Molded electronic package with tilted side

Abstract

The present disclosure provides an electronic device (100) comprising a molded package structure (108) having lateral sides (101, 102, 103, 104) extending at an angle (01, 92) greater than 15 degrees and less than or equal to 25 degrees and electrically conductive leads (110, 120) partially exposed outside the package structure (108) to facilitate mold cavity filling during package molding and reduce mold voids in the electronic device (100). A method of manufacturing an electronic device includes: bonding a die (150) to a lead frame; electrically coupling conductive terminals of the die (150) to conductive leads; and performing a molding process using a mold having a cavity sidewall with a draft angle greater than 15 degrees and less than or equal to 25 degrees to form a package structure (108) enclosing the die (150) and partially enclosing the conductive leads (110, 120).

Description

Background Art

[0001] Packaged electronic devices typically include one or more semiconductor dies, conductive leads, and electrical interconnects to form a circuit that can be connected to conductive pads of a host printed circuit board. The package is molded to enclose the die and some of the leads. Unbalanced flow of molding material can occur during the molding process, especially for high pressure molding compounds used to produce high packages. This can lead to incomplete filling during molding and mold voids or gaps in the molded package structure. Mold voids can be addressed by mold parameter optimization, but this increases manufacturing cost and complexity. Summary of the invention

[0002] In one aspect, an electronic device includes a molded package structure and conductive leads partially exposed outside the package structure. The package structure has lateral sides extending at an angle greater than 15 degrees and less than or equal to 25 degrees to facilitate mold cavity filling during package molding and reduce mold voids in the electronic device.

[0003] On the other hand, a method for manufacturing an electronic device includes: attaching a tube core to a lead frame; electrically coupling the conductive terminals of the tube core to conductive leads; and performing a molding process using a mold having a cavity sidewall with a draft angle greater than 15 degrees and less than or equal to 25 degrees to form a packaging structure that encloses the tube core and partially encloses the conductive leads. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 is a perspective view of an electronic device having a molded package structure with high draft angle sidewalls and gull-wing leads.

[0005] Figure 1A for Figure 1 A partial side view of an electronic device.

[0006] Figure 1B for Figure 1 and 1A A top view of an electronic device.

[0007] Figure 1C for Figure 1-1B A front elevation view of an electronic device.

[0008] Figure 1D for Figure 1-1C Side view of an electronic device.

[0009] Figure 2 A flow chart of a method for manufacturing an electronic device.

[0010] Figure 3-8 Display basis Figure 2 The method of manufacturing Figure 1-1D electronic device.

[0011] Fig. 9 FIG. 1 is a partial side view of another electronic device having a J-shaped lead.

[0012] Fig.10 A partial side view of a quad flat no-lead (QFN) electronic device having a molded package structure with high draft angle sidewalls.

[0013] Fig.11 is a partial side view of another electronic device having a molded package structure with upper and lower side portions of unequal heights.

[0014] Fig.12 is a partial side view of another electronic device having a molded package structure with upper and lower side portions of unequal heights at different draft angles.

[0015] Fig.13 is a partial side view of another electronic device having a molded package structure with upper and lower side portions having different draft angles. DETAILED DESCRIPTION

[0016] In the drawings, like reference numerals refer to like elements throughout, and the various features are not necessarily drawn to scale. In addition, the term "couple" or "couples" includes indirect or direct electrical or mechanical connections, or a combination thereof. For example, if a first device is coupled to or coupled with a second device, the connection may be via a direct electrical connection, or an indirect electrical connection via one or more intervening devices and connections.

[0017] First reference Figure 1-1D , Figure 1 An electronic device 100 is shown having a molded package structure 108 with high draft angle sidewalls and gull-wing leads. Figure 1A A partial side view of the electronic device 100 is shown. Figure 1B A top plan view of the electronic device 100 is shown. Figure 1C A front elevation view of the electronic device 100 is shown. Figure 1D A side view of the electronic device 100 is shown. The electronic device 100 is shown as being located in an example position in a three-dimensional space, in which the corresponding first direction X, second direction Y, and third direction Z are mutually orthogonal. Figure 1, the electronic device 100 includes an opposing first side 101 and a second side 102 extending along a second direction Y and spaced apart from each other along a first direction X. The electronic device 100 also includes a third side 103 and a fourth side 104 spaced apart from each other along the second direction Y, and a bottom side 105 and a top side 106 spaced apart from the bottom side 105 along a third direction Z. In the illustrated example, the bottom side 105 and the top side 106 are substantially planar and extend in respective XY planes of the first direction X and the second direction Y. The electronic device 100 includes gull-wing conductive leads 110 along the first side 101, and leads 120 along the opposing second side 102. The example gull-wing leads 110 and 120 are or include a conductive metal, such as aluminum or copper, and have an inner portion enclosed by a molded package structure 108 and an outer portion partially exposed outside the package structure 108.

[0018] like Figure 1 , 1A 1C, the lateral sides 101-104 of the package structure 108 have tapered portions extending at an angle greater than 15 degrees and less than or equal to 25 degrees to facilitate mold cavity filling during package molding and reduce mold voids in the electronic device. The tapered surfaces of the sides 101-104 are generated by corresponding tapered walls of the mold cavity during molding to form the molded package structure 108, as further illustrated and described below. The first side 101 has an upper first portion 111 and a lower second portion 112. The first portion 111 of the first side 101 extends from a first plane P1YZ in the corresponding second direction Y and third direction Z to the sixth side 106 at a first angle θ1. The second portion 112 of the first side 101 extends from a first plane P1YZ in the corresponding second direction Y and third direction Z to the fifth side 105. In one example, the first angle θ1 is greater than 15 degrees, and the first angle θ1 is 25 degrees or less. In these or other examples, the second portion 112 of the first side 101 extends from the first plane P1YZ in the respective second direction Y and the third direction Z to the fifth side 105 at a second angle θ2. In one embodiment, the second angle θ2 is greater than 15 degrees, and the second angle θ2 is 25 degrees or less. In one example, the first angle θ1 is substantially equal to the second angle θ2. In other embodiments, the first angle θ1 and the second angle θ2 are different (e.g., the angles θ1 and θ2 described below). Fig.12 and 13 ).

[0019] like Figure 1 and 1C, the second side 102 has an upper first portion 121 and a lower second portion 122. The first portion 121 of the second side 102 extends from the second YZ plane P2YZ of the corresponding second direction Y and the third direction Z to the sixth side 106 at a first angle θ1. The second portion 122 of the second side 102 extends from the second YZ plane P2YZ to the fifth side 105. In one example, the second portion 122 of the second side 102 extends from the second YZ plane P2YZ of the fifth side 105 at a second angle θ2.

[0020] like Figure 1 and 1D , the third side 103 has an upper first portion 131 and a lower second portion 132. The first portion 131 of the third side 103 extends from a first XZ plane P1XZ corresponding to the first direction X and the third direction Z to the sixth side 106 at a first angle θ1. The second portion 132 of the third side 103 extends from the first XZ plane P1XZ to the fifth side 105. In one example, the second portion 132 of the third side 103 extends from the first XZ plane P1XZ to the fifth side 105 at a second angle θ2. In this example, the fourth side 104 has a first portion 141 and a second portion 142. The first portion 141 of the fourth side 104 extends from a second XZ plane P2XZ corresponding to the first direction X and the third direction Z to the sixth side 106 at a first angle θ1, and the second portion 142 of the fourth side 104 extends from the second XZ plane P2XZ to the fifth side 105. In one example, the second portion 142 of the fourth side 104 extends from the second XZ plane P2XZ to the fifth side 105 at a second angle θ2.

[0021] like Figure 1A As shown in , the first portions 111, 121, 131 and 141 of the respective first side 101, the second side 102, the third side 103 and the fourth side 104 have a first height L1 along the third direction Z. The second portions 112, 122, 132 and 142 of the respective sides 101, 102, 103 and 104 have a second height L2 along the third direction Z. Figure 1-1DIn the electronic device 100 of the embodiment, the first height L1 is substantially equal to the second height L2. In other examples (e.g., 11 and 12 of the following figures), the first height L1 and the second height L2 are different. In the illustrated example, the side 101 includes a middle portion between the first portion 111 and the second portion 112, and the lead 110 extends outwardly from the middle portion of the first side 101 substantially along the first direction X transversely. In this example, the other lateral sides 102-104 have similar middle portions. In other embodiments (not shown), the middle portion is omitted from each of the lateral sides 101-104, for example, wherein the upper first portions 111, 21, 131 and 141 extend to the corresponding second portions 112, 122, 132 and 142.

[0022] As in Figure 1 As further shown in , electronic device 100 includes, for example, a semiconductor die 150 mounted on die attach pads (not shown) and enclosed within a molding material of package structure 108. Die 150 includes conductive terminals, such as conductive copper or aluminum die bond pads, some of which are electrically coupled to respective ones of conductive leads 110 or 120 by conductive bond wires 152. Other examples include flip chip die attach electrical connections alone or in combination with bond wires, substrate interconnects, and / or other forms of electrical couplings (not shown). Figure 1-1D In the example of FIG. 1 , leads 110 and 120 are gull-wing leads extending outwardly from respective first and second sides 101 and 102 of package structure 108. In other examples, different lead types and / or shapes may be used, such as J-shaped leads (e.g., hereinafter referred to as J-shaped leads). Fig. 9 ), Quad Flat No-Lead (QFN) package type leadless type (for example, below Fig.10 ) etc. In addition, in various embodiments, the leads 110 , 120 may be disposed along one side, two sides, three sides, or four sides of the electronic device 100 .

[0023] The electronic device provides increased angles θ1 and θ2 of more than 15 degrees to promote balanced mold material flow within the mold cavity during the molding process to reduce or avoid mold voids or gaps in the material 0 of the finished molded package structure 108. This facilitates proper mechanical support and protection of the enclosed components as well as electrical isolation and high voltage withstand capabilities, particularly for high voltage isolation devices. In addition, the increased angles θ1 and θ2 facilitate uniform void-free molding through enhanced mold material flow uniformity during mold filling operations without the need to adjust or optimize mold parameters, such as mold material temperature range, injection pressure and flow rate, mold material viscosity, and other properties. In some instances, the electronic device may be a high-voltage device with a high profile, such as a 3.00 mm mold thickness along a third direction Z together with tapered side portions extending at first θ1 and second angles θ2 greater than 15 degrees. In some instances, the angles θ1 and θ2 are 25 degrees or less, where angles above this amount can reduce the electrical isolation spacing distance between the high voltage components (e.g., die 150, bond wires 152) enclosed within the package structure 108 and external components or systems by reducing the thickness of the molding material of the package structure 108 near the respective sides 101-104. In some instances, one or both of the angles θ1 and θ2 are greater than or equal to 18 degrees and less than or equal to 22 degrees, such as approximately 20 degrees. The angles θ1 and θ2 in one embodiment are set or controlled by the configuration of the respective mold halves or mold sections of the molding process used to form the molded package structure 108.

[0024] Reference Figure 2-8 , Figure 2 A method 200 of manufacturing an electronic device is shown, and Figure 3-8 Demonstrating a manufacturing process according to method 200 Figure 1-1D The electronic device 100. The method 200 includes a die attach process at 202. Figure 3 One example is shown in which a die attach process 300 is performed to attach a semiconductor die 150 to a die attach pad 302 of a starting leadframe that also includes the intended leads 110 and 120. In one example, the starting leadframe has a plurality of intended device sections arranged in an array of rows and columns (not shown), and the die attach process 300 includes placing a plurality of dies 150 simultaneously or sequentially to respective die attach pads of a panel array.

[0025] Method 200 continues at 204, where the electrical coupling includes coupling one or more conductive terminals of die 150 to corresponding conductive leads 110 or 120, as well as any die-to-die connections required for a given electronic device design (e.g., die-to-chip connections for a multi-chip module or MCM device, not shown). Figure 4One example is shown in which a wire bonding process 400 is performed to form bond wires 152 between respective conductive bonding pads of the semiconductor die 150 and associated ones of the conductive leads 110 , 120 of a starting leadframe.

[0026] The method 200 further includes molding using a mold having a high upper draft angle and a high lower draft angle at 206 . Figure 5-8 An example of an electronic device 100 is shown in which a molding process 500 is performed using a mold having a separable first mold section 501 and a separable second mold section 502. Figure 5-8 In an example, the first mold section 501 has a first (e.g., upper) cavity with a first draft angle θ1, and the second mold section 502 has a second (e.g., lower) cavity with a second draft angle θ2. In one example, the draft angles θ1 and θ2 are both greater than 15 degrees and less than or equal to 25 degrees, such as 18 to 22 degrees in one embodiment. The draft angles θ1 and θ2 of the inner side walls of the mold cavity roughly correspond to the corresponding first angle θ1 and second angle θ2 of the electronic device 100 after molding. The molding process 500 forms a package structure 108 that encloses the die 150 and the bonding wires 152, and partially encloses the conductive leads 110 and 120, thereby exposing external portions of the conductive leads for subsequent trimming and molding operations. Along Figure 5 The upper mold section 501 and the lower mold section 502 are enclosed in the direction of the arrows in FIG. 5 to surround the die 150 and the intended device section of the lead frame panel array, thereby creating a cavity associated with each intended electronic device. The cavity for each device is then filled with Figure 6 The molten molding material 108 shown in FIG. 1 , and the molten molding material solidifies when it cools, as shown in FIG. Figure 7 Then follow the Figure 8 The mold sections 501 and 502 are separated in the direction of the arrows in FIG. 1 , so that the molded package structure 108 has side portions at angles θ1 and θ2, as described above in conjunction with Figure 1-1D Method 200 continues to Figure 2 At 208 , lead trimming and molding processes (not shown) are performed, and package singulation is performed at 210 to provide individual finished packaged electronic devices 100 .

[0027] Figure 9-13 Another example electronic device is shown having a molded package structure with a sidewall angle greater than 15 degrees and less than or equal to 25 degrees. Fig. 9A portion of another electronic device 900 is shown having a molded package structure 908 and J-shaped leads 910 along a first side 901 having a first (e.g., upper) portion 911 extending to a top (e.g., sixth) side 906 at a first angle θ1 and a second (e.g., lower) portion 912 extending to a bottom (e.g., fifth) side 905 at a second angle θ2. The other three lateral sides have similar first and second portions at respective angles θ1 and θ2. In one example, the electronic device 900 has four lateral sides including the side 901 shown, and each of the four sides includes one or more conductive leads 910 partially exposed along the respective side and partially exposed along a bottom (e.g., fifth) side 905 of the package structure 908. In another example, the electronic device 900 has leads along less than all of the lateral sides.

[0028] Fig.10 A portion of another electronic device 1000 is shown having a square flat molded (e.g., QFN) package structure 1008 and partially exposed leads 1010 along a first side 1001, the first side having a first (e.g., upper) portion 1011 extending to a top (e.g., sixth) side 1006 at a first angle θ1 and a second (e.g., lower) portion 1012 extending to a bottom (e.g., fifth) side 1005 at a second angle θ2. The other three lateral sides have similar first and second portions at respective angles θ1 and θ2. In one example, the electronic device 1000 has four lateral sides including the side 1001 shown, and each of the four sides includes one or more conductive leads 1010 partially exposed along the respective side and partially exposed along a bottom (e.g., fifth) side 1005 of the package structure 1008. In another example, the electronic device 1000 has leads along less than all of the lateral sides.

[0029] Fig.11A portion of another electronic device 1100 is shown having a molded package structure 1108 and gull-wing leads 1110 along a first side 1101, the first side having a first (e.g., upper) portion 1111 extending to a top (e.g., sixth) side 1106 at a first angle θ1 and a second (e.g., lower) portion 1112 extending to a bottom (e.g., fifth) side 1105 at a second angle θ2. In this example, the first portion 1111 of the first side 1101 has a first height L1 along a third direction Z, and the second portion 1112 has a second height L2 along the third direction Z, and the first height L1 and the second height L2 are different. In the illustrated embodiment, the second height L2 is less than the first height L1. In another example, the second height L2 is greater than the first height L1. In these examples, the other three lateral sides have similar first and second portions at respective angles θ1 and θ2. In one example, the electronic device 1100 has four lateral sides including the side 1101 shown, and each of the four sides includes one or more gull-wing conductive leads 1110 extending out of the respective side. In another example, the electronic device 1100 has leads 1110 along less than all of the lateral sides. Fig.11 In the example, further, the first angle θ1 is different from the second angle θ2, and both angles θ1 and θ2 are greater than 15 degrees and less than or equal to 25 degrees. In the illustrated embodiment, angle θ1 is less than angle θ2. In another embodiment, angle θ1 is greater than angle θ2.

[0030] Fig.12 A portion of another electronic device 1200 having upper and lower side portions at different draft angles is shown. The electronic device 1200 has a molded package structure 1208 and gull-wing leads 1210 along a first side 1201, the first side having a first (e.g., upper) portion 1211 extending to a top (e.g., sixth) side 1206 at a first angle θ1 and a second (e.g., lower) portion 1212 extending to a bottom (e.g., fifth) side 1205 at a second angle θ2. In this example, the first portion 1211 of the first side 1201 has a first height L1 along a third direction Z, and the second portion 1212 has a second height L2 along the third direction Z, and the first height L1 and the second height L2 are different. In the illustrated embodiment, the second height L2 is less than the first height L1. In another example, the second height L2 is greater than the first height L1. In these examples, the other three lateral sides have similar first and second portions at respective angles θ1 and θ2. In one example, the electronic device 1200 has four lateral sides including the side 1201 shown, and each of the four sides includes one or more gull-wing conductive leads 1210 extending out of the respective side. In another example, the electronic device 1200 has leads 1210 along less than all of the lateral sides. Fig.12 In the example, further, the first angle θ1 is different from the second angle θ2, and both angles θ1 and θ2 are greater than 15 degrees and less than or equal to 25 degrees. In the illustrated embodiment, angle θ1 is less than angle θ2. In another embodiment, angle θ1 is greater than angle θ2.

[0031] Fig.13 Another example electronic device 1300 is shown with a molded package structure 1308 having upper side portions 1311 and lower side portions 1312 at different draft angles. The electronic device 1300 has a gull-wing lead 1310 along a first side 1301 having a first (e.g., upper) portion 1311 extending to a top (e.g., sixth) side 1306 at a first angle θ1 and a second (e.g., lower) portion 1312 extending to a bottom (e.g., fifth) side 1305 at a second angle θ2. In this example, the first portion 1311 of the first side 1301 has a first height L1 along a third direction Z, and the second portion 1312 has a second height L2 along the third direction Z, and the first height L1 is substantially equal to the second height L2. In this example, the other three lateral sides have similar first and second portions at respective angles θ1 and θ2. In one example, the electronic device 1300 has four lateral sides including the side 1301 shown, and each of the four sides includes one or more gull-wing conductive leads 1310 extending out of the respective side. In another example, the electronic device 1300 has leads 1310 along less than all of the lateral sides. Fig.13 In the example, further, the first angle θ1 is different from the second angle θ2, and both angles θ1 and θ2 are greater than 15 degrees and less than or equal to 25 degrees. In the illustrated embodiment, angle θ1 is less than angle θ2. In another embodiment, angle θ1 is greater than angle θ2.

[0032] The described examples and their variations provide advantages in promoting complete mold filling and reducing mold voids or gaps to enhance the performance and hardness of molded package structures. These examples allow the use of common molding parameter control without increasing the cost and complexity of mold parameter optimization. These solutions have advantages, such as for multi-chip module (MCM) packaged devices and packaged integrated circuits, during the manufacture of single-component packaged electronic devices and packaged integrated circuits with multiple electronic components, there is usually an enhanced mold material flow. In addition, the described solutions have advantages about thick package designs, including devices with package structure thickness (e.g., 3.00 mm or greater along the example third direction (Z)). Certain embodiments of the described examples can be modified by the mold to implement a new package draft angle design in which the draft angle is greater than 15 degrees and less than or equal to 25 degrees to alleviate mold flow imbalance with high pressure molding compounds. These examples also save production costs by minimizing the yield loss caused by external mold voids, and improve productivity by avoiding machine downtime caused by external mold voids, without the need for further mold process optimization and eliminating multiple learning cycles about mold flow / parameter optimization.

[0033] The above examples illustrate only several possible implementations of various aspects of the present disclosure, where other skilled in the art will conceive equivalent changes and / or modifications after reading and understanding this specification and the accompanying drawings. Unless otherwise stated, "about," "approximately," or "substantially" in front of a value means + / - 10 percent of the stated value. Modifications to the described examples are possible and other implementations are possible within the scope of the claims.

Claims

1. An electronic device, comprising: A package structure having a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, wherein the first side and the second side are spaced apart from each other along a first direction, the third side and the fourth side are spaced apart from each other along a second direction orthogonal to the first direction, and the fifth side and the sixth side are spaced apart from each other along a third direction orthogonal to the first direction and the second direction; as well as A conductive lead partially exposed outside the packaging structure; The first side has a first portion and a second portion, the first portion of the first side extends from a first plane of the second direction and the third direction to the sixth side at a first angle, the second portion of the first side extends from the first plane of the second direction and the third direction to the fifth side, the first angle is greater than 15 degrees, and the first angle is 25 degrees or less; The second side has a first portion and a second portion, the first portion of the second side extends from a second plane of the second direction and the third direction to the sixth side at the first angle, and the second portion of the second side extends from the second plane of the second direction and the third direction to the fifth side; The third side has a first portion and a second portion, the first portion of the third side extends from a first plane of the first direction and the third direction to the sixth side at the first angle, and the second portion of the third side extends from the first plane of the first direction and the third direction to the fifth side; and The fourth side has a first portion and a second portion, the first portion of the fourth side extends from the first direction and the second plane of the third direction to the sixth side at the first angle, and the second portion of the fourth side extends from the first direction and the second plane of the third direction to the fifth side.

2. The electronic device according to claim 1, wherein: the second portion of the first side extending from the first plane of the second direction and the third direction to the fifth side at a second angle; the second portion of the second side extends from the second plane of the second direction and the third direction to the fifth side at the second angle; the second portion of the third side extends from the first plane of the first direction and the third direction to the fifth side at the second angle; the second portion of the fourth side extends from the second plane of the first direction and the third direction to the fifth side at the second angle; The second angle is greater than 15 degrees; and The second angle is 25 degrees or less. The electronic device according to claim 2 , wherein the first angle is substantially equal to the second angle. The electronic device of claim 3 , wherein the conductive leads extend outwardly from the first side of the package structure. 5 . The electronic device of claim 3 , wherein the conductive leads are partially exposed along the first side and the fifth side of the package structure. The electronic device of claim 2 , wherein the conductive leads extend outwardly from the first side of the package structure. 7 . The electronic device of claim 2 , wherein the conductive leads are partially exposed along the first side and the fifth side of the package structure.

8. The electronic device according to claim 2, wherein: The first angle is 18 degrees or greater; The first angle is 22 degrees or less; The second angle is 18 degrees or greater; and The second angle is 22 degrees or less. 9 . The electronic device of claim 1 , wherein the conductive leads extend outwardly from the first side of the package structure. 10 . The electronic device of claim 1 , wherein the conductive leads are partially exposed along the first side and the fifth side of the package structure.

11. The electronic device according to claim 1, wherein: The first angle is 18 degrees or greater; The first angle is 22 degrees or less; The second angle is 18 degrees or greater; and The second angle is 22 degrees or less.

12. The electronic device according to claim 1, wherein: The first portions of the respective first side, second side, third side and fourth side have a first height along the third direction; The second portions of the respective first side, second side, third side and fourth side have a second height along the third direction; and The first height and the second height are different.

13. The electronic device according to claim 12, wherein: the second portion of the first side extending from the first plane of the second direction and the third direction to the fifth side at a second angle; the second portion of the second side extends from the second plane of the second direction and the third direction to the fifth side at the second angle; the second portion of the third side extends from the first plane of the first direction and the third direction to the fifth side at the second angle; The second portion of the fourth side extends from the second plane of the first direction and the third direction to the fifth side at the second angle; and The first angle and the second angle are different.

14. The electronic device according to claim 1, wherein: the second portion of the first side extending from the first plane of the second direction and the third direction to the fifth side at a second angle; the second portion of the second side extends from the second plane of the second direction and the third direction to the fifth side at the second angle; the second portion of the third side extends from the first plane of the first direction and the third direction to the fifth side at the second angle; The second portion of the fourth side extends from the second plane of the first direction and the third direction to the fifth side at the second angle; and The first angle and the second angle are different.

15. The electronic device according to claim 14, wherein: The first portions of the respective first side, second side, third side and fourth side have a first height along the third direction; The second portions of the respective first side, second side, third side and fourth side have a second height along the third direction; and The first height is substantially equal to the second height.

16. A method of manufacturing an electronic device, the method comprising: attaching the die to the lead frame; electrically coupling the conductive terminals of the die to the conductive leads; as well as A molding process is performed using a mold having a cavity sidewall with a draft angle greater than 15 degrees and less than or equal to 25 degrees to form a package structure enclosing the die and partially enclosing the conductive leads. The method according to claim 16 , wherein the draft angle is greater than or equal to 18 degrees and less than or equal to 22 degrees.

18. The method of claim 16, wherein: The mold comprises a separable first mold section and a second mold section; The first mold section has a first cavity having the draft angle; and The second mold section has a second cavity with a second draft angle.

19. The method of claim 18, wherein the draft angle is substantially equal to the second draft angle.

20. The method of claim 18, wherein: The draft angle is 18 degrees or greater; The draft angle is 22 degrees or less; The second draft angle is 18 degrees or greater; and The second draft angle is 22 degrees or less.

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