Special cleaning agent for electronic materials and preparation method thereof

Abstract

The invention relates to the technical field of cleaning agents, particularly provides a special cleaning agent for electronic materials and a preparation method of the special cleaning agent, and aims to effectively remove metal oxides and organic pollutants and reduce chemical residues on the cleaned surface to the greatest extent. The cleaning agent comprises ethyl levulinate as a solvent and alkyl polyglucoside as a surfactant, the organic acid comprises phytic acid and auxiliary acid, and the auxiliary acid is one of citric acid, formic acid or gluconic acid. The chelating agent is selected from at least one of EDTA (Ethylene Diamine Tetraacetic Acid), glycolic acid and polyaspartic acid, preferably a mixture of glycolic acid and polyaspartic acid. The cleaning agent can also comprise low-molecular-weight polyethylene glycol and aspergillus niger lipase. Through the synergistic effect of the compound organic acid, the chelating agent and the biological enzyme, the cleaning agent can efficiently remove pollutants and remarkably reduce surface residues, is particularly suitable for cleaning high-precision electronic materials, and shows excellent cleaning performance and environment-friendly characteristics.

Description

Technical Field

[0001] The present invention relates to the technical field of cleaning agents, and in particular to a cleaning agent special for electronic materials and a preparation method thereof. Background Art

[0002] In the manufacturing process of electronic materials, the cleaning process is one of the key steps to ensure the cleanliness of the product surface, subsequent processing performance and device quality. Electronic materials such as semiconductors, aluminum-based copper-clad laminates, printed circuit boards (PCBs) are often affected by a variety of pollutants during the production process, including organic matter, metal oxides and other impurities. In order to ensure the efficient operation of these materials in precision manufacturing, the selection of cleaning agents is crucial.

[0003] At present, the electronic material cleaning agents commonly used in the market usually contain strong acids or strong bases, combined with surfactants and chelating agents to remove pollutants. However, although these cleaning agents have good cleaning ability, they are often accompanied by high corrosiveness and are prone to form chemical residues on the surface of the material after cleaning. The residual chemical substances not only affect the surface properties of the material, but may also have an adverse effect on the subsequent processing and device performance, especially in the field of high-precision manufacturing, such as the manufacturing process of microelectronics and optoelectronic components. The residues will interfere with the conductivity and heat dissipation of the material, and even affect the reliability and service life of the finished product.

[0004] In order to deal with these problems, some technical solutions have introduced biodegradable surfactants or green solvents to reduce the environmental burden of cleaning agents and reduce chemical residues. However, such cleaning agents often have difficulty in striking a balance between decontamination ability and residual problems, especially when dealing with complex metal oxides and organic pollutants. The application effect of traditional single chelating agents is limited, and it is not easy to completely remove them during the rinsing process, and harmful residues are still easily left.

[0005] In order to solve the above problems, in recent years, the solution of compounding different types of chelating agents and introducing biodegradable and low-corrosive green chemical components has gradually become a research hotspot. By compounding different chelating agents in cleaning agents, the cleaning ability of cleaning agents for different metal ions, metal oxides and organic pollutants can be enhanced, while reducing corrosion and residue. However, the specific design of the compounding ratio of chelating agents and the targeted removal of different pollutants in the prior art are still insufficient, and it is impossible to achieve the optimal balance between efficient cleaning, low corrosion and low residue.

[0006] Therefore, there is an urgent need to develop a special cleaning agent for electronic materials that has high-efficiency cleaning ability, low residue characteristics, good chelation effect and mild corrosiveness to different pollutants. Summary of the invention

[0007] In view of this, the present invention proposes a special cleaning agent for electronic materials and a preparation method thereof, aiming to maintain good decontamination performance while minimizing chemical residues after cleaning to meet the higher requirements for cleanliness and environmental protection in the manufacturing process of modern electronic materials.

[0008] The technical solution of the present invention is implemented as follows: The present invention provides a special cleaning agent for electronic materials, which, calculated by weight percentage as 100%, comprises:

[0009]

[0010] The balance is water, wherein the solvent is ethyl levulinate, the surfactant is alkyl polysaccharide, the organic acid comprises phytic acid and auxiliary acid, and the auxiliary acid further comprises one of citric acid, formic acid and gluconic acid.

[0011] In the development process of cleaning agents, reducing surface residues is a very critical technical problem, especially in the manufacturing process of high-precision electronic materials, where residues not only affect subsequent processes, but also damage product performance. Residues in cleaning agents usually come from pollutants that are not completely removed and chemical substances deposited on the surface of the cleaning agent itself. In the above embodiment, a compounded organic acid scheme is adopted, which has significant advantages in reducing residues. Phytic acid is a polyphosphoric acid organic acid, which contains multiple phosphate groups in its molecular structure, each of which can provide a negative charge, which enables phytic acid to form multi-tooth chelates with a variety of metal ions. This chelate is very stable and can be completely dissolved in water, so metal ions and metal oxides can be completely separated from the surface of the material through the chelation of phytic acid to prevent them from re-depositing on the surface. The role of auxiliary acids in cleaning agents is not only to provide an acidic environment, but these organic acids themselves are also mild chelating agents. Their combination with phytic acid can enhance the removal ability of different types of metal ions, and by adjusting the pH value, the overall acid-base balance of the cleaning agent is optimized to ensure that the corrosion of the material surface during the cleaning process is minimized, and the organic acid itself can reduce harmful residues.

[0012] In some embodiments, the mass ratio of phytic acid: auxiliary acid is (1-2):1, preferably 3:2.

[0013] In the above embodiment, phytic acid, as a strong chelating agent, shows a strong ability in removing heavy metals and metal oxides, while auxiliary acids (such as citric acid, formic acid, and gluconic acid) can supplement and enhance the removal effect of specific metal ions. Through the preferred ratio design, the chelating ability is optimized to ensure that different types of metal pollutants can be chelated and dissolved in water, and finally removed with the rinse liquid. As a better ratio, the mass ratio of phytic acid: auxiliary acid is 3:2.

[0014] In some embodiments, the chelating agent includes at least one of EDTA, glycolic acid, and polyaspartic acid.

[0015] In some embodiments, the chelating agent is a mixture of glycolic acid and polyaspartic acid.

[0016] In the above embodiments, glycolic acid and polyaspartic acid each have a strong chelating ability, and the rapid penetration of glycolic acid and the long-lasting effect of polyaspartic acid can be effectively combined to form a stable metal chelate. This dual effect ensures that the pollutants are completely removed and carried away with water during the rinsing process, thereby greatly reducing the possibility of residue. Since polyaspartic acid has good biodegradability and glycolic acid is also a mild organic acid, the entire cleaning system has excellent environmental protection characteristics, avoids the risk of residual toxic chemicals, and is particularly suitable for cleaning high-precision electronic materials, such as semiconductors and microelectronic devices. Compared with common strong acid or EDTA systems, this chelating agent system can better protect the surface of the cleaning material and avoid excessive corrosion. Within a specific pH range, the mixture of glycolic acid and polyaspartic acid has a mild cleaning effect on the surface of the material, and will not cause surface damage due to strong acid corrosion, thereby reducing surface micropores and chemical residues.

[0017] In some embodiments, the cleaning agent further comprises 0.5-1% of low molecular weight polyethylene glycol, wherein the low molecular weight polyethylene glycol is one of PEG200, PEG400 or PEG600.

[0018] In the above implementation, low molecular weight PEG is selected mainly because low molecular weight PEG has better water solubility and rinsability, and will not easily form a film on the surface that is difficult to remove like high molecular weight polymers, thereby effectively reducing chemical residues. At the same time, low molecular weight PEG can also form a synergistic wetting effect with other components (such as surfactants and organic acids), improve the wettability of the surface and the diffusion of the cleaning agent, and ensure that the pollutants and cleaning agent components can be completely removed during rinsing.

[0019] In some embodiments, the cleaning agent further comprises 0.2-0.5% of Aspergillus niger lipase.

[0020] In the above implementation, Aspergillus niger lipase, as a biocatalyst, can catalytically decompose oily organic pollutants and convert them into water-soluble small molecular products such as glycerol and fatty acids, which are easily dissolved in water and rinsed away, thereby preventing oily pollutants from being deposited on the surface of the material after cleaning. The specificity and efficiency of the enzyme enable it to efficiently decompose organic pollutants under mild conditions.

[0021] In a second aspect, the present invention further provides a method for preparing the above-mentioned cleaning agent, comprising the following steps:

[0022] Step 1, dissolving ethyl levulinate in water, and then adding alkyl polysaccharide and stirring evenly;

[0023] Step 2: Add an organic acid and a chelating agent to the solution obtained in step 1 in sequence, stir and dissolve, and obtain a special cleaning agent for electronic materials.

[0024] In some embodiments, when the raw material further includes low molecular weight polyethylene glycol, in step 2, the low molecular weight polyethylene glycol is further added after the chelating agent is added.

[0025] In some embodiments, when the raw material further comprises Aspergillus niger lipase, in step 2, the Aspergillus niger lipase is further added after the chelating agent is added.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The cleaning agent of the present invention adopts a solution of compounding phytic acid and auxiliary acid, which effectively chelates and removes metal ions and metal oxide pollutants, ensures that the pollutants are completely separated from the surface of the material and taken away with the rinsing liquid, and reduces chemical residues. DETAILED DESCRIPTION

[0028] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the embodiments of the present invention belong. If the definitions set forth in this section are contrary to or otherwise inconsistent with the definitions set forth in the patents, patent applications, published patent applications, and other publications incorporated herein by reference, the definitions listed in this section take precedence over the definitions incorporated herein by reference.

[0030] Unless otherwise specified, the methods used in the following examples are all conventional methods. Unless otherwise specified, the materials, reagents and instruments used are all conventional materials, reagents and instruments in the art, and can be obtained by those skilled in the art through commercial channels.

[0031] When an amount, concentration or other value or parameter is expressed as a range, a preferred range or a range defined by a series of upper preferred values ​​and lower preferred values, this should be understood as specifically disclosing all ranges formed by any pairing of any range upper limit or preferred value with any range lower limit or preferred value, regardless of whether the range is disclosed separately. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted as including the range "1 to 4", "1 to 3", "1 to 2", "1 to 2 and 4 to 5", "1 to 3 and 5", etc. When a numerical range is described herein, unless otherwise stated, the range is intended to include its end values ​​and all integers and fractions within the range. In the present specification and claims, range definitions can be combined and / or interchanged, and if not otherwise stated, these ranges include all subranges contained therein.

[0032] Example 1

[0033] This embodiment provides a formula and preparation method of a cleaning agent

[0034] Raw materials weight percentage composition:

[0035] Ethyl levulinate: 3.5%

[0036] Alkyl polyglycoside: 1.5%.

[0037] Phytic acid: 0.6%

[0038] Citric acid: 0.4%

[0039] Glycol Acid: 0.5%

[0040] Polyaspartic acid: 0.5%

[0041] PEG 400: 0.7%

[0042] Aspergillus niger lipase: 0.3%

[0043] Water: Balance to 100%

[0044] Preparation method:

[0045] (1) Add ethyl levulinate into water and stir until uniform.

[0046] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0047] (3) Add phytic acid, citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0048] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0049] Example 2

[0050] This embodiment provides a formula and preparation method of a cleaning agent

[0051] Raw materials weight percentage composition:

[0052] Ethyl levulinate: 3.5%

[0053] Alkyl polyglycoside: 1.5%.

[0054] Phytic acid: 0.6%

[0055] Formic acid: 0.4%

[0056] Glycol Acid: 0.5%

[0057] Polyaspartic acid: 0.5%

[0058] PEG 400: 0.7%

[0059] Aspergillus niger lipase: 0.3%

[0060] Water: Balance to 100%

[0061] Preparation method:

[0062] (1) Add ethyl levulinate into water and stir until uniform.

[0063] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0064] (3) Add phytic acid, formic acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0065] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0066] Example 3

[0067] This embodiment provides a formula and preparation method of a cleaning agent

[0068] Raw materials weight percentage composition:

[0069] Ethyl levulinate: 3.5%

[0070] Alkyl polyglycoside: 1.5%.

[0071] Phytic acid: 0.6%

[0072] Gluconate: 0.4%

[0073] Glycol Acid: 0.5%

[0074] Polyaspartic acid: 0.5%

[0075] PEG 400: 0.7%

[0076] Aspergillus niger lipase: 0.3%

[0077] Water: Balance to 100%

[0078] Preparation method:

[0079] (1) Add ethyl levulinate into water and stir until uniform.

[0080] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0081] (3) Add phytic acid, gluconic acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0082] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0083] Example 4

[0084] This embodiment provides a formula and preparation method of a cleaning agent

[0085] Raw materials weight percentage composition:

[0086] Ethyl levulinate: 3.5%

[0087] Alkyl polyglycoside: 1.5%.

[0088] Phytic acid: 0.5%

[0089] Citric acid: 0.5%

[0090] Glycol Acid: 0.5%

[0091] Polyaspartic acid: 0.5%

[0092] PEG 400: 0.7%

[0093] Aspergillus niger lipase: 0.3%

[0094] Water: Balance to 100%

[0095] Preparation method:

[0096] (1) Add ethyl levulinate into water and stir until uniform.

[0097] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0098] (3) Add phytic acid, citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0099] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0100] Example 5

[0101] This embodiment provides a formula and preparation method of a cleaning agent

[0102] Raw materials weight percentage composition:

[0103] Ethyl levulinate: 3.5%

[0104] Alkyl polyglycoside: 1.5%.

[0105] Phytic acid: 0.66%

[0106] Citric acid: 0.33%

[0107] Glycol Acid: 0.5%

[0108] Polyaspartic acid: 0.5%

[0109] PEG 400: 0.7%

[0110] Aspergillus niger lipase: 0.3%

[0111] Water: Balance to 100%

[0112] Preparation method:

[0113] (1) Add ethyl levulinate into water and stir until uniform.

[0114] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0115] (3) Add phytic acid, citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0116] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0117] Comparative Example 1

[0118] This embodiment provides a formula and preparation method of a cleaning agent

[0119] Raw materials weight percentage composition:

[0120] Ethyl levulinate: 3.5%

[0121] Alkyl polyglycoside: 1.5%.

[0122] Phytic acid: 1%

[0123] Glycol Acid: 0.5%

[0124] Polyaspartic acid: 0.5%

[0125] PEG 400: 0.7%

[0126] Aspergillus niger lipase: 0.3%

[0127] Water: Balance to 100%

[0128] Preparation method:

[0129] (1) Add ethyl levulinate into water and stir until uniform.

[0130] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0131] (3) Add phytic acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0132] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0133] Comparative Example 2

[0134] This embodiment provides a formula and preparation method of a cleaning agent

[0135] Raw materials weight percentage composition:

[0136] Ethyl levulinate: 3.5%

[0137] Alkyl polyglycoside: 1.5%.

[0138] Citric acid: 1%

[0139] Glycol Acid: 0.5%

[0140] Polyaspartic acid: 0.5%

[0141] PEG 400: 0.7%

[0142] Aspergillus niger lipase: 0.3%

[0143] Water: Balance to 100%

[0144] Preparation method:

[0145] (1) Add ethyl levulinate into water and stir until uniform.

[0146] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0147] (3) Add citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0148] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0149] Example 6

[0150] This embodiment provides a formula and preparation method of a cleaning agent

[0151] Raw materials weight percentage composition:

[0152] Ethyl levulinate: 3.5%

[0153] Alkyl polyglycoside: 1.5%.

[0154] Phytic acid: 0.6%

[0155] Citric acid: 0.4%

[0156] EDTA: 1%

[0157] PEG 400: 0.7%

[0158] Aspergillus niger lipase: 0.3%

[0159] Water: Balance to 100%

[0160] Preparation method:

[0161] (1) Add ethyl levulinate into water and stir until uniform.

[0162] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0163] (3) Add phytic acid, citric acid and EDTA in order and continue stirring until dissolved.

[0164] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0165] Example 7

[0166] This embodiment provides a formula and preparation method of a cleaning agent

[0167] Raw materials weight percentage composition:

[0168] Ethyl levulinate: 3.5%

[0169] Alkyl polyglycoside: 1.5%.

[0170] Phytic acid: 0.6%

[0171] Citric acid: 0.4%

[0172] Glycol Acid: 1%

[0173] PEG 400: 0.7%

[0174] Aspergillus niger lipase: 0.3%

[0175] Water: Balance to 100%

[0176] Preparation method:

[0177] (1) Add ethyl levulinate into water and stir until uniform.

[0178] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0179] (3) Add phytic acid, citric acid and glycolic acid in order and continue stirring until dissolved.

[0180] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0181] Example 8

[0182] This embodiment provides a formula and preparation method of a cleaning agent

[0183] Raw materials weight percentage composition:

[0184] Ethyl levulinate: 3.5%

[0185] Alkyl polyglycoside: 1.5%.

[0186] Phytic acid: 0.6%

[0187] Citric acid: 0.4%

[0188] Polyaspartic acid: 1%

[0189] PEG 400: 0.7%

[0190] Aspergillus niger lipase: 0.3%

[0191] Water: Balance to 100%

[0192] Preparation method:

[0193] (1) Add ethyl levulinate into water and stir until uniform.

[0194] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0195] (3) Add phytic acid, citric acid and polyaspartic acid in order and continue stirring until dissolved.

[0196] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0197] Example 9

[0198] This embodiment provides a formula and preparation method of a cleaning agent

[0199] Raw materials weight percentage composition:

[0200] Ethyl levulinate: 3.5%

[0201] Alkyl polyglycoside: 1.5%.

[0202] Phytic acid: 0.6%

[0203] Citric acid: 0.4%

[0204] Glycol Acid: 0.5%

[0205] Polyaspartic acid: 0.5%

[0206] Aspergillus niger lipase: 0.3%

[0207] Water: Balance to 100%

[0208] Preparation method:

[0209] (1) Add ethyl levulinate into water and stir until uniform.

[0210] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0211] (3) Add phytic acid, citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0212] (4) Add Aspergillus niger lipase and stir evenly to obtain the final cleaning agent.

[0213] Example 10

[0214] This embodiment provides a formula and preparation method of a cleaning agent

[0215] Raw materials weight percentage composition:

[0216] Ethyl levulinate: 3.5%

[0217] Alkyl polyglycoside: 1.5%.

[0218] Phytic acid: 0.6%

[0219] Citric acid: 0.4%

[0220] Glycol Acid: 0.5%

[0221] Polyaspartic acid: 0.5%

[0222] PEG 400: 0.7%

[0223] Water: Balance to 100%

[0224] Preparation method:

[0225] (1) Add ethyl levulinate into water and stir until uniform.

[0226] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0227] (3) Add phytic acid, citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved. (4) Add PEG 400 and stir evenly to obtain the final cleaning agent.

[0228] Embodiment 11

[0229] This embodiment provides a formula and preparation method of a cleaning agent

[0230] Raw materials weight percentage composition:

[0231] Ethyl levulinate: 3.5%

[0232] Alkyl polyglycoside: 1.5%.

[0233] Phytic acid: 0.6%

[0234] Citric acid: 0.4%

[0235] Glycol Acid: 0.5%

[0236] Polyaspartic acid: 0.5%

[0237] Water: Balance to 100%

[0238] Preparation method:

[0239] (1) Add ethyl levulinate into water and stir until uniform.

[0240] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0241] (3) Add phytic acid, citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved to obtain the final cleaning agent.

[0242] Comparative Example 3

[0243] This embodiment provides a formula and preparation method of a cleaning agent

[0244] Raw materials weight percentage composition:

[0245] Ethyl levulinate: 3.5%

[0246] Alkyl polyglycoside: 1.5%.

[0247] Phytic acid: 0.6%

[0248] Citric acid: 0.4%

[0249] PEG 400: 0.7%

[0250] Aspergillus niger lipase: 0.3%

[0251] Water: Balance to 100%

[0252] Preparation method:

[0253] (1) Add ethyl levulinate into water and stir until uniform.

[0254] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0255] (3) Add phytic acid and citric acid in order and continue stirring until dissolved.

[0256] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0257] Example 12

[0258] This embodiment provides a formula and preparation method of a cleaning agent

[0259] Raw materials weight percentage composition:

[0260] Ethyl levulinate: 4%

[0261] Alkyl polyglycoside: 2%.

[0262] Phytic acid: 0.6%

[0263] Citric acid: 0.4%

[0264] Glycol Acid: 0.5%

[0265] Polyaspartic acid: 0.5%

[0266] PEG 400: 1%

[0267] Aspergillus niger lipase: 0.5%

[0268] Water: Balance to 100%

[0269] Preparation method:

[0270] (1) Add ethyl levulinate into water and stir until uniform.

[0271] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0272] (3) Add phytic acid, citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0273] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0274] Example 13

[0275] This embodiment provides a formula and preparation method of a cleaning agent

[0276] Raw materials weight percentage composition:

[0277] Ethyl levulinate: 2%

[0278] Alkyl polyglycoside: 1%.

[0279] Phytic acid: 0.3%

[0280] Citric acid: 0.2%

[0281] Glycol Acid: 0.2%

[0282] Polyaspartic acid: 0.3%

[0283] PEG 400: 0.5%

[0284] Aspergillus niger lipase: 0.2%

[0285] Water: Balance to 100%

[0286] Preparation method:

[0287] (1) Add ethyl levulinate into water and stir until uniform.

[0288] (2) Add alkyl polysaccharide and stir until completely dissolved.

[0289] (3) Add phytic acid, citric acid, glycolic acid and polyaspartic acid in order and continue stirring until dissolved.

[0290] (4) adding PEG 400 and stirring evenly, and finally adding Aspergillus niger lipase and stirring evenly to obtain the final cleaning agent.

[0291] The cleaning agents prepared in the above embodiments and comparative examples were used for cleaning tests of filter copper-clad laminates. The testing method included:

[0292] Take the aluminum-based copper-clad laminate to be tested, soak it in 100 ml of the cleaning agent of the embodiment or the comparative example for 10 minutes, and then rinse it with deionized water for 3 times, each time using 500 ml of water. After rinsing, use X-ray photoelectron spectroscopy to detect whether there is any residue on the surface of the material, and record the residual content of metal oxides and organic pollutants on the surface of the material before and after cleaning, and obtain the results shown in the following table:

[0293]

[0294] Among them, the surface data of the aluminum-based copper-clad laminate is:

[0295]

[0296] Example 5 The metal oxide residual values ​​of Example 10 and Example 12 are the lowest, which are 3.9ppm, 4.2ppm and 4.0ppm respectively, indicating that these cleaning agents have the best removal effect on metal oxides. The common point of these three groups of examples is that a composite system of phytic acid, citric acid, glycolic acid and polyaspartic acid is used, and its strong chelating effect ensures the efficient removal of metal oxides.

[0297] The residual amounts of metal oxides in Comparative Examples 1, 2 and 3 are relatively high, which are 6.5 ppm, 7.0 ppm and 6.8 ppm respectively, indicating that the formulations without compounded organic acids or lacking effective chelating agents are less effective in cleaning metal oxides.

[0298] The cleaning agents in the examples performed well in terms of residual organic pollutants, especially in Examples 5 and 12, where the residual organic pollutants were only 3.0 ppm and 2.9 ppm, respectively. The reason for this is that the addition of Aspergillus niger lipase can effectively decompose grease-based organic pollutants and convert them into small molecules that are easy to rinse.

[0299] The cleaning agent of the comparative example was not effective in removing organic pollutants, and a large amount of residues (5.2ppm-6.0ppm) were left, indicating that the cleaning agent components were insufficient to effectively decompose and remove organic pollutants.

[0300] The surface roughness of Example 5, Example 10 and Example 12 is 0.3 nm, indicating that the cleaning agent can not only efficiently remove pollutants but also cause minimal damage to the material surface, and is suitable for cleaning high-precision electronic materials.

[0301] The cleaning agents of the comparative examples, especially comparative examples 2 and 3, have a relatively high surface roughness (0.8 nm), indicating that there are more surface residues, resulting in a rough surface of the material.

[0302] The above results show that the combination of the compounded organic acid system and the chelating agent exhibits a strong synergistic effect. The compounded organic acids each play their own role in metal oxide chelation, and can cover metal ions of different types and valences, while the dual chelation of glycolic acid and polyaspartic acid ensures that the pollutants are completely detached from the surface.

[0303] The introduction of Aspergillus niger lipase greatly improved the removal efficiency of oily organic pollutants. Combined with low molecular weight PEG, it significantly reduced chemical residues and rinsing difficulty, forming an efficient cleaning system.

[0304] The cleaning agent formulas of Example 5, Example 10 and Example 12 achieve extremely low metal oxide and organic pollutant residues, extremely small surface roughness, and a cleaning effect far superior to that of the comparative example through the dual chelation effect of compounding organic acid, glycol acid and polyaspartic acid chelating agent, and the introduction of Aspergillus niger lipase.

[0305] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A cleaning agent for electronic materials, characterized in that: Calculated as 100% by weight, including: The balance is water, wherein the solvent is ethyl levulinate, the surfactant is alkyl polysaccharide, the organic acid comprises phytic acid and auxiliary acid, and the auxiliary acid further comprises one of citric acid, formic acid and gluconic acid.

2. The electronic material cleaning agent according to claim 1, characterized in that: The mass ratio of phytic acid to auxiliary acid is (1-2):

1.

3. The electronic material cleaning agent according to claim 1, characterized in that: The chelating agent includes at least one of EDTA, glycolic acid, and polyaspartic acid.

4. The electronic material cleaning agent according to claim 3, characterized in that: The chelating agent is a mixture of glycolic acid and polyaspartic acid.

5. The electronic material cleaning agent according to claim 1, characterized in that: The cleaning agent further comprises 0.5-1% of low molecular weight polyethylene glycol, and the low molecular weight polyethylene glycol is one of PEG200, PEG400 or PEG600.

6. The electronic material cleaning agent according to claim 1, characterized in that: The cleaning agent also includes 0.2-0.5% of Aspergillus niger lipase.

7. The method for preparing the special cleaning agent for electronic materials according to any one of claims 1 to 6, characterized in that: The steps include: Step 1, dissolving ethyl levulinate in water, and then adding alkyl polysaccharide and stirring evenly; Step 2: Add an organic acid and a chelating agent to the solution obtained in step 1 in sequence, stir and dissolve, and obtain a special cleaning agent for electronic materials.

8. The method for preparing the special cleaning agent for electronic materials according to claim 7, characterized in that: When the raw materials also include low molecular weight polyethylene glycol, in step 2, the low molecular weight polyethylene glycol is further added after the chelating agent is added.

9. The method for preparing the special cleaning agent for electronic materials according to claim 7, characterized in that: When the raw materials further include Aspergillus niger lipase, in step 2, the Aspergillus niger lipase is further added after the chelating agent is added.

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