Chip recovery device and chip recovery method

Abstract

A chip recovery device is provided with: a secondary duct that receives, from a chip receiving opening, chips of a tape member discharged from a tape feeder provided in a component mounting device; the main pipeline is connected with the secondary pipeline through a chip inlet opening; and a plurality of air ejectors that eject air into the main pipe and convey the chips, which have been moved from the secondary pipe into the main pipe through the chip inlet opening, to the air outlet side of the main pipe. The multiple air ejectors are arranged in a straight line in the extending direction of the main pipeline and sequentially eject air so that the cuttings entering the main pipeline from the secondary pipeline can be sequentially conveyed to the air outlet side.

Description

Technical Field

[0001] The present invention relates to a chip recovery device and a chip recovery method for recovering chips of a tape member discharged from a tape feeder. Background Art

[0002] Conventionally, in a component assembly device for assembling components on a substrate, there is known a chip recovery device that automatically recovers chips of a tape component discharged from a tape feeder as a component supply unit (for example, the following patent document 1). In patent document 1, the chips of the tape component cut by the tape cutter fall due to their own weight and are received by a secondary pipe (receiving unit), and then move to a main pipe (recovery path) under the action of air blown from an air blower provided in the secondary pipe. Furthermore, the chips are transported to the air outlet side of the main pipe under the action of air ejected from an air ejector provided in the main pipe.

[0003] In the above-mentioned conventional chip recovery device, an air ejector is provided at the most upstream side of the main duct, and the chips in the main duct are sent out to the air outlet at once by ejecting air from the air ejector with a large ejection force.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2021 / 131165 Summary of the invention

[0007] However, the force of the chips moving in the main duct under the action of the air ejected by the air ejector becomes weaker as it approaches the air outlet side of the main duct. Therefore, there is a problem that when the main duct is long to a certain extent, the chips may not be transported to the air outlet of the main duct.

[0008] Therefore, an object of the present invention is to provide a chip recovery device and a chip recovery method capable of reliably conveying chips of a belt member in a main duct to an air outlet of the main duct.

[0009] The chip recovery device of the present invention comprises: a secondary pipe, which receives chips of a belt component discharged from a belt feeder provided in a component assembly device through a chip receiving opening; a main pipe, which is connected to the secondary pipe through a chip entry opening; and a plurality of air ejectors, which eject air into the main pipe to transport the chips that move from the secondary pipe into the main pipe through the chip entry opening to the air outlet side of the main pipe, the plurality of air ejectors are arranged in a straight line along the extension direction of the main pipe, and the plurality of air ejectors eject air in sequence to transport the chips that enter the main pipe from the secondary pipe to the air outlet side in sequence.

[0010] The chip recovery method of the present invention is a chip recovery method performed by a chip recovery device, the chip recovery device comprising: a secondary pipe, which receives chips of a belt component discharged from a belt feeder provided in a component assembly device from a chip receiving opening; a main pipe, which is connected to the secondary pipe through a chip entry opening; and a plurality of air ejectors, which eject air into the main pipe to transport the chips that move from the secondary pipe into the main pipe through the chip entry opening to the air outlet side of the main pipe, the plurality of air ejectors being arranged in a straight line along the extension direction of the main pipe, wherein the plurality of air ejectors respectively eject air to transport the chips that enter the main pipe from the chip entry opening to the air outlet side in sequence.

[0011] According to the present invention, the chips of the belt member in the main duct can be reliably conveyed to the air outlet of the main duct. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a perspective view showing a chip recovery device in one embodiment of the present invention together with a work line of a component assembly device.

[0013] Figure 2 It is a side view of the component mounting device in one embodiment of the present invention.

[0014] Figure 3 It is a cross-sectional view of a part of the component mounting device and a part of the chip recovery device in one embodiment of the present invention.

[0015] Figure 4 It is a perspective view of the chip recovery device in one embodiment of the present invention.

[0016] Figure 5 It is a schematic plan view of a chip recovery device in one embodiment of the present invention.

[0017] Figure 6 This is a perspective view of a part of a chip recovery device in one embodiment of the present invention.

[0018] Figure 7 It is a top view of a part of the chip recovery device in one embodiment of the present invention.

[0019] Fig. 8A This is an explanatory diagram of the operation of the air blower included in the chip recovery device according to one embodiment of the present invention (closed position).

[0020] Figure 8B This is an explanatory diagram of the operation of the air blower included in the chip recovery device according to the embodiment of the present invention (open position).

[0021] Fig. 9A This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0022] Fig. 9B This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0023] Fig. 9C This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0024] Fig. 10A This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0025] Fig. 10B This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0026] Fig. 10C This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0027] Fig.11A This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0028] Fig. 11B This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0029] Fig. 11C This is a diagram for explaining the assembly procedure of the main duct of the chip recovery device in one embodiment of the present invention.

[0030] Fig. 12A This is a perspective view (closed position) of a second duct fitting connected to a first duct fitting provided in a main duct of a chip recovery device according to an embodiment of the present invention.

[0031] Fig. 12B This is a perspective view (open position) of a second duct component connected to a first duct component included in a main duct of a chip recovery device according to an embodiment of the present invention.

[0032] Fig.13A It is an operation explanation diagram (closed position) of the air ejector and the check valve included in the chip recovery device according to one embodiment of the present invention.

[0033] Fig. 13B It is an operation explanation diagram (open position) of the air ejector and the check valve included in the chip recovery device according to one embodiment of the present invention.

[0034] Fig.14A It is a perspective view of a storage portion provided in the chip recovery device in one embodiment of the present invention.

[0035] Fig. 14B It is a side view of the storage part with which the chip recovery device in one embodiment of the present invention is equipped.

[0036] Fig.15A It is an explanatory diagram of the operation of the chip recovery device in one embodiment of the present invention.

[0037] Fig. 15B It is an explanatory diagram of the operation of the chip recovery device in one embodiment of the present invention.

[0038] Fig. 15C It is an explanatory diagram of the operation of the chip recovery device in one embodiment of the present invention.

[0039] Fig.16A It is an explanatory diagram of the operation of the chip recovery device in one embodiment of the present invention.

[0040] Fig. 16B It is an explanatory diagram of the operation of the chip recovery device in one embodiment of the present invention.

[0041] Fig. 16C It is an explanatory diagram of the operation of the chip recovery device in one embodiment of the present invention.

[0042] Fig.17 It is a perspective view showing another example of the baffle plate provided in the chip recovery device in one embodiment of the present invention.

[0043] Fig.18 It is a plan view of another example of the baffle plate provided in the chip recovery device in one embodiment of the present invention.

[0044] Fig.19A It is an explanatory diagram of the operation of the storage section included in the chip recovery device in one embodiment of the present invention.

[0045] Fig.19B It is an explanatory diagram of the operation of the storage section included in the chip recovery device in one embodiment of the present invention.

[0046] Fig.19C It is an explanatory diagram of the operation of the storage section included in the chip recovery device in one embodiment of the present invention.

[0047] Fig. 20A This is a diagram for explaining a procedure for installing a chip recovery device in one embodiment of the present invention.

[0048] Fig. 20BThis is a diagram for explaining a procedure for installing a chip recovery device in one embodiment of the present invention.

[0049] Fig. 20C This is a diagram for explaining a procedure for installing a chip recovery device in one embodiment of the present invention.

[0050] Fig.21A This is a diagram for explaining a procedure for installing a chip recovery device in one embodiment of the present invention.

[0051] Fig. 21B This is a diagram for explaining a procedure for installing a chip recovery device in one embodiment of the present invention.

[0052] Fig. 21C This is a diagram for explaining a procedure for installing a chip recovery device in one embodiment of the present invention.

[0053] Fig. 22 It is a schematic plan view of a chip recovery device in a modified example of one embodiment of the present invention.

[0054] Fig.23A It is an explanatory diagram of another example of the operation of the chip recovery device in one embodiment of the present invention.

[0055] Fig. 23B It is an explanatory diagram of another example of the operation of the chip recovery device in one embodiment of the present invention.

[0056] Fig.23C It is an explanatory diagram of another example of the operation of the chip recovery device in one embodiment of the present invention.

[0057] Fig.24A It is an explanatory diagram of another example of the operation of the chip recovery device in one embodiment of the present invention.

[0058] Fig. 24B It is an explanatory diagram of another example of the operation of the chip recovery device in one embodiment of the present invention.

[0059] Fig.24C It is an explanatory diagram of another example of the operation of the chip recovery device in one embodiment of the present invention. DETAILED DESCRIPTION

[0060] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 1The work line 2 is provided with a chip recovery device 1 in one embodiment of the present invention. The work line 2 has a structure in which a plurality of (here, three) component assembly devices 3 for assembling components on a substrate KB are arranged in one direction, and the substrate KB is transferred to each other in adjacent component assembly devices 3 and components are assembled to the substrate KB. In this embodiment, the direction in which the substrate KB is transferred in the work line 2 (left-right direction and the direction in which the component assembly devices 3 are arranged) is set as the X direction, the horizontal direction (front-back direction) orthogonal to the X direction is set as the Y direction, and the up-down direction is set as the Z direction.

[0061] exist Figure 2 In the embodiment, the component assembly device 3 includes a base 11 and a cover member 12 covering the upper portion of the base 11. A work space 13 covered by the cover member 12 is formed above the base 11. A substrate conveying unit 14 extending in the X direction in the work space 13 is provided on the upper surface of the base 11. The substrate conveying unit 14 is composed of a pair of conveyor mechanisms arranged in the Y direction. The substrate conveying unit 14 conveys the substrate KB in the X direction and positions the substrate KB at a predetermined work position in the work space 13.

[0062] exist Figure 2 In the embodiment, a feeder carriage 15 is installed at each of the front and rear ends of the base 11. A plurality of tape feeders 16 (also see Figure 1 Each tape feeder 16 takes in a carrier tape 18 as a tape member fed from a tape reel 17 held on a feeder carriage 15 and conveys it in the Y direction (toward the substrate conveying section 14 ), and supplies the component BH stored in the carrier tape 18 to the component supply position 16K.

[0063] exist Figure 2 In the embodiment, two assembly heads 21 are provided above the base 11 so as to be movable by a head moving mechanism 22. Each assembly head 21 has a nozzle 21N extending downward. The head moving mechanism 22 is constituted by, for example, an orthogonal coordinate robot, and enables the two assembly heads 21 to move independently in a horizontal plane. Each assembly head 21 picks up a component BH ( Figure 2 ).

[0064] exist Figure 2 In the embodiment, the component mounting device 3 includes a control device 23. The control device 23 controls the operations of the substrate conveying unit 14, the tape feeder 16, the mounting head 21, the head moving mechanism 22, and the like.

[0065] When the component assembly device 3 performs the component assembly operation, first, the substrate conveying unit 14 is operated to receive the substrate KB from the device on the upstream side, and the substrate KB is positioned at the working position. After positioning the substrate KB at the working position, the component assembly device 3 operates the tape feeder 16 to supply the component BH to the component supply position 16K, and operates the head moving mechanism 22 to cause the assembly head 21 to repeatedly perform the component transfer operation. In the component transfer operation, the assembly head 21 picks up the component BH supplied by the tape feeder 16 and then assembles the component BH on the substrate KB.

[0066] After each component assembly device 3 assembles the component BH to be assembled on the substrate KB by repeatedly performing the component transfer operation performed by the assembly head 21, the substrate conveying unit 14 is operated to carry out the substrate KB to the downstream side. Thus, the three component assembly devices 3 respectively assemble the component BH on the substrate KB, and after the component assembly device 3 located at the most downstream side carries out the substrate KB, the component assembly operation on the substrate KB using the operation line 2 is completed.

[0067] Next, the chip recovery device 1 will be described. First, the cutting of the carrier tape 18 will be described. Figure 2 As shown in FIG. 1 , the feeder carriage 15 provided in each component mounting device 3 has a tape cutter 24 and a chute 25. The tape cutter 24 is provided below the tape feeder 16 to cut the carrier tape 18 after the tape feeder 16 has supplied the component BH. The chute 25 is also provided as shown in FIG. Figure 3 ( Figure 2 As shown in the enlarged view of the area RY in FIG. 2 , the chute 25 is provided below the tape cutter 24. The chute 25 guides the chips KZ of the carrier tape 18 cut by the tape cutter 24 and falling due to its own weight, and discharges the chips KZ to the outside of the feeder carriage 15 from the discharge opening 25K at the lower end.

[0068] The chips KZ of the carrier 18 are generated from each component assembly device 3 constituting the operation line 2, and the chips KZ of the carrier 18 generated in the entire operation line 2 become huge in number. The chip recovery device 1 in this embodiment automatically recovers a large amount of chips KZ of the carrier 18 generated from the operation line 2 without relying on manual labor, thereby facilitating the disposal of the chips KZ.

[0069] exist Figure 1 , Figure 4 as well as Figure 5In the embodiment, the chip recovery device 1 includes a main duct 31, a plurality of sub-ducts 32, and a storage portion 33. The main duct 31 extends below the operation line 2 extending in the X direction (specifically, below each of the plurality of component assembly devices 3) along the extension direction (X direction) of the operation line 2, and has openings on the upstream side (one end side) and the downstream side (the other end side). Hereinafter, the air outlet in the main duct 31 is referred to as "air outlet 31D".

[0070] exist Figure 4 as well as Figure 5 In the embodiment, the main pipe 31 is connected by a plurality of pipe parts 41 in one direction (the arrangement direction of the component assembly device 3, and the X direction). Figure 3 as well as Figure 6 As shown, the duct component 41 has a hollow shape with a rectangular cross section, and includes an upper wall 41 a , a lower wall 41 b , and two side walls 41 c facing each other in the Y direction.

[0071] exist Figure 4 In the embodiment, the main duct 31 is composed of two duct parts 41, namely, a main duct part 41M and a sub-duct part 41S as a duct part for distance adjustment (adjustment duct part). The main duct part 41M has chip inlet openings 41K formed on two side walls 41c facing each other in the Y direction. Therefore, a plurality of chip inlet openings 41K are provided in the extending direction (X direction) of the main duct 31.

[0072] exist Figure 1 , Figure 2 as well as Figure 4 In the embodiment, a plurality of sub-pipes 32 are respectively arranged on the floor surface FL below the feeder carriage 15, and each sub-pipe 32 is respectively connected to two side walls 41c of the main pipe 31 facing each other in the front and rear direction (Y direction) in a manner covering the chip inlet opening 41K (see also Figure 5 Hereinafter, the secondary pipe 32 located at the front side of the main pipe 31 is referred to as the "first pipe 32A", and the secondary pipe 32 located at the rear side of the main pipe 31 is referred to as the "secondary pipe 32B" ( Figure 5 ).

[0073] In this embodiment, two first-stage pipes 32A adjacent to each other in the X direction correspond to one feeder trolley 15 on the front side of one component assembly device 3, and two second-stage pipes 32B adjacent to each other in the X direction correspond to one feeder trolley 15 on the rear side of one component assembly device 3 ( Figure 5 Each secondary pipe 32 has a box shape open to the main pipe 31 side ( Figure 6 , Figure 7 , Fig. 8A as well as Figure 8B ).

[0074] exist Figure 3 , Figure 6 , Fig. 8A as well as Figure 8B In the embodiment, a chip receiving opening 32K opening upward (toward the belt feeder 16) is provided on the upper wall of each secondary duct 32. The secondary duct 32 receives the chips KZ of the carrier belt 18 (i.e., the chips KZ discharged from the belt feeder 16) that fall due to their own weight through the corresponding chute 25 located just above through the chip receiving opening 32K.

[0075] exist Figure 1 as well as Figure 4 In the embodiment, the end of the main duct 31 on the air outlet 31D side extends obliquely upward toward the downstream side, and the front end extending obliquely upward forms a horizontal portion. The air outlet 31D is provided to be opened on the lower surface of the horizontal portion.

[0076] Two adjacent main pipe parts 41M constituting the above-mentioned one main pipe unit are in a state where their respective ends are butted against each other ( Fig. 9A → Fig. 9B ) and connected using an L-shaped connecting member 42. Fig. 9B as well as Fig. 9C As shown, the L-shaped connector 42 has a horizontal portion 42a and a vertical portion 42b extending downward from one end of the horizontal portion 42a, and has an L-shaped shape as a whole. The horizontal portion 42a is a portion that contacts the upper surface of each of the two adjacent main conduit parts 41M (the upper surface of the upper wall 41a), and the vertical portion 42b is a portion that contacts the side surface of each of the two adjacent main conduit parts 41M (the outer surface of one side wall 41c).

[0077] exist Fig. 9B In the embodiment, two cutout grooves 42K extending toward the end portion on the side where the vertical portion 42b is formed are provided at the end portion of the horizontal portion 42a of the L-shaped connector 42 on the side opposite to the side where the vertical portion 42b is formed. In addition, screw insertion holes 42H penetrating the vertical portion 42b in the plate thickness direction are provided in the vertical portion 42b of the L-shaped connector 42 in a row in the X direction.

[0078] exist Figures 9A to 9C In the embodiment, a bolt as a protrusion 43 is provided on the upper surface (upper surface of the upper wall 41a) of each main pipe part 41M so as to extend upward. In addition, a plurality of screw holes 41H are provided on the upper and lower sides of the side wall 41c of each main pipe part 41M. When the ends of two main pipe parts 41M are butted against each other, the interval in the X direction between two adjacent protrusions 43 is consistent with the interval between two notch grooves 42K provided in the L-shaped connecting piece 42, and the interval in the X direction between two adjacent screw holes 41H is consistent with the interval between two screw insertion holes 42H provided in the L-shaped connecting piece 42.

[0079] When two main pipe parts 41M are connected with their ends butted against each other by the L-shaped connecting member 42, the L-shaped connecting member 42 is brought close to the two main pipe parts 41M (from a position where the two notch grooves 42K of the L-shaped connecting member 42 and the two protrusions 43 of the two main pipe parts 41M are opposed in the horizontal direction (Y direction). Fig. 9B → Fig. 9C ). In addition, the two cutout grooves 42K formed in the L-shaped connector 42 are engaged with the two protrusions 43 of the two main pipe parts 41M from the lateral direction (Y direction), and the vertical portion 42b of the L-shaped connector 42 is brought into contact with the side surfaces (outer surfaces of the side walls 41c) of the two main pipe parts 41M.

[0080] After the vertical portion 42b contacts the side surfaces of the two main pipe parts 41M, two screws 44 as fasteners are inserted from the two screw insertion holes 42H provided in the vertical portion 42b and screwed into the screw holes 41H provided in the side walls 41c of the two main pipe parts 41M. Thus, the L-shaped connecting member 42 is fixed to the two main pipe parts 41M, and the two main pipe parts 41M are connected by the L-shaped connecting member 42 ( Fig. 9C ).

[0081] As described above, two main duct parts 41M connected in the X direction correspond to one component mounting device 3, and the sub duct part 41S is provided between the two connected main duct parts 41M (for convenience, referred to as a "main duct unit").

[0082] exist Fig. 10A as well as Fig. 10B In the embodiment, the sub-duct part 41S has an extension 41E at one end. The other end of the sub-duct part 41S is the same as the end of the main duct part 41M and can be connected to the main duct part 41M by the aforementioned L-shaped connector 42 and screw 44 ( Fig. 10B → Fig. 10C ).

[0083] Thus, in this embodiment, the L-shaped connector 42 connects two adjacent duct parts 41 (main duct parts 41M or main duct part 41M and sub-duct part 41S) in a state where the ends thereof are butted against each other. More specifically, the L-shaped connector 42 connects the two duct parts 41 in a state where the L-shaped connector 42 is in contact with the upper surface and the side surface of each of the two duct parts 41.

[0084] In this way, in the present embodiment, the two cutout grooves 42K formed in the portion (horizontal portion 42a) of the L-shaped connector 42 that contacts the upper surface of each of the two pipe parts 41 are engaged with the protrusions 43 that are provided to protrude upward from the upper surface of each of the two pipe parts 41 from the lateral direction. In addition, the vertical portion 42b of the L-shaped connector 42 is fastened to the side surfaces of the two pipe parts 41 by the screws 44 as fasteners.

[0085] The sub-pipe part 41S connected to the main pipe part 41M at one end is installed by inserting and fitting the extension part 41E formed at the other end into the other main pipe part 41M ( Fig.11A → Fig. 11B ). The sub-pipe part 41S is inserted and fitted into the main pipe part 41M, so the sub-pipe part 41S can slide freely in the X direction relative to the main pipe part 41M. Therefore, the interval between the two main pipe parts 41M located at both ends of the sub-pipe part 41S can be changed and the distance can be adjusted.

[0086] The socket-fitted auxiliary pipe part 41S is used with the main pipe part 41M. Fig. 11B as well as Fig. 11C The flat plate type connector 45 is connected to the side surfaces of two adjacent duct parts 41 (main duct part 41M and sub duct part 41S) by screws 44 as fasteners in a state of being in contact with the side surfaces of the two duct parts 41 (main duct part 41M and sub duct part 41S).

[0087] like Fig. 11B As shown, the flat-plate connector 45 has two screw insertion holes 45H arranged in the upper and lower parts and two long holes 45N arranged in the upper and lower parts and extending in the X direction. The screws 44 inserted from the two screw insertion holes 45H and the screws 44 inserted from the two long holes 45N are respectively screwed into the screw holes 41H provided on the side of the main pipe part 41M, so that they can be fixed to the sub-pipe part 41S and the main pipe part 41M, thereby connecting the sub-pipe part 41S to the main pipe part 41M ( Fig. 11C ).

[0088] As described above, in this embodiment, the connectors (L-shaped connector 42 and flat connector 45 ) that connect two adjacent duct parts 41 connect the two duct parts 41 in a state of being in contact with the upper surfaces or side surfaces of the two adjacent duct parts 41 .

[0089] exist Figure 3 , Figure 4 , Figure 5 as well as Figure 6In the embodiment, an air blower 51 is provided inside each sub-duct 32. The air blower 51 is composed of, for example, a tubular member extending in the X direction, and includes a plurality of air blower ports 51N arranged in the X direction.

[0090] exist Figure 6 , Fig. 8A as well as Figure 8B In the embodiment, each air blowing port 51N opens toward the direction of the chip inlet opening 41K of the main duct 31. Hereinafter, the air blower 51 disposed in the first duct 32A on the front side of the main duct 31 is referred to as the "first air blower 51A", and the air blower 51 disposed in the second duct 32B on the rear side of the main duct 31 is referred to as the "second air blower 51B" ( Figure 5 ).

[0091] exist Figure 4 In the embodiment, a plurality of first air blowers 51A located at the front side of the main duct 31 and arranged along the X direction are respectively connected to a first air supply path 52A extending in the X direction in front of the main duct 31. In addition, a plurality of second air blowers 51B located at the rear side of the main duct 31 and arranged along the X direction are respectively connected to a second air supply path 52B extending in the X direction behind the main duct 31.

[0092] exist Figure 3 , Figure 5 , Figure 6 , Fig. 8A as well as Figure 8B In the embodiment, a baffle 53 for opening and closing the chip inlet opening 41K is provided on the side wall 41c of the main pipe part 41M constituting the main pipe 31. The baffle 53 is composed of a rectangular flat plate-shaped member as a whole, and the upper edge is supported by the main pipe 31. Specifically, the upper edge of the baffle 53 is attached to the top plate surface (lower surface of the upper wall 41a) of the main pipe 31 by a hinge (baffle hinge 54) whose axis is oriented in the X direction (left-right direction) (see also Figure 7 ). Therefore, the baffle 53 is able to swing freely in a vertical plane (YZ plane) with the baffle hinge 54 as a fulcrum.

[0093] The two ends of each baffle 53 in the X direction are bent toward the side wall 41c of the main duct part 41M (i.e., the main duct 31). As a result, the two ends of the baffle 53 serve as air receiving portions 53T ( ) that receive air ejected from the air ejector 71 described later. Figure 6 , Figure 7 , Fig. 8A as well as Figure 8B ).

[0094] The baffles 53 are provided corresponding to the chip inlet openings 41K formed in the two side walls 41c of the main duct 31 that are opposite to each other in the Y direction. Therefore, the baffle 53 located at the front side and the baffle 53 located at the rear side are located in the main duct 31 so as to be opposite to each other in the Y direction. Hereinafter, the baffle 53 located at the front side of the main duct 31 and corresponding to the first duct 32A is referred to as the "first baffle 53A", and the baffle 53 located at the rear side of the main duct 31 and corresponding to the second duct 32B is referred to as the "second baffle 53B" ( Figure 5 ).

[0095] The chip recovery device 1 in this embodiment has the following structure: as the secondary duct 32, it has the first duct 32A and the second duct 32B at the position opposite to the main duct 31, and as the air blower 51, it has the first air blower 51A that moves the chips KZ received by the first duct 32A into the main duct 31, and the second air blower 51B that moves the chips KZ received by the second duct 32B into the main duct 31. In addition, it has the following structure: as the baffle 53, it has the first baffle 53A that opens and closes the chip entry opening 41K corresponding to the first duct 32A, and the second baffle 53B that opens and closes the chip entry opening 41K corresponding to the second duct 32B.

[0096] Each baffle 53 is able to swing freely with the baffle hinge 54 as a support axis, and is in a closed position ( Figure 6 , Figure 7 as well as Fig. 8A ) and the open position ( Figure 8B When the damper 53 is in the closed position, both ends of the damper 53 (the ends of the air receiving portion 53T) are in contact with the inner surface of the main duct 31 ( Figure 6 as well as Figure 7 ).

[0097] exist Figure 4 In the embodiment, the first air blower 51A ( Figure 5 ) and the second air blower 51B ( Figure 5 ) are connected to the control valve 61 via the air supply path 52. The control valve 61 is connected to an air generation source (not shown).

[0098] The operation of the control valve 61 is controlled by the management device 62 ( Figure 4) is controlled to supply the air generated by the air generation source to the first air supply path 52A or the second air supply path 52B. When the control valve 61 is used to supply air to the first air supply path 52A, the air from the plurality of first air blowers 51A ( Figure 5 ) respectively blow out air, and when air is supplied to the second air supply path 52B by the control valve 61, the plurality of second air blowers 51B ( Figure 5 ) to blow out the air separately.

[0099] When the air blower 51 is not blowing air, the baffle 53 is in a drooping position due to its own weight and is located in the closed position ( Fig. 8A When the air Air is blown out from the air blower 51 from this state, the damper 53 is pressed by the air Air and is located in the open position ( Fig. 8A → Figure 8B ), the chips KZ in the secondary pipe 32 move from the chip entry opening 41K into the main pipe 31 ( Figure 8B When the air blower 51 stops blowing the air Air, the baffle 53 returns to the hanging posture due to its own weight and returns to the closed position ( Figure 8B → Fig. 8A ).

[0100] Thus, in this embodiment, the baffle 53 is set to swing freely along the vertical plane (here is the YZ plane), and is located in the closed position to close the chip entry opening 41K when the air blower 51 is not blowing air, and is pressed by the air blown by the air blower 51 to open the chip entry opening 41K when the air blower 51 is blowing air.

[0101] exist Figure 4 as well as Figure 5 In the embodiment, a plurality of air ejectors 71 are provided in the main pipe 31. The plurality of air ejectors 71 are arranged in a straight line along the extension direction of the main pipe 31. In the present embodiment, the air ejectors 71 are provided in the sub-pipe part 41S (i.e., between the two main pipe units) ( Fig. 12A as well as Fig. 12B ).

[0102] Thus, in this embodiment, the air ejector 71 is provided for each main duct unit, that is, provided at a position that separates every two (or more) chip inlet openings 41K along the extending direction (X direction) of the main duct 31. Figure 5 ). It should be noted that the air ejector 71 is disposed between two main duct parts 41M constituting the main duct unit, and thus may be disposed for each main duct part 41M, or may be disposed for each of three or more main duct parts 41M.

[0103] exist Fig. 12Aas well as Fig. 12B In the embodiment, the air ejector 71 is composed of a tubular member extending in the Y direction, and has a plurality of air ejection ports 71N arranged in the Y direction. The air ejector 71 is provided at a position close to the top plate in the auxiliary duct part 41S, and the air ejection ports 71N are directed toward the air outlet 31D ( Figure 4 ) side diagonally downward (see also Fig.13A as well as Fig. 13B ).

[0104] exist Figure 4 In the embodiment, a plurality of air ejectors 71 are connected to an air supply pipe 71T extending in the X direction, and the air supply pipe 71T is connected to the control valve 61. When the management device 62 controls the control valve 61 and supplies air to each air ejector 71 through the air supply pipe 71T, air is ejected from its air ejection port 71N ( Fig. 13B ).

[0105] The management device 62 controls the plurality of air ejectors 71 so that air is ejected sequentially from the air ejector 71 located on the upstream side. As a result, air flows sequentially from the upstream side toward the downstream side (air outlet 31D) in the main duct 31, and the chips KZ moved from the sub-duct 32 to the main duct 31 are conveyed (conveyed sequentially) to the downstream side (air outlet 31D side) in a relay manner.

[0106] Thus, in the chip recovery device 1 of the present embodiment, a plurality of air ejectors 71 ejecting air into the main duct 31 are arranged in a straight line along the extension direction of the main duct 31, and these plurality of air ejectors 71 eject air sequentially, thereby sequentially conveying the chips KZ entering the main duct 31 from the secondary duct 32 to the air outlet 31D. Therefore, the ejection force of air required by each air ejector 71 can be the size required to convey the chips KZ to the position of the air ejector 71 located at the nearest downstream side, and the ejection force required to convey the chips KZ from the most upstream side of the main duct 31 to the most downstream side (air outlet 31D) at once is not required as in the past, so the operation cost can be reduced accordingly.

[0107] exist Fig. 12A , Fig. 12B , Fig.13A as well as Fig. 13B In the embodiment, a plurality of check valves 72 are provided in the main duct 31. The check valves 72 have a function of preventing the chips KZ in the main duct 31 from moving in a direction opposite to the ejection direction of the air Air ejected by the air ejector 71 (from the downstream side to the upstream side) as described later.

[0108] Each check valve 72 is provided at the downstream end of each auxiliary pipe part 41S ( Fig. 12A , Fig. 12B , Fig.13A as well as Fig. 13B ). The sub-pipe part 41S is provided between two main pipe units arranged in the X direction as described above, and the check valve 72 is located between two adjacent component assembly devices 3. Therefore, in the present embodiment, the check valve 72 is provided for each main pipe unit, that is, provided at a position separating the plurality of chip inlet openings 41K by two (or more) along the extension direction (X direction) of the main pipe 31 ( Figure 5 ). It should be noted that the check valve 72 can be provided for each main pipe part 41M or for each of three or more main pipe parts 41M by providing the air ejector 71 between the two main pipe parts 41M constituting the main pipe unit.

[0109] exist Fig. 10A , Fig. 12A as well as Fig. 12B In the embodiment, the upper edge of the check valve 72 is attached to the top plate surface (lower surface of the upper wall 41a) of the downstream end of the sub-duct part 41S via a hinge (valve hinge 72H). Therefore, the check valve 72 can swing along the vertical plane (XZ plane) and can move between a closed position hanging down due to its own weight and an open position swinging in a direction to move the lower end toward the downstream side (air outlet 31D side).

[0110] Even if the check valve 72 is to be swung from the closed position in a direction in which the lower end moves to the upstream side (the side opposite to the air outlet 31D), the check valve 72 is prevented from swinging due to the stopper 41P ( Fig. 12B ) abuts and cannot move (maintains the state of being in the closed position). In this way, the check valve 72 becomes a structure that can only swing in the direction that moves the lower end to the downstream side.

[0111] The check valve 72 is provided at a position downstream of the air ejector 71 provided in the sub-duct component 41S to which the check valve 72 is installed. When the air Air is ejected from the air ejector 71 on the nearest upstream side, the check valve 72 is pressed toward the downstream side by the air Air, and swings from the closed position in a direction in which the lower end moves toward the downstream side to be located at the open position, thereby making the position (the position where the check valve 72 is provided) in the main duct 31 an open state ( Fig.13A → Fig. 13B ). Then, the chips KZ in the auxiliary duct part 41S are moved to the downstream side through the check valve 72 by the air Air ejected from the air ejector 71 ( Fig. 13B ).

[0112] On the other hand, the check valve 72 is maintained in a closed position when the air ejector 71 located on the nearest upstream side does not eject air and the air ejected from the air ejector 51 in the nearest downstream side sub-pipe 32 flows to the upstream side through the chip inlet opening 41K corresponding to the sub-pipe 32. Therefore, the chips KZ moved from the sub-pipe 32 to the main pipe 31 by the air ejector 51 located on the downstream side ejecting air will not move to the upstream side thereof through the check valve 72.

[0113] Thus, in this embodiment, the check valve 72 allows the chips KZ in the main pipe 31 to pass to the downstream side under the action of the air ejected by the air ejector 71 when it is in the open position, and prevents the chips KZ in the main pipe 31 from moving in the direction opposite to the ejection direction of the air ejected by the air ejector 71.

[0114] exist Fig.14A as well as Fig. 14B In the embodiment, the storage section 33 includes a belt conveyor 91. The belt conveyor 91 includes a pair of frames 92 arranged opposite to each other in the X direction, a plurality of pulleys (a driving pulley 93K and a plurality of driven pulleys 93J) supported by the pair of frames 92 so as to be rotatable, and a conveying belt 94 mounted on the plurality of pulleys. On the surface of the conveying belt 94, partition members 95 extending in the width direction of the conveying belt 94 are formed at regular intervals.

[0115] exist Fig.14A as well as Fig. 14B In the embodiment, a drive motor 96 is mounted on a frame 92 on one side of the belt conveyor 91. When the drive motor 96 rotates the drive pulley 93K via the drive belt 97, the conveying belt 94 moves. A pair of belt guides 98 are provided on the frame 92, and the conveying belt 94 moves along a predetermined path by being guided at both ends by the pair of belt guides 98. The operation of the drive motor 96 is controlled by the management device 62.

[0116] The conveying area where the conveyor belt 91 is used for conveying is as follows: Fig. 14B As shown, the conveyor belt 94 is composed of a discharge area R1 extending substantially horizontally in the front-rear direction, a rising area R2 connected to the discharge area R1 and directed obliquely upward, and a discarding area R3 connected to the rising area R2 and extending substantially horizontally in the Y direction. When the driving pulley 93K is driven to rotate by the driving motor 96, the conveying belt 94 moves in the three areas in the order of the discharge area R1 → the rising area R2 → the discarding area R3.

[0117] exist Figure 4 In the embodiment, the belt conveyor 91 is arranged so that the discharge area R1 of the conveying belt 94 is located directly below the air outlet 31D. Figure 4 , Fig.14A as well as Fig. 14B As shown, a chip passage 99 is provided below the discarding region R3 of the conveyor belt 94, and a storage box 100 is provided below the chip passage 99. The storage box 100 is composed of a box-shaped member opened upward.

[0118] Next, the recovery operation of the chips KZ performed by the chip recovery device 1 is described. As described above, the chips KZ of the carrier 18 discharged by the feeder carriage 15 of each component assembly device 3 are discharged downward through the chute 25. The chips KZ discharged downward through the chute 25 are received by the secondary duct 32 through the chip receiving opening 32K formed in the secondary duct 32 ( Figure 3 as well as Fig. 8A ).

[0119] While the component assembly device 3 constituting the work line 2 is performing the component assembly operation, the chip recovery device 1 performs the chip recovery operation at regular intervals. In the recovery operation, first, the management device 62 operates the control valve 61, so that air is blown out from all the first air blowers 51A for a certain period of time (several seconds or so) ( Figure 8B ). As a result, all the first baffles 53A swing from the closed position to the open position, and the chips KZ in the primary duct 32A move from the corresponding front chip inlet opening 41K into the main duct 31 ( Fig.15A ). When the first air blower 51A finishes blowing air, the first damper 53A returns to the closed position due to its own weight.

[0120] After the first damper 53A is in the closed position, the management device 62 blows air from all the second air blowers 51B for a certain period of time ( Fig. 15B ). As a result, all the second baffles 53B swing from the closed position to the open position, and the chips KZ in the secondary duct 32B move from the corresponding rear chip entry opening 41K into the main duct 31 ( Fig. 15B ). When the second air blower 51B finishes blowing air, the second damper 53B returns to the closed position due to its own weight.

[0121] Here, the baffle 53 (the first baffle 53A and the second baffle 53B) for opening and closing the chip inlet opening 41K is mounted on the main duct 31 by the upper edge so as to be freely swingable along the vertical plane (YZ plane), and when it is in the open position by being pressed by the air blown from the air blower 51, its lower edge is moved in a direction (upward) away from the bottom surface (the upper surface of the lower wall 41b of the duct part 41) in the main duct 31. Therefore, the baffle 53 moved to the open position side does not bite the chips KZ between the lower edge and the bottom surface in the main duct 31, and the situation that the baffle 53 cannot be opened and closed due to the biting of the chips KZ is prevented.

[0122] After the second damper 53B is in the closed position, the management device 62 then ejects air from the plurality of air ejectors 71 through the air supply pipe 71T. At this time, the plurality of air ejectors 71 arranged in series in the main duct 31 eject air in sequence at regular intervals toward the downstream side (the air outlet 31D side). Fig. 15C → Fig.16A → Fig. 16B → Fig. 16C As a result, an air flow in the direction of the air outlet 31D is formed in the main duct 31, and the chips KZ moved from each sub-duct 32 to the main duct 31 are conveyed to the downstream side (the air outlet 31D side) in a relay manner under the action of the air flow (pressure). Fig. 16C ).

[0123] While each component assembly device 3 constituting the work line 2 is performing the component assembly operation, the management device 62 repeatedly performs the above-mentioned operation ( Fig.15A → Fig. 15B →… Fig. 16C ). Thus, the chips KZ dropped from the tape feeders 16 of the component assembly devices 3 into the secondary duct 32 move to the main duct 31 at regular intervals, move to the downstream side of the main duct 31, and are discharged to the outside of the main duct 31 from the air outlet 31D.

[0124] In the chip recovery device 1 of the present embodiment, each baffle 53 is located in the closed position ( Figure 6 , Figure 7 as well as Fig. 8A Therefore, when one air ejector 71 ejects air, all the dampers 53 located on the downstream side of the air ejector 71 are in the closed position. However, when the air Air ejected from the air ejector 51 hits the air receiving portion 53T formed at both ends of the damper 53, a force acts on the damper 53 toward the closed position ( Figure 7 As shown by the arrow P in FIG), the baffle 53 is reliably located in the closed position. Thus, during the period when the air is ejected from the air ejector 71, the baffle 53 can reliably close each chip entry opening 41K, and the chips KZ in the main pipe 31 can be prevented from flowing back into the secondary pipe 32.

[0125] It should be noted that the bent portions at both ends of the baffle 53 here become the air receiving portion 53T, but it may also be as follows Fig.17 as well as Fig.18As in the other example shown in the figure, a mountain-shaped extension member 53H having a pair of inclined portions obliquely intersecting in the X direction is provided on the surface of the flat damper 53 (the surface on the main duct 31 side), and the inclined portion of the extension member 53H functions as an air receiving portion 53T. Even with this structure, when the air Air blown out from the air blower 51 hits the air receiving portion 53T, a force is applied to the damper 53 toward the closed position ( Fig.18 Therefore, during the period when the air is ejected from the air ejector 71, each chip inlet opening 41K is reliably closed by the baffle plate 53, and the same effect can be obtained.

[0126] In the present embodiment, as described above, the first baffle 53A and the second baffle 53B, which are opposite to each other across the main duct 31, are located in the open position at a time offset. That is, the time when the first air blower 51A blows out air does not overlap with the time when the second air blower 51B blows out air. Therefore, interference will not occur due to the two opposing baffles 53 (the first baffle 53A and the second baffle 53B) being located in the open position at the same time, and damage to the baffle 53 can be prevented. In addition, it is also possible to prevent the chips KZ from returning to the secondary duct 32 under the action of the air blown out by the two opposing air blowers 51 (the first air blower 51A and the second air blower 51B).

[0127] After the chips KZ are moved in relay fashion in the main duct 31 by the plurality of air ejectors 71 and reach the air outlet 31D, the chips KZ fall downward from the air outlet 31D. As a result, the chips KZ are discharged to the discharge area R1 on the conveyor belt 94 of the storage section 33 located below the air outlet 31D ( Fig.19A ).

[0128] After the chips KZ in the main duct 31 are discharged onto the conveyor belt 94 of the storage section 33, the management device 62 operates the drive motor 96 of the storage section 33 to move the conveyor belt 94. As a result, the chips KZ discharged to the discharge area R1 of the conveyor belt 94 are transported in the ascending direction in the ascending area R2 ( Fig.19B and transported to the discard area R3 ( Fig.19C As described above, the surface of the conveyor belt 94 is provided with a partition member 95 extending in the width direction of the conveyor belt 94, so that the chips KZ will not be separated (fall) from the conveyor belt 94 even in the rising area R2 and can be reliably transported to the discarding area R3.

[0129] The chips KZ transported to the discarding area R3 are then discarded downward from the end of the discarding area R3. The chips KZ discarded from the end of the discarding area R3 fall through the chip passage 99 located directly below it and are stored in the storage box 100. Therefore, the chips KZ recovered through the two main pipes 31 in front and behind are finally stored in one storage box 100. After the chips KZ are stored in the storage box 100, the operator removes the storage box 100 from the storage part 33, and after processing the chips KZ at a specified place, returns the storage box 100 to its original position. Thus, a series of chip recovery operations are completed.

[0130] Next, the execution steps (installation method) of the installation operation of the chip recovery device 1 in this embodiment are described. When the chip recovery device 1 is installed below the work line 2 in which the component assembly devices 3 are arranged in one direction, first, a plurality of pipe parts 41 are respectively inserted below the component assembly device 3 (work line 2) (insertion process). Fig. 20A → Fig. 20B After the plurality of duct parts 41 are inserted below the component assembly device 3 , adjacent duct parts among the inserted plurality of duct parts 41 are connected to each other using connectors (L-shaped connector 42 and flat connector 45 ) (connection step).

[0131] In the connection process, first, two adjacent main pipe parts 41M are connected using an L-shaped connection piece 42 ( Fig. 20C , Fig. 9B → Fig. 9C ), and use the L-shaped connector 42 to connect the sub-duct part 41S to the two connected main duct parts 41M (main duct unit) ( Fig. 10B → Fig. 10C Then, the extension portion 41E of the connected sub-pipe part 41S is socket-fitted with another main pipe unit similarly connected to the sub-pipe part 41S ( Fig.11A ), and changing the length of the fitting portion between the main pipe part 41M and the sub-pipe part 41S, thereby adjusting the distance between the two main pipe parts 41M arranged across the sub-pipe part 41S (the distance between the two main pipe units) ( Fig.21A Then, the socket-fitted secondary pipe part 41S is connected to the main pipe part 41M using the flat-plate connector 45 ( Fig. 21B , Fig. 11B → Fig. 11C ).

[0132] Thus, in the setting operation (setting method) of the chip recovery device 1 in the present embodiment, in the connection process, after the distance between the two pipe parts 41 (main pipe part 41M) arranged with the pipe part 41 for distance adjustment (i.e., the sub-pipe part 41S) separated by the pipe part 41 (i.e., the sub-pipe part 41S) is adjusted, the sub-pipe part 41S is connected to the main pipe part 41M.

[0133] After the adjacent main conduit parts 41M are connected to each other in the above-mentioned connection step, the sub-conduit 32 is attached to each main conduit part 41M (sub-conduit attachment step). Fig. 21C ), the receiving portion 33 is provided on the air outlet 31D side of the main duct 31 (receiving portion providing step). Thus, the installation work of the chip recovery device 1 is completed.

[0134] Thus, in this embodiment, when the main pipe 31 formed by connecting multiple pipe parts 41 in a straight line along the extension direction (X direction) of the operation line 2 is set below the operation line 2, after the multiple pipe parts 41 are respectively inserted below the component assembly device 3 (insertion process), the adjacent pipe parts among the multiple pipe parts 41 inserted below the component assembly device 3 are connected to each other using connecting parts (L-shaped connecting parts 42 and flat-plate connecting parts 45) (connection process).

[0135] Therefore, when the main pipe 31 is set below the work line 2 as in the past, it is not necessary to perform a large-scale operation such as pressing and inserting from the end of the upstream side or downstream side of the work line 2 in the extension direction (X direction) of the work line 2 in a state where a plurality of pipe parts 41 corresponding to all or part of the main pipe 31 are pre-connected. Therefore, it is not necessary to occupy a large work space for the installation operation of the main pipe 31, and the operation can be performed with a small number of people, and the operation time required for the installation can be greatly shortened. In addition, since the pipe parts 41 include the pipe parts 41 for distance adjustment (sub-pipe parts 41S) for adjusting the distance between the other two pipe parts 41 located at both ends, the distance between adjacent pipe parts 41 (main pipe parts 41M) can be easily adjusted in the connection process.

[0136] It should be noted that in the above embodiment, there is only one main pipeline 31, but Fig. 22 As shown, when the main pipe 31 is composed of two main pipes 31, namely a first main pipe 31A and a second main pipe 31B extending parallel to each other, in the insertion process of inserting a plurality of pipe parts 41 respectively downward of the component assembly device 3, the plurality of pipe parts 41 constituting the first main pipe 31A and the plurality of pipe parts 41 constituting the second main pipe 31B are respectively inserted downward of the component assembly device 3 from both sides opposite to each other (opposite in the Y direction) across the operation line 2.

[0137] As described above, in the chip recovery device 1 of the present embodiment, a plurality of air ejectors 71 ejecting air into the main duct 31 are arranged in a straight line along the extension direction of the main duct 31, and these plurality of air ejectors 71 eject air Air in sequence, and sequentially convey the chips KZ intruding from the secondary duct 32 into the main duct 31 to the air outlet 31D. Therefore, the ejection force of air required by each air ejector 71 can be a size required to convey the chips KZ to the position of the air ejector 71 located at the nearest downstream side, and the ejection force required to convey the chips KZ from the most upstream side of the main duct 31 to the most downstream side (air outlet 31D) at once is not required as in the past, so the operation cost of the chip recovery device 1 can be reduced accordingly.

[0138] The embodiments of the present invention have been described so far, but the present invention is not limited to the above-mentioned embodiments and can be variously modified. For example, in the above-mentioned embodiment, the storage section 33 is a structure in which the chips KZ discharged from the outlet (air outlet 31D) of the main duct 31 are transported by the belt conveyor 91 and discharged to the storage box 100, but the storage box 100 can also be set below the air outlet 31D without using the belt conveyor 91.

[0139] In the above-mentioned embodiment, in the chip recovery operation of the chip recovery device 1, the following steps are performed: after blowing air from all the first air blowers 51A for a certain period of time ( Fig.15A ), and then blow air from all the second air blowers 51B for a certain period of time ( Fig. 15B ), and then the plurality of air ejectors 71 eject air in sequence from the upstream side to the downstream side at regular intervals ( Fig. 15C → Fig.16A → Fig. 16B → Fig. 16C ), but this is just an example, and the chip KZ recovery action can also be other steps. For example, instead of the above-mentioned step of "all first air blowers 51A blow out air at the same time → all second air blowers 51B blow out air at the same time → multiple air blowers 71 blow out air in sequence from the upstream side to the downstream side", it can also be a step in which the action consisting of "the first air blower 51A blows out air → the second air blower 51B opposite to it blows out air → the air blower 71 immediately upstream of these first air blowers 51A and the second air blowers 51B blows out air" is performed in sequence from the upstream side to the downstream side ( Fig.23A → Fig. 23B → Fig.23C → Fig.24A → Fig. 24B → Fig.24C →…), etc.

[0140] Industrial Applicability

[0141] Provided are a chip recovery device and a chip recovery method capable of reliably conveying chips of a belt member in a main duct to an air outlet of the main duct.

[0142] Description of Reference Numerals

[0143] 1 Chip recovery device

[0144] 2 Operation lines

[0145] 3. Component assembly device

[0146] 16 With feeder

[0147] 18 Carrier tape (with components)

[0148] 31 Main pipeline

[0149] 31A First main pipeline

[0150] 31B Second main pipeline

[0151] 31D Air outlet

[0152] 32 pipelines

[0153] 32A First Pipeline

[0154] 32B Second pipeline

[0155] 32K Chip receiving opening

[0156] 41K Chip entry opening

[0157] 51 Air blower

[0158] 51A First air blower

[0159] 51B Second air blower

[0160] 52A First air supply line

[0161] 52B Second air supply line

[0162] 53 Baffle

[0163] 53A First baffle

[0164] 53B Second baffle

[0165] 53T Air receiving part

[0166] 71 Air ejector

[0167] 72 Check valve

[0168] Air

[0169] KZ Chips

[0170] BH Parts

[0171] KB substrate.

Claims

1. A chip recovery device, wherein: The chip recovery device comprises: a secondary duct that receives, from a chip receiving opening, chips of the tape member discharged from a tape feeder provided in the component assembly device; a primary conduit connected to the secondary conduit through a chip inlet opening; and a plurality of air ejectors for ejecting air into the main duct to transport the chips moving from the secondary duct into the main duct through the chip inlet opening to the air outlet side of the main duct, The plurality of air ejectors are arranged in series along an extending direction of the main duct, and the plurality of air ejectors eject air in sequence to sequentially transport the chips entering the main duct from the secondary duct to the air outlet side.

2. The chip recovery device according to claim 1, wherein: Each of the plurality of air ejectors ejects air in an obliquely downward direction toward the air outlet side of the main duct.

3. The chip recovery device according to claim 1 or 2, wherein: The plurality of chip inlet openings are each the chip inlet openings, the plurality of chip inlet openings are arranged along the extending direction of the main duct, and the plurality of air ejectors are arranged at positions separating each or each plurality of the plurality of chip inlet openings.

4. The chip recovery device according to claim 1, wherein: The main duct is extended along the work line below a work line in which a plurality of component assembly devices, each of which is the component assembly device, are arranged in one direction, and each of the plurality of air ejectors is located between two adjacent component assembly devices among the plurality of component assembly devices.

5. The chip recovery device according to claim 1, wherein: The chip recovery device further includes a check valve that prevents the chips in the main duct from moving in a direction opposite to a direction in which the air is ejected from the plurality of air ejectors.

6. The chip recovery device according to claim 5, wherein: The check valve swings in a vertical plane and is movable between a closed position and an open position, and when located at the open position, allows the chips in the main duct to pass toward the downstream side under the action of the air ejected by the plurality of air ejectors.

7. The chip recovery device according to claim 6, wherein: The upper edge of the check valve is supported by the main pipe, and the check valve is movable between the closed position where the check valve hangs down due to its own weight and the open position where the check valve is pressed and swung by the air ejected from the plurality of air ejectors.

8. The chip recovery device according to any one of claims 5 to 7, wherein: A plurality of chip inlet openings are each the chip inlet opening, the plurality of chip inlet openings are arranged along the extending direction of the main pipe, and the check valve is arranged at a position separating each or each plurality of the plurality of chip inlet openings.

9. The chip recovery device according to claim 8, wherein: The main pipe is extended in the one direction below a work line in which a plurality of component assembling devices, each of which is the component assembling device, are arranged in the one direction, and the check valve is located between two adjacent component assembling devices among the plurality of component assembling devices.

10. A chip recovery method, which is a chip recovery method performed by a chip recovery device, the chip recovery device comprising: a secondary duct that receives chips of a belt component discharged from a belt feeder provided in a component assembly device through a chip receiving opening; a main duct that is connected to the secondary duct through a chip inlet opening; and a plurality of air ejectors that eject air into the main duct to transport the chips that have moved from the secondary duct into the main duct through the chip inlet opening toward an air outlet side of the main duct, the plurality of air ejectors being arranged in a straight line along an extension direction of the main duct, in, The plurality of air ejectors eject air respectively to sequentially transport the chips that have entered the main duct from the chip inlet opening to the air outlet side.

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