Bearing-heat dissipation function integrated structure design method and design system

Through the combination of topological optimization and dot matrix structure, the problem that traditional chassis structure design is difficult to meet the requirements of lightweight and heat dissipation, and the chassis lightweight and heat dissipation enhancement are achieved, and the assembly process is simplified.

CN119150384APending Publication Date: 2024-12-17BEIJING INST OF RADIO MEASUREMENT
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Patent Information

Application Number
CN202411114142.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-08-14
Publication Date
2024-12-17

AI Technical Summary

Technical Problem

The traditional electronic equipment chassis structure is difficult to meet the rigidity, strength and lightweight design requirements at the same time, and traditional structural design methods lead to excessive functional division, many connected components and increased weight.

Method used

The chassis structure is designed lightweight by combining topological optimization and lattice structure, and by combining three-dimensional flow channels with lattice structure, the chassis heat dissipation structure is enhanced and the overall structure is lightweight.

Benefits of technology

It realizes lightweight and enhances heat dissipation performance of the chassis structure, while simplifying the assembly process and reducing overall quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a bearing-heat dissipation function integrated structure design method and design system.The bearing-heat dissipation function integrated structure design method comprises the following steps that a topological optimization and lattice structure combined method is adopted, and a case structure is lightened; a method of combining a three-dimensional flow channel and a lattice structure is adopted, and the heat dissipation structure of the case is enhanced. According to the technical scheme, a topological optimization and lattice structure combined method is adopted, and the chassis structure is lightened; a method of combining a three-dimensional flow channel and a lattice structure is adopted, and the heat dissipation structure of the case is enhanced; the purposes of structural light weight, heat dissipation enhancement and assembly simplification are achieved.
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Description

Background Art

[0002] As high-end electronic equipment places increasingly higher demands on lightweight design, traditional structural design methods are unable to simultaneously meet the stiffness, strength and weight requirements of electronic equipment chassis.

[0003] Compared with mechanical processing, additive manufacturing technology significantly improves the design freedom of structural designers, while making the complex structures obtained by structural topology optimization manufacturable.

[0004] The lattice structure has the characteristics of light weight, high strength, and high designability. The application of lattice structure is an important way to design lightweight structures. In addition, some lattice structures also have the characteristics of heat insulation or enhanced heat exchange.

[0005] The traditional chassis structure adopts a structural design method based on function, which generally includes rails, heat pipes, shells, handles and other structures. These structures have different functions, and the components are connected by screwing or riveting. This method requires additional screws, rivets and other connecting parts on the one hand, and the functional division leads to more structural margins on the other hand, both of which increase the overall quality of the chassis. Summary of the invention

[0006] The present application provides a load-bearing-heat dissipation function integrated structure design method and design system, which are used to combine topology optimization, lattice structure and multifunctional integrated structure design to achieve the purpose of lightweight structure, enhanced heat dissipation and simplified assembly.

[0007] In a first aspect, a method for designing a structure with integrated load-bearing and heat dissipation functions is provided, comprising the following steps:

[0008] The chassis structure is lightweight by combining topology optimization and lattice structure.

[0009] In the above technical solution, a method combining topology optimization and lattice structure is adopted to lighten the chassis structure, thereby realizing a lightweight design of the chassis structure.

[0010] In a specific embodiment, it also includes:

[0011] The heat dissipation structure of the chassis is enhanced by combining three-dimensional flow channels and lattice structures.

[0012] In the above technical scheme, a method combining topology optimization and lattice structure is adopted to lightweight the chassis structure; a method combining three-dimensional flow channels and lattice structure is adopted to enhance the chassis heat dissipation structure; the purpose of lightweight structure, enhanced heat dissipation and simplified assembly is achieved.

[0013] In a specific implementation scheme, the lattice structure includes a relationship between the actual volume fraction of the lattice structure and the elastic modulus, and the topology optimization includes a corresponding relationship between the mechanical properties of the structure and the value of θ, wherein θ is a design variable;

[0014] The steps to lightweight the chassis structure by combining topology optimization and lattice structure are as follows:

[0015] Taking the actual volume fraction-elastic modulus relationship of the lattice structure as the correspondence between the structural mechanical properties and the value of θ, the structural topology optimization is carried out to obtain the optimized structural material distribution and lightweight the chassis structure.

[0016] In a specific implementation scheme, the step of using the actual volume fraction-elastic modulus relationship of the lattice structure as the corresponding relationship between the mechanical properties of the structure and the value of θ is specifically as follows:

[0017] The corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus is calculated by the homogenization method; the corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus is used as the relationship between the structural mechanical properties and the design variables in the SIMP method to perform topological optimization;

[0018] The material distribution domain obtained by topology optimization is used as a parameter to fill the chassis with a lattice structure.

[0019] In a specific embodiment, the material distribution domain includes equivalent elastic moduli of lattice cells at different volume fractions.

[0020] In a specific implementation scheme, the topology optimization algorithm adopts the SIMP method, the value range of the design variable θ is [0, 1], and the corresponding relationship between the structural mechanical properties and the value of θ is:

[0021]

[0022] Where K is the original stiffness matrix of the unit in the finite element method, is the element stiffness matrix after SIMP penalty of θ, and p is the penalty factor of SIMP method;

[0023] The corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus obtained by the homogenization method is used as the relationship between the structural mechanical properties and design variables in the SIMP method for topological optimization.

[0024] In a specific implementation scheme, the steps of enhancing the heat dissipation structure of the chassis by combining a three-dimensional flow channel with a lattice structure are as follows:

[0025] Integrate the internal liquid cooling channel of the chassis with the chassis shell.

[0026] A lattice structure is filled inside the internal liquid cooling channel to enhance the heat dissipation structure of the chassis.

[0027] In a specific implementation manner, the lattice structure is a TPMS lattice structure.

[0028] In a second aspect, a load-bearing and heat dissipation integrated structure design system is provided, comprising:

[0029] The structural lightweight module is used to lightweight the chassis structure by combining topology optimization and lattice structure;

[0030] The heat dissipation enhancement module is used to enhance the heat dissipation structure of the chassis by combining three-dimensional flow channels and lattice structures.

[0031] In the above technical scheme, a method combining topology optimization and lattice structure is adopted to lightweight the chassis structure; a method combining three-dimensional flow channels and lattice structure is adopted to enhance the chassis heat dissipation structure; the purpose of lightweight structure, enhanced heat dissipation and simplified assembly is achieved.

[0032] In a specific embodiment,

[0033] The structural lightweight module comprises:

[0034] The topology optimization unit is used to use the corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus obtained by the homogenization method as the relationship between the structural mechanical properties and the design variables in the SIMP method, perform topology optimization, and calculate the material distribution domain;

[0035] A structural filling unit, used to fill the chassis structure with a lattice structure using the material distribution domain as a design parameter, thereby making the chassis structure lightweight;

[0036] The heat dissipation enhancement module comprises:

[0037] A cold channel integration unit is used to integrate the internal liquid cooling channel of the chassis with the chassis shell;

[0038] The heat dissipation filling unit is used to fill a lattice structure inside the internal liquid cooling channel to enhance the heat dissipation structure of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A flowchart of a method for designing a structure with integrated load-bearing and heat-dissipating functions provided in an embodiment of the present application;

[0040] Figure 2 A structural block diagram of a load-bearing and heat-dissipating integrated structural design system provided in an embodiment of the present application;

[0041] Figure 3 Volume fraction-elastic modulus relationship diagram of several lattice cells provided in the embodiments of the present application;

[0042] Figure 4 A schematic diagram of a structure of a gradient lattice filling structure based on topologically optimized material distribution provided in an embodiment of the present application;

[0043] Figure 5 A schematic diagram of the structure of the spatial flow channel provided in an embodiment of the present application;

[0044] Figure 6 A schematic diagram of the structure of an enhanced heat exchange point array structure in a flow channel provided in an embodiment of the present application;

[0045] Figure 7 A schematic diagram of the structure of an integrated structure with load-bearing and heat-dissipating functions based on topological optimization and a thin-walled lattice structure provided in an embodiment of the present application. DETAILED DESCRIPTION

[0046] The present application is further described in detail below through the accompanying drawings and embodiments. Through these descriptions, the characteristics and advantages of the present application will become clearer and more specific.

[0047] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. Although various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise noted.

[0048] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0049] To facilitate understanding of the load-bearing-heat dissipation function integrated structure design method and design system provided in the embodiment of the present application, its application scenario is first explained. The load-bearing-heat dissipation function integrated structure design method provided in the embodiment of the present application is used to combine topology optimization, lattice structure and multifunctional integrated structure design to achieve the purpose of lightweight structure, enhanced heat dissipation and simplified assembly. With the increasing requirements for lightweight design of high-end electronic equipment, it is difficult for traditional structural design methods to simultaneously meet the requirements of rigidity, strength and weight index of electronic equipment chassis. Compared with mechanical processing, additive manufacturing technology significantly improves the design freedom of structural designers, and at the same time makes the complex structure obtained by structural topology optimization manufacturability. The lattice structure has the characteristics of light weight, high strength and high designability. The application of lattice structure is an important way of lightweight structure design. In addition, some lattice structures also have the characteristics of heat insulation or enhanced heat exchange. The traditional chassis structure adopts a structural design method based on function, generally including structures such as guide rails, heat pipes, shells, handles, etc. These structures have different functions, and the components are connected by screwing or riveting. This method requires additional screws, rivets and other connecting parts on the one hand, and the functional division leads to more structural margins on the other hand, both of which increase the overall mass of the chassis. To this end, the embodiment of the present application provides a load-bearing-heat dissipation function integrated structure design method and design system to combine topology optimization, lattice structure and multifunctional integrated structure design to achieve the purpose of lightweight structure, enhanced heat dissipation and simplified assembly. The following is a detailed description of the embodiment in conjunction with specific drawings.

[0050] refer to Figures 1 to 7 , Figure 1 A flowchart of a method for designing a structure with integrated load-bearing and heat-dissipating functions provided in an embodiment of the present application; Figure 2 A structural block diagram of a load-bearing and heat-dissipating integrated structural design system provided in an embodiment of the present application; Figure 3 Volume fraction-elastic modulus relationship diagram of several lattice cells provided in the embodiments of the present application; Figure 4 A schematic diagram of a structure of a gradient lattice filling structure based on topologically optimized material distribution provided in an embodiment of the present application; Figure 5 A schematic diagram of the structure of the spatial flow channel provided in an embodiment of the present application; Figure 6 A schematic diagram of the structure of an enhanced heat exchange point array structure in a flow channel provided in an embodiment of the present application;

[0051] Figure 7 A schematic diagram of the structure of an integrated structure with load-bearing and heat-dissipating functions based on topological optimization and a thin-walled lattice structure provided in an embodiment of the present application.

[0052] exist Figure 1 In the embodiment of the present application, a method for designing a structure with integrated load-bearing and heat dissipation functions is provided, comprising the following steps:

[0053] The chassis structure is lightweight by combining topology optimization and lattice structure.

[0054] In the above technical solution, a method combining topology optimization and lattice structure is adopted to lighten the chassis structure, thereby realizing a lightweight design of the chassis structure.

[0055] In a specific embodiment, it also includes:

[0056] The heat dissipation structure of the chassis is enhanced by combining three-dimensional flow channels and lattice structures.

[0057] In the above technical solutions, the chassis structure is lightweighted by combining topological optimization and lattice structure; the chassis heat dissipation structure is enhanced by combining three-dimensional flow channels and lattice structure; the topological optimization, lattice structure and multifunctional integrated structure design are combined to achieve the purpose of lightweight structure, enhanced heat dissipation and simplified assembly. The design idea of ​​multifunctional integrated structure combines the functions of two or more components, or adopts an integrated forming method, which can realize the lightweight structure design to the greatest extent.

[0058] In a specific implementation scheme, the lattice structure includes a relationship between the actual volume fraction of the lattice structure and the elastic modulus, and the topology optimization includes a corresponding relationship between the mechanical properties of the structure and the value of θ, wherein θ is a design variable;

[0059] The steps to lightweight the chassis structure by combining topology optimization and lattice structure are as follows:

[0060] Taking the actual volume fraction-elastic modulus relationship of the lattice structure as the correspondence between the structural mechanical properties and the value of θ, the structural topology optimization is carried out to obtain the optimized structural material distribution and lightweight the chassis structure.

[0061] In a specific implementation scheme, the step of using the actual volume fraction-elastic modulus relationship of the lattice structure as the corresponding relationship between the mechanical properties of the structure and the value of θ is specifically as follows:

[0062] The corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus is calculated by the homogenization method; the corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus is used as the relationship between the structural mechanical properties and the design variables in the SIMP method to perform topological optimization;

[0063] The material distribution domain obtained by topology optimization is used as a parameter to fill the chassis with a lattice structure.

[0064] In a specific embodiment, the material distribution domain includes equivalent elastic moduli of lattice cells at different volume fractions.

[0065] In a specific implementation scheme, the topology optimization algorithm adopts the SIMP method, the value range of the design variable θ is [0, 1], and the corresponding relationship between the structural mechanical properties and the value of θ is:

[0066]

[0067] Where K is the original stiffness matrix of the unit in the finite element method, is the element stiffness matrix after SIMP penalty of θ, and p is the penalty factor of SIMP method;

[0068] The corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus obtained by the homogenization method is used as the relationship between the structural mechanical properties and design variables in the SIMP method for topological optimization.

[0069] It should be noted that the optimization process of SIMP (Solid Isotropic Material with Penalization) method usually includes the following steps:

[0070] 1. Initialization: set the design domain, unit division, initial relative density distribution, etc.

[0071] 2. Finite element analysis: Based on the current relative density distribution, finite element analysis is performed to calculate the response of the structure (such as displacement, stress, etc.).

[0072] 3. Sensitivity analysis: Calculate the sensitivity of the objective function to the design variables, that is, the gradient of the objective function as the design variables change.

[0073] 4. Optimization update: According to the results of sensitivity analysis, update the design variables (i.e., unit relative density) to reduce the objective function value.

[0074] 5. Convergence judgment: Check whether the optimization result meets the convergence condition (such as the change in the objective function value is less than a certain threshold). If not, return to step 2 to continue iteration; if satisfied, end the optimization process.

[0075] The advantages of SIMP method are: 1. The structural design variables and optimization problems are directly linked: the topological structure directly depends on the design variables (unit density), and the optimization algorithm has good convergence. 2. The sensitivity is simple and easy to calculate: the discrete design sensitivity calculation based on finite elements can be directly performed. 3. It is suitable for complex structures.

[0076] Specifically, it is only necessary to solve the distribution of the design variable θ in the structure to obtain the topology optimization result.

[0077] The problem with the above method is that the corresponding relationship between the design variable θ, the structural mechanical properties and the value of θ, and the penalty factor p are all artificially set and cannot reflect the actual situation well.

[0078] By taking the actual volume fraction-elastic modulus relationship of the lattice structure as the correspondence between the structural mechanical properties and the value of θ, structural topology optimization can be performed to obtain a more reasonable structural material distribution.

[0079] Therefore, the equivalent elastic modulus of the lattice cell at different volume fractions can be calculated by the homogenization method; the volume fraction-elastic modulus relationship of several cells is as follows: Figure 3 As shown; the horizontal axis is the cell volume fraction, the vertical axis is the equivalent elastic modulus, points of different shapes represent different types of cells, * represents Octet cells, represents body-centered cubic cell, o represents Diamod cell;

[0080] The material distribution domain obtained by the above topological optimization is used as the design parameter, and the original structure is filled with a lattice structure to achieve a lightweight structural design.

[0081] In this embodiment, a method combining topology optimization and lattice structure is adopted to lighten the chassis structure, thereby achieving a lightweight design of the chassis structure.

[0082] In a specific implementation scheme, the steps of enhancing the heat dissipation structure of the chassis by combining a three-dimensional flow channel with a lattice structure are as follows:

[0083] Integrate the internal liquid cooling channel of the chassis with the chassis shell.

[0084] A lattice structure is filled inside the internal liquid cooling channel to enhance the heat dissipation structure of the chassis.

[0085] In a specific implementation manner, the lattice structure is a TPMS lattice structure.

[0086] It should be noted that the TPMS (Triply Periodic Minimal Surface) lattice structure, that is, the three-periodic minimal surface lattice structure, is a material structure with unique geometric properties and excellent mechanical properties. Its characteristics are: 1. Lightweight and high strength: The TPMS lattice structure achieves a significant reduction in structural weight by optimizing material distribution while maintaining high strength and stiffness. 2. Large specific surface area: Due to its complex curved surface structure and porosity, the TPMS lattice structure has a large specific surface area, which is conducive to processes such as heat transfer and material exchange. 3. Good connectivity: The pores of the TPMS lattice structure are interconnected, forming a good fluid channel, which is conducive to the flow and heat transfer of the fluid.

[0087] When the TPMS lattice structure is used to design lightweight components, it can reduce structural weight and improve performance; in heat transfer devices such as heat exchangers and radiators, the high surface area and connectivity of the TPMS lattice structure help improve heat transfer efficiency.

[0088] exist Figure 2 In the embodiment of the present application, there is also provided a load-bearing-heat dissipation function integrated structure design system, including:

[0089] The structural lightweight module is used to lightweight the chassis structure by combining topology optimization and lattice structure;

[0090] The heat dissipation enhancement module is used to enhance the heat dissipation structure of the chassis by combining three-dimensional flow channels and lattice structures.

[0091] In the above technical scheme, a method combining topology optimization and lattice structure is adopted to lightweight the chassis structure; a method combining three-dimensional flow channels and lattice structure is adopted to enhance the chassis heat dissipation structure; the purpose of lightweight structure, enhanced heat dissipation and simplified assembly is achieved.

[0092] refer to Figures 3 to 7 In one specific embodiment,

[0093] The structural lightweight module comprises:

[0094] The topology optimization unit is used to use the corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus obtained by the homogenization method as the relationship between the structural mechanical properties and the design variables in the SIMP method, perform topology optimization, and calculate the material distribution domain;

[0095] A structural filling unit, used to fill the chassis structure with a lattice structure using the material distribution domain as a design parameter, thereby making the chassis structure lightweight;

[0096] The heat dissipation enhancement module comprises:

[0097] A cold channel integration unit is used to integrate the internal liquid cooling channel of the chassis with the chassis shell;

[0098] The heat dissipation filling unit is used to fill a lattice structure inside the internal liquid cooling channel to enhance the heat dissipation structure of the chassis.

[0099] In this embodiment, in order to solve the problem that the flow channel can only be distributed regularly, the freedom of flow channel design is significantly improved based on additive manufacturing technology; an enhanced heat exchange point matrix structure is filled inside the flow channel to enhance the heat exchange capacity between the refrigerant and the cold plate and improve the heat dissipation effect; the area outside the flow channel that does not require heat dissipation but is connected to other structures is filled with a lightweight lattice structure to make the heat exchange area more concentrated and reduce the weight of the cold plate.

[0100] Those skilled in the art will appreciate that the present application may be implemented as a system, method or computer program product.

[0101] Therefore, the present disclosure may be specifically implemented in the following forms, namely: it may be completely hardware, it may be completely software (including firmware, resident software, microcode, etc.), or it may be a combination of hardware and software, generally referred to herein as a "circuit", "module" or "system". In addition, in some embodiments, the present application may also be implemented in the form of a computer program product in one or more computer-readable media, and the computer-readable medium may contain computer-readable program code.

[0102] Any combination of one or more computer-readable media can be used. Computer-readable media can be computer-readable signal media or computer-readable storage media. Computer-readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or devices, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: electrical connections with one or more wires, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this document, computer-readable storage media can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.

[0103] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present application. A person of ordinary skill in the art can change, modify, replace and modify the above embodiments within the scope of the present application. On this basis, a variety of replacements and improvements can be made to the present application, all of which fall within the scope of protection of the present application.

Claims

1. A method for designing a structure with integrated load-bearing and heat-dissipating functions, characterized in that: The following steps are involved: The chassis structure is lightweight by combining topology optimization and lattice structure.

2. The load-bearing and heat-dissipating integrated structure design method according to claim 1, characterized in that: Also includes: The heat dissipation structure of the chassis is enhanced by combining three-dimensional flow channels and lattice structures.

3. The method for designing a structure with integrated load-bearing and heat-dissipating functions according to claim 2, characterized in that: The lattice structure includes the relationship between the actual volume fraction of the lattice structure and the elastic modulus, and the topology optimization includes the corresponding relationship between the mechanical properties of the structure and the value of θ, wherein θ is a design variable; The steps to lightweight the chassis structure by combining topology optimization and lattice structure are as follows: Taking the actual volume fraction-elastic modulus relationship of the lattice structure as the correspondence between the structural mechanical properties and the value of θ, the structural topology optimization is carried out to obtain the optimized structural material distribution and lightweight the chassis structure.

4. The load-bearing and heat-dissipating integrated structure design method according to claim 3, characterized in that: The steps of using the actual volume fraction-elastic modulus relationship of the lattice structure as the corresponding relationship between the mechanical properties of the structure and the value of θ are as follows: The corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus is calculated by the homogenization method. The corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus is used as the relationship between the structural mechanical properties and design variables in the SIMP method to perform topological optimization. The material distribution domain obtained by topology optimization is used as a parameter to fill the chassis with a lattice structure.

5. The method for designing a structure with integrated load-bearing and heat-dissipating functions according to claim 4, characterized in that: The material distribution domain includes equivalent elastic moduli of lattice cells at different volume fractions.

6. The method for designing a structure with integrated load-bearing and heat-dissipating functions according to claim 5, characterized in that: The topology optimization algorithm adopts the SIMP method. The value range of the design variable θ is [0, 1]. The corresponding relationship between the structural mechanical properties and the value of θ is: Where K is the original stiffness matrix of the unit in the finite element method, is the element stiffness matrix after SIMP penalty of θ, and p is the penalty factor of SIMP method; The corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus obtained by the homogenization method is used as the relationship between the structural mechanical properties and design variables in the SIMP method for topological optimization.

7. The method for designing a structure with integrated load-bearing and heat-dissipating functions according to claim 6, characterized in that: The steps of enhancing the heat dissipation structure of the chassis by combining the three-dimensional flow channel and the lattice structure are as follows: Integrate the internal liquid cooling channel of the chassis with the chassis shell. A lattice structure is filled inside the internal liquid cooling channel to enhance the heat dissipation structure of the chassis.

8. The method for designing a structure with integrated load-bearing and heat-dissipating functions according to claim 7, characterized in that: The lattice structure is a TPMS lattice structure.

9. A load-bearing and heat dissipation integrated structural design system, characterized in that: include: The structural lightweight module is used to lightweight the chassis structure by combining topology optimization and lattice structure; The heat dissipation enhancement module is used to enhance the heat dissipation structure of the chassis by combining three-dimensional flow channels and lattice structures.

10. The load-bearing and heat-dissipating integrated structural design system according to claim 9, characterized in that: The structural lightweight module comprises: The topology optimization unit is used to use the corresponding relationship between the volume fraction of the lattice structure and its equivalent elastic modulus obtained by the homogenization method as the relationship between the structural mechanical properties and the design variables in the SIMP method, perform topology optimization, and calculate the material distribution domain; A structural filling unit, used to fill the chassis structure with a lattice structure using the material distribution domain as a design parameter, thereby making the chassis structure lightweight; The heat dissipation enhancement module comprises: A cold channel integration unit is used to integrate the internal liquid cooling channel of the chassis with the chassis shell; The heat dissipation filling unit is used to fill a lattice structure inside the internal liquid cooling channel to enhance the heat dissipation structure of the chassis.

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