Display panel, preparation method thereof and display device

Abstract

The display panel and the preparation method thereof and the display device provided by the embodiments of the present disclosure include: a display panel, a driving device, the display panel includes a substrate and a bare chip, the bare chip includes a wiring area extending to the outside of the substrate; the driving device includes a driving chip, a rigid circuit board and a flexible circuit board, the driving chip is arranged on the rigid circuit board, the flexible circuit board is connected with the rigid circuit board, one end of the flexible circuit board away from the rigid circuit board forms a binding end, two opposite surfaces of the binding end define a first binding area and a second binding area respectively; the first binding area is connected with the wiring area through a first connecting part, the second binding area is connected with the wiring area through a second connecting part, the present disclosure can reduce the area of the binding end in the flexible circuit board, thereby reducing the wiring area of the bare chip corresponding to the binding end, and further reducing the non-display area of the substrate occupied by the bare chip, thereby reducing the area of the non-display area, and improving the proportion of the display area.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] In the two-chip design of the display panel (i.e., having a bare chip and a circuit board), the bare chip and the circuit board are separate. After the bare chip and the circuit board are processed, they are bonded together to make them electrically connected.

[0003] With the advancement of display technology, higher demands are placed on the performance of display products. In order to achieve high frame rates in display products, the number of bonding pins (gold fingers) connecting the circuit board and the bare chip will also increase. This leads to an increase in the bonding area of ​​the circuit board and the bonding area of ​​the bare chip, which requires an increase in the area of ​​the non-display area to meet the increased bonding area requirements. Consequently, the proportion of the display area (Active Area, AA) is reduced, which is not conducive to the realization of full-screen displays. Summary of the Invention

[0004] This disclosure provides a display panel and its manufacturing method, as well as a display device, to solve or alleviate one or more technical problems in the prior art.

[0005] As one aspect of this disclosure, an embodiment provides a display module comprising:

[0006] The display panel includes a substrate and a bare chip disposed on the substrate, the bare chip including a wiring area extending to the outside of the substrate;

[0007] The driving device includes a driving chip, a rigid circuit board and a flexible circuit board. The driving chip is disposed on the rigid circuit board, and the flexible circuit board is connected to the rigid circuit board. The end of the flexible circuit board away from the rigid circuit board forms a bonding end, and the two surfaces opposite to the bonding end define a first bonding area and a second bonding area, respectively.

[0008] The bonding end is connected to the bare chip, the first bonding area is connected to the wiring area through the first connecting part, and the second bonding area is connected to the wiring area through the second connecting part.

[0009] In some embodiments, the first connecting portion is an anisotropic conductive film.

[0010] In some embodiments, the second connection portion is a silver paste layer.

[0011] In some implementations, the first bonding area is located on the side of the flexible circuit board facing the bare chip, and the second bonding area is located on the side of the flexible circuit board facing away from the bare chip.

[0012] In some embodiments, it also includes: a connector; the connector is disposed on a flexible circuit board.

[0013] In some implementations, the orthographic projection of the bare chip on the substrate is the first projection, the orthographic projection of the flexible circuit board on the substrate is the second projection, and the orthographic projection of the rigid circuit board on the substrate is the third projection.

[0014] The first projection and the third projection are spaced apart on the substrate, and the second projection and the first projection overlap at least partially on the substrate.

[0015] In some implementations, the second bonding area is flush with the edge of the flexible circuit board adjacent to the bare chip, and the first bonding area has a certain reserved area on the edge of the flexible circuit board adjacent to the bare chip.

[0016] In some implementations, the first bonding area is provided with a plurality of first bonding pins, at least a portion of which are electrically connected to the bare chip via a first connection portion.

[0017] In some implementations, the second bonding region is provided with a plurality of second bonding pins, at least a portion of which are electrically connected to the bare chip via a second connection portion.

[0018] In some embodiments, the display module further includes a power module and a signal module. The second connection part includes multiple silver paste connection blocks. The current of the first bonding pin is the same as that of the second bonding pin. The first bonding pin is connected to the signal module. Multiple second bonding pins are connected to form a conductive block and the conductive block is connected to the power module. The conductive block is connected to the wiring area through the silver paste connection blocks.

[0019] In some implementations, the center distance between two adjacent first bonding pins is the first distance, and the center distance between two adjacent second bonding pins is the second distance. The ratio of the first distance to the second distance satisfies (18-20)∶55.

[0020] In some implementations, the rigid circuit board and the bare chip are spaced apart along a first direction, a plurality of first bonding pins are spaced apart along a second direction, a plurality of second bonding pins are spaced apart along a second direction, and the first and second directions are perpendicular to each other.

[0021] As another aspect of the embodiments of this disclosure, this disclosure also provides a method for manufacturing a display module, for manufacturing the above-mentioned display module, the method comprising:

[0022] A bare die is formed on a substrate, the bare die including a wiring area extending to the outside of the substrate;

[0023] A rigid circuit board and a flexible circuit board are provided. The flexible circuit board is connected to the rigid circuit board. The end of the flexible circuit board away from the rigid circuit board forms a bonding end. The two surfaces opposite the bonding end define a first bonding area and a second bonding area, respectively.

[0024] A first connecting part is provided, and a first bonding area is connected to a wiring area through the first connecting part;

[0025] A second connector is provided, and the second bonding area is connected to the wiring area through the second connector;

[0026] The driver chip is formed on a rigid circuit board.

[0027] In some embodiments, a first connecting portion is provided, and a first bonding area is connected to a wiring area via the first connecting portion, specifically including:

[0028] An anisotropic conductive adhesive film is formed between the first bonding area and the wiring area by an ACF hot pressing process.

[0029] In some embodiments, a second connection portion is provided, through which the second bonding area is connected to the wiring area, specifically including:

[0030] The second bonding area is located on the side of the flexible circuit board facing away from the bare chip. A silver paste layer connecting the second bonding area and the wiring area is formed by a silver paste curing process.

[0031] As another aspect of the present disclosure, the present disclosure also provides a display device, which includes: the display module as described above or the display module prepared by the method described above.

[0032] The embodiments disclosed herein have the following beneficial effects:

[0033] Based on the aforementioned display panel, its manufacturing method, and display device, this disclosure reduces the area of ​​the bonding ends in the flexible circuit board by forming a first bonding area and a second bonding area on opposite sides of the bonding ends, and by setting gold fingers in the first and second bonding areas respectively, thus evenly distributing the gold fingers to the first and second bonding areas. Furthermore, this disclosure connects the first bonding area and the wiring area via a first connecting portion and the second bonding area and the wiring area via a second connecting portion, thereby achieving bonding between the first and second bonding areas and the bare chip. During signal transmission, the signal is input to the flexible circuit board through the rigid circuit board, and the signal from the flexible circuit board is then input to the bare chip via the first and second connecting portions, thus achieving signal transmission between the bare chip and the rigid circuit board. This configuration achieves signal transmission between the flexible circuit board and the driver chip while reducing the area of ​​the bonding ends in the flexible circuit board, thereby reducing the wiring area of ​​the bare chip corresponding to the bonding ends, and further reducing the area of ​​the non-display area occupied by the bare chip on the substrate, thereby increasing the proportion of the display area. Attached Figure Description

[0034] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this disclosure and should not be construed as limiting the scope of this disclosure.

[0035] Figure 1 This diagram illustrates the structure of a circuit board in the relevant technology.

[0036] Figure 2 A schematic diagram of the structure of a flexible circuit board according to an embodiment of the present disclosure is shown;

[0037] Figure 3 A schematic diagram of the structure of a display panel according to an embodiment of the present disclosure is shown;

[0038] Figure 4 A schematic diagram of the structure of a drive device according to an embodiment of the present disclosure is shown;

[0039] Figure 5 A side view of a display module according to an embodiment of the present disclosure is shown;

[0040] Figure 6 A top view of a display module according to an embodiment of the present disclosure is shown;

[0041] Figure 7 A schematic diagram showing the connection relationship of the conductive block and the wiring area according to an embodiment of the present disclosure is provided.

[0042] Explanation of reference numerals in the attached figures:

[0043] Related technologies:

[0044] 10' Flexible circuit board; 11' Bonding area;

[0045] 20', Reinforcing layer;

[0046] 30', Rigid circuit board.

[0047] This disclosure:

[0048] 1. Display module;

[0049] 10. Display panel; 11. Substrate; 12. Bare chip; 121. Wiring area;

[0050] 20. Drive unit; 21. Rigid circuit board; 22. Flexible circuit board; 221. Bonding end; 2211. First bonding area; 2212. Second bonding area; 23. Drive chip;

[0051] 30. First connecting part;

[0052] 40. Second connecting part; 41. Silver paste connecting block;

[0053] 50. Connector;

[0054] 60. Conductive block;

[0055] X, the first direction; Y, the second direction. Detailed Implementation

[0056] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure. Therefore, the drawings and description are to be considered exemplary in nature and not restrictive.

[0057] Figure 1The diagram shows a schematic of the circuit board structure in the related technology. In the related technology, in the two-chip design of the display panel (i.e., having a bare chip and a circuit board), the bare chip and the circuit board are separated. The circuit board includes a flexible circuit board 10' and a rigid circuit board 30'. The flexible circuit board 10' is sandwiched in the middle layer of the rigid circuit board 30'. After the bare chip and the flexible circuit board 10' are processed, they are electrically connected by bonding. With the advancement of display technology, higher demands are placed on the performance of display products. While achieving high frame rates, the number of bonding pins (gold fingers) connecting the flexible circuit board 10' and the bare chip also increases. However, one side of the flexible circuit board 10' is the bonding area 11', and the other side is provided with a reinforcement layer 20'. This means that the only way to meet the increased number of gold fingers is to increase the area of ​​the bonding area 11' of the flexible circuit board 10'. The increase in the area of ​​the bonding area 11' of the flexible circuit board 10' leads to a corresponding increase in the area of ​​the non-display area to meet the requirements, which in turn reduces the proportion of the display area (Active Area, AA), which is not conducive to the realization of a full-screen display.

[0058] Figure 2 A schematic diagram of the structure of the flexible circuit board 22 according to an embodiment of the present disclosure is shown; Figure 3 A schematic diagram of the structure of the display panel 10 according to an embodiment of the present disclosure is shown; Figure 4 A schematic diagram of the structure of the drive device 20 according to an embodiment of the present disclosure is shown; Figure 5 A side view of a display module 1 according to an embodiment of the present disclosure is shown; Figure 6 A top view of display module 1 according to an embodiment of the present disclosure is shown. See also some embodiments of the present disclosure. Figures 2-6 This paper proposes a display module 1, which includes a display panel 10 and a driving device 20. Compared with the previous case where the bonding end 221 only has a bonding area on one side, this disclosure provides a first bonding area 2211 and a second bonding area 2212 on the two opposite sides of the bonding end 221 of the flexible circuit board 22. Gold fingers are provided in the first bonding area 2211 and the second bonding area 2212 respectively, and the gold fingers are evenly distributed in the first bonding area 2211 and the second bonding area 2212. This reduces the area of ​​the bonding end 221 in the flexible circuit board 22, thereby reducing the area of ​​the wiring area 121 of the bare chip 12. This achieves the effect of reducing the area of ​​the non-display area occupied by the bare chip 12 on the substrate 11, thereby increasing the proportion of the display area (Active Area, AA).

[0059] See Figure 3 and Figure 5 In this embodiment, the display panel 10 includes a substrate 11 and a bare chip 12 disposed on the substrate 11. The bare chip 12 includes a wiring region 121 extending to the outside of the substrate 11.

[0060] It is understood that the display panel 10 includes a display area and a non-display area, the non-display area is located around the display area, the bare chip 12 is disposed on the substrate 11, and the bare chip 12 is located within the non-display area.

[0061] See Figure 4 and Figure 5 The driving device 20 includes a driving chip 23, a rigid circuit board 21, and a flexible circuit board 22. The driving chip 23 is disposed on the rigid circuit board 21. The flexible circuit board 22 is connected to the rigid circuit board 21. The end of the flexible circuit board 22 away from the rigid circuit board 21 forms a bonding end 221. The two surfaces opposite to the bonding end 221 define a first bonding area 2211 and a second bonding area 2212, respectively. Both the first bonding area 2211 and the second bonding area 2212 are used to set gold fingers.

[0062] Specifically, the flexible circuit board 22 is clamped in the middle layer of the rigid circuit board 21.

[0063] See Figure 5 In this configuration, the bonding end 221 is connected to the bare chip 12, the first bonding area 2211 is connected to the wiring area 121 through the first connecting part 30, and the second bonding area 2212 is connected to the wiring area 121 through the second connecting part 40.

[0064] The gold fingers are used to bond the bare chip 12 to the flexible circuit board 22 and to input control signals to the bare chip 12. Here is a simple explanation of the concept of gold fingers: a nickel-gold plate is plated on the pads or copper foil of the first bonding area 2211 and the second bonding area 2212 so that the pads or copper foil are connected to the structure to be connected. Because its shape is similar to a gold finger, it is called a "gold finger".

[0065] According to the display module 1 of the present disclosure, the present disclosure forms a first bonding area 2211 and a second bonding area 2212 on opposite sides of the bonding end 221 of the flexible circuit board 22, and provides gold fingers in the first bonding area 2211 and the second bonding area 2212 respectively, so that the gold fingers are evenly distributed to the first bonding area 2211 and the second bonding area 2212, thereby reducing the area of ​​the bonding end 221 in the flexible circuit board 22. Secondly, this disclosure also connects the first bonding area 2211 and the wiring area 121 respectively through the first connecting part 30 and the second bonding area 2212 and the wiring area 121 respectively through the second connecting part 40, thereby realizing the bonding of the first bonding area 2211 and the second bonding area 2212 with the bare chip 12. During signal transmission, the signal is input to the flexible circuit board 22 through the rigid circuit board 21. The signal of the flexible circuit board 22 is then input to the bare chip 12 through the first connecting part 30 and the second connecting part 40, thereby realizing the signal transmission between the bare chip 12 and the rigid circuit board 21. With this configuration, the signal transmission between the flexible circuit board 22 and the driver chip 23 can be realized, and the area of ​​the bonding end 221 in the flexible circuit board 22 can be reduced, thereby reducing the area of ​​the wiring area 121 of the bare chip 12 corresponding to the bonding end 221. This reduces the area of ​​the non-display area of ​​the substrate 11 occupied by the bare chip 12, thereby reducing the area of ​​the non-display area in the display module 1 and increasing the proportion of the display area.

[0066] For example, when it is necessary to increase the frame rate from 90Hz to 120Hz, the number of gold fingers on the flexible circuit board 22 needs to be increased. For instance, when the number of gold fingers is 1000, the area of ​​the bonding end in the related art is S. In the case of the display module 1 using the embodiment of this disclosure, 500 gold fingers can be set in the first bonding area 2211 and the second bonding area 2212 respectively. Thus, the area of ​​the bonding end 221 in this disclosure is S / 2. Compared with the display modules in the related art, the area of ​​the bonding end 221 in the flexible circuit board 22 of the display module of this disclosure is reduced by half. It should be noted that the number of gold fingers is not limited to this. In specific applications, those skilled in the art can determine it according to actual needs.

[0067] In some embodiments, the first connecting portion 30 is an anisotropic conductive film (ACF). Anisotropic conductive film has advantages such as low processing cost and small footprint, thereby reducing the area between the bonding end 221 and the wiring area 121 used for mounting the first connecting portion 303. The anisotropic conductive film mainly includes conductive particles, insulating material, an upper protective film, and a lower protective film. The conductive particles and insulating material are located between the upper and lower protective films. During assembly, the upper and lower protective films can be removed, and the anisotropic conductive film can be adhered to the first bonding area 2211 and the wiring area 121 respectively, thereby connecting the driver chip 23 and the flexible circuit board 22 through the anisotropic conductive film. During the process of fixing the anisotropic conductive film to the driver chip 23, the bare chip 12 can be pressed and heated to cure the insulating material and form a stable connection structure.

[0068] During signal transmission, the signal is input to the flexible circuit board 22 through the rigid circuit board 21. The signal from the flexible circuit board 22 is input to the bare chip 12 through the conductive particles of the anisotropic conductive film, thereby realizing signal transmission between the bare chip 12 and the rigid circuit board 21.

[0069] In this embodiment of the disclosure, the display module 1 may include a computer monitor, television, billboard, laser printer with display function, telephone, mobile phone, personal digital assistant (PDA), laptop computer, digital camera, portable camcorder, viewfinder, vehicle, large wall area, theater screen or stadium sign, etc.

[0070] See Figure 4 and Figure 5 In some embodiments, the first bonding area 2211 is located on the side of the flexible circuit board 22 facing the bare chip 12, and the second bonding area 2212 is located on the side of the flexible circuit board 22 away from the bare chip 12.

[0071] In some embodiments, the second connection portion 40 is a silver paste layer. In this embodiment, since the second bonding region 2212 is on the side facing away from the bare chip 12, the second bonding region 2212 and the wiring region 121 of the bare chip 12 face the same direction, and the anisotropic conductive film... Anisotropic conductive adhesive film (ACF) can only be used for bonding between two opposing surfaces. Therefore, the second bonding area 2212 and the bare chip 12 cannot be electrically connected using anisotropic conductive adhesive film. However, this disclosure achieves the electrical connection between the second bonding area 2212 and the bare chip 12 by curing conductive silver paste to form a silver paste layer. Furthermore, since there is a height difference between the side of the bare chip 12 facing the substrate 11 and the second bonding area 2212 in the direction perpendicular to the substrate, and since the cured silver paste layer has a certain mechanical strength, it can withstand certain physical stress and environmental changes. Therefore, using conductive silver paste to form a silver paste layer to achieve the electrical connection between the second bonding area 2212 and the bare chip 12 can avoid the connection failure caused by the height difference between the side of the bare chip 12 facing the substrate 11 and the second bonding area 2212 in the direction perpendicular to the substrate, thereby improving the connection stability of the bare chip 12 and the second bonding area 2212. To achieve conductivity between the driver chip 23 and the flexible circuit board 22, conductive silver paste has advantages such as low curing temperature, high bonding strength, stable electrical performance, and simple bonding process. Using conductive silver paste in the bonding process can significantly improve the bonding quality, thereby improving signal transmission performance and display effect.

[0072] See Figure 4 , Figure 5 as well as Figure 6 In some embodiments, this disclosure further includes a connector 50. The connector 50 is disposed on the flexible circuit board 22. Specifically, the rigid circuit board and the bare chip 12 are spaced apart along a first direction X, and the connector 50 and the driver chip 23 on the rigid circuit board 21 are spaced apart along the first direction X. The connector 50 and the driver chip 23 extend along a second direction Y, and the first direction X and the second direction Y are perpendicular to each other. This arrangement allows for a more reasonable layout of the connector 50 and the driver chip 23 on the rigid circuit board 21, reducing the area of ​​the rigid circuit board 21.

[0073] Specifically, the connector 50 connects the display panel 10 and the host unit so that the host unit can transmit signals and data to the display panel 10. For example, the connector 50 is an eDP connector or a USB-type-C connector, etc.

[0074] In some embodiments, the orthographic projection of the bare chip 12 onto the substrate 11 is the first projection, the orthographic projection of the flexible circuit board 22 onto the substrate 11 is the second projection, and the orthographic projection of the rigid circuit board 21 onto the substrate 11 is the third projection. The first and third projections are spaced apart on the substrate 11, and the second and first projections at least partially overlap. The overlap area between the first and second projections can be designed by adjusting the number of gold fingers to maximize the proximity of the first connection portion 30 to the side of the bare chip 12 facing the rigid circuit board 21, thereby reducing the overlap area between the first and second projections. The smaller the overlap area between the first and second projections, the smaller the area of ​​the flexible circuit board 22 in the non-display area of ​​the display panel 10, effectively increasing the proportion of the display area.

[0075] In some embodiments, the first bonding area 2211 is provided with a plurality of first bonding pins (also referred to as circuit board gold fingers (FPC bump)), and the plurality of first bonding pins are electrically connected to the bare chip 12 at least partially through the first connection portion 30.

[0076] In some embodiments, the second bonding area 2212 is provided with a plurality of second bonding pins (also known as circuit board gold fingers (FPC bump)), at least a portion of which are electrically connected to the bare chip 12 via the second connection portion 40.

[0077] See Figure 6 In some embodiments, the rigid circuit board 21 and the bare chip 12 are spaced apart along a first direction X, a plurality of first bonding pins are spaced apart along a second direction Y, a plurality of second bonding pins are spaced apart along a second direction Y, and the first direction X and the second direction Y are perpendicular to each other.

[0078] In related technologies, silicon-based OLED (Organic Light Emitting Diode) display modules require connection to a power module via bonding pins to supply power to the display panel. Secondly, the display panel also needs to be connected to a signal module via bonding pins to input drive signals. The current in the bonding pins connected to the power module is greater than the current in the bonding pins connected to the signal module. For example, the power module is at least one of AVDD, IOVCC, ELVDD, VCOM, VSS1, and VSS2. AVDD is the analog voltage used by the driver chip 23 to output the corresponding signal; IOVCC is the voltage of the input / output (I / O) interface chip in the driver chip 23 used to drive the display panel; ELVDD is used to control the high and low voltages of pixel emission in the display area; and VCOM is used to balance the drive circuit. For the power module to function properly, the circuit module requires a large current. For example, IOVCC = 600mA, ELVDD = 600mA, VCOM = 300mA, and AVDD = 200mA. Since the power module requires a large current, it needs to be connected to multiple bonding pins to meet the current requirements of the power module.

[0079] Figure 7 A schematic diagram showing the connection relationship between the conductive block 60 and the wiring region 121 according to an embodiment of the present disclosure is shown. See also Figure 7 To address the technical issues mentioned above, this disclosure also includes a power module and a signal module. The second connection portion includes multiple silver paste connection blocks 41. The current of the first bonding pin and the current of the second bonding pin are the same. The first bonding pin is connected to the signal module. Multiple second bonding pins are connected to form a conductive block 60, which is connected to the power module. The conductive block is connected to the wiring area 121 through the silver paste connection blocks 41. Thus, the current through the conductive block 60 is greater than the current through a single first bonding pin.

[0080] The current passing through the first and second bonding pins is related to their area; the larger the area, the greater the current that can pass through.

[0081] It should be noted that each silver paste connector 41 of the silver paste layer needs to be processed individually to connect the silver paste connector 41 to the corresponding conductive block 60 and wiring area 121. Since the silver paste layer includes multiple silver paste connectors 41, the number of silver paste connectors 41 will affect the processing efficiency of the silver paste layer.

[0082] Through the above embodiments, this disclosure combines multiple second bonding pins connected to the power module to form a conductive block 60. The current passing through the conductive block 60 is the sum of the currents passing through the multiple second bonding pins. Therefore, only one conductive block 60 is needed to meet the current requirements of the power module. Secondly, this disclosure sets the conductive block 60 in the second bonding area, that is, sets the conductive block 60 on the surface of the flexible circuit board 22 facing away from the substrate 11. Then, the conductive block 60 is connected to the wiring area 121 by a silver paste connector 41. Since this disclosure combines multiple second bonding pins connected to the power module to form the conductive block 60, and each conductive block 60 only needs to be configured with one silver paste connector 41, the number of silver paste connectors 41 in the flexible circuit board and the wiring area 121 is effectively reduced, which is beneficial to improving the processing efficiency of the silver paste layer.

[0083] See Figure 2 In some embodiments, the second bonding area 2212 is flush with the edge of the flexible circuit board adjacent to the bare chip 12, and the first bonding area 2211 has a certain reserved area on the edge of the flexible circuit board adjacent to the bare chip 12. For example, the size of the reserved area is 0.2mm, 0.3mm or 0.4mm, etc. Since the first bonding area 2211 is first bonded to the wiring area 121 of the bare chip 12 during the manufacturing process of the display module 1, and then the second bonding area 2212 is bonded to the wiring area 121 of the bare chip 12, since the silver paste has a certain flowability before fixing, this disclosure reserves a certain space by setting the reserved area to prevent the silver paste from flowing to the first bonding area 2211 before curing. This can prevent the silver paste layer of the second bonding area 2212 from contacting the second bonding area 2212 during the curing process and causing a short circuit, thereby damaging the display module 1.

[0084] In some embodiments, the center distance between two adjacent first bonding pins is the first distance, and the center distance between two adjacent second bonding pins is the second distance. When the first bonding pins on the flexible circuit board have sufficient area to meet the requirements of the anisotropic conductive adhesive film for the number of conductive particles, the center distance between two adjacent first bonding pins is 36µm to 40µm. However, due to the fluidity of the silver paste, when it falls onto two adjacent second bonding pins, it can easily cause the two adjacent second bonding pins to connect through the silver paste, which can easily lead to reliability problems such as short circuits. Therefore, the center distance between two adjacent second bonding pins is 110µm. Thus, the ratio of the first distance to the second distance needs to satisfy: (18-20)∶55.

[0085] The embodiments of this disclosure also provide a method for manufacturing the display module 1 as described in the above embodiments, including:

[0086] A bare die 12 is formed on the substrate 11, and the bare die 12 includes a wiring region 121 extending to the outside of the substrate 11;

[0087] A rigid circuit board 21 and a flexible circuit board 22 are provided. The flexible circuit board 22 is connected to the rigid circuit board 21. The end of the flexible circuit board 22 away from the rigid circuit board 21 forms a bonding end 221. The two surfaces opposite to the bonding end 221 respectively define a first bonding area 2211 and a second bonding area 2212.

[0088] A first connecting part 30 is provided, and a first binding area 2211 is connected to a wiring area 121 through the first connecting part 30;

[0089] A second connection part 40 is provided, and the second binding area 2212 is connected to the wiring area 121 through the second connection part 40;

[0090] A driver chip 23 is formed on a rigid circuit board 21.

[0091] In this embodiment of the present disclosure, a first bonding area 2211 and a second bonding area 2212 are formed on opposite sides of the bonding end 221 of the flexible circuit board 22, and gold fingers are respectively provided in the first bonding area 2211 and the second bonding area 2212, so that the gold fingers are evenly distributed to the first bonding area 2211 and the second bonding area 2212. Since the number of gold fingers in one of the bonding areas 2211 and the second bonding area 2212 is reduced, the area of ​​the bonding end 221 in the flexible circuit board 22 can be reduced. Secondly, this disclosure also connects the first bonding area 2211 and the wiring area 121 respectively through the first connecting part 30 and the second bonding area 2212 and the wiring area 121 respectively through the second connecting part 40, thereby realizing the bonding of the first bonding area 2211 and the second bonding area 2212 with the bare chip 12. During signal transmission, the signal is input to the flexible circuit board through the rigid circuit board 21, and the signal of the flexible circuit board is input to the bare chip 12 through the first connecting part 30 and the second connecting part 40, thereby realizing the signal transmission between the bare chip 12 and the rigid circuit board 21. With this configuration, the signal transmission between the flexible circuit board 22 and the driver chip 23 can be realized, and the area of ​​the bonding end 221 in the flexible circuit board 22 can be reduced, thereby reducing the area of ​​the wiring area 121 of the bare chip 12 corresponding to the bonding end 221, and further reducing the area of ​​the non-display area occupied by the bare chip 12 on the substrate 11. This reduces the area of ​​the non-display area and thus increases the proportion of the display area.

[0092] In some embodiments, a first connecting portion 30 is provided, and a first binding area 2211 is connected to a wiring area 121 via the first connecting portion 30, specifically including:

[0093] An anisotropic conductive adhesive film is formed between the first bonding area 2211 and the wiring area 121 by an ACF hot pressing process. The anisotropic conductive adhesive film has the advantages of low process cost and small space occupation, thereby making the area occupied by the first connection part 30 of the driver chip 23 smaller.

[0094] In some embodiments, a second connection portion 40 is provided, and the second binding area 2212 is connected to the wiring area 121 through the second connection portion 40, specifically including:

[0095] The second bonding area 2212 is located on the side of the flexible circuit board 22 facing away from the bare chip 12. A silver paste layer is formed by a silver paste curing process to connect the second bonding area 2212 and the wiring area 121. Specifically, the silver paste layer in this disclosure includes multiple silver paste connecting blocks. Each second bonding pin needs to be connected to the wiring area 121 by a silver paste connecting block curing process, thereby realizing the connection between the second bonding pin and the wiring area 121.

[0096] Embodiments of this disclosure also provide a display device, which includes: a display panel 10 according to the above embodiments of this disclosure, or a display panel 10 prepared using the preparation method of the above embodiments of this disclosure. Therefore, this display device can possess all the features and advantages of the display panel 10 or the preparation method described above, which will not be repeated here.

[0097] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0098] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0099] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0100] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0101] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify the disclosure, specific examples of components and arrangements have been described above. Of course, these are merely examples and are not intended to limit the scope of this disclosure. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0102] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized by The display module comprises: a display panel comprising a substrate and a bare chip disposed on the substrate, the bare chip comprising a wiring area extending to the outside of the substrate; a driving device comprising a driving chip, a rigid circuit board and a flexible circuit board, the driving chip being disposed on the rigid circuit board, the flexible circuit board being connected with the rigid circuit board, an end of the flexible circuit board away from the rigid circuit board forming a binding end, two opposite surfaces of the binding end defining a first binding area and a second binding area respectively; wherein the binding end overlaps the bare chip, the first binding area is connected with the wiring area through a first connecting part, and the second binding area is connected with the wiring area through a second connecting part.

2. The display module of claim 1, wherein, The first connecting part is an anisotropic conductive adhesive film.

3. The display module of claim 1, wherein, The second connecting part is a silver paste layer.

4. The display module of claim 1, wherein, The first binding area is located on one side of the flexible circuit board facing the bare chip, and the second binding area is located on one side of the flexible circuit board away from the bare chip.

5. The display module of claim 1, wherein, Further comprising: a connector, the connector being disposed on the flexible circuit board.

6. The display module of claim 1, wherein, The orthographic projection of the bare chip on the substrate is a first projection, the orthographic projection of the flexible circuit board on the substrate is a second projection, and the orthographic projection of the rigid circuit board on the substrate is a third projection; wherein the first projection and the third projection are spaced apart on the substrate, and the second projection and the first projection at least partially overlap on the substrate.

7. The display module of claim 1, wherein, The second binding area is flush with one side edge of the flexible circuit board adjacent to the bare chip, and the first binding area has a certain reserved area with one side edge of the flexible circuit board adjacent to the bare chip.

8. The display module of any of claims 1-7, wherein, The first binding area is provided with a plurality of first binding pins, and at least part of the plurality of first binding pins are electrically connected with the bare chip through the first connecting part.

9. The display module of claim 8, wherein, The second binding area is provided with a plurality of second binding pins, and at least part of the plurality of second binding pins are electrically connected with the bare chip through the second connecting part.

10. The display module of claim 9, wherein, The display module further comprises a power module and a signal module, the second connecting part comprises a plurality of silver paste connecting blocks, the current of the first binding pin is the same as the current of the second binding pin, the first binding pin is connected with the signal module, a plurality of second binding pins are connected to form a conductive block, and the conductive block is connected with the power module, and the conductive block is connected with the wiring area through the silver paste connecting block.

11. The display module of claim 9, wherein, The center distance between two adjacent first binding pins is a first distance, the center distance between two adjacent second binding pins is a second distance, and the ratio of the first distance to the second distance satisfies: (18-20):

55.

12. The display module of claim 9, wherein, The rigid circuit board and the bare chip are spaced apart along a first direction, a plurality of first binding pins are spaced apart along a second direction, and a plurality of second binding pins are spaced apart along the second direction, and the first direction and the second direction are perpendicular to each other.

13. A method for manufacturing a display module, characterized by: A method for preparing the display module as claimed in any one of claims 1-12, the method comprising: forming a bare chip on a substrate, the bare chip comprising a wiring area extending to the outside of the substrate; The rigid circuit board and the flexible circuit board are provided, the flexible circuit board is connected with the rigid circuit board, one end of the flexible circuit board away from the rigid circuit board forms a binding end, and two opposite surfaces of the binding end define a first binding area and a second binding area respectively; A first connecting part is provided, and the first binding area is connected with the wiring area through the first connecting part; A second connecting part is provided, and the second binding area is connected with the wiring area through the second connecting part; A driving chip is formed on the rigid circuit board.

14. The method of claim 13, wherein, The first connecting part is provided, and the first binding area is connected with the wiring area through the first connecting part, specifically including: An ACF hot pressing process is performed between the first binding area and the wiring area to form an anisotropic conductive adhesive film connecting the first binding area and the wiring area.

15. The preparation method according to claim 13, characterized in that, The second connecting part is provided, and the second binding area is connected with the wiring area through the second connecting part, specifically including: The second binding area is located on the side of the flexible circuit board away from the bare chip, and a silver paste solidification process is performed to form a silver paste layer connecting the second binding area and the wiring area.

16. A display device comprising: It includes: The display module of any one of claims 1-12 or the display module prepared by the method of any one of claims 13-15.

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