Large-size wafer transverse transportation device and method

Abstract

The invention relates to a large-size wafer transverse transportation device and method.The large-size wafer transverse transportation device comprises a damping cabinet body, the damping cabinet body comprises a damping upper cover and a damping base, and the damping base is installed at the top end of the damping upper cover; the storage box body is located on the inner side of the damping cabinet body, the storage box body comprises a storage top cover, a storage base, storage units and limiting blocking columns, the multiple storage units are stacked on the storage base, and the storage top cover is installed at the top end of the storage unit located on the uppermost layer. Through the use of the impurity removing part, cooling liquid in the impurity removing part can take away heat of a motor, then the cooling liquid reaches the inner side of a second storage barrel through a first pipeline, due to the fact that the second storage barrel rotates, the cooling liquid can be thrown out of the second storage barrel through a liquid outlet groove, the cooling liquid enables the peripheries of blades to be cleaned, airflow is wetted, and generation of static electricity is reduced; and the air flow is cooled, so that the cooling capacity of the air flow is improved.

Description

Technical Field

[0001] The present invention belongs to the field of wafer transportation, and in particular relates to a device and method for horizontally transporting large-size wafers. Background Art

[0002] With the continuous development of the industry, the performance requirements for components are getting higher and higher. As a new generation of semiconductor materials for industrial production, silicon carbide is widely used in high-power, high-voltage, high-frequency and other electronic device fields due to its excellent performance.

[0003] At present, 6-inch silicon carbide substrates have been mass-produced in China, and 8-inch substrates are in the small-batch production stage internationally. Domestic substrate manufacturers are also conducting research and development of 8-inch substrates. Compared with 6-inch substrates, the number of chips cut from 8-inch substrates will be greater, which will improve production efficiency, and the edge loss of 8-inch substrates will be further reduced, effectively reducing production costs. Therefore, large-size substrates will inevitably be the trend of future development.

[0004] However, with the continuous optimization of wafer growth and cutting technology, the size of the substrate continues to increase while the thickness of the wafer remains relatively stable. Existing wafer packaging boxes often place the substrate vertically in the packaging box for transportation. For larger and thinner wafers, the vibration generated during the vertical transportation will increase the stress of the wafer in the packaging box, and the wafer edge is prone to breakage. The wafer as a whole will also have new structural defects due to the large shear force. In order to ensure the structural stability of the storage device and the clamping equipment during transportation, it is also necessary to install a cooling air-cooling component to ensure that the device is maintained at an appropriate temperature. The blades of the air-cooling component are prone to adsorb a large amount of dust, which in turn causes the dynamic balance of the blades to be destroyed, resulting in its operation being hindered. Therefore, a large-size wafer lateral transportation device and method are proposed. Summary of the invention

[0005] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] In view of the following technical problems in the prior art: the vibration generated during the longitudinal transportation will increase the stress on the wafer in the packaging box, the wafer edge is prone to breakage, and the wafer as a whole will also have new structural defects due to the large shear force. In order to ensure the structural stability of the storage device and the clamping device during transportation, it is also necessary to install a cooling air-cooling component to ensure that the device is maintained at an appropriate temperature. The blades of the air-cooling component are prone to adsorb a large amount of dust, which in turn causes the dynamic balance of the blades to be destroyed, causing its operation to be hindered.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a large-size wafer lateral transportation device and method, comprising:

[0008] A shock-absorbing cabinet, the shock-absorbing cabinet comprising a shock-absorbing upper cover and a shock-absorbing seat, the shock-absorbing seat being arranged on the top of the shock-absorbing upper cover;

[0009] A storage box body, the storage box body is located inside the shock-absorbing cabinet body, the storage box body comprises a storage cover, a storage base, a storage unit and a limit stop column, a plurality of storage units are stacked on the storage base, a storage cover is arranged on the top of the storage unit located at the top layer, and the top of the storage base and the storage unit are provided with four limit stop columns in a circular array;

[0010] Notches are provided on both sides of the storage base, and the notches match and correspond to the heat conducting components;

[0011] A storage chamber is provided on the front of the storage unit, a wafer placement pit is recessed on the inner bottom wall of the storage chamber, the central axes of the two wafer placement pits coincide, a clamping through hole is recessed through the middle of the wafer placement pit, four blocking column through holes are evenly recessed through the circumference of the wafer placement pit, and the limit blocking columns are correspondingly plugged into the blocking column through holes;

[0012] A pressure indicator light is arranged on the top of the shock-absorbing upper cover.

[0013] As a preferred technical solution for a large-size wafer lateral transport device and method, a clamping column is installed in the middle of the top of the storage unit and the storage base, and the clamping column extends into the clamping through hole above it;

[0014] The wafer is clamped between the top of the clamping column and the inner top wall of the storage chamber, and the clamping column is located in the middle of the four limit stop columns;

[0015] A vertical connecting rod is respectively installed at the four corners of the storage unit and the storage base, and a second limiting block is installed on the top of the vertical connecting rod. The vertical connecting rod is correspondingly plugged into the storage unit.

[0016] As an optimal technical solution for a large-size wafer lateral transportation device and method, four limit blocks are evenly installed on the lower side of the shock-absorbing upper cover, and four limit holes are recessed on the upper side of the shock-absorbing seat, and the limit blocks are plugged into the corresponding limit holes.

[0017] The shock absorbing upper cover and the shock absorbing seat are installed in coordination with each other by using the limiting block 1 and the limiting hole.

[0018] As a preferred technical solution for a large-size wafer lateral transportation device and method, the storage unit is located on the side of the storage chamber opening and is preset with two limiting sharp corners, the storage top cover and the storage base are provided with assembly grooves, the assembly grooves are clamped with the connecting plate, the storage top cover and the storage base are provided with two limit grooves, the head and tail of the connecting plate are respectively provided with two limit blocks three, and the limit blocks three are plugged into the limit grooves accordingly.

[0019] The connecting plate closes the storage chamber opening, so that the storage chamber becomes a closed cavity.

[0020] As a preferred technical solution for a large-size wafer lateral transportation device and method, an air cooling component is installed on the front of the shock absorbing seat, and an air outlet hole is reserved on the back of the shock absorbing seat.

[0021] The airflow enters from the sleeve and exits from the air outlet hole, during which the heat of the assembled structure is taken away.

[0022] As a preferred technical solution for a large-size wafer lateral transport device and method, the air-cooling component includes a sleeve, a structural arm, an inner sleeve, a base, a power component and a liquid-cooling component;

[0023] The sleeve is a cylindrical shell, the structure arms are 4 in number and are welded to the inner side of the sleeve at equal intervals, the inner sleeve is arranged on the inner side of the sleeve, one end of the structure arm deviating from the sleeve is connected to the inner sleeve, and the center line of the sleeve coincides with the center line of the inner sleeve;

[0024] The inner side of the sleeve accommodates the power components and liquid cooling components.

[0025] As a preferred technical solution for a large-size wafer lateral transportation device and method, the power component includes blades, a mounting plate, an outer sleeve, a motor and a transmission rod. The outer sleeve is fixedly connected to the inner side of the inner sleeve, the motor is located on the inner side of the outer sleeve, the transmission rod is sleeved on the power head of the motor, the transmission rod is fixedly connected to the mounting plate, and several blades are evenly spaced on the circumference of the mounting plate. The sleeve, mounting plate and transmission rod are coaxial.

[0026] As an optimal technical solution for a large-size wafer lateral transport device and method, the liquid cooling component includes pipeline 1, structural rods, pipeline 2, an outer sleeve and a debris removal component. Pipeline 2 is installed in the structural arm at the bottom of the inner sleeve. The upper side of pipeline 2 is connected to the inner side of the inner sleeve. The end of pipeline 2 that deviates from the inner sleeve is connected to the external water supply pipeline. The storage barrel 2 is plugged with the transmission rod. The bottom of pipeline 1 is fixedly connected to the storage barrel 2. The pipeline is connected to the storage barrel 2. The end of pipeline 1 that deviates from the storage barrel 2 is fixedly connected to the inner sleeve. Pipeline 1 is connected to the inner sleeve. A structural rod is installed between the storage barrel 2 and the inner sleeve. The pipeline 1 and the structural rod are installed in a mirror image.

[0027] The impurity removal components include a liquid outlet groove, a rotating circle, a pipeline three and a storage barrel one. The pipeline three is a plurality of pipelines that are fixedly connected to the storage barrel two at equal intervals. The pipeline three is connected to the storage barrel two. The end of the pipeline three that deviates from the storage barrel two is fixedly connected to the rotating circle. The rotating circle is movably connected to the storage barrel one. The pipeline three is connected to the storage barrel one. The storage barrel one is fixedly connected to the inner side of the mounting plate. The number of blades is half the number of liquid outlet grooves. Two liquid outlet grooves are reserved on each blade. The liquid outlet groove is connected to the storage barrel one.

[0028] A plurality of horizontally arranged guide plates are installed on both sides of the inner side of the shock-absorbing seat, and a plurality of thermal conductive pipes are arranged on both sides of the storage cover. The thermal conductive pressure block is located inside the storage cover, and a thermal conductive liquid is arranged inside the thermal conductive pipe. The thermal conductive pipe passes through the corresponding guide plates vertically downward, and the thermal conductive pipe conducts the heat inside the storage cover. The guide plates divert the airflow, and the airflow passes through the surface of the thermal conductive pipe so that the heat of the thermal conductive pipe is taken away, thereby reducing the temperature inside the storage cover and the storage unit;

[0029] The heat transfer component includes a heat transfer pipe, a heat transfer block, a flexible heat transfer pad and a heat transfer plate. The heat transfer pipe is an evaporation section at the heat transfer block, where the working liquid in the heat pipe evaporates into steam.

[0030] The contact point between the temperature guide pipe and the guide plate is the condensation section, where the steam in the heat pipe condenses into liquid and releases heat. The guide plate connects the storage unit and the shock-absorbing seat to make the assembled structure stable and not shake.

[0031] A flexible thermal pad is placed on the inner top wall of the storage chamber. Adjacent flexible thermal pads are connected by a thermal plate. The thermal plate passes through the storage unit. The thermal plate transfers heat to the outside of the storage unit. The thermal pressure block consists of two upper and lower blocks. The two thermal pressure blocks are clamped in the middle of the thermal pipe. The two parallel parts of the thermal pipe are distributed on both sides of the storage unit to further transfer heat to the guide plate for air cooling.

[0032] A capillary structure is reserved inside the temperature conducting tube, and the capillary structure promotes evaporation and reflux of water.

[0033] When the storage units are tightly attached to each other, the heat-conducting plates arranged therein will fit each other at the upper and lower connections and transfer heat; in order to ensure that adjacent heat-conducting plates can fit tightly in the vertical direction, a flexible heat-conducting material can be arranged at the interface, and the flexible heat-conducting material uses a silicone material as a substrate, and the silicone substrate has a built-in thermal conductive filler such as aluminum oxide, boron nitride, beryllium oxide or aluminum nitride.

[0034] An air duct is arranged inside the shock absorbing seat, and a guide plate is sealed and arranged on the inner wall of the shock absorbing seat, one end of the guide plate is located in the air duct area, and the other end is located in the assembly area of ​​the shock absorbing seat and the storage box body, and the two areas are sealed and do not circulate;

[0035] In order to ensure that the left and right ends of the storage box body do not collide with the guide plate during transportation and have a significant impact on the box body, a thermal conductive gasket can be set at the docking opening between the guide plate and the temperature conduction tube to absorb kinetic energy.

[0036] As a preferred technical solution for a large-size wafer lateral transportation device and method, the transportation method is:

[0037] S1: placing the pressing column into the wafer placement pit in the storage unit;

[0038] S2: placing the storage unit of the first layer on the upper side of the storage base, aligning the limit stopper column with the stopper column through hole, and aligning the clamping column with the clamping through hole. When the storage unit approaches the storage base, the wafer is lifted by the clamping column until the wafer is clamped by the clamping column and the inner top wall of the storage chamber.

[0039] S3: placing other storage units with clamping columns on other storage units that have been assembled, aligning the limit stopper columns with the stopper column through holes, and the clamping columns with the clamping through holes. When the storage units are close to each other, the wafers are lifted by the clamping columns until they are clamped by the clamping columns and the inner top wall of the storage chamber.

[0040] S4: placing the storage unit with the storage cover preset to the uppermost position;

[0041] S5: A connection plate is covered in the assembly groove on one side of the storage chamber opening, so that the limiting block 3 on the connection plate is plugged into the corresponding limiting groove to form a final assembly structure, so that the storage chamber is closed;

[0042] S6: placing the final assembly structure into the shock-absorbing seat, covering the shock-absorbing upper cover on the shock-absorbing seat, and inserting the limiting block 1 into the corresponding limiting hole.

[0043] The beneficial effects of the large-size wafer lateral transportation device and method of the present invention are as follows: by inflating the upper airbag and the lower airbag, the storage box body is compressed, the shaking of the storage box body in the inner space of the shock-absorbing cabinet is reduced, the storage box body is made more stable, and the transportation loss of the wafer is reduced to the greatest extent;

[0044] By using air-cooling components, the device is kept at a suitable temperature, ensuring the structural stability of the storage device and the clamping equipment;

[0045] By using the impurity removal components, the heat of the motor can be taken away by the cooling liquid therein, and the cooling liquid then reaches the inner side of the storage barrel 2 through the pipeline 1. As the storage barrel 2 is rotating, the cooling liquid will be thrown out of the storage barrel 2 through the liquid outlet groove. The cooling liquid cleans the periphery of the blades and moistens the airflow, reducing the generation of static electricity, cooling the airflow, and improving the cooling capacity of the airflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0047] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0048] Figure 2 The positional relationship between the upper airbag and the lower airbag of the present invention;

[0049] Figure 3 The three-dimensional structure of the storage box of the present invention is shown in FIG. Figure 1 ;

[0050] Figure 4 The three-dimensional structure of the storage box of the present invention is shown in FIG. Figure 2 ;

[0051] Figure 5 It is a schematic diagram of the assembly of the storage box body and the shock absorbing seat of the present invention;

[0052] Figure 6 The three-dimensional structure of the storage unit of the present invention is shown in FIG. Figure 1 ;

[0053] Figure 7 The three-dimensional structure of the storage unit of the present invention is shown in FIG. Figure 2 ;

[0054] Figure 8 It is a bottom view structural schematic diagram of the storage unit of the present invention;

[0055] Fig. 9 It is a schematic diagram of the three-dimensional structure of the connecting plate of the present invention;

[0056] Fig.10 It is a top view schematic diagram of the shock absorbing seat and the guide plate after being assembled according to the present invention;

[0057] Fig.11 It is a schematic diagram of the three-dimensional structure of the heat conduction system of the present invention;

[0058] Fig.12 is a front view schematic diagram of the heat conduction system of the present invention;

[0059] Fig.13 It is a schematic diagram of the three-dimensional structure of the air-cooling component of the present invention;

[0060] Fig.14 The cross-sectional structure of the air-cooling component of the present invention is shown in FIG. Figure 1 ;

[0061] Fig.15For the present invention Fig.14 A schematic diagram of the local enlarged structure of the G part;

[0062] Fig.16 It is a front structural schematic diagram of the air-cooling component of the present invention;

[0063] Fig.17 The cross-sectional structure of the air-cooling component of the present invention is shown in FIG. Figure 1 ;

[0064] Fig.18 The cross-sectional structure of the air-cooling component of the present invention is shown in FIG. Figure 2 .

[0065] Figure 1: shock-absorbing cabinet 1, shock-absorbing upper cover 11, limit block 111, shock-absorbing seat 12, limit hole 121, upper air bag 13, lower air bag 14, air inlet interface 15, air outlet interface 16, pressure indicator light 17, guide plate 18, temperature conduction component 19, temperature conduction pipe 191, temperature conduction pressure block 192, flexible temperature conduction pad 193, temperature conduction plate 194, storage box 2, storage top cover 21, assembly groove 211, limit groove 212, storage base 22, storage unit 23, limit button 231, blocking column through hole 232, pressing through hole Hole 233, wafer placement pit 234, storage chamber 235, limit stop column 24, clamping column 25, vertical connecting rod 26, limit block two 261, wafer 3, connecting plate 4, limit block three 41, sleeve 42, blade 43, structural arm 44, liquid outlet groove 45, mounting plate 46, structural plate 47, pipeline one 48, outer sleeve 49, motor 50, inner sleeve 51, transmission rod 52, structural rod 53, pipeline two 54, rotating ring 56, pipeline three 57, storage barrel one 58, storage barrel two 59, rubber ring one 60, rubber ring two 61. DETAILED DESCRIPTION

[0066] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0067] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0068] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0069] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0070] Method 1:

[0071] like Figure 1-8 As shown, the present invention provides a large-size wafer lateral transportation device and method, comprising:

[0072] A shock-absorbing cabinet 1, wherein the shock-absorbing cabinet 1 comprises a shock-absorbing upper cover 11 and a shock-absorbing seat 12, and the shock-absorbing seat 12 is arranged on the top of the shock-absorbing upper cover 11;

[0073] A storage box body 2, the storage box body 2 is located inside the shock-absorbing cabinet body 1, the storage box body 2 comprises a storage cover 21, a storage base 22, a storage unit 23 and a limit stop column 24, a plurality of storage units 23 are stacked on the storage base 22, a storage cover 21 is arranged on the top of the storage unit 23 located at the top layer, and four limit stop columns 24 are arranged in a circular array on the top of the storage base 22 and the storage unit 23;

[0074] A storage chamber 235 is provided on the front of the storage unit 23. A wafer placement pit 234 is recessed on the inner bottom wall of the storage chamber 235. The central axes of the two wafer placement pits 234 coincide with each other. A pressing through hole 233 is recessed through the middle of the wafer placement pit 234. Four stopper through holes 232 are evenly recessed through the circumference of the wafer placement pit 234. The limit stopper 24 is correspondingly plugged into the stopper through holes 232.

[0075] A pressure indicator light 17 is arranged on the top of the shock-absorbing upper cover 11 .

[0076] A pressing column 25 is installed in the middle of the top of the storage unit 23 and the storage base 22, and the pressing column 25 extends into the pressing through hole 233 above the storage unit 23 and the storage base 22;

[0077] The wafer 3 is clamped between the top of the clamping column 25 and the inner top wall of the storage chamber 235, and the clamping column 25 is located in the middle of the four limit stop columns 24;

[0078] A vertical connecting rod 26 is respectively installed at the four corners of the storage unit 23 and the storage base 22 , and a second limiting block 261 is installed at the top of the vertical connecting rod 26 . The vertical connecting rod 26 is correspondingly plugged into the storage unit 23 .

[0079] Four limiting blocks 111 are evenly arranged on the lower side of the shock-absorbing upper cover 11 , and four limiting holes 121 are recessed on the upper side of the shock-absorbing seat 12 . The limiting blocks 111 are plugged into the corresponding limiting holes 121 .

[0080] The limiting block 111 and the limiting hole 121 are used to coordinately install the shock absorbing upper cover 11 and the shock absorbing seat 12 .

[0081] The storage unit 23 is preset with two limiting sharp corners 231 on the side of the opening of the storage chamber 235, and the storage top cover 21 and the storage base 22 are both provided with assembly grooves 211, and the assembly grooves 211 are snap-connected with the connecting plate 4. The storage top cover 21 and the storage base 22 are both provided with two limiting grooves 212, and two limiting blocks three 41 are respectively installed at the head and tail of the connecting plate 4, and the limiting blocks three 41 are correspondingly plugged into the limiting grooves 212.

[0082] The connecting plate 4 closes the opening of the storage chamber 235, so that the storage chamber 235 becomes a closed cavity.

[0083] An air cooling component is installed on the front of the shock absorbing seat 12 , and an air outlet hole is reserved on the back of the shock absorbing seat 12 .

[0084] The airflow enters from the sleeve 42 and exits from the air outlet hole, during which the heat of the assembled structure is taken away.

[0085] Method 2:

[0086] like Figure 9-18 , the air-cooling component includes a sleeve 42, a structural arm 44, an inner sleeve 51, a power component and a liquid-cooling component;

[0087] The sleeve 42 is a cylindrical shell, and the four structural arms 44 are welded on the inner side of the sleeve 42 at equal intervals. The inner sleeve 51 is arranged on the inner side of the sleeve 42. One end of the structural arm 44 deviates from the sleeve 42 and is connected to the inner sleeve 51. The center line of the sleeve 42 coincides with the center line of the inner sleeve 51.

[0088] The inner side of the sleeve 42 accommodates the power components and liquid cooling components;

[0089] The power component includes blades 43, a mounting plate 46, an outer sleeve 49, a motor 50 and a transmission rod 52. The outer sleeve 49 is fixedly connected to the inner side of the inner sleeve 51, and the motor 50 is located on the inner side of the outer sleeve 49. The transmission rod 52 is sleeved on the power head of the motor 50. The transmission rod 52 is fixedly connected to the mounting plate 46. Several blades 43 are evenly spaced on the circumference of the mounting plate 46. The sleeve 42, the mounting plate 46 and the transmission rod 52 are coaxial.

[0090] The liquid cooling component includes pipeline one 48, structural rod 53, pipeline two 54, outer sleeve 49 and impurity removal components. Pipeline two 54 is installed in the structural arm 44 at the bottom of the inner sleeve 51, the upper side of pipeline two 54 is connected to the inner side of the inner sleeve 51, and the end of pipeline two 54 deviating from the inner sleeve 51 is connected to the external water supply pipeline, the storage barrel two 59 is plugged into the transmission rod 52, and the storage barrel two 59 is screwed to the transmission rod 52. The bottom of pipeline one 48 is fixedly connected to the storage barrel two 59, the pipeline one 48 is connected to the storage barrel two 59, and the end of pipeline one 48 deviating from the storage barrel two 59 is fixedly connected to the inner sleeve 51, the pipeline one 48 and the inner sleeve 51 are connected, and the structural rod 53 is installed between the storage barrel two 59 and the inner sleeve 51, and the pipeline one 48 and the structural rod 53 are installed in a mirror image.

[0091] The impurity removal components include a liquid outlet groove 45, a rotating ring 56, a pipeline three 57 and a storage barrel one 58. The pipeline three 57 is a plurality of pipelines that are evenly spaced and fixedly connected to the storage barrel two 59. The pipeline three 57 is connected to the storage barrel two 59. One end of the pipeline three 57 that deviates from the storage barrel two 59 is fixedly connected to the rotating ring 56. The rotating ring 56 is movably connected to the storage barrel one 58. The pipeline three 57 is connected to the storage barrel one 58. The storage barrel one 58 is fixedly connected to the inner side of the mounting plate 46. The number of blades 43 is half the number of liquid outlet grooves 45. Two liquid outlet grooves 45 are reserved on each blade 43. The liquid outlet groove 45 is connected to the storage barrel one 58.

[0092] The liquid outlet grooves 45 on two opposite surfaces of each blade 43 are staggered to prevent the liquid outlet grooves 45 from causing the thickness of the blade 43 to be too small locally. The storage barrel 58 is ring-shaped.

[0093] A structural plate 47 is installed at the joint of the structural arm 44 and the inner sleeve 51 to reduce vibration and noise.

[0094] The inner sleeve 51 is wrapped with a vacuum insulation layer to reduce heat exchange between the inner sleeve 51 and the outside.

[0095] Mode 3: A rubber ring 1 60 is arranged between the rotating ring 56 and the pipeline 3 57, and a rubber ring 2 61 is arranged between the outer sleeve 49 and the transmission rod 52. The rubber ring 1 60 and the rubber ring 2 61 can increase the air tightness.

[0096] Mode 4: A limiting ring is disposed between the transmission rod 52 and the mounting plate 46. The limiting ring is fixedly connected to the transmission rod 52. The limiting ring limits the position of the pipeline three 57 and the storage barrel one 58 to avoid mismatch between the liquid outlet groove 45 and the storage barrel one 58.

[0097] The base 55 is fixedly connected to the lower side of the sleeve 42, and the motor 50 is started, and the motor 50 drives the transmission rod 52 to rotate, and the transmission rod 52 drives the mounting plate 46 to rotate, and the mounting plate 46 drives the blades 43 to rotate to generate airflow. During this period, the pipeline 2 54 injects cooling liquid into the rubber ring 2 61, and the cooling liquid can take away the heat of the motor 50. The cooling liquid then reaches the inner side of the storage barrel 2 59 through the pipeline 1 48. Since the storage barrel 2 59 is rotating, the cooling liquid will be thrown out of the storage barrel 2 59 through the liquid outlet groove 45. The cooling liquid cleans the periphery of the blade 43 and moistens the airflow, reduces the generation of static electricity, cools the airflow, and improves the cooling capacity of the airflow.

[0098] An upper airbag 13 is installed in the shock-absorbing seat 12, and a lower airbag 14 is installed in the shock-absorbing upper cover 11. By inflating the upper airbag 13 and the lower airbag 14, an air inlet interface 15 and an air outlet interface 16 are installed on the upper airbag 13 and the lower airbag 14. The air outlet interface 16 and the air inlet interface 15 can extend out of the shock-absorbing upper cover 11, and the air inlet interface 15 can be externally connected to an air supply pipeline. By inflating the upper airbag 13 and the lower airbag 14, the storage box body 2 is compressed, and the shaking of the storage box body 2 in the inner space of the shock-absorbing cabinet 1 is reduced, making it more stable, and minimizing the transportation loss of the wafer 3. A pressure switch is arranged in the shock-absorbing upper cover 11, and the pressure switch is connected to the pressure indicator light 17. When the upper airbag 13 and the lower airbag 14 reach a certain pressure, the pressure switch is activated. When the pressure indicator light 17 on the shock-absorbing upper cover 11 lights up, the airbag is stopped from being inflated, and the storage of the storage box body is completed.

[0099] The sleeve 42 is located outside the shock absorbing seat 12 and is also provided with a dustproof component, which includes but is not limited to a dustproof cylinder and a filter. The dustproof cylinder is connected to the shock absorbing seat 12 and a filter is installed on the dustproof cylinder.

[0100] The motor 50 is started, and the motor 50 drives the transmission rod 52 to rotate, the transmission rod 52 drives the mounting plate 46 to rotate, and the mounting plate 46 drives the blades 43 to rotate to generate airflow, and the heat conduction tube 191 outputs the heat inside the storage unit 23 to the guide plate 18, and the guide plate 18 diverts the airflow. The airflow passes through the surface of the guide plate 18, so that the heat of the guide plate 18 and the heat conduction tube 191 is taken away, thereby reducing the temperature of the wafer 3 and the inside and surface of the storage unit 23.

[0101] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0102] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A large-size wafer lateral transport device and method, characterized in that: include: A shock-absorbing cabinet (1), the shock-absorbing cabinet (1) comprising a shock-absorbing upper cover (11), a shock-absorbing seat (12) being arranged at the top of the shock-absorbing upper cover (11); A storage box body (2), the storage box body (2) is located inside the shock-absorbing cabinet body (1), the storage box body (2) comprises a storage cover (21), a plurality of storage units (23) are stacked on the storage base (22), the top of the storage unit (23) located on the top layer is provided with the storage cover (21), and the tops of the storage base (22) and the storage units (23) are provided with four limit stop posts (24) in a circular array; A storage chamber (235) is provided on the front of the storage unit (23), a wafer placement pit (234) is recessed on the inner bottom wall of the storage chamber (235), a pressing through hole (233) is recessed through the middle of the wafer placement pit (234), four blocking column through holes (232) are evenly recessed through the circumference of the wafer placement pit (234), and the limiting blocking column (24) is correspondingly plugged into the blocking column through holes (232); The front sides of the shock-absorbing upper cover (11) and the shock-absorbing seat (12) are both concavely provided with an air inlet interface (15) and an air outlet interface (16).

2. The large-size wafer lateral transport device and method according to claim 1, characterized in that: A compression column (25) is installed in the middle of the top of the storage unit (23) and the storage base (22), and the compression column (25) extends into the compression through hole (233) above it.

3. The large-size wafer lateral transport device and method according to claim 2, characterized in that: The wafer (3) is clamped between the top of the pressing column (25) and the inner top wall of the storage chamber (235); A vertical connecting rod (26) is respectively installed at the four corners of the storage unit (23) and the storage base (22), and a second limiting block (261) is installed at the top of the vertical connecting rod (26). The vertical connecting rod (26) is correspondingly plugged into the storage unit (23); Notches are provided on both sides of the storage base (22), and the notches match and correspond to the heat conducting components (19).

4. The large-size wafer lateral transport device and method according to claim 1, characterized in that: Four limiting blocks (111) are evenly arranged on the lower side of the shock-absorbing upper cover (11), and four limiting holes (121) are recessed on the upper side of the shock-absorbing seat (12), and the limiting blocks (111) are plugged into the corresponding limiting holes (121).

5. The large-size wafer lateral transport device and method according to claim 1, characterized in that: The storage unit (23) is provided with two limiting sharp corners (231) on the side of the opening of the storage chamber (235), the storage top cover (21) and the storage base (22) are provided with two limiting grooves (212), and the head and tail of the connecting plate (4) are respectively provided with two limiting blocks (41), and the limiting blocks (41) are correspondingly plugged into the limiting grooves (212).

6. The large-size wafer lateral transport device and method according to claim 1, characterized in that: An air cooling component is arranged on the front of the shock absorbing seat (12), and an air outlet hole is reserved on the back of the shock absorbing seat (12).

7. The large-size wafer lateral transport device and method according to claim 1, characterized in that: The thermal conductive component (19) comprises a thermal conductive tube (191), a thermal conductive pressing block (192), a flexible thermal conductive pad (193) and a thermal conductive plate (194); the thermal conductive pressing block (192) comprises two upper and lower pieces; the two thermal conductive pressing blocks (192) are clamped in the middle of the thermal conductive tube (191); and two mutually parallel parts of the thermal conductive tube (191) are distributed on both sides of the storage unit (23); A flexible heat-conducting pad (193) is arranged on the inner top wall of the storage chamber (235), and adjacent flexible heat-conducting pads (193) are connected by a heat-conducting plate (194), and the heat-conducting plate (194) passes through the storage unit (23); The temperature-conducting pressing block (192) is located inside the storage top cover (21), a heat-conducting liquid is arranged inside the temperature-conducting tube (191), and the temperature-conducting tube (191) vertically passes through the corresponding guide plate (18) downward.

8. The large-size wafer lateral transport device and method according to claim 6, characterized in that: The shipping methods are: S1: placing a pressing column (25) into a wafer placement pit (234) in a storage unit (23); S2: placing the storage unit (23) of the first layer onto the upper side of the storage base (22), aligning the limit stopper column (24) with the stopper column through hole (232), and aligning the clamping column (25) with the clamping through hole (233), and when the storage unit (23) is close to the storage base (22), the wafer is lifted up by the clamping column (25) until the wafer is clamped by the clamping column (25) and the inner top wall of the storage chamber (235); S3: placing other storage units (23) with clamping columns (25) on other storage units (23) that have been assembled, aligning the limit stop column (24) with the stop column through hole (232), and aligning the clamping column (25) with the clamping through hole (233), and when the storage unit (23) approaches the storage unit (23), the wafer is lifted up by the clamping column (25) until the wafer is clamped by the clamping column (25) and the inner top wall of the storage chamber (235); S4: placing the storage unit (23) with the storage cover (21) preset to the uppermost position; S5: Covering the connection plate (4) on one side of the opening of the storage chamber (235), so that the limiting block (41) on the connection plate (4) is plugged into the corresponding limiting groove (212) to form a final assembly structure; S6: placing the final assembly structure into the shock absorbing seat (12), covering the shock absorbing upper cover (11) on the shock absorbing seat (12), and inserting the limiting block 1 (111) into the corresponding limiting hole (121).

Images