Periodic management and control method, device and equipment of PCB (Printed Circuit Board), storage medium and product
By classifying and splicing PCB optical boards and recording production link data using QR codes, the problems of low production efficiency and poor maintenance effects of PCB boards are solved, efficient cycle control and full life cycle monitoring are achieved, and user stickiness is improved.
Patent Information
- Application Number
- CN202411250599.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2024-12-13
AI Technical Summary
In the prior art, PCB boards have low production efficiency and poor maintenance effects, resulting in low user viscosity.
By sorting and splicing PCB optical boards, recording production link data using QR codes, the cycle control of the factory boards can be achieved, and production efficiency and maintenance results can be improved.
It improves the production efficiency of PCB boards, reduces production costs, and improves the maintenance effect of factory boards through full life cycle control, enhancing user stickiness.
Smart Images

Figure CN119130248A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit board quality control, and in particular to a PCB board cycle control method, device, equipment, storage medium and product. Background Art
[0002] At present, the industry has not formed a complete and reasonable management system for the life cycle of PCB boards (Printed Circuit Boards), so there are the following technical problems. First, when the circuit boards are produced, for the same batch of circuit boards but applied to different solutions, the production method is usually to customize the circuit boards for each solution separately, which leads to low production efficiency. Second, after the circuit boards are delivered, due to the lack of proactive maintenance of the circuit boards by the manufacturer, users cannot estimate the service life of the circuit boards (or even if the users know the service life of the circuit boards, due to the lack of proactive maintenance by the manufacturer, the users may look for other suppliers), resulting in low user stickiness. Summary of the invention
[0003] The main purpose of this application is to provide a PCB board cycle control method, device, equipment, storage medium and product, aiming to solve the technical problems of low production efficiency and poor maintenance effect of PCB boards in the prior art.
[0004] To achieve the above object, the present application provides a PCB board cycle control method, the method comprising the following steps:
[0005] Classifying PCB light boards, wherein the PCB light boards are provided with a two-dimensional code, wherein the two-dimensional code is a printed two-dimensional code or a labeled two-dimensional code;
[0006] Obtaining edge shapes corresponding to the classified PCB bare panels, and merging the classified PCB bare panels according to the edge shapes to obtain PCB panels;
[0007] Welding the PCB panel as a whole based on the overall BOM of the PCB panel, and testing the PCB panel after welding;
[0008] Scan the QR code to record the production process data of the PCB panel in the cloud, and perform periodic control on each factory board in the PCB panel based on the production process data.
[0009] In one embodiment, the step of classifying the PCB light boards includes:
[0010] Classifying the PCB boards according to their board layers, so as to classify the PCB boards with the same board layers into one category, thereby obtaining the classified PCB boards;
[0011] The first-classified PCB light boards are secondarily classified according to the component distribution of the first-classified PCB light boards to obtain classified PCB light boards.
[0012] In one embodiment, the step of obtaining edge shapes corresponding to the classified PCB bare panels and merging the classified PCB bare panels according to the edge shapes to obtain PCB panels includes:
[0013] Determining a welding container according to welding parameters of a welding device, wherein the welding parameters are used to represent a maximum weldable area of the welding device;
[0014] According to the edge shapes corresponding to the classified PCB bare boards, the classified PCB bare boards are spliced into the welding container for merging to obtain PCB panels.
[0015] In one embodiment, the step of splicing the classified PCB bare boards into the welding container according to the edge shapes corresponding to the classified PCB bare boards to obtain the PCB splicing comprises:
[0016] Performing image processing on the image data of the classified PCB light board, and acquiring the edge morphology corresponding to the classified PCB light board based on the processed image data;
[0017] Shape matching is performed on the classified PCB bare panels according to the edge morphology, and based on the matching result, the classified PCB bare panels are spliced into the welding container for merging to obtain a PCB splice.
[0018] In one embodiment, the step of welding the PCB panel as a whole based on the overall BOM of the PCB panel and testing the PCB panel after welding comprises:
[0019] Merging the welding BOMs of the bare PCB boards in the PCB panel into an overall BOM, and welding the PCB panel as a whole according to the overall BOM;
[0020] After the welding is completed, the PCB board with the components welded thereon is taken out from the welding container, and the PCB board with the components welded thereon is tested.
[0021] In one embodiment, the step of scanning the QR code to record the production process data of the PCB panel in the cloud, and performing periodic control on each factory board in the PCB panel based on the production process data includes:
[0022] Scan the QR code to record the production data of the PCB panel in the cloud, where the production data contains a corresponding timestamp;
[0023] Determine whether the factory boards in the PCB panel have exceeded the shelf life within a preset time according to the timestamp, and send a maintenance notification to the corresponding customer if the shelf life has exceeded the preset time;
[0024] When the factory board fails, the production process data of the factory board can be traced back according to the two-dimensional code to troubleshoot and locate the fault of the factory board.
[0025] In addition, to achieve the above purpose, the present application also proposes a cycle control device for a PCB board, the cycle control device for a PCB board comprising:
[0026] A light board classification module is used to classify PCB light boards, wherein the PCB light boards are provided with a two-dimensional code, and the two-dimensional code is a printed two-dimensional code or a labeled two-dimensional code;
[0027] A light board merging module is used to obtain the edge shapes corresponding to the classified PCB light boards, and merge the classified PCB light boards according to the edge shapes to obtain PCB panels;
[0028] A welding test module, used to weld the PCB panel as a whole based on the overall BOM of the PCB panel, and to test the PCB panel after welding;
[0029] The cycle control module is used to scan the QR code to record the production process data of the PCB panel in the cloud, and perform cycle control on each factory board in the PCB panel based on the production process data.
[0030] In addition, to achieve the above-mentioned purpose, the present application also proposes a cycle control device for a PCB board, the device comprising: a memory, a processor, and a cycle control program for a PCB board stored on the memory and executable on the processor, the cycle control program for the PCB board being configured to implement the steps of the cycle control method for the PCB board as described above.
[0031] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium, and on which is stored a cycle control program for a PCB board. When the cycle control program for a PCB board is executed by a processor, the steps of the cycle control method for a PCB board as described above are implemented.
[0032] In addition, to achieve the above-mentioned purpose, the present invention also provides a computer program product, which includes a cycle control program for a PCB board, and when the cycle control program for a PCB board is executed by a processor, the steps of the cycle control method for a PCB board as described above are implemented.
[0033] This application classifies PCB light boards, and the PCB light boards are provided with QR codes, and the QR codes are printed QR codes or labeled QR codes; the edge shapes corresponding to the classified PCB light boards are obtained, and the classified PCB light boards are merged according to the edge shapes to obtain PCB panels; the PCB panels are welded as a whole based on the overall BOM of the PCB panels, and the PCB panels are tested after welding; the QR codes are scanned to record the production link data of the PCB panels in the cloud, and the various factory boards in the PCB panels are periodically controlled based on the production link data. Compared with the traditional PCB board cycle control method, since the above method of this application first classifies the PCB light boards, and then merges the classified PCB light boards into panels before welding the components, it improves the production efficiency and reduces the production cost; in addition, this application also records the production link data of the factory boards in the cloud through QR codes, thereby realizing the full life cycle control of the factory boards and improving the maintenance effect of the factory boards. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] Figure 1 A schematic diagram of the structure of a PCB board cycle control device in the hardware operating environment involved in the embodiment of the present application;
[0035] Figure 2 This is a flow chart of the first embodiment of the cycle control method of the PCB board of this application;
[0036] Figure 3 This is a flow chart of the second embodiment of the cycle control method of the PCB board of this application;
[0037] Figure 4 This is a flow chart of the third embodiment of the cycle control method of the PCB board of the present application;
[0038] Figure 5 This is a structural block diagram of the first embodiment of the cycle control device of the PCB board of this application.
[0039] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0040] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0041] Reference Figure 1 , Figure 1 This is a schematic diagram of the structure of the periodic control equipment of the PCB board in the hardware operating environment involved in the embodiment of the present application.
[0042] like Figure 1 As shown, the cycle control device of the PCB board may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Among them, the communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a wireless fidelity (Wireless-Fidelity, Wi-Fi) interface). The memory 1005 may be a high-speed random access memory (Random Access Memory, RAM), or a stable non-volatile memory (Non-Volatile Memory, NVM), such as a disk storage. The memory 1005 may also be a storage device independent of the aforementioned processor 1001.
[0043] Those skilled in the art will understand that Figure 1 The structure shown in does not constitute a limitation on the cycle control device of the PCB board, and may include more or fewer components than shown in the figure, or a combination of certain components, or a different arrangement of components.
[0044] like Figure 1 As shown, the memory 1005 as a storage medium may include an operating system, a network communication module, a user interface module, and a cycle control program of a PCB board.
[0045] exist Figure 1 In the cycle control device of the PCB board shown, the network interface 1004 is mainly used for data communication with the network server; the user interface 1003 is mainly used for data interaction with the user; the processor 1001 and the memory 1005 in the cycle control device of the PCB board of the present application can be set in the cycle control device of the PCB board, and the cycle control device of the PCB board calls the cycle control program of the PCB board stored in the memory 1005 through the processor 1001, and executes the cycle control method of the PCB board provided in the embodiment of the present application.
[0046] The present application embodiment provides a cycle control method for a PCB board, referring to Figure 2 , Figure 2 This is a flow chart of the first embodiment of the cycle control method of the PCB board of the present application.
[0047] In this embodiment, the cycle control method of the PCB board includes the following steps:
[0048] Step S10: Classifying the PCB light boards, on which the PCB light boards are provided with a two-dimensional code, which is a printed two-dimensional code or a labeled two-dimensional code.
[0049] It should be noted that the execution subject of the method of this embodiment can be a terminal device with cycle control, data processing and program running functions, or an electronic device with the same or similar functions, such as the cycle control device of the above-mentioned PCB board. The following takes the cycle control device of the PCB board (hereinafter referred to as the control device) as an example to illustrate this embodiment and the following embodiments.
[0050] It is understandable that the above-mentioned PCB optical board is the basic material for making printed circuit boards (PCB boards). It transfers the designed circuit pattern to the printed circuit board through light and chemical reactions to form connections between conductive circuits and electronic components.
[0051] It should be understood that when designing a QR code, the actual size and layout of the PCB board must be taken into account to ensure that the QR code can be fully and clearly presented on the PCB board. Different PCB materials and processes may affect the recognition effect of the QR code, so it is necessary to adjust and optimize according to the specific situation during the actual operation. After the QR code is added, a scanning test can be performed to verify the recognition effect of the QR code. If recognition problems are found, adjustments and improvements should be made in a timely manner.
[0052] Step S20: obtaining edge shapes corresponding to the classified PCB bare panels, and merging the classified PCB bare panels according to the edge shapes to obtain PCB panels.
[0053] It should be noted that the edge morphology corresponding to the above-classified PCB bare board can be extracted from the Gerber file corresponding to the PCB bare board. Among them, the Gerber file is a document format collection of circuit board industry software describing the circuit board (including circuit layer, solder mask layer, character layer, etc.) image and drilling and milling data. It is a standard format for image conversion in the circuit board industry. It is often used to convey information about printed circuit board manufacturing specifications, including circuit board copper wire, solder mask image, character image, drilling coordinates and attributes, and the outline of the physical board.
[0054] Step S30: welding the PCB panel as a whole based on the overall BOM of the PCB panel, and testing the PCB panel after welding.
[0055] It should be noted that the above-mentioned overall BOM (Bill of Materials) includes all raw materials, components, parts and related information required for the production process of PCB panelization, including but not limited to material number, material description, material quantity, material cost, supplier information, alternative options, version information, etc.
[0056] It should be understood that the above-mentioned overall BOM can be obtained by combining the BOMs of all PCB boards in the PCB panel.
[0057] Step S40: Scan the QR code to record the production process data of the PCB panel in the cloud, and perform periodic control on each factory board in the PCB panel based on the production process data.
[0058] It should be noted that in the cycle control method of PCB boards mentioned in this embodiment, the PCBA production links can be automatically timestamped from the bare board delivery, welding, AOI, visual inspection, testing and other links, and the corresponding quantity and test results can be counted: an automatic barcode scanner is placed in each of the above links, and a printed QR code or a labeled QR code is printed when the bare board is delivered. The automatic barcode scanner can automatically scan and record the link where the board is located and synchronize the statistics in the cloud background. In the test link, the automatic chemical testing tooling is used to complete the automated testing of the board, and all test data are automatically recorded to the cloud. When the customer uses a mobile phone to scan the QR code, he can see all the production and test data of each board on the day of production.
[0059] In the specific implementation, without damaging the original production system, this embodiment also uses machine vision to test the PCB board. For example, this embodiment does not need to access the factory's ERP (Enterprise Resource Planning) system, nor does it need to use API (Application Programming Interface) to read the data of AOI (Automated Optical Inspection) equipment and SMT (Surface Mount Technology) equipment (because accessing the ERP system or using API to read device data will inevitably destroy the original production process and reconstruct the digital production system of the entire production line, which is very costly). Instead, this embodiment can simply use an external machine vision device (such as a camera scanner) to count in key production links, such as the bare board outbound link and the welding link. More specifically, the test link of the PCB board can be divided into a key test link and a functional indicator test link. Among them, in the key test links, machine vision technology can be used to automatically distinguish and count good and defective products, such as the AOI link and visual inspection link. In these two links, the defective and good products are placed in different containers respectively, and the machine vision equipment automatically identifies the number of PCB boards placed in different containers to count the defective and good products. The machine vision equipment here is a camera scanner. In the functional indicator test link, the final function and performance indicator test can be completed by deploying automated tooling and the data can be uploaded to the cloud for storage. After the automatic test is offline, the data of all previous links are collected in the cloud and a unique correspondence is established with the QR code on the PCB board for later maintenance.
[0060] This embodiment classifies PCB light boards, and the PCB light boards are provided with QR codes, and the QR codes are printed QR codes or labeled QR codes; the edge shapes corresponding to the classified PCB light boards are obtained, and the classified PCB light boards are merged according to the edge shapes to obtain PCB panels; the PCB panels are welded as a whole based on the overall BOM of the PCB panels, and the PCB panels are tested after welding; the QR codes are scanned to record the production link data of the PCB panels in the cloud, and the various factory boards in the PCB panels are periodically controlled based on the production link data. Compared with the traditional PCB board cycle control method, since the above method of this embodiment first classifies the PCB light boards, and then merges the classified PCB light boards into panels before welding the components, the production efficiency is improved while the production cost is reduced; in addition, the present application also records the production link data of the factory boards in the cloud through QR codes, thereby realizing the full life cycle control of the factory boards and improving the maintenance effect of the factory boards.
[0061] refer to Figure 3 , Figure 3 This is a flow chart of the second embodiment of the cycle control method of the PCB board of the present application.
[0062] In a feasible implementation manner, the step S10 may include:
[0063] Step S101: Classifying the PCB boards according to their board layers, so as to classify the PCB boards with the same board layers into one category, thereby obtaining classified PCB boards.
[0064] Step S102: performing secondary classification on the first-classified PCB boards according to the component distribution of the first-classified PCB boards to obtain classified PCB boards.
[0065] In a specific implementation, PCB bare boards with single-sided board layers can be classified into one category. PCB bare boards with double-sided board layers can be classified according to the number of components on the front and back sides. For example, PCB bare boards with the number of components >80%, >70%, >60%, and >50% can be classified into one category respectively.
[0066] In a feasible implementation manner, the step S20 may include:
[0067] Step S201: determining a welding container according to welding parameters of a welding device, wherein the welding parameters are used to represent a maximum weldable area of the welding device.
[0068] Step S202: splicing the classified PCB bare boards into the welding container according to the edge shapes corresponding to the classified PCB bare boards to obtain PCB panels.
[0069] In the specific implementation, taking the four PCB boards A, B, C, and D corresponding to four different PCB board production plans as an example, the merging principle is to place more PCB board production plans in the largest weldable area (determined by the model of the welding equipment, the maximum size of small equipment is 300mm*300mm, the medium size is 400mm*500mm, and the large size is 600mm*600mm), and the image edge and area are automatically calculated by the computer program to obtain the optimal merge classification. It should be noted that the above-mentioned welding container is a high-temperature resistant tray, and has different positioning columns according to the different PCB light boards, so as to fix the four PCB boards corresponding to the four production plans ABCD. According to the specifications of the welding container, the Gerber files of ABCD can be spliced into an overall Gerber file. In this step, the relative position of ABCD in the new overall Gerber file must be ensured, so as to determine the position of each component on ABCD, and the overall steel mesh is opened according to the merged overall Gerber file.
[0070] In a feasible implementation manner, the step S202 may include:
[0071] Step S2021: performing image processing on the image data of the classified PCB light board, and acquiring the edge morphology corresponding to the classified PCB light board based on the processed image data.
[0072] Step S2022: performing shape matching on the classified PCB bare panels according to the edge morphology, and splicing the classified PCB bare panels into the welding container for merging based on the matching result to obtain a PCB splice.
[0073] In a specific implementation, an image processing library (such as OpenCV, PIL, etc.) can be used to read the image data of the above-classified PCB light board, and the color image can be converted into a grayscale image, and a filter (such as Gaussian filtering) can be applied to remove noise. Then, an edge detection algorithm (such as Canny edge detector) is used to detect the edges in the image, and a series of pixel points obtained by the detection are used as the edge shape corresponding to the classified PCB light board. Finally, the shape of the welding container is used as the final target shape, and the shape matching of the classified PCB light board is performed according to the edge shape, and based on the matching result, the classified PCB light board is spliced into the welding container for merging, thereby obtaining a PCB panel.
[0074] In this embodiment, the PCB light board is classified once according to the board layer of the PCB light board, so as to classify the PCB light boards with the same board layer into one category to obtain the first-classified PCB light board; the first-classified PCB light board is classified twice according to the component distribution of the first-classified PCB light board to obtain the classified PCB light board; the welding container is determined according to the welding parameters of the welding equipment, and the welding parameters are used to represent the maximum weldable area of the welding equipment; the image data of the classified PCB light board is processed, and the edge shape corresponding to the classified PCB light board is obtained based on the processed image data; the shape of the classified PCB light board is matched according to the edge shape, and the classified PCB light board is spliced into the welding container based on the matching result to merge, so as to obtain a PCB panel. Compared with the traditional cycle control method of PCB boards, the above method of this embodiment classifies different PCB light boards in advance, splices and merges them into the welding container to form a PCB panel, so that only the PCB panel needs to be processed to realize the processing of all PCB light boards in the PCB panel, which improves production efficiency and reduces production costs.
[0075] refer to Figure 4 , Figure 4 This is a flow chart of the third embodiment of the cycle control method of the PCB board of the present application.
[0076] In a feasible implementation manner, the step S30 may include:
[0077] Step S301: merging the welding BOMs of the bare PCBs in the PCB panel into an overall BOM, and welding the PCB panel as a whole according to the overall BOM.
[0078] Step S302: after the welding is completed, the PCB board with the components welded thereon is taken out from the welding container, and the PCB board with the components welded thereon is tested.
[0079] In the specific implementation, since the present embodiment adopts the panel welding technology, the PCB boards of different customers produced in the same batch establish the correlation of batch materials. After integrating the welding BOM, the overall cost structure can be optimized according to the correlation of batch materials. Taking four different PCB boards ABCD as an example, assuming that material a is used on ABCD, and ABCD is panel welded on the same day, when arranging material a to be shipped out, material a belonging to the same batch will be given priority for use by ABCD. In this way, the batch correlation of the same material on different boards of ABCD is established. When the number of the same material type reaches a certain level, the cost optimization action can be triggered to reduce material loss or to renegotiate the price based on the advantage of the number of materials. In addition, the testing process can refer to the key testing links and functional indicator testing links mentioned after S40, which will not be repeated here.
[0080] In a feasible implementation manner, the step S40 may include:
[0081] Step S401: Scan the QR code to record the production process data of the PCB panel in the cloud, and the production process data contains a corresponding timestamp.
[0082] It should be noted that the above-mentioned production process data may include welding data, test data, etc., which is not limited in this embodiment.
[0083] Step S402: determining whether the factory boards in the PCB panel have exceeded the shelf life within a preset time according to the timestamp, and sending a maintenance notification to the corresponding customer if the shelf life has exceeded the preset time.
[0084] Step S403: When the factory board fails, the production process data of the factory board is traced back according to the QR code to troubleshoot and locate the fault of the factory board.
[0085] In the specific implementation, the backend PCBA lifecycle management system will count in real time whether the lifecycle of each batch of different factory boards is close to the shelf life. If it is close, the customer will be notified to perform maintenance in advance. When the customer's whole machine has a return or other failure, the production and test data of each board on the day of production can be traced by scanning the QR code on the factory board, so as to locate the fault problem more accurately and make continuous quality improvement.
[0086] This embodiment combines the welding BOMs of each PCB bare board in the PCB panel into an overall BOM, and welds the PCB panel as a whole according to the overall BOM; after welding, takes out the PCB board with welded components from the welding container, and tests the PCB board with welded components; scans the QR code to record the production link data of the PCB panel in the cloud, and the production link data contains a corresponding timestamp; determines whether the factory board in the PCB panel exceeds the shelf life within a preset time according to the timestamp, and sends a maintenance notification to the corresponding customer when the shelf life exceeds the preset time; when the factory board fails, the production link data of the factory board is traced according to the QR code to troubleshoot and locate the factory board. Compared with the traditional PCB board cycle control method, the above method of this embodiment obtains the production process data of the PCB board by scanning the QR code on the PCB board, so that the entire life cycle of the PCB board can be monitored based on the production process data, and the PCB board can be actively maintained based on the monitoring results, thereby avoiding the situation where users cannot estimate the service life of the PCB board, or even if the user knows the service life, the user may look for other suppliers due to the lack of active maintenance by the manufacturer, thereby improving user stickiness.
[0087] In addition, an embodiment of the present application further proposes a storage medium, on which a cycle control program for a PCB board is stored. When the cycle control program for a PCB board is executed by a processor, the steps of the cycle control method for a PCB board as described above are implemented.
[0088] Reference Figure 5 , Figure 5 This is a structural block diagram of the first embodiment of the cycle control device of the PCB board of this application.
[0089] like Figure 5 As shown, the cycle control device of the PCB board proposed in the embodiment of the present application includes:
[0090] The board classification module 501 is used to classify the PCB boards, where a two-dimensional code is provided on the PCB boards, and the two-dimensional code is a printed two-dimensional code or a labeled two-dimensional code;
[0091] The light board merging module 502 is used to obtain the edge shapes corresponding to the classified PCB light boards, and merge the classified PCB light boards according to the edge shapes to obtain PCB panels;
[0092] A welding test module 503 is used to weld the PCB panel as a whole based on the overall BOM of the PCB panel, and to test the PCB panel after welding is completed;
[0093] The cycle control module 504 is used to scan the QR code to record the production process data of the PCB panel in the cloud, and perform cycle control on each factory board in the PCB panel based on the production process data.
[0094] This embodiment classifies PCB light boards, and the PCB light boards are provided with QR codes, and the QR codes are printed QR codes or labeled QR codes; the edge shapes corresponding to the classified PCB light boards are obtained, and the classified PCB light boards are merged according to the edge shapes to obtain PCB panels; the PCB panels are welded as a whole based on the overall BOM of the PCB panels, and the PCB panels are tested after welding; the QR codes are scanned to record the production link data of the PCB panels in the cloud, and the various factory boards in the PCB panels are periodically controlled based on the production link data. Compared with the traditional PCB board cycle control method, since the above method of this embodiment first classifies the PCB light boards, and then merges the classified PCB light boards into panels before welding the components, the production efficiency is improved while the production cost is reduced; in addition, the present application also records the production link data of the factory boards in the cloud through QR codes, thereby realizing the full life cycle control of the factory boards and improving the maintenance effect of the factory boards.
[0095] Based on the first embodiment of the cycle control device of the PCB board of the present application, a second embodiment of the cycle control device of the PCB board of the present application is proposed.
[0096] In this embodiment, the light board classification module 501 is also used to classify the PCB light boards once according to the board layers of the PCB light boards, so as to classify PCB light boards with the same board layers into one category to obtain once-classified PCB light boards; and to perform a second classification on the once-classified PCB light boards according to the component distribution of the once-classified PCB light boards to obtain classified PCB light boards.
[0097] Furthermore, the light board merging module 502 is also used to determine a welding container according to welding parameters of a welding device, wherein the welding parameters are used to represent a maximum weldable area of the welding device; and according to edge shapes corresponding to the classified PCB light boards, the classified PCB light boards are spliced into the welding container for merging to obtain a PCB panel.
[0098] Furthermore, the light board merging module 502 is also used to perform image processing on the image data of the classified PCB light boards, and obtain the edge morphology corresponding to the classified PCB light boards based on the processed image data; perform shape matching on the classified PCB light boards according to the edge morphology, and splice the classified PCB light boards into the welding container based on the matching results to merge them, so as to obtain a PCB panel.
[0099] Furthermore, the welding test module 503 is also used to merge the welding BOMs of each PCB bare board in the PCB panel into an overall BOM, and perform overall welding on the PCB panel according to the overall BOM; after welding is completed, take out the PCB board with welded components from the welding container, and test the PCB board with welded components.
[0100] Furthermore, the cycle control module 504 is also used to scan the QR code to record the production process data of the PCB panel in the cloud, and the production process data contains a corresponding timestamp; judge whether the factory board in the PCB panel exceeds the shelf life within a preset time according to the timestamp, and send a maintenance notification to the corresponding customer when the shelf life exceeds the preset time; when the factory board fails, trace the production process data of the factory board according to the QR code to troubleshoot and locate the factory board.
[0101] Other embodiments or specific implementation methods of the cycle control device of the PCB board of the present application can refer to the above-mentioned method embodiments, which will not be repeated here.
[0102] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or system including the element.
[0103] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.
[0104] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as a read-only memory / random access memory, a disk, or an optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application.
[0105] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A cycle control method for a PCB board, characterized in that: The method comprises the following steps: Classifying PCB light boards, wherein the PCB light boards are provided with a two-dimensional code, wherein the two-dimensional code is a printed two-dimensional code or a labeled two-dimensional code; Obtaining edge shapes corresponding to the classified PCB bare panels, and merging the classified PCB bare panels according to the edge shapes to obtain PCB panels; Welding the PCB panel as a whole based on the overall BOM of the PCB panel, and testing the PCB panel after welding; Scan the QR code to record the production process data of the PCB panel in the cloud, and perform periodic control on each factory board in the PCB panel based on the production process data.
2. The cycle control method of a PCB board according to claim 1, characterized in that: The step of classifying the PCB bare boards comprises: Classifying the PCB boards according to their board layers, so as to classify the PCB boards with the same board layers into one category, thereby obtaining the classified PCB boards; The first-classified PCB light boards are secondarily classified according to the component distribution of the first-classified PCB light boards to obtain classified PCB light boards.
3. The cycle control method of a PCB board as claimed in claim 1, characterized in that: The step of obtaining edge shapes corresponding to the classified PCB bare panels, and merging the classified PCB bare panels according to the edge shapes to obtain PCB panels includes: Determining a welding container according to welding parameters of a welding device, wherein the welding parameters are used to represent a maximum weldable area of the welding device; According to the edge shapes corresponding to the classified PCB bare boards, the classified PCB bare boards are spliced into the welding container for merging to obtain PCB panels.
4. The cycle control method of a PCB board as claimed in claim 3, characterized in that: The step of splicing the classified PCB bare boards into the welding container according to the edge shapes corresponding to the classified PCB bare boards to obtain PCB splicing comprises: Performing image processing on the image data of the classified PCB light board, and acquiring the edge morphology corresponding to the classified PCB light board based on the processed image data; Shape matching is performed on the classified PCB bare panels according to the edge morphology, and based on the matching result, the classified PCB bare panels are spliced into the welding container for merging to obtain a PCB splice.
5. The cycle control method of a PCB board according to claim 1, characterized in that: The step of welding the PCB panel as a whole based on the overall BOM of the PCB panel, and testing the PCB panel after welding, comprises: Merging the welding BOMs of the bare PCB boards in the PCB panel into an overall BOM, and welding the PCB panel as a whole according to the overall BOM; After the welding is completed, the PCB board with the components welded thereon is taken out from the welding container, and the PCB board with the components welded thereon is tested.
6. The cycle control method of a PCB board according to claim 1, characterized in that: The step of scanning the QR code to record the production process data of the PCB panel in the cloud, and performing periodic control on each factory board in the PCB panel based on the production process data, includes: Scan the QR code to record the production data of the PCB panel in the cloud, where the production data contains a corresponding timestamp; Determine whether the factory boards in the PCB panel have exceeded the shelf life within a preset time according to the timestamp, and send a maintenance notification to the corresponding customer if the shelf life has exceeded the preset time; When the factory board fails, the production process data of the factory board can be traced back according to the two-dimensional code to troubleshoot and locate the fault of the factory board.
7. A cycle control device for a PCB board, characterized in that: The cycle control device of the PCB board includes: A light board classification module is used to classify PCB light boards, wherein the PCB light boards are provided with a two-dimensional code, and the two-dimensional code is a printed two-dimensional code or a labeled two-dimensional code; A light board merging module is used to obtain the edge shapes corresponding to the classified PCB light boards, and merge the classified PCB light boards according to the edge shapes to obtain PCB panels; A welding test module, used to weld the PCB panel as a whole based on the overall BOM of the PCB panel, and to test the PCB panel after welding; The cycle control module is used to scan the QR code to record the production process data of the PCB panel in the cloud, and perform cycle control on each factory board in the PCB panel based on the production process data.
8. A cycle control device for PCB boards, characterized in that: The device comprises: a memory, a processor, and a cycle control program of a PCB board stored in the memory and executable on the processor, wherein the cycle control program of the PCB board is configured to implement the steps of the cycle control method of the PCB board as described in any one of claims 1 to 6.
9. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, on which a cycle control program for a PCB board is stored. When the cycle control program for a PCB board is executed by a processor, the steps of the cycle control method for a PCB board as described in any one of claims 1 to 6 are implemented.
10. A computer program product, characterized in that The computer program product includes a cycle control program for a PCB board, and when the cycle control program for a PCB board is executed by a processor, the steps of the cycle control method for a PCB board as described in any one of claims 1 to 6 are implemented.
