Method, device and equipment for cutting printed material after printing based on etching

Abstract

The invention discloses a post-printing printed material cutting method, device and equipment based on etching, and relates to the technical field of laser etching and ink-jet printing. The method comprises the following steps: acquiring an image of a printing stock subjected to laser etching and ink-jet printing through an image acquisition module to obtain a first image, and acquiring first position information of a cutting line of the printing stock according to the first image; the laser etching module is controlled to move above the printing platform according to a preset movement track determined by the first position information; acquiring second position information of the laser etching module according to a grating ruler on the printing platform; and when the second position information is matched with the first position information, the laser etching module is controlled to emit laser beams to cut the printing stock. According to the method, the image acquisition module and the printing platform grating ruler are combined to realize automatic and accurate cutting of the etched and printed image, so that the cutting positioning is more accurate and efficient, the problem of product scrapping caused by inaccurate cutting is effectively avoided, and the production efficiency is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of laser etching and inkjet printing, and in particular to a method, device and equipment for cutting printed matter after printing based on etching. Background Art

[0002] Inkjet printing technology is a printing technology that uses a nozzle to spray ink onto paper or other printing materials to form patterns, texts or pictures. Inkjet printing technology has the characteristics of fast printing speed, low printing cost and good printing quality. Inkjet printing technology is widely used in various fields, such as electronics, aviation, medical, etc. However, due to factors such as the unevenness and smoothness of the material surface, problems such as printing position offset and unstable ink flow often occur during inkjet printing, which affects the printing accuracy and printing quality. In order to solve these problems, the industry has proposed a method of laser etching before inkjet printing, that is, first use laser etching technology to etch out the image, so that the surface of the substrate is uneven to form a certain roughness, which helps the ink to form a better adhesion with the surface of the substrate. Subsequently, inkjet printing is performed on the basis of the etched image to make the printing effect more solid, thereby improving the quality and stability of the printing. After etching and inkjet printing are completed, the substrate can often be cut by laser to obtain a final product of a preset shape. However, when cutting the product, if the cutting positioning is inaccurate, it will affect the product quality and even cause the product to be scrapped, affecting production efficiency and causing waste. Summary of the invention

[0003] In view of this, the embodiments of the present invention provide a method, device and equipment for cutting printed matter after printing based on etching, so as to solve the problem in the prior art that inaccurate cutting positioning affects product quality.

[0004] In a first aspect, an embodiment of the present invention provides a method for cutting printed materials after printing based on etching, wherein a laser etching module and an image acquisition module are integrated on an inkjet printing device, and the laser etching module is used to etch and cut the printed materials on the printing platform, and the method comprises:

[0005] Controlling the image acquisition module to acquire an image of the substrate that has completed laser etching and inkjet printing, which is recorded as a first image;

[0006] Acquire a cutting line of the substrate and first position information thereof relative to the printing platform according to the first image;

[0007] determining a preset motion trajectory according to the first position information;

[0008] Controlling the laser etching module to move above the printing platform according to the preset motion trajectory;

[0009] Acquire second position information of the laser etching module according to the grating ruler on the printing platform;

[0010] When the second position information matches the first position information, the laser etching module is controlled to emit a laser beam to cut the substrate.

[0011] Preferably, the image acquisition module is controlled to acquire an image of the substrate that has been laser etched and inkjet printed, which is recorded as a first image and includes:

[0012] Adjusting the height of the image acquisition module relative to the printing platform so that the acquisition range of the image acquisition module can completely cover the printing platform, wherein a first preset origin is marked on the printing platform;

[0013] The image acquisition module is controlled to acquire images of the printing platform and the substrate placed thereon that has completed laser etching and inkjet printing, so as to obtain the first image.

[0014] Preferably, the image acquisition module is controlled to acquire an image of the substrate that has been laser etched and inkjet printed, which is recorded as a first image and includes:

[0015] Adjusting the height of the image acquisition module relative to the printing platform so that the acquisition range of the image acquisition module can at least completely cover the substrate, wherein a second preset origin is marked on the edge of the substrate;

[0016] The image acquisition module is controlled to acquire an image of the substrate to obtain the first image.

[0017] Preferably, acquiring the substrate cutting line and the first position information thereof relative to the printing platform according to the first image comprises:

[0018] Extracting a printing platform image, a printing image contour and a substrate contour according to the first image;

[0019] A two-dimensional rectangular coordinate system is established with a point corresponding to the first preset origin in the printing platform image as a coordinate origin, which is recorded as a first coordinate system;

[0020] Determine a substrate cutting line according to the printed image contour and the substrate edge contour;

[0021] The first position information is obtained by acquiring coordinate information of the cutting line of the substrate in the first coordinate system.

[0022] Preferably, acquiring the substrate cutting line and the first position information thereof relative to the printing platform according to the first image comprises:

[0023] Extracting a printed image contour and a printed object contour according to the first image;

[0024] Determine a substrate cutting line according to the printed image contour and the substrate edge contour;

[0025] A two-dimensional rectangular coordinate system is established with the point corresponding to the second preset origin in the outline of the substrate as the coordinate origin, which is recorded as the second coordinate system;

[0026] Acquire the coordinate information of the cutting line of the substrate in the second coordinate system to obtain third position information;

[0027] The first position information is acquired according to the position information of the second preset origin on the printing platform and the third position information.

[0028] Preferably, determining the substrate cutting line according to the printed image contour and the substrate edge contour comprises:

[0029] Determine the cutting line of the substrate according to external input information;

[0030] Determine whether the substrate cutting line inclusion range covers the print image outline and is within the substrate outline;

[0031] If so, determining the substrate cutting line according to the external input information;

[0032] If not, determining whether the cutting line contour of the substrate is within the printed image contour;

[0033] If yes, determining the substrate cutting line according to the printed image rim;

[0034] If not, determining whether the outline of the substrate cutting line is outside the outline of the substrate;

[0035] If yes, the substrate cutting line is determined according to the substrate contour.

[0036] Preferably, the substrate is any one, two or more of glass, crystal, metal, plastic and stone.

[0037] In a second aspect, an embodiment of the present invention provides a post-printing substrate cutting device based on etching, wherein a laser etching module and an image acquisition module are integrated on an inkjet printing device, wherein the laser etching module is used to etch and cut the substrate on the printing platform, and the device comprises:

[0038] The acquisition module is used to control the image acquisition module to acquire an image of the substrate that has been laser etched and inkjet printed, which is recorded as a first image;

[0039] A first position information acquisition module, used for acquiring a cutting line of the substrate and first position information thereof relative to the printing platform according to the first image;

[0040] A determination module, configured to determine a preset motion trajectory according to the first position information;

[0041] A moving module, used for controlling the laser etching module to move above the printing platform according to the preset motion trajectory;

[0042] A second position information acquisition module, used to acquire second position information of the laser etching module according to the grating ruler on the printing platform;

[0043] The cutting module is used to control the laser etching module to emit a laser beam to cut the substrate when the second position information matches the first position information.

[0044] In a third aspect, an embodiment of the present invention provides an etching-based post-printing substrate cutting device, comprising: at least one processor, at least one memory, and computer program instructions stored in the memory, and when the computer program instructions are executed by the processor, the method of the first aspect in the above embodiment is implemented.

[0045] In a fourth aspect, an embodiment of the present invention provides a storage medium having computer program instructions stored thereon, which implements the method of the first aspect in the above-mentioned embodiment when the computer program instructions are executed by a processor.

[0046] In summary, the beneficial effects of the present invention are as follows:

[0047] The etching-based post-printing substrate cutting method, device and equipment provided by the embodiment of the present invention acquires the image of the substrate that has completed laser etching and inkjet printing by an image acquisition module to obtain a first image, obtains the first position information of the substrate cutting line according to the first image; controls the laser etching module to move above the printing platform according to the preset motion trajectory determined by the first position information; obtains the second position information of the laser etching module according to the grating ruler on the printing platform; when the second position information matches the first position information, controls the laser etching module to emit a laser beam to cut the substrate. The method of the present invention utilizes the combination of the image acquisition module and the printing platform grating ruler to realize automatic and accurate cutting of the image after laser etching and inkjet printing, making the cutting positioning more accurate and efficient, effectively avoiding the problem of product scrapping caused by inaccurate cutting, and greatly improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0049] Figure 1 Schematic diagram of the structure of the laser etching inkjet printing system according to an embodiment of the present invention.

[0050] Figure 2 It is a schematic flow chart of a method for cutting printed matter after printing based on etching according to an embodiment of the present invention.

[0051] Figure 3 Schematic diagram of a substrate cutting line according to an embodiment of the present invention.

[0052] Figure 4 is a schematic diagram of a first image according to an embodiment of the present invention.

[0053] Figure 5 It is a schematic structural diagram of a post-printing substrate cutting device based on etching according to an embodiment of the present invention.

[0054] Figure 6 It is a schematic structural diagram of a post-printing substrate cutting device based on etching according to an embodiment of the present invention. DETAILED DESCRIPTION

[0055] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and Examples. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0056] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0057] Embodiment 1

[0058] The embodiment of the present invention provides a method for cutting printed matter after printing based on etching, which is applied to an inkjet printing system integrated with a laser etching module, hereinafter referred to as a laser etching inkjet printing system. Figure 1 As shown, the system includes a laser etching module 13 and an inkjet printing module 11, and also includes an image acquisition module 12, which can be a CCD / CMOS monocular camera, a 3D vision camera, and the like. Figure 1 As shown, the laser etching module 13 etches a pattern by sending a laser beam to the etching area 6 on the surface of the substrate 2; the image acquisition module 12 is used to acquire the image of the printing platform 3 or the substrate 2 on the printing platform 3, and the inkjet printing module 11 is used to perform inkjet printing on the basis of the etching pattern. Figure 1 As shown, in the above embodiment of the present invention, the laser etching module 13, the image acquisition module 12 and the inkjet printing module 11 are all arranged on the crossbeam 5, and the laser etching module 13, the image acquisition module 12 and the inkjet printing module 13 can reciprocate along the X direction on the crossbeam 5, and the crossbeam can reciprocate along the Y direction. The motion control module (not shown) of the laser etching inkjet printing system can drive the laser etching module 13, the image acquisition module 12 and the inkjet printing module 11 to move respectively along the X direction and / or the Y direction so that the laser beam can be irradiated or the ink can be sprayed to any position in the substrate 2 on the printing platform 3. The laser etching inkjet printing system obtains the positioning information of the laser etching module 13 or the inkjet printing module through a grating ruler (not shown). In addition, the distance between the laser etching module 13, the image acquisition module 12 and the inkjet printing module 11 relative to the printing platform 3 in the direction perpendicular to the plane where the printing platform is located (i.e., the XY plane) can be freely adjusted, and the printing substrate 2 can be glass, crystal, metal, plastic (including PVC, ABS, acrylic, etc.), stone, etc.

[0059] Based on the above-mentioned laser etching inkjet printing system, laser etching and inkjet printing are performed on the substrate. After the final printed image is obtained, it may be necessary to cut the substrate with the printed image into a preset shape to obtain the final product. For example, the preset shape can be a rectangle, a circle, a star, a triangle, or the outline shape of the printed image, etc. In an embodiment of the present invention, a laser etching module in the laser etching inkjet printing system is used to send a more powerful laser to cut the substrate. In order to ensure accurate cutting, before cutting, it is necessary to determine the position information of the substrate cutting line on the substrate, and then cut according to the substrate cutting line position information.

[0060] See also Figure 2 The post-printing substrate cutting method based on etching specifically comprises the following steps:

[0061] S1: controlling the image acquisition module to acquire an image of the substrate that has been laser etched and inkjet printed, recorded as a first image;

[0062] S2: acquiring a cutting line of the substrate and first position information thereof relative to the printing platform according to the first image;

[0063] S3: determining a preset motion trajectory according to the first position information;

[0064] S4: controlling the laser etching module to move above the printing platform according to the preset motion trajectory;

[0065] S5: Acquiring second position information of the laser etching module according to the grating ruler on the printing platform;

[0066] S6: When the second position information matches the first position information, the laser etching module is controlled to emit a laser beam to cut the substrate.

[0067] Specifically, in order to ensure the accuracy of the laser cutting position, in an embodiment of the present invention, the image of the substrate is captured by controlling the image acquisition module. The substrate has been laser etched and inkjet printed. The captured electronic image is recorded as the first image. Then, the first image is processed to obtain a printed image (the image formed on the substrate after laser etching and inkjet printing is recorded as the printed image). The substrate cutting line is determined according to the shape, size and position of the printed image in the substrate, the shape of the final product preset by the user, etc. After determining the substrate cutting line, it is necessary to determine the position information of the substrate cutting line relative to the printing platform, which is recorded as the first position information. For example, Figure 3As shown, a substrate cutting line 22 is determined in the substrate 2, and the first position information of the cutting line relative to the printing platform is obtained. Specifically, the origin (zero point) of the grating ruler on the printing platform is used as the coordinate origin, a rectangular coordinate system is established, and the coordinate information of the substrate cutting line 22 in the rectangular coordinate system is determined. For example, the substrate cutting line 22 is divided into four line segments, namely, the upper, lower, left and right line segments. It can be known that the lower line segment 222 has a starting coordinate (X1, Y1) and an end coordinate (X2, Y1), the upper line segment 221 has a starting coordinate (X1, Y2) and an end coordinate (X2, Y2), the left line segment 223 has a starting coordinate (X1, Y1) and an end coordinate (X1, Y2), and the right line segment 224 has a starting coordinate (X2, Y1) and an end coordinate (X1, Y2).

[0068] After determining the first position information, the preset motion trajectory of the laser etching module is determined according to the first position information: illustratively, if it is necessary to start cutting from the lower line segment 222, and then cut along the right line segment, the upper line segment, and the left line segment, then the laser etching module is controlled to move from the origin to the position (0, Y1), and then move along the X direction to the position (X1, Y1) to reach the starting position of the cutting, and then move along the X direction from (X1, Y1) to the position (X2, Y1), and then move along the Y direction from (X2, Y1) to the position (X2, Y2), and then move along the X direction from (X2, Y2) to the position (X1, Y2), and then move along the Y direction from (X1, Y2) to (X1, Y1).

[0069] When performing laser etching or inkjet printing, the motion control module of the laser etching inkjet printing system controls the movement of the laser etching module or inkjet printing module on the printing platform, positions the laser etching module or inkjet printing module through the grating ruler (ruler) on the printing platform, and obtains the position information of the laser etching module or inkjet printing module relative to the printing platform in real time, thereby triggering the laser etching module or inkjet printing module to emit laser beams or spray ink droplets. In an embodiment of the present invention, in order to ensure accurate cutting of the substrate, the first position information of the substrate cutting line is obtained through the image acquisition module. Similarly, when laser cutting is performed, the laser etching module is positioned using the grating ruler on the printing platform. The laser etching module is provided with a grating ruler reading module. The grating ruler reading module reads the encoder signal on the grating ruler and converts it into position information of the laser etching module, which is recorded as the second position information. The second position information of the laser etching module also uses the origin (zero point) of the grating ruler on the printing platform as a reference point. When the second position information matches the first position information, it indicates that the current laser etching module is at the position of the substrate cutting line. Therefore, the laser etching module is controlled to emit a laser beam to the substrate to cut the substrate.

[0070] In order to realize the automation and intelligence of the laser etching inkjet printing system, in an embodiment of the present invention, the positioning of the substrate cutting line is performed by using an image acquisition module. In one embodiment, a preset origin (corresponding to the origin of the grating ruler) is marked on the printing platform, and the height of the image acquisition module relative to the printing platform is adjusted so that the acquisition range of the image acquisition module can cover the entire printing platform. At this time, the substrate cutting line and its first position information relative to the printing platform can be directly obtained based on the first image collected. Specifically, the obtaining of the substrate cutting line and its first position information relative to the printing platform based on the first image includes:

[0071] Extracting a printing platform image, a printing image contour and a substrate contour according to the first image;

[0072] A two-dimensional rectangular coordinate system is established with a point corresponding to the first preset origin in the printing platform image as a coordinate origin, which is recorded as a first coordinate system;

[0073] Determine a substrate cutting line according to the printed image contour and the substrate edge contour;

[0074] The first position information is obtained by acquiring coordinate information of the cutting line of the substrate in the first coordinate system.

[0075] Specifically, since the acquisition range of the image acquisition module is large enough to complete the acquisition of the entire printing plane, the first image can be directly used to determine the cutting line and the first position information of the cutting line relative to the printing platform. Figure 4, because the first preset origin is marked on the printing platform, and there is a point A (image) corresponding to the first preset origin on the first image, a rectangular coordinate system is established with the point A as the origin, which is recorded as the first coordinate system. The printing platform image 30, the printing image outline 60 and the substrate outline 20 are extracted from the first image 7 using image recognition processing technology. In one embodiment, the system automatically determines the substrate cutting line (image) based on the information of the printing image outline 60 and the substrate outline 20, as shown in the figure, the substrate cutting line 220. The area within the substrate cutting line needs to cover the printing image outline but be smaller than the substrate outline. In other embodiments, the user can also manually identify the substrate cutting line in the first image through a graphic user interface. After the substrate cutting line 220 is determined, the position information of the substrate cutting line 220 in the first coordinate system is obtained. For example, the substrate cutting line 220 is divided into four line segments: upper, lower, left and right. It can be known that the lower line segment 2220 has a starting coordinate (X10, Y10) and an end coordinate (X20, Y10), the upper line segment 2210 has a starting coordinate (X10, Y20) and an end coordinate (X20, Y20), the left line segment 2230 has a starting coordinate (X10, Y10) and an end coordinate (X10, Y20), and the right line segment 2240 has a starting coordinate (X20, Y10) and an end coordinate (X10, Y20). The actual first position information of the substrate cutting line relative to the printing platform is obtained according to the coordinate values ​​of the substrate cutting line in the first coordinate system.

[0076] In one embodiment, when the acquisition range of the image acquisition module is not sufficient to cover the entire printing platform, the first image corresponding to the substrate can be first acquired, and then the position of the substrate cutting line relative to the substrate can be obtained based on the first image, and then the position information of the substrate cutting line relative to the printing platform can be analyzed based on the placement information or position information of the substrate on the printing platform. Preferably, the first position information of the substrate cutting line relative to the printing platform can be obtained based on the first image, including:

[0077] Extracting a printed image contour and a printed object contour according to the first image;

[0078] Determine a substrate cutting line according to the printed image contour and the substrate edge contour;

[0079] A two-dimensional rectangular coordinate system is established with the point corresponding to the second preset origin in the outline of the substrate as the coordinate origin, which is recorded as the second coordinate system;

[0080] Acquire the coordinate information of the cutting line of the substrate in the second coordinate system to obtain third position information;

[0081] The first position information is acquired according to the position information of the second preset origin on the printing platform and the third position information.

[0082] Specifically, a second preset origin is marked on the edge of the substrate. Preferably, the point on the edge of the substrate closest to the origin of the grating ruler in the printing platform is selected as the second preset origin. The height of the image acquisition module relative to the printing platform is adjusted so that the acquisition range of the image acquisition module can cover the entire substrate and acquire the substrate image to obtain the first image. Because the first image only records the image of the substrate, the substrate contour (the image corresponding to the substrate edge) and the print image contour can be extracted according to the first image. Although the substrate cutting line and the position of the substrate cutting line relative to the second preset origin in the substrate edge can be determined according to the first image, the actual position information of the substrate cutting line relative to the printing platform cannot be directly obtained. Therefore, in an embodiment of the present invention, after the substrate cutting line and its relative position information in the substrate are obtained according to the first image, the position information of the substrate cutting line relative to the printing platform, that is, the first position information, is obtained according to the position information of the substrate relative to the printing platform. The method of obtaining the third position information of the substrate cutting line in the second coordinate system is similar to the method of obtaining the position information in the first coordinate system, which will not be repeated here. After obtaining the third position information, further obtain the position information of the second preset origin in the edge of the substrate relative to the printing platform, so as to obtain the first position information of the substrate cutting line actually relative to the printing platform. Exemplarily, if the coordinates of one point in the third position information corresponding to the substrate cutting line are (X100, Y100), and the position information of the second preset origin on the printing platform is (X0, Y0), then the position information corresponding to the point on the printing platform is (X100+X0, Y100+Y0).

[0083] In one embodiment, determining the substrate cutting line according to the printed image contour and the substrate edge contour comprises:

[0084] Determine the cutting line of the substrate according to external input information;

[0085] Determine whether the substrate cutting line inclusion range covers the print image outline and is within the substrate outline;

[0086] If so, determining the substrate cutting line according to the external input information;

[0087] If not, determining whether the cutting line contour of the substrate is within the printed image contour;

[0088] If yes, determining the substrate cutting line according to the printed image rim;

[0089] If not, determining whether the outline of the substrate cutting line is outside the outline of the substrate;

[0090] If yes, the substrate cutting line is determined according to the substrate contour.

[0091] After the first image is acquired, the first image can be processed and output to the human-computer interaction interface, so that the user can select the substrate cutting line. After the first image is processed, it can display the printed image and the substrate image, or only display the printed image outline and the substrate outline, and can provide the user with the size information of the printed image and the substrate image. The user can input the desired cutting line by means of input methods such as a mouse or a stylus. The system extracts the substrate cutting line according to the user input (external input). When the range included in the acquired substrate cutting line can completely cover the printed image outline and is within the substrate outline, the cutting line input by the user is used as the substrate cutting line. If the cutting line input by the user is within the printed image outline, considering that this will cause the printed image to be cut during actual cutting, the system automatically uses the printed image outline as the substrate cutting line to avoid actually cutting the printed image. If the cutting line input by the user is outside the substrate outline, the system automatically uses the substrate outline as the substrate cutting line.

[0092] After determining the substrate cutting line and its first position information relative to the printing platform, when performing laser cutting, the laser etching module is positioned using the grating ruler on the printing platform. The grating ruler reading module provided on the laser etching module reads the encoder signal on the grating ruler and converts it into the second position information of the laser etching module. When the second position information matches the first position information, it indicates that the current laser etching module is at the position of the substrate cutting line. Therefore, the laser etching module is controlled to emit a laser beam onto the substrate to cut the substrate.

[0093] In summary, the post-printing substrate cutting method based on etching of the above embodiment of the present invention acquires the image of the substrate that has completed laser etching and inkjet printing by means of an image acquisition module to obtain a first image, obtains the substrate cutting line and its first position information relative to the printing platform according to the first image; determines a preset motion trajectory according to the first position information; controls the laser etching module to move above the printing platform according to the preset motion trajectory; obtains the second position information of the laser etching module according to the grating ruler on the printing platform; and when the second position information matches the first position information, controls the laser etching module to emit a laser beam to cut the substrate. The method of the present invention utilizes a combination of an image acquisition module and a printing platform grating ruler to realize automatic and precise cutting of images after laser etching and inkjet printing, making cutting positioning more accurate and efficient, effectively avoiding the problem of product scrapping caused by inaccurate cutting, and greatly improving production efficiency.

[0094] Embodiment 2

[0095] See also Figure 5 The embodiment of the present invention provides a post-printing substrate cutting device 200 based on etching, and the device 200 includes:

[0096] The acquisition module 201 is used to control the image acquisition module to acquire an image of the substrate that has been laser etched and inkjet printed, which is recorded as a first image;

[0097] A first position information acquisition module 202, configured to acquire a substrate cutting line and first position information thereof relative to the printing platform according to the first image;

[0098] A determination module 203, configured to determine a preset motion trajectory according to the first position information;

[0099] A moving module 204, used to control the laser etching module to move above the printing platform according to the preset motion trajectory;

[0100] A second position information acquisition module 205, used to acquire second position information of the laser etching module according to the grating ruler on the printing platform;

[0101] The cutting module 206 is used to control the laser etching module to emit a laser beam to cut the substrate when the second position information matches the first position information.

[0102] Preferably, the acquisition module 201 includes:

[0103] A first adjustment unit, used for adjusting the height of the image acquisition module relative to the printing platform so that the acquisition range of the image acquisition module can completely cover the printing platform, wherein a first preset origin is marked on the printing platform;

[0104] The first control unit is used to control the image acquisition module to acquire images of the printing platform and the substrate placed thereon that has completed laser etching and inkjet printing, so as to obtain the first image.

[0105] Preferably, the acquisition module 201 includes:

[0106] A second adjustment unit, used for adjusting the height of the image acquisition module relative to the printing platform so that the acquisition range of the image acquisition module can at least completely cover the substrate, wherein a second preset origin is marked on the edge of the substrate;

[0107] The second control unit is used to control the image acquisition module to acquire the image of the substrate to obtain the first image.

[0108] Preferably, the first location information acquisition module 202 includes:

[0109] A first extraction unit, configured to extract a printing platform image, a printing image contour and a substrate contour according to the first image;

[0110] A first coordinate system acquisition unit, configured to establish a two-dimensional rectangular coordinate system with a point corresponding to the first preset origin in the printing platform image as a coordinate origin, which is recorded as a first coordinate system;

[0111] A first determining unit, configured to determine a substrate cutting line according to the printed image contour and the substrate edge contour;

[0112] The first position acquisition unit is used to acquire the coordinate information of the cutting line of the substrate in the first coordinate system to obtain the first position information.

[0113] Preferably, the first location information acquisition module 202 includes:

[0114] A second extraction unit, used for extracting a printed image contour and a substrate contour according to the first image;

[0115] A second determining unit, configured to determine a substrate cutting line according to the printed image contour and the substrate edge contour;

[0116] A second coordinate system establishing unit, used for establishing a two-dimensional rectangular coordinate system with a point corresponding to the second preset origin in the outline of the substrate as a coordinate origin, which is recorded as the second coordinate system;

[0117] A third position information acquisition unit, used for acquiring coordinate information of the substrate cutting line in the second coordinate system to obtain third position information;

[0118] The second position acquisition unit is used to acquire the first position information according to the position information of the second preset origin on the printing platform and the third position information.

[0119] In summary, the etching-based post-printing substrate cutting device provided in the embodiment of the present invention acquires the image of the substrate that has completed laser etching and inkjet printing through the image acquisition module to obtain a first image, obtains the substrate cutting line and its first position information relative to the printing platform according to the first image; determines a preset motion trajectory according to the first position information; controls the laser etching module to move above the printing platform according to the preset motion trajectory; acquires the second position information of the laser etching module according to the grating ruler on the printing platform; when the second position information matches the first position information, controls the laser etching module to emit a laser beam to cut the substrate. The method of the present invention utilizes the combination of the image acquisition module and the printing platform grating ruler to realize automatic and accurate cutting of images after laser etching and inkjet printing, making the cutting positioning more accurate and efficient, effectively avoiding the problem of product scrapping caused by inaccurate cutting, and greatly improving production efficiency.

[0120] Embodiment 3

[0121] In addition, the post-printing substrate cutting method based on etching according to the embodiment of the present invention can be implemented by a post-printing substrate cutting device based on etching. Figure 5 The figure shows a hardware structure diagram of a post-printing substrate cutting device based on etching provided by an embodiment of the present invention.

[0122] The etching-based post-press substrate cutting apparatus may include a processor 301 and a memory 302 storing computer program instructions.

[0123] Specifically, the processor 301 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present invention.

[0124] Memory 302 may include a large capacity memory for data or instructions. For example, but not limitation, memory 302 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a tape, or a universal serial bus (USB) drive or a combination of two or more of these. In appropriate cases, memory 302 may include a removable or non-removable (or fixed) medium. In appropriate cases, memory 302 may be inside or outside a data processing device. In a specific embodiment, memory 302 is a non-volatile solid-state memory. In a specific embodiment, memory 302 includes a read-only memory (ROM). In appropriate cases, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM) or a flash memory or a combination of two or more of these.

[0125] The processor 301 reads and executes the computer program instructions stored in the memory 302 to implement any one of the post-printing substrate cutting methods based on etching in the above embodiments.

[0126] In one example, the etching-based post-printing substrate cutting device may further include a communication interface 303 and a bus 310. Figure 5 As shown, the processor 301, the memory 302, and the communication interface 303 are connected via a bus 310 and communicate with each other.

[0127] The communication interface 303 is mainly used to implement the communication between the modules, devices, units and / or equipment in the embodiment of the present invention.

[0128] Bus 310 includes hardware, software or both, and couples the components of the post-printing substrate cutting device based on etching to each other. For example and not limitation, bus 310 may include accelerated graphics port (AGP) or other graphics bus, enhanced industrial standard architecture (EISA) bus, front-side bus (FSB), hypertransport (HT) interconnection, industrial standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnect (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations. Where appropriate, bus 310 may include one or more buses. Although the embodiments of the present invention describe and illustrate specific buses, the present invention considers any suitable bus or interconnection.

[0129] Embodiment 4

[0130] In addition, in combination with the post-printing substrate cutting method based on etching in the above embodiments, the embodiment of the present invention can provide a computer-readable storage medium for implementation. The computer-readable storage medium stores computer program instructions; when the computer program instructions are executed by the processor 301, any post-printing substrate cutting method based on etching in the above embodiments is implemented.

[0131] In summary, the etching-based post-printing substrate cutting method, device and equipment provided by the embodiments of the present invention acquires the image of the substrate that has completed laser etching and inkjet printing through the image acquisition module to obtain a first image, obtains the substrate cutting line and its first position information relative to the printing platform according to the first image; determines a preset motion trajectory according to the first position information; controls the laser etching module to move above the printing platform according to the preset motion trajectory; obtains the second position information of the laser etching module according to the grating ruler on the printing platform; when the second position information matches the first position information, controls the laser etching module to emit a laser beam to cut the substrate. The method of the present invention utilizes the combination of the image acquisition module and the printing platform grating ruler to realize automatic and accurate cutting of the image after laser etching and inkjet printing, making the cutting positioning more accurate and efficient, effectively avoiding the problem of product scrapping caused by inaccurate cutting, and greatly improving production efficiency.

[0132] It should be clear that the present invention is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present invention.

[0133] The functional blocks shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present invention are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0134] It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiments, or in a different order from the embodiments, or several steps can be performed simultaneously.

[0135] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims

1. A method for cutting printed materials after printing based on etching, characterized in that: A laser etching module and an image acquisition module are integrated on an inkjet printing device, wherein the laser etching module is used to etch and cut a substrate on a printing platform. The method comprises: Controlling the image acquisition module to acquire an image of the substrate that has completed laser etching and inkjet printing, which is recorded as a first image; Acquire a cutting line of the substrate and first position information thereof relative to the printing platform according to the first image; determining a preset motion trajectory according to the first position information; Controlling the laser etching module to move above the printing platform according to the preset motion trajectory; Acquire second position information of the laser etching module according to the grating ruler on the printing platform; When the second position information matches the first position information, the laser etching module is controlled to emit a laser beam to cut the substrate.

2. The post-printing substrate cutting method based on etching according to claim 1, characterized in that: The control image acquisition module acquires an image of the substrate that has completed laser etching and inkjet printing, which is recorded as the first image and includes: Adjusting the height of the image acquisition module relative to the printing platform so that the acquisition range of the image acquisition module can completely cover the printing platform, wherein a first preset origin is marked on the printing platform; The image acquisition module is controlled to acquire images of the printing platform and the substrate placed thereon that has completed laser etching and inkjet printing, so as to obtain the first image.

3. The post-printing substrate cutting method based on etching according to claim 1, characterized in that: The control image acquisition module acquires an image of the substrate that has completed laser etching and inkjet printing, which is recorded as the first image and includes: Adjusting the height of the image acquisition module relative to the printing platform so that the acquisition range of the image acquisition module can at least completely cover the substrate, wherein a second preset origin is marked on the edge of the substrate; The image acquisition module is controlled to acquire an image of the substrate to obtain the first image.

4. The post-printing substrate cutting method based on etching according to claim 2, characterized in that: The step of acquiring the substrate cutting line and the first position information thereof relative to the printing platform according to the first image comprises: Extracting a printing platform image, a printing image contour and a substrate contour according to the first image; A two-dimensional rectangular coordinate system is established with a point corresponding to the first preset origin in the printing platform image as a coordinate origin, which is recorded as a first coordinate system; Determine a substrate cutting line according to the printed image contour and the substrate edge contour; The first position information is obtained by acquiring coordinate information of the cutting line of the substrate in the first coordinate system.

5. The post-printing substrate cutting method based on etching according to claim 3, characterized in that: The step of acquiring the substrate cutting line and the first position information thereof relative to the printing platform according to the first image comprises: Extracting a printed image contour and a printed object contour according to the first image; Determine a substrate cutting line according to the printed image contour and the substrate edge contour; A two-dimensional rectangular coordinate system is established with the point corresponding to the second preset origin in the outline of the substrate as the coordinate origin, which is recorded as the second coordinate system; Acquire the coordinate information of the cutting line of the substrate in the second coordinate system to obtain third position information; The first position information is acquired according to the position information of the second preset origin on the printing platform and the third position information.

6. The post-printing substrate cutting method based on etching according to claim 1, characterized in that: Determining the substrate cutting line according to the printed image contour and the substrate edge contour comprises: Determine the cutting line of the substrate according to external input information; Determine whether the substrate cutting line inclusion range covers the print image outline and is within the substrate outline; If so, determining the substrate cutting line according to the external input information; If not, determining whether the cutting line contour of the substrate is within the printed image contour; If yes, determining the substrate cutting line according to the printed image rim; If not, determining whether the outline of the substrate cutting line is outside the outline of the substrate; If yes, the substrate cutting line is determined according to the substrate contour.

7. The post-printing substrate cutting method based on etching according to claim 1, characterized in that: When the second position information matches the first position information, controlling the laser etching module to emit a laser beam to cut the substrate includes: Acquire the current position coordinates of the laser etching module according to the second position information; Determine whether the current position coordinates are one of the first position information; If so, it is considered that the second position information matches the first position information, and the laser etching module is controlled to emit a laser beam to cut the substrate.

8. A post-printing substrate cutting device based on etching, characterized in that: A laser etching module and an image acquisition module are integrated on an inkjet printing device, wherein the laser etching module is used to etch and cut a substrate on a printing platform, and the device comprises: The acquisition module is used to control the image acquisition module to acquire an image of the substrate that has been laser etched and inkjet printed, which is recorded as a first image; A first position information acquisition module, used for acquiring a cutting line of the substrate and first position information thereof relative to the printing platform according to the first image; A determination module, configured to determine a preset motion trajectory according to the first position information; A moving module, used for controlling the laser etching module to move above the printing platform according to the preset motion trajectory; A second position information acquisition module, used to acquire second position information of the laser etching module according to the grating ruler on the printing platform; The cutting module is used to control the laser etching module to emit a laser beam to cut the substrate when the second position information matches the first position information.

9. A post-printing substrate cutting device based on etching, characterized in that: include: At least one processor, at least one memory and computer program instructions stored in the memory, when the computer program instructions are executed by the processor, implement the method according to any one of claims 1 to 7.

10. A storage medium having computer program instructions stored thereon, characterized in that: When the computer program instructions are executed by a processor, the method according to any one of claims 1 to 7 is implemented.

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