Inductor array component and substrate with built-in inductor array component

Abstract

The invention provides an inductor array component and an inductor array component built-in substrate which can improve the freedom degree of circuit design. The inductor array component includes: a flat plate-shaped main body including a magnetic layer including a resin and a metal magnetic powder contained in the resin; a first inductor wiring and a second inductor wiring disposed on the same plane in the main body and adjacent to each other; a plurality of first vertical wirings extending from first and second end sides of the first inductor wirings and first and second end sides of the second inductor wirings in a first direction of a normal direction with respect to the plane to pass through the interior of the main body, and exposed on a first main surface side of the main body; and a plurality of second vertical wirings extending from the first end side and the second end side of the first inductor wiring and the first end side and the second end side of the second inductor wiring in a second direction of the normal direction with respect to the plane so as to pass through the interior of the main body and be exposed on the second main surface side of the main body.

Description

[0001] This application is a divisional application of the invention patent application with application number 202011145895.X, application date October 23, 2020, applicant Murata Manufacturing Co., Ltd., and invention name “Inductor array component and inductor array component built-in substrate”. Technical Field

[0002] The present invention relates to an inductor array component and an inductor array component built-in substrate. Background Art

[0003] Conventionally, there is a substrate with built-in inductor components described in Japanese Patent Application Laid-Open No. 2004-319875 (Patent Document 1). The substrate with built-in inductor components includes an inductor component with a winding structure and a substrate in which the inductor component is embedded. The coil diameter of the winding of the inductor component is parallel to the thickness direction of the substrate.

[0004] In addition, Japanese Patent Publication No. 2014-197590 (Patent Document 2) describes an inductor component having an inductor wiring wound into a plane, and a first magnetic layer and a second magnetic layer located at a position clamping the inductor wiring from both sides of the normal direction of the plane on which the inductor wiring is wound. The shape of the inductor component is a rectangular parallelepiped, having an upper surface and a lower surface perpendicular to the normal direction, and four side surfaces parallel to the normal direction. The inductor is a surface-mounted chip component, and the inductor wiring is connected to an external electrode via a lead portion (terminal electrode + lead electrode) connected to its outer peripheral end. The lead portion is exposed to the outside from the side surface, and the external electrode is exposed to the outside from the upper surface, forming an L-shaped external terminal.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-319875

[0006] Patent Document 2: Japanese Patent Application Publication No. 2014-197590

[0007] As inductor components become smaller and lower in height, not only the conventional surface mounting is being studied, but also the three-dimensional mounting of inductor components using SiP (System in Package) technology, PoP (Package on Package) technology, etc. is being studied. For example, by embedding the inductor component in the substrate, the entire system can be made smaller and thinner. However, in the inductor built-in substrate of Patent Document 1, since the inductor component is a winding structure and the coil diameter of the winding is parallel to the thickness direction of the substrate, it is difficult to maintain the characteristics of the inductor component when the substrate is made thinner.

[0008] Therefore, it is considered to embed the inductor component of Patent Document 2 in the substrate so that the plane around which the inductor wiring is wound is perpendicular to the thickness direction of the substrate. This can reduce the influence of the thinning of the substrate on the characteristics of the inductor component.

[0009] On the other hand, the inductor component of Patent Document 2 is assumed to be surface mounted, and it is difficult to say that it is a structure corresponding to three-dimensional mounting. For example, in the inductor component of Patent Document 2, the inductor wiring is temporarily led out to the side side of the inductor component (along the direction of the plane on which the inductor wiring is wound = the main surface direction of the substrate) through the lead-out portion and then connected to the external terminal. This assumes that the wiring pattern of the substrate is connected to the inductor component from the side side along the main surface of the substrate in surface mounting. On the other hand, in three-dimensional mounting, the wiring pattern of the substrate is connected to the inductor component from the upper surface side or the lower surface side, but if the inductor wiring is temporarily led out to the side side as in the inductor component of Patent Document 2, the wiring pattern temporarily detours to the side side of the inductor component and then connects to the inductor wiring, resulting in unnecessary wiring routing.

[0010] In addition, in the surface-mounted inductor components, which include not only inductor components having L-shaped external terminals as in the inductor component of Patent Document 2, but also in the bottom electrode type inductor components in which the external terminals are exposed only from the upper surface or the lower surface, the external terminals are basically arranged close to the side surface. This is because in surface mounting, the inductor component is soldered to the substrate, so in order to prevent the short circuit between the electrodes caused by the wetting and diffusion of the solder, the interval between the external terminals is made as wide as possible. On the other hand, in three-dimensional mounting, the connection between the inductor component and the wiring pattern of the substrate is not limited to soldering. Therefore, there is a concern that the wide interval between the external terminals will lead to unnecessary wiring routing. Summary of the invention

[0011] Therefore, an object of the present disclosure is to provide an inductor array component and an inductor array component built-in substrate that can improve the degree of freedom in circuit design by also supporting three-dimensional mounting.

[0012] In order to solve the above-mentioned problems, an inductor array component according to one aspect of the present disclosure includes:

[0013] A flat plate-shaped main body including a magnetic layer, wherein the magnetic layer includes a resin and a metal magnetic powder contained in the resin;

[0014] The first inductor wiring and the second inductor wiring are arranged on the same plane in the main body and are adjacent to each other;

[0015] a plurality of first vertical wirings extending from the first end side and the second end side of the first inductor wiring and the first end side and the second end side of the second inductor wiring in a first direction in a normal direction relative to the plane so as to penetrate the interior of the body and be exposed on the first main surface side of the body; and

[0016] A plurality of second vertical wirings extend from the first end side and the second end side of the first inductor wiring and the first end side and the second end side of the second inductor wiring in a second direction in the normal direction relative to the plane to penetrate the interior of the body and be exposed on the second main surface side of the body.

[0017] According to the inductor array component of the present disclosure, the first and second vertical wirings are led out in the first and second directions relative to the first and second inductor wirings, thereby improving the degree of freedom in connection with the wirings.

[0018] In one embodiment of the inductor array component, preferably, with respect to each of the plurality of first vertical wirings, a central axis of the second vertical wiring extending from the same position in the second direction is coaxial with a central axis of the first vertical wiring.

[0019] Here, existing on the same axis includes not only completely coinciding with the central axes but also substantially coinciding with each other. Specifically, when the central axes are offset by about 10% of the width of the first and second vertical wirings, they are considered to be existing on the same axis as a manufacturing variation.

[0020] According to the above embodiment, since the central axes of the paired first vertical wiring and second vertical wiring exist on the same axis, the physical and electrical differences between the front and back of the inductor array component can be reduced.

[0021] In one embodiment of the inductor array component, preferably, with respect to each of the plurality of first vertical wirings, a cross-sectional area of ​​the second vertical wiring extending from the same position in the second direction is different from a cross-sectional area of ​​the first vertical wiring.

[0022] Here, the cross-sectional area refers to the area on a transverse section perpendicular to the direction in which the vertical wiring extends.

[0023] According to the above embodiment, the first and second vertical wirings to be connected can be selected according to the current density flowing through the inductor wiring. Therefore, it is not necessary to make each vertical wiring have the same cross-sectional area. By reducing the cross-sectional area of ​​a part of the vertical wiring and increasing the volume of the magnetic layer around it, the inductance can be increased with respect to the same component shape.

[0024] In one embodiment of the inductor array component, it is preferable to further include a non-magnetic insulating layer covering at least a portion of the first inductor wiring and the second inductor wiring.

[0025] According to the above embodiment, the insulation properties of the first and second inductor wirings can be improved.

[0026] In one embodiment of the inductor array component, the insulating layer preferably includes at least one of epoxy resin, phenol resin, polyimide resin, acrylic resin, and vinyl ether resin.

[0027] According to the above embodiment, by using an insulating organic resin for the insulating layer, the adhesion between the inductor wiring and the magnetic layer can be improved. In addition, compared with the case where an inorganic material is used for the insulating layer, the insulating layer is softer, so the inductor array component can be given flexibility, and the mechanical strength and resistance to thermal shock can be improved.

[0028] Preferably, in one embodiment of the inductor array component, at least one of the multiple first vertical wirings and the multiple second vertical wirings includes: a via-hole conductor extending from the first end or the second end of the first inductor wiring or the second inductor wiring in the normal direction and penetrating the interior of the insulating layer, and a columnar wiring extending from the via-hole conductor in the normal direction and penetrating the interior of the magnetic layer.

[0029] According to the above embodiment, different processes can be used for the via-hole conductors penetrating the interior of the insulating layer and the columnar wirings penetrating the interior of the magnetic layer, thereby improving the degree of freedom in manufacturing.

[0030] In one embodiment of the inductor array component, preferably, of the set of the first vertical wiring and the second vertical wiring extending from the same position in the normal direction, one includes the via-hole conductor and the columnar wiring, and the other does not include the via-hole conductor.

[0031] According to the above-mentioned embodiment, the other of the first vertical wiring and the second vertical wiring does not include a via conductor, and there is no insulating layer on the other side, so even if the component shape is the same, the DC superposition characteristics of the inductor array component can be improved, and even if the characteristics are the same, the inductor array component can be made lighter and thinner.

[0032] In one embodiment of the inductor array component, preferably, a minimum distance between the plurality of first vertical wirings and the plurality of second vertical wirings and the metal magnetic powder is 200 nm or less.

[0033] According to the above embodiment, the filling amount of the metal magnetic powder can be increased, so the inductance can be improved.

[0034] In one embodiment of the inductor array component, preferably, a minimum distance between the first inductor wiring and the second inductor wiring and the metal magnetic powder is 200 nm or less.

[0035] According to the above embodiment, the filling amount of the metal magnetic powder can be increased, so the inductance can be improved.

[0036] Preferably, in one embodiment of the inductor array component,

[0037] The magnetic layer includes a main surface having projections and depressions and parallel to the plane.

[0038] The arithmetic mean roughness R of the concavities and convexities of the main surface of the magnetic layer is a It is 1 / 10 or less of the thickness T of the magnetic layer.

[0039] According to the above embodiment, since the irregularities on the main surface of the magnetic layer are small, stress is less likely to be applied to the irregularities on the surface of the inductor array component when the inductor array component is embedded, and damage to the inductor array component can be prevented.

[0040] In one embodiment of the inductor array component, it is preferable that a cover film is further provided on a surface of the magnetic layer.

[0041] According to the above embodiment, when external terminals are provided on the surface of the magnetic layer, the cover film can improve the insulation between the external terminals. In addition, the cover film can shield the surface of the magnetic layer from damage.

[0042] In one embodiment of the inductor array component, it is preferable that the inductor array component further includes a plurality of inductor wirings stacked in the normal direction of the first inductor wiring and the second inductor wiring.

[0043] According to the above embodiment, by stacking a plurality of inductor wirings on the first inductor wiring and the second inductor wiring, the mounting area can be reduced. Furthermore, by connecting the stacked inductor wirings in series, the inductance can be increased.

[0044] Preferably, in one embodiment of the inductor array component,

[0045] The invention further comprises a plurality of interlayer via conductors for connecting the inductor wirings of different layers in the normal direction.

[0046] A central axis of at least one of the plurality of interlayer via conductors is different from a central axis of each of the first vertical wiring and the second vertical wiring.

[0047] According to the above embodiment, since recessing can be suppressed when forming an interlayer via-hole conductor, an inductor array component with stable quality can be provided.

[0048] In one embodiment of the inductor array component, preferably, an average particle size of the metal magnetic powder is not less than 1 / 30 and not more than 1 / 3 of an inscribed circle of an internal magnetic path of the first inductor wiring and the second inductor wiring as viewed in the normal direction.

[0049] According to the above embodiment, the obtainable magnetic permeability can be increased, and the metal magnetic powder can be stably filled into the internal magnetic circuit.

[0050] In one embodiment of the inductor array component, preferably, an average particle size of the metal magnetic powder is not less than 1 / 30 and not more than 1 / 3 of a maximum distance between the first inductor wiring and the second inductor wiring.

[0051] According to the above embodiment, the obtainable magnetic permeability can be increased, and the metal magnetic powder can be stably filled between the first inductor wiring and the second inductor wiring.

[0052] In one embodiment of the inductor array component, preferably, an average particle size of the metal magnetic powder is not less than 1 / 10 and not more than 2 / 3 of a thickness T of the magnetic layer.

[0053] According to the above-described embodiment, the obtainable magnetic permeability can be increased, and the effective magnetic permeability can be improved.

[0054] In one embodiment of the inductor array component, preferably, the magnetic layer further includes ferrite powder.

[0055] According to the above embodiment, the relative magnetic permeability of the ferrite powder is high, so the magnetic permeability per unit volume of the magnetic layer, that is, the effective magnetic permeability can be increased. In addition, the insulation property of the magnetic layer can be improved.

[0056] In one embodiment of the inductor array component, preferably, the magnetic layer includes non-magnetic powder made of an insulator.

[0057] According to the above embodiment, the magnetic layer contains non-magnetic powder composed of an insulator such as a silica filler, so the insulating property of the magnetic layer can be improved.

[0058] Preferably, in one embodiment of the inductor array component built-in substrate, the substrate includes:

[0059] The inductor array component described above;

[0060] a substrate in which the inductor array component is embedded; and

[0061] The substrate wiring includes a pattern portion extending in a direction along the main surface of the substrate and a substrate through-hole portion extending in a thickness direction of the substrate.

[0062] The substrate wiring is connected to the inductor array component through the substrate via portion.

[0063] According to the above-described embodiment, the degree of freedom in circuit design can be improved.

[0064] In one embodiment of the inductor array component built-in substrate, preferably, the pattern portion of the substrate wiring is arranged parallel to a plane on which the inductor wiring is arranged.

[0065] According to the above embodiment, the inductor array component built-in substrate can be made thinner.

[0066] According to the inductor array component and the inductor array component built-in substrate of one aspect of the present disclosure, the degree of freedom in circuit design can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] Figure 1A It is a perspective plan view showing the inductor array component according to the first embodiment.

[0068] Figure 1B It is a cross-sectional view showing the inductor array component according to the first embodiment.

[0069] Figure 2 yes Figure 1B Enlarged view of part A.

[0070] Figure 3 is a cross-sectional view showing another inductor array component.

[0071] Figure 4A It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0072] Figure 4B It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0073] Figure 4C It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0074] Figure 4D It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0075] Figure 4E It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0076] Figure 4F It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0077] Figure 4G It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0078] Figure 4H It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0079] Fig. 4I It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0080] Figure 4J It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0081] Figure 4K It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0082] Figure 4L It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0083] Figure 4M It is an explanatory diagram for explaining the method of manufacturing the inductor array component according to the first embodiment.

[0084] Figure 5 It is a cross-sectional view showing an inductor array component according to a second embodiment.

[0085] Fig. 6A It is a perspective plan view showing an inductor array component according to a third embodiment.

[0086] Figure 6B It is a cross-sectional view of the inductor array component according to the third embodiment.

[0087] Fig. 7A It is a perspective plan view showing an inductor array component according to a fourth embodiment.

[0088] Figure 7B It is a cross-sectional view of the inductor array component according to the fourth embodiment.

[0089] Figure 8 It is a cross-sectional view of a substrate with built-in inductor array components according to a fifth embodiment.

[0090] Explanation of reference numerals: 1, 1A to 1D…inductor array component, 5…inductor array component built-in substrate, 6…substrate, 6f…substrate wiring, 10…body, 10a…first principal surface, 10b…second principal surface, 11…magnetic layer, 13…internal magnetic circuit, 15…insulating layer, 21, 21C…first inductor wiring, 21a…first end, 21b…second end, 22, 22C…second inductor wiring, 22a…first end, 22b…second end, 23…third inductor wiring, 25…via conductor, 28…interlayer via conductor, 31…first columnar wiring, 32…second columnar wiring, 41…first external terminal, 42…second external terminal, 50…cover film, 51…first vertical wiring, 52…second vertical wiring, 100…resin, 101…metal magnetic powder. DETAILED DESCRIPTION

[0091] Hereinafter, an inductor array component according to one aspect of the present disclosure will be described in detail with reference to the embodiments shown in the drawings. In addition, the drawings include some schematic drawings, and may not reflect actual dimensions or ratios.

[0092] (First Embodiment)

[0093] (constitute)

[0094] Figure 1A It is a perspective plan view showing the first embodiment of the inductor array component. Figure 1B yes Figure 1A X-X section view. Figure 2 yes Figure 1B A magnified view of part A. Figure 1A , Figure 1B as well as Figure 2 , the inductor array component 1 is described.

[0095] The inductor array component 1 is a component that is mounted on electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, and automotive electronics, and is, for example, a component that is in the shape of a rectangular parallelepiped as a whole. However, the shape of the inductor array component 1 is not particularly limited, and may be a cylindrical shape, a polygonal cylindrical shape, a truncated cone shape, or a polygonal truncated cone shape.

[0096] The inductor array component 1 includes a main body 10 , an insulating layer 15 , inductor wirings 21 , 22 , vertical wirings 51 , 52 , external terminals 41 , 42 , and a cover film 50 .

[0097] The first inductor wiring 21 is made of a conductive material and is wound in a plane. In other words, in this embodiment, the first inductor wiring 21 is a spiral wiring. Here, the spiral wiring refers to a curve (two-dimensional curve) extending on a plane, and the number of turns drawn by the curve may be more than one turn or less than one turn. In addition, it may have multiple curves wound in different directions, or may have a straight line in part.

[0098] In the figure, the normal direction relative to the plane on which the first inductor wiring 21 is wound is set as the Z direction (up and down direction), and hereinafter, the first direction as the positive Z direction is set as the upper side, and the second direction as the reverse Z direction is set as the lower side. In addition, the Z direction is the same in other embodiments and examples. When viewed from the upper side, the first inductor wiring 21 is wound in a spiral shape in the clockwise direction from the first end 21a as the inner peripheral end toward the second end 21b as the outer peripheral end. The first end 21a and the second end 21b may not be exact ends but may slightly enter the inside, or may have a protruding portion that becomes a current path.

[0099] The second inductor wiring 22 has the same structure as the first inductor wiring 21, and is wound in a spiral shape clockwise from the first end 22a as the inner peripheral end toward the second end 22b as the outer peripheral end. The first inductor wiring 21 and the second inductor wiring 22 are arranged side by side on the same plane in the body 10 and are adjacent to each other.

[0100] The first inductor wiring 21 and the second inductor wiring 22 are made of a conductive material, for example, a low-resistance metal material such as Cu, Ag, Au, Fe, or an alloy containing these metals. This can reduce the DC resistance of the first inductor wiring 21 and the second inductor wiring 22. As an embodiment of the first inductor wiring 21 and the second inductor wiring 22, the thickness is 45 μm, the wiring width is 50 μm, and the wiring space (turn pitch) is 10 μm.

[0101] The main body 10 is in the shape of a plate. The main body 10 has a first main surface 10a located on the upper side and a second main surface 10b located on the lower side opposite to the first main surface 10a. The main body 10 includes a magnetic layer 11. The first main surface of the magnetic layer 11 corresponds to the first main surface 10a of the main body 10, and the second main surface of the magnetic layer 11 corresponds to the second main surface 10b of the main body 10.

[0102] The magnetic layer 11 sandwiches the inductor wirings 21 and 22 from both sides in the Z direction and is also arranged inside and outside the inductor wirings 21 and 22. In this way, the magnetic layer 11 forms a closed magnetic path with respect to the inductor wirings 21 and 22. The magnetic layer 11 forms an internal magnetic path 13 inside the inductor wirings 21 and 22.

[0103] Magnetic layer 11 includes resin 100 and metal magnetic powder 101 contained in resin 100. Metal magnetic powder 101 can improve DC superposition characteristics, and resin 100 can electrically insulate metal magnetic powder 101 and reduce loss (iron loss) at high frequencies.

[0104] The resin 100 preferably includes at least one of an epoxy resin or an acrylic resin. This can improve the insulation of the magnetic layer 11, and can improve the mechanical strength of the magnetic layer 11 due to the stress relaxation effect of the resin 100. The resin 100 includes, for example, at least one of an epoxy resin, a polyimide resin, a phenolic resin, and a vinyl ether resin.

[0105] The metal magnetic powder 101 preferably includes Fe-based magnetic powder. This can provide excellent DC superposition characteristics. Examples of Fe-based magnetic powder include FeSi-based alloys such as FeSiCr, FeCo-based alloys, Fe-based alloys such as NiFe, or amorphous alloys thereof. These Fe-based magnetic powders can be used alone or in combination.

[0106] The magnetic layer 11 preferably further includes ferrite powder. Thus, since the relative magnetic permeability of the ferrite powder is high, the magnetic permeability per unit volume of the magnetic layer 11, that is, the effective magnetic permeability, can be increased, and the insulation of the magnetic layer 11 can be improved. Examples of the ferrite powder include NiZn-based ferrite and MnZn-based ferrite. These ferrite powders can be used alone or in combination.

[0107] The magnetic layer 11 preferably contains non-magnetic powder made of an insulator. Thus, the magnetic layer 11 can improve its insulation properties by containing non-magnetic powder made of an insulator such as a silica filler. In addition, the main body 10 may contain not only the magnetic layer 11 but also an insulator.

[0108] The insulating layer 15 is embedded in the main body 10 (magnetic layer 11). The insulating layer 15 is in direct contact with the first inductor wiring 21 and the second inductor wiring 22, and covers the first inductor wiring 21 and the second inductor wiring 22. Thus, the insulation of the first and second inductor wirings 21 and 22 can be improved. In addition, the insulating layer 15 may cover a portion of the first inductor wiring 21 and the second inductor wiring 22, or may be in direct contact with the first inductor wiring 21 or the second inductor wiring 22, or may be arranged to be spaced apart from the first inductor wiring 21 and the second inductor wiring 22. More specifically, the insulating layer 15 may cover only the bottom surface of the first inductor wiring 21 and / or the second inductor wiring 22, or may cover only the top surface and the side surface. In addition, in this case, the entire surface of the bottom surface, the top surface and the side surface may be covered, or only a portion of the surface may be covered, or multiple portions may be covered.

[0109] The insulating layer 15 does not contain a magnetic body, that is, it is a non-magnetic body and contains an insulating material. The insulating material is, for example, an insulating organic resin, and more specifically, contains at least one of epoxy resin, phenolic resin, polyimide resin, acrylic resin, and vinyl ether resin. If the insulating layer 15 contains these insulating organic resins, the first inductor wiring 21 and the second inductor wiring 22 are in close contact with the resin 100 contained in the magnetic layer 11 via the above-mentioned resin of the insulating layer 15, so as a result, the adhesion between the first inductor wiring 21 and the second inductor wiring 22 and the magnetic layer 11 can be improved. In addition, the insulating organic resin of the insulating layer 15 is softer than that of inorganic materials, so the inductor array component 1 can be given flexibility, and the mechanical strength and resistance to thermal shock can be improved. In addition, the insulating layer 15 can also contain non-magnetic fillers such as silica, in which case the strength, processability, and electrical properties of the insulating layer 15 can be improved.

[0110] The plurality of first vertical wirings 51 extend from the first end 21a side and the second end 21b side of the first inductor wiring 21 and the first end 22a side and the second end 22b side of the second inductor wiring 22 in the first direction (positive Z direction) to penetrate the interior of the body 10, and are exposed on the first main surface 10a side of the body 10. Specifically, the plurality of first vertical wirings 51 include a via hole conductor 25 extending from the first end 21a and the second end 21b of the first inductor wiring 21 and the first end 22a and the second end 22b of the second inductor wiring 22 in the first direction and penetrating the interior of the insulating layer 15, and a first columnar wiring 31 extending from the via hole conductor 25 in the first direction and penetrating the interior of the magnetic layer 11.

[0111] The plurality of second vertical wirings 52 extend from the first end 21a and the second end 21b of the first inductor wiring 21 and the first end 22a and the second end 22b of the second inductor wiring 22 in the second direction (anti-Z direction) to penetrate the interior of the body 10 and are exposed on the second main surface 10b side of the body 10. Specifically, the plurality of second vertical wirings 52 include a via hole conductor 25 extending from the first end 21a and the second end 21b of the first inductor wiring 21 and the first end 22a and the second end 22b of the second inductor wiring 22 in the second direction and penetrating the interior of the insulating layer 15, and a second columnar wiring 32 extending from the via hole conductor 25 in the second direction and penetrating the interior of the magnetic layer 11.

[0112] The external terminals 41 and 42 are electrically connected to the first and second inductor wirings 21 and 22, and are exposed from the first and second main surfaces 10a and 10b of the main body 10. The external terminals 41 and 42 cover a portion of the first and second main surfaces 10a and 10b of the main body 10, and are electrically connected to the first and second inductor wirings 21 and 22 via vertical wirings 51 and 52. The external terminals 41 and 42 are made of a conductive material. The conductive material is, for example, at least one of Cu, Ni and Au, or an alloy thereof. In addition, the external terminals 41 and 42 may be a multilayer metal film in which a plurality of metal films are stacked.

[0113] The plurality of first external terminals 41 are provided on the first main surface 10a and the second main surface 10b of the body 10, respectively. On the first main surface 10a, the plurality of first external terminals 41 are connected to the first vertical wiring 51 connected to the first end 21a of the first inductor wiring 21 and the first vertical wiring 51 connected to the first end 22a of the second inductor wiring 22, respectively. The first external terminals 41 cover the end surface of the first vertical wiring 51 (first columnar wiring 31) exposed from the first main surface 10a of the body 10. On the second main surface 10b, the plurality of first external terminals 41 are connected to the second vertical wiring 52 connected to the first end 21a of the first inductor wiring 21 and the second vertical wiring 52 connected to the first end 22a of the second inductor wiring 22, respectively.

[0114] The plurality of second external terminals 42 are provided on the first main surface 10a and the second main surface 10b of the body 10, respectively. On the first main surface 10a, the plurality of second external terminals 42 are connected to the first vertical wiring 51 connected to the second end 21b of the first inductor wiring 21 and the first vertical wiring 51 connected to the second end 22b of the second inductor wiring 22, respectively. The second external terminals 42 cover the end surface of the first vertical wiring 51 (first columnar wiring 31) exposed from the first main surface 10a of the body 10. On the second main surface 10b, the plurality of second external terminals 42 are connected to the second vertical wiring 52 connected to the second end 21b of the first inductor wiring 21 and the second vertical wiring 52 connected to the second end 22b of the second inductor wiring 22, respectively.

[0115] The covering film 50 is provided on the surface of the magnetic layer 11. The covering film 50 covers a portion of the first and second main surfaces 10a and 10b of the main body 10, exposing the end surfaces of the external terminals 41 and 42. Thus, the covering film 50 can improve the insulation between the external terminals 41 and 42 (specifically, between the first external terminal 41 and the second external terminal 42, between adjacent first external terminals 41 and 41, and between adjacent second external terminals 42 and 42). In addition, the covering film 50 can cover the damage of the first and second main surfaces 10a and 10b of the main body 10. The covering film 50 does not contain a magnetic body, that is, it is a non-magnetic body, for example, it is composed of an insulating material exemplified as a material of the insulating layer 15.

[0116] According to the above-mentioned inductor array component 1, the first and second vertical wirings 51 and 52 are led out in the first direction and the second direction relative to the first and second inductor wirings 21 and 22, so that the degree of freedom of connection with the wiring of the mounting substrate is improved. For example, the inductor array component 1 can be connected to the input terminal only from the upper side and the output terminal only from the lower side. In addition, the first and second vertical wirings 51 and 52 are led out in the first direction and the second direction relative to the first and second inductor wirings 21 and 22, so that the upper and lower stresses can be made similar with respect to the first and second inductor wirings 21 and 22 of the inductor array component 1, and the warping of the inductor array component 1 can be suppressed. In addition, since the first and second vertical wirings 51 and 52 are led out from the first ends 21a and 22a and the second ends 21b and 22b of all the first and second inductor wirings 21 and 22 to the upper and lower sides of the inductor array component 1, the inductor array component 1 can be used without distinguishing between the front and back sides, and the front and back identification and arrangement steps during component manufacturing and component installation can be omitted.

[0117] Preferably, for each of the plurality of first vertical wirings 51, the center axis of the second vertical wiring 52 extending from the same position in the second direction is coaxial with the center axis of the first vertical wiring 51. Specifically, the center axis of the first columnar wiring 31 of the first vertical wiring 51 is coaxial with the center axis of the second columnar wiring 32 of the second vertical wiring 52, and the center axis of the via-hole conductor 25 of the first vertical wiring 51 is coaxial with the center axis of the via-hole conductor 25 of the second vertical wiring 52. In addition, in the same first vertical wiring 51, the center axis of the first columnar wiring 31 is coaxial with the center axis of the via-hole conductor 25, but may be eccentric. The same is true for the second vertical wiring 52.

[0118] Accordingly, the central axes of the paired first vertical wiring 51 and second vertical wiring 52 exist on the same axis, so the physical and electrical differences between the front and back of the inductor array component 1 can be reduced. In contrast, when the central axis is offset, there is a difference between the front and back of the inductor array component. If there is such a difference, it is necessary to confirm the front and back during installation, especially when the inductor array component is to be used with high precision. In addition, if the current path flowing through the inductor wiring is different on the front and back due to the offset of the connection position of the vertical wiring, the effective Rdc and inductance are also slightly different on the front and back.

[0119] The plurality of first and second vertical wirings 51 and 52 preferably include via-hole conductors 25 and columnar wirings 31 and 32. This allows different processes to be used for via-hole conductors 25 penetrating the insulating layer 15 and columnar wirings 31 and 32 penetrating the magnetic layer 11, thereby improving manufacturing freedom.

[0120] In addition, although in the inductor array component 1, the plurality of first vertical wirings and the plurality of second vertical wirings all include via-hole conductors and columnar wirings, the present invention is not limited thereto, and at least one of the plurality of first vertical wirings and the plurality of second vertical wirings may include a via-hole conductor and a columnar wiring. Specifically, in a set of first vertical wirings and second vertical wirings extending in the normal direction from the same position, one includes a via-hole conductor and a columnar wiring, and the other does not include a via-hole conductor.

[0121] For example, Figure 3 As shown in FIG. 1 , in another inductor array component 1a, the insulating layer 15 covers only the bottom surfaces of the first inductor wiring 21 and the second inductor wiring 22, and the top surfaces and side surfaces of the first inductor wiring 21 and the second inductor wiring 22 are in contact with the magnetic layer 11. In this case, the second vertical wiring 52 includes the via hole conductor 25 and the columnar wiring 32, while the first vertical wiring 51A does not include the via hole conductor 25 but includes the columnar wiring 31.

[0122] Accordingly, the other of the first vertical wiring and the second vertical wiring does not include a via conductor and does not include an insulating layer on the other side, so even with the same component appearance, the DC superposition characteristics of the inductor array component can be improved, and even with the same characteristics, the inductor array component can be made lighter and thinner.

[0123] It is preferred that the minimum distance between the first vertical wiring 51 and the second vertical wiring 52 and the metal magnetic powder 101 is less than 200 nm. Accordingly, the filling amount of the metal magnetic powder 101 in the magnetic layer 11 can be increased, so the inductance of the inductor array component 1 can be improved. Here, the minimum distance is measured using a SEM (Scanning Electron Microscope) image of a cross section passing through the central axis of the first vertical wiring 51. In other words, using the SEM image, the distance between the first vertical wiring 51 and the metal magnetic powder 101 in its vicinity is measured, and the smallest distance among the obtained distances is taken as the minimum distance. The same is true for the second vertical wiring 52. In addition, the magnification of the SEM image for measuring the distance is ten thousand times, or a magnification that includes about thirty metal magnetic powders 101.

[0124] It is preferred that the minimum distance between the first inductor wiring 21 and the second inductor wiring 22 and the metal magnetic powder 101 is 200 nm or less. This can increase the amount of metal magnetic powder 101 filled in the magnetic layer 11, so that the inductance of the inductor array component 1 can be improved. Here, the minimum distance is measured using an SEM image of a cross section passing through the central axis of the first inductor wiring 21. In other words, the distance between the first inductor wiring 21 and the metal magnetic powder 101 near it is measured using the SEM image, and the minimum distance among the obtained distances is taken as the minimum distance. The same is true for the second inductor wiring 22.

[0125] It is preferred that the main surface of the magnetic layer 11 (the first and second main surfaces 10a and 10b of the main body 10) have unevenness. The main surface of the magnetic layer 11 is parallel to the plane on which the first inductor wiring 21 and the second inductor wiring 22 are arranged. The unevenness is formed by granulating a part of the metal magnetic powder 101 from the first and second main surfaces 10a and 10b. Although the unevenness is mainly composed of a part based on the flatness of the resin 100 part and a part based on the concave part 16 formed by granulating the metal magnetic powder 101, in the main surfaces 10a and 10b of the main body 10 of the present embodiment, the arithmetic mean roughness R a The dominant role is played by the latter part based on the recess 16 formed by the granulation of the metal magnetic powder 101. The layer in contact with the main surfaces 10a, 10b (for example, the cover film 50 and the first and second external terminals 41, 42) enters the recess 16, so the adhesion between the main surfaces 10a, 10b of the body 10 and the layer in contact with the main surfaces 10a, 10b is improved due to the anchoring effect.

[0126] The arithmetic mean roughness R of the concavities and convexities on the main surface of the magnetic layer 11 is preferably a is less than 1 / 10 of the thickness T of the magnetic layer 11. aWhen the thickness T is 1 / 10 or less of the magnetic layer 11 , the main surface of the magnetic layer 11 has small irregularities, so that stress is less likely to be applied to the surface irregularities of the inductor array device 1 when the inductor array device 1 is embedded, thereby preventing the inductor array device 1 from being damaged.

[0127] Arithmetic mean roughness R a The arithmetic mean roughness of a portion of a straight line on the first main surface 10a of the main body 10 passing through the first and second external terminals 41 and 42, excluding the portion overlapping with the first and second external terminals 41 and 42. In this embodiment, the straight line is drawn as a straight line on the first main surface 10a passing through the first and second external terminals 41 and 42, for example, Figure 1A The arithmetic mean roughness R can be measured using a shape analysis laser microscope (“Shape Measurement Laser Microscope VK-X100” manufactured by KEYENCE Corporation). a Specifically, the cover film 50 of the inductor array component 1 is peeled off to expose the first main surface 10a of the main body 10. The arithmetic mean roughness R of the portion of the first main surface 10a including the straight line passing through the external terminals 41 and 42 is measured at a measurement magnification of 50 times on the exposed first main surface 10a. a The same also applies to the second main surface 10 b.

[0128] The thickness T of the magnetic layer 11 is the thickness of the magnetic layer 11 in the Z direction. The thickness T is measured using a scanning electron microscope. Specifically, the inductor array component 1 is cut in the Z direction using a straight line drawn on the first main surface 10a passing through the first and second external terminals 41 and 42, and a SEM image is obtained from the cross section of the measurement sample using a scanning electron microscope. The thickness T is measured using the SEM image.

[0129] In addition, at least one of the first and second main surfaces 10a and 10b satisfies R a It is sufficient to be less than T / 10. In addition, when there are multiple magnetic layers 11, the thickness T of the magnetic layer refers to the sum of the thicknesses of the multiple magnetic layers. In addition, when there is a non-magnetic layer between the multiple magnetic layers 11, the thickness of the non-magnetic layer is not included in the thickness T.

[0130] The average particle size of the metal magnetic powder 101 is preferably not less than 1 / 30 and not more than 1 / 3 of the inscribed circle of the internal magnetic circuit of the first and second inductor wirings 21 and 22 observed from the normal direction (Z direction). Therefore, since the average particle size is not less than 1 / 30, the magnetic permeability that can be obtained by the inductor array component 1 can be increased without making the average particle size of the metal magnetic powder 101 smaller than necessary. In addition, since the average particle size is not more than 1 / 3, the metal magnetic powder 101 can be stably filled into the internal magnetic circuit. The inscribed circle of the internal magnetic circuit refers to the circle with the largest diameter among the circles that are in contact with the inner circumferential ends of the first and second inductor wirings 21 and 22 when the first and second inductor wirings 21 and 22 are observed from the Z direction. For example, the average particle size of the metal magnetic powder 101 is 45μm, and the inscribed circle of the internal magnetic circuit is 900μm. In addition, although the first and second inductor wirings 21 and 22 are covered by the insulating layer 15, the thickness of the insulating layer 15 is relatively thin, so it is not necessary to consider the thickness of the insulating layer 15. Specifically, if the thickness of the insulating layer 15 is less than 1 / 10 of the maximum diameter of the inscribed circle of the internal magnetic circuit of the first and second inductor wirings 21 and 22, it can be said that it is sufficiently thin.

[0131] The average particle size of the metal magnetic powder 101 is, for example, 0.1 μm to 50 μm, preferably 1 μm to 30 μm, and more preferably 2 μm to 5 μm. The particle size (volume median diameter D) corresponding to 50% of the cumulative value of the particle size distribution obtained by the laser diffraction / scattering method in the raw material state of the resin 100 containing the metal magnetic powder 101 can be used. 50 ), to calculate the average particle size of the metal magnetic powder 101. In addition, in the state of the finished product of the inductor array component 1, the average particle size of the metal magnetic powder 101 is measured using an SEM image of a cross section passing through the straight lines on the first and second main surfaces 10a and 10b of the main body 10. Specifically, in the SEM image at a magnification that can confirm 15 or more metal magnetic powders 101, the area of ​​each metal magnetic powder 101 is measured, and the equivalent circle diameter is calculated, and then the arithmetic mean thereof is taken as the average particle size of the metal magnetic powder 101.

[0132] The average particle size of the metal magnetic powder 101 is preferably not less than 1 / 10 and not more than 2 / 3 of the thickness T of the magnetic layer 11. Accordingly, since the average particle size of the metal magnetic powder 101 is not less than 1 / 10, the average particle size of the metal magnetic powder 101 does not become smaller than necessary relative to the magnetic layer 11, and the magnetic permeability that can be obtained by the inductor array component 1 can be increased. In addition, since the average particle size of the metal magnetic powder 101 is not more than 2 / 3, the granulation of the metal magnetic powder 101 during the grinding of the magnetic layer 11 can be reduced, and the effective magnetic permeability can be increased.

[0133] (Manufacturing method)

[0134] Next, a method for manufacturing the inductor array component 1 will be described.

[0135] like Figure 4A As shown in the figure, a dummy core substrate 61 is prepared. There is a substrate copper foil on both sides of the dummy core substrate 61. In this embodiment, the dummy core substrate 61 is a glass epoxy substrate. Since the thickness of the dummy core substrate 61 does not affect the thickness of the inductor array component, it is convenient to use a thickness and material that is easy to handle for reasons such as deformation during processing.

[0136] Next, copper foil 62 is bonded to the surface of the substrate copper foil. Copper foil 62 is bonded to the smooth surface of the substrate copper foil. Therefore, the bonding force between copper foil 62 and the substrate copper foil can be weakened, and in the subsequent process, the virtual core substrate 61 can be easily peeled off from copper foil 62. It is preferred that the adhesive bonding the virtual core substrate 61 and the virtual metal layer (copper foil 62) is a low-adhesive agent. In addition, in order to weaken the bonding force between the virtual core substrate 61 and the copper foil 62, it is preferred that the bonding surface of the virtual core substrate 61 and the copper foil 62 is a glossy surface.

[0137] Thereafter, the insulating layer 63 is laminated on the copper foil 62. At this time, the insulating layer 63 is thermally pressed and thermally cured by a vacuum laminator or a press machine.

[0138] like Figure 4B As shown in FIG. 1 , an opening 63a is formed in the insulating layer 63 by laser processing or the like. Then, as shown in FIG. Figure 4C As shown, dummy copper 64a and inductor wiring 64b are formed on the insulating layer 63. In detail, a power supply film (not shown) for SAP is formed on the insulating layer 63 by electroless plating, sputtering, evaporation, etc. After the power supply film is formed, a photosensitive resist is coated or pasted on the power supply film, and an opening of the photosensitive resist is formed at a position to become a wiring pattern by photolithography. Thereafter, metal wiring corresponding to the dummy copper 64a and the inductor wiring 64b is formed in the opening of the photosensitive resist layer. After the metal wiring is formed, the photosensitive resist is peeled off and removed by a chemical solution, and the power supply film is etched away. Thereafter, by further using the metal wiring as a power supply portion, additional copper electrolytic plating is performed to obtain wiring in a narrow space. In addition, by using SAP in Figure 4B The formed opening 63a is filled with copper.

[0139] Then, if Figure 4D As shown, the dummy copper 64a and the inductor wiring 64b are covered with an insulating layer 65. The insulating layer 65 is thermally pressed and thermally cured by a vacuum laminator or a press machine.

[0140] Next, if Figure 4E As shown, an opening 65 a is formed in the insulating layer 65 by laser processing or the like.

[0141] Thereafter, the dummy core substrate 61 is peeled off from the copper foil 62. Then, the copper foil 62 is removed by etching or the like, and the dummy copper 64a is removed by etching or the like, as shown in FIG. Figure 4F As shown, a hole portion 66a corresponding to the internal magnetic circuit and a hole portion 66b corresponding to the external magnetic circuit are formed.

[0142] Afterwards, if Figure 4G As shown in FIG. 1 , the insulating layer opening 67a is formed by laser processing or the like. Then, as shown in FIG. Figure 4H As shown, copper is filled in the insulating layer opening 67 a by SAP, and a columnar wiring 68 is formed on the insulating layer 63 .

[0143] Next, if Fig. 4I As shown, the inductor wiring, insulating layer, and columnar wiring are covered with a magnetic material (magnetic layer) 69 to form an inductor substrate. The magnetic material 69 is thermally pressed and thermally cured by a vacuum laminator or a punching machine. At this time, the magnetic material 69 is also filled into the holes 66a and 66b.

[0144] Then, if Figure 4J As shown in FIG. 1 , the magnetic material 69 on the upper and lower sides of the inductor substrate is thinned by a grinding process. At this time, by exposing a portion of the columnar wiring 68, the exposed portion of the columnar wiring 68 is formed on the same plane of the magnetic material 69. At this time, by grinding the magnetic material 69 to a sufficient thickness to obtain the inductance value, the inductor array component can be made thinner.

[0145] Afterwards, if Figure 4K As shown, an insulating resin (cover film) 70 is formed on the surface of the magnetic body by printing. Here, the opening 70a of the insulating resin 70 is used as a forming portion of the external terminal. In this embodiment, the printing method is used, but the opening 70a can also be formed by photolithography.

[0146] Next, if Figure 4L As shown, the external terminal 71a is formed by electroless copper plating or Ni and Au plating. Figure 4M As shown, the dotted line portion L is cut into individual pieces to obtain Figure 1B Inductor array components. In addition, Figure 4C Although not described hereafter, inductor substrates may be formed on both surfaces of the dummy core substrate 61. This can achieve high productivity.

[0147] (Second Embodiment)

[0148] Figure 51 is a cross-sectional view showing a second embodiment of the inductor array component. In the second embodiment, the cross-sectional areas of the first vertical wiring and the second vertical wiring are different from each other compared to the first embodiment. The different configurations are described below. In addition, in the second embodiment, the same reference numerals as those in the first embodiment are the same configurations as those in the first embodiment, so their descriptions are omitted.

[0149] like Figure 5 As shown, in the inductor array device 1A of the second embodiment, the first vertical wiring 51 and the second vertical wiring 52 connected to the same position have different cross-sectional areas. More specifically, for example, the cross-sectional area of ​​the second columnar wiring 32 is smaller than the cross-sectional area of ​​the first columnar wiring 31. The cross-sectional areas of the first and second vertical wirings 51 and 52 are the areas of the vertical wirings 51 and 52 in the cross section orthogonal to the direction (Z direction) in which the vertical wirings 51 and 52 extend.

[0150] If the cross-sectional areas of the first vertical wiring 51 and the second vertical wiring 52 are different from each other, the first and second vertical wirings 51 and 52 to be connected can be selected according to the current density flowing through the inductor wirings 21 and 22. Therefore, it is not necessary to make the vertical wirings 51 and 52 have the same cross-sectional area, and by making the cross-sectional area of ​​the second vertical wiring 52 smaller than the cross-sectional area of ​​the first vertical wiring 51, the volume of the magnetic layer 11 around the second vertical wiring 52 is increased, thereby increasing the inductance with respect to the same outer shape of the inductor array component 1.

[0151] Furthermore, the cross-sectional area of ​​the first vertical wiring 51 may be smaller than the cross-sectional area of ​​the second vertical wiring 52. In this case, the volume of the magnetic layer 11 around the first vertical wiring 51 is increased, so that the inductance can be increased with respect to the same outer shape of the inductor array component 1. In addition, in at least one of the multiple groups of the first vertical wiring 51 and the second vertical wiring 52 connected to the same position, the cross-sectional areas of the first vertical wiring 51 and the second vertical wiring 52 are different from each other.

[0152] (Third Embodiment)

[0153] Fig. 6A It is a perspective plan view showing a third embodiment of the inductor array component. Figure 6B is a cross-sectional view of an inductor array component according to a third embodiment ( Fig. 6AXX cross-sectional view of the third embodiment). The third embodiment differs from the first embodiment in the configuration of the inductor wiring (more specifically, the shape and number of the inductor wiring) and in the fact that an interlayer via conductor is further provided. The following describes the different configuration. In the third embodiment, the same reference numerals as those in the first embodiment indicate the same configuration as those in the first embodiment, and therefore their description is omitted.

[0154] like Fig. 6A as well as Figure 6B As shown, the inductor array component 1B of the third embodiment is compared with the first embodiment, in which a plurality of inductor wirings are stacked in the normal direction (Z direction) of the first inductor wiring 21 and the second inductor wiring 22. Thus, by stacking a plurality of inductor wirings in the normal direction, the influence on the mounting area can be reduced. In addition, by connecting the stacked inductor wirings in series, the inductance of the inductor array component 1B can be increased.

[0155] Specifically, the third inductor wiring 23 is stacked in the normal direction of the first inductor wiring 21 , and the first inductor wiring 21 and the third inductor wiring 23 are connected in series. The first inductor wiring 21 and the third inductor wiring 23 are connected in series via the interlayer via conductor 28 .

[0156] The first end 21a of the first inductor wiring 21 is electrically connected to the first external terminal 41 on the second main surface 10b side via the second vertical wiring 52 below the first end 21a. The second end 21b of the first inductor wiring 21 is electrically connected to the second external terminal 42 on the first main surface 10a side via the first vertical wiring 51 above the second end 21b, and is electrically connected to the second external terminal 42 on the second main surface 10b side via the second vertical wiring 52 below the second end 21b.

[0157] The third inductor wiring 23 is arranged on the upper side of the first inductor wiring 21. The first end 23a of the third inductor wiring 23 is electrically connected to the first external terminal 41 on the first main surface 10a side via the first vertical wiring 51 on the upper side of the first end 23a. The second end 23b of the third inductor wiring 23 is electrically connected to the second external terminal 42 on the first main surface 10a side via the first vertical wiring 51 on the upper side of the second end 23b, and is electrically connected to the second external terminal 42 on the second main surface 10b side via the second vertical wiring 52 on the lower side of the second end 23b.

[0158] The first end 21a of the first inductor wiring 21 and the first end 23a of the third inductor wiring 23 are electrically connected via the interlayer via conductor 28. Thus, the first end 21a of the first inductor wiring 21 is electrically connected to the first external terminal 41 on the first main surface 10a side via the first vertical wiring 51 above the first end 21a.

[0159] The central axis 28a of the interlayer via conductor 28 is different from the central axes 51a and 52a of the first vertical wiring 51 and the second vertical wiring 52. This can suppress the occurrence of depressions when forming the interlayer via conductor 28, and thus provide an inductor array device 1B of stable quality.

[0160] In the above embodiment, two inductor wirings are arranged in the Z direction, but three or more inductor wirings of different layers may be arranged in the Z direction. When three or more inductor wirings of different layers are arranged in the Z direction, a plurality of interlayer via conductors electrically connecting the three or more inductor wirings are provided. When the inductor array component includes a plurality of interlayer via conductors, the central axis of at least one of the plurality of interlayer via conductors is different from the central axis of each of the first vertical wiring and the second vertical wiring.

[0161] (Fourth Embodiment)

[0162] Fig. 7A It is a perspective plan view showing a fourth embodiment of the inductor array component. Figure 7B yes Fig. 7A XX cross-sectional view. The fourth embodiment is different from the first embodiment in the configuration of the inductor wiring. The different configuration is described below. In the fourth embodiment, the same reference numerals as those in other embodiments are the same configurations as those in the first embodiment, and thus their descriptions are omitted.

[0163] like Fig. 7A and Figure 7B As shown, the inductor array device 1C of the fourth embodiment is similar to the inductor array device 1 of the first embodiment, and includes vertical wirings 51 and 52 extending from the inductor wirings 21C and 22C in the Z direction and penetrating the interior of the magnetic layer 11. In other words, the first vertical wiring 51 and the second vertical wiring 52 are connected to the first ends 21a and 22a of the first and second inductor wirings 21C and 22C, respectively, and the first vertical wiring 51 and the second vertical wiring 52 are connected to the second ends 21b and 22b of the first and second inductor wirings 21C and 22C, respectively.

[0164] In the inductor array component 1C of the fourth embodiment, when viewed from the Z direction, the first inductor wiring 21C and the second inductor wiring 22C are semi-elliptical arcs. The arcs of the inductor wirings 21C and 22C are formed to protrude in a direction approaching each other. That is, the first and second inductor wirings 21C and 22C are curved wirings that are wound about half a turn. In addition, the inductor wirings 21C and 22C include a straight line portion in the middle. In addition, the first and second inductor wirings 21C and 22C may also be curved lines with a number of turns less than one turn.

[0165] In each of the first and second inductor wirings 21C and 22C, the inner diameter portion is defined as a range surrounded by the curved line drawn by the inductor wirings 21C and 22C and the straight line connecting the two ends of the inductor wirings 21C and 22C. At this time, when viewed from the Z direction, the inner diameter portions of the inductor wirings 21C and 22C do not overlap each other.

[0166] On the other hand, the first and second inductor wirings 21C and 22C are close to each other. That is, the magnetic flux generated in the first inductor wiring 21C surrounds the second inductor wiring 22C close to each other, and the magnetic flux generated in the second inductor wiring 22C surrounds the first inductor wiring 21C close to each other. Therefore, the magnetic coupling between the first inductor wiring 21C and the second inductor wiring 22C becomes stronger.

[0167] In addition, in the first and second inductor wirings 21C and 22C, when current flows from the first ends 21a and 22a on the same side to the second ends 21b and 22b on the opposite side at the same time, the magnetic fluxes of each other are mutually reinforced. This means that when the first ends 21a and 22a of the first inductor wiring 21C and the second inductor wiring 22C are used as the input side of the pulse signal together, and the second ends 21b and 22b are used as the output side of the pulse signal together, the first inductor wiring 21C and the second inductor wiring 22C are positively coupled. On the other hand, for example, if the first end 21a side of the first inductor wiring 21C is used as input and the second end 21b side is used as output, and the first end 22a side of the second inductor wiring 22C is used as output and the second end 22b side is used as input, the first inductor wiring 21C and the second inductor wiring 22C can be in a negatively coupled state.

[0168] The average particle size of the metal magnetic powder 101 is preferably not less than 1 / 30 and not more than 1 / 3 of the maximum distance between the first inductor wiring 21C and the second inductor wiring 22C. Thus, since the average particle size is not less than 1 / 30, the average particle size of the metal magnetic powder 101 will not be reduced more than necessary, and the magnetic permeability that can be obtained by the inductor array component 1 can be increased. In addition, since the average particle size is not more than 1 / 3, it can be stably filled between the first inductor wiring 21C and the second inductor wiring 22C. The maximum distance between the first inductor wiring 21C and the second inductor wiring 22C refers to the maximum distance when the first and second inductor wirings 21C and 22C are observed from the Z direction. In addition, although the first and second inductor wirings 21C and 22C are covered by the insulating layer 15, since the thickness of the insulating layer 15 is relatively thin, the thickness of the insulating layer 15 can also be ignored.

[0169] (Fifth Embodiment)

[0170] Figure 8 FIG. 4 is a cross-sectional view showing a fifth embodiment of the inductor array component built-in substrate. Figure 8 As shown, the inductor array component built-in substrate 5 of the fifth embodiment includes an inductor array component 1D, a substrate 6 in which the inductor array component 1D is embedded, and a substrate wiring 6f. The substrate wiring 6f includes pattern portions 6a to 6d extending in a direction along the main surface (substrate main surface 17) of the substrate 6, and a substrate via hole portion 6e extending in the thickness direction of the substrate 6. The substrate wiring 6f is connected to the inductor array component 1D at the substrate via hole portion 6e.

[0171] The inductor array device 1D differs from the inductor array device 1 of the first embodiment in that it does not include the cover film 50 . Other configurations are the same as those of the inductor array device 1 of the first embodiment, and thus description thereof will be omitted.

[0172] The substrate 6 has a core material 7 and an insulating layer 8. The inductor array component 1D is disposed in the through-hole 7a of the core material 7 and is covered by the insulating layer 8 together with the core material 7. In the inductor array component 1D, when the main surfaces 10a and 10b of the body 10 are formed with irregularities, the insulating layer 8 covers the main surfaces 10a and 10b having the irregularities, so that the adhesion between the main surfaces 10a and 10b and the insulating layer 8 is improved due to the anchor effect.

[0173] It is preferred that the principal surfaces 10a and 10b of the main body 10 of the inductor array component 1D are parallel to the substrate principal surface 17. When the principal surfaces 10a and 10b of the inductor array component 1D are parallel to the substrate principal surface 17, the inductor array component built-in substrate 5 can be further thinned. In addition, the inductor array component 1D may be embedded in the substrate 6 in a state where the substrate principal surface 17, the principal surfaces 10a and 10b of the main body 10, and the plane on which the inductor wirings 21 and 22 are arranged are substantially parallel. In such a case, the Z direction in the inductor array component 1D (the normal direction with respect to the plane on which the inductor wirings 21 and 22 are arranged) substantially coincides with the thickness direction in the substrate 6 and is substantially orthogonal to the substrate principal surface 17.

[0174] The external terminals 41 and 42 of the inductor array component 1D are directly connected to the substrate via hole portion 6e. In other words, the substrate wiring 6f is connected to the external terminals 41 and 42 of the inductor array component 1D at the substrate via hole portion 6e. In addition, the substrate via hole portion 6e includes a first via hole portion connected to the inductor array component 1D from the upper side in the Z direction, and a second via hole portion connected to the inductor array component 1D from the lower side in the Z direction. Specifically, the first external terminal 41 on the upper side is connected to the first pattern portion 6a via the substrate via hole portion 6e (first via hole portion) on the upper side of the first external terminal 41. The second external terminal 42 on the upper side is connected to the second pattern portion 6b via the substrate via hole portion 6e (first via hole portion) on the upper side of the second external terminal 42. The second external terminal 42 on the lower side is connected to the third pattern portion 6c via the substrate via hole portion 6e (second via hole portion) on the lower side of the second external terminal 42. Furthermore, the lower first external terminal 41 is not connected to the fourth pattern portion 6 d below the first external terminal 41 .

[0175] Therefore, the inductor array component built-in substrate 5 includes the inductor array component 1D, so the degree of freedom in circuit design can be increased. Preferably, the pattern portions 6a to 6d of the substrate wiring 6f are arranged parallel to the plane where the inductor wirings 21 and 22 are arranged. Thus, the inductor array component built-in substrate 5 can be made thinner.

[0176] In summary, in the inductor array component built-in substrate 5, the inductor wirings 21 and 22 of the inductor array component 1D are connected to the substrate wiring 6f through the vertical wirings 51 and 52 extending in the Z direction and the substrate via 6e. This means that the inductor wiring 21 and the substrate wiring 6f are connected without routing an unnecessary wiring. In the inductor array component built-in substrate 5, since the unnecessary routing is omitted, the free space can be effectively utilized, and thus the degree of freedom of circuit design can be improved compared with the inductor array component and the inductor array component built-in substrate of the prior art.

[0177] In addition, in the inductor array component built-in substrate 5, since there is no extra wiring routing, the wiring resistance can be reduced. In addition, in the inductor array component built-in substrate 5, by embedding the relatively large inductor array component 1D in the substrate 6, the entire circuit can be miniaturized and thinned.

[0178] In addition, the substrate wiring 6f is electrically connected from both sides (upper and lower sides) of the inductor array component 1D in the Z direction. In this case, compared with a conventional inductor array component built-in substrate in which the substrate wiring is connected only from one side of the inductor array component 1D, the layout options of the pattern portions 6a to 6d increase, and the degree of freedom of circuit design increases.

[0179] Furthermore, as described in the first embodiment, in the inductor array component 1D, the areas of the external terminals 41 and 42 are larger than the areas of the columnar wirings 31 and 32 when viewed from the Z direction, so that the areas of the external terminals 41 and 42 can be increased. Therefore, when the inductor array component 1D is embedded in the substrate 6, when the substrate via holes 6e connected to the external terminals of the inductor array component 1D are provided in the substrate 6, the margin of the formation position of the substrate via holes 6e with respect to the external terminals 41 and 42 can be increased, and the yield rate during embedding can be improved.

[0180] In addition, although Figure 8 In the embodiment, only the inductor array component 1D and the substrate wiring 6f are described in the inductor array component built-in substrate 5, but other electronic components such as semiconductor components, capacitor components, and resistor components may be embedded in the inductor array component built-in substrate 5. In addition, other electronic components may be mounted on the surface of the substrate main surface 17, or semiconductor chips may be bonded. In addition, the inductor array components of the second to fourth embodiments may be embedded in the inductor array component built-in substrate of the fifth embodiment instead of the inductor array component 1D.

[0181] In addition, the present disclosure is not limited to the above-mentioned embodiments, and design changes can be made within the scope of the main purpose of the present disclosure. For example, various combinations of the characteristic points of the first to fifth embodiments can also be made. In addition, in the first to sixth embodiments, even if the effects described in other embodiments are not specifically mentioned in the embodiment and the description is omitted, if the embodiment has the same structure, the same effects can basically be exerted in the embodiment.

[0182] In the above embodiment, the inductor wiring is a spiral wiring, but the inductor wiring is not limited to the above embodiment, and can have various well-known structures and shapes such as a straight shape, a curved shape, and a spiral shape. In other words, the inductor wiring of the present disclosure is a wiring that gives inductance to the inductor array component by causing a magnetic flux to be generated in the magnetic layer when a current flows, and its structure, shape, material, etc. are not particularly limited.

[0183] In the above embodiment, the inductor wiring is covered by the insulating layer, but the insulating layer may not be provided and the entire inductor wiring may be in contact with the magnetic layer. The number of inductor wirings may be increased or decreased without departing from the gist of the present disclosure.

Claims

1. An inductor array component, comprising: A flat plate-shaped main body including a magnetic layer, wherein the magnetic layer includes a resin and a metal magnetic powder contained in the resin; The first inductor wiring and the second inductor wiring are arranged on the same plane in the main body and are adjacent to each other; a plurality of first vertical wirings extending from the first end side and the second end side of the first inductor wiring and the first end side and the second end side of the second inductor wiring in a first direction in a normal direction relative to the plane to penetrate the interior of the body and be exposed on the first main surface side of the body; as well as a plurality of second vertical wirings extending from the first end side and the second end side of the first inductor wiring and the first end side and the second end side of the second inductor wiring in a second direction in a normal direction relative to the plane to penetrate the interior of the body and be exposed on the second main surface side of the body, A first vertical wiring and a second vertical wiring extending from the same position of the same inductor wiring constitute one group, In at least one of the plurality of groups consisting of the plurality of first vertical wirings and the plurality of second vertical wirings extending from the same inductor wiring, the first vertical wirings and the second vertical wirings have cross-sectional areas different from each other.

2. The inductor array component according to claim 1, in, With respect to each of the plurality of first vertical wirings, a central axis of the second vertical wiring extending from the same position in the second direction exists on the same axis as a central axis of the first vertical wiring.

3. The inductor array component according to claim 1, in, A non-magnetic insulating layer is further provided, and the insulating layer covers at least a portion of the first inductor wiring and the second inductor wiring.

4. The inductor array component according to claim 3, in, The insulating layer includes at least one of epoxy resin, phenolic resin, polyimide resin, acrylic resin and vinyl ether resin.

5. The inductor array component according to claim 3, in, At least one of the multiple first vertical wirings and the multiple second vertical wirings includes: a via-hole conductor extending from the first end or the second end of the first inductor wiring or the second inductor wiring in the normal direction and penetrating the interior of the insulating layer, and a columnar wiring extending from the via-hole conductor in the normal direction and penetrating the interior of the magnetic layer.

6. The inductor array component according to claim 5, in, In the set of the first vertical wiring and the second vertical wiring extending from the same position in the normal direction, one includes the via-hole conductor and the columnar wiring, and the other does not include the via-hole conductor.

7. The inductor array component according to any one of claims 1 to 6, in, The minimum distance between the plurality of first vertical wirings and the plurality of second vertical wirings and the metal magnetic powder is less than 200 nm.

8. The inductor array component according to any one of claims 1 to 6, in, A minimum distance between the first inductor wiring and the second inductor wiring and the metal magnetic powder is 200 nm or less.

9. The inductor array component according to any one of claims 1 to 6, in, The magnetic layer includes a main surface having projections and depressions and parallel to the plane. The arithmetic mean roughness R of the concavities and convexities of the main surface of the magnetic layer is a It is 1 / 10 or less of the thickness T of the magnetic layer.

10. The inductor array component according to any one of claims 1 to 6, in, The invention further includes a cover film provided on the surface of the magnetic layer.

11. The inductor array component according to any one of claims 1 to 6, in, The invention further includes a plurality of inductor wirings stacked in the normal direction of the first inductor wiring and the second inductor wiring.

12. The inductor array component according to claim 11, in, The invention further comprises a plurality of interlayer via conductors for connecting the inductor wirings of different layers in the normal direction. A central axis of at least one of the plurality of interlayer via conductors is different from a central axis of each of the first vertical wiring and the second vertical wiring.

13. The inductor array component according to any one of claims 1 to 6 and 12, in, The average particle size of the metal magnetic powder is not less than 1 / 30 and not more than 1 / 3 of an inscribed circle of an internal magnetic path of the first inductor wiring and the second inductor wiring as viewed in the normal direction.

14. The inductor array component according to any one of claims 1 to 6 and 12, in, An average particle size of the metal magnetic powder is not less than 1 / 30 and not more than 1 / 3 of a maximum distance between the first inductor wiring and the second inductor wiring.

15. The inductor array component according to any one of claims 1 to 6 and 12, in, The average particle size of the metal magnetic powder is not less than 1 / 10 and not more than 2 / 3 of the thickness T of the magnetic layer.

16. The inductor array component according to any one of claims 1 to 6 and 12, in, The magnetic layer further contains ferrite powder.

17. The inductor array component according to any one of claims 1 to 6 and 12, in, The magnetic layer contains non-magnetic powder made of an insulator.

18. An inductor array component comprising: A flat plate-shaped main body including a magnetic layer, wherein the magnetic layer includes a resin and a metal magnetic powder contained in the resin; The first inductor wiring and the second inductor wiring are arranged on the same plane in the main body and are adjacent to each other; a plurality of first vertical wirings extending from the first end side and the second end side of the first inductor wiring and the first end side and the second end side of the second inductor wiring in a first direction in a normal direction relative to the plane to penetrate the interior of the body and be exposed on the first main surface side of the body; a plurality of second vertical wirings extending from the first end side and the second end side of the first inductor wiring and the first end side and the second end side of the second inductor wiring in a second direction in a normal direction relative to the plane to penetrate the interior of the body and be exposed on the second main surface side of the body; a plurality of inductor wirings stacked in the normal direction of the first inductor wiring and the second inductor wiring; as well as The plurality of interlayer via conductors connect the inductors of different layers in the normal direction. With respect to each of the plurality of first vertical wirings, a central axis of the second vertical wiring extending from the same position in the second direction is coaxial with a central axis of the first vertical wiring. A central axis of at least one of the plurality of interlayer via conductors is located on a different axis from central axes of the first vertical wiring and the second vertical wiring located on the same side as the at least one interlayer via conductor at the first end and the second end.

19. The inductor array component according to claim 18, in, A non-magnetic insulating layer is further provided, and the insulating layer covers at least a portion of the first inductor wiring and the second inductor wiring.

20. The inductor array component according to claim 19, in, The insulating layer includes at least one of epoxy resin, phenolic resin, polyimide resin, acrylic resin and vinyl ether resin.

21. The inductor array component according to claim 19, in, At least one of the multiple first vertical wirings and the multiple second vertical wirings includes: a via-hole conductor extending from the first end or the second end of the first inductor wiring or the second inductor wiring in the normal direction and penetrating the interior of the insulating layer, and a columnar wiring extending from the via-hole conductor in the normal direction and penetrating the interior of the magnetic layer.

22. The inductor array component according to claim 21, in, In the set of the first vertical wiring and the second vertical wiring extending from the same position in the normal direction, one includes the via-hole conductor and the columnar wiring, and the other does not include the via-hole conductor.

23. The inductor array component according to any one of claims 18 to 22, in, The minimum distance between the plurality of first vertical wirings and the plurality of second vertical wirings and the metal magnetic powder is less than 200 nm.

24. The inductor array component according to any one of claims 18 to 22, in, A minimum distance between the first inductor wiring and the second inductor wiring and the metal magnetic powder is 200 nm or less.

25. The inductor array component according to any one of claims 18 to 22, in, The magnetic layer includes a main surface having projections and depressions and parallel to the plane. The arithmetic mean roughness R of the concavities and convexities of the main surface of the magnetic layer is a It is 1 / 10 or less of the thickness T of the magnetic layer.

26. The inductor array component according to any one of claims 18 to 22, in, The invention further includes a cover film provided on the surface of the magnetic layer.

27. The inductor array component according to any one of claims 18 to 22, in, The average particle size of the metal magnetic powder is not less than 1 / 30 and not more than 1 / 3 of an inscribed circle of an internal magnetic path of the first inductor wiring and the second inductor wiring as viewed in the normal direction.

28. The inductor array component according to any one of claims 18 to 22, in, An average particle size of the metal magnetic powder is not less than 1 / 30 and not more than 1 / 3 of a maximum distance between the first inductor wiring and the second inductor wiring.

29. The inductor array component according to any one of claims 18 to 22, in, The average particle size of the metal magnetic powder is not less than 1 / 10 and not more than 2 / 3 of the thickness T of the magnetic layer.

30. The inductor array component according to any one of claims 18 to 22, in, The magnetic layer further contains ferrite powder.

31. The inductor array component according to any one of claims 18 to 22, in, The magnetic layer contains non-magnetic powder made of an insulator.

32. An inductor array component built-in substrate, comprising: The inductor array component according to any one of claims 1 to 31; a substrate in which the inductor array component is embedded; and The substrate wiring includes a pattern portion extending in a direction along the main surface of the substrate and a substrate through-hole portion extending in a thickness direction of the substrate. The substrate wiring is connected to the inductor array component through the substrate via portion.

33. The inductor array component built-in substrate according to claim 32, in, The pattern portion of the substrate wiring is arranged parallel to a plane on which the inductor wiring is arranged.

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