Optical module

Abstract

The optical module provided by the invention comprises a circuit board, a light emitting part, a first power supply chip, a second power supply chip, a driving chip and an MCU. Wherein the light emitting component comprises a laser chip; the first power supply chip provides a first electric signal for the laser chip; a second register is arranged in the second power supply chip, and the second power supply chip provides a second electric signal for the laser chip. The MCU respectively adjusts the second electric signal and the first electric signal according to the received first command signal and the second command signal; if the current eye pattern characterization parameter is smaller than the preset value, continuously adjusting the first electric signal according to a received third instruction signal until the eye pattern characterization parameter is not smaller than the preset value; and if the eye pattern characterization parameter cannot be not smaller than the preset value by adjusting the first electric signal, adjusting the output of the driving chip according to a received fourth instruction signal until the eye pattern characterization parameter is not smaller than the preset value. According to the invention, the output of the laser signal is adjusted according to the instruction signal, so that the quality of the output eye pattern of the laser chip is optimized.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules, as one of the key components in optical communication equipment, can realize the conversion of optical and electrical signals. In the development of optical communication technology, the data transmission rate of optical modules is required to be continuously improved.

[0003] In optical modules of different structures, commonly used laser types include distributed feedback laser (DFB), electro-absorption modulated laser (EML), etc. Among them, EML laser is an integrated device of electro-absorption modulator (EAM) and DFB laser. It also integrates optical isolator, backlight monitoring PD, TEC cooler, thermistor and other components. It has the characteristics of high integration, high speed, long transmission distance, high isolation, etc. It is a universal ideal light source for information transmission carriers in current high-speed optical fiber transmission networks at home and abroad.

[0004] In order to ensure that the EML laser meets the strict protocol requirements of telecommunication-grade signal transmission, it is necessary to control the EML laser to have a good eye diagram quality. Summary of the invention

[0005] The present application provides an optical module, which can be debugged to make the eye diagram quality of the EML laser meet the requirements.

[0006] The optical module provided in this application includes:

[0007] Circuit boards;

[0008] A light emitting component, electrically connected to the circuit board, including a laser chip;

[0009] A first power chip is disposed on the surface of the circuit board and is electrically connected to the laser chip, and is used to provide a first electrical signal to the laser chip; the first power chip has a built-in first register;

[0010] A second power chip is disposed on the surface of the circuit board and is electrically connected to the laser chip to provide a second electrical signal to the laser chip; the second power chip has a built-in second register;

[0011] The driver chip is disposed on the surface of the circuit board and is electrically connected to the laser chip, and is used to provide a third electrical signal to the laser chip, where the third electrical signal is a modulation signal; the driver chip has a built-in third register;

[0012] The MCU is disposed on the surface of the circuit board and is electrically connected to the first power chip, the second power chip, and the driver chip respectively, and is configured as follows:

[0013] According to the first instruction signal, the register value of the first register is fixed, and the register value of the second register is adjusted to adjust the second electrical signal, thereby making the output optical power within a first preset range, where the first preset range is related to the target output optical power;

[0014] According to the second instruction signal, the current register value of the second register is maintained, and the register value of the first register is adjusted to adjust the first electrical signal, so that the output optical power is within a second preset range, and the second preset range is related to the target output optical power;

[0015] According to the third instruction signal, adjusting the register value of the first register so that the eye diagram characterization parameter is not less than a preset value, wherein the eye diagram characterization parameter is less than the preset value when the third instruction signal is issued;

[0016] According to the fourth instruction signal, the register value of the third register is adjusted to change the modulation signal output by the driver chip so that the eye diagram characterization parameter is not less than the preset value, wherein the eye diagram characterization parameter is less than the preset value when the fourth instruction signal is issued, and the eye diagram characterization parameter cannot be achieved by adjusting the register value of the first register.

[0017] The optical module provided in the present application includes a circuit board, an optical emitting component, a first power chip, a second power chip, a driver chip and an MCU. The optical emitting component includes a laser chip; the first power chip has a built-in first register and provides a first electrical signal to the laser chip; the second power chip has a built-in second register and provides a second electrical signal to the laser chip; the driver chip has a built-in third register and provides a third electrical signal to the laser chip, and the third electrical signal is a modulation signal. When debugging the output eye diagram of the laser chip, firstly, the output eye diagram is roughly debugged by adjusting the first electrical signal and the second electrical signal so that the output optical power reaches a preset range, and then the output eye diagram is finely modulated by continuing to adjust the first electrical signal or adjusting the output of the driver chip. Wherein, the output eye diagram is roughly debugged by adjusting the first electrical signal and the second electrical signal so that the output optical power reaches the preset range, including: the MCU receives the first command signal, keeps the register value in the first register fixed according to the first command signal, and then adjusts the register value of the second register until the output optical power is in the first preset range; then the MCU receives the second command signal, keeps the current register value of the second register according to the second command signal, and adjusts the register value of the first register until the output optical power is in the second preset range. Exemplarily, the first electrical signal is a bias voltage and the second electrical signal is a bias current. When the bias voltage is adjusted, the optical power absorbed by the electro-absorption modulator inside the laser chip changes, so the second preset range is different from the second preset range. If the eye diagram characterization parameter is not less than the preset value under the current register value of the first register and the register value of the second register, the debugging is completed. By continuing to adjust the first electrical signal or adjusting the output of the driver chip, the output eye diagram is finely modulated, including: if the eye diagram characterization parameter is less than the preset value under the current register value of the first register and the register value of the second register, then continue to adjust the register value of the first register according to the received third instruction signal, and adjust the output of the laser chip by adjusting the first electrical signal output by the first power chip, thereby optimizing the output eye diagram quality of the laser chip until the eye diagram characterization parameter is not less than the preset value. If the eye diagram characterization parameter cannot be achieved to be not less than the preset value by continuing to adjust the register value of the first register, then adjust the register value of the third register according to the received fourth instruction signal, thereby changing the modulation signal output by the driver chip, thereby adjusting the modulation signal quality loaded by the driver chip on the laser chip, and optimizing the output eye diagram quality of the laser chip until the eye diagram characterization parameter is not less than the preset value. In the present application, the MCU adjusts the output of the laser signal and optimizes the output eye diagram quality of the laser chip by adjusting the output of the first power chip, the second power chip, or the driver chip according to the received instruction signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0019] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0020] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0021] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0022] Figure 4 is an exploded view of an optical module according to some embodiments;

[0023] Figure 5 is a diagram of the internal structure of an optical module according to some embodiments;

[0024] Figure 6 is a structural diagram of a first register according to some embodiments;

[0025] Figure 7 is a structural diagram of a second register according to some embodiments;

[0026] Figure 8 is a structural diagram of a fourth register according to some embodiments;

[0027] Fig. 9 is a structural diagram of a third register according to some embodiments;

[0028] Fig.10 The present invention is a flow chart of a laser chip eye diagram debugging method according to some embodiments. DETAILED DESCRIPTION

[0029] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0030] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0031] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0032] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0033] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0034] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0035] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0036] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0037] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0038] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0039] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0040] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0041] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0042] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0043] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the opening 204 and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0044] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the light emitting component 400 and the light receiving component 500, etc., it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0045] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0046] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0047] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0048] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting amplifier), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

[0049] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0050] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0051] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0052] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0053] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0054] In some embodiments, the light emitting component 400 includes a laser chip 401. Exemplarily, the laser chip 401 is an EML laser. The EML laser integrates a light emitting region and an electro-absorption modulation region, wherein the light emitting region includes a DFB laser, and the electro-absorption modulation region includes an electro-absorption modulator. When a suitable bias current passes through the light emitting region in the forward direction, a portion of the light emitted by the light emitting region enters the electro-absorption modulation region, and when a suitable bias voltage passes through the electro-absorption modulation region in the reverse direction, the electro-absorption modulation region modulates the light emitted by the light emitting region under the action of the bias voltage to obtain an optical signal carrying data.

[0055] In some embodiments, an NRZ electrical signal is input from an electrical interface unit, and after pre-processing and PAM4 modulation by a DSP processor, a PAM4 modulated electrical signal is output and loaded onto a driver chip. The driver chip transmits the PAM4 modulated electrical signal to an EML laser, and the electro-absorption modulation area of ​​the EML laser loads the PAM4 modulated electrical signal onto the light emitted by the light-emitting area, thereby obtaining an optical signal carrying data.

[0056] In some embodiments of the present application, in order to ensure that the EML laser meets the strict protocol requirements of telecommunication-grade signal transmission, it is necessary to control the EML laser to have a good eye diagram quality.

[0057] To this end, the optical module adjusts the output of different electrical components and optimizes the eye diagram quality by responding to different command signals received at different stages; illustratively, when debugging the output eye diagram of the laser chip, the output eye diagram is first roughly debugged by adjusting the first electrical signal and the second electrical signal so that the output optical power reaches a preset range, and then the output eye diagram is finely modulated by continuing to adjust the first electrical signal or adjusting the output of the driver chip to optimize the output eye diagram quality.

[0058] Figure 5 FIG. 1 is a diagram showing the internal structure of an optical module according to some embodiments. Figure 5 As shown, a MCU 302 , a driver chip 303 , a first power chip 304 and a second power chip 305 are respectively disposed on the surface of the circuit board 300 .

[0059] In some embodiments, the first electrical signal is provided to the laser chip through the first power chip 304. Exemplarily, the first electrical signal may be a bias voltage or a bias current. When the first electrical signal is a bias voltage, the first power chip 304 provides a bias voltage to the electro-absorption modulation region of the laser chip; when the first electrical signal is a bias current, the first power chip 304 provides a bias current to the light-emitting region of the laser chip.

[0060] Exemplarily, the first power chip 304 has a built-in first register. When a corresponding register value is written into the first register, the first power chip 304 outputs a first electrical signal accordingly. When the first power chip 304 provides a bias voltage to the laser chip, the output of the first power chip 304 is adjusted by rewriting and adjusting the register value in the first register, so that the first power chip 304 provides different bias voltages to the laser chip. When the first power chip 304 provides a bias current to the laser chip, the output of the first power chip 304 is adjusted by rewriting and adjusting the register value in the first register, so that the first power chip 304 provides different bias currents to the laser chip.

[0061] In some embodiments, a second electrical signal is provided to the laser chip through the second power chip 305. Exemplarily, the second electrical signal and the first electrical signal are different types of electrical signals. When the first electrical signal is a bias voltage, the second electrical signal is a bias current; when the first electrical signal is a bias current, the second electrical signal is a bias voltage. When the second electrical signal is a bias current, the second power chip 305 provides a bias current to the light-emitting area; when the second electrical signal is a bias voltage, the second power chip 305 provides a bias voltage to the light-emitting area.

[0062] Exemplarily, the second power chip 305 has a built-in second register. When a corresponding register value is written into the second register, the second power chip 305 outputs a second electrical signal accordingly. When the second power chip 305 provides a bias current to the laser chip, the output of the second power chip 305 is adjusted by rewriting or adjusting the register value in the second register, so that the second power chip 305 provides different bias currents to the laser chip. When the second power chip 305 provides a bias voltage to the laser chip, the output of the second power chip 305 is adjusted by rewriting or adjusting the register value in the second register, so that the second power chip 305 provides different bias voltages to the laser chip.

[0063] The following embodiments are illustrative by taking the example that the first power chip 304 provides a bias voltage to the laser chip, that is, the first electrical signal is the bias voltage; and the second power chip 305 provides a bias current to the laser, that is, the second electrical signal is the bias current.

[0064] In some embodiments, the second power chip 305 is integrated in the driver chip 303 , and then the driver chip 303 provides a bias current to the laser chip, and the first power chip 304 provides a bias voltage to the laser chip.

[0065] In some embodiments of the present application, when debugging the EML laser eye diagram, a waveform curve of different signal amplitudes changing over time can be observed through an oscilloscope. The information processing device electrically connected to the oscilloscope is called a debugging host computer. The debugging host computer can send a command signal to the optical module. After the optical module receives the command signal, it responds to the command signal to adjust the input to the EML laser, and then adjusts the output of the EML laser to optimize the output eye diagram quality of the laser chip.

[0066] In some embodiments, the output eye diagram is roughly debugged by adjusting the first electrical signal and the second electrical signal so that the output optical power reaches a preset range, including: the debugging host computer sends a first command signal, and the first command signal indicates that the bias voltage output by the first power chip 304 is fixed and maintained, and the bias current output by the second power chip 305 is adjusted, so that the output optical power is within the first preset range. The MCU302 in the optical module responds to the first command signal, fixes the bias voltage output by the first power chip 304, and adjusts the bias current output by the second power chip 305. Exemplarily, the MCU302 fixes the register value of the first register according to the first command signal, and then fixes the bias voltage output by the first power chip 304.

[0067] The present application selects the output optical power as a reference indicator for output eye diagram debugging, which can not only ensure the output optical power, but also makes it convenient to monitor the output optical power when the output optical power is used as a reference indicator, making the rough debugging process of the output eye diagram more concise.

[0068] Exemplarily, fixing the bias voltage output by the first power chip 304 includes: fixing the bias voltage output by the first power chip 304 at 0V by writing a register value to the first register; or fixing the bias voltage output by the first power chip 304 at a non-0 voltage by writing a register value to the first register. Since both the bias current and the bias voltage affect the output optical power, when debugging the bias current, the output bias voltage is kept unchanged. At this time, the output optical power is affected by the bias current, which is an influencing factor, thereby ensuring that the debugged bias current has a higher accuracy.

[0069] Figure 6 FIG. 4 is a structural diagram of a first register according to some embodiments. Figure 6 As shown, illustratively, MCU302 fixes the register value of the first register according to the first instruction signal, and adjusts the register value of the second register from the fourth register value to the fifth register value, and adjusts the bias current output by the second power chip 305 so that the output optical power is within the first preset range. The first preset range is related to the target output optical power. Exemplarily, the first preset range can ensure that the current output optical power is the maximum optical power. When the current output optical power is within the first preset range, it can be considered that the bias current output by the second power chip 305 is a more suitable bias current. It can be understood that the process of adjusting the register value of the second register from the fourth register value to the fifth register value includes not only one adjustment, but may include multiple adjustments. By adjusting the register value of the second register, the bias current output by the second power chip 305 is changed, thereby adjusting the output of the EML laser and changing the quality of its output eye diagram until the output optical power is within the first preset range. At this time, the eye diagram characterization parameters of the output eye diagram may meet the preset requirements, that is, the eye diagram output at this time may be debugged to obtain a better eye diagram. Of course, it is also possible that the eye diagram output at this time is not a better eye diagram.

[0070] In some embodiments, the debugging host computer sends a second command signal, and through the second command signal, instructs to maintain the output of the second power chip 305, and adjust the output of the first power chip 304, so that the optical power is within the second preset range. In response to the second command signal, the MCU302 fixes the bias current output by the second power chip 305 and adjusts the bias voltage output by the first power chip 304. Exemplarily, the MCU302 fixes the register value of the second register according to the second command signal, and then fixes the bias current output by the second power chip 305.

[0071] Exemplarily, the bias voltage output by the second power chip 305 is fixed and maintained, including: maintaining the register value in the second register to maintain the fifth register value unchanged. As mentioned above, both the bias current and the bias voltage affect the output optical power. Therefore, when debugging the bias voltage, the output of the bias current is maintained unchanged. At this time, the output optical power is affected by the bias voltage, which can ensure that the debugged bias voltage has a higher accuracy.

[0072] Figure 7 FIG. 4 is a structural diagram of a second register according to some embodiments. Figure 7 As shown, illustratively, MCU302 fixes the register value of the second register according to the second instruction signal, and adjusts the register value of the first register from the first register value to the second register value, and adjusts the bias voltage output by the first power chip 304 so that the output optical power is within the second preset range. The second preset range is related to the target output optical power. When the current output optical power is within the second preset range, it can be considered that the bias voltage output by the first power chip 304 is a more suitable bias voltage. It can be understood that the process of adjusting the register value of the first register from the first register value to the second register value includes not only one adjustment, but may include multiple adjustments. By adjusting the register value of the first register, the bias current output by the first power chip 304 is changed, thereby adjusting the output of the EML laser, changing the quality of its output eye diagram, until the output optical power is within the second preset range, at this time, the eye diagram characterization parameters of the output eye diagram may meet the preset requirements, that is, the output eye diagram at this time may be debugged to obtain a better eye diagram, of course, it is also possible that the output eye diagram at this time is not a better eye diagram.

[0073] In the above embodiment, MCU302 debugs the bias current according to the first instruction signal, and then debugs the bias voltage according to the second instruction signal. In some embodiments, MCU302 may also debug the bias voltage according to the first instruction signal, and then debug the bias current according to the second instruction signal. Exemplarily, MCU302 debugs the bias current according to the first instruction signal, and then debugs the bias voltage according to the second instruction signal. This is because the bias voltage has a smaller effect on the output optical power than the bias current. After the bias current is debugged according to the first instruction signal, the output optical power can be quickly made within the first preset range. The first preset range can ensure that the output optical power is the maximum output optical power. Then, when the bias voltage is debugged according to the second instruction signal, the bias voltage has a smaller effect on the output optical power than the bias current. At this time, the effect of debugging the bias voltage on the output optical power is smaller, ensuring a higher output optical power. Therefore, in some embodiments, MCU302 debugs the bias current according to the first instruction signal, and then debugs the bias voltage according to the second instruction signal.

[0074] In some embodiments, the bias voltage is adjusted to a fixed value V0 according to the first command signal, and the bias current is adjusted so that the output optical power satisfies the output optical power P0 under the condition of the error value Q1. Exemplarily, the output optical power P0 under the condition of the error value Q1 is in the first preset range. The bias voltage is adjusted according to the second command signal so that the target output optical power P under the condition of the error value Q1 is P0-△P. Exemplarily, the target output optical power P satisfies the second preset range. The range where the output optical power P0 is located is the above-mentioned first preset range, and the range where the target output optical power P is located is the above-mentioned second preset range. Both the first preset range and the second preset range are related to the target output optical power. The positive or negative value of the difference △P between the first preset range and the second preset range depends on the relative size relationship between the fixed value V0 and the bias voltage adjusted according to the second command signal.

[0075] When the fixed value V0 is 0V, it means that the current bias voltage is 0V, and the bias voltage applied to the electro-absorption modulator is 0, so the electro-absorption effect of the electro-absorption modulator is relatively weak, and the light incident on the electro-absorption modulator will not be absorbed, so the output optical power is the largest at this time. When the bias voltage is debugged according to the second instruction signal, the bias voltage is increased on the basis of the fixed value V0, the electro-absorption effect of the electro-absorption modulator is enhanced, and part of the light incident on the electro-absorption modulator is absorbed, and the output optical power is reduced. At this time, the second preset range is smaller than the first preset range, △P is positive, and the difference △P between the first preset range and the second preset range depends on the performance of the EML laser. Exemplarily, the appropriate output optical power P0 can be determined based on the target output optical power P and △P.

[0076] When the fixed value V0 is a value greater than 0, it means that there is a bias voltage currently applied to the electro-absorption modulator, and the electro-absorption modulator has a certain electro-absorption effect. When the bias voltage is modulated according to the second command signal, if the bias voltage is increased on the basis of the fixed value V0, the electro-absorption effect of the electro-absorption modulator is stronger, and the output optical power is reduced at this time. In this case, the second preset range is smaller than the first preset range, and △P is positive. When the bias voltage is modulated according to the second command signal, if the bias voltage is reduced on the basis of the fixed value V0, the electro-absorption effect of the electro-absorption modulator is weakened. At this time, the output optical power increases relative to the output optical power at the fixed value V0. In this case, the second preset range is larger than the first preset range, and △P is negative.

[0077] In some embodiments of the present application, the eye diagram output quality is characterized by an eye diagram characterization parameter. Exemplarily, the eye diagram characterization parameter may be a level interval misalignment degree, or may be a signal transmission dispersion eye closure degree.

[0078] The PAM4 modulated electrical signal has four voltage levels, and each amplitude level corresponds to the logical bit values ​​"00", "01", "10" and "11". When the eye diagram characterization parameter is the level interval misalignment, the level interval misalignment can be used to characterize the difference in optical power between the four levels, thereby characterizing the output eye diagram quality. The physical meaning of the level interval misalignment is the maximum deviation of the optical power when the four levels are compared with the ideal level.

[0079] In some embodiments of the present application, the MCU302 fixes the register value of the first register according to the first instruction signal, adjusts the register value of the second register from the fourth register value to the fifth register value, and adjusts the bias current output by the second power chip 305 so that the output optical power is within the first preset range. The MCU302 fixes the register value of the second register according to the second instruction signal, adjusts the register value of the first register from the first register value to the second register value, and adjusts the bias voltage output by the first power chip 304 so that the output optical power is within the second preset range. At this time, the debugging host computer monitors the output eye diagram characterization parameters, for example, such as the level interval misalignment, when the level interval misalignment is greater than the preset value, for example, the preset value is 0.95, it means that the output eye diagram quality meets the preset requirements, and the debugging can be ended. Then the debugging host computer sends a command signal to instruct MCU302 to store the current fifth register value and the current second register value. Therefore, when MCU302 receives the command signal, it stores the fifth register value and the second register value in the register within MCU302. In order to distinguish from the first register and the second register, the register within MCU302 is described as the fourth register. For example, the fifth register value and the second register value are stored in the fourth register. It can be understood that the eye diagram characterization parameters, for example, when the level interval misalignment reaches the preset requirements, the debugging can be ended, including: other indicators required by the protocol in addition to the level interval misalignment parameter also meet the protocol requirements. Figure 8 FIG. 4 is a structural diagram of a fourth register according to some embodiments. Figure 8 As shown, when the MCU 302 receives the instruction signal, the fifth register value and the second register value are stored in the fourth register.

[0080] In some embodiments of the present application, the output eye diagram is finely modulated by continuing to adjust the first electrical signal or adjusting the output of the driver chip, including: when the debugging host computer monitors the eye diagram characterization parameter, for example, when the level interval misalignment is less than the preset value, a third instruction signal is sent to MCU302 to indicate to adjust the register value of the first register, adjust the output of the first power chip 304, and then adjust the output of the EML laser, optimize the eye diagram output quality, and make the level interval misalignment not less than the preset value. MCU302 responds to the third instruction signal, changes the register value of the first register, adjusts the bias voltage output by the first power chip 304, and then optimizes the eye diagram output quality. As mentioned above, the bias voltage has a smaller effect on the output optical power than the bias current. Therefore, in the present application, when the eye diagram characterization parameter is less than the preset value, the bias voltage is selected to be adjusted instead of the bias current to minimize the impact on the output optical power.

[0081] In some embodiments, when the MCU 302 adjusts the register value of the first register according to the third instruction, the register value of the second register may be kept unchanged to minimize the impact on the output optical power.

[0082] In some embodiments, the MCU 302 adjusts the register value of the first register from the second register value to the third register value in response to the third instruction signal to adjust the bias voltage output by the first power chip 304 until the level interval misalignment is not less than the preset value. It can be understood that the process of adjusting the register value of the first register from the second register value to the third register value includes not only one adjustment, but may include multiple adjustments until the level interval misalignment is not less than the preset value, thereby optimizing the output quality of the eye diagram.

[0083] In some embodiments, when the bias voltage output by the first power chip 304 is adjusted according to the third command signal, when the register value of the first register is adjusted from the second register value to the third register value, if the level interval misalignment is greater than the preset value, it means that the output eye diagram quality meets the preset requirements, then the debugging host computer sends a command signal to instruct MCU302 to store the current fifth register value and the current third register value. Therefore, when MCU302 receives the command signal, it stores the fifth register value and the third register value in the fourth register in MCU302.

[0084] In some embodiments of the present application, the output eye diagram is finely modulated by continuing to adjust the first electrical signal or adjusting the output of the driver chip, and also includes: when the bias voltage output by the first power chip 304 is adjusted according to the third instruction signal, when the register value of the first register is adjusted from the second register value to the third register value, if the level interval misalignment is greater than the preset value, the debugging host computer sends a fourth instruction signal to indicate that the eye diagram characterization parameter cannot be achieved to be not less than the preset value by adjusting the register value of the first register, and the MCU302 needs to be instructed to adjust the output of the driver chip 303.

[0085] Exemplarily, a register is provided in the driver chip 303. To distinguish it from the first register of the first power chip 304, the second register of the second power chip 305, and the fourth register of the MCU 302, the register in the driver chip 303 is referred to as the third register. The fourth instruction signal is used to instruct the MCU 302 to adjust the output of the driver chip 303. Exemplarily, the MCU 302 adjusts the output of the driver chip 303 by adjusting the register value in the third register. Therefore, the MCU 302 adjusts the register value of the third register in response to the fourth instruction signal to change the modulation signal output by the driver chip 303, so that the eye diagram characterization parameter is not less than the preset value. The driver chip 303 outputs the PAM4 modulated electrical signal to the EML laser. When the register value of the third register is adjusted, the output performance of the driver chip 303 is changed, thereby changing the modulation signal output by the driver chip 303, such as changing the amplitude of the modulation signal output by the driver chip 303, so that the quality of the modulated electrical signal loaded on the EML laser also changes, and the EML output eye diagram is optimized.

[0086] Fig. 9 FIG. 4 is a structural diagram of a third register according to some embodiments. Fig. 9 As shown, in some embodiments, the third registers built into the driver chip 303 include:

[0087] The first storage area is used to store the pre-emphasis parameters output by the driver chip 303. The MCU 302 adjusts the pre-emphasis parameters output by the driver chip 303 by changing the register value in the first storage area.

[0088] The second storage area is used to store the de-emphasis parameters output by the driver chip 303. The MCU 302 adjusts the de-emphasis parameters output by the driver chip 303 by changing the register value in the second storage area.

[0089] The third storage area is used to store the output swing of the driver chip 303. The MCU 302 adjusts the output swing of the driver chip 303 by changing the register value of the third storage area.

[0090] In order to improve the quality of the modulated signal output by the driver chip 303, pre-emphasis or de-emphasis can be used. Among them, pre-emphasis can keep the low-frequency part of the modulated signal unchanged and improve the high-frequency part of the modulated signal; de-emphasis attenuates the low-frequency part of the modulated signal and maintains the high-frequency part of the modulated signal. The purpose of pre-emphasis or de-emphasis is to enhance the energy of the high-frequency part of the modulated signal, so that some channels have excessive attenuation of the high-frequency part. Therefore, pre-emphasis or de-emphasis can improve the quality of the modulated signal output by the driver chip 303.

[0091] By adjusting the pre-emphasis parameter, the de-emphasis parameter or the output swing, the quality of the modulation signal output by the driver chip 303 is improved, so that the output eye diagram of the EML laser can be improved.

[0092] Exemplarily, MCU302 adjusts the register value of the first storage area, the second storage area or the third storage area according to the fourth instruction signal, thereby optimizing the output performance of the driver chip 303 and improving the quality of the modulation signal output by the driver chip 303, so that the output eye diagram of the EML laser can be improved until the eye diagram characterization parameter is not less than the preset value.

[0093] In some embodiments, when the MCU302 adjusts the register value of the first storage area, the second storage area or the third storage area according to the fourth instruction signal, the current register value of the first register and the current register value of the second register are kept unchanged to ensure the output optical power.

[0094] Fig.10 FIG. 1 is a flow chart of a laser chip eye diagram debugging method according to some embodiments. Fig.10 As shown, according to the above embodiment, exemplarily, the EML laser output eye diagram debugging process may include:

[0095] S100: According to the first instruction signal, the bias voltage output by the first power chip 304 is adjusted to a fixed value V0, and the bias current output by the second power chip 305 is adjusted so that the output optical power satisfies the optical power P0 under the condition of the error value Q1;

[0096] S200: According to the second instruction signal, the bias voltage output by the second power chip 305 is debugged so that the output optical power is at the target optical power P=P0-ΔP under the condition of the error value Q1;

[0097] S300: If the level interval misalignment is less than the preset value, continue to modulate the bias voltage output by the second power chip 305 according to the third instruction signal until the level interval misalignment is not less than the preset value and other indicators required by the protocol also meet the protocol requirements;

[0098] S400: Write the current bias current and bias voltage into the register of MCU302;

[0099] S500: If the level interval misalignment cannot be achieved to be not less than the preset value when the bias voltage output by the second power chip 305 is continuously modulated, the output of the driver chip 303 is adjusted according to the fourth instruction signal, and the level interval misalignment is made not less than the preset value, and other indicators required by the protocol also meet the protocol requirements;

[0100] S600: Write the current bias current, bias voltage and adjustment parameters corresponding to the driver chip 303 into the register of the MCU 302 .

[0101] In order to ensure production efficiency, the fixed value V0, the error values ​​Q1, P0, ΔP and the adjustment parameters corresponding to the driver chip 303 can be set in advance through multiple experiments.

[0102] The present application monitors the eye diagram characterization parameters and sends a corresponding command signal to the MCU302. The MCU302 adjusts the output of the EML laser according to the received command signal, thereby improving the quality of the EML laser output optical signal and optimizing the output eye diagram.

[0103] In the optical module provided in the present application, when debugging the output eye diagram of the laser chip, the output eye diagram is firstly roughly debugged by adjusting the first electrical signal and the second electrical signal so that the output optical power reaches a preset range, and then the output eye diagram is finely modulated by continuing to adjust the first electrical signal or adjusting the output of the driver chip. Wherein, the output eye diagram is roughly debugged by adjusting the first electrical signal and the second electrical signal so that the output optical power reaches a preset range, including: the MCU receives a first command signal, keeps the register value in the first register fixed according to the first command signal, and then adjusts the register value of the second register until the output optical power is within the first preset range; the MCU receives a second command signal, keeps the current register value of the second register according to the second command signal, and adjusts the register value of the first register until the output optical power is within the second preset range. The output eye diagram is finely modulated by continuing to adjust the first electrical signal or adjusting the output of the driver chip, including: if the eye diagram characterization parameter is less than the preset value under the current register value of the first register and the register value of the second register, then continue to adjust the register value of the first register according to the received third instruction signal, and adjust the output of the laser chip by adjusting the first electrical signal output by the first power chip, thereby optimizing the output eye diagram quality of the laser chip until the eye diagram characterization parameter is not less than the preset value. If the eye diagram characterization parameter cannot be achieved to be not less than the preset value by continuing to adjust the register value of the first register, then adjust the register value of the third register according to the received fourth instruction signal, thereby changing the modulation signal output by the driver chip, thereby adjusting the modulation signal quality loaded by the driver chip on the laser chip, and optimizing the output eye diagram quality of the laser chip.

[0104] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An optical module, characterized in that: include: Circuit boards; A light emitting component, electrically connected to the circuit board, comprising a laser chip; A first power chip is disposed on the surface of the circuit board and is electrically connected to the laser chip, and is used to provide a first electrical signal to the laser chip; the first power chip has a built-in first register; A second power chip, disposed on the surface of the circuit board, electrically connected to the laser chip, and used to provide a second electrical signal to the laser chip; The second power chip has a built-in second register; A driving chip is disposed on the surface of the circuit board and is electrically connected to the laser chip, and is used to provide a third electrical signal to the laser chip, wherein the third electrical signal is a modulation signal; the driving chip has a built-in third register; The MCU is disposed on the surface of the circuit board, and is electrically connected to the first power chip, the second power chip, and the driver chip, respectively, and is configured as follows: According to the first instruction signal, the register value of the first register is fixed, and the register value of the second register is adjusted to adjust the second electrical signal, thereby making the output optical power within a first preset range; According to the second instruction signal, the current register value of the second register is maintained, and the register value of the first register is adjusted to adjust the first electrical signal, thereby making the output optical power within a second preset range; According to a third instruction signal, adjusting the register value of the first register so that the eye diagram characterization parameter is not less than a preset value, wherein the eye diagram characterization parameter is less than the preset value when the third instruction signal is issued; According to the fourth instruction signal, the register value of the third register is adjusted to change the modulation signal output by the driver chip, so that the eye diagram characterization parameter is not less than a preset value, wherein the eye diagram characterization parameter is less than the preset value when the fourth instruction signal is issued, and the eye diagram characterization parameter cannot be achieved by adjusting the register value of the first register.

2. The optical module according to claim 1, characterized in that: The first electrical signal is a bias voltage, and the second electrical signal is a bias current; the MCU is configured as follows: According to the first instruction signal, the bias voltage is fixed, and the register value of the second register is adjusted to adjust the bias current, thereby making the output optical power within the first preset range; According to the second instruction signal, the bias current is maintained, and the register value of the first register is adjusted to adjust the bias voltage, thereby making the output optical power within the second preset range.

3. The optical module according to claim 2, characterized in that: The MCU is configured as: According to the first instruction signal, fixing the register value of the first register, and adjusting the register value of the second register from the fourth register value to the fifth register value, so that the output optical power is within a first preset range; According to the second instruction signal, maintaining the current register value of the second register, and adjusting the register value of the first register from the first register value to the second register value, so that the output optical power is within a second preset range; According to the third instruction signal, the register value of the first register is adjusted from the second register value to the third register value so that the eye diagram characterization parameter is not less than a preset value, wherein the eye diagram characterization parameter is less than the preset value when the third instruction signal is issued.

4. The optical module according to claim 3, characterized in that: The MCU includes a fourth register configured as: According to the first instruction signal, the register value of the first register is fixed, and the register value of the second register is adjusted to adjust the second electrical signal, thereby making the output optical power within a first preset range; According to the second instruction signal, adjust the register value of the first register to adjust the first electrical signal, thereby making the output optical power within a second preset range; If the eye diagram characterization parameter is greater than a preset value, the fifth register value and the second register value are stored in the fourth register.

5. The optical module according to claim 4, characterized in that: The MCU is configured as: According to the first instruction signal, the register value of the first register is fixed, and the register value of the second register is adjusted to adjust the second electrical signal, thereby making the output optical power within a first preset range; According to the second instruction signal, adjust the register value of the first register to adjust the first electrical signal, thereby making the output optical power within a second preset range; According to the third instruction signal, adjusting the register value of the first register from the second register value to the third register value so that the eye diagram characterization parameter is not less than a preset value; If the eye diagram characterization parameter is greater than a preset value, the fifth register value and the third register value are stored in the fourth register.

6. The optical module according to claim 4, characterized in that: The MCU is configured as: According to the first instruction signal, the register value of the first register is fixed, and the register value of the second register is adjusted to adjust the second electrical signal, thereby making the output optical power within a first preset range; According to the second instruction signal, adjust the register value of the first register to adjust the first electrical signal, thereby making the output optical power within a second preset range; According to a third instruction signal, adjusting the register value of the first register so that the eye diagram characterization parameter is not less than a preset value, wherein the eye diagram characterization parameter is less than the preset value when the third instruction signal is issued; According to a fourth instruction signal, adjusting the register value of the third register to change the modulation signal output by the driver chip, so that the eye diagram characterization parameter is not less than a preset value; If the eye diagram characterization parameter is greater than a preset value, the fifth register value, the third register value and the latest register value in the third register are stored in the fourth register.

7. The optical module according to claim 1, characterized in that: The third register includes: A first storage area is used to store the pre-emphasis parameters output by the driver chip; the MCU adjusts the pre-emphasis parameters output by the driver chip by changing the register value of the first storage area; The second storage area is used to store the de-emphasis parameters output by the driver chip; the MCU adjusts the de-emphasis parameters output by the driver chip by changing the register value of the second storage area; The third storage area is used to store the output swing of the driver chip; the MCU adjusts the output swing of the driver chip by changing the register value of the third storage area.

8. The optical module according to claim 1, characterized in that: When the first electrical signal is a bias voltage and the second electrical signal is a bias current, the first power chip provides the bias voltage to the electro-absorption modulation area of ​​the laser chip, and the second power chip provides the bias current to the light-emitting area of ​​the laser chip; When the first electrical signal is a bias current and the second electrical signal is a bias voltage, the first power chip provides the bias current to the light-emitting area, and the second power chip provides the bias voltage to the electro-absorption modulation area.

9. The optical module according to claim 1, characterized in that: The difference between the first preset range and the second preset range is related to the characteristics of the laser chip.

10. The optical module according to claim 1, characterized in that: The eye diagram characterization parameter is the level interval misalignment degree or the signal transmission dispersion eye closure degree.

Images