Photovoltaic cell grid line preparation method and preparation device

Abstract

The invention provides a photovoltaic cell grid line preparation method and device, and the method comprises the steps: obtaining a to-be-manufactured piece of a grid line, and the to-be-manufactured piece of the grid line is a photovoltaic cell semi-finished product containing a dielectric layer before the electroplating of the grid line; the grid line to-be-manufactured piece is subjected to film opening, a strip-shaped conductive area from one side of the grid line to-be-manufactured piece to the other side of the grid line to-be-manufactured piece is formed, and the conductive area is used for being connected with an external electrode; patterning the to-be-manufactured piece of the grid line after the film is opened, and removing the dielectric layer of the to-be-manufactured piece of the grid line to form a contact area of the grid line; and preparing the grid line in the contact area through an electroplating process, connecting the conductive area on the to-be-manufactured piece of the grid line to an external electrode when the grid line is electroplated, and horizontally placing the to-be-manufactured piece of the grid line and making contact with the electroplating liquid. The metal grid line prepared by the method is more uniform in height and better in pulling-out force, a seed layer does not need to be prepared, the production cost is reduced, and the preparation time is shortened.

Description

Technical Field

[0001] The present invention mainly relates to the technical field of photovoltaic cell preparation, and in particular to a photovoltaic cell grid line preparation method and preparation device. Background Art

[0002] Solar cells or photovoltaic cells (PV) are components that convert solar energy into electrical energy. When sunlight shines on the semiconductor material on the surface of the solar cell, the semiconductor material absorbs the energy of the photons, allowing the electrons in the semiconductor atoms to obtain enough energy to be excited from the covalent bonds to form free electrons. These free electrons separate under the action of the PN junction electric field to form current, which can drive the load to work. The production process of solar cells mainly includes steps such as cleaning, texturing, diffusion, etching, coating, screen printing and sintering. These steps work together to process the substrate into a solar cell with photoelectric conversion function.

[0003] With the development of photovoltaic technology, the photoelectric conversion efficiency of photovoltaic cells has gradually increased and the cost has gradually decreased. However, due to the high price of silver paste used in the screen printing process, the cost of silver paste accounts for about 40% of the non-silicon cost of the battery, making the cost of photovoltaic cells high. Through electroplating, chemical plating and other technologies, the silver in the metallization process is replaced with cheap metals such as copper, making electroplating and chemical plating technologies a new way to reduce costs.

[0004] At present, most of the metallization of photovoltaic cells is achieved by screen printing. The screen printing process first prints the slurry onto the cell according to a certain pattern, and then the effective ingredients in the slurry corrode and burn through the surface dielectric material, that is, the dielectric layer, at high temperature, thereby connecting with the conductive substrate to realize the extraction of current. However, the slurry used for screen printing has a high silver content, so the preparation cost is relatively high. Electroplating metallization has attracted much attention because it uses relatively cheap metals such as copper and nickel to prepare metal grid lines, which can significantly reduce costs. Among them, rack plating is a commonly used coating method. Since the rack plating process requires a hanging point to be left on the cell, the hanging point needs to be partially removed after electroplating. Therefore, the height uniformity of the metal grid line prepared by rack plating is poor, and there are certain problems with the pull-off force of the grid line. Sometimes it is also necessary to prepare a seed layer to complete the preparation of the grid line, but the preparation of the seed layer will increase the process flow and cost. In addition, the electroplating fixture also needs to be cleaned, and there are many processes. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method and a device for preparing grid lines of photovoltaic cells. The prepared grid lines have more uniform height and better pull-off force, and do not require the preparation of a seed layer, thereby reducing production costs and shortening preparation time.

[0006] To solve the above technical problems, in the first aspect, the present invention provides a method for preparing a photovoltaic cell grid line, comprising: obtaining a grid line workpiece, wherein the grid line workpiece is a semi-finished photovoltaic cell product containing a dielectric layer before electroplating the grid line; opening the film of the grid line workpiece to form a strip-shaped conductive area from one side of the grid line workpiece to the other side, wherein the conductive area is used to connect an external electrode; graphing the grid line workpiece after opening the film, removing the dielectric layer of the grid line workpiece to form a contact area of ​​the grid line; preparing the grid line in the contact area by an electroplating process; when electroplating the grid line, the conductive area on the grid line workpiece is connected to the external electrode, and the grid line workpiece is placed horizontally and in contact with the electroplating solution.

[0007] Optionally, the photovoltaic cell grid line preparation method is used to prepare a back contact cell.

[0008] Optionally, patterning the gate line component after the film is opened, and removing the dielectric layer of the gate line component includes: patterning the gate line component after the film is opened by using a laser etching process or an exposure mask process, and removing the dielectric layer of the gate line component.

[0009] Optionally, the method further includes: when preparing the gate line in the contact area by an electroplating process, using an electroplating device with a light-inducing device to perform the electroplating process.

[0010] In a second aspect, the present invention provides a photovoltaic cell grid line preparation device, comprising: a plating liquid tank; a support portion, the support portion is arranged on the plating liquid tank, and is configured to support a horizontally placed grid line workpiece when electroplating the grid line; a brush, the brush is arranged at a position close to the plating liquid tank, and is configured to contact a strip-shaped conductive area of ​​the grid line workpiece when electroplating the grid line; wherein the conductive area is an area on the grid line workpiece used to connect an external electrode during electroplating; and an electrode rod, the electrode rod is arranged in the tank of the plating liquid tank.

[0011] Optionally, the electroplating liquid tank comprises a sub-tank and a main tank, wherein the sub-tank is located above the main tank and is connected to the main tank through a pipeline.

[0012] Optionally, a first overflow groove is provided on one side of the sub-groove, and the first overflow groove is connected to the main groove through a first overflow pipe.

[0013] Optionally, a second overflow groove is provided on the other side of the sub-groove, and the second overflow groove is connected to the main groove through a second overflow pipe.

[0014] Optionally, the support portion includes a support shaft and support rollers, wherein the support shaft is horizontally placed above the electroplating tank, and a plurality of support rollers are fixed on the support shaft.

[0015] Optionally, an overflow baffle is provided between the brush and the electroplating liquid tank.

[0016] Compared with the prior art, the present invention has the following advantages: when electroplating metal gate lines, the gate line workpiece is opened to form a strip-shaped conductive area from one side of the gate line workpiece to the other side, and the conductive area is used to connect the external electrode. The gate line workpiece after the opening is then patterned to form a contact area for the gate line. The conductive area on the gate line workpiece is connected to the external electrode and the gate line workpiece is placed horizontally and in contact with the electroplating solution. The metal gate lines prepared in this way have more uniform height and better pull-off force, and there is no need to prepare a seed layer, which reduces production costs and shortens preparation time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are included to provide a further understanding of the present application. They are included and constitute a part of the present application. The accompanying drawings illustrate embodiments of the present application and together with the present specification serve to explain the principles of the present application. In the accompanying drawings:

[0018] Figure 1 It is a schematic diagram of the process of preparing a photovoltaic cell grid line according to an embodiment of the present invention;

[0019] Figure 2 It is a schematic diagram of the structure of the gate line workpiece after film opening in one embodiment of the present invention;

[0020] Figure 3 It is a schematic structural diagram of a photovoltaic cell grid line preparation device according to an embodiment of the present invention;

[0021] Figure 4 yes Figure 3 Schematic diagram of the enlarged structure of the dotted line part A.

[0022] In the figure:

[0023] 100-grid line workpiece, 110-conductive area;

[0024] 201-first electrode region, 202-second electrode region;

[0025] 300-electroplating tank, 310-sub-tank, 320-mother tank, 330-pipeline;

[0026] 410 - first overflow trough, 420 - first overflow pipe;

[0027] 510 - second overflow trough, 520 - second overflow pipe;

[0028] 600-support part, 610-support shaft, 620-support roller;

[0029] 700-Electrode rod;

[0030] 800-Brush;

[0031] 900-Overflow baffle. DETAILED DESCRIPTION

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0033] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0034] In the description of the present application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0035] In addition, it should be noted that the use of words such as "first" and "second" to define components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above words have no special meaning and cannot be understood as limiting the scope of protection of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article. In addition, it is required to understand this application not only by the actual terms used, but also by the meaning implied by each term.

[0036] Flowcharts are used in the present application to illustrate the operations performed by the system according to the embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed accurately in order. On the contrary, various steps may be processed in reverse order or simultaneously. At the same time, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0037] Figure 1 is a schematic diagram of a process for preparing a photovoltaic cell grid line according to an embodiment of the present invention, with reference to Figure 1 As shown, it includes: S110, obtaining a grid line workpiece, wherein the grid line workpiece is a semi-finished photovoltaic cell containing a dielectric layer before electroplating the grid line; S120, opening the film of the grid line workpiece to form a strip-shaped conductive area from one side of the grid line workpiece to the other side, and the conductive area is used to connect the external electrode; S130, graphing the grid line workpiece after opening the film, removing the dielectric layer of the grid line workpiece to form a contact area of ​​the grid line; S140, preparing the grid line in the contact area through an electroplating process; when electroplating the grid line, the conductive area on the grid line workpiece is connected to the external electrode, and the grid line workpiece is placed horizontally and in contact with the electroplating solution (or electrolyte).

[0038] refer to Figure 2As shown, after the opening film treatment, the grid line part 100 has a conductive area 110 in its middle position, and this conductive area 110 is a strip or rectangular region, and the left and right sides of this strip conductive area 110 are respectively the regions that need to plate the grid line. Then, the grid line part 100 is graphically processed again to form the electrode region, i.e., the region that needs to finally form the grid line, exposing the conductive substrate at the bottom. After completing the above-mentioned basic work, the grid line part 100 after the treatment is electroplated. When the grid line part 100 enters the electroplating device, by adjusting the electroplating liquid level, the grid line part 100 is contacted with the electroplating liquid, and then energized to electroplate the metal grid line. When the grid line is electroplated, according to the electroplating process, the grid line part 100 needs to be connected with the external electrode so that the loop is formed to carry out the electroplating process. In this embodiment, the grid line workpiece 100 is placed horizontally for electroplating, and the conductive area thereon can contact the external electrode, and the contact part between the external electrode and the conductive area can be any position on the conductive area. Therefore, the grid line workpiece 100 can always be in a conductive state, avoiding the situation in which the conduction is interrupted due to the presence of a dielectric layer between the grid line areas in the traditional electroplating process. In addition, the conductive area 110 is not an effective area for forming the final photovoltaic cell, and will not have an adverse effect on the performance of the photovoltaic cell. The preparation method of this embodiment, on the one hand, the efficiency of the electroplated grid line is improved by opening the film to form the conductive area, combined with horizontal electroplating, and the production capacity is increased, and the metal grid line prepared by horizontal electroplating has good height uniformity and pull-off force; on the other hand, this method does not require the preparation of a seed layer, which can shorten the preparation time and reduce production costs.

[0039] In one example, the photovoltaic cell grid line preparation method of this embodiment is used to prepare a back contact cell.

[0040] The back contact cell (BC cell) is a high-efficiency photovoltaic cell that moves the PN junction and metal contact of the solar cell to the back of the cell. The emitter electrode and base electrode of the back contact cell are both located on the back of the cell, thus avoiding the shading loss of the front grid line. Since there is no metal electrode blocking the front of the back contact cell, the back contact cell can maximize the use of sunlight, reduce optical losses, increase the effective power generation area, and improve the photoelectric conversion efficiency. Its theoretical conversion efficiency limit is 29.1%.

[0041] Back contact cells are mostly plated by hanging, that is, a hanging point is reserved on the cell sheet (grid wire to be processed 100), an external fixture clamps the cell sheet, and the conductive contact is connected to the hanging point to realize the conduction of current. After that, the assembly is placed in an electroplating solution, and the metal grid wire is energized to prepare. In order to ensure the uniformity of current distribution during the electroplating grid wire process, a seed layer needs to be prepared before electroplating, and the metal seed layer can better conduct current and speed up the preparation of the metal grid wire. However, for back contact cells, since the metal grid wires are all on the back, the connection between the cell sheet and the external electrode during the electroplating grid wire process has certain difficulties.

[0042] Continue to refer Figure 2 As shown, if the gate wire workpiece 100 is an intermediate product for preparing a back contact battery, the left and right sides of the conductive area 110 are still areas where the gate wire needs to be plated. The gate wire workpiece 100 is then subjected to a graphical treatment to form an electrode area, that is, an area where the gate wire needs to be formed, exposing the conductive substrate at the bottom. Wherein, the formed electrode area includes a first electrode area 201 and a second electrode area 202, and the first electrode area 201 and the second electrode area 202 correspond to the positive and negative electrodes of the back contact battery. For example, the first electrode area 201 can be a positive electrode, and the second electrode area 202 can be a negative electrode, or the first electrode area 201 can be a negative electrode, and the second electrode area 202 can be a positive electrode.

[0043] In this embodiment, the conductive area 110 in the middle of the back contact cell is used as the part connecting the external electrode, and other areas are patterned normally. The dielectric layer on the surface of the cell is removed, and then the metal grid line is prepared. Horizontal electroplating is performed by directly separating the metal grid line area from the conductive area 110, thereby achieving the preparation of the metal grid line and the protection of the external electrode at the same time.

[0044] In one example, the gate line component 100 after the film is opened is patterned, and the dielectric layer of the gate line component 100 is removed by patterning the gate line component 100 after the film is opened using a laser etching process or an exposure mask process.

[0045] The laser etching process uses the high energy density characteristics of the laser beam to process the dielectric layer. When the laser beam irradiates the dielectric layer, the dielectric layer absorbs the laser energy and heats up rapidly. When the temperature reaches the melting point or boiling point of the dielectric layer, the dielectric layer material will melt, ablate or evaporate, thereby removing the dielectric layer material and forming a groove structure. The laser etching process has extremely high precision and can accurately control the shape, size and depth of the pattern to adapt to different photovoltaic cell structures and performance requirements. This precise control capability helps to optimize the photovoltaic cell structure and improve the overall performance of the photovoltaic cell.

[0046] Compared with the laser etching process, the advantage of the exposure mask process is that the exposure time, light source intensity, development time and other parameters in the exposure mask process can be adjusted according to specific process requirements to achieve the best graphic transfer effect. The controllability of this process helps to optimize the production process and improve product quality. In addition, if the optimal process parameters are determined, the exposure mask process can maintain a high degree of consistency in mass production, ensuring that each photovoltaic cell has the same performance and quality.

[0047] In one example, the method of this embodiment further includes, when preparing the gate line in the contact area by the electroplating process, using an electroplating device having a light-induced device to perform the electroplating process.

[0048] In this embodiment, the light-induced device can provide the necessary light energy for the gate line electroplating process and convert it into electrical energy to achieve the selective deposition of metal ions. Since the irradiation of the light source can directly stimulate the photovoltaic cell to generate electrical energy, the use of the electroplating device with the light-induced device to perform the electroplating process can significantly improve the efficiency of the electroplating, and no external power supply and complex circuit system are required, making the gate line electroplating process more simple and easy.

[0049] In the method for preparing the grid lines of photovoltaic cells of the present embodiment, when electroplating the metal grid lines, the grid line workpiece is opened to form a strip-shaped conductive area from one side of the grid line workpiece to the other side, and the conductive area is used to connect the external electrode. The grid line workpiece after the opening of the film is then patterned to form a contact area for the grid line. The conductive area on the grid line workpiece is connected to the external electrode and the grid line workpiece is placed horizontally and in contact with the electroplating solution. The metal grid lines prepared in this way have more uniform height and better pull-off force, and there is no need to prepare a seed layer, which reduces production costs and shortens preparation time.

[0050] Figure 3 is a schematic structural diagram of a photovoltaic cell grid line preparation device according to an embodiment of the present invention, Figure 4 yes Figure 3 The enlarged schematic diagram of the structure of the dotted line part A is shown in Figure 1. Figure 3 and Figure 4 As shown, the preparation device of this embodiment can be applied to the photovoltaic cell grid line preparation method of the aforementioned embodiment, but is not limited thereto. Specifically, the preparation device includes a plating tank 300, a support portion 600, a brush 800 and an electrode rod 700, wherein the support portion 600 is arranged on the plating tank 300, and is configured to support the horizontally placed grid line workpiece 100 when electroplating the grid line. The brush 800 is arranged at a position close to the plating tank 300, and is configured to contact the strip-shaped conductive area 110 of the grid line workpiece 100 when electroplating the grid line, and the conductive area 110 is an area on the grid line workpiece 100 for connecting an external electrode during electroplating, such as connecting to an external negative electrode. The electrode rod 700 (such as an anode rod) is arranged in the groove of the plating tank 300.

[0051] Electroplating is the process of depositing a layer of metal film on the surface of metal or other materials by electrolysis. In the electroplating process, an electrolyte containing metal ions to be plated is usually used, and the workpiece to be plated is used as the cathode, another metal or conductive material is used as the anode, and then a direct current is passed. Under the action of the electric field, the metal ions in the electrolyte will migrate to the cathode, and the metal ions accept electrons on the cathode surface and undergo a reduction reaction, thereby depositing a layer of metal plating. In the present embodiment, when the grid line needs to be electroplated, the electroplating solution (i.e., electrolyte) is filled in the electroplating solution tank 300. Since the electrode rod 700 (anode rod) is arranged in the groove of the electroplating solution tank 300, therefore, when the electroplating solution is filled in the electroplating solution tank 300, the electrode rod 700 is placed in the electroplating solution. The grid line to be processed 100 is horizontally placed on the support 600 and contacts the electroplating solution in the electroplating solution tank 300 below. In addition, the brush 800 connected to the external electrode contacts the conductive area 110 in the middle area of ​​the grid line to be processed 100. The conditions required for electroplating are met in the above manner. When a loop current is passed, a metal grid line is formed in the contact area, and the preparation of the metal grid line is finally completed.

[0052] The preparation device of this embodiment can be provided with one set or two sets of the same. Figure 3 As shown, since the gate line workpiece 100 is divided into two left and right parts by the middle conductive area 110, two identical sets of components can be set. Of course, the two sets of components can still be considered to form a preparation device of this embodiment. The preparation device can be used to electroplate the gate lines on both sides of the conductive area 110 at the same time, thereby improving the efficiency of electroplating the gate lines.

[0053] In one example, the electroplating tank 300 includes a sub-tank 310 and a main tank 320, wherein the sub-tank 310 is located above the main tank 320 and is connected to the main tank 320 through a pipe 330. When the device of this embodiment is not performing the gate line electroplating operation, the electrolyte is often stored in the main tank 320. When the gate line electroplating operation is required, the electrolyte in the main tank 320 is introduced into the sub-tank 310 to perform the gate line electroplating operation.

[0054] In one example, a first overflow groove 410 is disposed on one side of the sub-groove 310, and the first overflow groove 410 is connected to the main groove 320 through a first overflow pipe 420. Furthermore, a second overflow groove 510 is disposed on the other side of the sub-groove 310, and the second overflow groove 510 is connected to the main groove 320 through a second overflow pipe 520.

[0055] In this embodiment, when there is too much electrolyte in the sub-slot 310 or the electrolyte flows out of the sub-slot 310 due to other reasons (such as the slope or inclination of the plating liquid tank 300), the overflowing electrolyte is effectively collected by the first overflow slot 410 and recycled into the main slot 320 to prevent the electrolyte from entering the area where the brush 800 is located when the liquid level is too high and contaminating the brush 800. The second overflow slot 510 and its attached components are arranged on the other side of the sub-slot 310 of the device of this embodiment for the same reason, which will not be repeated here.

[0056] In one example, the support portion 600 includes a support shaft 610 and support rollers 620 , wherein the support shaft 610 is horizontally placed above the electroplating tank 300 , and a plurality of support rollers 620 are fixed on the support shaft 610 .

[0057] In this embodiment, the support shaft 610 is placed horizontally on the plating liquid tank 300, and a plurality of support rollers 620 are fixed on the support shaft 610. When electroplating the gate line, the gate line workpiece 100 is placed on the support rollers 620. The support rollers 620 jointly support the gate line workpiece 100, and the gate line workpiece 100 can move in the horizontal direction driven by the rollers 620.

[0058] In one example, an overflow baffle 900 is provided between the brush 800 and the electroplating liquid tank 300. The upper surface of the sub-tank 310 in the manufacturing device of this embodiment may have a certain slope, which may increase the risk of electrolyte overflow. To this end, this embodiment may provide an overflow baffle 900 near the brush 800 to prevent the electrolyte from flowing to the brush 800, thereby protecting the brush 800.

[0059] The photovoltaic cell grid line preparation device of the present embodiment can provide a horizontal electroplating method. When electroplating the grid line, the anode is realized by the electrode rod 700 placed in the electroplating liquid tank 300, and the cathode is realized by contacting the conductive area 110 of the grid line workpiece 100 with the external brush 800. Therefore, through this horizontal electroplating method, the efficiency of electroplating the grid line is improved, that is, the production capacity is improved, and the prepared metal grid line has good height uniformity and pull-off force. When using the device of the present embodiment to electroplate the grid line, there is no need to prepare a seed layer, which shortens the grid line preparation time and reduces the production cost. In addition, the device of the present embodiment also realizes a continuous and efficient grid line electroplating process by arranging a support shaft 610 and a support roller 620.

[0060] The basic concepts have been described above. Obviously, for those skilled in the art, the above invention disclosure is only used as an example and does not constitute a limitation of the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements and amendments to the present application. Such modifications, improvements and amendments are suggested in the present application, so such modifications, improvements and amendments still belong to the spirit and scope of the exemplary embodiments of the present application.

[0061] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0062] Although the present application has been described with reference to the current specific embodiments, ordinary technicians in this technical field should recognize that the above embodiments are only used to illustrate the present application, and various equivalent changes or substitutions may be made without departing from the spirit of the present application. Therefore, as long as the changes and modifications to the above embodiments are within the essential spirit of the present application, they will fall within the scope of the claims of the present application.

Claims

1. A method for preparing a photovoltaic cell grid line, characterized in that: include: Obtaining a grid line workpiece, wherein the grid line workpiece is a semi-finished photovoltaic cell containing a dielectric layer before the grid line is electroplated; Opening the gate line workpiece to form a strip-shaped conductive area from one side to the other side of the gate line workpiece, wherein the conductive area is used to connect an external electrode; Patterning the gate line workpiece after film opening, removing the dielectric layer of the gate line workpiece, and forming a contact area of ​​the gate line; The gate line is prepared in the contact area by an electroplating process; when the gate line is electroplated, the conductive area on the gate line workpiece is connected to the external electrode, and the gate line workpiece is placed horizontally and in contact with the electroplating solution.

2. The method for preparing a photovoltaic cell grid line according to claim 1, characterized in that: The photovoltaic cell grid line preparation method is used to prepare a back contact cell.

3. The method for preparing a photovoltaic cell grid line according to claim 1, characterized in that: The gate line workpiece to be processed is patterned after the film is opened, and the dielectric layer of the gate line workpiece to be processed is removed, which includes: patterning the gate line workpiece to be processed after the film is opened by using a laser etching process or an exposure mask process, and removing the dielectric layer of the gate line workpiece to be processed.

4. The method for preparing a photovoltaic cell grid line according to claim 1, characterized in that: Also includes: In the step of preparing the gate line in the contact area by an electroplating process, an electroplating device having a light-inducing device is used to perform the electroplating process.

5. A photovoltaic cell grid line preparation device, characterized in that: include: Electroplating bath; A support portion, the support portion is disposed on the electroplating tank and is configured to support a horizontally placed grid line workpiece when electroplating the grid line; An electric brush, the electric brush is arranged near the electroplating tank and is configured to contact the strip-shaped conductive area of ​​the grid line workpiece when electroplating the grid line; The conductive area is an area on the gate line workpiece that is used to connect to an external electrode during electroplating; An electrode rod is arranged in the electroplating tank.

6. The photovoltaic cell grid line preparation device according to claim 5, characterized in that: The electroplating liquid tank comprises a sub-tank and a main tank, wherein the sub-tank is located above the main tank and is connected to the main tank through a pipeline.

7. The photovoltaic cell grid line preparation device according to claim 6, characterized in that: A first overflow groove is arranged on one side of the sub-groove, and the first overflow groove is connected to the main groove through a first overflow pipe.

8. The photovoltaic cell grid line preparation device according to claim 7, characterized in that: A second overflow groove is arranged on the other side of the sub-groove, and the second overflow groove is connected to the main groove through a second overflow pipe.

9. The photovoltaic cell grid line preparation device according to claim 5, characterized in that: The support part comprises a support shaft and support rollers, wherein the support shaft is horizontally placed above the electroplating liquid tank, and a plurality of support rollers are fixed on the support shaft.

10. The photovoltaic cell grid line preparation device according to any one of claims 5 to 9, characterized in that: An overflow baffle is arranged between the brush and the electroplating liquid tank.

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