Semiconductor process machine calibration device, calibration method thereof and semiconductor process machine

Abstract

The invention provides a semiconductor process machine calibration device, a calibration method thereof and a semiconductor process machine. The semiconductor process machine calibration device is used for calibrating an electronic system of a semiconductor process machine and comprises a first mechanical arm, the tail end of the first mechanical arm is provided with a supporting table, and the first mechanical arm can be controlled to be electrically connected to the semiconductor process machine; the arc-shaped positioning mechanism is arranged on the first mechanical arm and surrounds the supporting table, and a plurality of positioning grooves are formed in the surface of the arc-shaped positioning mechanism; the wheel disc is rotatably arranged on the surface of the supporting table, and the edge of the wheel disc is arranged on the surface of the arc-shaped positioning mechanism; the multiple calibration modules are distributed at the edge position of the wheel disc and can be controlled to be electrically connected to the supporting table, and convex points matched with the positioning grooves are arranged on the sides, close to the arc-shaped positioning mechanisms, of the calibration modules; according to the semiconductor process machine calibration device, the angle of the wheel disc can be adjusted by rotating the wheel disc, so that one calibration module is selected to be electrically connected to the supporting table, and then an electronic system of the semiconductor process machine is calibrated.

Description

Technical Field

[0001] The present invention relates to the semiconductor field, and in particular to a semiconductor process machine calibration device and a calibration method thereof, as well as a semiconductor process machine. Background Art

[0002] Calibration of the electronic system of the RS-200 sheet resistance measuring equipment is a means of testing and correcting the electronic circuit system of the RS-200 model. Figure 1-2 ,in, Figure 1 It is a structural diagram of a measuring device in the prior art; Figure 2 FIG. 1 is a structural diagram of a calibration module in the prior art. Figure 1 As shown, the two ends of the robot arm 11 are provided with probes 12 of different models, which are fixed to the two ends of the robot arm 11 with screws. Different wafers can be selected during measurement. When calibrating the machine, manually rotate the nut where the probe 12 is placed, loosen the fixing screw, remove the probe 12, and then Figure 2 The socket 22 of the calibration module 21 is inserted into the corresponding position of the robot arm 11, so that the probe 12 is replaced with the calibration module 21, and the electronic system of the machine can be calibrated to ensure the stability of the machine and the accuracy of the measurement data.

[0003] When measuring the square resistance of the wafer later, the probe 12 needs to be manually installed back to the two ends of the robot arm 11, but this will bring two problems: first, the stability of the probe 12 is difficult to guarantee; second, the different horizontal planes for fixing the probe 12 will affect the authenticity of the data. In addition, whenever the height of the probe 12 does not match, it needs to be adjusted manually. Each adjustment requires adjusting its height in batches and multiple times, as well as the tightness of the installation of the probe 12. Multiple debugging during measurement wastes a lot of time, and each calibration requires repeated disassembly and assembly of different calibration modules 21 (three pieces), plus the disassembly and assembly of the probe 12 (two), which makes the problem of long recovery time (three hours) exist for a long time.

[0004] Therefore, how to improve the calibration efficiency of the sheet resistance measurement equipment is a problem that needs to be solved at present. Summary of the invention

[0005] The technical problem to be solved by the present invention is to improve the calibration efficiency of a sheet resistance measuring machine, and to provide a semiconductor process machine calibration device and a calibration method thereof, as well as a semiconductor process machine.

[0006] In order to solve the above problems, the present invention provides a semiconductor process machine calibration device for calibrating the electronic system of a semiconductor process machine, comprising: a first robot arm, a support platform is provided at the end of the first robot arm, and the first robot arm can be controlled to be electrically connected to the semiconductor process machine; an arc positioning mechanism is arranged on the first robot arm and surrounds the support platform, and a plurality of positioning grooves are arranged on the surface of the arc positioning mechanism; a wheel disc is rotatably arranged on the surface of the support platform, and the edge of the wheel disc is arranged on the surface of the arc positioning mechanism; a plurality of calibration modules are distributed at the edge positions of the wheel disc and can be controlled to be electrically connected to the support platform, and a convex point that matches the positioning groove is arranged on one side of the calibration module close to the arc positioning mechanism; the semiconductor process machine calibration device can adjust the angle of the wheel disc by rotating the wheel disc to select one of the calibration modules to be electrically connected to the support platform, thereby calibrating the electronic system of the semiconductor process machine.

[0007] In order to solve the above problems, the present invention provides a semiconductor process tool calibration method, comprising the following steps: providing a semiconductor process tool calibration device, wherein the semiconductor process tool calibration device adopts the semiconductor process tool calibration device described in the present invention; rotating the wheel to adjust the angle of the wheel to select one of the calibration modules as a target calibration module and electrically connect it to the support platform; controlling the first robot arm to be electrically connected to the semiconductor process tool; measuring the electronic system of the semiconductor process tool through the target calibration module to obtain a calibration result; repeating the above steps to obtain the calibration results of all the calibration modules measuring the electronic system of the semiconductor process tool.

[0008] In order to solve the above problems, the present invention provides a semiconductor process machine including: a machine body; a second robot arm connected to the machine body, a probe is provided on the surface of the second robot arm for measuring the block resistance of the wafer; a semiconductor process machine calibration device connected to the machine body, the semiconductor process machine calibration device adopts the semiconductor process machine calibration device described in the present invention.

[0009] The above technical solution adjusts the angle of the calibration module by rotating the wheel, so that the calibration module simulates the position of the probe on the robotic arm, without the need to repeatedly disassemble and install the probe, greatly reducing the calibration time and improving the calibration rate.

[0010] It should be understood that the above general description and the detailed description below are exemplary and explanatory only and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but where appropriate, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following is a brief introduction to the drawings required for the description of the specific embodiments. Obviously, the drawings described below are only some specific embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0012] Figure 1 It is a structural diagram of a measuring device in the prior art.

[0013] Figure 2 It is a structural diagram of a calibration module in the prior art.

[0014] Figure 3 FIG. 1 is a top view of an embodiment of a semiconductor process tool calibration device according to the present invention.

[0015] Figure 4 It is a three-dimensional diagram of a first robot arm and an arc-shaped positioning mechanism of an embodiment of the semiconductor process tool calibration device of the present invention.

[0016] Figure 5 The figure is a flow chart of the steps of an embodiment of the semiconductor process tool calibration method of the present invention.

[0017] Figure 6 It is a schematic structural diagram of an embodiment of the semiconductor process machine of the present invention. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0019] The calibration module and probe assembly and disassembly of the existing block resistance measuring equipment RS-200 are too complicated, and the probe adjustment and calibration times are too many, resulting in a long time required for resetting the machine. The present invention provides a semiconductor process machine calibration device, which greatly reduces the calibration time and improves the calibration rate. Figure 3-4 ,in, Figure 3 FIG. 1 is a top view of an embodiment of the semiconductor process tool calibration device according to the present invention. Figure 4 The first mechanical arm and arc-shaped positioning mechanism of an embodiment of the semiconductor process tool calibration device of the present invention are shown in a three-dimensional diagram, wherein the invisible parts are drawn with dotted lines. The semiconductor process tool calibration device is used to calibrate the electronic system of the semiconductor process tool, such as Figure 3-4As shown, the semiconductor process machine calibration device includes: a first mechanical arm 31, an arc-shaped positioning mechanism 311, a wheel 32, and a plurality of calibration modules 33. A support platform 312 is provided at the end of the first mechanical arm 31, and the first mechanical arm 31 can be controlled to be electrically connected to the semiconductor process machine (not shown). The arc-shaped positioning mechanism 311 is provided on the first mechanical arm 31 and surrounds the support platform 312, and a plurality of positioning grooves 3111 are provided on the surface of the arc-shaped positioning mechanism 311. The wheel 32 is rotatably provided on the surface of the support platform 312, and the edge of the wheel 32 is provided on the surface of the arc-shaped positioning mechanism 311. The plurality of calibration modules 33 are distributed at the edge of the wheel 32, and can be controlled to be electrically connected to the support platform 312, and a convex point 330 matching the positioning groove 3111 is provided on the side of the calibration module 33 close to the arc-shaped positioning mechanism 311. The semiconductor process tool calibration device can adjust the angle of the wheel disk 32 by rotating the wheel disk 32 to select one of the calibration modules 33 to be electrically connected to the support platform 312 , thereby calibrating the electronic system of the semiconductor process tool.

[0020] The above technical solution adjusts the angle of the calibration module by rotating the wheel, so that the calibration module simulates the position of the probe on the robotic arm, without the need to repeatedly disassemble and install the probe, greatly reducing the calibration time and improving the calibration rate.

[0021] In some embodiments, the semiconductor process tool calibration device further includes a plurality of variable circuits 34 , each of which has one end electrically connected to one of the calibration modules 33 and the other end electrically connected to the support platform 312 .

[0022] In some embodiments, each variable circuit 34 is provided with a branch switch 340 for individually controlling the opening and closing of the corresponding variable circuit 34. When the branch switch 340 is pressed, the calibration module 33 on the corresponding variable circuit 34 is connected to the semiconductor process machine, so that the semiconductor process machine and the calibration module 33 achieve a communication effect, and the branch switch 340 ensures the independence of each calibration module 33.

[0023] In some embodiments, the multiple calibration modules 33 specifically include a first calibration module 331, a second calibration module 332, and a third calibration module 333 that are evenly distributed at the edge position of the wheel 32, and the multiple variable circuits 34 specifically include a first variable circuit 341, a second variable circuit 342, and a third variable circuit 343; the first calibration module 331 is electrically connected to the first variable circuit 341 through a corresponding branch switch 340, the second calibration module 332 is electrically connected to the second variable circuit 342 through a corresponding branch switch 340, and the third calibration module 333 is electrically connected to the third variable circuit 343 through a corresponding branch switch 340.

[0024] When calibrating the machine circuit, it is necessary to use the calibration modules 33 with different resistance values ​​to measure the same probe position three times to obtain the calibration result. Therefore, in some embodiments, the resistance values ​​of the multiple calibration modules 33 are different. In this embodiment, the resistance value of the first calibration module 331 is 0.297 ohms, the resistance value of the second calibration module 332 is 297 ohms, and the resistance value of the third calibration module 333 is 297000 ohms. Three calibration modules 33 with different resistance values ​​are arranged on the surface of the wheel 32. When detecting the same probe position, there is no need to repeatedly disassemble and install the calibration module 33. It is only necessary to rotate the wheel 32 to adjust the required calibration module 33 to the position of the analog probe, and use the calibration module 33 for measurement. After three measurements, the calibration result is obtained.

[0025] In some embodiments, the roulette wheel 32 is circular, the center of the roulette wheel 32 corresponds to the surface of the support platform 312 , and the plurality of variable circuits 34 are gathered at the center of the roulette wheel 32 .

[0026] In some embodiments, the surface of the wheel 32 has a first scale line 321, wherein the first scale line 321 is a straight line passing through the center of the wheel 32 and is perpendicular to the connection line between one of the calibration modules 33 and the support platform 312. The first scale line 321 is used to calibrate the position of the target calibration module when the wheel 32 is rotated to adjust the angle of the wheel 32 to select one of the calibration modules 33 to be electrically connected to the support platform 312.

[0027] In some embodiments, the support platform 312 can move in a direction perpendicular to the surface of the wheel disc 32 so that the wheel disc 32 moves closer to or farther away from the arc-shaped positioning mechanism 311 .

[0028] In some embodiments, the wheel disc 32 can rotate under the drive of the support platform 312. A pressing and fixing mechanism (not shown) is provided inside the support platform 312. The pressing and fixing mechanism can lock the rotation function when the wheel disc 32 is close to the arc positioning mechanism 311, and unlock the rotation function when it is away from the arc positioning mechanism 311. After the wheel disc 32 is rotated to make the calibration module 33 reach the specified position, the center of the wheel disc 32 is pressed to make the wheel disc 32 close to the arc positioning mechanism 311 to trigger the pressing and fixing mechanism in the support platform 312. The position of the wheel disc 32 is fixed and no longer rotates. At the same time, the corresponding position of the calibration module 33 has the convex point 330. When the convex point 330 is in the appropriate position, it fits with the positioning groove 3111, which again ensures that the wheel disc 32 will not rotate.

[0029] In some embodiments, the first robot arm 31 further includes a main switch 310 , and the first robot arm 31 is electrically connected to the semiconductor process tool through the main switch 310 , thereby controlling the connection between the semiconductor process tool and the calibration module 33 .

[0030] Based on the same inventive concept, an embodiment of the present invention further provides a semiconductor process tool calibration method.

[0031] See also Figure 5 , which is a flow chart of the steps of an embodiment of the semiconductor process tool calibration method of the present invention. Figure 5 As shown, the semiconductor process tool calibration method includes the following steps: step S51, providing a semiconductor process tool calibration device, wherein the semiconductor process tool calibration device adopts the semiconductor process tool calibration device described in the present invention; step S52, rotating the wheel to adjust the angle of the wheel to select one of the calibration modules as the target calibration module and electrically connect it to the support platform; step S53, controlling the first robot arm to be electrically connected to the semiconductor process tool; step S54, measuring the electronic system of the semiconductor process tool through the target calibration module to obtain a calibration result; step S55, repeating the above steps to obtain the calibration results of all the calibration modules measuring the electronic system of the semiconductor process tool.

[0032] Please refer to Figure 3-4 And step S51, providing a semiconductor process tool calibration device, wherein the semiconductor process tool calibration device adopts the present invention Figure 3-4 A semiconductor process tool calibration device is shown.

[0033] Please refer to Figure 3-4And step S52 , rotating the wheel 32 to adjust the angle of the wheel 32 , so as to select one of the calibration modules 33 as a target calibration module and electrically connect it to the support platform 312 .

[0034] In some embodiments, when the surface of the wheel disc 32 has a first scale line 321, rotating the wheel disc 32 to adjust the angle of the wheel disc 32 to select one of the calibration modules 33 as a target calibration module and electrically connect it to the support platform 312 further includes the following steps: (1) moving the support platform 312 in a direction perpendicular to the surface of the wheel disc 32 so that the wheel disc 32 is away from the arc positioning mechanism 311; (2) rotating the wheel disc 32 and calibrating the position of the target calibration module through the first scale line 321; (3) moving the support platform 312 in a direction perpendicular to the surface of the wheel disc 32 so that the wheel disc 32 is close to the arc positioning mechanism 311, and the protrusion 330 of the target calibration module fits with the positioning groove 3111 of the arc positioning mechanism 311. At this time, one of the three calibration modules 33 is parallel to the extension direction of the first robotic arm 31, and the other two form an angle with the extension direction of the first robotic arm 31. One of the two calibration modules 33 that form an angle with the extension direction of the first robotic arm 31 is selected as the target calibration module.

[0035] In some embodiments, when a branch switch 340 is provided on each of the variable circuits 34, the step of selecting one of the calibration modules 33 as a target calibration module and electrically connecting it to the support platform 312 further includes the following steps: turning on the corresponding branch switch 340 to electrically connect the target calibration module to the support platform 312. When the branch switch 340 is pressed, the calibration module 33 on the corresponding variable circuit 34 is connected to the semiconductor process machine, so that the semiconductor process machine and the calibration module 33 achieve a communication effect, and the branch switch 340 ensures the independence of each calibration module 33.

[0036] Please refer to Figure 3-4 And step S53, controlling the first robot arm 31 to connect to the semiconductor process machine.

[0037] In some embodiments, when the first robot arm 31 further includes a main switch 310, controlling the first robot arm 31 to be electrically connected to the semiconductor process tool further includes the following steps: turning on the main switch 310 to electrically connect the first robot arm 31 to the semiconductor process tool.

[0038] Please refer to Figure 3-4 And step S54, measuring the electronic system of the semiconductor process tool through the target calibration module to obtain a calibration result.

[0039] Please refer to Figure 3-4 And step S55, repeat the above steps to obtain the calibration results of all the calibration modules 33 measuring the electronic system of the semiconductor process machine. After completing the measurement of one calibration module 33, rotate the wheel 32 again to adjust the angle of the wheel 32 to select another calibration module 33 as the target calibration module and electrically connect it to the support table 312; control the first robot 31 to be electrically connected to the semiconductor process machine; measure the electronic system of the semiconductor process machine through the target calibration module to obtain another calibration result. Repeat the above steps until the measurement of all the calibration modules 33 is completed.

[0040] Taking the first calibration module 331 as an example, adjust it to the 12 o'clock direction, which is the same as the probe position of the mechanical arm of the semiconductor process machine. At this time, the position can be calibrated by adjusting the first scale line 321. After determining the position, press the center of the wheel 32, the wheel support platform 312 drops, and the convex point 330 of the first calibration module 331 fits with the positioning groove 3111, and the position is determined again. Turn on the branch switch 340 on the first variable circuit 341 to form a passage between the first calibration module 331 and the semiconductor process machine, and keep the branch switches 340 of the other variable circuits 34 closed, that is, the second calibration module 332 and the third calibration module 333 are disconnected from the semiconductor process machine. Press the main switch 310 to make the first calibration module 331 communicate with the semiconductor process machine, so as to achieve the purpose of calibrating the semiconductor process machine. According to the same steps, rotate the wheel 32 to complete the measurement of the second calibration module 332 and the third calibration module 333 in turn to obtain the calibration result.

[0041] The present invention simplifies the calibration method of semiconductor process machines and improves the adjustment rate and calibration speed. Before the improvement, it took about 40 minutes to repeatedly install and disassemble the calibration module. After the calibration, the probe needs to be installed and adjusted. The whole process takes about 3 hours. Using the semiconductor process machine calibration process and semiconductor process machine calibration method described in the present invention, it only takes 30 minutes to complete the whole calibration process. After the improvement, there is no need to repeatedly disassemble and assemble the probe, so the calibration rate of the semiconductor process machine is greatly improved.

[0042] Based on the same inventive concept, an embodiment of the present invention further provides a semiconductor process machine.

[0043] See also Figure 6 , which is a schematic diagram of the structure of an embodiment of the semiconductor process machine of the present invention. Figure 6As shown, the semiconductor process machine comprises: a machine body 60, a semiconductor process machine calibration device 61, and a second robot arm 62. The second robot arm 62 is connected to the machine body 60, and a probe 620 is arranged on the surface of the second robot arm 62 for measuring the square resistance of the wafer. The semiconductor process machine calibration device 61 is connected to the machine body 60, and the semiconductor process machine calibration device 61 adopts the present invention. Figure 3-4 A semiconductor process tool calibration device is shown.

[0044] In some embodiments, the first robotic arm 610 is located above the second robotic arm 62 .

[0045] The above technical solution adds a semiconductor machine calibration device including a first robot arm above the original second robot arm of the semiconductor process machine, so that the semiconductor process machine can be calibrated without repeatedly disassembling the probe and without affecting the operation of the original second robot arm.

[0046] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.

[0047] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.

[0048] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present invention are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present invention. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0049] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A semiconductor process tool calibration device, used for calibrating an electronic system of a semiconductor process tool, characterized in that: include: A first robot arm, a support platform is disposed at the end of the first robot arm, and the first robot arm can be controllably electrically connected to the semiconductor process machine; An arc-shaped positioning mechanism is arranged on the first mechanical arm and surrounds the support platform, and a plurality of positioning grooves are arranged on the surface of the arc-shaped positioning mechanism; A wheel disc is rotatably disposed on the surface of the support platform, and an edge of the wheel disc is disposed on the surface of the arc-shaped positioning mechanism; A plurality of calibration modules are distributed at the edge of the wheel disc and can be electrically connected to the support platform in a controllable manner, and a convex point that matches the positioning groove is provided on one side of the calibration module close to the arc-shaped positioning mechanism; The semiconductor process tool calibration device can adjust the angle of the wheel by rotating the wheel to select one of the calibration modules to be electrically connected to the support platform, thereby calibrating the electronic system of the semiconductor process tool.

2. The semiconductor process tool calibration device according to claim 1, characterized in that: The resistance values ​​of the multiple calibration modules are different.

3. The semiconductor process tool calibration device according to claim 1, characterized in that: It also includes a plurality of variable circuits, one end of each of the variable circuits is electrically connected to one of the calibration modules, and the other end is electrically connected to the support platform.

4. The semiconductor process tool calibration device according to claim 3, characterized in that: Each of the variable circuits is provided with a branch switch for individually controlling the opening and closing of the corresponding variable circuit.

5. The semiconductor process tool calibration device according to claim 4, characterized in that: The plurality of calibration modules specifically include a first calibration module, a second calibration module, and a third calibration module uniformly distributed at the edge of the wheel, and the plurality of variable circuits specifically include a first variable circuit, a second variable circuit, and a third variable circuit; The first calibration module is electrically connected to the first variable circuit via a corresponding branch switch, the second calibration module is electrically connected to the second variable circuit via a corresponding branch switch, and the third calibration module is electrically connected to the third variable circuit via a corresponding branch switch.

6. The semiconductor process tool calibration device according to claim 3, characterized in that: The wheel is circular, the center of which corresponds to the surface of the support platform, and the gathering point of the plurality of variable circuits is located at the center of the wheel.

7. The semiconductor process tool calibration device according to claim 6, characterized in that: The surface of the wheel disc has a first scale line, wherein the first scale line is a straight line passing through the center of the wheel disc and is perpendicular to a connection line between one of the calibration modules and the support platform.

8. The semiconductor process tool calibration device according to claim 1, wherein: The support platform can move in a direction perpendicular to the surface of the wheel disc, so that the wheel disc is close to or away from the arc-shaped positioning mechanism.

9. The semiconductor process tool calibration device according to claim 8, characterized in that: The wheel disc can rotate driven by the support platform, and a pressing and fixing mechanism is arranged inside the support platform. The pressing and fixing mechanism can lock the rotation function when the wheel disc is close to the arc positioning mechanism, and unlock the rotation function when the wheel disc is far away from the arc positioning mechanism.

10. The semiconductor process tool calibration device according to claim 1, wherein: The first robot arm also includes a main switch, and the first robot arm is electrically connected to the semiconductor process tool under control of the main switch.

11. A semiconductor process tool calibration method, characterized in that: The steps include: A semiconductor process tool calibration device is provided, wherein the semiconductor process tool calibration device adopts the semiconductor process tool calibration device according to any one of claims 1 to 10; Rotating the wheel to adjust the angle of the wheel to select one of the calibration modules as a target calibration module and electrically connect it to the support platform; Controlling the first robot arm to be electrically connected to the semiconductor process machine; Measuring the electronic system of the semiconductor process tool by the target calibration module to obtain a calibration result; The above steps are repeatedly performed to obtain calibration results of all the calibration modules measuring the electronic system of the semiconductor process tool.

12. The method according to claim 11, characterized in that When the surface of the wheel disc has a first scale line, rotating the wheel disc to adjust the wheel disc angle to select one of the calibration modules as a target calibration module and electrically connecting it to the support platform further comprises the following steps: Moving the support platform in a direction perpendicular to the surface of the wheel disc so that the wheel disc is away from the arc-shaped positioning mechanism; Rotate the wheel and calibrate the position of the target calibration module through the first scale line; The support platform is moved in a direction perpendicular to the surface of the wheel disc so that the wheel disc is close to the arc-shaped positioning mechanism, and the convex point of the target calibration module is matched with the positioning groove of the arc-shaped positioning mechanism.

13. The method according to claim 11, characterized in that When a branch switch is provided on each of the variable circuits, the step of selecting one of the calibration modules as a target calibration module and electrically connecting it to the support platform further includes the following steps: turning on the corresponding branch switch to electrically connect the target calibration module to the support platform.

14. The method according to claim 11, characterized in that When the first robot arm further includes a main switch, controlling the first robot arm to be electrically connected to the semiconductor process tool further includes the following step: turning on the main switch to electrically connect the first robot arm to the semiconductor process tool.

15. A semiconductor process machine, characterized in that: include: Machine body; A second mechanical arm is connected to the machine body, and a probe is provided on the surface of the second mechanical arm for measuring the square resistance of the wafer; A semiconductor process tool calibration device is connected to the tool body, and the semiconductor process tool calibration device adopts the semiconductor process tool calibration device as claimed in any one of claims 1 to 10.

16. The semiconductor process machine according to claim 15, wherein: The first mechanical arm is located above the second mechanical arm.

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