Wafer overflow glue trimming device and method

Abstract

The present invention discloses a wafer overflow glue trimming device and method, including a rotary adsorption device, a tool device, a moving device and a positioning device; the rotary adsorption device includes a wafer carrier for adsorbing and driving the wafer to rotate; the tool device is installed on the moving device, the moving device is located at the periphery of the rotary adsorption device, and the moving device is used to drive the tool device to approach or move away from the periphery of the wafer on the wafer carrier; the tool device includes a rotating component and a floating tool head component; the positioning device includes a visual positioning component arranged at the periphery of the rotary adsorption device, and the visual positioning component includes a detection window for upward visual detection. By this, the trimming device of the present invention has a high degree of flexibility, can achieve the distance between the tool and the wafer to follow at all times, the trimming head does not damage the wafer, the overflow glue trimming is uniform, and the notch can be automatically removed. Compared with manual trimming, it avoids the damage and contamination of the wafer caused by uneven force of manual trimming, and effectively improves the production efficiency and product yield.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to a wafer overflow glue trimming device and method. Background Art

[0002] With the continuous development of wafer processing technology, the wafer bonding process is being used more and more widely. Before wafer bonding, the overflow glue after wafer lamination needs to be trimmed. The overflow glue on the edge of the wafer can easily lead to uneven alignment of the upper and lower wafers during wafer bonding, and difficulty in aligning the notch. At present, in order to effectively solve the problem of overflow glue after wafer lamination, blades are used to manually trim the overflow glue and notch of each wafer. This is labor-intensive, the wafer is unevenly stressed, and it is easy to have fragments and cracks. There are also safety hazards.

[0003] Therefore, there is a device and method for removing glue overflow around a wafer, as disclosed in Chinese patent CN 115213974 B; in this solution, a rotating adsorption fixture, a positioning fixture and a glue repair knife mechanism are provided, and the wafer is positioned on the rotating adsorption fixture by the positioning fixture, and then the rotating adsorption device rotates the wafer at a constant speed, and the edge trimming is achieved by cooperating with the feeding of the glue repair tool mechanism; however, in this solution, it is difficult for the positioning fixture to accurately position the center of the wafer and the center of the rotating adsorption fixture, so the wafer cannot achieve concentric rotation with the rotating adsorption fixture, and because the feeding position is fixed, part of the edge of the wafer may not be able to contact the edge trimming tool mechanism and the purpose of edge trimming cannot be achieved. Moreover, this solution is aimed at repairing the overflow of the wafer after the glue has been solidified after debonding, and the amount of repair is small; and this solution cannot automatically trim the notch, and manual trimming is required.

[0004] At the same time, in order to meet the precision requirements of the wafer back-end production process, it is often necessary to control the amount of wafer glue overflow to ensure that the glue overflow does not protrude from the wafer or is controlled within the micrometer level as much as possible. However, the current automatic trimming technology often cannot control the uniformity of the glue overflow trimming, and cannot achieve the internal trimming of the wafer glue overflow (that is, the glue overflow after trimming is smaller than the wafer diameter). This ultimately leads to edge collapse after debonding, and wafer cracking due to uneven glue overflow in the electroplating process. Summary of the invention

[0005] The purpose of the present invention is to provide a wafer overflow glue trimming device and method, which has the advantages of ensuring the uniformity of the overflow glue at the edge of the wafer after the wafer overflow glue trimming; at the same time, internal trimming can be performed to ensure that the overflow glue does not protrude from the edge of the wafer, thereby improving the yield of wafer bonding and avoiding safety hazards.

[0006] In order to achieve the above object, the solution of the present invention is:

[0007] A wafer overflow glue trimming device, comprising a rotary adsorption device, a tool device, a moving device and a positioning device;

[0008] The rotary adsorption device comprises a wafer stage for adsorbing and driving the wafer to rotate, wherein the diameter of the wafer stage is smaller than the diameter of the wafer;

[0009] The tool device is installed on a moving device, which is located at the periphery of the rotating adsorption device, and is used to drive the tool device to approach or move away from the periphery of the wafer on the wafer stage;

[0010] The tool device comprises a rotating assembly and a floating cutter head assembly, the cutter head of the floating cutter head assembly can adaptively move forward and backward, and the rotating assembly is used to adjust the rotation angle and tilt angle of the floating cutter head assembly;

[0011] The positioning device includes two visual positioning components which are arranged on the outer periphery of the rotating adsorption device and are circumferentially spaced apart. The visual positioning component includes a detection window facing upward for visual detection, and the detection window is located below the wafer on the wafer carrier.

[0012] Furthermore, the two vision positioning components are circumferentially spaced 90° apart.

[0013] Furthermore, the visual positioning component includes a visual component and a visual moving component, and the detection window is arranged at the top of the visual component close to the rotating adsorption device; the visual moving component controls the detection window of the visual component to move along the radial direction of the wafer carrier.

[0014] Furthermore, the moving device is an XY moving component, and the XY moving component is used to drive the tool device to reciprocate along the XY direction.

[0015] Furthermore, the rotating adsorption device also includes an adsorption platform, a carrier rotation assembly and a vacuum adsorption assembly; the wafer carrier is rotatably installed on the top of the adsorption platform, and the carrier rotation assembly is used to drive the wafer carrier to rotate; the vacuum adsorption assembly includes a vacuum pipeline connected to the top surface of the wafer carrier.

[0016] Furthermore, the rotating assembly of the tool device includes a mounting plate, a rotating seat, a horizontal rotating drive, a tool mounting seat and a tilted rotating drive; the mounting plate is mounted and connected to the moving device, the rotating seat and the horizontal rotating drive are both mounted on the mounting plate, and the horizontal rotating drive drives the rotating seat to rotate horizontally on the mounting plate; the tilted rotating drive and the tool mounting seat are both mounted on the rotating seat, and the tilted rotating drive drives the tool mounting seat to rotate tilted relative to the horizontal plane on the rotating seat; the floating tool head assembly is mounted on the tool mounting seat.

[0017] Furthermore, the floating cutter head assembly includes a cutter head, a cutter head seat and a cutter head spring; the cutter head is detachably mounted on one end of the cutter head seat close to the wafer carrier, and the other end of the cutter head seat can be reciprocatingly slidably mounted on the tool mounting seat, and the cutter head spring is arranged between the end face of the cutter head seat away from the cutter head and the tool mounting seat.

[0018] Furthermore, it also includes a chip extraction device, which includes a chip cover, a chip box, a suction assembly and a lifting assembly; the chip cover is arranged on the side of the floating cutter head assembly away from the wafer carrier to form a chip guide cavity, and the bottom of the chip guide cavity is open, and the inside of the cutter head has a through hole connected to the chip guide cavity; the top of the chip box is open to form a chip collection groove, and the chip collection groove is located below the trimming point where the floating cutter head assembly and the wafer contact; the suction assembly has a suction channel connected to the chip collection groove; the lifting assembly drives the chip box to move up and down.

[0019] The present invention also provides a wafer glue overflow trimming method, which uses the above-mentioned trimming equipment to trim the glue overflow of the wafer, comprising the following steps:

[0020] Step 1: Wafer loading: placing the wafer on the wafer carrier of the rotating adsorption device manually or by a robot, and adsorbing the wafer on the wafer carrier;

[0021] Step 2: Wafer positioning: Use the visual positioning component of the positioning device to visually detect the edge of the lower surface of the wafer without overflowing glue to obtain the coordinates of the center of the wafer;

[0022] Step 3: Calculate the wafer trimming starting point; compare the wafer center coordinates obtained in step 2 with the wafer stage center coordinates, and calculate the wafer trimming starting point;

[0023] Step 4: Prepare the trimming of the tool device; adjust the rotation angle and tilt angle of the floating tool head assembly through the rotating assembly of the tool device. After the angle is adjusted, move the tool head of the floating tool head assembly to the wafer trimming starting point calculated in step 3 through the moving device;

[0024] Step 5: The tool device follows to trim the wafer glue overflow; the wafer rotates under the drive of the wafer carrier and moves along a circular trajectory or a cam trajectory for at least one circle, and the corresponding moving device drives the tool device to follow the trajectory of the wafer to perform adaptive movement, and the adaptive movement is used to keep the blade of the floating blade assembly always close to the edge of the wafer to ensure that the distance between the two is always consistent, so as to achieve the removal of the glue overflow on the edge of the wafer; at the same time, during the wafer trimming process, the visual positioning component performs visual inspection to obtain the notch coordinates at the end of the wafer trimming; after the trimming is completed, the moving device and the tool device are reset to the initial position;

[0025] Step 6: repairing the overflow glue at the notch mouth; after step 5, the wafer stage of the rotating adsorption device rotates the wafer according to the notch mouth coordinates obtained in step 5, and rotates the notch mouth to a preset starting position for repairing the notch mouth, and then the tool device adjusts the angle of the floating tool head assembly, and drives the floating tool head assembly to approach the starting position for repairing the notch mouth through the moving device to perform a notch mouth profiling action, so as to remove the overflow glue in the notch mouth along the shape of the notch mouth;

[0026] Step 7: Wafer unloading; after all the overflow glue is removed, the rotating adsorption device disconnects the adsorption of the wafer, and the wafer with the overflow glue removed is taken away manually or by a robot.

[0027] Furthermore, the trimming method also includes step 8: tool wear detection; adjusting the angle of the floating cutter head assembly by the rotating assembly of the tool device, and at the same time the moving device moves the tool device to the top of the visual positioning assembly, the visual positioning assembly performs visual inspection on the cutter head of the floating cutter head assembly to determine the degree of wear of the cutter head; after the inspection is completed, the moving device and the tool device are reset to the initial position, and prompt whether the cutter head needs to be replaced according to the degree of wear.

[0028] Furthermore, in the step 2 of wafer positioning, the visual positioning component performs multiple visual inspections on the edge of the lower surface of the wafer without glue overflow to obtain multiple wafer center coordinates; specifically, after each visual inspection, the wafer carrier is used to drive the wafer to rotate a predetermined angle before the next visual inspection is performed; finally, the average value of the multiple wafer center coordinates is taken as the final wafer center coordinate.

[0029] Furthermore, before executing step 6, the inclination angle of the floating cutter head assembly is adjusted, and then steps 2 to 5 are repeated to achieve internal repair of the overflow glue on the edge of the wafer; the trimming equipment also includes a chip extraction device; in steps 5 and 6, the chip extraction device works synchronously to suck out the removed glue chips.

[0030] After adopting the above technical solution, a rotating adsorption device, a positioning device, a moving device and a tool device are provided. It has high flexibility, can realize the distance between the tool and the wafer to follow at all times, the trimming head does not damage the wafer, the overflow trimming is uniform, the wear of the tool head is controllable, and the automatic removal of glue from the notch mouth can be realized, which is convenient for wafer positioning in subsequent processes. At the same time, the wafer with a large amount of overflow glue before debonding can be trimmed, and internal repair can be performed to ensure that the overflow glue does not protrude from the edge of the wafer, improve the yield of wafer bonding, and avoid safety hazards. Compared with manual work, it avoids damage and contamination to the wafer caused by uneven force of manual trimming, effectively improving production efficiency and product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1A perspective view of an edge trimming device according to an embodiment of the present invention;

[0032] Figure 2 A schematic diagram of the cooperation between the rotary adsorption device and the positioning device of an embodiment of the present invention;

[0033] Figure 3 A schematic structural diagram of a rotary adsorption device according to an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of the cooperation between the moving device and the tool device of an embodiment of the present invention;

[0035] Figure 5 A schematic structural diagram of a tool device according to an embodiment of the present invention;

[0036] Figure 6 A schematic flow chart of a trimming method according to an embodiment of the present invention;

[0037] Figure 7 for Figure 1 Enlarged view of point A.

[0038] Explanation of reference numerals: trimming device 100, rotating adsorption device 10, wafer carrier 11, adsorption platform 12, carrier rotation assembly 13, sensor 14, tool device 20, rotation assembly 21, mounting plate 211, rotating seat 212, horizontal rotation driver 213, tool mounting seat 214, tilting rotation driver 215, floating tool head assembly 22, tool head 221, tool head seat 222, tool head spring 223, slider 224, through hole 225, moving device 30, moving slider 31, positioning device 40, visual positioning assembly 41, detection window 411, visual assembly 412, visual moving assembly 413, chip extraction device 50, chip guard 51, chip guide chamber 511, chip extraction box 52, chip collecting groove 521, lifting assembly 53, wafer 200, notch opening 201. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0040] like Figures 1 to 5 As shown, a wafer overflow trimming device 100 of the present embodiment includes a rotating adsorption device 10 , a tool device 20 , a moving device 30 , a positioning device 40 and a chip extraction device 50 .

[0041] like Figure 1As shown, the rotating adsorption device 10 includes a wafer stage 11 for adsorbing and driving the wafer 200 to rotate, and the diameter of the wafer stage 11 is smaller than the diameter of the wafer 200; the rotating adsorption device 10 can fix the wafer 200 by vacuum adsorption, and of course other methods can also be used to ensure that the outer edge of the wafer 200 with a larger diameter is located outside the wafer stage 11.

[0042] Specific reference Figure 3 The rotating adsorption device 10 also includes an adsorption platform 12, a carrier rotating assembly 13 and a vacuum adsorption assembly (not shown); the wafer carrier 11 is rotatably installed on the top of the adsorption platform 12, and the carrier rotating assembly 13 can be a motor installed inside the adsorption platform 12, which is used to drive the wafer carrier 11 to rotate; the vacuum adsorption assembly includes a vacuum pipeline connected to the top surface of the wafer carrier 11 to provide vacuum suction.

[0043] A sensor 14 may also be provided on the side of the adsorption platform 12 for identifying whether a wafer is placed.

[0044] like Figure 1 As shown, the tool device 20 is installed on a moving device 30, and the moving device 30 is located at the periphery of the rotating adsorption device 10. The moving device 30 is used to drive the tool device 20 to approach or move away from the periphery of the wafer 200 on the wafer carrier 11; therefore, when the wafer carrier 11 drives the wafer 200 to rotate, the tool device 20 can be close to the periphery of the wafer 200 to achieve the repair of the overflowed glue.

[0045] The moving device 30 of this embodiment can be a common XY moving component, which is used to drive the tool device 20 to reciprocate along the XY direction.

[0046] See also Figure 4 and Figure 5 The tool device 20 includes a rotating component 21 and a floating tool head component 22. The tool head 221 of the floating tool head component 22 can adaptively extend and retract forward and backward to avoid hard contact between the tool head 221 and the wafer 200 itself and damage to the wafer 200. The rotating component 21 is used to adjust the rotation angle and tilt angle of the floating tool head component 22; thereby adjusting the contact position between the floating tool head component 22 and the outer edge of the wafer 200, and at the same time, the tilt angle of the floating tool head component 22 can be adjusted to adjust the angle between the floating tool head component 22 and the top surface of the wafer 200, so as to realize internal repair of the wafer and ensure that the overflow glue does not protrude from the edge of the wafer.

[0047] Specifically, the rotating assembly 21 of the tool device 20 includes a mounting plate 211, a rotating seat 212, a horizontal rotating driver 213, a tool mounting seat 214 and a tilted rotating driver 215; the mounting plate 211 can be installed on the moving slider 31 of the moving device 30, the rotating seat 212 and the horizontal rotating driver 213 are both installed on the mounting plate 211, and the horizontal rotating driver 213 drives the rotating seat 212 to rotate horizontally on the mounting plate 211; the tilted rotating driver 215 and the tool mounting seat 214 are both installed on the rotating seat 212, and the tilted rotating driver 215 drives the tool mounting seat 214 to rotate tilted relative to the horizontal plane on the rotating seat 212; the floating tool head assembly 22 is installed on the tool mounting seat 214.

[0048] The horizontal rotation driver 213 and the tilt rotation driver 215 of this embodiment may be motors, and the rotating seat 212 and the tool mounting seat 214 may both be "L"-shaped.

[0049] like Figure 5 The floating cutter head assembly 22 includes a cutter head 221, a cutter head seat 222 and a cutter head spring 223; the cutter head 221 is detachably mounted on one end of the cutter head seat 222 close to the wafer carrier 11, and the other end of the cutter head seat 222 can be reciprocatingly slidably mounted and limited on the tool mounting seat 214, and a slider 224 can be provided on the tool mounting seat 214, and a slide groove (not shown) that cooperates with the slider 224 is provided on the cutter head seat 222; and the cutter head spring 223 is arranged between the end surface of the cutter head seat 222 away from the cutter head 221 and the tool mounting seat 214, and the cutter head spring 223 provides elastic force to make the cutter head 221 and the cutter head seat 222 slide outward, and allows the cutter head 221 and the cutter head seat 222 to retreat and make way on the tool mounting seat 214, so as to avoid hard contact between the cutter head 221 and the wafer 200 and cause damage to the wafer 200.

[0050] like Figure 1 and Figure 2 As shown, the positioning device 40 includes two visual positioning components 41 arranged on the outer periphery of the rotating adsorption device 10 and spaced circumferentially, and the visual positioning component 41 includes a detection window 411 facing upward for visual detection, and the detection window 411 is located below the wafer 200 on the wafer stage 11. Through the detection window 411, the edge without overflowing glue below the wafer 200 can be visually inspected, that is, the lower surface of the wafer 200 can be photographed and analyzed, and the coordinates of the center of the wafer 200 can be calculated, thereby locating the specific position of the wafer 200 on the wafer stage 11. The positioning device 40 of this embodiment has two visual positioning components 41 spaced 90° circumferentially. Thereby improving the speed and accuracy of positioning recognition.

[0051] Also see Figure 1In this embodiment, the left side, the rear side and the right side of the rotating adsorption device 10 are sequentially distributed with the moving device 30, the first visual positioning component 41 and the second visual positioning component 41.

[0052] The visual positioning component 41 of this embodiment includes a visual component 412 and a visual moving component 413. The visual component 412 is provided with the detection window 411 at the top of one end close to the rotating adsorption device 10; the visual component 412 can be installed on the top of the visual moving component 413, and the visual moving component 413 can include a driving cylinder. The visual moving component 413 controls the detection window 411 of the visual component 412 to move along the radial direction of the wafer stage 11. Therefore, the position of the detection window 411 can be adjusted according to wafers 200 of different sizes, thereby improving the versatility of the device.

[0053] Another example Figure 1 As shown, the chip extraction device 50 of this embodiment includes a chip cover 51, a chip box 52, a suction assembly (not shown) and a lifting assembly 53; the chip cover 51 is arranged on the side of the floating cutter head assembly 22 where the cutter head 221 is away from the wafer carrier 11 to form a chip guide chamber 511, and the bottom of the chip guide chamber 511 is open, and the inside of the cutter head 221 has a through hole 225 connected to the chip guide chamber 511; the top of the chip box 52 is open to form a chip collecting groove 521, and the chip collecting groove 521 is located below the trimming point where the floating cutter head assembly 22 and the wafer 200 contact; the suction assembly has a suction channel connected to the chip collecting groove 521; the lifting assembly 53 drives the chip box 52 to move up and down, and the lifting assembly 53 may include a driving cylinder. Therefore, the chip guard 51 can guide the rubber chips cut by the cutter head 221 into the chip collecting groove 521 on the chip box 52, and then be extracted by the suction component, ensuring the cleanliness of the equipment working environment, and the lifting component 53 can control the height of the chip box 52, thereby improving the chip extraction efficiency.

[0054] Thus, the embodiment is provided with the rotating adsorption device 10, the positioning device 40, the moving device 30 and the tool device 20. It has high flexibility, can achieve the distance between the cutter head 221 and the wafer 200 to follow all the time, the trimming cutter head 221 does not damage the wafer 200, the overflow trimming is uniform, the wear of the cutter head 221 is controllable, and the notch 201 (see Figure 7 ) to facilitate the positioning of the wafer 200 in subsequent processes. Compared with manual work, it avoids the damage and contamination of the wafer 200 caused by uneven force of manual trimming, and effectively improves production efficiency and product yield.

[0055] Specifically, using the above-mentioned device structure, such as Figure 6 This embodiment provides a wafer overflow adhesive trimming method, comprising the following steps:

[0056] Step 1: Wafer loading; the wafer 200 is placed on the wafer carrier 11 of the rotating adsorption device 10 manually or by a robot, and the wafer 200 is adsorbed on the wafer carrier 11; specifically, the wafer 200 can be fixed by vacuum adsorption.

[0057] Step 2: Wafer positioning; use the visual positioning component 41 of the positioning device 40 to visually detect the edge of the lower surface of the wafer 200 without glue overflow to obtain the center coordinates of the wafer 200; the arc edge of the lower surface of the wafer 200 can be identified to calculate the center coordinates of the wafer 200 in a preset spatial coordinate system.

[0058] Step 3: Calculate the wafer trimming starting point; compare the center coordinates of the wafer 200 obtained in step 2 with the center coordinates of the wafer stage 11, and calculate the trimming starting point of the wafer 200. Since the center coordinates of the wafer stage 11 are pre-set and known, the coordinates of the trimming starting point of the wafer 200 can be calculated based on the center coordinates of the wafer 200 obtained by detection, which is convenient for the subsequent cutting of the tool device 20.

[0059] Step 4: Prepare trimming of the tool device; adjust the rotation angle and tilt angle of the floating tool head assembly 22 through the rotating assembly 21 of the tool device 20. After adjusting the angle, move the tool head 221 of the floating tool head assembly 22 to the trimming starting point of the wafer 200 calculated in step 3 through the moving device 30.

[0060] Step 5: The cutter device is driven to trim the wafer overflow; the wafer 200 is driven by the wafer carrier 11 to rotate and make at least one circle of circular trajectory or cam trajectory movement (after loading, when the wafer 200 is concentric with the wafer carrier 11, the wafer 200 moves in a circular trajectory, but in practice, most of the wafers 200 and the wafer carrier 11 will be eccentric, and the wafer 200 moves in a cam trajectory), specifically, the wafer 200 can be rotated more than 360°; the corresponding moving device 30 drives the cutter device 20 follows the trajectory of the wafer 200 to perform adaptive movement (in the present embodiment, the adaptive movement refers to the moving device 30 driving the tool device 20 to perform follow-up reciprocating movement in the direction of the connecting line between the trimming starting point of the wafer 200 and the center of the wafer carrier 11). The adaptive movement is used to keep the tool head 221 of the floating tool head assembly 22 always close to the edge of the wafer 200 to ensure that the distance between the two is always consistent, for example, keeping the distance at 0, so as to achieve accurate removal of the overflow glue on the edge of the wafer 200 without damaging the wafer 200 itself.

[0061] Meanwhile, during the wafer trimming process, the visual positioning component 41 performs visual inspection to obtain the coordinates of the notch 201 when the wafer 200 is trimmed. Specifically, the visual positioning component 41 performs multiple photo inspections in real time during the rotation of the wafer 200 during trimming.

[0062] After the trimming is completed, the moving device 30 and the tool device 20 are reset to the initial position.

[0063] Step 6: Repair the overflowed glue at the notch mouth; after step 5, the wafer carrier 11 of the rotating adsorption device 10 rotates the wafer 200 according to the coordinates of the notch mouth 201 obtained in step 5, and rotates the notch mouth 201 to the preset starting position of the notch mouth 201 for repairing, and then the tool device 20 adjusts the angle of the floating tool head assembly 22, and drives the floating tool head assembly 22 to approach the starting position of the notch mouth 201 for repairing through the moving device 30 to perform the notch mouth 201 profiling action, so as to remove the overflowed glue in the notch mouth 201 along the shape of the notch mouth 201; the automatic removal of the overflowed glue in the notch mouth 201 can be realized conveniently and quickly.

[0064] Step 7: Wafer unloading; after all the overflowed glue is removed, the rotating adsorption device 10 disconnects the adsorption of the wafer 200, and the wafer 200 with the overflowed glue removed is taken away manually or by a robot.

[0065] Furthermore, in the step 2 for positioning the wafer 200, the visual positioning component 41 performs multiple visual inspections on the edge of the lower surface of the wafer 200 without glue overflow to obtain multiple center coordinates of the wafer 200; specifically, after each visual inspection, the wafer carrier 11 is used to drive the wafer 200 to rotate a predetermined angle before the next visual inspection; finally, the average value of the multiple center coordinates of the wafer 200 is taken as the final center coordinate of the wafer 200, so as to provide the accuracy of the center coordinate of the wafer 200.

[0066] Before executing step 6, the inclination angle of the floating cutter head assembly 22 can be adjusted as needed, and then steps 2 to 5 can be repeated to achieve internal repair of the wafer to ensure that the overflow glue does not protrude from the edge of the wafer, thereby achieving accurate removal of the overflow glue at the edge of the wafer 200.

[0067] At the same time, in step 5 and step 6, the scrap extraction device 50 works synchronously to extract the removed glue scraps to ensure a clean environment.

[0068] The trimming method described in this embodiment may also include step 8: tool wear detection; adjusting the angle of the floating cutter head assembly 22 by the rotating assembly 21 of the tool device 20, and at the same time the moving device 30 moves the tool device 20 to the top of the visual positioning assembly 41, and the visual positioning assembly 41 performs visual detection on the cutter head 221 of the floating cutter head assembly 22 to determine the degree of wear of the cutter head 221; since the shape and size of the cutter head 221 are small, it is difficult for the human eye to specifically observe the degree of wear, so through the photographic detection of the visual positioning assembly 41, the degree of wear of the cutter head 221 can be automatically and efficiently identified, which is more accurate, reliable and faster than human eye recognition.

[0069] After the detection is completed, the moving device 30 and the tool device 20 are reset to the initial position, and then it is prompted whether the cutter head 221 needs to be replaced according to the degree of wear, so as to ensure that the cutter head 221 has a good effect in removing the overflowed glue.

[0070] In summary, the embodiments of the present invention also have at least the following advantages:

[0071] ① The overall structure of the present invention is compact, occupies a small area, and can be automated;

[0072] ② The present invention adopts the positioning device 40, and the wafer 200 is conveniently and accurately positioned without manual adjustment;

[0073] ③ The present invention adopts a moving device 30 and a tool device 20 with a rotating component 21. The blade has a high degree of flexibility and can follow the rotating adsorption device 10.

[0074] ④ The wear of the cutter head 221 of the present invention is controllable, thereby preventing the cutter head 221 from damaging the wafer 200 .

[0075] ⑤ During trimming, the cutter head 221 and the wafer 200 always move together, and the cutter head 221 always maintains a safe distance from the wafer 200, so as not to damage the wafer 200.

[0076] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, equivalent changes and modifications without departing from the principle of the present invention should still belong to the protection scope of the present invention.

[0077] In the description of the embodiments of the present application, it should be understood that the indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the application is usually placed when in use, or is the orientation or position relationship commonly understood by technical personnel in this field. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

Claims

1. A wafer overflow trimming device, characterized by: It includes a rotating adsorption device, a tool device, a moving device and a positioning device; The rotary adsorption device comprises a wafer stage for adsorbing and driving the wafer to rotate, wherein the diameter of the wafer stage is smaller than the diameter of the wafer; The tool device is installed on a moving device, which is located at the periphery of the rotating adsorption device, and is used to drive the tool device to approach or move away from the periphery of the wafer on the wafer stage; The tool device comprises a rotating assembly and a floating cutter head assembly, the cutter head of the floating cutter head assembly can adaptively move forward and backward, and the rotating assembly is used to adjust the rotation angle and tilt angle of the floating cutter head assembly; The rotating assembly of the tool device includes a mounting plate, a rotating seat, a horizontal rotating drive, a tool mounting seat and a tilting rotating drive; the mounting plate is mounted and connected to the moving device, the rotating seat and the horizontal rotating drive are both mounted on the mounting plate, and the horizontal rotating drive drives the rotating seat to rotate horizontally on the mounting plate; the tilting rotating drive and the tool mounting seat are both mounted on the rotating seat, and the tilting rotating drive drives the tool mounting seat to rotate tilted relative to the horizontal plane on the rotating seat; the floating cutter head assembly is mounted on the tool mounting seat; The floating cutter head assembly comprises a cutter head, a cutter head seat and a cutter head spring; the cutter head is detachably mounted on one end of the cutter head seat close to the wafer stage, the other end of the cutter head seat can be reciprocatingly slidably mounted on the cutter mounting seat, and the cutter head spring is arranged between the end face of the cutter head seat away from the cutter head and the cutter mounting seat; The positioning device includes two visual positioning components arranged on the outer periphery of the rotating adsorption device and spaced circumferentially, the visual positioning component includes a detection window facing upward for visual detection, and the detection window is located below the wafer on the wafer stage; The two visual positioning components are circumferentially spaced 90° apart; the visual positioning component includes a visual component and a visual moving component, and the detection window is arranged at the top of the visual component close to the rotating adsorption device; the visual moving component controls the detection window of the visual component to move along the radial direction of the wafer carrier.

2. The wafer overflow trimming device according to claim 1, characterized in that: The moving device is an XY moving component, which is used to drive the tool device to reciprocate along the XY direction; the rotating adsorption device also includes an adsorption platform, a carrier rotation component and a vacuum adsorption component; the wafer carrier is rotatably installed on the top of the adsorption platform, and the carrier rotation component is used to drive the wafer carrier to rotate; the vacuum adsorption component includes a vacuum pipeline connected to the top surface of the wafer carrier.

3. The wafer overflow trimming device according to claim 1, characterized in that: The chip extraction device also includes a chip guard, a chip extraction box, a suction assembly and a lifting assembly; the chip guard is arranged on the side of the floating cutter head assembly away from the wafer carrier to form a chip guide cavity, and the bottom of the chip guide cavity is open, and the inside of the cutter head has a through hole connected to the chip guide cavity; the top of the chip extraction box is open to form a chip collection groove, and the chip collection groove is located below the trimming point where the floating cutter head assembly contacts the wafer; the suction assembly has a suction channel connected to the chip collection groove; The lifting assembly drives the chip box to move up and down.

4. A wafer overflow trimming method, characterized in that: Use trimming equipment to trim the overflow of the wafer; The trimming device comprises a rotary adsorption device, a tool device, a moving device and a positioning device; The rotary adsorption device comprises a wafer stage for adsorbing and driving the wafer to rotate, wherein the diameter of the wafer stage is smaller than the diameter of the wafer; The tool device is installed on a moving device, which is located at the periphery of the rotating adsorption device, and is used to drive the tool device to approach or move away from the periphery of the wafer on the wafer stage; The tool device comprises a rotating assembly and a floating cutter head assembly, the cutter head of the floating cutter head assembly can adaptively move forward and backward, and the rotating assembly is used to adjust the rotation angle and tilt angle of the floating cutter head assembly; The positioning device includes two visual positioning components arranged on the outer periphery of the rotating adsorption device and spaced circumferentially, the visual positioning component includes a detection window facing upward for visual detection, and the detection window is located below the wafer on the wafer stage; The two visual positioning components are circumferentially spaced 90° apart; the visual positioning component includes a visual component and a visual moving component, and the detection window is arranged at the top of the visual component close to the rotating adsorption device; the visual moving component controls the detection window of the visual component to move along the radial direction of the wafer stage; The trimming method comprises the following steps: Step 1: Wafer loading; The wafer is placed on the wafer carrier of the rotating adsorption device manually or by a robot, and the wafer is adsorbed on the wafer carrier; Step 2: Wafer positioning: Use the visual positioning component of the positioning device to visually detect the edge of the lower surface of the wafer without overflowing glue to obtain the coordinates of the center of the wafer; Step 3: Calculate the wafer trimming starting point; compare the wafer center coordinates obtained in step 2 with the wafer stage center coordinates, and calculate the wafer trimming starting point; Step 4: Prepare the trimming of the tool device; adjust the rotation angle and tilt angle of the floating tool head assembly through the rotating assembly of the tool device. After the angle is adjusted, move the tool head of the floating tool head assembly to the wafer trimming starting point calculated in step 3 through the moving device; Step 5: The tool device follows to trim the wafer glue overflow; the wafer rotates under the drive of the wafer carrier and moves along a circular trajectory or a cam trajectory for at least one circle, and the corresponding moving device drives the tool device to follow the trajectory of the wafer to perform adaptive movement, and the adaptive movement is used to keep the blade of the floating blade assembly always close to the edge of the wafer to ensure that the distance between the two is always consistent, so as to achieve the removal of the glue overflow on the edge of the wafer; at the same time, during the wafer trimming process, the visual positioning component performs visual inspection to obtain the notch coordinates at the end of the wafer trimming; after the trimming is completed, the moving device and the tool device are reset to the initial position; Step 6: repairing the overflow glue at the notch mouth; after step 5, the wafer stage of the rotating adsorption device rotates the wafer according to the notch mouth coordinates obtained in step 5, and rotates the notch mouth to a preset starting position for repairing the notch mouth, and then the tool device adjusts the angle of the floating tool head assembly, and drives the floating tool head assembly to approach the starting position for repairing the notch mouth through the moving device to perform a notch mouth profiling action, so as to remove the overflow glue in the notch mouth along the shape of the notch mouth; Step 7: Wafer unloading; After all the overflow glue is removed, the rotating adsorption device disconnects the adsorption of the wafer, and the wafer after the overflow glue is removed is taken away manually or by a robot.

5. A wafer overflow trimming method according to claim 4, characterized in that: The trimming method also includes step 8: tool wear detection; adjusting the angle of the floating cutter head assembly by the rotating assembly of the tool device, and at the same time the moving device moves the tool device to the top of the visual positioning assembly, the visual positioning assembly performs a visual inspection on the tool head of the floating cutter head assembly to determine the degree of wear of the tool head; after the inspection is completed, the moving device and the tool device are reset to the initial position, and prompt whether the cutter head needs to be replaced according to the degree of wear.

6. A wafer overflow trimming method according to claim 4, characterized in that: In the wafer positioning of step 2, the visual positioning component performs multiple visual inspections on the edge of the lower surface of the wafer without glue overflow to obtain multiple wafer center coordinates; specifically, after each visual inspection, the wafer is driven by the wafer carrier to rotate a predetermined angle before the next visual inspection; finally, the average value of the multiple wafer center coordinates is taken as the final wafer center coordinate.

7. A wafer overflow trimming method according to claim 4, characterized in that: Before executing step 6, adjust the inclination angle of the floating cutter head assembly, and then repeat steps 2 to 5 to achieve internal repair of the overflow glue on the edge of the wafer; the trimming equipment also includes a chip extraction device; in steps 5 and 6, the chip extraction device works synchronously to suck the removed glue chips.

Images