Wafer lens automatic assembly machine and assembly method thereof

Abstract

The present invention relates to the field of lens assembly technology, and more particularly to an automatic wafer lens assembly machine and an assembly method thereof. A motion mechanism is provided with a front linear module and a rear linear module; a front pick-and-place mechanism is fixed to the front linear module; a rear pick-and-place mechanism is provided on the rear linear module; a tray transfer mechanism is used to remove full trays from a hopper and place empty trays into the hopper; the front pick-and-place mechanism includes a pick-and-place fixing plate; a material removal claw module is used to transport a housing Y on the tray transfer mechanism to an assembly station; a suction pen is used to load a wafer lens X from the tray displacement mechanism into the housing Y; and a rotating suction pen is used to tighten a locking ring Z onto the housing Y. When using the present invention, in addition to improving lens assembly efficiency and reducing labor intensity, the quality of lens assembly can also be more stable.

Description

Technical Field

[0001] The present invention relates to the technical field of lens assembly, and in particular to an automatic wafer lens assembly machine and an assembly method thereof. Background Art

[0002] The lens assembly consists of a wafer lens X, a housing Y, and a locking ring Z. During lens assembly, the housing Y is first manually placed on a jig and secured. Then, using tweezers, a wafer lens X is removed and positioned within the housing Y. A glue gun is then moved over the lens to apply glue. Finally, the locking ring Z is tightened onto the housing Y. This lens assembly method is labor-intensive and inefficient. Furthermore, the lens assembly quality is inconsistent. Summary of the Invention

[0003] The purpose of the present invention is to provide a wafer lens automatic assembly machine and an assembly method thereof in view of the defects and shortcomings of the prior art.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] The present invention provides an automatic wafer lens assembly machine, comprising a chassis; a material tray transfer mechanism, a material bin, an assembly station, a motion mechanism, a lens ejection mechanism, and a rubber tray displacement mechanism are fixed to the chassis;

[0006] The motion mechanism is provided with a front linear module and a rear linear module; the front linear module is fixed with a front pick-and-place mechanism; the rear linear module is provided with a rear pick-and-place mechanism; the tray transplanting mechanism is used to take out a full tray from the silo and put an empty tray into the silo;

[0007] The front pick-and-place mechanism includes a pick-and-place fixed plate; the pick-and-place fixed plate is provided with a dispensing head, a material picking claw module, a suction pen and a rotating suction pen;

[0008] The material picking claw module is used to transport the shell Y on the material tray transfer mechanism to the assembly station; the suction pen is used to load the wafer lens X of the rubber tray displacement mechanism into the shell Y; the rotating suction pen is used to tighten the locking ring Z on the shell Y.

[0009] Furthermore, a lens flipping mechanism is provided between the assembly station and the rubber disc displacement mechanism;

[0010] The lens flipping mechanism includes a swing rod and a sliding plate; a rotating assembly and a nozzle fixing plate are fixed on the sliding plate; the swing rod is connected to the rotating assembly;

[0011] The rotating assembly is used to drive the swing arm to swing; the lens nozzle is fixed on the swing arm and the nozzle fixing plate; the lens nozzle on the swing arm is the first nozzle; the lens nozzle on the nozzle fixing plate is the second nozzle; the second nozzle is arranged on the movement path of the first nozzle.

[0012] Furthermore, a flip fixing seat is fixed on the chassis; the sliding plate is slidably connected to the flip fixing seat; and a micrometer head is connected between the sliding plate and the flip fixing seat.

[0013] Furthermore, the assembly station includes an assembly sliding frame and an assembly linear module for driving the assembly sliding frame to slide; the assembly sliding frame is provided with an assembly rotating component; the assembly rotating component is connected to a clamping component; the clamping toe of the clamping component is connected to a shell clamping block; the dispensing head is arranged above the movement path of the clamping component.

[0014] Furthermore, the adhesive disc displacement mechanism includes an adhesive disc moving linear module and an adhesive disc moving seat connected to the adhesive disc moving linear module; the adhesive disc is fixed on the adhesive disc moving seat;

[0015] A lens ejection mechanism is provided below the front pick-up and placement mechanism; the rubber disc displacement mechanism is provided between the lens ejection mechanism and the front pick-up and placement mechanism;

[0016] The lens ejection mechanism includes an ejector pin moving linear module, an ejector pin fixing seat connected to the ejector pin moving linear module, and an ejector pin lifting cylinder connected to the ejector pin fixing seat at one end; an ejector pin is fixed to the other end of the ejector pin lifting cylinder; the movement direction of the rubber disc moving linear module and the movement direction of the ejector pin moving linear module are arranged perpendicular to each other.

[0017] Furthermore, a slide is provided on the ejector moving linear module; the ejector fixing seat is slidably connected to the slide; and a micrometer head is provided between the slide and the ejector fixing seat.

[0018] Furthermore, a UV irradiation lamp is fixed on the chassis.

[0019] An assembly method for a wafer lens automatic assembly machine comprises the following steps:

[0020] 1. Place a lens that has been laser cut into multiple wafer lenses X on a plastic tray and then send it under the UV irradiation lamp through the rear pick-and-place mechanism for illumination. Then, send the plastic tray to the plastic tray moving seat and fix it.

[0021] 2. The material picking claw module and the rotary suction pen on the front pick-and-place mechanism respectively take out a shell Y and a locking ring Z from the tray transfer mechanism;

[0022] 3. The suction pen on the front pick-and-place mechanism sucks a wafer lens X from the plastic tray and sends it to the lower visual mechanism for inspection. If the direction of the wafer lens X is inconsistent with the set direction, the suction pen is placed into the lens flipping mechanism for flipping. The suction pen then re-adsorbs and fixes the flipped wafer lens X to complete the positioning of the wafer lens X on the suction pen.

[0023] 4. The picking claw module first places the shell Y on the assembly station, and then places the wafer lens X positioned on the suction pen in the step into the interior of the shell Y;

[0024] 5. The dispensing head discharges glue, and at the same time, the assembly station drives the shell Y and the wafer lens X inside the shell Y to rotate synchronously, so that the glue discharged by the dispensing head forms an annular sealing line inside the shell Y;

[0025] 6. The assembly station transports the shell Y and wafer lens X, which have been glued in step 6, to the UV lamp for light curing.

[0026] 7. Rotate the suction pen to screw the threaded locking ring Z into the outer shell Y after the glue is light-cured in step 1;

[0027] 8. The material picking claw module places the lens assembled in the step into the empty tray of the tray transfer mechanism.

[0028] After adopting the above structure, the beneficial effects of the present invention are as follows: the front linear module drives the front pick-and-place mechanism to move, the material gripper module clamps and fixes the shell Y, and then the suction pen is rotated to adsorb and fix the locking ring Z; the shell Y is first placed in the assembly station for clamping and positioning; the suction pen takes out a wafer lens X from the glue plate displacement mechanism and places it on the shell Y in the assembly station, and the glue dispensing head dispenses glue in the gap between the wafer lens X and the shell Y; finally, the suction pen is rotated to screw the locking ring Z onto the outside of the shell Y; this structure can assemble and dispense glue on the wafer lens X, shell Y and locking ring Z, which not only improves the efficiency of lens assembly and reduces labor intensity, but also makes the quality of lens assembly more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the present invention;

[0030] Figure 2 It is a structural diagram of the front pick-and-place mechanism;

[0031] Figure 3 It is a structural diagram of the lens flip mechanism;

[0032] Figure 4 It is a structural diagram of the assembly station;

[0033] Figure 5 yes Figure 4 A magnified view of the M part;

[0034] Figure 6 It is a structural diagram of the rear pick-and-place mechanism;

[0035] Figure 7 This is the main view of the combination of the front pick-and-place mechanism, the rubber disc displacement mechanism and the lens ejection mechanism;

[0036] Figure 8 yes Figure 7 Magnified view of the O part in the figure;

[0037] Figure 9 This is a top view of the front pick-and-place mechanism, the rubber disc displacement mechanism, and the lens ejection mechanism combined;

[0038] Figure 10 It is a structural diagram of the lens ejection mechanism;

[0039] Figure 11 It is the structural diagram of the rubber disc displacement mechanism;

[0040] Figure 12 is a cross-sectional view of the lens assembly;

[0041] Description of reference numerals:

[0042] A, front pick-and-place mechanism; A1, dispensing head; A2, material picking gripper module; A3, suction pen;

[0043] A4, rotating suction pen; A5, material loading and unloading fixed plate;

[0044] B, lens flip mechanism; B1, lens nozzle; B2, flip fixing seat; B3, swing rod;

[0045] B4, rotating assembly; B5, micrometer head; B6, nozzle fixing plate; B601, strip hole;

[0046] B7, sliding plate;

[0047] C. Lower vision mechanism; D. Lens positioning mechanism; E. Tray transplanting mechanism; F. Silo;

[0048] G, chassis; H, UV irradiation lamp; I, ​​assembly station; I1, assembly linear module;

[0049] I2. Assemble the rotating assembly; I3. Assemble the sliding frame; I4. U-shaped photoelectric sensor; I5. Sensor sheet;

[0050] I6, clamping assembly; I7, housing clamping block;

[0051] J, lens ejection mechanism; J1, ejector linear module; J101, slide; J2, micrometer head;

[0052] J3, ejector fixing seat; J4, ejector; J5, ejector lifting cylinder;

[0053] K, rubber disc displacement mechanism; K1, rubber disc moving linear module; K2, rubber disc moving seat;

[0054] K201, countersunk hole of movable seat; K3, forward push cylinder; K4, rubber plate; K5, rubber plate fixing frame;

[0055] K6, glue plate cylinder; L, rear pick-and-place mechanism; N, motion mechanism; X, wafer lens;

[0056] Y, housing; Z, locking ring. DETAILED DESCRIPTION

[0057] The present invention will be further described below with reference to the accompanying drawings.

[0058] like Figure 1 As shown, the wafer lens automatic assembly machine of the present invention includes a chassis G; the chassis G is fixed with a material tray transfer mechanism E, a material bin F, an assembly station I, a motion mechanism N, a lens ejection mechanism J and a rubber tray displacement mechanism K;

[0059] The motion mechanism N is provided with a front linear module and a rear linear module; a front pick-up and placement mechanism A is fixed to the front linear module; a rear pick-up and placement mechanism L is provided on the rear linear module; the tray transplanting mechanism E is used to take out full trays from the silo F and put empty trays into the silo F;

[0060] The front pick-and-place mechanism A includes a pick-and-place fixed plate A5; the pick-and-place fixed plate A5 is provided with a dispensing head A1, a pick-and-place clamping module A2, a suction pen A3 and a rotating suction pen A4;

[0061] The material-retrieving gripper module A2 is used to transport the housing Y on the tray transfer mechanism E to the assembly station I; the suction pen A3 is used to load the wafer lens X of the disk displacement mechanism K into the housing Y; the rotary suction pen A4 is used to tighten the locking ring Z on the housing Y;

[0062] The silo F can automatically stack the trays; the tray transfer mechanism E can take the trays inside the silo F. The silo F and the tray transfer mechanism E are essentially the same as those in the prior art, so they will not be described in detail.

[0063] The motion mechanism N consists of a crossbeam and a front linear module and a rear linear module fixed on the crossbeam;

[0064] The lower visual mechanism C is provided on the chassis G. The lower visual mechanism C is a shooting device used to obtain images on the dispensing head A1, the material gripper module A2, the suction pen A3 and the rotating suction pen A4, and detect whether there is material and whether the direction of the material is consistent with the setting;

[0065] The front and rear linear modules are both linear modules that can move independently of each other. The rear pick-and-place mechanism L is a suction cup manipulator used to transport the rubber disc to the rubber disc displacement mechanism K. The material picking claw module A2 is a pneumatic claw mechanism used to clamp and fix the shell Y. The rotary suction pen A4 is essentially the same as the existing technology, so it is not described in detail. It can absorb the workpiece and drive the workpiece to rotate.

[0066] The front linear module drives the front pick-and-place mechanism A to move. The material gripper module A2 clamps and fixes the housing Y, and then the rotating suction pen A4 sucks and fixes the locking ring Z. The housing Y is first placed in the assembly station I for clamping and positioning. The suction pen A3 removes a wafer lens X from the glue plate displacement mechanism K and places it on the housing Y in the assembly station I. The dispensing head A1 dispenses glue in the gap between the wafer lens X and the housing Y. Finally, the rotating suction pen A4 screws the locking ring Z onto the outside of the housing Y. This structure can assemble and dispense glue on the wafer lens X, housing Y, and locking ring Z. In addition to improving lens assembly efficiency and reducing labor intensity, it can also ensure more stable lens assembly quality.

[0067] As a preferred embodiment of the present invention, a lens flipping mechanism B is provided between the assembly station I and the rubber plate displacement mechanism K;

[0068] The lens flip mechanism B includes a swing rod B3 and a sliding plate B7; a rotating assembly B4 and a nozzle fixing plate B6 are fixed on the sliding plate B7; the swing rod B3 is connected to the rotating assembly B4;

[0069] The rotating assembly B4 is used to drive the swing arm B3 to swing; the swing arm B3 and the nozzle fixing plate B6 are both fixed with a lens nozzle B1; the lens nozzle B1 on the swing arm B3 is the first nozzle; the lens nozzle B1 on the nozzle fixing plate B6 is the second nozzle; the second nozzle is arranged on the movement path of the first nozzle;

[0070] The lens suction nozzle B1 is essentially the same as the existing suction nozzle mechanism, so it will not be described in detail. The portion of the lens suction nozzle B1 used to absorb the product is made of a cylindrical silicone material, which can reduce the impact of the wafer lens X. After the wafer lens X is flipped, it is centered by the lens positioning mechanism D. The lens positioning mechanism D is a clamping cylinder with a fixture on the clamping toe of the clamping cylinder. The fixture clamps the wafer lens X to keep the wafer lens X centered.

[0071] After the wafer lens X waiting to be flipped is placed on the first suction nozzle on the swing arm B3, the wafer lens X is sucked and fixed by the first suction nozzle. Then, the rotating component B4 drives the swing arm B3 to rotate, causing the first suction nozzle and the wafer lens X to flip 180 degrees together. After the end of the wafer lens X away from the first suction nozzle is attached to the second suction nozzle, the second suction nozzle sucks the wafer lens X, and the first suction nozzle releases the wafer lens X, waiting for the material placement and retrieval mechanism to retrieve the material. In this structure, the flipping structure and the two suction nozzles cooperate to suction and place, which can reduce damage to the surface of the wafer lens X and ensure the product yield.

[0072] The rotating assembly B4 is any one of a rotating cylinder and a motor. The nozzle fixing plate B6 is provided with a plurality of strip holes B601; the strip holes B601 are arranged parallel to each other; the sliding plate B7 is provided with a plurality of threaded holes; each of the strip holes B601 is provided with a head bolt; the head bolt passes through the strip hole B601 and is threadedly connected to the threaded hole; the head of the head bolt fixes the nozzle fixing plate B6 to the sliding plate B7; after loosening the head bolt, the nozzle fixing plate B6 can slide along the length direction of the strip hole B601 to adjust the position of the nozzle fixing plate B6 and the second nozzle; so that after the first nozzle is flipped into place, the first nozzle, the second nozzle and the wafer lens X are coaxial, preventing the wafer lens X from falling when the first nozzle is handed over to the second nozzle.

[0073] As a preferred embodiment of the present invention, a flip fixing seat B2 is fixed on the chassis G; the sliding plate B7 is slidably connected to the flip fixing seat B2; a differential head B5 is connected between the sliding plate B7 and the flip fixing seat B2; the differential head B5 is essentially no different from the prior art, so it is not described in detail; the two ends of the differential head B5 are respectively connected to the flip fixing seat B2 and the sliding plate B7; the differential head B5 can perform telescopic movement, and the overall position of the sliding plate B7 on the flip fixing seat B2 can be adjusted by rotating the differential head B5, so as to synchronously realize the alignment of the positions of the two lens suction nozzles B1 with the material placement and picking mechanism.

[0074] As a preferred embodiment of the present invention, the assembly station I includes an assembly slide frame I3 and an assembly linear module I1 for driving the assembly slide frame I3 to slide; the assembly slide frame I3 is provided with an assembly rotation component I2; the assembly rotation component I2 is connected to a clamping component I6; the clamping toe of the clamping component I6 is connected to a shell clamping block I7; the dispensing head A1 is provided above the movement path of the clamping component I6;

[0075] The dispensing head A1 is essentially the same as the prior art, so it is not described in detail. The dispensing head A1 can dispense glue. The assembled linear module I1 is a linear module, which is essentially the same as the prior art, so it is not described in detail.

[0076] After the clamping component I6 is actuated, the shell with the wafer lens is clamped and positioned in the center by the shell clamping block I7; then the assembled linear module I1 drives the assembled sliding frame I3 to move to the bottom of the dispensing head A1; while the dispensing head A1 discharges glue, the rotating component I2 drives the shell on the clamping component I6 to rotate, so that the dispensing head A1 pours a circle of glue on the wafer lens; in this structure, a circle of uniform glue can be wrapped around the wafer lens, which not only can enhance the bonding force between the wafer lens and the shell, but also can form an annular sealing structure to enhance the waterproof effect of the product; the clamping component I6 is a three-claw cylinder; the number of the shell clamping blocks I7 is three; the three shell clamping blocks I7 are respectively fixed on the three clamping toes of the three-claw cylinder, and the rotating component I2 is a motor and a rotary Any one of the rotating cylinders; a U-shaped photoelectric sensor I4 is fixed on the rotating component I2; a sensor sheet I5 is fixed on the clamping component I6; the sensor sheet I5 is a shielding sheet, which has no essential difference from the prior art, so it is not described in detail; when the clamping component I6 rotates, the sensor sheet I5 will trigger the U-shaped photoelectric sensor I4. When the U-shaped photoelectric sensor I4 generates an electrical signal, it is immediately transmitted to the control circuit, causing the dispensing head A1 and the rotating component I2 to stop moving; and the current stop position is the initial position of the next dispensing product. This structure can make each product rotate exactly one circle, and the glue dispensing head A1's glue discharge demand is fed back according to the electrical signal of the U-shaped photoelectric sensor I4, so that the thickness of the glue of each product is more uniform throughout the circle.

[0077] As a preferred embodiment of the present invention, the adhesive disc displacement mechanism K includes an adhesive disc moving linear module K1 and an adhesive disc moving seat K2 connected to the adhesive disc moving linear module K1; an adhesive disc K4 is fixed on the adhesive disc moving seat K2;

[0078] A lens ejection mechanism J is provided below the front pick-up and placement mechanism A; the rubber disc displacement mechanism K is provided between the lens ejection mechanism J and the front pick-up and placement mechanism A;

[0079] The lens ejection mechanism J includes an ejector pin moving linear module J1, an ejector pin fixing seat J3 connected to the ejector pin moving linear module J1, and an ejector pin lifting cylinder J5 with one end connected to the ejector pin fixing seat J3; an ejector pin J4 is fixed to the other end of the ejector pin lifting cylinder J5; the movement direction of the rubber disc moving linear module K1 is arranged perpendicular to the movement direction of the ejector pin moving linear module J1.

[0080] The ejector moving linear module J1 and the rubber plate moving linear module K1 are both linear modules, which are essentially the same as the existing technology, so they are not described in detail. The ejector moving linear module J1 and the rubber plate moving linear module K1 can perform horizontal and vertical movements respectively.

[0081] The large wafer lens is cut into multiple wafer lenses X and loaded onto the plastic tray K4; then the plastic tray moving linear module K1 drives the plastic tray moving seat K2 to transport the large wafer lens to the bottom of the suction pen A3 of the front pick-up and placement mechanism A; the ejector pin moving linear module J1 on the lens ejection mechanism J adjusts the position of the ejector pin J4 so that the ejector pin J4 is aligned with the wafer lens X to be removed; the ejector pin lifting cylinder J5 drives the ejector pin J4 to push up the corresponding wafer lens X, allowing the wafer lens X to overcome the resistance of the adjacent lenses and rise. When the wafer lens X and the adjacent lenses are misaligned to a certain extent in the height direction, the friction between the wafer lens X to be removed and the adjacent lenses is reduced, making the target wafer lens X easier to remove and reducing the chance of the suction pen A3 being empty. Improve loading efficiency; at least one moving seat countersunk hole K201 is provided on the rubber disc moving seat K2; a rubber disc fixing frame K5 is fixed to the outside of the rubber disc K4; the rubber disc fixing frame K5 is embedded in the countersunk hole of the moving seat countersunk hole K201; the rubber disc moving seat K2 is provided with a rubber disc pressing mechanism for pressing the rubber disc fixing frame K5 into the moving seat countersunk hole K201; the soft rubber disc K4 is fixedly positioned in the moving seat countersunk hole K201 by the rubber disc fixing frame K5, so that the wafer lens is positioned on the rubber disc displacement mechanism K; the rubber disc K4 is a UV anti-viscosity protective film. When the UV anti-viscosity protective film is lifted and squeezed, the position in contact with the ejector pin J4 can undergo plastic deformation and be lifted to a certain height together with the ejector pin J4. The rubber disc pressing mechanism is composed of multiple pressing modules; the pressing modules are distributed in a circular pattern on the movable seat countersunk hole K201; the pressing module is composed of a forward pushing cylinder K3 and a rubber disc pressing cylinder K6; one end of the forward pushing cylinder K3 is fixed on the rubber disc movable seat K2; the other end of the forward pushing cylinder K3 is fixed on one end of the rubber disc pressing cylinder K6; the forward pushing cylinder K3 is used to drive the rubber disc pressing cylinder K6 to perform translational movement, so that before the rubber disc K4 is placed in, the rubber disc pressing cylinder K6 moves to a position where it does not hinder the rubber disc K4 from being placed in the movable seat countersunk hole K201; after the rubber disc K4 is placed in the movable seat countersunk hole K201, the forward pushing cylinder K3 drives the rubber disc pressing cylinder K6 to move above the rubber disc fixing frame K5, and then the rubber disc pressing cylinder K6 descends to press the rubber disc K4 on the movable seat countersunk hole K201.

[0082] As a preferred embodiment of the present invention, a slide J101 is provided on the ejector moving linear module J1; the ejector fixing seat J3 is slidably connected to the slide J101; a differential head J2 is provided between the slide J101 and the ejector fixing seat J3; the differential head J2 has no essential difference from the prior art, so it is not described in detail; the movement direction of the ejector fixing seat J3 adjusted by the differential head J2 is perpendicular to the movement direction of the ejector moving linear module J1; the ejector moving linear module J1 can drive the slide J101 to perform translational movement; after the differential head J2 rotates, it can drive the ejector fixing seat J3 to move relative to the slide J101, and the center position of the ejector J4 can be fine-tuned to be coaxial with the target lens through the differential head J2.

[0083] As a preferred embodiment of the present invention, a UV irradiation lamp H is fixed to the chassis G; after the gap between the wafer lens X and the housing Y is glued, the UV irradiation lamp H irradiates, which can enable the glue to cure quickly; in addition, since the wafer lens X is adhered to the surface of the glue disk K4, the glue disk K4 is a UV adhesive film, and a UV adhesive film is applied to the surface of the film to dissolve the adhesive; after the UV irradiation lamp H illuminates the UV adhesive film, the adhesion between the adhesive and the wafer lens X is reduced. The UV adhesive film is essentially the same as that of the prior art and is not described in detail.

[0084] Before placing the adhesive disc fixing frame K into the adhesive disc moving seat K2, the rear pick-and-place mechanism L moves the adhesive disc moving seat K2 to the UV irradiation lamp H for irradiation. This can weaken the adhesion of the adhesive disc K4 surface to the wafer lens X, making the wafer lens X easier to be grasped by the suction pen A3.

[0085] An assembly method for a wafer lens automatic assembly machine comprises the following steps:

[0086] 1. Place a lens that has been laser-cut into multiple wafer lenses X onto the plastic tray K4 and then move it under the UV irradiation lamp H for illumination via the rear pick-and-place mechanism L. Then, move the plastic tray K4 into the plastic tray moving seat K2 for fixation.

[0087] 2. The material picking claw module A2 and the rotary suction pen A4 on the front pick-and-place mechanism respectively remove a shell Y and a locking ring Z from the tray transfer mechanism E;

[0088] 3. The suction pen A3 on the front pick-and-place mechanism sucks a wafer lens X from the plastic tray K4 and sends it to the lower vision mechanism C for inspection. If the direction of the wafer lens X is inconsistent with the set direction, the suction pen A3 is placed in the lens flipping mechanism B for flipping. The suction pen A3 then re-adsorbs and fixes the flipped wafer lens X, completing the positioning of the wafer lens X on the suction pen A3.

[0089] 4. The material picking claw module A2 first places the shell Y on the assembly station I, and then places the wafer lens X positioned on the suction pen A3 in step 3 into the interior of the shell Y;

[0090] 5. The dispensing head A1 dispenses glue, and at the same time, the assembly station I drives the housing Y and the wafer lens X inside the housing Y to rotate synchronously, so that the glue dispensed by the dispensing head A1 forms an annular sealing line inside the housing Y;

[0091] 6. Assembly station I transports the housing Y and wafer lens X, which have been glued in step 5, to the UV lamp H for light curing.

[0092] 7. Rotate the suction pen A4 to screw the threaded locking ring Z into the outer shell Y after the glue is light-cured in step 6;

[0093] 8. The material-retrieving gripper module A2 places the lens assembled in step 7 into the empty tray of the tray transfer mechanism E.

[0094] The above description is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the scope of the patent application of the present invention.

Claims

1. A wafer lens automatic assembly machine, characterized by: The machine comprises a chassis (G); a material tray transfer mechanism (E), a material bin (F), an assembly station (I), a motion mechanism (N), a lens ejection mechanism (J) and a rubber tray displacement mechanism (K) are fixed on the chassis (G); The motion mechanism (N) is provided with a front linear module and a rear linear module; a front pick-up and placement mechanism (A) is fixed to the front linear module; a rear pick-up and placement mechanism (L) is provided on the rear linear module; the tray transplanting mechanism (E) is used to take out a full tray from the silo (F) and to place an empty tray into the silo (F); The front pick-and-place mechanism (A) includes a pick-and-place fixed plate (A5); a dispensing head (A1), a pick-and-place clamping module (A2), a suction pen (A3), and a rotating suction pen (A4) are provided on the pick-and-place fixed plate (A5); The material-retrieving claw module (A2) is used to transport the housing (Y) on the material tray transfer mechanism (E) to the assembly station (I); the suction pen (A3) is used to install the wafer lens (X) of the rubber tray displacement mechanism (K) into the housing (Y); the rotating suction pen (A4) is used to tighten the locking ring (Z) on the housing (Y); a lens flipping mechanism (B) is provided between the assembly station (I) and the rubber tray displacement mechanism (K); The lens flip mechanism (B) includes a swing rod (B3) and a sliding plate (B7); a rotating assembly (B4) and a nozzle fixing plate (B6) are fixed on the sliding plate (B7); the swing rod (B3) is connected to the rotating assembly (B4); The rotating assembly (B4) is used to drive the swing rod (B3) to swing; a lens suction nozzle (B1) is fixed on both the swing rod (B3) and the suction nozzle fixing plate (B6); the lens suction nozzle (B1) on the swing rod (B3) is a first suction nozzle; the lens suction nozzle (B1) on the suction nozzle fixing plate (B6) is a second suction nozzle; and the second suction nozzle is arranged on the movement path of the first suction nozzle.

2. The wafer lens automatic assembly machine according to claim 1, characterized in that: A flip fixing seat (B2) is fixed on the chassis (G); the sliding plate (B7) is slidably connected to the flip fixing seat (B2); and a differential head (B5) is connected between the sliding plate (B7) and the flip fixing seat (B2).

3. The wafer lens automatic assembly machine according to claim 1, characterized in that: The assembly station (I) includes an assembly slide frame (I3) and an assembly linear module (I1) for driving the assembly slide frame (I3) to slide; an assembly rotation component (I2) is provided on the assembly slide frame (I3); a clamping component (I6) is connected to the assembly rotation component (I2); a housing clamping block (I7) is connected to the clamping toe of the clamping component (I6); and the dispensing head (A1) is provided above the movement path of the clamping component (I6).

4. The wafer lens automatic assembly machine according to claim 1, characterized in that: The adhesive disc displacement mechanism (K) comprises an adhesive disc moving linear module (K1) and an adhesive disc moving seat (K2) connected to the adhesive disc moving linear module (K1); an adhesive disc (K4) is fixed on the adhesive disc moving seat (K2); A lens ejection mechanism (J) is provided below the front pick-up and placement mechanism (A); the rubber disc displacement mechanism (K) is provided between the lens ejection mechanism (J) and the front pick-up and placement mechanism (A); The lens ejection mechanism (J) comprises an ejector pin moving linear module (J1), an ejector pin fixing seat (J3) connected to the ejector pin moving linear module (J1), and an ejector pin lifting cylinder (J5) having one end connected to the ejector pin fixing seat (J3); an ejector pin (J4) is fixed to the other end of the ejector pin lifting cylinder (J5); and the movement direction of the rubber plate moving linear module (K1) and the movement direction of the ejector pin moving linear module (J1) are arranged perpendicular to each other.

5. The wafer lens automatic assembly machine according to claim 4, characterized in that: A slide (J101) is provided on the ejector moving linear module (J1); the ejector fixing seat (J3) is slidably connected to the slide (J101); and a differential head (J2) is provided between the slide (J101) and the ejector fixing seat (J3).

6. The wafer lens automatic assembly machine according to claim 1, characterized in that: A UV irradiation lamp (H) is fixed on the chassis (G).

7. The assembly method of the wafer lens automatic assembly machine according to any one of claims 1 to 6, characterized in that: The steps include: (1) Place a lens that has been cut into multiple wafer lenses (X) by laser into a plastic tray (K4) and then send it to the bottom of the UV irradiation lamp (H) through the rear pick-and-place mechanism (L) for illumination. Then, send the plastic tray (K4) into the plastic tray moving seat (K2) for fixation. (2) The material picking claw module (A2) and the rotary suction pen (A4) on the front pick-and-place mechanism remove a shell (Y) and a locking ring (Z) from the tray transfer mechanism (E); (3) The suction pen (A3) on the front pick-and-place mechanism sucks a wafer lens (X) from the plastic tray (K4) to the lower visual mechanism (C) for inspection. If the direction of the wafer lens (X) is inconsistent with the set direction, the suction pen (A3) is placed in the lens flipping mechanism (B) for flipping. The suction pen (A3) then re-adsorbs and fixes the flipped wafer lens (X) to complete the positioning of the wafer lens (X) on the suction pen (A3); (4) The material picking claw module (A2) first places the housing (Y) on the assembly station (I), and then places the wafer lens (X) positioned on the suction pen (A3) in step 3 into the interior of the housing (Y); (5) The dispensing head (A1) dispenses glue, and at the same time, the assembly station (I) drives the housing (Y) and the wafer lens (X) inside the housing (Y) to rotate synchronously, so that the glue dispensed by the dispensing head (A1) forms a ring-shaped sealing line inside the housing (Y); (6) The assembly station (I) transports the shell (Y) and wafer lens (X) that have been glued in step 5 to the bottom of the UV lamp (H) for light curing; (7) Rotate the suction pen (A4) to screw the threaded locking ring (Z) into the housing (Y) after the glue is light-cured in step 6; (8) The material picking claw module (A2) places the lens assembled in step 7 into the empty tray of the tray transfer mechanism (E).

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