CMP polishing liquid and polishing method

CN119137709APending Publication Date: 2024-12-13RESONAC CORP
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Patent Information

Application Number
CN202380037518.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-06-15
Filing Date
2023-06-12
Publication Date
2024-12-13

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Abstract

A CMP polishing liquid for polishing a carbon material, the CMP polishing liquid containing abrasive grains, iron ions, and water, the abrasive grains containing silica, the iron ion content being 7 ppm or more, and the pH being 3.5 or less. And a polishing method for polishing a carbon material using the CMP polishing liquid.
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