Heat dissipation system and data center

Abstract

The embodiment of the invention provides a heat dissipation system and a data center. An air cooling branch and a liquid cooling branch are arranged between a primary side liquid supply pipe and a primary side liquid return pipe of the heat dissipation system. The cabinet body of the cabinet comprises a plurality of interlayers used for placing to-be-cooled equipment. And the conveying pipe and the receiving pipe are communicated with the cooling element in the interlayer and are communicated with the secondary side circulation loop. The air cooling unit is coupled to the air cooling branch, the air outlet side of the air cooling unit can convey cold air to the multiple interlayers, and the air return side of the air cooling unit can receive return air obtained after heat exchange in the multiple interlayers. The heat exchanger is coupled to the liquid cooling branch and the secondary side circulation loop, so that the liquid cooling branch exchanges heat with the secondary side circulation loop. By means of the arrangement, air cooling and liquid cooling can be combined in the cabinet, air cooling is used for cooling low-power devices, liquid cooling is used for cooling high-power devices, the cooling requirement can be met, and energy consumption can be reduced. Meanwhile, heat of the air cooling branch and heat of the liquid cooling branch can be discharged outdoors, and the indoor working environment cannot be affected.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to the field of cabinet heat dissipation technology, and more particularly to a heat dissipation system and a data center. Background Art

[0002] With the development of high-power servers, high power density will also bring greater heat dissipation problems, and traditional air cooling technology has gradually revealed its limitations. Although closed hot and cold air ducts can improve air cooling efficiency, they are expensive, have long heat dissipation paths, and have limited heat dissipation efficiency. In some conventional server cabinets, liquid cooling and cold distribution units (CDUs) may be used to dissipate heat from the cooling equipment, but this method still has problems with heat dissipation and energy efficiency. Summary of the invention

[0003] In the first aspect of the present disclosure, a heat dissipation system is provided. The heat dissipation system comprises: an outdoor heat exchange unit; a primary side liquid supply pipe and a primary side liquid return pipe, which are connected to the outdoor heat exchange unit, and an air cooling branch and a liquid cooling branch are arranged between the primary side liquid supply pipe and the primary side liquid return pipe; a cabinet, comprising: a cabinet body, comprising a plurality of compartments for placing equipment to be cooled; a secondary side circulation loop; and a plurality of delivery pipes and a plurality of receiving pipes, which correspond to the plurality of compartments respectively and are connected to the secondary side circulation loop respectively, the delivery pipes being suitable for delivering the cooling medium in the secondary side circulation loop to the cooling element in the corresponding compartment, and the receiving pipes being suitable for delivering the cooling medium after heat exchange in the corresponding cooling element to the secondary side circulation loop; and an air cooling unit, which is coupled to the air cooling branch and comprises an air outlet side and an air return side, the air outlet side being capable of delivering cold air to the plurality of compartments, and the air return side being capable of receiving the return air after heat exchange in the plurality of compartments; and a heat exchanger, which is coupled to the liquid cooling branch and the secondary side circulation loop, so that the liquid cooling branch exchanges heat with the secondary side circulation loop.

[0004] In a second aspect of the present disclosure, a data center is provided, comprising: a computer room; and the heat dissipation system of the first aspect of the present disclosure, wherein the outdoor heat exchange unit of the heat dissipation system is arranged outside the computer room, and the cabinet of the heat dissipation system is arranged inside the computer room.

[0005] It should be understood that the content described in this content section is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0007] Figure 1A schematic diagram showing a heat dissipation system according to a first embodiment of the present disclosure is shown;

[0008] Figure 2 A schematic diagram showing a cabinet of a heat dissipation system according to a second embodiment of the present disclosure is shown;

[0009] Figure 3 A schematic diagram showing a cabinet of a heat dissipation system according to a third embodiment of the present disclosure is shown;

[0010] Figure 4 A schematic diagram showing a cabinet of a heat dissipation system according to a fourth embodiment of the present disclosure along a horizontal direction is shown;

[0011] Figure 5 A schematic diagram showing a heat dissipation system according to a fifth embodiment of the present disclosure is shown;

[0012] Figure 6 A schematic diagram showing a heat dissipation system according to a sixth embodiment of the present disclosure; and

[0013] Figure 7 A schematic diagram of a data center of the present disclosure is shown.

[0014] Description of reference numerals:

[0015] 100. Cooling system;

[0016] 10. Outdoor heat exchange unit;

[0017] 20. Primary side liquid supply pipe; 21. Primary side liquid return pipe; 23. Air cooling branch; 24. Liquid cooling branch; 25. Bypass branch; 26. First valve; 27. Second valve; 28. Diverter;

[0018] 30. Cabinet; 31. Cabinet body; 310. Interlayer; 32. Secondary circulation loop; 321. Delivery pipe; 322. Receiving pipe; 33. Cooling element; 34. Front air duct; 35. Rear air duct; 36. Inlet and outlet air duct; 37. Circulation pump; 38. Compressor; 39. Throttle valve;

[0019] 40. Air-cooled unit; 41. Fan module; 42. Surface cooler;

[0020] 50. Heat exchanger;

[0021] 60. Radiator;

[0022] 200. Computer room. DETAILED DESCRIPTION

[0023] The preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0024] As used herein, the term "including" and its variations mean open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "based at least in part on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc. may refer to different or the same objects.

[0025] As mentioned above, in some conventional server cabinets, liquid cooling may be combined with a cooling distribution unit (CDU) to dissipate heat from the cooling equipment. However, this approach still has problems with heat dissipation and energy efficiency.

[0026] The embodiments of the present disclosure provide a heat dissipation system and a data center including the heat dissipation system. The heat dissipation system includes an outdoor heat exchange unit, a cabinet, an air cooling unit, a heat exchanger, a primary side liquid supply pipe and a primary side liquid return pipe. An air cooling branch and a liquid cooling branch are arranged between the primary side liquid supply pipe and the primary side liquid return pipe. The air cooling branch can provide cold air to multiple compartments in the cabinet. The liquid cooling branch can exchange heat with the equipment to be cooled in the compartment through a cooling element. The combination of air cooling and liquid cooling can not only meet the heat dissipation requirements, but also improve the heat exchange efficiency. At the same time, the heat of the air cooling branch and the liquid cooling branch can be discharged to the outdoors through the outdoor heat exchange unit, without affecting the indoor ambient temperature.

[0027] The following will be combined Figures 1 to 6 To describe the principles of the present disclosure in detail, Figure 1 The structure of the heat dissipation system 100 according to the first embodiment of the present disclosure is shown. Figure 2 The structure of the heat dissipation system 100 according to the second embodiment of the present disclosure is shown. Figure 3 The structure of the heat dissipation system 100 according to the third embodiment of the present disclosure is shown. Figure 4 The structure of the heat dissipation system 100 according to the fourth embodiment of the present disclosure is shown. Figure 5 The structure of the heat dissipation system 100 according to the fifth embodiment of the present disclosure is shown. Figure 6 The structure of the heat dissipation system 100 of the sixth embodiment of the present disclosure is shown. Figure 1 The principle of the heat dissipation system 100 according to the first embodiment of the present disclosure will be described in detail.

[0028] like Figure 1 As shown, the heat dissipation system 100 includes an outdoor heat exchange unit 10 , a cabinet 30 , an air cooling unit 40 , a heat exchanger 50 , a primary side liquid supply pipe 20 and a primary side liquid return pipe 21 .

[0029] The outdoor heat exchange unit 10 can release the heat of the cooling medium in the primary side liquid return pipe 21 to the external environment, and can adjust the temperature in the physical space (for example, the machine room), thereby providing a comfortable working environment.

[0030] As an example, Figure 1 As shown, the outdoor heat exchange unit 10 can be a cooling tower, which can use water evaporation to reduce the temperature of the cooling medium. Hot water from the machine room is pumped to the top of the cooling tower. The hot water is evenly distributed on the filler through the nozzle to form fine water droplets, thereby increasing the surface area of ​​water in contact with the air. The air comes into contact with the water droplets when passing through the filler. Natural ventilation cooling towers rely on wind power, while mechanical ventilation cooling towers use fans to force air flow. When part of the water evaporates, it takes away a lot of heat, which can cool the remaining water. The cooled water flows into the water collection tray at the bottom and is then pumped back to the cooling system in the machine room for recycling.

[0031] It should be understood that the outdoor heat exchange unit 10 can be any structure that can exchange heat with the cooling medium, and can be selected according to specific needs, space limitations and efficiency requirements, and the present disclosure is not intended to be limited to this.

[0032] The primary side liquid supply pipe 20 and the primary side liquid return pipe 21 are connected to the outdoor heat exchange unit 10. The primary side liquid supply pipe 20 is used to transport the cooling medium after cooling by the outdoor heat exchange unit 10 to the indoor heat exchange unit, so as to perform heat exchange at the heat exchange unit. The primary side liquid return pipe 21 is used to transport the high-temperature cooling medium after heat exchange to the outdoor heat exchange unit 10, so as to perform heat exchange at the outdoor heat exchange unit 10.

[0033] like Figure 1 As shown, the heat dissipation system 100 further includes two flow dividers 28, which are respectively mounted on the primary side liquid supply pipe 20 and the primary side liquid return pipe 21, and an air cooling branch 23 and a liquid cooling branch 24 are arranged between the two flow dividers 28. In this way, the cooling medium between the primary side liquid supply pipe 20 and the primary side liquid return pipe 21 can be divided into two paths, flowing in the air cooling branch 23 and the liquid cooling branch 24 respectively, and heat can be exchanged at the air cooling branch 23 and the liquid cooling branch 24.

[0034] As an example, pipeline connectors, such as "T"-shaped connectors or "L"-shaped connectors, can be provided on the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21, so that an air-cooling branch 23 and a liquid-cooling branch 24 can be provided between the primary-side liquid supply pipe 20 and the primary-side liquid return pipe 21 through the pipeline connectors.

[0035] As another example, the primary side liquid supply pipe 20 and the primary side liquid return pipe 21 are both two-way, one of the two ways is connected to the air cooling branch 23, and the other of the two ways is connected to the liquid cooling branch 24. In other embodiments, a refrigerator can also be provided in the branch to adjust the temperature of the cooling medium in the air cooling branch 23 and the liquid cooling branch 24.

[0036] In some embodiments, the number of the air cooling branch 23 and the number of the liquid cooling branch 24 can both be one. In other embodiments, the number of the air cooling branch 23 and the liquid cooling branch 24 can be set as needed, and the present disclosure is not intended to limit this.

[0037] like Figure 1 As shown, the cabinet 30 is widely used in data centers, telecommunication facilities and other high-density electronic equipment. It can not only physically protect sensitive equipment, but also include thermal management components to ensure that the equipment to be cooled operates at an optimal temperature. In an embodiment of the present disclosure, the cabinet 30 includes a cabinet body 31, a secondary side circulation loop 32, a plurality of delivery pipes 321 and a plurality of receiving pipes 322.

[0038] The cabinet 31 is the core area of ​​the cabinet 30. The cabinet 31 is provided with a plurality of compartments 310, and the compartments 310 can be used to place the equipment to be cooled, such as servers, storage units, network equipment, etc. The shape and size of the compartments 310 need to take into account the size of the equipment to be cooled, the heat dissipation requirements, and the convenience of wiring. At the same time, the equipment to be cooled set in the compartments 310 will generate heat when working, so a cooling element 33 can be integrated in each equipment to be cooled.

[0039] As an example, a plurality of partitions are provided in the cabinet 31. There is a preset distance between the plurality of partitions, so that a plurality of compartments 310 are separated in the cabinet 310 by the plurality of partitions. When in use, IT equipment such as servers are placed on the partitions, and the electronic equipment is supported by the partitions.

[0040] As another example, multiple guide rails are respectively provided on the inner walls on both sides of the cabinet 31, and the multiple guide rails on both sides are arranged correspondingly. A slide seat that can cooperate with the guide rails is provided on the housing of the electronic device. The electronic device can be installed in the cabinet 31 or pulled out from the cabinet 31 by pulling. In this way, multiple compartments 310 can be separated in the cabinet 31 by adjusting the arrangement positions and arrangement spacings of the multiple guide rails.

[0041] like Figure 1As shown, a plurality of delivery pipes 321 and a plurality of receiving pipes 322 are provided in the cabinet 30, and the plurality of delivery pipes 321 and the plurality of receiving pipes 322 are respectively connected to the secondary circulation loop 32. Each interlayer 310 corresponds to at least one delivery pipe 321 and at least one receiving pipe 322. The delivery pipe 321 is used to deliver the cooling medium in the secondary circulation loop 32 to the cooling element 33 in the corresponding interlayer 310. The receiving pipe 322 is used to deliver the cooling medium after heat exchange in the corresponding cooling element 33 to the secondary circulation loop 32.

[0042] As an example, the delivery pipe 321 and the receiving pipe 322 both include quick-connect fittings. A quick-connect interface is provided on each cooling element 33 of the device to be cooled, and the quick-connect fitting is connected to the quick-connect interface, thereby achieving connection between the delivery pipe 321 and the receiving pipe 322 and the cooling element 33.

[0043] With this arrangement, the heat generated by the device to be cooled during operation is transferred to the cooling medium in the cooling element 33. The secondary circulation loop 32 is a closed liquid pipeline that can transport the cooling medium after heat exchange in the multiple cooling elements 33 to the heat exchanger 50, and transport the cooled cooling medium to the multiple cooling elements 33 again.

[0044] As an example, Figure 1 As shown, the cooling element 33 may be a cold plate. The cold plate can protect the device to be cooled in the insulation layer 310 from overheating and damage, and has high cooling efficiency.

[0045] like Figure 1 As shown, the heat exchanger 50 is coupled to the liquid cooling branch 24 and the secondary circulation loop 32, and the liquid cooling branch 24 can exchange heat with the secondary circulation loop 32 through the heat exchanger 50. In this way, the heat generated when the device to be cooled is working can be transferred to the cooling medium in the secondary circulation loop 32 through the cold plate, and the heat in the secondary circulation loop 32 can be transferred to the liquid cooling branch 24 through the heat exchanger 50. When the outdoor heat exchange unit 10 is running, the heat in the liquid cooling branch 24 can be released to the outdoor environment along with the cooling medium.

[0046] like Figure 1 As shown, the heat dissipation system 100 further includes an air cooling unit 40. The air cooling unit 40 is coupled to the air cooling branch 23. The air cooling unit 40 includes an air outlet side and an air supply side. The air outlet side of the air cooling unit 40 can deliver cold air to the multiple interlayers 310, and the return air side of the air cooling unit 40 can receive the return air after heat exchange in the multiple interlayers 310.

[0047] As an example, Figure 1As shown, the air-cooled unit 40 includes a fan module 41 and a cooler 42. The outer shell of the cooler 42 can be made of corrosion-resistant materials (such as stainless steel or carbon steel) to protect the internal components. There are inlet and outlet pipes on the outer shell of the cooler 42, which are used to connect to the air-cooled branch 23. The cooler 42 has a tube bundle, which can be composed of a plurality of copper tubes or steel tubes arranged in parallel. After the cooling medium in the air-cooled branch 23 flows into the tube bundle, the cooling medium in contact with the tube wall is cooled. Fins can be provided on the outer surface of the tube bundle, and the fins can increase the heat exchange area of ​​the tube bundle, thereby improving the heat exchange efficiency. The fan module 41 is arranged on one side of the cooler 42, which can drive air to flow through the cooler 42, thereby accelerating the heat exchange between the air and the cooling medium in the tube bundle.

[0048] With this arrangement, the air cooling branch 23 between the primary side liquid supply pipe 20 and the primary side liquid return pipe 21 can provide cold air to the multiple compartments 310 of the cabinet 30, and the liquid cooling branch 24 can exchange heat with the device to be cooled through the secondary side circulation loop 32 and the cooling element 33. The air cooling unit 40 can be used to cool low power density electronic components, such as small servers, network equipment, etc. The fan module 41 drives the cold air to flow through the low power devices, thereby taking away the heat generated by the low power devices. The liquid cooling branch 24 can cool high power density devices, such as high performance computing nodes, graphics processors (GPUs), large storage arrays, etc.

[0049] In this way, air cooling and liquid cooling can be combined in the cabinet 30, air cooling is used to process low-power electronic devices, and liquid cooling is used to cool high-power electronic devices, thereby ensuring that energy consumption is reduced as much as possible while meeting cooling requirements. At the same time, the heat of the air cooling branch 23 and the liquid cooling branch 24 can be discharged to the outside of the computer room through the outdoor heat exchange unit 10, without affecting the ambient temperature in the computer room.

[0050] In some embodiments, Figure 1 As shown, a plurality of air ducts may be provided in the cabinet 30 , and the plurality of air ducts are used to transport cold air into the plurality of compartments 310 , and receive return air after heat exchange in the plurality of compartments 310 .

[0051] like Figure 1As shown, a front air duct 34, a rear air duct 35 and an inlet and outlet air duct 36 are provided in the cabinet 30. The front air duct 34 is located on a side of the cabinet 30 near the front door, and is used to deliver cold air to the equipment to be cooled inside the cabinet 30. The front air duct 34 is connected to a plurality of compartments 310, so that the cold air can directly reach the equipment to be cooled in each compartment 310, thereby improving the cooling efficiency. The rear air duct 35 is located on a side of the cabinet 30 near the rear door, and is used to receive hot air exhausted from the plurality of compartments 310. The rear air duct 35 is also connected to each compartment 310, so that the hot air can flow from the surrounding of the equipment to be cooled to the air cooling unit 40.

[0052] like Figure 1 As shown, the inlet and outlet air duct 36 is connected with the front air duct 34 and the rear air duct 35, and can guide the cold air into the multiple interlayers 310 and extract the hot air from the multiple interlayers 310. The inlet and outlet air duct 36 can ensure the isolation of cold air and hot air, avoid air flow short circuit, and improve the cooling efficiency. The air cooling unit 40 is arranged in the inlet and outlet air duct 36, and can deliver cold air to the multiple interlayers 310 through the front air duct 34 and receive the return air after heat exchange in the multiple interlayers 310 through the rear air duct 35.

[0053] With this arrangement, the hot air in the multiple compartments 310 is cooled by the air cooling unit 40, and then sent to the front air duct 34 through the inlet and outlet air ducts 36, and then distributed to each compartment 310 from the front air duct 34 to provide cooling for the equipment. The hot air generated by the equipment during operation is collected through the rear air duct 35, and finally returned to the air cooling unit 40 through the inlet and outlet air ducts 36. The hot air exchanges heat with the surface cooler 42 of the air cooling unit 40 to prepare for the next cycle.

[0054] In some embodiments, Figure 1 As shown, the inlet and outlet air duct 36 can be arranged at the top of the cabinet 31. In this way, the hot air generated by the cooling equipment during operation flows upward through the rear air duct 35 to the inlet and outlet air duct 36, the hot air exchanges heat with the surface cooler 42 of the air cooling unit 40 for cooling, and the cold air flows downward along the front air duct 34 and is distributed to the multiple compartments 310.

[0055] It should be understood that, in other embodiments, the air inlet and outlet duct 36 may also be disposed at the bottom of the cabinet 31 or at any other appropriate position.

[0056] In some embodiments, Figure 1 As shown, the heat exchanger 50 can be arranged in the air inlet and outlet duct 36. In this way, the use of the space in the cabinet 30 can be optimized and the equipment installation cost can be reduced.

[0057] In some embodiments, a flow valve may be provided on the air cooling branch 23. During the operation of the heat dissipation system 100, if the heat generated by the low-power device and the heat generated by the high-power device change, the flow ratio of the cooling medium in the air cooling branch 23 and the liquid cooling branch 24 may be adjusted by adjusting the opening of the flow valve, thereby meeting the cooling requirements of the equipment to be cooled in the cabinet 30 under different conditions.

[0058] In some alternative embodiments, a flow valve may also be provided on the liquid cooling branch 24 to adjust the flow of the coolant in the liquid cooling branch 24 .

[0059] In other embodiments, the flow resistance ratio of the air cooling branch 23 and the liquid cooling branch 24 is a preset value, so as to adjust the flow ratio of the cooling medium in the air cooling branch 23 and the liquid cooling branch 24. It should be understood that the flow distribution in the air cooling branch 23 and the liquid cooling branch 24 can also be achieved by other methods, and the present disclosure is not intended to be limited to this.

[0060] In some embodiments, Figure 1 As shown, the cooling element 33 of the heat dissipation system 100 may include a cold plate, and the heat exchanger 50 may include a plate heat exchanger. The secondary circulation loop 32 may be filled with a single-phase cooling medium, such as deionized water, PG / EG aqueous solution, etc.

[0061] like Figure 1 As shown, the heat dissipation system 100 further includes a circulation pump 37. The circulation pump 37 is coupled to the secondary circulation loop, and the circulation pump 37 can drive the single-phase cooling medium in the secondary circulation loop 32 to flow. With this arrangement, the liquid cooling branch 24 exchanges heat with the secondary circulation loop 32 through the plate heat exchanger. Driven by the circulation pump 37, the heat generated when the device to be cooled is working can be transferred to the single-phase cooling medium in the secondary circulation loop 32 through the cold plate, and the heat of the cooling medium in the secondary circulation loop 32 can be transferred to the liquid cooling branch 24 through the plate heat exchanger.

[0062] The following will be combined Figure 2 The principle of the heat dissipation system 100 of the second embodiment of the present disclosure is described in detail. The structure and combination of the heat dissipation system 100 of the second embodiment Figure 1 A part of the structure of the first embodiment described is similar. Hereinafter, the difference between them will be mainly described, and the same parts will not be described in detail.

[0063] like Figure 2As shown, the inlet and outlet air ducts 36 can be arranged in the middle of the cabinet 31. With this arrangement, independent circulation air paths can be formed on the upper and lower sides of the inlet and outlet air ducts 36, which helps to evenly distribute cold air within the height range of the cabinet 30, and can ensure that the equipment to be cooled located at the upper and lower parts of the inlet and outlet air ducts 36 obtain a consistent cooling effect to avoid local overheating. Secondly, this arrangement can improve the airflow organization inside the cabinet 30, reduce the mixing of cold and hot air, and thus improve the heat exchange efficiency. The upper and lower equipment can independently receive cold air from the front side, while the back side is used to discharge hot air, reliably separating the cold and hot air. Furthermore, when the inlet and outlet air ducts 36 are arranged in the middle of the cabinet 31, greater flexibility can be provided for the layout of the equipment. For example, it allows electronic devices with different power densities to be installed at different heights of the cabinet 31 without affecting the overall thermal management.

[0064] In some embodiments, Figure 2 As shown, the length of the inlet and outlet air duct 36 is less than half the height of the cabinet 31. With this arrangement, cold air can flow along a predetermined path, directly cool the electronic components, and then be discharged back to the rear air duct 35, reducing the possibility of turbulence and air short circuit. Secondly, the shortening of the length of the inlet and outlet air duct 36 can reduce the friction resistance in the air flow, and the fan module 41 can push the air flow at a lower pressure, thereby reducing energy consumption, while maintaining sufficient air flow speed to ensure effective heat exchange.

[0065] The following will be combined Figure 3 The principle of the heat dissipation system 100 of the third embodiment of the present disclosure is described in detail. The structure and combination of the heat dissipation system 100 of the third embodiment Figure 1 A part of the structure of the first embodiment described is similar. Hereinafter, the difference between them will be mainly described, and the same parts will not be described in detail.

[0066] like Figure 3 As shown, the heat dissipation system 100 further includes a first valve 26, a second valve 27 and a bypass branch 25. The first valve 26 is coupled to the air cooling branch 23 between the air cooling unit 40 and the primary side liquid return pipe 21. The first valve 26 can control the on-off of the air cooling branch 23. One end of the bypass branch 25 is communicated with the air cooling branch 23 between the air cooling unit 40 and the first valve 26. The other end of the bypass branch 25 is communicated with the liquid cooling branch 24 between the heat exchanger 50 and the primary side liquid supply pipe 20. The second valve 27 is coupled to the bypass branch 25. The second valve 27 can control the on-off of the bypass branch 25.

[0067] When the first valve 26 is open and the second valve 27 is closed, the air cooling branch 23 and the liquid cooling branch 24 are arranged in parallel between the primary liquid return pipe 21 and the primary liquid supply pipe 20. The cooling medium after heat exchange in the air cooling branch 23 flows directly to the primary liquid return pipe 21, and then flows to the outdoor heat exchange unit 10 for cooling.

[0068] When the first valve 26 is closed and the second valve 27 is opened, the cooling medium after heat exchange in the air cooling branch 23 flows into the liquid cooling branch 24 .

[0069] With this arrangement, air cooling and liquid cooling are not operated in isolation, and under the control of the first valve 26 and the second valve 27, the two can work together. When the second valve 27 is open, the cooling medium that has exchanged heat in the air cooling branch 23 can flow into the liquid cooling branch 24. The liquid cooling branch 24 is in direct contact with the high-power device and can take away heat more effectively. When the cooling medium in the air cooling branch 23 is introduced into the liquid cooling branch 24 after a heat exchange, this part of the cooling medium undergoes two heat exchange processes in one cycle. The first time is in the air cooling stage, and the second time is in the liquid cooling stage. In this way, more heat can be extracted from the high-power device, thereby improving the heat exchange efficiency of the entire system. Secondly, the burden of the liquid cooling branch 24 directly handling the high-temperature cooling medium is reduced, and the utilization efficiency of cooling resources is improved.

[0070] The following will be combined Figure 4 The principle of the heat dissipation system 100 according to the fourth embodiment of the present disclosure is described in detail. The structure and combination of the heat dissipation system 100 according to the fourth embodiment Figure 1 A part of the structure of the first embodiment described is similar. Hereinafter, the difference between them will be mainly described, and the same parts will not be described in detail.

[0071] like Figure 4 As shown, the heat exchanger 50 of the heat dissipation system 100 is arranged outside the cabinet 30. In this way, the space inside the cabinet 31 can be released, thereby providing installation locations for more devices to be cooled, and improving the equipment density of the server cabinet 30. In addition, the heat exchanger 50 is arranged outside the cabinet 31, which can be conveniently connected to the outdoor heat exchange unit 10 (for example, a cooling tower), thereby improving the installation and maintenance efficiency.

[0072] In some embodiments, Figure 4 As shown, the cabinet 30 further includes a heat dissipation chamber 60. The heat dissipation chamber 60 is disposed on one side of the cabinet body 31, and an inlet and outlet air duct 36 is disposed in the heat dissipation chamber 60. The inlet and outlet air duct 36 is communicated with the front air duct 34 and the rear air duct 35, and heat exchange can be performed through air flow.

[0073] like Figure 4As shown, the heat dissipation cabin 60 can be arranged on the left or right side of the cabinet 31. The space inside the heat dissipation cabin 60 can form an inlet and outlet air duct 36. The inlet and outlet air duct 36 is connected with the front side air duct 34 and the rear side air duct 35, and can guide cold air into the multiple interlayers 310 and extract hot air from the multiple interlayers 310. The inlet and outlet air duct 36 can ensure the isolation of cold air and hot air, avoid air flow short circuit, and improve the cooling efficiency. The air cooling unit 40 is arranged in the inlet and outlet air duct 36, and can deliver cold air to the multiple interlayers 310 via the front side air duct 34 and receive the return air after heat exchange in the multiple interlayers 310 via the rear side air duct 35.

[0074] With this arrangement, there is no need to reserve additional space inside the cabinet 31 to install the air cooling unit 40 and the heat exchanger 50, which helps to fully utilize the space inside the cabinet 31. When the air cooling unit 40 or the heat exchanger 50 needs to be repaired or replaced, the heat dissipation compartment 60 can be opened without interfering with other devices inside the cabinet 30. Secondly, the air cooling unit 40 and the heat exchanger 50 can be flexibly arranged in the heat dissipation compartment 60, which helps to optimize the airflow path of the heat dissipation system 100.

[0075] The following will be combined Figure 5 The principle of the heat dissipation system 100 according to the fifth embodiment of the present disclosure is described in detail. The structure and combination of the heat dissipation system 100 according to the fifth embodiment Figure 1 A part of the structure of the first embodiment described is similar. Hereinafter, the difference between them will be mainly described, and the same parts will not be described in detail.

[0076] like Figure 5 As shown, the secondary side circulation loop 32 in the cabinet 30 uses the phase change of the two-phase cooling medium to perform heat exchange. The multiple cooling elements 33 arranged in the cabinet 30 may be evaporators, and the heat exchanger 50 may include a condenser. The secondary side circulation loop 32 is filled with a two-phase cooling medium, such as R-134a.

[0077] like Figure 5 As shown, the heat dissipation system 100 further includes a compressor 38 and a throttle valve 39 . The compressor 38 is coupled to the secondary circulation loop 32 between the evaporator and the condenser, and the throttle valve 39 is coupled to the secondary circulation loop 32 between the condenser and the evaporator.

[0078] The evaporator is installed in the compartment 310 of the cabinet 30, and can absorb the heat generated by the high-power devices of the IT equipment. When the two-phase cooling medium (such as R-134a) flows through the evaporator, it changes from liquid to gas, absorbing heat in the process, so that the cooling medium becomes a high-temperature, low-pressure steam. The condenser is located in the cabinet 30, and is used to cool the high-temperature steam flowing out of the evaporator and convert it back to a liquid state. In this process, the cooling medium releases the heat absorbed before, and this part of the heat is transferred to the outdoor heat exchange unit 10 through the liquid cooling branch 24, and then released to the external environment. The compressor 38 is located in the secondary side circulation loop 32, which can increase the pressure and temperature of the cooling medium, so that it changes from high-temperature, low-pressure steam to high-temperature, high-pressure steam, and then is sent to the condenser. The compressor 38 is the power source of the entire refrigeration cycle. The throttle valve 39 is located on the pipeline between the condenser and the evaporator. The throttle valve 39 can reduce the pressure of the cooling medium, so that the cooling medium becomes a low-temperature, low-pressure state before entering the evaporator. When the cooling medium flows through the evaporator again, it can absorb more heat.

[0079] With this arrangement, inside the cabinet 30, when the cooling medium (in a low-temperature and low-pressure state) flows through the evaporator, it can absorb the heat generated by the server and transform it into high-temperature and low-pressure steam. The high-temperature and low-pressure steam is compressed into a high-temperature and high-pressure gas by the compressor 38. The high-temperature and high-pressure gas flows through the condenser, releases heat to the liquid cooling branch 24, and is cooled to become a low-temperature and high-pressure liquid. The low-temperature and high-pressure liquid passes through the throttle valve 39, the pressure is reduced, and it becomes a low-temperature and low-pressure liquid, and enters the evaporator circulation again. In this way, the heat dissipation system 100 can continuously provide cooling for the server to ensure its stable operation.

[0080] The following will be combined Figure 6 The principle of the heat dissipation system 100 of the sixth embodiment of the present disclosure is described in detail. The structure and combination of the heat dissipation system 100 of the sixth embodiment Figure 5 A part of the structure of the fifth embodiment described is similar. Hereinafter, the difference between them will be mainly described, and the same parts will not be repeated.

[0081] like Figure 6 As shown, the secondary circulation loop 32 in the cabinet 30 uses phase change of a two-phase cooling medium to perform heat exchange. The multiple cooling elements 33 provided in the cabinet 30 may be evaporators, and the heat exchanger 50 may include a condenser.

[0082] like Figure 6As shown, the two-phase cooling medium does not need to drive the compressor 38 and adjust the pressure of the throttle valve 39 during the circulation process. A delivery pipe 321 and a receiving pipe 322 are provided between each evaporator and the secondary circulation loop, and the position where the receiving pipe 322 is connected to the evaporator is higher than the position where the delivery pipe 321 is connected to the evaporator, and the position of the condenser is higher than the positions of multiple evaporators.

[0083] The delivery pipe 321 is used to deliver the condensed cooling medium (liquid) to the evaporator. The delivery pipe 321 is connected to the evaporator at a relatively low position to ensure that the liquid cooling medium can flow smoothly into the evaporator. The receiving pipe 322 is used to deliver the steam (gaseous) generated in the evaporator to the condenser. The receiving pipe 322 is connected to the evaporator at a relatively high position, and the steam can naturally rise and enter the condenser through the receiving pipe 322. The position of the condenser is higher than that of multiple evaporators, and the steam can naturally flow from the evaporator to the condenser. In this way, the natural upward trend of the steam and the natural downward trend of the liquid cooling medium can be utilized, so that no additional power device is required to drive the flow of the cooling medium.

[0084] In the evaporator in the interlayer 310, the cooling medium absorbs the heat generated by the high-power devices of the IT equipment, causing the cooling medium to evaporate and turn into steam. In this process, the density of the cooling medium decreases. Since the density of steam is less than that of liquid, the steam naturally rises, while the liquid falls due to gravity. The steam rises along the pipeline to the condenser, and releases heat to the liquid cooling branch 24 at the condenser, and the steam turns back into liquid at the condenser. The condenser is usually placed at a higher position so that the steam can rise naturally.

[0085] With this arrangement, the secondary circulation loop 32 can constitute a self-driven liquid return heat exchange system. The self-driven liquid return heat exchange system uses the phase change characteristics of the cooling medium to transfer heat, which not only has a good heat dissipation effect, but also does not require an external pumping device. There are no moving parts inside the heat exchange system, which reduces the possibility of mechanical failure, while reducing energy consumption and operating noise. In addition, the compact structure of the self-driven liquid return heat exchange system helps save space in the cabinet 30, thereby helping to increase the equipment layout density in the server.

[0086] In some embodiments, the self-driven liquid return heat exchange system can be a loop type gravity heat pipe (LoopThermosyphon) system. In some other embodiments, the self-driven liquid return heat exchange system can be a loop heat pipe (Loop HeatPipe) system. It should be understood that the self-driven liquid return heat exchange system can also be any other achievable manner, and the present disclosure is not intended to be limited thereto.

[0087] In a second aspect of the present disclosure, a data center is provided. Figure 7As shown, the data center includes a computer room 200 and any one of the cooling systems 100 described above, the outdoor heat exchange unit 10 of the cooling system 100 is arranged outside the computer room, and the cabinet 30 of the cooling system 100 is arranged in the computer room 200.

[0088] In a data center, the air cooling branch 23 between the primary side liquid supply pipe 20 and the primary side liquid return pipe 21 of the heat dissipation system 100 can provide cold air to multiple compartments 310 of the cabinet 30, and the liquid cooling branch 24 can exchange heat with the device to be cooled through the secondary side circulation loop 32 and the cooling element 33. The air cooling unit 40 can be used to cool electronic components with low to medium power density, such as small servers, network equipment, etc. The fan module 41 drives the cold air to flow through the equipment, thereby taking away the heat generated by the equipment. The liquid cooling branch 24 can cool high power density devices, such as high-performance computing nodes, graphics processors (GPUs), large storage arrays, etc. The liquid cooling branch 24 can meet the heat dissipation requirements of these electronic devices.

[0089] With this arrangement, air cooling and liquid cooling can be combined in the cabinet 30, with air cooling being used to process lower power devices and liquid cooling being used to cool high power devices, ensuring that energy consumption is minimized while meeting cooling requirements. At the same time, the heat of the air cooling branch 23 and the liquid cooling branch 24 can be discharged to the outside of the machine room through the outdoor heat exchange unit 10, without affecting the indoor ambient temperature.

[0090] In some embodiments, Figure 7 As shown, the number of outdoor heat exchange units 10 can be configured according to the total heating power of the cabinets 30 in the data center. For example, multiple outdoor heat exchange units 10 are connected to multiple cabinets 30 through the primary side liquid supply pipe 20 and the primary side liquid return pipe 21. Here, the primary side liquid supply pipe 20 and the primary side liquid return pipe 21 are used as the main ring network pipeline, and the heat dissipation system 100 can meet the heat dissipation requirements of a large number of cabinets 30 in the data center.

[0091] Embodiments of the present disclosure are also embodied in the following examples.

[0092] Example 1. A heat dissipation system, comprising:

[0093] Outdoor heat exchange unit;

[0094] A primary side liquid supply pipe and a primary side liquid return pipe are connected to the outdoor heat exchange unit, and an air cooling branch and a liquid cooling branch are provided between the primary side liquid supply pipe and the primary side liquid return pipe;

[0095] Cabinet, including:

[0096] a cabinet including a plurality of compartments for placing equipment to be cooled;

[0097] A secondary circulation loop; and

[0098] A plurality of delivery tubes and a plurality of receiving tubes, respectively corresponding to the plurality of partitions, and

[0099] are respectively connected to the secondary circulation loop, the delivery pipe is suitable for delivering the cooling medium in the secondary circulation loop to the corresponding cooling element in the interlayer, and the receiving pipe is suitable for delivering the cooling medium after heat exchange in the corresponding cooling element to the secondary circulation loop; and

[0100] an air cooling unit, coupled to the air cooling branch, and comprising an air outlet side and an air return side, wherein the air outlet side is capable of delivering cold air to the plurality of interlayers, and the air return side is capable of receiving return air after heat exchange in the plurality of interlayers; and

[0101] A heat exchanger is coupled to the liquid cooling branch and the secondary circulation loop so that the liquid cooling branch exchanges heat with the secondary circulation loop.

[0102] Example 2. The heat dissipation system according to Example 1, wherein the cabinet further comprises:

[0103] A front air duct is disposed at the front side of the plurality of partitions and is in communication with the plurality of partitions;

[0104] a rear air duct, disposed at the rear side of the plurality of partitions and communicating with the plurality of partitions; and

[0105] The inlet and outlet air ducts are connected with the front air duct and the rear air duct, and the air cooling unit is arranged in the inlet and outlet air ducts to transport cold air to the multiple interlayers via the front air duct and receive return air after heat exchange in the multiple interlayers via the rear air duct.

[0106] Example 3. A heat dissipation system according to Example 2, wherein the inlet and outlet air ducts are arranged at the top or bottom of the cabinet.

[0107] Example 4. A heat dissipation system according to Example 2, wherein the inlet and outlet air ducts are arranged in the middle of the cabinet to form circulating air paths on the upper and lower sides of the inlet and outlet air ducts respectively.

[0108] Example 5. A cooling system according to Example 3, wherein the length of the inlet and outlet air ducts is less than half the height of the cabinet.

[0109] Example 6. A heat dissipation system according to Example 2, wherein the heat exchanger is disposed in the inlet and outlet air duct.

[0110] Example 7. The heat dissipation system according to any one of Examples 1 to 6, further comprising:

[0111] A first valve, coupled to the air-cooling branch between the air-cooling unit and the primary-side liquid return pipe, to adjust the on-off of the air-cooling branch;

[0112] a bypass branch, one end of which is in communication with the air-cooling branch between the air-cooling unit and the first valve, and the other end of which is in communication with the liquid-cooling branch between the heat exchanger and the primary-side liquid supply pipe; and

[0113] The second valve is coupled to the bypass branch to adjust the on-off state of the bypass branch.

[0114] Example 8. A heat dissipation system according to any one of Examples 1 to 6, wherein the air-cooling branch and / or the liquid-cooling branch is provided with a flow valve to adjust the flow ratio of the cooling medium in the air-cooling branch and the liquid-cooling branch.

[0115] Example 9. A heat dissipation system according to any one of Examples 1 to 6, wherein the flow resistance ratio of the air-cooling branch and the liquid-cooling branch is a preset value.

[0116] Example 10. The heat dissipation system according to any one of Examples 1 to 6, wherein the cooling element in the interlayer comprises a cold plate, the heat exchanger comprises a plate heat exchanger, and the secondary side circulation loop can be filled with a single-phase cooling medium, and the heat dissipation system further comprises:

[0117] A circulation pump is coupled to the secondary circulation loop, and the circulation pump can drive the single-phase cooling medium in the secondary circulation loop to flow.

[0118] Example 11. The heat dissipation system according to any one of Examples 1 to 5, wherein the heat exchanger is disposed outside the cabinet.

[0119] Example 12. A cooling system according to Example 11, wherein there are multiple cabinets, and the secondary side circulation loops of the multiple cabinets are all coupled to the heat exchanger, so that the liquid cooling branch exchanges heat with the secondary side circulation loops in the multiple cabinets via the heat exchanger.

[0120] Example 13. The heat dissipation system according to any one of Examples 1 to 5, wherein the cabinet further comprises:

[0121] The heat dissipation cabin is arranged on one side of the cabinet, and the air inlet and outlet ducts are arranged in the heat dissipation cabin.

[0122] Example 14. A heat dissipation system according to any one of Examples 1 to 6, wherein the cooling element in the interlayer includes an evaporator, the heat exchanger includes a condenser, and the secondary side circulation loop can be filled with a two-phase cooling medium to exchange heat via phase change of the two-phase cooling medium in the condenser and in the evaporator.

[0123] Example 15. The heat dissipation system according to Example 14, further comprising:

[0124] a compressor coupled to the secondary circulation loop between the evaporator and the condenser; and

[0125] A throttle valve is coupled to the secondary circulation loop between the condenser and the evaporator.

[0126] Example 16. According to the heat dissipation system of Example 14, the position where the receiving tube is connected to the evaporator is higher than the position where the delivery tube is connected to the evaporator, and the position of the condenser is higher than the positions of the plurality of evaporators.

[0127] Example 17. The heat dissipation system according to any one of Examples 1 to 6, wherein the air cooling unit comprises:

[0128] Fan module; and

[0129] The surface cooler is arranged on one side of the fan module and is coupled to the air cooling branch.

[0130] Example 18. The heat dissipation system of any one of Examples 1 to 6, wherein the outdoor heat exchange unit comprises a cooling tower.

[0131] Example 19. The heat dissipation system according to any one of Examples 1 to 6, further comprising:

[0132] Two flow dividers are respectively coupled to the primary-side liquid supply pipe and the primary-side liquid return pipe, and the air-cooling branch and the liquid-cooling branch are arranged between the two flow dividers.

[0133] Example 20. A data center comprising:

[0134] Computer room; and

[0135] According to the heat dissipation system described in any one of Examples 1 to 19, the outdoor heat exchange unit of the heat dissipation system is arranged outside the machine room, and the cabinet of the heat dissipation system is arranged in the machine room.

[0136] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A heat dissipation system (100), comprising: Outdoor heat exchange unit (10); A primary side liquid supply pipe (20) and a primary side liquid return pipe (21) are connected to the outdoor heat exchange unit (10), and an air cooling branch (23) and a liquid cooling branch (24) are provided between the primary side liquid supply pipe (20) and the primary side liquid return pipe (21); The cabinet (30) comprises: A cabinet (31) comprising a plurality of compartments (310) for placing equipment to be cooled; A secondary circulation loop (32); and a plurality of delivery pipes (321) and a plurality of receiving pipes (322), respectively corresponding to the plurality of partitions (310) and respectively connected to the secondary circulation loop (32), the delivery pipes being suitable for delivering the cooling medium in the secondary circulation loop (32) to the corresponding cooling element (33) in the partition (310), and the receiving pipes being suitable for delivering the cooling medium after heat exchange in the corresponding cooling element (33) to the secondary circulation loop (32); and an air cooling unit (40), coupled to the air cooling branch (23), and comprising an air outlet side and an air return side, the air outlet side being capable of delivering cold air to the plurality of compartments (310), and the air return side being capable of receiving return air after heat exchange in the plurality of compartments (310); and A heat exchanger (50) is coupled to the liquid cooling branch (24) and the secondary side circulation loop (32) so that the liquid cooling branch (24) and the secondary side circulation loop (32) can exchange heat.

2. The heat dissipation system (100) according to claim 1, wherein the cabinet (30) further comprises: A front air duct (34) is disposed on the front side of the plurality of partitions (310) and is in communication with the plurality of partitions (310); a rear air duct (35), disposed at the rear side of the plurality of partitions (310) and communicating with the plurality of partitions (310); and The inlet and outlet air duct (36) is connected to the front air duct (34) and the rear air duct (35), and the air cooling unit (40) is arranged in the inlet and outlet air duct (36) to transport cold air to the multiple compartments (310) via the front air duct (34), and to receive return air after heat exchange in the multiple compartments (310) via the rear air duct (35).

3. The heat dissipation system (100) according to claim 2, wherein the air inlet and outlet duct (36) is arranged at the top or bottom of the cabinet (31).

4. The heat dissipation system (100) according to claim 2, wherein the air inlet and outlet duct (36) is arranged in the middle of the cabinet (31) to form a circulating air path on the upper and lower sides of the air inlet and outlet duct (36).

5. The heat dissipation system (100) according to claim 4, wherein the length of the air inlet and outlet duct (36) is less than half the height of the cabinet (31).

6. The heat dissipation system (100) according to claim 2, wherein the heat exchanger (50) is arranged in the inlet and outlet air duct (36).

7. The heat dissipation system (100) according to any one of claims 1 to 6, further comprising: A first valve (26) coupled to the air cooling branch (23) between the air cooling unit (40) and the primary side liquid return pipe (21) to adjust the on-off of the air cooling branch (23); a bypass branch (25), one end of the bypass branch (25) being in communication with the air cooling branch (23) between the air cooling unit (40) and the first valve (26), and the other end of the bypass branch (25) being in communication with the liquid cooling branch (24) between the heat exchanger (50) and the primary side liquid supply pipe (20); as well as The second valve (27) is coupled to the bypass branch (25) to adjust the on-off state of the bypass branch (25).

8. The heat dissipation system (100) according to any one of claims 1 to 6, wherein the air cooling branch (23) and / or the liquid cooling branch (24) is provided with a flow valve to adjust the flow ratio of the cooling medium in the air cooling branch (23) and the liquid cooling branch (24).

9. The heat dissipation system (100) according to any one of claims 1 to 6, wherein a flow resistance ratio of the air cooling branch (23) and the liquid cooling branch (24) is a preset value.

10. The heat dissipation system (100) according to any one of claims 1 to 6, wherein the cooling element (33) in the interlayer (310) comprises a cold plate, the heat exchanger (50) comprises a plate heat exchanger, and the secondary side circulation loop (32) can be filled with a single-phase cooling medium, and the heat dissipation system (100) further comprises: A circulation pump (37) is coupled to the secondary circulation loop (32), and the circulation pump (37) is capable of driving the single-phase cooling medium in the secondary circulation loop (32) to flow.

11. The heat dissipation system (100) according to any one of claims 1 to 5, wherein the heat exchanger (50) is arranged outside the cabinet (30).

12. The heat dissipation system (100) according to claim 11, wherein the number of the cabinets (30) is multiple, and the secondary side circulation loops (32) of the multiple cabinets (30) are all coupled to the heat exchanger (50), so that the liquid cooling branch (24) exchanges heat with the secondary side circulation loops (32) in the multiple cabinets (30) via the heat exchanger (50).

13. The heat dissipation system (100) according to claim 2, wherein the cabinet (30) further comprises: The heat dissipation chamber (60) is arranged on one side of the cabinet (31), and the air inlet and outlet duct (36) is arranged in the heat dissipation chamber (60).

14. The heat dissipation system (100) according to any one of claims 1 to 6, wherein the cooling element (33) in the interlayer (310) includes an evaporator, the heat exchanger (50) includes a condenser, and the secondary side circulation loop (32) can be filled with a two-phase cooling medium to exchange heat via phase change of the two-phase cooling medium in the condenser and in the evaporator.

15. The heat dissipation system (100) according to claim 14, further comprising: A compressor (38) coupled to the secondary circulation loop (32) between the evaporator and the condenser; as well as A throttle valve (39) is coupled to the secondary circulation loop (32) between the condenser and the evaporator.

16. The heat dissipation system (100) according to claim 14, wherein the position at which the receiving tube (322) is connected to the evaporator is higher than the position at which the delivery tube (321) is connected to the evaporator, and the position of the condenser is higher than the positions of the plurality of evaporators.

17. The heat dissipation system (100) according to any one of claims 1 to 6, wherein the air cooling unit (40) comprises: Fan module (41); as well as The surface cooler (42) is arranged on one side of the fan module (41) and is coupled to the air cooling branch (23).

18. The heat dissipation system (100) according to any one of claims 1 to 6, wherein the outdoor heat exchange unit (10) comprises a cooling tower.

19. The heat dissipation system (100) according to any one of claims 1 to 6, further comprising: The two flow dividers (28) are respectively coupled to the primary side liquid supply pipe (20) and the primary side liquid return pipe (21), and the air cooling branch (23) and the liquid cooling branch (24) are arranged between the two flow dividers (28).

20. A data center, comprising: engine room; as well as According to the heat dissipation system (100) according to any one of claims 1 to 19, the outdoor heat exchange unit (10) of the heat dissipation system (100) is arranged outside the machine room, and the cabinet (30) of the heat dissipation system (100) is arranged in the machine room.

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