Electronic component, manufacturing method thereof and electronic equipment

Abstract

The invention provides an electronic component and a manufacturing method thereof, and electronic equipment, and the electronic component comprises a chip which is provided with a front surface and a back surface which are opposite to each other, and the back surface is provided with a solder ball and a back pasting capacitor; the circuit board is provided with a front surface and a back surface which are opposite to each other, a slot is formed in the front surface of the circuit board, the chip is arranged on the circuit board through the solder balls, the back-mounted capacitor extends into the slot, and the slot is filled with a heat conduction material device. According to the invention, the grooving area of the chip is filled with the heat conduction material, so that the heat generated by the chip is effectively conducted downwards through the heat conduction material, and the heat at the bottom of the chip is conducted to the circuit board to realize a soaking effect.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic component and a manufacturing method thereof, and an electronic device. Background Art

[0002] With the development of modern technology, multifunctional electronic products are increasingly favored by people. Take computers as an example. The design inspiration comes from the two-in-one computer of laptop and tablet computer. It combines the advantages of both. The light and portable two-in-one computer is suitable for both entertainment and office work. It can be freely transformed into a laptop or tablet in various occasions such as office, home and outdoor. It has gradually been recognized by consumers.

[0003] For two-in-one computers, under the current heat dissipation situation, due to the increase in power consumption, the temperature rise in the processor (such as CPU or SOC) area is abnormal, thus limiting the power consumption increase of the whole machine. In addition, the current mainstream Intel platform usually has a back-mounted capacitor at the bottom of the chip, so it is necessary to hollow out the area where the processor is located on the circuit board to accommodate the back-mounted capacitor at the bottom of the chip. There are currently two common solutions: one is to completely hollow out the circuit board at the bottom of the processor, leaving an air gap in the middle; the other is to partially hollow out the circuit board at the bottom of the processor, generally with a depth of about 0.2mm (that is, usually 4 layers of a 10-layer single board are hollowed out), leaving a certain air gap in the hollowed area. However, no matter which solution is adopted, a certain air gap will be left under the chip, making it impossible to effectively conduct the large amount of heat generated by the front processor, which further leads to abnormal temperature rise in the processor (such as CPU or SOC) area, limiting the power consumption increase of the whole machine. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides an electronic component and a manufacturing method thereof, and an electronic device. In the electronic component, by filling the slotted area of ​​the chip with thermal conductive material, the heat generated by the chip is effectively conducted downward through the thermal conductive material, and then the heat at the bottom of the chip is conducted to the circuit board to achieve a heat equalization effect.

[0005] In a first aspect, the present application provides an electronic component, comprising:

[0006] A chip, wherein the chip has a front side and a back side opposite to each other, and a solder ball and a back-mounted capacitor are formed on the back side;

[0007] A circuit board, wherein the circuit board has a front side and a back side opposite to each other, a groove is formed on the front side of the circuit board, the chip is arranged on the circuit board through the solder balls, the back-mounted capacitor extends into the groove, and the groove is filled with a thermal conductive material.

[0008] According to the first aspect, the present application fills the slotted area of ​​the chip with a thermally conductive material, thereby effectively conducting the heat generated by the chip downward through the thermally conductive material, and then conducting the heat from the bottom of the chip to the circuit board to achieve a heat equalization effect.

[0009] According to the first aspect, or any implementation of the first aspect above, the heat conductive material is a heat conductive gel, so that the heat generated by the chip can be effectively transferred downward through the heat conductive gel, thereby transferring the heat from the bottom of the chip to the circuit board to achieve a heat distribution effect.

[0010] According to the first aspect, or any implementation of the first aspect above, a glue filling hole and an exhaust hole are formed on the back of the circuit board, the glue filling hole is connected to the slot, the glue filling hole is used to fill the slot with the thermally conductive gel, and the exhaust hole is used to exhaust the air in the slot. In this way, it is convenient to fill the slot with thermally conductive gel and exhaust the air in the slot through the glue filling hole and the exhaust hole.

[0011] According to the first aspect, or any implementation of the first aspect above, the glue filling hole and the exhaust hole are arranged perpendicular to the circuit board, which has a simple structure and short glue filling and exhaust paths.

[0012] According to the first aspect, or any implementation of the first aspect above, the glue filling hole and the exhaust hole are arranged in a diagonal L-shape. This arrangement is convenient for fully ensuring that the slot is better vacuumed when the thermal conductive glue is filled, so that the thermal conductive gel fills the slot, ensuring the heat dissipation performance of the electronic component.

[0013] According to the first aspect, or any implementation of the first aspect above, an underfill is formed around the slot on the circuit board, and the underfill seals the gap between the chip and the circuit board around the slot. This arrangement can prevent the thermal conductive gel from overflowing onto the pad around the slot, and helps to quickly conduct heat from the solder ball, and helps to relieve thermal fatigue of the solder joint.

[0014] According to the first aspect, or any implementation of the first aspect above, the thermally conductive material is an elastic thermally conductive foam or a thermally conductive pad, so that the heat generated by the chip can be effectively transferred downward through the thermally conductive foam or the thermally conductive pad, thereby transferring the heat from the bottom of the chip to the circuit board to achieve a heat distribution effect.

[0015] According to the first aspect, or any implementation of the first aspect above, the thermally conductive material is in contact with the back of the chip, so that the heat generated by the chip can be effectively transferred downward through the thermally conductive material, thereby transferring the heat from the bottom of the chip to the circuit board to achieve a heat distribution effect.

[0016] According to the first aspect, or any implementation of the first aspect above, a heat-conducting layer is formed in the circuit board, and a portion of the heat-conducting layer is in contact with the bottom of the slot. This arrangement facilitates the effective downward conduction of heat generated by the chip to the heat-conducting layer through the heat-conducting material, thereby achieving heat conduction from the bottom of the chip to the circuit board to achieve a heat-balance effect.

[0017] According to the first aspect, or any implementation of the first aspect above, the heat conducting layer is made of copper, and the thickness of the heat conducting layer is 1-2 ounces. This arrangement facilitates improving the heat dissipation capacity of the circuit board and ensures the heat dissipation effect of the electronic components and the entire machine.

[0018] In a second aspect, the present application provides a method for manufacturing an electronic component, comprising:

[0019] A slot is formed in a chip preset mounting area of ​​the circuit board, and a glue filling hole and an exhaust hole communicating with the slot are formed in an area below the slot;

[0020] Solder the chip to the chip's preset mounting area on the circuit board;

[0021] The slots are filled with thermally conductive gel through the glue filling holes, and the air in the slots is exhausted through the vent holes.

[0022] According to the second aspect, the present application fills the slotted area of ​​the chip with thermally conductive gel, thereby effectively conducting the heat generated by the chip downward through the thermally conductive gel, and then conducting the heat from the bottom of the chip to the circuit board to achieve a heat equalization effect.

[0023] In a third aspect, the present application provides a method for manufacturing an electronic component, comprising:

[0024] A slot is formed in a chip preset mounting area of ​​the circuit board, and a flexible thermal conductive material is placed in the slot;

[0025] Placing the chip in a preset chip mounting area on the circuit board and placing an auxiliary pressing block on the surface of the chip;

[0026] Complete the SMT process and solder the chip to the chip preset mounting area on the circuit board.

[0027] According to the third aspect, the present application fills the slotted area of ​​the chip with flexible thermally conductive material, thereby effectively conducting the heat generated by the chip downward through the flexible thermally conductive material, and then conducting the heat from the bottom of the chip to the circuit board to achieve a heat equalization effect.

[0028] In a fourth aspect, the present application provides an electronic device, comprising a housing and a display screen mounted on the housing, and an electronic component as described in any one of the first aspects mounted inside the housing.

[0029] According to the fourth aspect, due to the use of the electronic components provided by the first aspect of the present application, the heat dissipation effect of the chip and the whole machine is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0031] Figure 2 A schematic diagram of an electronic component of a current electronic device is shown as an example;

[0032] Figure 3 is a flow chart of a method for manufacturing an electronic component according to an embodiment of the present application;

[0033] Figure 4 is a cross-sectional schematic diagram of an electronic component according to an embodiment of the present application, wherein the slot is not filled with thermally conductive gel;

[0034] Figure 5 is a schematic top view of an electronic component according to an embodiment of the present application;

[0035] Figure 6 is a cross-sectional schematic diagram of an electronic component according to an embodiment of the present application, wherein the slot is filled with thermally conductive gel;

[0036] Figure 7 is a flow chart of a method for manufacturing an electronic component according to another embodiment of the present application;

[0037] Figure 8 FIG. 4 is a cross-sectional schematic diagram of an electronic component according to another embodiment of the present application. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0040] The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects rather than to describe a specific order of target objects.

[0041] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0042] Introduction to terms related to this application:

[0043] Thermally conductive gel: It is a kind of gap filling thermally conductive material, which is a gel-like thermally conductive material made by stirring, mixing and encapsulating a silicone composite thermally conductive filler. It is formed according to the shape of the structure, has good fluidity, excellent structural applicability and structural surface application properties, and can fully fill the gap. It has good insulation and withstand voltage characteristics and temperature stability, and is safe and reliable.

[0044] Thermal conductive foam: It is mainly composed of graphite thermal conductive material and elastic foam, combining thermal conductivity and buffering functions into one, and the thermal conductivity effect is very obvious.

[0045] Underfill glue: also known as bottom filling glue, bottom filling glue, lower filler, bottom filler, bottom filler, bottom filler, bottom filling glue, etc., is a one-component, fast-curing modified epoxy adhesive. It is used to fill the bottom of the chip in the BGA packaging mode, and fill a large area of ​​the bottom gap of the BGA (generally covering more than 80%), so as to achieve the purpose of reinforcement. It can be applied to the spraying process, which is faster than dispensing and can save time and cost.

[0046] Non-contact jet dispensing technology: It is the best method for underfilling chip scale packages (CSP), ball grid arrays (BGA) and package on package (PoP) on circuit boards. The jetting system can automatically manage the key process flows related to underfilling.

[0047] OZ: The abbreviation of ounce, which means "ounce" in Chinese. When ounce is used as a unit of length, 1oz represents the copper foil thickness of the PCB is about 35um. It comes from the thickness formed by spreading 1oz of pure copper with a density of 8.9g / cm^3 on an area of ​​1 square foot (=144 inches).

[0048] SMT: Surface Mount Technology, is the most popular technology and process in the current electronic assembly industry. It is a circuit assembly technology that mounts pinless or short-lead surface mount components (abbreviated as SMC / SMD, called chip components in Chinese) on the surface of a printed circuit board (PCB) or other substrate, and assembles them by soldering through reflow soldering or dip soldering.

[0049] The electronic device provided in the embodiment of the present application may be a computing device such as a tablet computer, a laptop computer, a two-in-one computer, or a device with a processor having a back-mounted capacitor, etc., but the embodiment of the present application is not limited to this.

[0050] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of the electronic device 100 provided in the embodiment of the present application. Figure 1 In the figure, the electronic device 100 is a two-in-one computer, and includes a housing 1, a display screen 2 and a bracket 3. The display screen 2 is mounted on the housing 1, so that the electronic device 100 forms a closed whole. At the same time, the housing 1 and the display screen 2 also jointly define a storage space inside the electronic device 100. The electronic device 100 also includes electronic components (not shown in the figure) arranged in the storage space, and the electronic components include circuit boards, processors, sensors, cameras, microphones, batteries, etc., but are not limited thereto.

[0051] The housing 1 may be a metal housing, such as magnesium alloy, stainless steel, etc. In addition, it may also be a plastic housing, a glass housing, a ceramic housing, etc., but is not limited thereto.

[0052] The display screen 2 may be a light emitting diode (LED) display screen, a liquid crystal display (LCD) display screen, or an organic light-emitting diode (OLED) display screen, but is not limited thereto. The display screen 2 may also be a flexible display screen with a foldable feature, that is, the electronic device 100 may also be a foldable electronic device, such as a foldable tablet computer.

[0053] The bracket 3 is rotatably mounted on the housing 1 , and the tilt angle of the display screen can be adjusted by adjusting the unfolding angle of the bracket 3 , thereby providing a suitable viewing angle for the user.

[0054] The electronic device 100 of the embodiment of the present application is a two-in-one computer, that is, the electronic device 100 can be used as a common tablet computer or as a notebook computer to meet different usage requirements. Figure 1 As shown, the electronic device 100 further includes a keyboard 4. When the electronic device 100 is used as a notebook computer, the keyboard 4 can be communicatively connected with the processor in the housing 1 and can be used to input instructions and data.

[0055] Optionally, the keyboard 4 is detachably connected to the housing 1 , and when the electronic device 100 is used as a tablet computer, the keyboard 4 can be removed to facilitate user use.

[0056] Optionally, a touchpad may be provided on the keyboard 4 to improve user operation efficiency.

[0057] Optionally, a card reader socket, a USB interface, a headphone interface, etc. may be further provided on the keyboard 4 and / or the side wall of the housing 1 , thereby improving the performance of the electronic device 100 .

[0058] Please refer to Figure 2 , Figure 2 FIG. 1 is a schematic diagram showing an electronic component of a current electronic device. Figure 2 As shown, currently used in Figure 1 The electronic components of the electronic device 100 shown include a chip 10 and a circuit board 20. The chip 10 has a front side and a back side opposite to each other, and a back-mounted capacitor 11 and a solder ball 12 are arranged on the back side of the chip 10. The chip 10 is arranged on the circuit board 20 through the solder ball 12. The circuit board 20 includes a plurality of conductive layers 21 and a plurality of dielectric layers 22, for example, including 10 conductive layers 21 and 10 dielectric layers 22. Adjacent conductive layers 21 are isolated from each other by the dielectric layer 22. And since the back side of the chip 10 is provided with a back-mounted capacitor 11, as mentioned above, in order to assemble the chip 10 on the circuit board 20 and the back-mounted capacitor 11 does not interfere with the circuit board 20, a slot 23 is formed on the front side of the circuit board 20 at a position below the chip 10, and the position of the slot 23 corresponds to the position of the back-mounted capacitor 11, so that when the chip 10 is soldered on the circuit board 20, the back-mounted capacitor 11 extends into the slot 23, so that the back-mounted capacitor 11 does not interfere with the circuit board 20.

[0059] For example, the slot 23 does not penetrate the circuit board 20, and its depth is about 0.2 mm (ie, 4 layers are usually hollowed out of 10 layers of the single board). Figure 2As shown, the slot 23 penetrates through the four conductive layers 21, and the bottom is in contact with the fifth conductive layer 21. Of course, the slot 23 can also penetrate the entire circuit board 20. However, no matter which method is used, as mentioned above, a certain air gap will be left under the chip, making it impossible to effectively conduct away the large amount of heat generated by the front processor, thereby further causing abnormal temperature rise in the processor (such as CPU or SOC) area, limiting the power consumption of the whole machine.

[0060] Based on the above description, the embodiment of the present application proposes an electronic component and a method for manufacturing the same, which can effectively conduct a large amount of heat generated on the front side of the processor, thereby reducing the temperature rise in the processor (such as CPU or SOC) area, and then achieving an increase in the maximum power consumption of the entire machine, or reducing the temperature of the entire machine.

[0061] Please refer to Figure 3 , Figure 3 FIG. 1 is a flow chart of a method for manufacturing an electronic component according to an embodiment of the present application. Figure 3 As shown,

[0062] The manufacturing method 300 of an electronic component provided in an embodiment of the present application includes:

[0063] Step S301, forming a slot in a chip preset mounting area of ​​the circuit board, and forming a glue filling hole and an exhaust hole communicating with the slot in an area below the slot;

[0064] Step S302, soldering the chip to a preset chip mounting area on the circuit board;

[0065] Step S303, filling the slot with thermally conductive gel through the glue filling hole, and exhausting the air in the slot through the exhaust hole.

[0066] In step S301, Figure 4 As shown, a slot 23 is formed in the chip preset mounting area on the front side of the circuit board 20, and a glue filling hole 24 and a vent hole 25 communicating with the slot 23 are formed in the area below the slot 23. In other words, a glue filling hole 24 and a vent hole 25 are formed on the back side of the circuit board 20, and the glue filling hole 24 and the vent hole 25 are communicated with the slot 23.

[0067] In the embodiment of the present application, the structure of the circuit board 20 is Figure 2Similar to the example shown in the figure, it includes multiple conductive layers 21 and multiple dielectric layers 22, for example, 10 conductive layers 21 and 10 dielectric layers 22. Adjacent conductive layers 21 are isolated from each other by the dielectric layer 22. And since a back-mounted capacitor 11 is provided on the back of the chip 10 to be mounted, as mentioned above, in order to assemble the chip 10 on the circuit board 20 and the back-mounted capacitor 11 does not interfere with the circuit board 20, a slot 23 is formed on the circuit board 20 in the preset chip mounting area, and the position and size of the slot 23 correspond to the position and size of the area occupied by the back-mounted capacitor 11.

[0068] A glue filling hole 24 and an exhaust hole 25 are formed at the bottom of the slot 23 (i.e., the side away from the chip 10) penetrating the circuit board 20. The glue filling hole 24 is used to fill the slot 23 with thermal conductive gel, and the exhaust hole 24 is used to exhaust the air in the slot 23.

[0069] Exemplarily, the glue filling hole 24 and the exhaust hole 25 are arranged perpendicular to the circuit board 20, so that the path is shortest, the processing is easy, and the glue filling and exhaust are convenient.

[0070] Exemplarily, the size of the glue filling hole 24 and the vent hole 25 is the same, for example, the diameter of the glue filling hole 24 and the vent hole 25 is 1.2 mm to 3 mm, for example, it can be 1.2 mm, 2 mm, 2.4 mm, 3 mm. Exemplarily, in an embodiment of the present application, the diameter of the glue filling hole 24 and the vent hole 25 is 1.6 mm, so as to take into account the routing design of the circuit board 20 and the filling effect of the thermal conductive gel.

[0071] It should be understood that the functions of the glue filling hole 24 and the exhaust hole 25 are interchangeable, that is, one of the two openings on the circuit board 20 is used as a glue filling hole and the other is used as an exhaust hole, but it is not limited to a hole being a glue filling hole or an exhaust hole.

[0072] like Figure 5 As shown, in the embodiment of the present application, the cross-section of the slot 23 is roughly rectangular, and the glue filling hole 24 and the exhaust hole 25 are arranged diagonally in an "L" shape on the circuit board 20, that is, the glue filling hole 24 and the exhaust hole 25 are arranged at two diagonal positions at the bottom of the slot 23. In this way, it can be better ensured that when the thermal conductive glue is filled in the slot 23, vacuum can be drawn through the exhaust hole 25 to better allow the thermal conductive gel to fill the slot 23, thereby ensuring the heat dissipation performance of the electronic components and improving the heat dissipation capacity and performance of the electronic equipment.

[0073] In step S302, the chip 10 is soldered to a predetermined chip mounting area on the circuit board 20. Figure 4As shown, the chip 10 is similar to the aforementioned structure, having a front side and a back side opposite to each other, and a back-mounted capacitor 11 and a solder ball 12 are arranged on the back side of the chip 10. The chip 10 can be mounted on the circuit board 20 by soldering the solder ball 12 to the corresponding pad on the circuit board 20, and since the position of the slot 23 corresponds to the position of the back-mounted capacitor 11, when the chip 10 is soldered on the circuit board 20, the back-mounted capacitor 11 extends into the slot 23, so the back-mounted capacitor 11 will not interfere with the circuit board 20.

[0074] It should be understood that the specific method of soldering the chip 10 to the circuit board 20 may be any commonly used method in the art or any suitable method developed later, and is not specifically limited here.

[0075] In step S303, the thermally conductive gel 26 is filled into the slot 23 through the glue filling hole 24, and the air in the slot 23 is exhausted through the exhaust hole 25. Finally, the electronic component is obtained as shown in FIG. Figure 6 shown.

[0076] For example, in the embodiment of the present application, the thermally conductive gel 26 may be made of aluminum oxide particles and epoxy resin medium, with a thermal conductivity of 1.5 W / mK to 3 W / mK and a viscosity of 220000. The thermally conductive gel 26 is in a thin paste state and has a certain fluidity.

[0077] For example, in the embodiment of the present application, a suction nozzle can be used to pour the thermally conductive gel 26 from the glue filling hole 24 into the entire slot 23, wherein the thermally conductive gel 26 is in a semi-molten state and has a certain fluidity. In addition, while pouring the thermally conductive gel 26 from the glue filling hole 24 into the entire slot 23, a suction nozzle can be used at the exhaust hole 25 to exhaust the air in the slot 23 by vacuum suction, and the slot 23 is filled with the thermally conductive gel 26 in this cyclic filling and suction manner.

[0078] For example, in the embodiment of the present application, the diameter of the nozzle may be 2.6-4.6 mm, such as 2.6 mm, 3 mm or 4.6 mm. A 0.5-1 mm margin is reserved on one side of the nozzle relative to the glue filling hole 24 and the exhaust hole 25 .

[0079] For example, in the embodiment of the present application, 1.5-2.5 atmospheres of pressure may be used when vacuuming the exhaust hole 25, thereby ensuring a sealing effect when vacuuming the glue filling.

[0080] like Figure 6 As shown, in the embodiment of the present application, the thermally conductive gel 26 in the groove 23 is filled to the extent of contacting the back side of the chip 10, so that the heat generated by the chip 10 can be conducted away more quickly.

[0081] Furthermore, in one embodiment of the present application, in order to prevent the thermal conductive gel 26 from overflowing onto the pads around the slot 23 on the circuit board 20 when filling the thermal conductive gel 26, after the chip 10 is soldered to the circuit board 20 in step S302, an underfill glue may be filled around the slot 23 on the circuit board 20 to seal the gap between the chip 10 and the circuit board 20 around the slot 23, thereby preventing the thermal conductive gel 26 from overflowing onto the pads around the slot 23 on the circuit board 20 when filling the thermal conductive gel 26.

[0082] See also Figure 6 In the embodiment of the present application, in order to improve the heat dissipation capacity of the electronic component, a heat conducting layer 27 is further formed in the circuit board 20, and the heat conducting layer 27 is in contact with the bottom of the slot 23, so that the heat generated by the chip 10 is conducted to the heat conducting layer 27 through the heat conducting gel 26, and then conducted to both sides or downward through the heat conducting layer 27, and finally conducted to the outside of the device. The heat conduction path of the electronic component in this embodiment of the present application is as follows Figure 6 As shown by the middle arrow, the heat generated by the chip 10 is directly transferred downward to the heat-conducting layer 27 through the heat-conducting gel 26 , and then passes through the heat-conducting layer 27 to achieve a heat-balance effect for the circuit board and the entire device.

[0083] For example, in the embodiment of the present application, the heat conducting layer 27 is made of copper, that is, the heat conducting layer 27 is a copper layer, and in order to enhance the heat dissipation effect, the thickness of the heat conducting layer 27 is greater than the thickness of other conductive layers 21 in the circuit board 20. For example, the thickness of the heat conducting layer 27 is 1-2 ounces (OZ), for example, 1OZ, 1.5OZ or 2OZ.

[0084] Exemplarily, in the embodiment of the present application, the circuit board 20 includes 10 conductive layers 21 , the depth of the groove 23 is about 0.2 mm, it penetrates 4 conductive layers 21 , and the bottom is in contact with the thermal conductive layer 27 , which also serves as the fifth conductive layer 21 .

[0085] In order to verify the heat dissipation capability of the electronic assembly provided in the embodiment of the present application, a simulation verification is performed, and the results are shown in Table 1. The circuit board scheme in Table 1 indicates whether the conductive layer in contact with the bottom of the slot is a copper layer of ordinary thickness or a thickened copper layer, and the medium in the slot indicated by the chip bottom filling is air or thermal conductive gel.

[0086] Table 1 Temperature table corresponding to different cooling solutions at the bottom of the chip

[0087]

[0088] It can be seen from Table 1 that after filling the slots of the circuit board with thermal conductive gel, the temperature of the upper surface of the chip can be reduced by 2°C, and the temperature of the lower surface can be reduced by 9°C. The simulation results show that the heat dissipation effect of this solution is very obvious.

[0089] In addition, the above scheme was actually preliminarily verified. By collecting the temperature sensor data inside the chip and comparing it, it was found that filling the bottom of the chip with thermal conductive gel has a 1.7°C increase in the junction temperature of the chip, which reduces the internal temperature of the chip by about 1.7°C, and the heat dissipation effect is obvious.

[0090] Please refer to Figure 7 , Figure 7 FIG. 1 is a flow chart of a method for manufacturing an electronic component according to another embodiment of the present application. Figure 7 As shown,

[0091] The manufacturing method 700 of the electronic component provided in the embodiment of the present application includes:

[0092] Step S701, forming a slot in a chip preset mounting area of ​​a circuit board, and placing a flexible thermal conductive material in the slot;

[0093] Step S702, placing the chip in a preset chip mounting area on the circuit board, and placing an auxiliary pressing block on the surface of the chip;

[0094] Step S703, completing the SMT process and soldering the chip to the preset chip mounting area on the circuit board.

[0095] In step S701, Figure 8 As shown, a slot 23 is formed in the chip preset mounting area of ​​the circuit board 20, and a flexible thermal conductive material 28 is placed in the slot 23. The flexible thermal conductive material 28 is a material with thermal conductivity and high elasticity or deformation ability. In this way, when the chip 10 is soldered on the circuit board 20, the back-mounted capacitor 11 on the back of the chip 10 can extend into the flexible thermal conductive material 28, so as not to interfere with the circuit board 20, and the heat generated by the chip 10 can be quickly conducted downward through the flexible thermal conductive material 28.

[0096] For example, in the embodiment of the present application, the flexible thermally conductive material 28 is, for example, thermally conductive foam, that is, in step S701, the thermally conductive foam is filled in the slot 23. The flexible thermally conductive material 28 is, for example, a thermally conductive pad, that is, in step S701, the thermally conductive pad is placed in the slot 23.

[0097] In step S702, the chip 10 is placed in the preset chip mounting area on the circuit board 20, and an auxiliary pressing block 13 is placed on the surface of the chip 10. This is because during the SMT process, in order to prevent the thermal conductive material 28 from exerting an upward force on the chip 10, an auxiliary pressing block 13 is placed above the chip to prevent the thermal conductive material 28 from lifting the chip 10, thereby ensuring the chip welding effect. The auxiliary pressing block 13 can be removed after the SMT process is completed.

[0098] In step S703 , the SMT process is performed, and the solder balls 12 of the chip 10 are soldered to the corresponding pads of the circuit board 20 , so that the chip 10 is fixed on the circuit board 20 .

[0099] like Figure 8 As shown, in the embodiment of the present application, the flexible thermally conductive material 28 in the slot 23 is filled to the extent of contacting the back side of the chip 10, so that the heat generated by the chip 10 can be conducted away more quickly.

[0100] like Figure 8 As shown, in the embodiment of the present application, in order to improve the heat dissipation capacity of the electronic component, a heat conducting layer 27 is further formed in the circuit board 20, and the heat conducting layer 27 is in contact with the bottom of the slot 23, so that the heat generated by the chip 10 is conducted to the heat conducting layer 27 through the heat conducting gel 26, and then conducted to both sides or downward through the heat conducting layer 27, and finally conducted to the outside of the device. The heat conduction path of the electronic component in this embodiment of the present application is as follows Figure 6 As shown by the middle arrow, the heat generated by the chip 10 is directly transferred downward to the heat-conducting layer 27 through the heat-conducting gel 26 , and then passes through the heat-conducting layer 27 to achieve a heat-balance effect for the circuit board and the entire device.

[0101] For example, in the embodiment of the present application, the heat conducting layer 27 is made of copper, that is, the heat conducting layer 27 is a copper layer, and in order to enhance the heat dissipation effect, the thickness of the heat conducting layer 27 is greater than the thickness of other conductive layers 21 in the circuit board 20. For example, the thickness of the heat conducting layer 27 is 1-2 ounces (OZ), for example, 1OZ, 1.5OZ or 2OZ.

[0102] Exemplarily, in the embodiment of the present application, the circuit board 20 includes 10 conductive layers 21 , the depth of the groove 23 is about 0.2 mm, it penetrates 4 conductive layers 21 , and the bottom is in contact with the thermal conductive layer 27 , which also serves as the fifth conductive layer 21 .

[0103] The embodiment of the present application achieves the effect of uniform heat distribution by transferring the heat from the chip area to the middle thick copper surface by filling the slot 23 with flexible thermally conductive material. This solution makes full use of the middle slot area to achieve heat transfer between the chip and the single-board PCB, thereby effectively achieving heat dissipation on the lower surface of the chip, thereby enhancing the heat dissipation capacity of the chip and the entire machine.

[0104] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic component, characterized in that: include: A chip, wherein the chip has a front side and a back side opposite to each other, and a solder ball and a back-mounted capacitor are formed on the back side; A circuit board, wherein the circuit board has a front side and a back side opposite to each other, a groove is formed on the front side of the circuit board, the chip is arranged on the circuit board through the solder balls, the back-mounted capacitor extends into the groove, and the groove is filled with a thermal conductive material.

2. The electronic component according to claim 1, characterized in that The thermally conductive material is thermally conductive gel.

3. The electronic component according to claim 2, characterized in that A glue filling hole and an exhaust hole are formed on the back side of the circuit board. The glue filling hole is communicated with the slot and is used to fill the slot with the thermally conductive gel. The exhaust hole is used to exhaust the air in the slot.

4. The electronic component according to claim 3, characterized in that: The glue filling holes and the exhaust holes are arranged perpendicular to the circuit board.

5. The electronic component according to claim 3, characterized in that: The glue filling holes and the exhaust holes are arranged in a diagonal L shape.

6. The electronic component according to claim 2, characterized in that: An underfill is formed around the slot on the circuit board, and the underfill seals a gap between the chip around the slot and the circuit board.

7. The electronic component according to claim 1, characterized in that: The thermally conductive material is elastic thermally conductive foam or thermally conductive pad.

8. The electronic component according to any one of claims 1 to 7, characterized in that: The thermal conductive material contacts the back side of the chip.

9. The electronic component according to any one of claims 1 to 7, characterized in that: A heat-conducting layer is formed in the circuit board, and a portion of the heat-conducting layer is in contact with the bottom of the slot.

10. The electronic component according to claim 9, characterized in that The heat conducting layer is made of copper, and the thickness of the heat conducting layer is 1-2 ounces.

11. A method for manufacturing an electronic component, characterized in that: include: A slot is formed in a chip preset mounting area of ​​the circuit board, and a glue filling hole and an exhaust hole communicating with the slot are formed in an area below the slot; Solder the chip to the chip's preset mounting area on the circuit board; The slots are filled with thermally conductive gel through the glue filling holes, and the air in the slots is exhausted through the vent holes.

12. A method for manufacturing an electronic component, characterized in that: include: A slot is formed in a chip preset mounting area of ​​the circuit board, and a flexible thermal conductive material is placed in the slot; Placing the chip in a preset chip mounting area on the circuit board and placing an auxiliary pressing block on the surface of the chip; Complete the SMT process and solder the chip to the chip preset mounting area on the circuit board.

13. An electronic device, characterized in that: It comprises a housing and a display screen mounted on the housing, and an electronic component as claimed in any one of claims 1 to 10 mounted inside the housing.

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