Bonding device and bonding method thereof

Abstract

The present application relates to a bonding device and a bonding method thereof. The bonding device includes a picking device, a carrier platform and a rotation drive mechanism. The picking device is used to pick up a first component to be bonded and move the first component to a preset position, and the preset position is located on one side of the surface to be bonded of the second component. The carrier platform is used to carry a second component, and the second component is located at an initial position. The rotation drive mechanism is connected to the carrier platform and is used to drive the carrier platform to rotate so as to drive the second component to rotate so that the second component rotates from the initial position to a target position, and the second component located at the target position is aligned with the first component located at the preset position.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a bonding device and a bonding method thereof. Background Art

[0002] As semiconductor technology enters the post-Moore era, in order to meet the needs of high integration and high performance, the chip structure is developing in a three-dimensional direction. In the field of semiconductor technology, chips (die) are usually bonded to chips (or chips to wafers or wafers to wafers) to interconnect chips of different process nodes with high density, so as to achieve system-level integration with smaller size, higher performance and lower power consumption. In the related art, before bonding the chip to a bonding target including a chip or a wafer, it is necessary to align the chip with the bonding target in the height direction by a pickup device. However, in the bonding device of the related art, the alignment accuracy of the chip bonding is low, and the alignment time is long, resulting in low bonding accuracy. Summary of the invention

[0003] The present application provides a bonding device and a bonding method thereof to improve the alignment accuracy of a chip, reduce the alignment time, and improve the bonding accuracy.

[0004] In order to achieve the above technical objectives, the present application provides a bonding device on one hand. The bonding device includes a picking device, a carrying platform and a rotation drive mechanism. The picking device is used to pick up the first component to be bonded and move the first component to a preset position, and the preset position is located on the side of the second component to be bonded. The carrying platform is used to carry the second component, and the second component is located at an initial position. The rotation drive mechanism is connected to the carrying platform, and is used to drive the carrying platform to rotate so as to drive the second component to rotate so that the second component rotates from the initial position to the target position, wherein the second component located at the target position is aligned with the first component located at the preset position.

[0005] To achieve the above technical objectives, the present application provides a bonding method on the other hand. The bonding method includes: picking up a first component to be bonded and moving the first component to a preset position, the preset position is located on one side of the surface to be bonded of the second component, and the second component is located at an initial position; rotating the second component so that the second component rotates from the initial position to a target position, wherein the second component located at the target position is aligned with the first component located at the preset position.

[0006] In the present application, the first element to be bonded is picked up by a picking device and the first element is moved to a preset position to achieve the movement alignment of the first element and the second element. The rotation drive mechanism drives the carrier to rotate and drives the second element to rotate so that the second element is rotated from an initial position to a target position to achieve the rotation alignment of the first element and the second element. In this way, the movement alignment and rotation alignment of the first element and the second element can be performed simultaneously, thereby saving the alignment operation time of the first element and the second element and improving production efficiency. Furthermore, the picking device may not need a rotating device for rotating the first element, thereby reducing the weight of the picking device, reducing the difficulty of rotation alignment, and improving the translation accuracy and service life of the picking device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The present application will illustrate the implementation methods in conjunction with the accompanying drawings. The accompanying drawings of the present application are only used to describe the embodiments for the purpose of demonstration. Without departing from the principles of the present application, those skilled in the art can easily make other embodiments according to the steps described below through the following description.

[0008] Figure 1 is a schematic structural diagram of a bonding device according to some embodiments of the present application;

[0009] Figure 2 is a schematic diagram of the alignment position of the first element and the second element according to some embodiments of the present application;

[0010] Figure 3 yes Figure 1 A schematic diagram of the top view of the transmission pair in FIG.

[0011] Figure 4 is a schematic flow chart of a bonding method according to some embodiments of the present application;

[0012] Figure 5 yes Figure 4 A flowchart of step S21 in FIG.

[0013] Figure 6 yes Figure 4 Schematic diagram of the process of step S22 in . DETAILED DESCRIPTION

[0014] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0015] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0016] The term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship. In addition, "many" in this article means two or more than two.

[0017] The terms "first", "second" and "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specified in some embodiments. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0018] refer to Figure 1 , Figure 1 1 is a schematic structural diagram of a bonding device 1000 according to some embodiments of the present application. The bonding device 1000 can be used to move and align a first component 10 to be bonded to be placed above a second component 20 to be bonded, so as to subsequently perform bonding of the first component 10 to the second component 20.

[0019] The first element 10 and / or the second element 20 may be a semiconductor material or a non-semiconductor material. The size of the first element 10 may be greater than, equal to, or smaller than the size of the second element 20. In some embodiments, the first element 10 may be a die, a wafer, or a chip on a wafer, and the second element 20 may be a die, a wafer, or a chip on a wafer. The following description is made by taking the example that the first element 10 is a chip and the second element 20 is a wafer.

[0020] like Figure 1 As shown, the bonding device 1000 may include a pickup device 30 , a carrier 40 and a rotation driving mechanism 50 .

[0021] The pick-up device 30 is used to pick up the first component 10 to be bonded and move the picked-up first component 10 to a preset position, which is located on the side of the second component 20 to be bonded. Figure 1 In the illustrated embodiment, the preset position is located above the second element 20. The first element 10 to be bonded can be placed on a platform, such as a film expansion platform 60. The film expansion platform 60 can be used to expand, clean, store, etc. the first element 10 after cutting. The first element 10 to be bonded can also be placed on other platforms, and the present application does not impose specific restrictions on this. The picking device 30 can move along at least one of the first direction, the second direction, and the third direction, and the angles between the first direction, the second direction, and the third direction can be any angle. Preferably, the first direction, the second direction, and the third direction are perpendicular to each other, and the first direction is, for example, Figure 1 The X direction or the first horizontal direction shown in , the second direction is for example Figure 1 The Y direction or the second horizontal direction shown in , the third direction is for example Figure 1 The Z direction or vertical direction shown in .

[0022] The picking device 30 may include a rotating mechanism, and when picking up the first component 10, the first component 10 may be driven to rotate; the picking device 30 may also not include a rotating mechanism, and when the picking device 30 picks up the first component 10, the first component 10 may not rotate. Preferably, the picking device 30 does not include a rotating mechanism, and moves the first component 10 to a preset position along at least one of the first direction, the second direction, and the third direction. The picking device 30 may also bond the first component 10 to the second component 20. The picking device 30 picks up the first component 10, for example, by adsorption, adhesion, grasping, etc.

[0023] The carrier 40 is used to carry the second component 20, and the carrier 40 includes a carrying surface for carrying the second component 20. The second component 20 carried on the carrier 40 is located at an initial position before being rotated. The carrier 40 can be, for example, an electrostatic chuck, or other devices for carrying the second component 20. The present application does not specifically limit the carrier 40.

[0024] The rotation drive mechanism 50 is connected to the carrier 40, and is used to drive the carrier 40 to rotate and drive the second element 20 to rotate so that the second element 20 rotates from the initial position to the target position, wherein the second element 20 at the target position is aligned with the first element 10 at the preset position. The target position is a predefined position. When the first element 10 moves to the preset position, the first element 10 is projected onto the plane where the second element 20 is located to form a projection position, and the target position is a position on the second element 20 that coincides with or corresponds to the projection position. The carrier 40 can move along at least one of the first direction, the second direction, and the third direction and drive the second element 20 to move along at least one of the first direction, the second direction, and the third direction, or the carrier 40 cannot move along at least one of the first direction, the second direction, and the third direction, and can be set as needed.

[0025] In one embodiment, if Figure 2As shown, the first element 10 includes a first region to be bonded TR1, and the second element 20 includes a second region to be bonded TR2. The bonding device 1000 is used to bond the first region to be bonded TR1 of the first element 10 to the second region to be bonded TR2 of the second element 20 when the second element 20 located at the target position is aligned with the first element 10 located at the preset position. The target position and the preset position are predefined positions for aligning the first region to be bonded TR1 of the first element 10 with the second region to be bonded TR2 of the second element 20. For example, when the first element 10 is located at the preset position and the second element 20 is located at the target position, the first region to be bonded TR1 and the second region to be bonded TR2 are aligned, and the projection of the first region to be bonded TR1 on the plane where the second element 20 is located coincides with the second region to be bonded TR2, or falls within the range of the second region to be bonded TR2 and corresponds to the bonding position of the second element 20 on the second region to be bonded TR2. When the pick-up device 30 picks up the first component 10 to be bonded and moves the first component 10 to the preset position, the first area TR1 to be bonded includes the first rotation R1; when the second component 20 is located at the initial position, the second area TR2 to be bonded includes the second rotation R2; when the second component 20 rotates from the initial position to the target position, the second area TR2 to be bonded includes the target rotation R3. Since the rotation drive mechanism 50 drives the carrier 40 to rotate and drives the second component 20 to rotate so that the second component 20 rotates from the initial position to the target position, so that the second component 20 located at the target position is aligned with the first component 10 located at the preset position, the second rotation R2 rotates to the same as the target rotation R3, and the first rotation R1 is aligned with the target rotation R3 so that the first rotation R1 is aligned with the second rotation R2 located at the target position. In the related art, a rotating device is provided on the pick-up device 30 to increase the weight of the pick-up device, resulting in an increase in inertia due to the increase in weight when the pick-up device 30 drives the first component 10 to rotate and align, thereby increasing the difficulty of rotation alignment. Compared with the prior art, the rotary drive mechanism 50 of the present application drives the carrier 40 to rotate and drives the second element 20 to rotate so that the second element 20 rotates from the initial position to the target position, which can increase the alignment accuracy. In addition, the first element 10 to be bonded is picked up by the picking device 30 and the first element 10 is moved to a preset position to achieve the movement alignment of the first element 10 and the second element 20, and the rotary drive mechanism 50 drives the carrier 40 to rotate and drives the second element 20 to rotate so that the second element 20 rotates from the initial position to the target position to achieve the rotation alignment of the first element 10 and the second element 20. In this way, the movement alignment and rotation alignment of the first element 10 and the second element 20 can be performed simultaneously, thereby saving the alignment operation time of the first element 10 and the second element 20 and improving production efficiency.

[0026] The first region to be bonded TR1 on the first element 10 includes a first alignment mark, and the second region to be bonded TR2 on the second element 20 includes a second alignment mark and a reference point. The first rotation R1 of the first element 10 is the offset direction or offset angle of a line connecting the projected reference point formed by projecting the first alignment mark and the reference point onto a plane where the first alignment mark is located when the first element 10 moves to a preset position relative to a first direction (for example, the X direction or the first horizontal direction). In the same coordinate system, the second rotation R2 of the second element 20 is the offset direction or offset angle of a line connecting the second alignment mark and the reference point located at the initial position relative to the first direction (for example, the X direction or the first horizontal direction) when the second element 20 is located at the initial position. The target rotation R3 of the second element 20 is the offset direction or offset angle of a line connecting the second alignment mark and the reference point located at the target position relative to the first direction (for example, the X direction or the first horizontal direction) when the second element 20 is located at the target position, wherein the reference point when the second element 20 is located at the initial position is the same as that when the second element 20 is located at the target position. At least one of the first alignment mark, the second alignment mark, and the reference point can be a graphic on the chip or wafer for determining the position and direction, such as a straight, L-shaped or cross-shaped protrusion, notch, or notch, etc., and this application does not impose any specific restrictions.

[0027] In some embodiments, such as Figure 1 As shown, the bonding device 1000 may further include a movable support. The movable support is connected to the pickup device 30. The movable support may be, for example, Figure 1 The gantry 70 shown in FIG. The gantry 70 may be roughly a door frame structure, including a top plate and two side plates respectively connected to the top plate. The mobile bracket may be used to translate in a plane (e.g., an XY plane) formed by a first direction and a second direction, thereby driving the pickup device 30 to translate, thereby driving the first component 10 to translate. The mobile bracket may be used to drive the pickup device 30 to translate, so as to translate the first component 10 to a preset position. In some implementations, when the rotary drive mechanism 50 drives the carrier 40 to rotate, the mobile bracket synchronously drives the pickup device 30 to translate, so as to increase the speed of aligning the first component 10 and the second component 20.

[0028] In some embodiments, the bonding apparatus 1000 may further include an alignment mark recognition device 80. Figure 1 As shown, the alignment mark recognition device 80 may include a first recognizer 810 and a second recognizer 820. The first recognizer 810 and / or the second recognizer 820 may be configured as recognizers based on optical recognition, image recognition, etc. For example, the first recognizer 810 and / or the second recognizer 820 may be an image collector, which is not limited in the present application. Figure 1As shown, the first identifier 810 may include a first image collector 811 and a second image collector 812 respectively disposed on the upper and lower sides of the first element 10. The first image collector 811 and the second image collector 812 may operate together to identify the first alignment mark on the first element 10.

[0029] The first identifier 810 is used to identify the first alignment mark of the first element 10, and the second identifier 820 is used to identify the second alignment mark of the second element 20. The bonding device 1000 can determine the position and rotation angle of the first element 10 based on the first alignment mark of the first element 10. The bonding device 1000 can determine the position and rotation angle of the second element 20 based on the second alignment mark of the second element 20. The bonding device 1000 is used to determine the first region to be bonded TR1 and the second region to be bonded TR2. Specifically, the bonding device 1000 is used to determine the first region to be bonded TR1 and the second region to be bonded TR2 according to the first alignment mark and the second alignment mark, and determine the first rotation R1 corresponding to the first region to be bonded TR1, the second rotation R2 of the second region to be bonded TR2 at the initial position, and the target rotation R3 of the second region to be bonded TR2 at the target position, so as to facilitate the subsequent alignment of the first element 10 and the second element 20.

[0030] Reference again Figure 1 and Figure 3 , Figure 3 FIG. 5 shows a top view of a rotation drive mechanism 50 according to some embodiments of the present application. Figure 1 and Figure 3 As shown, the rotary drive mechanism 50 may include a prime mover 510 and a transmission pair drivingly connected to the prime mover 510 .

[0031] In some embodiments, the prime mover 510 may be, for example, an electric motor, a hydraulic motor, etc. This application is described by taking the prime mover 510 as an example of an electric motor. Depending on the specific application scenario, the motor may be, for example, a servo motor, a linear motor, or a stepper motor, etc.

[0032] In some embodiments, the transmission pair includes an active member 521 and a driven member 522. The active member 521 is arranged on one side of the support platform 40. The driven member 522 is fixedly connected to the support platform 40 and is transmission-connected to the active member 521, and is used to drive the support platform 40 to rotate as the active member 521 rotates. The active member 521 can be fixedly connected to the power output part of the prime mover 510. In some embodiments, the transmission pair is a primary transmission or a single-stage transmission. Compared with a complex multi-stage transmission, a single-stage transmission has a simple structure, a small cumulative error, a faster and more accurate dynamic response, and is conducive to achieving precise angle adjustment of the second element 20. Of course, in some embodiments, the transmission pair can also adopt a multi-stage transmission structure. This application does not make specific restrictions on this.

[0033] In some embodiments, the transmission pair has a large transmission ratio. For example, the transmission ratio i of the transmission pair may be greater than 5, such as greater than 8, greater than 10, etc.

[0034] When the rotation angle or displacement of the active member 521 is the same, the larger the transmission ratio, the smaller the rotation angle of the driven member 522, and the higher the control accuracy of the rotation of the carrier 40 and the second element 20 thereon. A large transmission ratio combined with the above-mentioned single-stage transmission can amplify the rotation control accuracy of the prime mover 510, thereby reducing the number of subsequent rotation angle adjustments of the second element 20. When the angle is greater than 10, the rotation angle of the second element 20 can be adjusted once and for all, with high alignment accuracy and no need for subsequent adjustments, thereby greatly saving alignment time.

[0035] In some embodiments, the transmission pair may be, for example, a gear transmission pair, a worm gear transmission pair, a rack and pinion mechanism, etc. The transmission pair may also be, for example, a chain transmission pair or a belt transmission pair, etc., which is not specifically limited in this application.

[0036] In some embodiments, such as Figure 3 As shown, the transmission pair is a gear transmission pair. The gear transmission pair includes a driving gear and a driven gear that mesh with each other. Among them, the driving gear is the first gear, and the driven gear is the second gear. Among them, the top circle diameter of the first gear is smaller than the top circle diameter of the second gear. The transmission ratio of the transmission pair Can be defined as .in, is the number of gears of the first gear, is the gear number of the second gear.

[0037] In some embodiments, the diameter of the second gear may be greater than 250 mm, for example, greater than 300 mm. The diameter of the first gear may range from 5 to 50 mm, for example, from 10 to 30 mm. The transmission ratio of the transmission pair may be greater than 10. Of course, in other embodiments, the diameters of the second gear and the first gear may also be set to other sizes, as long as the transmission ratio of the transmission pair meets the predetermined conditions.

[0038] In some embodiments, the second gear may be disposed around at least a portion of the outer circumference of the carrier 40. For example, the second gear may be fixed around the entire outer circumference or at least a portion of the outer circumference of the carrier 40. The first gear may be fixedly sleeved on the output shaft 512 of the prime mover 510, so that the first gear is driven to rotate by the prime mover 510, and the second gear is driven to rotate by the first gear.

[0039] In some embodiments, the first gear and the prime mover 510 may be disposed on one side of the carrier 40. For example, the bonding device 1000 may further include a platform base 90 and a carrier base 42. The carrier base 42 and the prime mover 510 may both be disposed on the platform base 90, and the carrier 40 may be disposed on the carrier base 42 and may be configured to rotate relative to the carrier base 42. The prime mover 510 may be disposed below the first gear. The output shaft 512 of the prime mover 510 may be configured to extend vertically through the center hole of the first gear and be fixedly fitted in the center hole.

[0040] In some embodiments, the first gear may be meshed with the second gear in an internal meshing manner. The prime mover 510 is disposed below the first gear. The prime mover 510 may be disposed, for example, within the carrier base 42.

[0041] In some embodiments, the transmission pair can be a rack and pinion transmission pair (not shown). The rack and pinion transmission pair includes a rack and a driven gear that mesh with each other. The driving member 521 is a rack, and the driven member 522 is a driven gear. Similar to the second gear described above, the driven gear can be fixed around the entire periphery or at least a portion of the periphery of the carrier 40. The prime mover 510 can be, for example, a linear motor. The rack can be coaxially connected to the output shaft 512 of the linear motor, or the rack is the output shaft 512 of the linear motor.

[0042] The above is an embodiment in which the driven member is set as a gear. Of course, in other embodiments, the driven member 522 can also be integrated with the support platform 40, for example, a driven tooth meshing with the active member (such as a first gear, a rack, etc.) is provided on the outer periphery of the support platform 40, and the support platform 40 is driven to rotate through the meshing transmission of the driven tooth and the active member.

[0043] In some embodiments, the transmission pair can be a worm gear transmission pair (not shown). The driving member 521 is a worm, and the driven member 522 is a worm wheel. Similar to the second gear described above, the worm wheel can be fixed around the entire periphery or at least a portion of the periphery of the carrier 40. The prime mover 510 can be, for example, a servo motor or a stepper motor. The worm can be coaxially connected to the output shaft 512 of the prime mover 510.

[0044] refer to Figure 4 , Figure 4 It is a schematic flow chart of a bonding method according to some embodiments of the present application.

[0045] The bonding method of the present application can be applied to the bonding device 1000 described above. The bonding device 1000 can include a pickup device 30, a carrier 40, and a rotation drive mechanism 50 connected to the carrier 40. The carrier 40 carries the second component 20.

[0046] like Figure 4As shown, the bonding method in the present application includes the following steps.

[0047] S21: Pick up the first component 10 to be bonded, and move the first component 10 to a preset position, where the preset position is located on one side of the surface of the second component 20 to be bonded.

[0048] refer to Figure 1 The picking device 30 can pick up the first component 10 to be bonded from the film expansion platform 60 and move the first component 10 to a preset position.

[0049] The first element 10 and / or the second element 20 may be a semiconductor material or a non-semiconductor material. The size of the first element 10 may be greater than, equal to, or less than the size of the second element 20. In some embodiments, the first element 10 may be a die, a wafer, or a chip on a wafer, and the second element 20 may be a die, a wafer, or a chip on a wafer. The following description will be given by taking the first element 10 as a chip and the second element 20 as a wafer as an example. The first element 10, the second element 20, the first bonding region TR1, and the second bonding region TR2, etc., can be referred to above and will not be repeated here.

[0050] S22: Rotate the second element 20 from the initial position to the target position, wherein the second element 20 at the target position is aligned with the first element 10 at the preset position.

[0051] In some embodiments, the support platform 40 may be driven to rotate by the rotation driving mechanism 50 to drive the second component 20 to rotate from the initial position to the target position.

[0052] The initial position and the target position can be referred to as described above and will not be described again here.

[0053] As described above, the rotation drive mechanism 50 may include a prime mover 510 and a transmission pair that are transmission-connected together. The transmission pair includes a driving member 521 and a driven member 522. The driven member 522 is fixedly connected to at least a portion of the carrier 40 and is used to drive the carrier 40 to rotate. The driving member 521 may be fixedly connected to the power output portion of the prime mover 510, thereby realizing a single-stage transmission of the carrier 40. The transmission pair may have a large transmission ratio greater than 8 or greater than 10.

[0054] refer to Figure 5 , Figure 5 A schematic flow chart of step S21 is shown.

[0055] like Figure 5 As shown, step S21 may include the following steps.

[0056] S31 : recognizing a first alignment mark of the first component 10 , and recognizing a second alignment mark of the second component 20 disposed on the carrier 40 .

[0057] The first alignment mark of the first component 10 can be identified by the alignment mark recognition device 80, and the second alignment mark of the second component 20 disposed on the carrier 40 can be identified. The alignment mark recognition device 80 may include a first identifier 810 and a second identifier 820. The first identifier 810 can be used to identify the first alignment mark of the first component 10, and the second identifier 820 can be used to identify the second alignment mark of the second component 20.

[0058] S32: Determine the first region to be bonded TR1 of the first element 10 and the second region to be bonded TR2 of the second element 20 based on the first alignment mark and the second alignment mark, and determine the first rotation R1 corresponding to the first region to be bonded TR1, the second rotation R2 in which the second region to be bonded TR2 is located at the initial position, and the target rotation R3 in which the second region to be bonded TR2 is located at the target position. The first rotation R1, the second rotation R2, and the target rotation R3 may be as described above, and will not be described in detail herein.

[0059] In some embodiments, the target rotation R3 of the second region to be bonded TR2 may be determined based on the first alignment mark and the second alignment mark. For example, during the process of the picking device 30 picking up and translating the first component 10, the first component 10 may not rotate, and accordingly, the first rotation R1 of the first component 10 remains unchanged. Since the second component 20 at the target position is aligned with the first component 10 at the preset position, especially the first region to be bonded TR1 and the second region to be bonded TR2 are aligned, the target rotation R3 of the second region to be bonded TR2 is the same as the first rotation R1. Accordingly, the target rotation R3 may be determined.

[0060] Further, the target position of the second element 20 can be determined based on the second region to be bonded TR2 and the target rotation R3 (or the first rotation R1). Specifically, it can be simulated that the first element 10 is moved by the pickup device 30 along at least one of the first direction, the second direction and the third direction to the top of the second element 20, and the second element 20 is only rotated to align the first region to be bonded TR1 and the second region to be bonded TR2, the position of the first element 10 is the preset position, and the position of the second element 20 is the target position.

[0061] S33: Move the first component 10 to a preset position above one side of the surface to be bonded with the second component 20.

[0062] The first component 10 is moved by the pickup device 30 along at least one of the first direction, the second direction and the third direction to a preset position above the second component 20. Preferably, during the movement, the pickup device 30 does not drive the first component 10 to rotate.

[0063] refer to Figure 6 , Figure 6 A schematic flow chart of step S22 is shown.

[0064] like Figure 6 As shown, step S22 may include the following steps.

[0065] S41: driving at least a portion of the carrier 40 to rotate via the rotation driving mechanism 50 to drive the second component 20 to rotate to the target rotation R3.

[0066] In some embodiments, the rotation driving mechanism 50 drives at least a portion of the carrier 40 to rotate, so as to drive the second component 20 to rotate to the target rotation R3.

[0067] In some embodiments, the bonding device 1000 can determine the rotation direction and rotation angle of the second element 20 according to the second rotation R2 and the target rotation R3. The bonding device 1000 then calculates the movement amount of the prime mover 510 of the rotation drive mechanism 50 according to the rotation direction, rotation angle and transmission ratio of the transmission pair. The prime mover 510 then starts to complete the movement amount, thereby completing a single rotation direction adjustment of the second element 20.

[0068] In some embodiments, after a single rotation adjustment of the second element 20 is completed, a predetermined time may be waited as a buffer. Afterwards, the bonding device 1000 may measure the current rotation or angular orientation of the second bonding region TR2 of the second element 20. Since the transmission pair may have a slight vibration during transmission, waiting for a predetermined time as a buffer can ensure the stability of the positions of the transmission pair, the carrier 40, and the second element 20, thereby ensuring accurate rotation / angular orientation measurement of the second element 20. The predetermined time may be, for example, between 1 second and 2 seconds.

[0069] If the current rotation of the second bonding region TR2 of the second element 20 coincides with the target rotation R3, the rotation adjustment of the second element 20 is completed; otherwise, the rotation direction and rotation angle of the second element 20 may be calculated again, and the driving element 510 may be restarted for adjustment.

[0070] After adopting the single-stage transmission pair with a transmission ratio greater than 10 in the present application, in most cases, only a single rotation adjustment is required to adjust the second element 20 to the target position.

[0071] In some embodiments, while driving at least a portion of the carrier 40 to rotate by the rotation drive mechanism 50, the pickup device 30 can translate the first component 10 to a preset position. That is, the above steps S21 and S22 can be performed synchronously or in parallel. Specifically, the above steps S33 and S41 can be performed synchronously or in parallel.

[0072] In some embodiments, the movable bracket can drive the picking device 30 to move so as to translate the first component 10 to a preset position, which will not be described in detail in this application.

[0073] In some embodiments, see Figure 4 After step S22, the bonding method further includes step S23: in response to the second element 20 at the target position being aligned with the first element 10 at the preset position, the first region to be bonded TR1 of the first element 10 is bonded to the second region to be bonded TR2 of the second element 20.

[0074] In some embodiments, when the second component 20 located at the target position is aligned with the first component 10 located at the preset position, that is, when the first region to be bonded TR1 is aligned with the second region to be bonded TR2, the picking device system 400 can drive the picking device 30 to vertically descend to vertically descend the first component 10 to the position for bonding with the second component 20.

[0075] Through the bonding method of the present application, the rotational alignment of the first element 10 and the second element 20 can be achieved by rotating the carrier 40 to the target position, and the movement alignment of the first element 10 and the second element 20 can be achieved by moving the first element 10 to the preset position by the pickup device 30. In this way, the movement alignment and the rotation alignment of the first element 10 and the second element 20 can be performed simultaneously, thereby saving the alignment operation time of the first element 10 and the second element 20, improving production efficiency, and increasing output. Furthermore, the pickup device 30 does not need to be provided with a rotating device for rotating the first element 10 in the related art, thereby reducing the weight of the pickup device 30, reducing the difficulty of rotational alignment, and improving the translation accuracy and service life of the pickup device 30.

[0076] The above description of various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other, and for the sake of brevity, they will not be repeated herein.

Claims

1. A bonding device, comprising: A picking device, used for picking up a first component to be bonded and moving the first component to a preset position, wherein the preset position is located on one side of a surface of the second component to be bonded; A carrying platform, used for carrying the second element, wherein the second element is located at an initial position; a rotation drive mechanism connected to the carrier platform, and used for driving the carrier platform to rotate and drive the second element to rotate so that the second element rotates from the initial position to the target position, wherein when the picking device moves the first element to the preset position, the second element at the target position is aligned with the first element at the preset position; The bonding device is used to determine a first region to be bonded of the first element and a second region to be bonded of the second element according to the identified first alignment mark of the first element and the second alignment mark of the second element, and to determine a first rotation corresponding to the first region to be bonded, a second rotation of the second region to be bonded at the initial position, and a target rotation of the second region to be bonded at the target position; Wherein, during the process of the picking device moving the first component to the preset position, the first rotation remains unchanged, and the target rotation is the same as the first rotation; Wherein, rotating the second element from the initial position to the target position includes rotating the second element to the target rotation.

2. The bonding device according to claim 1, characterized in that The rotary drive mechanism includes a transmission pair, and the transmission pair includes: An active component is disposed on one side of the supporting platform; and The driven member is fixedly connected to the bearing platform and is transmission-connected to the driving member, and drives the bearing platform to rotate as the driving member rotates.

3. The bonding device according to claim 2, characterized in that: The transmission ratio of the transmission pair is greater than 5.

4. The bonding device according to claim 2, characterized in that: The carrying platform comprises a carrying surface for carrying the second element; The active member includes a driving gear, and the driven member includes driven teeth meshing with the driving gear; The driven teeth are arranged around at least a portion of the outer circumference of the bearing platform; or The driven gear includes a gear arranged on a side of the bearing platform away from the bearing surface.

5. The bonding device according to claim 2, characterized in that: The carrying platform comprises a carrying surface for carrying the second element; The active member is a worm, and the driven member is a worm wheel sleeved on the outer periphery of the supporting platform; or The active member is a rack, the driven member includes driven teeth meshing with the rack, and the driven teeth are arranged around at least a portion of the outer circumference of the support platform; or the driven teeth include a gear arranged on a side of the support platform away from the support surface.

6. The bonding device according to claim 1, characterized in that: The bonding device is used for bonding the first to-be-bonded region of the first element to the second to-be-bonded region of the second element in response to the second element located at the target position being aligned with the first element located at the preset position.

7. The bonding device according to claim 6, characterized in that: Also includes: The alignment mark recognition device is used to recognize the first alignment mark of the first component and the second alignment mark of the second component.

8. The bonding device according to claim 1, characterized in that: The bonding device further comprises a movable bracket, and the movable bracket is connected to the picking device; When the rotation drive mechanism drives the carrying platform to rotate, the mobile bracket synchronously drives the picking device to translate.

9. A bonding method, characterized in that: include: Pick up a first component to be bonded and move the first component to a preset position, the preset position is located on one side of the surface to be bonded of the second component, and the second component is located at an initial position; rotating the second element so that the second element rotates from the initial position to a target position, wherein the second element at the target position is aligned with the first element at the preset position while the first element is moved to the preset position, The bonding method further comprises: Determining a first region to be bonded of the first component and a second region to be bonded of the second component according to the identified first alignment mark of the first component and the second alignment mark of the second component, and determining a first rotation corresponding to the first region to be bonded, a second rotation of the second region to be bonded at the initial position, and a target rotation of the second region to be bonded at the target position; Wherein, during the process of the picking device moving the first component to the preset position, the first rotation remains unchanged, and the target rotation is the same as the first rotation; Wherein, rotating the second element from the initial position to the target position includes rotating the second element to the target rotation.

10. The bonding method according to claim 9, characterized in that: Bonding is performed using the bonding device described in claims 1 to 8.

11. The bonding method according to claim 10, characterized in that: The bonding method further comprises: In response to the second component located at the target position being aligned with the first component located at the preset position, the first to-be-bonded region of the first component is bonded to the second to-be-bonded region of the second component.

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