Method, device and equipment for testing adhesion of grid line of battery chip
Through the method of combining tape pull-up and microscope observation, the problems of low and incomplete testing accuracy in the prior art are solved, and a comprehensive and accurate evaluation of the adhesion of photovoltaic solar cell chip grid lines is achieved.
Patent Information
- Application Number
- CN202411156406.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-21
- Publication Date
- 2024-12-13
AI Technical Summary
The existing gate line adhesion testing methods lack a unified standardized testing process, resulting in low accuracy and the inability to comprehensively analyze the gate line adhesion, focusing only on unilateral breaking situations.
Use tape to stick on the gate line of the photovoltaic solar cell chip, pull up the tape at a constant speed through a linear motor, combine it with a microscope to observe the shedding situation, residual traces and surface damage degree, calculate the shedding ratio, peeling ratio, fracture ratio and surface damage degree, comprehensively Assess the adhesion strength.
It improves the accuracy and comprehensiveness of gate wire adhesion testing, enables comprehensive analysis of adhesion, and ensures the reliability and representativeness of test results.
Smart Images
Figure CN119124989A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of data processing technology, and in particular to a method, device and equipment for testing the adhesion of a grid line of a battery chip. Background Art
[0002] In the production of photovoltaic solar cells, the grid lines on the surface of the cell chip play a vital role in the performance and efficiency of the cell. The adhesion of the grid lines directly affects the long-term stability and reliability of the cell.
[0003] In the test of the adhesion of the gate wire, one of the existing methods is to apply a vertical pulling force to the end of the gate wire and measure the force required to peel the gate wire from the substrate. This force value can be used to evaluate the adhesion of the gate wire to the battery surface; another method is to use a hard probe to apply gradually increasing pressure on the gate wire until the gate wire is scratched or peeled off. The pressure applied by the probe is proportional to the adhesion, and the adhesion can be evaluated by recording the relationship between the probe pressure and the gate wire failure point.
[0004] However, the existing methods for testing the adhesion of the gate lines have low accuracy due to the lack of a unified method and standardized testing process. In addition, the existing methods often only evaluate one aspect such as gate line cutting, and cannot comprehensively analyze the adhesion of the gate lines. Summary of the invention
[0005] A technical problem to be solved by the present application is that the existing methods for testing the adhesion of the gate lines have low accuracy due to the lack of a unified method and standardized testing process; and the existing methods often only conduct unilateral evaluations such as gate line cutting, and are unable to comprehensively analyze the adhesion of the gate lines.
[0006] In order to solve the above technical problems, the present application provides a method for testing the adhesion of a grid line of a battery chip, comprising:
[0007] Obtaining photovoltaic solar cell chips;
[0008] Adhere the adhesive tape to the grid line of the photovoltaic solar cell chip;
[0009] Pulling up the adhesive tape at a constant speed by a linear motor;
[0010] Observe the surfaces of the adhesive tape and the grid lines through a microscope to determine the falling off of the grid lines on the adhesive tape, the residual traces, and the degree of surface damage;
[0011] According to the falling off condition, the residual trace and the surface damage degree of the grid line on the adhesive tape, the adhesion of the grid line is evaluated to determine whether the adhesion of the grid line is qualified.
[0012] In some embodiments, after obtaining the photovoltaic solar cell chip sample, the method further includes:
[0013] The surface of the photovoltaic solar cell chip is ultrasonically cleaned using a cleaning device to remove stains and impurities on the surface.
[0014] In some embodiments, the step of attaching the adhesive tape to the grid lines of the photovoltaic solar cell chip specifically includes:
[0015] Flatly attaching the adhesive tape to the grid lines of the photovoltaic solar cell chip;
[0016] A rubber roller is used to roll the adhesive tape at a constant speed and apply a constant pressure to closely fit the adhesive tape to the grid line.
[0017] In some embodiments, the adhesion of the grid lines is evaluated according to the falling off condition, the residual traces and the degree of surface damage of the grid lines on the tape to determine whether the adhesion of the grid lines is qualified, specifically including:
[0018] Repeating the above test steps at different positions on the surface of the photovoltaic solar cell chip;
[0019] Counting the total residual length of the grid line on the adhesive surface of the tape;
[0020] When the total residual length of the grid line on the adhesive tape is less than a preset length and the surface of the grid line meets a preset condition, it is determined that the adhesion of the grid line at the current position of the photovoltaic solar cell chip is qualified.
[0021] In some embodiments, the preset condition is specifically:
[0022] The surface of the grid line has no peeling, falling off or breaking marks.
[0023] In some embodiments, the different positions are specifically:
[0024] The center position, edge position and / or corner position of the surface of the photovoltaic solar cell chip.
[0025] In some embodiments, the adhesion of the grid lines is evaluated according to the falling off condition, the residual traces and the degree of surface damage of the grid lines on the tape to determine whether the adhesion of the grid lines is qualified, specifically including:
[0026] According to the falling off condition, residual traces and surface damage degree of the grid wire on the tape, the adhesion strength of the grid wire is calculated:
[0027]
[0028] Wherein, σ represents the adhesion strength of the gate line, O represents the shedding ratio of the gate line, P represents the peeling ratio of the gate line, Q represents the breaking ratio of the gate line, R represents the surface damage degree of the gate line, λ0 represents a constant term, λ1 represents the weight of the shedding ratio of the gate line, λ2 represents the weight of the peeling ratio of the gate line, λ3 represents the weight of the breaking ratio of the gate line, and λ4 represents the weight of the surface damage degree of the gate line;
[0029] Whether the adhesion of the gate line is qualified is determined according to the adhesion strength of the gate line.
[0030] In some embodiments, the calculation formula for the shedding ratio of the gate line is:
[0031]
[0032] Wherein, M represents the number of gate lines that have fallen off, and N represents the total number of gate lines;
[0033] The calculation formula of the peeling ratio of the grid line is:
[0034]
[0035] Where A represents the peeling area of the grid line, and B represents the total area of the grid line;
[0036] The calculation formula of the breakage ratio of the grid line is:
[0037]
[0038] Wherein, I represents the number of broken gate lines;
[0039] The calculation formula for the surface damage degree of the grid line is:
[0040]
[0041] Wherein, J represents the surface damage area of the gate line.
[0042] The present application embodiment provides a battery chip grid line adhesion test device, comprising:
[0043] An acquisition module, used for acquiring photovoltaic solar cell chips;
[0044] A pasting module, used for pasting the tape on the grid line of the photovoltaic solar cell chip;
[0045] A pulling module, used for pulling up the adhesive tape at a uniform speed through a linear motor;
[0046] A determination module, used to observe the surface of the adhesive tape and the grid lines through a microscope to determine the falling off of the grid lines on the adhesive tape, the residual traces and the degree of surface damage;
[0047] The evaluation module is used to evaluate the adhesion of the grid lines according to the falling off condition, residual traces and surface damage degree of the grid lines on the adhesive tape, and determine whether the adhesion of the grid lines is qualified.
[0048] In some embodiments, after obtaining the photovoltaic solar cell chip sample, the method further includes:
[0049] The surface of the photovoltaic solar cell chip is ultrasonically cleaned using a cleaning device to remove stains and impurities on the surface.
[0050] In some embodiments, the pasting module is specifically used to:
[0051] Flatly attaching the adhesive tape to the grid lines of the photovoltaic solar cell chip;
[0052] A rubber roller is used to roll the adhesive tape at a constant speed and apply a constant pressure to closely fit the adhesive tape to the grid line.
[0053] In some embodiments, the evaluation module is specifically configured to:
[0054] Repeating the above test steps at different positions on the surface of the photovoltaic solar cell chip;
[0055] Counting the total residual length of the grid line on the adhesive surface of the tape;
[0056] When the total residual length of the grid line on the adhesive tape is less than a preset length and the surface of the grid line meets a preset condition, it is determined that the adhesion of the grid line at the current position of the photovoltaic solar cell chip is qualified.
[0057] In some embodiments, the preset condition is specifically:
[0058] The surface of the grid line has no peeling, falling off or breaking marks.
[0059] In some embodiments, the different positions are specifically:
[0060] The center position, edge position and / or corner position of the surface of the photovoltaic solar cell chip.
[0061] In some embodiments, the evaluation module is specifically configured to:
[0062] According to the falling off condition, residual traces and surface damage degree of the grid wire on the tape, the adhesion strength of the grid wire is calculated:
[0063]
[0064] Wherein, σ represents the adhesion strength of the gate line, O represents the shedding ratio of the gate line, P represents the peeling ratio of the gate line, Q represents the breaking ratio of the gate line, R represents the surface damage degree of the gate line, λ0 represents a constant term, λ1 represents the weight of the shedding ratio of the gate line, λ2 represents the weight of the peeling ratio of the gate line, λ3 represents the weight of the breaking ratio of the gate line, and λ4 represents the weight of the surface damage degree of the gate line;
[0065] Whether the adhesion of the gate line is qualified is determined according to the adhesion strength of the gate line.
[0066] In some embodiments, the calculation formula for the shedding ratio of the gate line is:
[0067]
[0068] Wherein, M represents the number of gate lines that have fallen off, and N represents the total number of gate lines;
[0069] The calculation formula of the peeling ratio of the grid line is:
[0070]
[0071] Where A represents the peeling area of the grid line, and B represents the total area of the grid line;
[0072] The calculation formula of the breakage ratio of the grid line is:
[0073]
[0074] Wherein, I represents the number of broken gate lines;
[0075] The calculation formula for the surface damage degree of the grid line is:
[0076]
[0077] Wherein, J represents the surface damage area of the gate line.
[0078] An embodiment of the present application provides a device, including: a processor and a memory;
[0079] The memory stores computer-readable instructions, and when the computer-readable instructions are executed by the processor, the above-mentioned grid line adhesion test method of the battery chip is implemented.
[0080] Through the above technical scheme, a photovoltaic solar cell chip is obtained, and the tape is pasted on the grid line of the photovoltaic solar cell chip. The tape is pulled up at a uniform speed by a linear motor, and a standardized test process is established to improve the accuracy of the grid line adhesion test; the surface of the tape and the grid line is observed through a microscope to determine the shedding condition of the grid line on the tape, the residual traces and the degree of surface damage; based on the shedding condition of the grid line on the tape, the residual traces and the degree of surface damage, the adhesion of the grid line is evaluated to determine whether the adhesion of the grid line is qualified; the shedding condition of the grid line on the tape, the residual traces and the degree of surface damage are combined to comprehensively analyze the adhesion of the grid line. BRIEF DESCRIPTION OF THE DRAWINGS
[0081] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0082] Figure 1 It is a schematic flow chart of a method for testing the grid line adhesion of a battery chip disclosed in an embodiment of the present application;
[0083] Figure 2 It is a structural schematic diagram of a grid line adhesion testing device for a battery chip disclosed in an embodiment of the present application;
[0084] Figure 3 It is a structural schematic diagram of a device disclosed in an embodiment of the present application. DETAILED DESCRIPTION
[0085] The following is a further detailed description of the implementation methods of the present application in conjunction with the accompanying drawings and examples. The detailed descriptions of the following examples and the accompanying drawings are used to exemplarily illustrate the principles of the present application, but cannot be used to limit the scope of the present application. The present application can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.
[0086] The present application provides these embodiments to make the present application thorough and complete, and to fully express the scope of the present application to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.
[0087] It should be noted that, in the description of this application, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0088] In addition, the words "first", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.
[0089] It should also be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.
[0090] All terms used in this application have the same meaning as those understood by those of ordinary skill in the art to which this application belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.
[0091] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.
[0092] Reference Manual Attached Figure 1 , showing a schematic flow chart of a method for testing the grid line adhesion of a battery chip disclosed in an embodiment of the present application.
[0093] The present application embodiment provides a method for testing the adhesion of a grid line of a battery chip, comprising:
[0094] S1: Obtain photovoltaic solar cell chips.
[0095] Among them, photovoltaic solar cell chip is a semiconductor device that directly converts sunlight energy into electrical energy and is the basic component of solar cell module. It uses the photovoltaic effect to generate current by absorbing photons and stimulating electron transition, thereby generating electrical energy.
[0096] Specifically, several photovoltaic solar cell chips are randomly selected from the production line as test samples.
[0097] In the present invention, randomly selecting samples can avoid selection bias, making the test samples more representative and able to more accurately reflect the quality status of the entire production batch.
[0098] In some embodiments, S1 further includes:
[0099] Use cleaning equipment to ultrasonically clean the surface of photovoltaic solar cell chips to remove surface stains and impurities.
[0100] In the present invention, ultrasonic cleaning can effectively remove impurities such as stains, dust, grease, etc. on the chip surface, ensuring that the adhesion between the gate line and the substrate is not interfered by surface contaminants, thereby improving the accuracy of the test.
[0101] S2: Stick the tape on the grid line of the photovoltaic solar cell chip.
[0102] In some embodiments, S2 specifically includes:
[0103] The tape is evenly attached to the grid lines of the photovoltaic solar cell chip.
[0104] Optionally, the tape is a high-strength transparent 3M tape with a width of 20 mm.
[0105] In the present invention, the high-strength 3M tape has excellent adhesion and durability, ensuring that the tape will not fall off or fail easily during the test process, thereby more accurately reflecting the adhesion of the grid lines.
[0106] Use a rubber roller to roll the tape at a constant speed, apply constant pressure, and fit the tape tightly to the grid line.
[0107] In the present invention, by applying constant pressure by rolling the rubber roller at a constant speed, it is possible to ensure that the tape is evenly attached to the entire grid line, avoiding loose attachment or bubbles caused by uneven local pressure, and improving the accuracy and repeatability of the test. At the same time, using the rubber roller instead of manual operation can reduce the error caused by uneven human force, making each test operation more standardized and improving the reliability of the test results.
[0108] S3: The tape is pulled up at a constant speed through the linear motor.
[0109] Among them, the linear motor is an electric motor that directly generates linear motion, which is different from the traditional rotary motor. It converts electrical energy directly into linear motion energy without going through rotary motion and mechanical transmission mechanism, and has efficient, precise and fast motion control capabilities.
[0110] It should be noted that the present invention uses a linear motor to pull up the tape so that each test can be performed with the same force, making the test results comparable.
[0111] Specifically, the tape is pulled horizontally at a speed of 100 mm / min through a linear motor at an angle of 45 to 90 degrees to the battery chip, ensuring that the tape remains taut during the pulling process and is completely torn off.
[0112] In the present invention, the tape is pulled horizontally at an angle of 45 to 90 degrees, which can effectively balance the pulling direction and the detachment effect, reduce the additional lateral stress on the grid line, and avoid unnecessary damage. At the same time, by using a linear motor to control the pulling speed, a constant speed of 100 mm / min can be accurately maintained, avoiding the problem of uneven speed during manual operation. In this way, it can ensure that the pulling force applied in each test is consistent, thereby improving the repeatability of the test and the reliability of the results.
[0113] S4: Observe the surface of the tape and the grid lines through a microscope to determine the detachment of the grid lines on the tape, the residual traces, and the degree of surface damage.
[0114] Specifically, the adhesive surface of the pulled tape and the battery chip grid line surface are placed upward under a high-resolution metallographic microscope and magnified 500 times to observe whether the battery chip grid line has fallen off, peeled or broken, and take photos to record the relevant situation.
[0115] Among them, the metallographic high-resolution microscope is an optical microscope used to observe and analyze the microstructure of materials, usually used for the microstructure analysis of metals, alloys and ceramic materials. It is widely used in the fields of materials science, metallurgy, electronics and semiconductor manufacturing to help study the characteristics of materials such as grains, phase composition, defects, impurities, etc.
[0116] In the present invention, by using a metallographic high-resolution microscope to magnify 500 times, the possible tiny peeling, peeling or breaking phenomena on the grid line can be clearly seen. This high-precision observation method can capture details that cannot be detected by the naked eye, thereby providing a more accurate adhesion evaluation. At the same time, using a microscope to observe and record instead of naked eye observation can reduce errors caused by subjective judgment and improve the objectivity and consistency of the analysis.
[0117] S5: According to the falling off of the grid line on the tape, the residual traces and the degree of surface damage, the adhesion of the grid line is evaluated to determine whether the adhesion of the grid line is qualified.
[0118] In some embodiments, S5 specifically includes:
[0119] Repeat the above test steps at different locations on the surface of the photovoltaic solar cell chip.
[0120] In the present invention, by repeating the test at different locations on the chip surface (such as the center, edge, and corner), the adhesion of the gate line on the entire chip surface can be comprehensively evaluated. This multi-point testing method can reveal the adhesion differences caused by manufacturing process or material non-uniformity, ensuring that the evaluation results are more representative.
[0121] Count the total remaining length of the grid lines on the adhesive surface of the tape.
[0122] When the total residual length of the grid line on the adhesive tape is less than a preset length and the surface of the grid line meets a preset condition, it is determined that the adhesion of the grid line at the current position of the photovoltaic solar cell chip is qualified.
[0123] In the present invention, the total residual length of the adhesion surface of the grid lines on the tape is counted and compared with a preset standard, so that the adhesion performance of the grid lines can be quantified and a clear judgment standard can be provided.
[0124] In some embodiments, the preset conditions are specifically:
[0125] There is no peeling, falling off or breaking on the surface of the grid wire.
[0126] In some embodiments, the different locations are specifically:
[0127] The center, edge and / or corner positions of the photovoltaic solar cell chip surface.
[0128] In some embodiments, S5 specifically further includes:
[0129] According to the falling off of the grid line on the tape, the residual traces and the degree of surface damage, the adhesion strength of the grid line is calculated:
[0130]
[0131] Among them, σ represents the adhesion strength of the gate line, O represents the shedding ratio of the gate line, P represents the peeling ratio of the gate line, Q represents the breakage ratio of the gate line, R represents the surface damage degree of the gate line, λ0 represents the constant term, λ1 represents the weight of the shedding ratio of the gate line, λ2 represents the weight of the peeling ratio of the gate line, λ3 represents the weight of the breakage ratio of the gate line, and λ4 represents the weight of the surface damage degree of the gate line.
[0132] Whether the adhesion of the gate line is qualified is determined according to the adhesion strength of the gate line.
[0133] In some embodiments,
[0134] The calculation formula of the grid line shedding ratio is:
[0135]
[0136] Wherein, M represents the number of gate lines that have fallen off, and N represents the total number of gate lines.
[0137] The calculation formula of the peeling ratio of the grid line is:
[0138]
[0139] Wherein, A represents the peeling area of the gate line, and B represents the total area of the gate line.
[0140] The calculation formula of the breakage ratio of the grid line is:
[0141]
[0142] Wherein, I represents the number of broken gate lines.
[0143] The calculation formula of the surface damage degree of the grid line is:
[0144]
[0145] Wherein, J represents the surface damage area of the gate line.
[0146] In the present invention, the calculation formula comprising the shedding ratio, the peeling ratio, the fracture ratio and the surface damage degree is used to comprehensively evaluate the adhesion strength of the grid line. This method takes into account a variety of factors that may affect adhesion, making the evaluation result more scientific and comprehensive. At the same time, the shedding, peeling, fracture and surface damage of the grid line are comprehensively evaluated to help identify potential quality problems and formulate targeted improvement measures. This accurate evaluation method can help manufacturers better control product quality and improve the overall performance and reliability of battery chips.
[0147] Furthermore, the calculated adhesion strength value can provide a quantitative indicator for product quality. This quantitative evaluation method not only helps to clearly determine whether the gate line is qualified, but also can be used to track and optimize the production process, providing a basis for subsequent process adjustments.
[0148] Reference Manual Attached Figure 2 , showing a schematic structural diagram of a grid line adhesion testing device for a battery chip disclosed in an embodiment of the present application.
[0149] The embodiment of the present application provides a grid line adhesion testing device 20 for a battery chip, comprising:
[0150] The acquisition module 201 is used to acquire photovoltaic solar cell chips.
[0151] The pasting module 202 is used to paste the tape on the grid lines of the photovoltaic solar cell chip.
[0152] The pulling module 203 is used to pull up the tape at a constant speed through a linear motor.
[0153] The determination module 204 is used to observe the surface of the adhesive tape and the grid lines through a microscope to determine the detachment of the grid lines on the adhesive tape, the residual traces, and the degree of surface damage.
[0154] The evaluation module 205 is used to evaluate the adhesion of the grid lines according to the falling off of the grid lines on the tape, the residual traces and the degree of surface damage, and determine whether the adhesion of the grid lines is qualified.
[0155] In some embodiments, after obtaining the photovoltaic solar cell chip sample, the method further includes:
[0156] Use cleaning equipment to ultrasonically clean the surface of photovoltaic solar cell chips to remove surface stains and impurities.
[0157] In some embodiments, the pasting module 202 is specifically used to:
[0158] The tape is evenly attached to the grid lines of the photovoltaic solar cell chip.
[0159] Use a rubber roller to roll the tape at a constant speed, apply constant pressure, and fit the tape tightly to the grid line.
[0160] In some embodiments, the evaluation module 205 is specifically configured to:
[0161] Repeat the above test steps at different locations on the surface of the photovoltaic solar cell chip.
[0162] Count the total remaining length of the grid lines on the adhesive surface of the tape.
[0163] When the total residual length of the grid line on the adhesive tape is less than a preset length and the surface of the grid line meets a preset condition, it is determined that the adhesion of the grid line at the current position of the photovoltaic solar cell chip is qualified.
[0164] In some embodiments, the preset conditions are specifically:
[0165] There is no peeling, falling off or breaking on the surface of the grid wire.
[0166] In some embodiments, the different locations are specifically:
[0167] The center, edge and / or corner positions of the photovoltaic solar cell chip surface.
[0168] In some embodiments, the evaluation module 205 is specifically configured to:
[0169] According to the falling off of the grid line on the tape, the residual traces and the degree of surface damage, the adhesion strength of the grid line is calculated:
[0170]
[0171] Among them, σ represents the adhesion strength of the gate line, O represents the shedding ratio of the gate line, P represents the peeling ratio of the gate line, Q represents the breakage ratio of the gate line, R represents the surface damage degree of the gate line, λ0 represents the constant term, λ1 represents the weight of the shedding ratio of the gate line, λ2 represents the weight of the peeling ratio of the gate line, λ3 represents the weight of the breakage ratio of the gate line, and λ4 represents the weight of the surface damage degree of the gate line.
[0172] Whether the adhesion of the gate line is qualified is determined according to the adhesion strength of the gate line.
[0173] In some embodiments, the calculation formula for the gate line drop ratio is:
[0174]
[0175] Wherein, M represents the number of gate lines that have fallen off, and N represents the total number of gate lines.
[0176] The calculation formula of the peeling ratio of the grid line is:
[0177]
[0178] Wherein, A represents the peeling area of the gate line, and B represents the total area of the gate line.
[0179] The calculation formula of the breakage ratio of the grid line is:
[0180]
[0181] Wherein, I represents the number of broken gate lines.
[0182] The calculation formula of the surface damage degree of the grid line is:
[0183]
[0184] Wherein, J represents the surface damage area of the gate line.
[0185] Reference Manual Attached Figure 3 , showing a schematic diagram of the structure of a device disclosed in an embodiment of the present application.
[0186] The embodiment of the present application provides a device 30, including: a processor 301 and a memory 302;
[0187] The memory 302 stores computer-readable instructions, and when the computer-readable instructions are executed by the processor 301 , the above-mentioned grid line adhesion test method of the battery chip is implemented.
[0188] Through the above technical scheme, a photovoltaic solar cell chip is obtained, and the tape is pasted on the grid line of the photovoltaic solar cell chip. The tape is pulled up at a uniform speed by a linear motor, and a standardized test process is established to improve the accuracy of the grid line adhesion test; the surface of the tape and the grid line is observed through a microscope to determine the shedding condition of the grid line on the tape, the residual traces and the degree of surface damage; based on the shedding condition of the grid line on the tape, the residual traces and the degree of surface damage, the adhesion of the grid line is evaluated to determine whether the adhesion of the grid line is qualified; the shedding condition of the grid line on the tape, the residual traces and the degree of surface damage are combined to comprehensively analyze the adhesion of the grid line.
[0189] So far, various embodiments of the present application have been described in detail. In order to avoid obscuring the concept of the present application, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed herein.
[0190] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.
Claims
1. A method for testing the adhesion of grid lines of battery chips. It is characterized in that include: Obtaining photovoltaic solar cell chips; Adhere the adhesive tape to the grid line of the photovoltaic solar cell chip; Pulling up the adhesive tape at a constant speed by a linear motor; Observe the surfaces of the adhesive tape and the grid lines through a microscope to determine the falling off of the grid lines on the adhesive tape, the residual traces, and the degree of surface damage; According to the falling off condition, the residual trace and the surface damage degree of the grid line on the adhesive tape, the adhesion of the grid line is evaluated to determine whether the adhesion of the grid line is qualified.
2. The method for testing the grid line adhesion of a battery chip according to claim 1, It is characterized in that After obtaining the photovoltaic solar cell chip samples, it also includes: The surface of the photovoltaic solar cell chip is ultrasonically cleaned using a cleaning device to remove stains and impurities on the surface.
3. The method for testing the grid line adhesion of a battery chip according to claim 1, It is characterized in that The step of sticking the adhesive tape on the grid line of the photovoltaic solar cell chip specifically includes: Flatly attaching the adhesive tape to the grid lines of the photovoltaic solar cell chip; A rubber roller is used to roll the adhesive tape at a constant speed and apply a constant pressure to closely fit the adhesive tape to the grid line.
4. The method for testing the grid line adhesion of a battery chip according to claim 1, It is characterized in that According to the falling off condition, residual traces and surface damage degree of the grid line on the tape, the adhesion of the grid line is evaluated to determine whether the adhesion of the grid line is qualified, specifically including: Repeating the above test steps at different positions on the surface of the photovoltaic solar cell chip; Counting the total residual length of the grid line on the adhesive surface of the tape; When the total residual length of the grid line on the adhesive tape is less than a preset length and the surface of the grid line meets a preset condition, it is determined that the adhesion of the grid line at the current position of the photovoltaic solar cell chip is qualified.
5. The method for testing the grid line adhesion of a battery chip according to claim 4, It is characterized in that The preset conditions are specifically: The surface of the grid line has no peeling, falling off or breaking marks.
6. The method for testing the grid line adhesion of a battery chip according to claim 4, It is characterized in that The different positions are specifically: The center position, edge position and / or corner position of the surface of the photovoltaic solar cell chip.
7. The method for testing the grid line adhesion of a battery chip according to claim 1, It is characterized in that According to the falling off condition, residual traces and surface damage degree of the grid line on the tape, the adhesion of the grid line is evaluated to determine whether the adhesion of the grid line is qualified, specifically including: According to the falling off condition, residual traces and surface damage degree of the grid wire on the tape, the adhesion strength of the grid wire is calculated: Among them, σ represents the adhesion strength of the gate line, O represents the shedding ratio of the gate line, P represents the peeling ratio of the gate line, Q represents the breaking ratio of the gate line, R represents the surface damage degree of the gate line, and λ 0 represents the constant term, λ 1 The weight of the grid line dropout ratio, λ 2 The weight of the peeling ratio of the grid line, λ 3 The weight of the broken ratio of the grid line, λ 4 The weight representing the surface damage degree of the grid line; Whether the adhesion of the gate line is qualified is determined according to the adhesion strength of the gate line.
8. The method for testing the grid line adhesion of a battery chip according to claim 7, It is characterized in that The calculation formula of the falling-off ratio of the grid line is: Wherein, M represents the number of gate lines that have fallen off, and N represents the total number of gate lines; The calculation formula of the peeling ratio of the grid line is: Where A represents the peeling area of the grid line, and B represents the total area of the grid line; The calculation formula of the breakage ratio of the grid line is: Wherein, I represents the number of broken gate lines; The calculation formula for the surface damage degree of the grid line is: Wherein, J represents the surface damage area of the gate line.
9. A battery chip grid line adhesion test device, It is characterized in that include: An acquisition module, used for acquiring photovoltaic solar cell chips; A pasting module, used for pasting the tape on the grid line of the photovoltaic solar cell chip; A pulling module, used for pulling up the adhesive tape at a uniform speed through a linear motor; A determination module, used to observe the surface of the adhesive tape and the grid lines through a microscope to determine the falling off of the grid lines on the adhesive tape, the residual traces and the degree of surface damage; The evaluation module is used to evaluate the adhesion of the grid lines according to the falling off condition, residual traces and surface damage degree of the grid lines on the adhesive tape, and determine whether the adhesion of the grid lines is qualified.
10. A device, It is characterized in that include: Processor and memory; The memory stores computer-readable instructions, and when the computer-readable instructions are executed by the processor, the grid line adhesion testing method of the battery chip according to any one of claims 1 to 9 is implemented.