A semiconductor special gas pipeline gas heating and insulation device

Abstract

The present invention relates to the field of gas heating technology, and specifically to a semiconductor special gas pipeline gas heating and insulation device, comprising: an insulation shell, two groups of exhaust pipes are fixedly connected on opposite sides of the insulation shell in the length direction, the two groups of exhaust pipes are arranged up and down on the side of the insulation shell, and the two groups of exhaust pipes are relatively inclined, and the bottom of the insulation shell is fixedly connected to a base; a heat conduction mechanism, the heat conduction mechanism includes a protective shell arranged inside the insulation shell, and the four corners of the inner wall of the protective shell are fixedly connected to insulation frames, and there is a spacing between two adjacent insulation frames, and the insulation frames are away from the two sides of the protective shell to form an inner arc surface. Through the drainage component and the airflow stirring component in the heat conduction mechanism, the unstable hot air flow transferred can be converted into uniform heat, thereby heating the gas transmitted in the air pipe, achieving uniform heating, avoiding local temperature problems, ensuring high-quality completion of processes such as chemical vapor deposition, and improving chip manufacturing quality and yield.

Description

Technical Field

[0001] The invention relates to the technical field of gas heating, and in particular to a semiconductor special gas pipeline gas heating and heat preservation device. Background Art

[0002] The semiconductor special gas pipeline gas heating and insulation device is a device specially used to heat and insulate the pipeline for transporting special gases in the semiconductor manufacturing process. Its purpose is to ensure that the special gas always maintains a stable temperature in the pipeline to meet the strict requirements of the semiconductor process on the gas temperature, thereby ensuring the smooth progress of processes such as chip manufacturing and the stability of product quality, such as a high-temperature gas heating device disclosed in publication number CN112797625A.

[0003] The existing semiconductor special gas pipeline gas heating and insulation device adopts a method in which the heating source directly contacts the gas pipeline and always maintains the same temperature, but cannot heat it in a step-by-step manner. This method will cause uneven gas temperature distribution and frequent local overheating, causing abnormal physical and chemical changes in the gas in the pipeline, changing its original properties and concentration, making it impossible to accurately match the subsequent semiconductor process requirements, resulting in temperature out of control problems when connecting process links. At the same time, the uneven gas temperature distribution and property changes will also cause abnormal chemical reactions between the gas in the pipeline and the pipeline material, accelerating the corrosion of the pipeline. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a semiconductor special gas pipeline gas heating and insulation device, which can effectively solve the problem that the prior art adopts the method of using the heating source to directly contact the gas pipeline and always maintain the same temperature, resulting in uneven gas temperature distribution and frequent local overheating.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] The present invention provides a semiconductor special gas pipeline gas heating and heat preservation device, comprising:

[0007] An insulation shell, wherein two sets of exhaust pipes are fixedly connected on both sides of the insulation shell, and the two sets of exhaust pipes are symmetrically arranged up and down on the side of the insulation shell, and the bottom of the insulation shell is fixedly connected to a base;

[0008] A heat conduction mechanism, wherein the heat conduction mechanism comprises a protective shell arranged inside the heat preservation shell, the four corners of the inner wall of the protective shell are fixedly connected with heat insulation frames, and there is a spacing between each two adjacent heat insulation frames, the two sides of the heat insulation frames away from the protective shell together constitute an inner arc surface, and the inner arc surface is provided with a plurality of exhaust holes in a rectangular array, a plurality of drainage components for guiding the flow direction of the hot air flow are arranged inside the heat insulation frame, and an airflow stirring component for stirring the hot air is arranged inside the heat insulation frame;

[0009] A vibration mechanism, wherein the vibration mechanism comprises a heating pipe fixedly connected to the inner arc surface of four protective shells, wherein the inner circumference of the heating pipe is fixedly connected with a plurality of groups of resonant hollow columns, wherein each group of the resonant hollow columns corresponds to the spacing between two adjacent insulation frames, wherein a plurality of vibration wave amplifying components are arranged in a rectangular array at the bottom of the resonant hollow columns, and a fixing rod corresponding to the resonant hollow column is arranged on the outer circumference of the heating pipe, and a plurality of resonant components are arranged in a linear array on the rod body of the fixing rod;

[0010] Wherein, heating mechanisms for providing heat to the heat-conducting mechanism are symmetrically arranged on both sides of the heat-insulating shell, and an air pipe is inserted inside the heating pipe.

[0011] Preferably, two partition plates are fixedly connected to the inside of the insulation frame, and the partition plates evenly divide the inside of the insulation frame into three heating zones, and the drainage assembly and the airflow stirring assembly correspond to the number of heating zones, and the protective shell is fixedly connected to air leak blocks on both opposite sides, and two adjacent insulation frames share one air leak block, and the upper end surface of the insulation frame is fixedly connected to a plurality of connecting pipes, and the connecting pipes are connected to the inside of each heating zone, and one end of each connecting pipe away from the insulation frame passes through the protective shell and is connected to the air leak block.

[0012] Preferably, the drainage assembly comprises an L-shaped plate fixedly connected to the interior of the heating zone, and the inner right angle of the L-shaped plate corresponds to the inner arc surface, a plurality of drainage grooves are provided in a linear array on the upper end surface of the L-shaped plate, and a plurality of heat-conducting columns are fixedly connected in a linear array on the inner wall of the inner right angle of the L-shaped plate;

[0013] The airflow stirring assembly is located in the L-shaped plate, and the airflow stirring assembly includes a rotating rod rotatably connected to the inner wall of the heating zone. The rod body of the rotating rod is fixedly connected to a plurality of multi-faceted stirring blades in a linear array, and each of the multi-faceted stirring blades is provided with a focusing groove at its edges and corners.

[0014] Preferably, a flow rate detector corresponding to the number of heating zones is fixedly connected to the inner circumference of the heating pipe, an air inlet corresponding to the heat insulation frame is opened on the inner circumference of the heating pipe, and the air inlet corresponds to the air outlet, the end of the fixing rod close to the resonant hollow column passes through the heating pipe and is fixedly connected to the resonant hollow column, the end of the resonant hollow column away from the heating pipe is fixedly connected to a round head block, and the end of the round head block away from the resonant hollow column is in contact with the air pipe;

[0015] The resonance component includes a vibration-guiding ring fixedly connected to the shaft of a fixed rod, a plurality of connecting rods are fixedly connected to the outer peripheral surface of the vibration-guiding ring in an annular array, and each of the connecting rods is fixedly connected to a vibration-focusing cavity at one end away from the vibration-guiding ring, and a plurality of resonance balls are fixedly connected to the inner rectangular array of the vibration-focusing cavity.

[0016] Preferably, the vibration wave amplification component includes a hollow column fixedly connected to the bottom of the resonant hollow column, a vibration focusing cover is fixedly connected to the top of the hollow column, and a plurality of convex balls are fixedly connected to the outer peripheral surface of the hollow column in a rectangular array.

[0017] Preferably, the heating mechanism has multiple components corresponding to the number of heating zones, the heating mechanism includes a protective frame fixedly connected to the side of the protective shell, the protective frame penetrates the insulation shell on the side away from the protective shell, and the protective frame is located between two groups of exhaust pipes, each group of the protective frames is located outside the insulation shell and is fixedly connected to a plurality of fans on the side, the protective frame is close to the fan and is rotatably connected to a plurality of mounting rods in an internal linear array, the mounting rod body is provided with a plurality of airflow convergence assemblies in a linear array, a plurality of heating rods are fixedly connected in a linear array inside the protective frame and behind the mounting rods, and a heat receiving block is fixedly connected thereto.

[0018] Preferably, each of the airflow convergence components includes two polygonal cones fixedly connected to the shaft of the mounting rod and a mixing ball, the mixing ball is fixedly connected to the thin ends of the two polygonal cones, and a plurality of mixing grooves are provided on the spherical surface of the mixing ball, a plurality of air ducts are fixedly connected in a linear array on the side of the protective frame facing the protective shell, and an end of the air duct away from the protective frame passes through the protective shell and is connected to the heating zone at the corresponding position.

[0019] Compared with the known prior art, the technical solution provided by the present invention has the following beneficial effects:

[0020] 1. The semiconductor special gas pipeline gas heating and insulation device, through the drainage component and the flow stirring component in the heat conduction mechanism, realizes the conversion of the thermally unstable hot air flow transferred into the thermally stable hot air flow, thereby heating the gas transmitted in the air pipe, wherein the drainage component can limit the flow direction of the thermally unstable hot air flow in the protective shell, thereby maximizing the use of the unstable hot air flow, and the flow stirring component can stir the uniform heat converted by the drainage component, so as to keep the temperature in the same area the same, achieve uniform heating, avoid local temperature problems, ensure the high-quality completion of processes such as chemical vapor deposition, and improve the chip manufacturing quality and yield rate.

[0021] 2. The semiconductor special gas pipeline gas heating and insulation device can collect the vibration waves generated by the unstable hot gas flow guided by the heat conduction mechanism through the resonance component, the resonance box and the vibration wave amplification component in the vibration mechanism, and act on the air pipe after strengthening. Among them, the resonance component collects the vibration waves generated by the unstable hot gas flow guided by the heat conduction mechanism, and the resonance box is used to receive the vibration waves transmitted by the resonance component, and use the vibration wave amplification component in the resonance box to amplify the vibration waves, and act on the air pipe after amplification, so that the gas flowing in the air pipe vibrates while being heated by the heat conduction mechanism. The semiconductor special gas pipeline gas heating and insulation device collects and amplifies the vibration waves generated by the unstable hot gas flow guided by the heat conduction mechanism to act on the air pipe through the resonance component, the resonance box and the vibration wave amplification component of the vibration mechanism, thereby improving the heating efficiency and uniformity, promoting heat transfer, reducing local hot spots, and improving the process quality of chemical vapor deposition and the chip yield.

[0022] 3. The semiconductor special gas pipeline gas heating and insulation device can provide a heat airflow source for the heat conduction mechanism through the fan, heating rod, airflow convergence component and heat block in the heating mechanism. Among them, the fan is used to absorb external air, and the airflow convergence component is responsible for reducing the speed of the external air absorbed by the fan. At the same time, the airflow convergence component can also convert the spiral air absorbed by the fan into direct current air, so that the heating rod can quickly heat the air, and the heat block can re-converge and guide the heated hot airflow to transmit it smoothly to the heat conduction mechanism, which is conducive to fast and efficient heating, stable and uniform heat transfer, so as to ensure the stability of the temperature when the gas is heated. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a structural schematic diagram of the heat conduction mechanism of the present invention;

[0026] Figure 3 It is a schematic diagram of the overall internal structure of the present invention;

[0027] Figure 4 It is a structural schematic diagram of the vibration mechanism of the present invention;

[0028] Figure 5 It is a schematic diagram of the structure inside the heat conduction mechanism of the present invention;

[0029] Figure 6 It is a structural schematic diagram of the airflow stirring assembly of the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of the drainage component of the present invention;

[0031] Figure 8 It is a schematic diagram of the overall structure of the vibration mechanism of the present invention;

[0032] Fig. 9 It is a schematic diagram of the overall structure of the heating mechanism of the present invention;

[0033] Fig.10 It is a structural schematic diagram of the airflow converging component of the present invention.

[0034] Figure numerals: 1, insulation shell; 11, exhaust pipe; 12, base; 2, heat conduction mechanism; 21, protective shell; 22, air release block; 23, insulation frame; 24, partition plate; 25, drainage assembly; 251, L-shaped plate; 252, drainage groove; 253, heat conduction column; 26, air flow stirring assembly; 261, rotating rod; 262, multi-faceted stirring blade; 263, flow collecting groove; 27, connecting pipe; 3, vibration mechanism; 31, heating pipe; 311, air hole; 32, fixing rod; 33, resonance assembly; 331 , vibration guide ring; 332, connecting rod; 333, vibration focusing cavity; 334, resonance ball; 35, flow rate detector; 36, resonance hollow column; 37, vibration wave amplification component; 371, hollow column; 372, convex ball; 373, vibration focusing cover; 38, round head block; 4, heating mechanism; 41, protection frame; 42, fan; 43, mounting rod; 44, heating rod; 45, heat receiving block; 46, air guide tube; 47, air flow convergence component; 471, polygonal pyramid; 472, mixing ball; 473, mixing tank; 5, air pipe. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] The present invention will be further described below in conjunction with the embodiments.

[0037] Example: Refer to Figures 1 to 10 , a semiconductor special gas pipeline gas heating and insulation device, comprising:

[0038] The insulation shell 1 has two sets of exhaust pipes 11 fixedly connected to both sides of the insulation shell 1. The two sets of exhaust pipes 11 are symmetrically arranged on the side of the insulation shell 1 in an inclined manner up and down. The bottom of the insulation shell 1 is fixedly connected to a base 12.

[0039] The heat conduction mechanism 2 includes a protective shell 21 arranged inside the heat preservation shell 1, and the four corners of the inner wall of the protective shell 21 are fixedly connected with heat insulation frames 23, and there is a spacing between each two adjacent heat insulation frames 23, and the two sides of the heat insulation frames 23 away from the protective shell 21 together form an inner arc surface, and the inner arc surface is provided with a plurality of exhaust holes in a rectangular array, and a plurality of guide components 25 for guiding the flow direction of the hot air flow are arranged inside the heat insulation frame 23, and an air flow stirring component 26 for stirring the hot air is arranged inside the heat insulation frame 23;

[0040] The vibration mechanism 3 includes a heating pipe 31 fixedly connected to the inner arc surface of the four protective shells 21, and the inner circumference of the heating pipe 31 is fixedly connected with a plurality of groups of resonant hollow columns 36, each group of resonant hollow columns 36 corresponds to the distance between two adjacent insulation frames 23, and a plurality of vibration wave amplifying components 37 are arranged in a rectangular array at the bottom of the resonant hollow columns 36, and a fixing rod 32 corresponding to the resonant hollow columns 36 is arranged on the outer circumference of the heating pipe 31, and a plurality of resonant components 33 are arranged in a linear array on the rod body of the fixing rod 32;

[0041] Wherein, heating mechanisms 4 for providing heat to the heat conducting mechanism 2 are symmetrically arranged on both sides of the heat-insulating shell 1 , and an air pipe 5 is inserted into the heating pipe 31 .

[0042] The thermal insulation frame 23 in the heat conduction mechanism 2 can be used to collect the transferred hot air flow, and the transferred unstable hot air flow can be converted into a stable hot air flow through the air flow stirring component 26. The air flow stirring component 26 can stir the converted air flow, so that the temperature of the converted stable hot air flow remains consistent. At the same time, the resonance component 33 in the vibration mechanism 3 can collect the vibration waves generated by the heat conduction mechanism 2 when guiding the air flow, and use the vibration wave amplification component 37 to amplify the vibration waves. The amplified vibration waves will act on the air pipe 5, so that the gas transmitted in the air pipe 5 will vibrate, thereby improving the heat transfer efficiency and reducing the temperature gradient. At the same time, it prevents particle deposition and agglomeration to ensure gas purity.

[0043] Reference Figures 3 to 5 Two partition plates 24 are fixedly connected to the inside of the insulation frame 23, and the partition plates 24 evenly divide the inside of the insulation frame 23 into three heating zones, and the drainage components 25 and the airflow stirring components 26 correspond to the number of heating zones. The protective shell 21 is fixedly connected to the air leakage blocks 22 on both opposite sides, and two adjacent insulation frames 23 share one air leakage block 22. The upper end surface of the insulation frame 23 is fixedly connected with a plurality of connecting pipes 27, and the connecting pipes 27 are connected to the inside of each heating zone, and the ends of each connecting pipe 27 away from the insulation frame 23 pass through the protective shell 21 and are connected to the air leakage block 22.

[0044] The insulation frame 23 can be divided into three heating zones by using two partition plates 24, and the three heating zones are connected to the air release block 22 through a connecting pipe 27, so that the unstable hot air flow that has been used in the heating zone can be discharged into the insulation shell 1, and the insulation shell 1 can be heated by using the residual heat of the unstable hot air flow, thereby achieving the insulation effect of the equipment and the air pipe 5 in the insulation shell 1, and the unstable hot air flow is discharged from the exhaust pipe 11.

[0045] Reference Figures 5 to 7 The drainage assembly 25 includes an L-shaped plate 251 fixedly connected to the interior of the heating zone, and the inner right angle of the L-shaped plate 251 corresponds to the inner arc surface, a plurality of drainage grooves 252 are linearly arranged on the upper end surface of the L-shaped plate 251, and a plurality of heat-conducting columns 253 are linearly arranged and fixedly connected to the inner wall of the inner right angle of the L-shaped plate 251;

[0046] The airflow stirring assembly 26 is located in the L-shaped plate 251, and the airflow stirring assembly 26 includes a rotating rod 261 rotatably connected to the inner wall of the heating zone. The rod body of the rotating rod 261 is fixedly connected to a plurality of multi-faceted stirring blades 262 in a linear array, and each multi-faceted stirring blade 262 has a focusing groove 263 at its edges and corners.

[0047] The L-shaped plate 251 in the drainage component 25 can be used to further spatially divide the heating area, so that the unstable hot air flow can flow along the drainage groove 252 of the L-shaped plate 251, and the heat in the unstable hot air flow can fully act on the L-shaped plate 251, and the L-shaped plate 251 will further transfer the heat to the heat-conducting column 253, thereby realizing the conversion of the unstable hot air flow to the stable hot air flow, and the multi-faceted stirring blade 262 in the airflow stirring component 26 can be used to stir the stable hot air flow, so that the temperature of the stable hot air flow in the L-shaped plate 251 can be kept consistent.

[0048] Reference Figure 4 , Figure 8 The inner circumference of the heating pipe 31 is fixedly connected with a flow rate detector 35 corresponding to the number of heating zones, the inner circumference of the heating pipe 31 is provided with an air inlet 311 corresponding to the heat insulation frame 23, and the air inlet 311 corresponds to the air outlet, the end of the fixing rod 32 close to the resonant hollow column 36 passes through the heating pipe 31 and is fixedly connected to the resonant hollow column 36, the end of the resonant hollow column 36 away from the heating pipe 31 is fixedly connected with a round head block 38, and the end of the round head block 38 away from the resonant hollow column 36 is in contact with the air pipe 5;

[0049] The resonance assembly 33 includes a vibration-guiding ring 331 fixedly connected to the shaft of the fixed rod 32, a plurality of connecting rods 332 are fixedly connected to the outer peripheral surface of the vibration-guiding ring 331 in an annular array, and each connecting rod 332 is fixedly connected to a vibration-focusing cavity 333 at one end away from the vibration-guiding ring 331, and a plurality of resonance balls 334 are fixedly connected to the inner rectangular array of the vibration-focusing cavity 333.

[0050] The vibration wave amplifying component 37 includes a hollow column 371 fixedly connected to the bottom of the resonant hollow column 36, a vibration focusing cover 373 fixedly connected to the top of the hollow column 371, and a plurality of convex balls 372 fixedly connected in a rectangular array on the outer peripheral surface of the hollow column 371.

[0051] The heating pipe 31 can be used to fix the air pipe 5. At the same time, the heating pipe 31 can transfer the stable hot air flow converted in the heat conduction mechanism 2 to the air pipe 5, thereby heating the gas transmitted in the air pipe 5, and the air pipe 5 in the heating pipe 31 can be suspended through the resonant hollow column 36 and the round head block 38, thereby avoiding direct contact between the air pipe 5 and the heating pipe 31. Among them, the vibration guide ring 331, the connecting rod 332 and the vibration focusing cavity 333 of the resonance component 33 can collect the vibration waves generated when the heat conduction mechanism 2 guides the unstable hot air flow, and transfer the collected vibration waves to the vibration wave amplification component 37 through the fixing rod 32, so that the collected vibration waves are enhanced by the vibration wave amplification component 37, and the enhanced vibration waves are transferred to the air pipe 5 through the round head block 38.

[0052] Reference Figure 1 , Fig. 9 The heating mechanism 4 has multiple heating zones corresponding to the number of heating zones. The heating mechanism 4 includes a protective frame 41 fixedly connected to the side of the protective shell 21. The side of the protective frame 41 away from the protective shell 21 penetrates the heat-insulating shell 1, and the protective frame 41 is located between the two groups of exhaust pipes 11. Each group of protective frames 41 is located on the side outside the heat-insulating shell 1 and is fixedly connected to multiple fans 42. The internal linear array of the protective frame 41 near the fan 42 is rotatably connected to multiple mounting rods 43. The linear array of the mounting rod 43 is provided with multiple airflow convergence components 47. Inside the protective frame 41 and behind the mounting rod 43, multiple heating rods 44 are fixedly connected in a linear array and a heat receiving block 45 is fixedly connected.

[0053] The fan 42 in the heating mechanism 4 can absorb the outside air and the gas with a certain amount of heat discharged from the exhaust pipe 11, so as to realize the reuse of hot gas. The outside air absorbed by the fan 42 will enter the protection frame 41 and be heated by the heating rod 44 in the protection frame 41.

[0054] Reference Fig.10Each airflow convergence component 47 includes two polygonal cones 471 and a mixing ball 472 fixedly connected to the shaft of the mounting rod 43. The mixing ball 472 is fixedly connected to the thin ends of the two polygonal cones 471, and a plurality of mixing grooves 473 are provided on the spherical surface of the mixing ball 472. A plurality of air guide tubes 46 are fixedly connected in a linear array on one side of the protective frame 41 facing the protective shell 21. One end of the air guide tube 46 away from the protective frame 41 passes through the protective shell 21 and is connected to the heating zone at the corresponding position.

[0055] The fan 42 is used to absorb the external air and transmit it to the air flow velocity in the protective frame 41, driving the two polygonal cones 471 and a mixing ball 472 to rotate, thereby achieving a deceleration effect on the external air. The polygonal cone 471 and the mixing ball 472 can also convert the spiral external air absorbed by the fan 42 into direct current, thereby enhancing the heating of the external air of the heating rod 44, and the heated air will enter the protective shell 21 through the heat block 45 and the air duct 46.

[0056] The operating principle of this embodiment is as follows:

[0057] Step 1: First, connect the two ends of the air pipe 5 to the input end and the output end of the semiconductor gas respectively, so that the semiconductor gas enters the air pipe 5. As the semiconductor gas enters the air pipe 5, the device is manually opened (the device in this scheme refers to the semiconductor special gas pipeline gas heating and insulation device). When the device is started, the fan 42 of the heating mechanism 4 is started first, and the fan 42 draws air from the external environment. At the same time, it also draws the gas with a certain amount of heat discharged from the exhaust pipe 11 (the source of the heat gas discharged from the exhaust pipe 11 is explained below), so as to achieve the recycling of hot gas. After the outside air is sucked in, it is directly discharged to the exhaust pipe 11. The airflow entering the protective frame 41 will impact the airflow convergence component 47 on the mounting rod 43. As the airflow convergence component 47 is impacted by the airflow, the mounting rod 43 and the airflow convergence component 47 will rotate accordingly. The multiple edges and corners of the polygonal pyramid 471 will hinder the airflow during the rotation process, effectively reducing the flow rate of the external air. The mixing ball 472 can disrupt the original spiral flow pattern of the airflow when rotating by virtue of the multiple mixing grooves 473 of the spherical annular array, and successfully convert it into DC air. The DC air state helps the subsequent heating rod 44 to heat the air more efficiently.

[0058] The air processed by the airflow convergence component 47 will come into contact with the heating rod 44. When the heating rod 44 is energized, it will generate high temperature and quickly heat the air. The temperature of the heated air rises rapidly, thereby forming a hot air flow in the protective frame 41. The hot air flow heated by the heating rod 44 will come into contact with the heating block 45. Since the heating block 45 is honeycomb-shaped, it can converge the scattered hot air flow again and guide it to flow in a specific direction, and finally enter the corresponding heating zone in the protective shell 21 smoothly through the air guide pipe 46. The hot air flow temperature provided by the heating mechanism 4 corresponding to each heating zone of the protective shell 21 is stepped, thereby avoiding the difficulty in uniformly heating the entire transmission channel of the transmission gas in the air pipe 5 to meet the different temperature requirements of multiple processes.

[0059] Step 2: After the hot air enters the protective shell 21 through the air duct 46, the heat insulation frame 23 plays its role of gathering the hot air flow. The two partition plates 24 fixedly connected inside the heat insulation frame 23 evenly divide its internal space into three independent heating zones, so that the hot air in the heating mechanism 4 at the corresponding position flows into the three different heating zones respectively, so that the temperature in the three different heating zones gradually increases. When the hot air flow enters the heating zone, the L-shaped plate 251 further divides the hot air flow into space, and the hot air flow can only flow along the drainage grooves 252 opened in the linear array on the upper end surface of the L-shaped plate 251. In this process In the embodiment, the hot air flow is in full contact with the L-shaped plate 251, and the heat is continuously transferred to the L-shaped plate 251. The multiple heat-conducting columns 253 (the heat-conducting columns 253 are made of heat-conducting materials such as copper, aluminum, and graphite) fixedly connected in a linear array on the right-angle inner wall of the L-shaped plate 251 further absorb the heat on the L-shaped plate 251, so that the heat in the hot air flow can be more fully absorbed and redistributed, thereby realizing the conversion from unstable hot air flow to relatively stable hot air flow (in this scheme, stable hot air flow refers to: hot air flow with continuous flow and uniform distribution, while unstable hot air flow refers to hot air flow with intermittent flow and discontinuous distribution);

[0060] At the same time, the airflow stirring assembly 26 is also working synchronously. The rotation of the rotating rod 261 on the inner wall of the heating zone drives the multiple multi-faceted stirring blades 262 to rotate accordingly (a built-in motor is arranged inside the rotating rod 261). The multi-faceted stirring blades 262 continuously cut and stir the hot air flow during the rotation process. The focusing grooves 263 opened at the corners enable the hot air flow to flow more concentratedly and orderly during the stirring process, so that the hot air flow can achieve sufficient mixing and energy exchange in the stirring area, ensuring that the temperature of the stable hot air flow in the L-shaped plate 251 can be kept consistent, and then the stable hot air flow is discharged through the exhaust hole on the arc surface of the insulation frame 23. Since the exhaust hole corresponds to the air hole 311 of the heating pipe 31, the stable hot air flow will be transmitted to the heating pipe 31, and then the hot air flow in the heating pipe 31 will exchange heat with the gas transmitted in the air pipe 5, thereby realizing the heating process of the gas in the air pipe 5.

[0061] Among them, after the heat exchange is completed in the heating zone, the unstable hot air flow is discharged into the insulation shell 1 through a plurality of connecting pipes 27 fixedly connected to the upper end surface of the insulation frame 23. These unstable hot air flows release the remaining heat in the insulation shell 1, and heat the insulation shell 1 and the equipment inside it (including the air pipe 5), thereby realizing the reuse of heat and improving the energy utilization rate. At the same time, it also provides a certain degree of insulation effect for the gas in the air pipe 5, which helps to maintain the stability of the gas temperature. Finally, the unstable hot air flow will be discharged from the exhaust pipes 11 arranged up and down and relatively inclined on both sides of the length direction of the insulation shell 1, and will be re-absorbed by the fan 42.

[0062] Step 3: When the heat conducting mechanism 2 guides the flow of the hot air flow, vibration waves are inevitably generated (the hot air flow flows quickly in the heat conducting mechanism 2, and when guided and restricted by the guide assembly 25 and other components, the flow velocity and flow direction change sharply, which can easily cause turbulence, and the collision and friction of gas molecules generate vibration waves. For example, when the hot air flow passes through the guide groove 252 of the L-shaped plate 251, the change in air flow direction and the interaction between the high-speed flow and the groove wall and the different speed areas inside cause vibration), and the resonance assembly 33 of the vibration mechanism 3 will collect the vibration waves;

[0063] The method of collecting vibration waves by the resonance component 33 is as follows:

[0064] The vibration focusing cavity 333 in the resonance component 33 first senses the generation of the vibration wave. Since the vibration focusing cavity 333 is an empty structure and is also at the "energy convergence point" of the propagation path, the vibration focusing cavity 333 will collect the vibration wave. The vibration focusing cavity 333 further enhances the collection effect of the vibration wave by using a plurality of resonance balls 334 fixedly connected by an internal rectangular array, ensuring that as many vibration waves as possible are effectively collected. The vibration waves collected by the vibration focusing cavity 333 are transmitted to the connecting rod 332, and the connecting rod 332 further transmits the vibration wave to the fixed rod 32.

[0065] Among them, when the fixed rod 32 receives the vibration wave, the fixed rod 32 quickly transmits it to the resonant hollow column 36. When the vibration wave is transmitted to the resonant hollow column 36, the vibration wave amplification component 37 will amplify the vibration wave. In the vibration wave amplification component 37, a plurality of convex balls 372 fixedly connected in a rectangular array on the outer peripheral surface of the hollow column 371 vibrate under the action of the vibration wave. The interaction of this vibration with the hollow column 371 and the vibration collecting cover 373 enhances and amplifies the vibration wave, so that the energy of the vibration wave is significantly improved. The amplified vibration wave is transmitted to the air pipe 5 through the round head block 38 fixedly connected at one end of the resonant hollow column 36. Due to the contact between the round head block 38 and the air pipe 5, the vibration wave can be effectively transmitted to the air pipe 5 and act on the gas transmitted therein, so that the gas flowing in the air pipe 5 vibrates. On the one hand, this vibration promotes the movement of gas molecules in the air pipe 5, accelerates the heat transfer speed, and improves the heating efficiency; on the other hand, it helps to prevent particle deposition and agglomeration, ensure the purity of the gas, and provide a better gas environment for semiconductor processes.

[0066] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor special gas pipeline gas heating and insulation device, characterized in that: include: A heat-insulating shell (1), wherein two groups of exhaust pipes (11) are fixedly connected to both sides of the heat-insulating shell (1), the two groups of exhaust pipes (11) are symmetrically arranged up and down on the side of the heat-insulating shell (1), and the bottom of the heat-insulating shell (1) is fixedly connected to a base (12); A heat conduction mechanism (2), the heat conduction mechanism (2) comprising a protective shell (21) arranged inside the heat-insulating shell (1), the inner wall of the protective shell (21) being fixedly connected to heat insulation frames (23) at four corners, and a spacing being provided between each two adjacent heat insulation frames (23), the two sides of the heat insulation frames (23) away from the protective shell (21) jointly forming an inner arc surface, and a plurality of exhaust holes are provided in a rectangular array on the inner arc surface, a plurality of flow guide components (25) for guiding the flow direction of a hot air flow are provided inside the heat insulation frame (23), and an air flow stirring component (26) for stirring the hot air is provided inside the heat insulation frame (23); A vibration mechanism (3), the vibration mechanism (3) comprising a heating pipe (31) fixedly connected to the inner arc surface of four protective shells (21), a plurality of groups of resonant hollow columns (36) fixedly connected to the inner peripheral surface of the heating pipe (31), each group of the resonant hollow columns (36) corresponding to the spacing between two adjacent heat insulation frames (23), a plurality of vibration wave amplifying components (37) arranged in a rectangular array at the bottom of the resonant hollow columns (36), a fixing rod (32) corresponding to the resonant hollow columns (36) arranged on the outer peripheral surface of the heating pipe (31), and a plurality of resonant components (33) arranged in a linear array on the rod body of the fixing rod (32); A heating mechanism (4), the heating mechanism (4) having a pair of heating mechanisms (4) symmetrically arranged on both sides of the heat preservation shell (1), the heating mechanism (4) having a plurality of heating mechanisms (47) corresponding to the number of heating zones, the heating mechanism (4) comprising a protection frame (41) fixedly connected to the side of the protection shell (21), the side of the protection frame (41) away from the protection shell (21) passing through the heat preservation shell (1), and the protection frame (41) being located between two groups of exhaust pipes (11), each group of the protection frames (41) being located outside the heat preservation shell (1) and being fixedly connected to a plurality of fans (42), the protection frames (41) being rotatably connected to a plurality of mounting rods (43) in a linear array inside the protection frames (41) near the fans (42), the mounting rods (43) being provided with a plurality of airflow convergence components (47) in a linear array, and a plurality of heating rods (44) and a heat receiving block (45) being fixedly connected in a linear array inside the protection frame (41) and behind the mounting rods (43); Wherein, an air pipe (5) is inserted into the interior of the heating pipe (31).

2. A semiconductor special gas pipeline gas heating and heat preservation device according to claim 1, characterized in that: Two partition plates (24) are fixedly connected inside the heat insulation frame (23), and the partition plates (24) evenly divide the inside of the heat insulation frame (23) into three heating zones, and the drainage components (25) and the airflow stirring components (26) correspond to the number of heating zones. The protective shell (21) is fixedly connected to air leakage blocks (22) on opposite sides, and two adjacent heat insulation frames (23) share one air leakage block (22). The upper end surface of the heat insulation frame (23) is fixedly connected to a plurality of connecting pipes (27), and the connecting pipes (27) are connected to the inside of each heating zone, and the ends of each connecting pipe (27) away from the heat insulation frame (23) penetrate the protective shell (21) and are connected to the air leakage block (22).

3. A semiconductor special gas pipeline gas heating and heat preservation device according to claim 1, characterized in that: The drainage component (25) comprises an L-shaped plate (251) fixedly connected to the interior of the heating zone, wherein the inner right angle of the L-shaped plate (251) corresponds to the inner arc surface, a plurality of drainage grooves (252) are provided in a linear array on the upper end surface of the L-shaped plate (251), and a plurality of heat-conducting columns (253) are fixedly connected in a linear array on the inner wall of the inner right angle of the L-shaped plate (251); The airflow stirring assembly (26) is located inside the L-shaped plate (251), and comprises a rotating rod (261) rotatably connected to the inner wall of the heating zone, a plurality of multi-faceted stirring blades (262) being fixedly connected to the rod body of the rotating rod (261) in a linear array, and a focusing groove (263) is provided at the corner of each multi-faceted stirring blade (262).

4. A semiconductor special gas pipeline gas heating and heat preservation device according to claim 1, characterized in that: The inner circumference of the heating pipe (31) is fixedly connected to a flow rate detector (35) corresponding to the number of heating zones, the inner circumference of the heating pipe (31) is provided with an air inlet (311) corresponding to the heat insulation frame (23), and the air inlet (311) corresponds to the air outlet, the end of the fixing rod (32) close to the resonant hollow column (36) passes through the heating pipe (31) and is fixedly connected to the resonant hollow column (36), the end of the resonant hollow column (36) away from the heating pipe (31) is fixedly connected to a round head block (38), and the end of the round head block (38) away from the resonant hollow column (36) is in contact with the air pipe (5); The resonance component (33) comprises a vibration-guiding ring (331) fixedly connected to a rod body of a fixed rod (32); a plurality of connecting rods (332) are fixedly connected in an annular array on the outer circumference of the vibration-guiding ring (331); one end of each connecting rod (332) away from the vibration-guiding ring (331) is fixedly connected to a vibration-focusing cavity (333); and a plurality of resonance balls (334) are fixedly connected in a rectangular array inside the vibration-focusing cavity (333).

5. The semiconductor special gas pipeline gas heating and heat preservation device according to claim 1, characterized in that: The vibration wave amplification component (37) comprises a hollow column (371) fixedly connected to the bottom of the resonant hollow column (36), a vibration focusing cover (373) fixedly connected to the top of the hollow column (371), and a plurality of convex balls (372) fixedly connected in a rectangular array on the outer peripheral surface of the hollow column (371).

6. The semiconductor special gas pipeline gas heating and heat preservation device according to claim 1 is characterized in that: Each of the airflow convergence components (47) comprises two polygonal cones (471) fixedly connected to the shaft of the mounting rod (43) and a mixing ball (472); the mixing ball (472) is fixedly connected to the thin ends of the two polygonal cones (471), and a plurality of mixing grooves (473) are provided on the spherical surface of the mixing ball (472); a plurality of air guide tubes (46) are fixedly connected in a linear array on one side of the protection frame (41) facing the protection shell (21); an end of the air guide tube (46) away from the protection frame (41) passes through the protection shell (21) and is connected to a heating zone at a corresponding position.

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