Contact type square resistance multi-point measurement method and related equipment

Abstract

The invention discloses a contact type square resistance multi-point measurement method and related equipment, the method is applied to a multi-point measurement device, the method comprises a control unit, a switching unit, a signal acquisition unit and multi-point measurement equipment, the multi-point measurement equipment comprises a test board, a motion motor and a measurement structure, and the motion motor is connected with the measurement structure. The method comprises the steps that after it is detected that a to-be-tested silicon wafer is placed on a test board, a control unit drives a motion motor to move, and a measurement structure makes contact with the to-be-tested silicon wafer; the switching unit and the signal acquisition unit are used to successively acquire voltage signals measured by the plurality of measuring probes included in the measuring structure so as to complete the test of the surface square resistance of the silicon wafer to be tested. According to the invention, after the motion motor drives the measuring structure to contact with the to-be-tested silicon wafer, the switching unit and the signal acquisition unit use the same measuring channel to sequentially obtain the voltage signals measured by the plurality of measuring probes, so that the accuracy of the voltage signals and the testing efficiency are improved.

Description

Technical Field

[0001] The present application relates to the field of measurement technology, and in particular to a contact-type square resistance multi-point measurement method and related equipment. Background Art

[0002] In the field of measuring the surface square resistance of silicon wafers in the solar cell industry, it is usually necessary to test multiple points to determine the uniformity of the silicon wafer surface. The commonly used test method is that a single probe moves the X, Y, and Z axes through its own motor to measure each point, or the test probe remains stationary and the motor drives the test platform and the silicon wafer to move together to complete the measurement of each point.

[0003] However, the commonly used testing methods mentioned above have the disadvantage of large test equipment size because they contain multiple moving parts, namely multiple motors. On the other hand, due to the slow movement speed of the moving parts, it takes too long to test a silicon wafer, affecting the test cost and efficiency.

[0004] Therefore, how to improve the test efficiency of silicon wafer surface resistance measurement is an urgent problem to be solved. Summary of the invention

[0005] In order to improve the test efficiency of silicon wafer surface square resistance measurement, the embodiments of the present application provide a contact square resistance multi-point measurement method and system, a multi-point measurement device, an electronic device, a computer-readable storage medium, and a computer program product.

[0006] In the first aspect, in order to solve the above technical problems, the present application provides a contact-type square resistance multi-point measurement method, which is applied to a multi-point measurement device, characterized in that the multi-point measurement device includes a control unit, a signal acquisition unit and a multi-point measurement device, the multi-point measurement device is connected to the control unit and the signal acquisition unit, and the multi-point measurement device includes a test bench, a motion motor and a measurement structure; the method includes:

[0007] After detecting that a silicon wafer to be tested is placed on the test bench, the control unit drives the motion motor to move so that the measuring structure contacts the silicon wafer to be tested;

[0008] The switching unit and the signal acquisition unit are used to sequentially acquire voltage signals measured by a plurality of measuring probes included in the measuring structure to complete the test of the surface square resistance of the silicon wafer to be tested.

[0009] The beneficial effects are:

[0010] In the technical solution provided in the embodiments of the present application, after detecting that a silicon wafer to be tested is placed on the test bench, the motion motor is driven to move by the control unit so that the measuring structure contacts the silicon wafer to be tested. In this way, only one motion motor can be used to drive the measuring structure to move for test preparation, which reduces the configuration of moving parts, saves hardware space, and simplifies the movement process. After the measuring structure contacts the silicon wafer to be tested, the switching unit and the signal acquisition unit are used to sequentially obtain the voltage signals measured by the multiple measuring probes included in the measuring structure to complete the test of the surface square resistance of the silicon wafer to be tested. In this way, the same measurement channel of the signal acquisition unit can sequentially obtain the voltage signals measured by the multiple measuring probes, thereby avoiding the differences caused by different channels and improving the accuracy of the measurement data, i.e., the voltage signal.

[0011] In a second aspect, the present invention provides a multi-point measurement device, which applies the contact-type square resistance multi-point measurement method, and includes a base, a test bench, a motion motor and a measurement structure;

[0012] The test bench and the motion motor are arranged on the base, and the measuring structure is connected to the motion motor and arranged opposite to the test bench, so that the motion motor can move the measuring structure to contact the silicon wafer to be tested placed on the test bench;

[0013] The measurement structure includes a plurality of measurement probes, and the plurality of measurement probes are arranged according to preset configuration requirements.

[0014] In a third aspect, the present invention provides a contact-type square resistance multi-point measurement system, comprising a motion unit and a test unit;

[0015] A motion unit, configured to drive the motion motor to move through the control unit after detecting that a silicon wafer to be tested is placed on the test bench, so that the measuring structure contacts the silicon wafer to be tested;

[0016] The testing unit is used to use the switching unit and the signal acquisition unit to sequentially obtain the voltage signals measured by the multiple measuring probes included in the measuring structure to complete the test of the surface square resistance of the silicon wafer to be tested.

[0017] In a fourth aspect, the present application also provides an electronic device, comprising: one or more processors; a storage device for storing one or more programs, wherein when the one or more programs are executed by the one or more processors, the electronic device implements the contact-type square resistance multi-point measurement method as described above.

[0018] In a fifth aspect, the present application further provides a computer-readable storage medium having computer-readable instructions stored thereon, which, when executed by a processor of a computer, enables the computer to execute the contact-type square resistance multi-point measurement method as described above.

[0019] In a sixth aspect, the present application further provides a computer program product or a computer program, the computer program product or the computer program including computer instructions, the computer instructions being stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the contact-type square resistance multi-point measurement method provided in the above-mentioned various optional embodiments.

[0020] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0022] Figure 1 It is a schematic diagram of an implementation environment involved in this application;

[0023] Figure 2 is a flow chart of a contact-type square resistance multi-point measurement method shown in an exemplary embodiment of the present application;

[0024] Figure 3 is a schematic diagram of a multi-point measurement device using a contact-type square resistance multi-point measurement method, shown in an exemplary embodiment of the present application;

[0025] Figure 4 is a schematic diagram of test points of a silicon wafer to be tested, shown in an exemplary embodiment of the present application;

[0026] Figure 5 is a block diagram of a contact-type square resistance multi-point measurement system shown in an exemplary embodiment of the present application;

[0027] Figure 6 It is a structural diagram of a computer system suitable for implementing an electronic device of an embodiment of the present application. DETAILED DESCRIPTION

[0028] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0029] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0030] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0031] The term "multiple" as used in this application refers to two or more than two. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the related objects are in an "or" relationship.

[0032] In order to solve the above problems, the embodiments of the present application propose a contact-type square resistance multi-point measurement method and system, a multi-point measurement device, an electronic device, and a computer-readable storage medium, which mainly involve the contact-type square resistance multi-point measurement technology included in the silicon wafer measurement technology. These embodiments will be described in detail below.

[0033] First see Figure 1 , Figure 1 1 is a schematic diagram of an implementation environment involved in the present application. The implementation environment is a multi-point measurement device, including a control unit 110, a switching unit 120, a signal acquisition unit 130 and a multi-point measurement device 140. The multi-point measurement device 140 communicates with the control unit 110, the switching unit 120 and the signal acquisition unit 130 via a wired or wireless network. The multi-point measurement device 140 includes a test bench 141, a motion motor 142 and a measurement structure 143. The motion motor 142 is connected to the measurement structure 143.

[0034] The control unit 110 is used to drive the motion motor 142 to move after detecting that a silicon wafer to be tested is placed on the test bench 141, so that the measurement structure 143 contacts the silicon wafer to be tested; the switching unit 120 and the signal acquisition unit 130 are used to sequentially obtain the voltage signals measured by the multiple measurement probes included in the measurement structure 143 to complete the test of the surface square resistance of the silicon wafer to be tested. Compared with the measurement scheme of the surface square resistance of silicon wafers in the prior art, the contact square resistance multi-point measurement method provided by the present implementation environment can reduce the configuration of moving parts, save hardware space, and improve the accuracy and efficiency of measurement.

[0035] It should be noted that Figure 1 The control unit 110 in the implementation environment shown can be a terminal such as a server that can realize the regulation function. The server can be an independent server or a cloud server that provides cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN), as well as basic cloud computing services such as big data and artificial intelligence platforms. No restrictions are made here.

[0036] Figure 2 FIG. 1 is a flow chart of a contact-type square resistance multi-point measurement method shown in an exemplary embodiment of the present application. The method can be applied to Figure 1 The implementation environment shown in Figure 1 The multi-point measurement device in the embodiment shown is specifically implemented. In other implementation environments, the method can be implemented by devices in other implementation environments, and this embodiment does not limit this.

[0037] like Figure 2 As shown, in an exemplary embodiment, the contact type square resistance multi-point measurement method may include steps S201 to S202, which are described in detail as follows:

[0038] Step S201 , after detecting that a silicon wafer to be tested is placed on the test bench, a control unit drives a motion motor to move so that a measuring structure contacts the silicon wafer to be tested.

[0039] After the silicon wafer to be tested is placed on the test bench, the contact-type square resistance multi-point measurement method provided in the present application is started for the silicon wafer to be tested. First, the test bench sends a test signal to the control unit. The control unit receives the test signal and controls the motion motor to operate based on the test signal. The operating motion motor drives the connected measurement structure to perform simple movements until the measurement structure contacts the silicon wafer to be tested and contact measurement can be performed, and then the motion motor is controlled to stop operating.

[0040] Step S202 , using the switching unit and the signal acquisition unit, sequentially acquire voltage signals measured by a plurality of measuring probes included in the measuring structure to complete the test of the surface square resistance of the silicon wafer to be tested.

[0041] After the measurement structure contacts the silicon wafer to be tested, the measurement preparation phase is completed and the measurement phase begins. In this phase, the switching unit is used to control the signal acquisition unit to sequentially obtain the voltage signals measured by the multiple measurement probes included in the measurement structure to complete the test of the surface square resistance of the silicon wafer to be tested.

[0042] As can be seen from the above, in the method provided in this embodiment, only one motion motor is used to drive the measurement structure to move for test preparation, which reduces the configuration of moving parts and saves hardware space, while simplifying the movement process and improving test efficiency and cost; and after the measurement structure contacts the silicon wafer to be tested, the switching unit is used to enable the signal acquisition unit to sequentially obtain the voltage signals measured by the multiple measurement probes included in the measurement structure to complete the test of the surface square resistance of the silicon wafer to be tested, so that the same measurement channel of the signal acquisition unit can sequentially obtain the voltage signals measured by the multiple measurement probes respectively, which can avoid the differences caused by different channels and improve the accuracy of the measurement data, i.e., the voltage signal.

[0043] In addition, the present embodiment can realize voltage range switching and output current adjustment through the control unit, thereby avoiding the situation in which the traditional tester lowers the probe of the test head to contact the workpiece under test. If the measurement result is abnormal, manual voltage range switching and output current adjustment are required, thereby reducing the cost and operational errors caused by manual labor.

[0044] In an exemplary embodiment of the present application, a measuring structure and a test bench are arranged opposite to each other in a multi-point measuring device of a multi-point measuring apparatus, so that a motion motor only needs to drive the measuring structure to move in a simple straight line to make the measuring structure contact with a silicon wafer to be tested, and the steps may specifically include:

[0045] After detecting that a silicon wafer to be tested is placed on the test bench, the control unit generates a movement command and transmits it to the motion motor;

[0046] The motion motor drives the measuring structure to move toward the test bench based on the moving instruction, so that the measuring probe contacts the silicon wafer to be tested.

[0047] In this embodiment, after the silicon wafer to be tested is placed on the test bench, the contact-type square resistance multi-point measurement method provided in this application is performed on the silicon wafer to be tested. First, the test bench sends a test signal to the control unit. After receiving the test signal, the control unit generates a corresponding movement instruction and transmits it to the motion motor. Since the measurement structure and the test bench are arranged relative to each other, that is, the measurement structure and the silicon wafer to be tested are in the same straight line, the motion motor only needs to drive the measurement structure to move in a straight line to a position where it can contact the silicon wafer to be tested.

[0048] In this way, the present embodiment uses only one motion motor to drive the measuring structure to move for test preparation, thereby reducing the configuration of moving parts and saving hardware space, while simplifying the motion process and improving test efficiency and cost.

[0049] In an exemplary embodiment of the present application, a switching unit is used to control a signal acquisition unit to sequentially acquire voltage signals measured by a plurality of measurement probes included in a measurement structure, and the acquisition order is determined by the test requirements corresponding to the silicon wafer to be tested. The specific steps may include:

[0050] Obtain preset test requirements and obtain the switching order based on the test requirements;

[0051] The switching unit and the signal acquisition unit are used to sequentially acquire voltage signals measured by a plurality of measuring probes included in the measuring structure according to the switching sequence.

[0052] In this embodiment, when it is detected that a silicon wafer to be tested is placed on the test bench, the preset test requirements corresponding to the silicon wafer to be tested are obtained, and the switching order for multiple measurement probes is determined based on the test requirements. Thereafter, the signal acquisition unit obtains the voltage signals measured by the multiple measurement probes included in the measurement structure in sequence according to the switching order.

[0053] In another exemplary embodiment, after determining the switching sequence, the switching unit switches the measuring probes connected to the signal acquisition unit according to the switching sequence to perform contact measurement in sequence, and the steps may specifically include:

[0054] Using the switching unit, based on the switching sequence, the measuring probes connected to the signal acquisition unit are switched among the multiple measuring probes to serve as the target measuring probes in turn;

[0055] After the target measurement probe is connected to the signal acquisition unit, the target measurement probe is controlled to measure and obtain a corresponding voltage signal;

[0056] The signal acquisition unit is used to sequentially acquire the voltage signals measured by each target measurement probe.

[0057] In this embodiment, the switching unit switches the measuring probe connected to the signal acquisition unit among the multiple measuring probes based on the switching sequence, and sequentially uses them as the target measuring probes. While determining the target probe, the control unit powers the target measuring probe, thereby controlling the target measuring probe to perform measurement, obtains the corresponding voltage signal, and then switches to the next measuring probe as the target measuring probe based on the switching sequence. In this process, the signal acquisition unit sequentially obtains the voltage signals measured by each target measuring probe.

[0058] It can be seen from the above embodiments that the contact-type square resistance multi-point measurement method provided by the present application can quickly switch between multiple measurement probes of the measurement structure, which not only improves the measurement rate, but also saves the number of channels for voltage signal acquisition, and ensures that all measurement probes use the same measurement channel, thereby avoiding differences caused by different channels and reducing data errors.

[0059] In an exemplary embodiment of the present application, after the signal acquisition unit acquires the voltage signal, it transmits it to the control unit for subsequent data processing, so as to put the measured data, i.e., the voltage signal, into practical application, for example, to determine the uniformity of the surface of the silicon wafer to be measured, and the specific steps may include:

[0060] After the signal acquisition unit obtains the voltage signals measured by the multiple measuring probes, it performs operational amplification processing on the voltage signals to obtain the target voltage signals;

[0061] The target voltage signal is transmitted to the control unit.

[0062] In another exemplary embodiment, after the switching unit switches to apply all the measuring probes, the measurement of the silicon wafer to be measured is ended, and the specific steps may include:

[0063] monitoring the signal quantity of the target voltage signal received by the control unit;

[0064] After the number of signals reaches a preset number corresponding to the plurality of measuring probes, the motion motor is controlled to move to separate the silicon wafer to be measured and the measuring structure.

[0065] In this embodiment, the number of voltage signals acquired by the monitoring control unit from the signal acquisition unit is used to determine whether the test on the silicon wafer to be tested has been completed. After the number of signals reaches a preset number corresponding to multiple measuring probes, for example, 9 measuring probes correspond to 9 groups of voltage signals, the motion motor is controlled to drive the measuring structure to move to separate the silicon wafer to be tested and the measuring probe until the initial state of the measuring device is restored. In this way, excessive manual intervention is avoided during the measurement and data transmission of the silicon wafer to be tested, data errors are reduced, and measurement efficiency is improved.

[0066] See also Figure 3 , Figure 3 FIG. 1 is a schematic diagram of a multi-point measurement device using a contact-type square resistance multi-point measurement method, shown in an exemplary embodiment of the present application. Figure 3 As shown, the multi-point measurement device includes a base, a test bench, a motion motor and a measurement structure;

[0067] The test bench and the motion motor are arranged on the base, and the measuring structure is connected to the motion motor and arranged opposite to the test bench, so that the motion motor can move the measuring structure to contact the silicon wafer to be tested placed on the test bench;

[0068] The measurement structure includes a plurality of measurement probes, and the plurality of measurement probes are arranged according to preset configuration requirements.

[0069] In another exemplary embodiment provided in the present application, the measurement structure may include 9 measurement probes, which can meet the requirements of the square resistance measurement of the surface of the silicon wafer of the contact solar cell.

[0070] See also Figure 4 , Figure 4 FIG. 1 is a schematic diagram of test points of a silicon wafer to be tested, shown in an exemplary embodiment of the present application. In this embodiment, the preset configuration requirements for determining the arrangement pattern of the multiple measurement probes correspond to the test points of the silicon wafer to be tested, such as Figure 4 As shown, the nine test points of the silicon wafer to be tested are evenly arranged, so there are also nine measurement probes that are evenly arranged.

[0071] Figure 5 FIG. 5 is a block diagram of a contact type square resistance multi-point measurement system 500 shown in an exemplary embodiment of the present application. Figure 5 As shown, the system includes:

[0072] The motion unit 501 is used to detect that a silicon wafer to be tested is placed on the test bench, and then drive the motion motor to move through the control unit so that the measuring structure contacts the silicon wafer to be tested;

[0073] The test unit 502 is used to use the switching unit and the signal acquisition unit to sequentially obtain the voltage signals measured by the multiple measurement probes included in the measurement structure to complete the test of the surface square resistance of the silicon wafer to be tested.

[0074] The device applies the contact-type square resistance multi-point measurement method provided by the present application. After detecting that a silicon wafer to be tested is placed on the test bench, the motion unit 501 drives the motion motor to move through the control unit so that the measurement structure contacts the silicon wafer to be tested. In this way, only one motion motor can be used to drive the measurement structure to move for test preparation, which reduces the configuration of moving parts, saves hardware space, and simplifies the movement process. After the measurement structure contacts the silicon wafer to be tested, the test unit 502 uses the switching unit and the signal acquisition unit to sequentially obtain the voltage signals measured by the multiple measurement probes included in the measurement structure to complete the test of the surface square resistance of the silicon wafer to be tested. In this way, the same measurement channel of the signal acquisition unit can sequentially obtain the voltage signals measured by the multiple measurement probes, thereby avoiding the differences caused by different channels and improving the accuracy of the measurement data, i.e., the voltage signal.

[0075] In another exemplary embodiment, the measuring structure is arranged relative to the test bench; the motion unit 501 is also used to detect that a silicon wafer to be tested is placed on the test bench, and the control unit generates a moving instruction and transmits it to the motion motor; the motion motor drives the measuring structure to move toward the test bench based on the moving instruction, so that the measuring probe contacts the silicon wafer to be tested.

[0076] In another exemplary embodiment, the test unit 502 is also used to obtain a preset test requirement and obtain a switching order based on the test requirement; using the switching unit and the signal acquisition unit, the voltage signals measured by the multiple measurement probes included in the measurement structure are obtained in sequence according to the switching order.

[0077] In another exemplary embodiment, the test unit 502 is further used to use the switching unit to switch the measurement probes connected to the signal acquisition unit among the multiple measurement probes based on the switching sequence, and use them as target measurement probes in turn; after the target measurement probe is connected to the signal acquisition unit, control the target measurement probe to measure and obtain a corresponding voltage signal; and use the signal acquisition unit to obtain the voltage signals measured by each target measurement probe in turn.

[0078] In another exemplary embodiment, the apparatus further comprises:

[0079] The transmission unit is used to perform operational amplification processing on the voltage signals measured by the multiple measuring probes after the signal acquisition unit acquires the voltage signals, so as to obtain the target voltage signals; and transmit the target voltage signals to the control unit.

[0080] In another exemplary embodiment, the apparatus further comprises:

[0081] The measurement end unit is used to monitor the signal quantity of the target voltage signal received by the control unit; after the signal quantity reaches a preset quantity corresponding to the multiple measurement probes, the motion motor is controlled to move to separate the silicon wafer to be measured and the measurement structure.

[0082] It should be noted that the contact-type square resistance multi-point measurement system provided in the above embodiment and the contact-type square resistance multi-point measurement method provided in the above embodiment belong to the same concept, wherein the specific manner in which each module and unit performs the operation has been described in detail in the method embodiment, and will not be repeated here. In practical applications, the contact-type square resistance multi-point measurement system provided in the above embodiment can allocate the above functions to different functional modules as needed, that is, divide the internal structure of the device into different functional modules to complete all or part of the functions described above, and this is not limited here.

[0083] An embodiment of the present application also provides an electronic device, including: one or more processors; a storage device for storing one or more programs, when the one or more programs are executed by one or more processors, the electronic device implements the contact-type square resistance multi-point measurement method provided in the above-mentioned embodiments.

[0084] Figure 6 The structure diagram of the computer system suitable for implementing the electronic device of the embodiment of the present application is shown. It should be noted that: Figure 6 The computer system 600 of the electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0085] like Figure 6 As shown, the computer system 600 includes a central processing unit (CPU) 601, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 602 or the program loaded from the storage part 608 to the random access memory (RAM) 603, such as executing the method in the above embodiment. In the RAM 603, various programs and data required for system operation are also stored. The CPU 601, ROM 602 and RAM 603 are connected to each other through a bus 604. An input / output (I / O) interface 605 is also connected to the bus 604.

[0086] The following components are connected to the I / O interface 605: an input section 606 including a keyboard, a mouse, etc.; an output section 607 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 608 including a hard disk, etc.; and a communication section 609 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 609 performs communication processing via a network such as the Internet. A drive 610 is also connected to the I / O interface 605 as needed. A removable medium 611, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 610 as needed so that a computer program read therefrom is installed into the storage section 608 as needed.

[0087] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication section 609, and / or installed from a removable medium 611. When the computer program is executed by a central processing unit (CPU) 601, various functions defined in the system of the present application are executed.

[0088] It should be noted that the computer-readable medium shown in the embodiment of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, wherein a computer-readable computer program is carried. This propagated data signal may take a variety of forms, including but not limited to an electromagnetic signal, an optical signal, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate or transmit a program for use by or in conjunction with an instruction execution system, apparatus or device. A computer program contained on a computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0089] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. Among them, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and the above-mentioned module, a program segment or a part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart, can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0090] The units involved in the embodiments described in this application may be implemented by software or hardware, and the units described may also be set in a processor. The names of these units do not, in some cases, constitute limitations on the units themselves.

[0091] Another aspect of the present application further provides a computer-readable storage medium on which a computer program is stored, and when the computer program is executed by a processor, the contact-type square resistance multi-point measurement method as described above is implemented. The computer-readable storage medium may be included in the electronic device described in the above embodiment, or may exist independently without being assembled into the electronic device.

[0092] Another aspect of the present application also provides a computer program product or a computer program, which includes a computer instruction stored in a computer-readable storage medium. A processor of a computer device reads the computer instruction from the computer-readable storage medium, and the processor executes the computer instruction, so that the computer device executes the contact-type square resistance multi-point measurement method provided in each of the above embodiments.

[0093] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A contact type square resistance multi-point measurement method, applied to a multi-point measurement device, characterized in that: The multi-point measurement device comprises a control unit, a switching unit, a signal acquisition unit and a multi-point measurement device, wherein the multi-point measurement device is connected to the control unit, the switching unit and the signal acquisition unit, and the multi-point measurement device comprises a test bench, a motion motor and a measurement structure, wherein the motion motor is connected to the measurement structure; the method comprises: After detecting that a silicon wafer to be tested is placed on the test bench, the control unit drives the motion motor to move so that the measuring structure contacts the silicon wafer to be tested; The switching unit and the signal acquisition unit are used to sequentially acquire voltage signals measured by a plurality of measuring probes included in the measuring structure to complete the test of the surface square resistance of the silicon wafer to be tested.

2. The method according to claim 1, characterized in that The measuring structure is arranged opposite to the test bench; after detecting that a silicon wafer to be tested is placed on the test bench, the control unit drives the motion motor to move so that the measuring structure contacts the silicon wafer to be tested, including: After detecting that a silicon wafer to be tested is placed on the test bench, the control unit generates a movement instruction and transmits it to the motion motor; The motion motor drives the measuring structure to move toward the test bench based on the movement instruction, so that the measuring probe contacts the silicon wafer to be tested.

3. The method according to claim 1, characterized in that The using the switching unit and the signal acquisition unit to sequentially obtain voltage signals measured by a plurality of measuring probes included in the measuring structure comprises: Obtaining preset test requirements, and obtaining a switching order based on the test requirements; The switching unit and the signal acquisition unit are utilized to sequentially acquire voltage signals measured by a plurality of measuring probes included in the measuring structure according to the switching sequence.

4. The method according to claim 3, characterized in that The using the switching unit and the signal acquisition unit to sequentially acquire voltage signals measured by a plurality of measuring probes included in the measuring structure according to the switching sequence includes: Using the switching unit, based on the switching sequence, switching the measuring probes that are connected to the signal acquisition unit among the plurality of measuring probes to serve as target measuring probes in turn; After the target measurement probe is connected to the signal acquisition unit, controlling the target measurement probe to measure and obtain a corresponding voltage signal; The signal acquisition unit is used to sequentially acquire the voltage signals measured by each target measurement probe.

5. The method according to claim 1, characterized in that: The method further comprises: After the signal acquisition unit acquires the voltage signals measured by the multiple measuring probes, it performs operational amplification processing on the voltage signals to obtain a target voltage signal; The target voltage signal is transmitted to a control unit.

6. The method according to claim 5, characterized in that The method further comprises: monitoring the signal quantity of the target voltage signal received by the control unit; After the number of the signals reaches a preset number corresponding to the plurality of measuring probes, the motion motor is controlled to move so as to separate the silicon wafer to be measured and the measuring structure.

7. A multi-point measurement device, applying the contact-type square resistance multi-point measurement method according to any one of claims 1 to 6, the multi-point measurement device comprising a base, a test bench, a motion motor and a measurement structure; The test bench and the motion motor are arranged on the base, and the measuring structure is connected to the motion motor and arranged opposite to the test bench, so that the motion motor can move the measuring structure to contact the silicon wafer to be tested placed on the test bench; The measurement structure includes a plurality of measurement probes, and the plurality of measurement probes are arranged according to preset configuration requirements.

8. The multi-point measurement device according to claim 7, characterized in that: The measuring structure comprises 9 measuring probes.

9. A contact type square resistance multi-point measurement system, applying the contact type square resistance multi-point measurement method according to any one of claims 1 to 6, the system comprising: A motion unit, configured to drive the motion motor to move through the control unit after detecting that a silicon wafer to be tested is placed on the test bench, so that the measuring structure contacts the silicon wafer to be tested; The testing unit is used to use the switching unit and the signal acquisition unit to sequentially obtain the voltage signals measured by the multiple measuring probes included in the measuring structure to complete the test of the surface square resistance of the silicon wafer to be tested.

10. A computer-readable storage medium, characterized in that: Computer-readable instructions are stored thereon, and when the computer-readable instructions are executed by a processor of a computer, the computer is enabled to execute the contact-type square resistance multi-point measurement method according to any one of claims 1 to 7.

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