect the crimping portion 110 at the end of the high-speed cable 100. The crimping portion 110 and the pad assembly 300 are both sandwiched between the functional layer and the prepreg 230. The prepreg 230 fixes the crimping portion 110 and the pad assembly 300 on the functional layer. Another functional layer covers the functional layer, forming a sandwich structure of the functional layer, the pad assembly 300, the crimping portion 110, the prepreg 230 and the functional layer, so that the crimping portion 110 is located between the sandwich layers.

[0049] For example, the functional layer provided with the crimping portion 110 and the pad assembly 300 is a core board, and the other functional layer opposite to the core board can be a core board or a copper layer 220. Alternatively, the functional layer provided with the crimping portion 110 and the pad assembly 300 is a core board group 210, and the other functional layer opposite to the core board group 210 can be a core board, a copper layer 220, or a core board group 210.

[0050] In some embodiments, the connector structure can be formed into a multi-layer structure according to actual conditions. For example, prepreg 230 is laid on the side of the two functional layers facing away from the crimping portion 110, and copper layer 220 or core board 210 is laid on the side of prepreg 230 facing away from the crimping portion 110. Then, a pressing device is used for pressing, and the above steps are repeated until the multi-layer structure of the connector structure is achieved.

[0051] To facilitate impedance control, a relief portion 221 can be provided on the functional layer opposite the crimping portion 110. This relief portion 221 corresponds to the crimping portion 110. By varying the area of ​​the relief portion 221, the impedance can be adjusted. For example, the area of ​​the relief portion 221 can be adjusted using simulation software to achieve a target impedance value. The area of ​​the relief portion 221 corresponding to the target impedance value is the fabricated area of ​​the relief portion 221. For example, the relief portion 221 is rectangular, with a length of 68 mils and a width of 50 mils.

[0052] It should be noted that when the cable 100 is welded on the surface of the connector structure, the impedance fluctuation is large, while when the cable is crimped on the inner layer of the connector structure, the impedance fluctuation is small.

[0053] The connector structure in the embodiment of the present application provides a connection basis for the crimping part 110 through the pad assembly 300. The crimping part 110 and the pad assembly 300 are both sandwiched between the functional layer and the semi-cured sheet 230 to form a sandwich structure of the functional layer, the pad assembly 300, the crimping part 110, the semi-cured sheet 230 and the functional layer arranged in sequence. The crimping part 110 is arranged in the inner layer of the sandwich structure to reduce impedance mismatch and avoid direct welding on the surface layer of the sandwich structure. Through pressing, the semi-cured sheet 230 makes the crimping part 110 and the pad assembly 300 uniformly crimped, the crimping part 110 and the pad assembly 300 are evenly stressed, and the material covering their surfaces is uniform, so that the impedance is consistent, the connection is reliable, and the quality and stability of signal transmission are improved.

[0054] In some possible implementations, in the connector structure provided by the embodiments of the present application, the two functional layers include a core board group 210 and at least one copper layer 220 ; or the two functional layers include two core board groups 210 .

[0055] Specifically, the two functional layers include at least one core board group 210 and at least one copper layer 220, that is, a prepreg 230 is provided between the core board group 210 and the copper layer 220. For example, the core board group 210, the pad assembly 300, the crimping portion 110, the prepreg 230, and the copper layer 220 are sequentially provided from bottom to top. The core board group 210 includes at least one core board.

[0056] In some embodiments, the two functional layers include at least two core board groups 210, that is, a semi-cured sheet 230 is arranged between the core board groups 210 and the core board groups 210. For example, the core board group 210, the pad assembly 300, the crimping portion 110, the semi-cured sheet 230 and the core board group 210 are arranged in sequence from bottom to top.

[0057] It should be noted that the two functional layers can be arranged in different ways, which makes it easy to design a reasonable stacking arrangement according to actual usage requirements, thereby optimizing the signal transmission path, reducing signal interference and reflection, and thus improving signal integrity.

[0058] In some possible implementations, in the connector structure provided by the embodiments of the present application, the core plate group 210 includes at least two core plates, and a prepreg 230 is provided between the two core plates.

[0059] Specifically, the two functional layers include at least two core plate groups 210 , with a prepreg 230 disposed between the two core plate groups 210 . The core plate group 210 includes at least two core plates, with a prepreg disposed between the two core plates.

[0060] For example, the laminate assembly 200 includes two functional layers, one functional layer including at least one core plate group 210 and at least one copper layer 220, wherein the core plate group 210 includes one core plate. The other functional layer includes two core plate groups 210, wherein the core plate group 210 includes at least two core plates. That is, the laminate assembly 200 includes three core plates, and the crimping portion 110 is located between the two core plates, for example, the third core plate, the prepreg 230, the second core plate, the pad assembly 300, the crimping portion 110, the prepreg 230, and the first core plate are arranged in sequence from bottom to top. Alternatively, the third core plate, the pad assembly 300, the crimping portion 110, the prepreg 230, the second core plate, the prepreg 230, and the first core plate are arranged in sequence from bottom to top.

[0061] Of course, the side of the third core plate and the first core plate facing away from the crimping portion 110 can also be covered with a copper layer 220. For example, the prepreg 230, the third core plate, the prepreg 230, the second core plate, the pad assembly 300, the crimping portion 110, the prepreg 230, the first core plate, the prepreg 230 and the copper layer 220 are arranged in sequence from bottom to top. It should be noted that the upper and lower surfaces of the core plates form a signal reference surface, which is used to lay the wiring structure 211. The first signal layer is the copper layer 220, the second ground layer is the upper surface of the first core plate, and the third ground layer is the lower surface of the first core plate. It should be noted that adding the prepreg 230 between the core plates to bond the core plates to each other can also promote the effective conduction of heat, reduce local overheating, and thus improve the reliability of the circuit.

[0062] In some possible implementations, in the connector structure provided by the embodiments of the present application, the crimping portion 110 includes at least two first electrical connection portions 111 and at least two second electrical connection portions 112, the first electrical connection portion 111 is electrically connected to the signal line 120 of the cable 100, and the second electrical connection portion 112 is electrically connected to the ground line 130 of the cable 100; the pad assembly 300 includes at least two signal pads 310 and at least two ground pads 320, each ground pad 320 is relatively arranged on both sides of at least two signal pads 310, the first electrical connection portion 111 is correspondingly connected to the signal pad 310, the second electrical connection portion 112 is correspondingly connected to the ground pad 320, and the signal pad 310 corresponds to the avoidance portion 221.

[0063] Specifically, the cable 100 includes a signal line 120, a ground line 130 and a protective layer 140 that wraps the signal line 120 and the ground line 130. The first electrical connection part 111 is electrically connected to the signal line 120 of the cable 100, and the second electrical connection part 112 is electrically connected to the ground line 130 of the cable 100.

[0064] For example, the first electrical connection portion 111 may be the end of the signal line 120, and the second electrical connection portion 112 may be the end of the ground line 130. It should be noted that the first electrical connection portion 111 and the second electrical connection portion 112 may be copper bars, or may be composed of multiple copper wires, and this application is not limited thereto. It is understood that the structure of the signal pad 310 may be consistent with or inconsistent with the structure of the ground pad 320, and this embodiment of the application is not limited thereto.

[0065] It should be noted that the integrated design of the first electrical connection portion 111 and the signal line 120, and the integrated design of the second electrical connection portion 112 and the ground line 130, ensure the consistency of the cable 100, avoid the need for secondary splicing of the cable 100, and ensure consistent impedance when connecting the cable 100 to the circuit board. Secondary splicing of the cable 100 means first connecting the terminal of the cable 100 to the circuit board and then soldering the cable 100 to the terminal.

[0066] In some possible implementations, in the connector structure provided in the embodiment of the present application, the signal pad 310 includes a welding portion 311 and a buffer portion 312, the first electrical connection portion 111 is correspondingly arranged on the welding portion 311, one end of the buffer portion 312 is connected to the welding portion 311, and the other end is connected to the routing structure 211.

[0067] Specifically, the buffer portion 312 is located between the solder portion 311 and the routing structure 211. The buffer portion 312 may or may not be on the same horizontal plane as the routing structure 211. The gradual buffer portion provides a buffer margin between the solder portion 311 and the routing structure 211, thereby reducing impedance mismatch.

[0068] It should be noted that the embodiment of the present application does not specifically limit the size of the buffer portion, the welding portion 311, and the first electrical connection portion 111, and can be designed according to actual needs. For example, the length of the buffer portion 312 is 28mil-32mil, the width of the welding portion 311 is 11mil-13mil, the length of the welding portion 311 is 52mil-56mil, and the width of the first electrical connection portion 111 is 5mil-7mil. For example, the length of the buffer portion 312 is 30mil, the width of the welding portion 311 is 12mil, the length of the welding portion 311 is 50mil, and the width of the first electrical connection portion 111 is 6mil. For example, Figure 6 In FIG. 1 , A represents the width of the routing structure 211 , B represents the length of the soldering portion 311 , and C represents the width of the soldering portion 311 .

[0069] In other embodiments, the connector structure provided by the embodiments of the present application has a width of the buffer portion 312 at the end facing the crimping portion 110 that is greater than the width of the buffer portion 312 at the end facing the routing structure 211. It should be noted that the buffer portion 312 is trapezoidal in top view. The gradual buffer portion prevents direct crimping between the cable 100 and the routing structure 211, leaving a buffer margin and reducing impedance mismatch.

[0070] In some embodiments, in the connector structure provided by the embodiments of the present application, the width of the welding portion 311 is greater than or equal to the width of the first electrical connection portion 111 , and the length of the welding portion 311 is greater than or equal to the length of the first electrical connection portion 111 .

[0071] Specifically, a connection margin is provided around the welding portion 311. Even if the first electrical connection portion 111 is offset, the first electrical connection portion 111 is still provided on the welding portion 311. For example, when the width of the first electrical connection portion 111 is 6 mils, the width of the welding portion 311 is 12 mils. It can be understood that the larger size of the welding portion 311 provides additional error tolerance, allowing a certain error in the positioning of the first electrical connection portion 111 without affecting the quality of the welding. Because the welding portion 311 can cover a larger area, the welding process is simplified, making the welding operation easier and reducing welding failures caused by positioning difficulties.

[0072] In addition, in the connector structure provided by the embodiment of the present application, a tin layer is provided between the crimping portion 110 and the pad assembly 300 .

[0073] It should be noted that in order to prevent the crimping portion 110 and the pad assembly 300 from being offset during the pressing process, a tin layer is provided between the crimping portion 110 and the pad assembly 300 to pre-fix the crimping portion 110 on the pad assembly 300 .

[0074] In some embodiments, embodiments of the present application further provide a method for preparing a connector structure, for preparing the connector structure of any of the above embodiments, the method comprising: S100: placing a functional layer on a pressing device, arranging a pad assembly 300 on the functional layer, and placing a crimping portion 110 on the pad assembly 300. Specifically, the pressing device comprises two opposing steel plates, one above the other, a functional layer placed on one of the steel plates, the functional layer being located between the two opposing steel plates, the pad assembly 300 being arranged on the functional layer, and the crimping portion 110 being placed on the pad assembly 300.

[0075] S200 places a prepreg 230 on the functional layer to cover the pad assembly 300 and the crimping portion 110. Another functional layer having a relief portion 221 is placed on the prepreg 230, with the relief portion 221 facing the crimping portion 110. For circular signal cables, the crimping portion 110 can be flattened using a laminating device. The upper and lower steel plates of the laminating device press the crimping portion 110 together to achieve the target thickness and width, thereby increasing the contact area between the crimping portion 110 and the pad assembly 300. Prepreg 230 is placed on the functional layer to cover the pad assembly 300 and the crimping portion 110. Another functional layer having a relief portion 221 is placed on the prepreg 230, with the relief portion 221 facing the crimping portion 110. This forms a structure comprising the steel plate, the functional layer, the pad assembly 300, the crimping portion 110, the prepreg 230, the functional layer, and the steel plate.

[0076] S300 The laminating device performs laminating to connect the functional layer, the crimping portion 110 and the pad assembly 300 via the prepreg 230. When the laminating device performs laminating, the prepreg 230 is liquefied and solidified, so that the functional layer, the crimping portion 110 and the pad assembly 300 are connected.

[0077] The manufacturing method in the embodiments of the present application integrates the connection between the crimping portion 110 of the cable 100 and the circuit board into the circuit board's crimping molding process. During the preparation of the circuit board stack, a press-fit device is used for lamination. The prepreg 230 connects the functional layer, the crimping portion 110, and the pad assembly 300, forming a crimped connection between the cable 100 and the functional layer. During this process, the prepreg 230 evenly covers the surface of the crimping portion 110, evenly applying force to the crimping portion 110, ensuring impedance consistency of the crimping portion 110 and improving the quality and consistency of signal transmission.

[0078] It should be noted that the area of ​​the avoidance portion 221 is related to the area of ​​the pad assembly 300. The presence or absence of the avoidance portion 221 affects the thickness of the prepreg 230. The relationship between the thickness of the prepreg 230 and the impedance is:

[0079]

[0080] Wherein, Z0 is impedance, Er is relative dielectric constant, H is thickness of prepreg 230, W is width of pad assembly (300), T is preset pressing thickness, and according to the simulation formula, when impedance is equal to preset impedance value, the area of ​​avoidance portion 221 at this time is obtained and used as parameter during preparation.

[0081] Exemplarily, first obtain the cable data, the length and width of the crimping portion 110 for pressing, and the cable data can be obtained from the manufacturer or designed according to the impedance requirements. The length and width of the pad assembly 300 are greater than or equal to the length and width of the crimping portion 110. Of course, additional weighted values ​​of length and width can be added to the pad assembly 300 for simulation. It should be noted that the size of the pad assembly 300 also affects the impedance value of the crimping position, and the additional weighted value can also be used as a variable for simulation. Through the crimping portion 110 information, the pad assembly 300 information and the stacking information, modeling is carried out according to the above formula, with the signal pad 310 as the center, and the functional layers above and below it are hollowed out to form an avoidance portion 221, and the area of ​​the avoidance portion 221 is scanned. According to the simulation formula, when the impedance is equal to the preset impedance value, the area of ​​the avoidance portion 221 and the thickness and number of layers of the semi-cured sheet at this time are obtained and used as parameters during preparation.

[0082] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0083] It should be readily understood that “on,” “above,” and “over” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also includes “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0084] Additionally, spatially relative terms, such as "below," "beneath," "beneath," "above," and the like, may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be in other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0085] It should be noted that references in this specification to "one embodiment," "an embodiment," "an exemplary embodiment," "some embodiments," and the like indicate that the described embodiment may include a particular feature, structure, or characteristic, but not necessarily every embodiment includes that particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A connector structure, characterized in that: include: a circuit board and at least one cable (100); The circuit board comprises a laminate assembly (200) and a pad assembly (300), the laminate assembly (200) comprises at least two functional layers and at least one prepreg (230), the prepreg (230) is arranged between the two functional layers, and the pad assembly (300) is arranged on the functional layer and electrically connected to the wiring structure (211) of the functional layer; The end of the cable (100) has a crimping portion (110), the crimping portion (110) and the pad assembly (300) are both sandwiched between the functional layer and the prepreg (230), the crimping portion (110) is arranged on the pad assembly (300), and the functional layer opposite to the crimping portion (110) has an avoidance portion (221), and the avoidance portion (221) is arranged corresponding to the crimping portion (110); The crimping portion (110) includes at least two first electrical connection portions (111) and at least two second electrical connection portions (112), wherein the first electrical connection portions (111) are electrically connected to the signal line (120) of the cable (100), and the second electrical connection portions (112) are electrically connected to the ground line (130) of the cable (100); The pad assembly (300) comprises at least two signal pads (310) and at least two ground pads (320), each of the ground pads (320) being relatively arranged on both sides of the at least two signal pads (310), the first electrical connection portion (111) being correspondingly connected to the signal pads (310), the second electrical connection portion (112) being correspondingly connected to the ground pads (320), and the signal pads (310) corresponding to the avoidance portion (221); The first electrical connection portion (111) and the signal line (120) are designed as one piece, and the second electrical connection portion (112) and the ground line (130) are designed as one piece.

2. The connector structure according to claim 1, wherein: The two functional layers include a core plate group (210) and at least one copper layer (220); or the two functional layers include two core plate groups (210).

3. The connector structure according to claim 2, wherein: The core plate group (210) includes at least two core plates, and the prepreg (230) is arranged between the two core plates.

4. The connector structure according to claim 1, wherein: The signal pad (310) comprises a welding portion (311) and a buffer portion (312); the first electrical connection portion (111) is correspondingly arranged on the welding portion (311); one end of the buffer portion (312) is connected to the welding portion (311), and the other end is connected to the routing structure (211).

5. The connector structure according to claim 4, characterized in that: The length of the buffer portion (312) is 28 mil-32 mil, the width of the welding portion (311) is 11 mil-13 mil, the length of the welding portion (311) is 52 mil-56 mil, and the width of the first electrical connection portion (111) is 5 mil-7 mil.

6. The connector structure according to claim 4, characterized in that: The width of the buffer portion (312) toward one end of the crimping portion (110) is greater than the width of the buffer portion (312) toward one end of the wiring structure (211).

7. The connector structure according to claim 4, characterized in that: The width of the welding portion (311) is greater than or equal to the width of the first electrical connection portion (111), and the length of the welding portion (311) is greater than or equal to the length of the first electrical connection portion (111).

8. The connector structure according to any one of claims 1 to 7, characterized in that: A tin layer is provided between the crimping portion (110) and the pad assembly (300).

9. A method for preparing a connector structure, characterized in that: For preparing the connector structure according to any one of claims 1 to 8, the method comprises: Placing a functional layer on the pressing device, arranging a pad assembly (300) on the functional layer, and placing the pressing portion (110) on the pad assembly (300); The prepreg (230) is placed on the functional layer to cover the pad assembly (300) and the crimping portion (110), and another functional layer having a relief portion (221) is placed on the prepreg (230), wherein the relief portion (221) is opposite to the crimping portion (110); The pressing device performs pressing to connect the functional layer, the pressing portion (110) and the pad assembly (300) through the prepreg (230).

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