Micro-rolling control method and equipment for bonding silver wire equipment based on data monitoring

Abstract

The invention discloses a bonding silver wire equipment micro rolling control method and device based on data monitoring, and the method comprises the steps: in the production process of bonding silver wire equipment, determining a silver blank movement detection result in the process that a silver blank moves to a cleaning area according to data collected by a displacement sensor; when movement is normal, a silver blank cleaning detection result is determined according to data collected by the water pressure sensor; when cleaning is normal, the silver blank quality detection result is determined according to data collected by the laser diameter measuring instrument; when the quality of the silver blank is normal, an electric arc fused deposition detection result is determined according to the grain boundary movement coefficient; and when the electric arc fused deposition is normal, determining a micro-rolling detection result according to data acquired by the X-ray crystal analyzer. Therefore, the automatic micro-rolling control scheme of the bonding silver wire equipment based on data monitoring in the production process of the bonding silver wire equipment is realized. The abnormal condition in the operation of the bonding silver wire equipment can be found in time, the production efficiency is improved, the production cost is reduced, and the product quality is ensured, so that the market demand is better met.

Description

Technical Field

[0001] The present application relates to the technical field of silver bonding wires, and in particular to a method and device for controlling micro-rolling of silver bonding wire equipment based on data monitoring. Background Art

[0002] With the development of social economy and the advancement of science and technology, various automation equipment are increasingly used in modern industrial production, including silver wire bonding equipment. Silver wire bonding equipment is a key equipment used in the production of microelectronic devices. It can realize the precise processing and connection of silver wires, ensuring the stability and reliability of microelectronic devices. However, in the production process of silver wire bonding equipment, due to the influence of factors such as the silver wire bonding equipment itself and the production environment, the processing accuracy and connection quality of the silver wire are often unstable, or even fail. In order to discover and solve these problems in a timely manner, the silver wire bonding equipment must be effectively monitored and controlled. Therefore, it is very important to provide a solution for effective monitoring and control of silver wire bonding equipment. Summary of the invention

[0003] The present application provides a method and device for micro-rolling control of a silver wire bonding device based on data monitoring, so as to provide a solution for effectively monitoring and controlling the silver wire bonding device.

[0004] In a first aspect, the present application provides a method for controlling micro-rolling of a silver wire bonding device based on data monitoring, the method comprising:

[0005] In the production process of the silver wire bonding equipment, it is determined that the silver billet has been forged, the silver billet is moved to a cleaning area, a displacement sensor is used to determine a movement feedback value of the silver billet moving to the cleaning area, and a movement detection result is determined according to the movement feedback value;

[0006] If the movement detection result is that the movement is normal, start the high-pressure pump for cleaning, use the water pressure sensor to determine the water pressure value of the high-pressure pump during the cleaning process, and determine the cleaning detection result according to the water pressure value of the high-pressure pump;

[0007] If the cleaning test result is that the cleaning is normal, the diameter of the silver blank after cleaning is determined by using a laser diameter gauge, and the silver blank quality test result is determined according to the diameter of the silver blank;

[0008] If the silver billet quality test result is normal, the silver billet is made into silver material according to the process flow, the silver material is micro-rolled, the grain boundary migration coefficient of the silver material is determined, and the arc deposition test result is determined according to the grain boundary migration coefficient;

[0009] If the arc deposition test result shows that the arc deposition is normal, an X-ray crystal analyzer is used to detect the lattice parameters of the current crystal, and the micro-rolling test result is determined according to the lattice parameters.

[0010] In a second aspect, the present application provides a micro-rolling control device for bonding silver wire equipment based on data monitoring, the device comprising:

[0011] The first detection module is used to determine that the silver billet has been forged during the production process of the silver wire bonding equipment, move the silver billet to a cleaning area, use a displacement sensor to determine a movement feedback value of the silver billet moving to the cleaning area, and determine a movement detection result according to the movement feedback value;

[0012] A second detection module is used to start the high-pressure pump cleaning if the movement detection result is normal movement, use the water pressure sensor to determine the water pressure value of the high-pressure pump during the cleaning process, and determine the cleaning detection result according to the water pressure value of the high-pressure pump;

[0013] A third detection module is used to determine the diameter of the silver blank after cleaning by using a laser diameter meter if the cleaning detection result is that the cleaning is normal, and determine the silver blank quality detection result according to the diameter of the silver blank;

[0014] A fourth detection module is used for, if the quality detection result of the silver billet is normal, making the silver billet into silver material according to the process flow, micro-rolling the silver material, determining the grain boundary migration coefficient of the silver material, and determining the arc deposition detection result according to the grain boundary migration coefficient;

[0015] The fifth detection module is used to detect the lattice parameters of the current crystallization by using an X-ray crystal analyzer if the arc deposition detection result is that the arc deposition is normal, and determine the micro-rolling detection result according to the lattice parameters.

[0016] In a third aspect, the present application provides an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other via the communication bus;

[0017] Memory, used to store computer programs;

[0018] The processor is used to implement the method steps when executing the program stored in the memory.

[0019] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method steps described are implemented.

[0020] The present application provides a method and device for controlling micro-rolling of a bonding silver wire device based on data monitoring, the method comprising: in the production process of the bonding silver wire device, determining that the silver billet has been forged, moving the silver billet to a cleaning area, using a displacement sensor to determine a movement feedback value of the silver billet moving to the cleaning area, and determining a movement detection result according to the movement feedback value; if the movement detection result is that the movement is normal, starting a high-pressure pump for cleaning, using a water pressure sensor to determine a water pressure value of the high-pressure pump during the cleaning process, and determining a cleaning detection result according to the water pressure value of the high-pressure pump; if the cleaning detection result is that the cleaning is normal, using a laser diameter gauge to determine the diameter of the cleaned silver billet, and determining a silver billet quality detection result according to the diameter of the silver billet; if the silver billet quality detection result is that the quality is normal, making the silver billet into a silver material according to the process flow, micro-rolling the silver material, determining a grain boundary movement coefficient of the silver material, and determining an arc deposition detection result according to the grain boundary movement coefficient; if the arc deposition detection result is that the arc deposition is normal, using an X-ray crystal analyzer to detect the lattice parameters of the crystallization, and determining a micro-rolling detection result according to the lattice parameters.

[0021] The above technical solution has the following advantages or beneficial effects:

[0022] In this application, during the production process of the silver wire bonding equipment, the silver billet movement detection result is determined according to the data collected by the displacement sensor during the movement of the silver billet to the cleaning area; when the movement is normal, the silver billet cleaning detection result is determined according to the data collected by the water pressure sensor; when the cleaning is normal, the silver billet quality detection result is determined according to the data collected by the laser diameter gauge; when the silver billet quality is normal, the arc deposition detection result is determined according to the grain boundary movement coefficient; when the arc deposition is normal, the micro-rolling detection result is determined according to the data collected by the X-ray crystal analyzer. Thus, an automated data-based micro-rolling control scheme for the silver wire bonding equipment is realized during the production process of the silver wire bonding equipment. This application can timely discover abnormal conditions in the operation of the silver wire bonding equipment by real-time monitoring and analysis of various parameters of the silver wire bonding equipment, improve production efficiency, reduce production costs, and ensure product quality, so as to better meet market demand. This application provides a more effective monitoring and control means for the production of silver wire bonding equipment, which helps to improve the production capacity and product quality of silver wire bonding equipment and promote the development and progress of the entire microelectronic device industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the micro-rolling control process of the silver wire bonding equipment based on data monitoring provided in this application;

[0024] Figure 2 A schematic diagram of the process of determining the mobile detection result provided by this application;

[0025] Figure 3Schematic diagram of the process of determining cleaning test results for this application;

[0026] Figure 4 Schematic diagram of the process of determining cleaning test results for this application;

[0027] Figure 5 A schematic diagram of the process of determining the silver blank quality test results provided in this application;

[0028] Figure 6 A schematic diagram of the process of determining the silver blank quality test results provided in this application;

[0029] Figure 7 A schematic diagram of the process of determining the grain boundary migration coefficient of silver material provided in this application;

[0030] Figure 8 A schematic diagram of the process of determining arc deposition detection results provided for this application;

[0031] Fig. 9 A schematic diagram of the process of determining micro-rolling test results provided for this application;

[0032] Fig.10 Normal distribution diagram of recrystallization with a reduction height of 1.5 and 2 mm provided for this application;

[0033] Fig.11 A schematic diagram of the structure of a micro-rolling control device for bonding silver wire equipment based on data monitoring provided in this application;

[0034] Fig.12 This is a schematic diagram of the electronic device structure provided in this application. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] The technical terms involved in this application are explained as follows:

[0037] This application is based on multi-threaded processing to achieve micro-rolling control of bonding silver wire equipment based on data monitoring. Multithreading refers to the technology of implementing multiple threads concurrently from software or hardware. Computers with multi-threading capabilities can execute more than one thread at the same time due to hardware support, thereby improving overall processing performance. Systems with this capability include symmetric multiprocessors (symmetric multiprocessing is a multiprocessor hardware architecture with two or more identical processors (processors) sharing the same main memory and controlled by an operating system), multi-core processors, and chip-level multiprocessing or simultaneous multithreading processors. In a program, these independently running program fragments are called "threads", and the concept of programming using them is called "multithreading".

[0038] The laser diameter gauge uses a light beam emitted by a laser to pass through a polygonal scanning mirror and a scanning optical system to form a continuous high-speed scanning beam parallel to the optical axis. It scans the workpiece placed in the measuring area at high speed and is received by a photoelectric receiver placed opposite the workpiece. The light projected onto the photoelectric receiver is blocked when the light beam scans the workpiece, so data related to the diameter of the workpiece can be obtained by analyzing the signal output by the photoelectric receiver.

[0039] The principle of the gas constant measuring device is based on the ideal gas state equation PV=nRT, where P is the gas pressure, V is the gas volume, n is the number of gas moles, R is the gas constant, and T is the absolute temperature of the gas. By measuring the state of the gas at different pressures and volumes, the number of gas moles and the gas constant can be obtained, thereby calculating the relative molecular mass or molar mass of the gas.

[0040] X-ray crystal analyzer uses back-scattered Laue photography. The film is installed between the crystal and the radiation source, and the incident light beam passes through the small hole in the film. What is recorded is the diffracted light beam in the backward direction. The direction of the diffracted light beam is used to measure the shape and size of the unknown crystal unit cell in order to determine the orientation of the crystal and evaluate the perfection of the crystal.

[0041] Figure 1 A schematic diagram of the micro-rolling control process of the bonding silver wire equipment based on data monitoring provided in this application, the process includes the following steps:

[0042] S101: during the production process of the silver wire bonding equipment, it is determined that the silver billet has been forged, the silver billet is moved to a cleaning area, a displacement sensor is used to determine a movement feedback value of the silver billet moving to the cleaning area, and a movement detection result is determined according to the movement feedback value;

[0043] S102: If the movement detection result is that the movement is normal, start the high-pressure pump for cleaning, use the water pressure sensor to determine the water pressure value of the high-pressure pump during the cleaning process, and determine the cleaning detection result according to the water pressure value of the high-pressure pump;

[0044] S103: If the cleaning test result is that the cleaning is normal, the diameter of the silver blank after cleaning is determined by using a laser diameter measuring instrument, and the silver blank quality test result is determined according to the diameter of the silver blank;

[0045] S104: if the silver billet quality inspection result is normal, the silver billet is made into silver material according to the process flow, the silver material is micro-rolled, the grain boundary migration coefficient of the silver material is determined, and the arc deposition inspection result is determined according to the grain boundary migration coefficient;

[0046] S105: If the arc deposition detection result is that the arc deposition is normal, use an X-ray crystal analyzer to detect the lattice parameters of the current crystal, and determine the micro-rolling detection result according to the lattice parameters.

[0047] The micro-rolling control method of bonding silver wire equipment based on data monitoring provided in the present application is applied to electronic equipment, which may be a computer, a server or other equipment.

[0048] During the production process of the silver wire bonding equipment, it is determined that the silver billet has been forged, and the silver billet is moved to the cleaning area. At this time, the displacement sensor is used to collect the movement feedback value of the silver billet moving to the cleaning area, and then the movement feedback value is sent to the electronic device. The electronic device determines the movement detection result based on the movement feedback value. Optionally, the electronic device can save the correct movement feedback value in advance. If the collected movement feedback value is the same as the correct movement feedback value saved in advance, the movement detection result is determined to be normal movement, otherwise the movement is determined to be abnormal. If the movement is normal, the subsequent control process is carried out. If the movement is abnormal, an alarm prompt information used to characterize the abnormal movement is output, and the subsequent process is no longer carried out.

[0049] If the movement detection result is that the movement is normal, start the high-pressure pump for cleaning, use the water pressure sensor to collect the high-pressure pump water pressure value during the cleaning process, and send the high-pressure pump water pressure value to the electronic device. The electronic device determines the cleaning detection result based on the high-pressure pump water pressure value. Optionally, the electronic device can save the correct high-pressure pump water pressure value in advance. If the collected high-pressure pump water pressure value is the same as the correct high-pressure pump water pressure value saved in advance, the cleaning detection result is determined to be normal cleaning, otherwise it is determined that the cleaning is abnormal. If the cleaning is normal, the subsequent control process is carried out. If the cleaning is abnormal, an alarm prompt information used to characterize the cleaning abnormality is output, and the subsequent process is no longer carried out.

[0050] If the cleaning test result is that the cleaning is normal, the diameter of the cleaned silver blank is collected using a laser diameter meter, and then the diameter is sent to the electronic device. The electronic device determines the silver blank quality test result based on the diameter. Optionally, the electronic device can save the correct diameter in advance. If the collected diameter is the same as the pre-saved correct diameter, the silver blank quality test result is determined to be normal quality, otherwise it is determined that the quality is abnormal. If the quality is normal, the subsequent control process is carried out. If the quality is abnormal, an alarm prompt information used to characterize the abnormal quality is output, and the subsequent process is no longer carried out.

[0051] If the quality inspection result of the silver billet is normal, the silver billet is made into silver material according to the process flow. Optionally, the silver billet is subjected to the process flow of rough rolling-flying shearing-intermediate rolling-water tank temperature control-flying shearing-pre-micro-rolling to form the silver material. The silver material is micro-rolled, and then the grain boundary movement coefficient of the silver material is determined, and the arc deposition detection result is determined according to the grain boundary movement coefficient. Optionally, the electronic device can save the correct grain boundary movement coefficient in advance. If the collected grain boundary movement coefficient is the same as the correct grain boundary movement coefficient saved in advance, the arc deposition detection result is determined to be normal arc deposition, otherwise it is determined that the arc deposition is abnormal. If the arc deposition is normal, the subsequent control process is carried out. If the arc deposition is abnormal, an alarm prompt information used to characterize the abnormal arc deposition is output, and the subsequent process is no longer carried out.

[0052] If the arc deposition test result is that the arc deposition is normal, the lattice parameters of the crystal are detected by an X-ray crystal analyzer, and the micro-rolling test result is determined according to the lattice parameters. Optionally, the electronic device can save the correct lattice parameters in advance. If the collected lattice parameters are the same as the correct lattice parameters saved in advance, the micro-rolling test result is determined to be normal micro-rolling, otherwise the micro-rolling test result is determined to be abnormal micro-rolling. If the micro-rolling is normal, the subsequent control process is carried out, at which time the processing accuracy and connection quality of the silver wire can be guaranteed. If the micro-rolling is abnormal, an alarm prompt information for characterizing the abnormal micro-rolling is output, and the subsequent process is no longer carried out.

[0053] In this application, during the production process of the silver wire bonding equipment, the silver billet movement detection result is determined according to the data collected by the displacement sensor during the movement of the silver billet to the cleaning area; when the movement is normal, the silver billet cleaning detection result is determined according to the data collected by the water pressure sensor; when the cleaning is normal, the silver billet quality detection result is determined according to the data collected by the laser diameter gauge; when the silver billet quality is normal, the arc deposition detection result is determined according to the grain boundary movement coefficient; when the arc deposition is normal, the micro-rolling detection result is determined according to the data collected by the X-ray crystal analyzer. Thus, an automated data-based micro-rolling control scheme for the silver wire bonding equipment is realized during the production process of the silver wire bonding equipment. This application can timely discover abnormal conditions in the operation of the silver wire bonding equipment by real-time monitoring and analysis of various parameters of the silver wire bonding equipment, improve production efficiency, reduce production costs, and ensure product quality, so as to better meet market demand. This application provides a more effective monitoring and control means for the production of silver wire bonding equipment, which helps to improve the production capacity and product quality of silver wire bonding equipment and promote the development and progress of the entire microelectronic device industry.

[0054] In order to make the mobile detection results more accurate, Figure 2 The process diagram for determining the mobile detection result provided in this application includes the following steps:

[0055] S201: obtaining a silver billet forging furnace identifier corresponding to the silver billet, and obtaining a pre-saved target movement feedback value according to the silver billet forging furnace identifier;

[0056] S202: Determine a first ratio of the movement feedback value to the target movement feedback value, and if the first ratio belongs to a preset first ratio range, determine that the movement detection result is normal movement, otherwise determine that the movement detection result is abnormal movement.

[0057] In the present application, the silver billet forging furnace identification corresponding to the silver billet is first obtained, and the electronic device pre-stores the corresponding target movement feedback value for different silver billet forging furnaces. Therefore, after obtaining the silver billet forging furnace identification corresponding to the silver billet, the corresponding target movement feedback value can be determined according to the silver billet forging furnace identification. Then, a first ratio of the movement feedback value to the target movement feedback value is determined. If the first ratio belongs to a preset first ratio range, the movement detection result is determined to be normal movement, otherwise the movement detection result is determined to be abnormal movement. The preset first ratio range is, for example, 95% to 105%.

[0058] In order to make the cleaning test results more accurate, Figure 3 Schematic diagram of the process of determining the cleaning test results for this application, including the following steps:

[0059] S301: collecting the water pressure value of the high-pressure pump during the cleaning process using a water pressure sensor according to a preset sampling frequency;

[0060] S302: for each preset time period, determining an average value of water pressure values ​​of each high-pressure pump collected in the time period as a first average water pressure value;

[0061] S303: Determine the second ratio of the first average water pressure values ​​in any two time periods in the time periods; if each second ratio belongs to a preset second ratio range, determine that the cleaning detection result is normal cleaning, otherwise determine that the cleaning detection result is abnormal cleaning.

[0062] The preset sampling frequency is, for example, 10ns, 20ns, 40ns, etc. According to the preset sampling frequency, the water pressure sensor is used to collect the water pressure value of the high-pressure pump during the cleaning process. The preset time periods are, for example, 0-500ms, 500-1000ms, 1000-1500ms, 1500-2000ms, etc. For each preset time period, the average value of each high-pressure pump water pressure value collected in the time period is determined as the first average water pressure value, that is, for each time period, the first average water pressure value in the time period can be determined. Then, in each time period, the second ratio of the first average water pressure value in any two time periods is determined; if each second ratio belongs to the preset second ratio range, it is determined that the cleaning detection result is normal, otherwise it is determined that the cleaning detection result is abnormal. The preset second ratio range is, for example, 92% to 108%.

[0063] In order to further determine the cleaning test results more accurately, Figure 4 Schematic diagram of the process of determining the cleaning test results for this application, including the following steps:

[0064] S401: collecting the water pressure value of the high-pressure pump during the cleaning process using a water pressure sensor according to a preset sampling frequency;

[0065] S402: for each preset time period, determining an average value of water pressure values ​​of each high-pressure pump collected in the time period as a first average water pressure value;

[0066] S403: Determine a second ratio of the first average water pressure values ​​in any two time periods in the time periods; if each second ratio belongs to a preset second ratio range, determine an average value of each first average water pressure value as the second average water pressure value;

[0067] S404: obtaining a silver billet forging furnace identifier corresponding to the silver billet, and obtaining a pre-saved target water pressure value according to the silver billet forging furnace identifier;

[0068] S405: Determine a third ratio of the second average water pressure value to the target water pressure value. If the third ratio belongs to a preset third ratio range, determine that the cleaning detection result is normal cleaning; otherwise, determine that the cleaning detection result is abnormal cleaning.

[0069] In the present application, if each second ratio belongs to a preset second ratio range, the first average water pressure value in each time period is obtained, and then the average value of each first average water pressure value is calculated as the second average water pressure value.

[0070] In the present application, the electronic device obtains the silver billet forging furnace identification corresponding to the silver billet, and the corresponding target water pressure values ​​are pre-stored for different silver billet forging furnaces. Therefore, after obtaining the silver billet forging furnace identification corresponding to the silver billet, the corresponding target water pressure value can be determined according to the silver billet forging furnace identification. Then, a third ratio of the second average water pressure value to the target water pressure value is determined. If the third ratio belongs to a preset third ratio range, the cleaning detection result is determined to be normal cleaning, otherwise the cleaning detection result is determined to be abnormal cleaning. The preset third ratio range is, for example, 96% to 104%.

[0071] In order to make the silver billet quality test results more accurate, Figure 5 A schematic diagram of the process of determining the silver blank quality test result provided in this application, the process includes the following steps:

[0072] S501: Determine two adjacent first sampling positions, wherein the distance between the two adjacent first sampling positions is a preset first distance;

[0073] S502: using a laser diameter gauge to determine the diameters of the silver billet at the two adjacent first sampling positions of the cleaned silver billet; the two diameters of the silver billet are used as the first diameter of the silver billet and the second diameter of the silver billet respectively;

[0074] S503: Determine a fourth ratio of the diameter of the first silver billet to the diameter of the second silver billet. If the fourth ratio belongs to a preset fourth ratio range, determine that the silver billet quality inspection result is normal; otherwise, determine that the silver billet quality inspection result is abnormal.

[0075] The electronic device first determines two adjacent first sampling positions, and the preset first distance between the two adjacent first sampling positions is, for example, 100 μm. Then, a laser diameter gauge is used to determine the diameter of the silver billet at the two adjacent first sampling positions of the cleaned silver billet; the first silver billet diameter and the second silver billet diameter are obtained. Then, a fourth ratio of the first silver billet diameter to the second silver billet diameter is determined. If the fourth ratio belongs to the preset fourth ratio range, the silver billet quality detection result is determined to be normal quality, otherwise, the silver billet quality detection result is determined to be abnormal quality. The preset fourth ratio range is, for example, 80% to 120%.

[0076] In order to further determine the silver billet quality test results more accurately, Figure 6 A schematic diagram of the process of determining the silver blank quality test result provided in this application, the process includes the following steps:

[0077] S601: Determine two adjacent first sampling positions, wherein the distance between the two adjacent first sampling positions is a preset first distance;

[0078] S602: using a laser diameter gauge to determine the diameters of the silver billet at the two adjacent first sampling positions of the cleaned silver billet; the two diameters of the silver billet are used as the first diameter of the silver billet and the second diameter of the silver billet respectively;

[0079] S603: determining a fourth ratio of the diameter of the first silver blank to the diameter of the second silver blank, and if the fourth ratio belongs to a preset fourth ratio range, determining each second sampling position on the cleaned silver blank with a preset second distance as the interval distance between adjacent sampling positions;

[0080] S604: using a laser diameter meter to determine the diameter of the third silver billet at each second sampling position, and determining an average value of the diameters of the third silver billets as the fourth silver billet diameter;

[0081] S605: obtaining a silver billet forging furnace identifier corresponding to the silver billet, and obtaining a pre-stored target silver billet diameter according to the silver billet forging furnace identifier;

[0082] S606: Determine a fifth ratio of the fourth silver billet diameter to the target silver billet diameter. If the fifth ratio belongs to a preset fifth ratio range, determine that the silver billet quality inspection result is normal; otherwise, determine that the silver billet quality inspection result is abnormal.

[0083] In the present application, if the fourth ratio belongs to the preset fourth ratio range, the preset second distance is used as the interval distance between adjacent sampling positions to determine each second sampling position on the cleaned silver blank. The preset second distance is, for example, 500 μm. Then, a laser diameter gauge is used to determine the third silver blank diameter of each second sampling position, and the average value of each third silver blank diameter is determined as the fourth silver blank diameter.

[0084] In the present application, the electronic device obtains the silver billet forging furnace identification corresponding to the silver billet, and the corresponding target silver billet diameter is saved in advance for different silver billet forging furnaces. Therefore, after obtaining the silver billet forging furnace identification corresponding to the silver billet, the corresponding target silver billet diameter can be determined according to the silver billet forging furnace identification. Then, the fifth ratio of the fourth silver billet diameter to the target silver billet diameter is determined. If the fifth ratio belongs to the preset fifth ratio range, the silver billet quality inspection result is determined to be normal quality, otherwise the silver billet quality inspection result is determined to be abnormal quality. The preset fifth ratio range is, for example, 95% to 105%.

[0085] In addition, the silver billet identification can be determined according to the fifth ratio. For example, the fifth ratio belongs to 105%-103%, and the silver billet identification is 1; the fifth ratio belongs to 103%-101%, and the silver billet identification is 2; the fifth ratio belongs to 101%-99%, and the silver billet identification is 3; the fifth ratio belongs to 99%-97%, and the silver billet identification is 4; the fifth ratio belongs to 97%-95%, and the silver billet identification is 5, etc.

[0086] In this application, in order to determine the grain boundary migration coefficient of silver material more accurately, Figure 7 A schematic diagram of a process for determining the grain boundary migration coefficient of a silver material provided in this application, the process comprising the following steps:

[0087] S701: micro-rolling the silver material, detecting the characteristic thickness and self-diffusion activation energy of the silver material grain boundary by using an X-ray crystal analyzer; detecting the current environmental gas constant by using a gas constant measuring device; and detecting the current absolute temperature of the silver material grain boundary by using an infrared temperature sensor;

[0088] S702: determining a silver billet identifier according to the fifth ratio; acquiring a pre-stored silver material grain boundary self-diffusion coefficient according to the silver billet forging furnace identifier and the silver billet identifier;

[0089] S703: Determine and calculate the current silver material grain boundary movement coefficient according to the characteristic thickness and self-diffusion activation energy of the silver material grain boundary, the current ambient gas constant, the current silver material grain boundary absolute temperature, and the pre-saved silver material grain boundary self-diffusion coefficient.

[0090] In the present application, the silver material is micro-rolled, and the characteristic thickness and self-diffusion activation energy of the silver material grain boundary are detected by an X-ray crystal analyzer; the current environmental gas constant is detected by a gas constant measuring device; and the current silver material grain boundary absolute temperature is detected by an infrared temperature sensor. And according to the fifth ratio, the silver billet identification is determined. The electronic device pre-stores the silver billet forging furnace identification and the silver billet identification, and the correspondence between the silver material grain boundary self-diffusion coefficient. After the electronic device determines the silver billet forging furnace identification and the silver billet identification, the silver material grain boundary self-diffusion coefficient can be determined according to the above correspondence. Then, according to the characteristic thickness and self-diffusion activation energy of the silver material grain boundary, the current environmental gas constant, the current silver material grain boundary absolute temperature, and the pre-stored silver material grain boundary self-diffusion coefficient, the current silver material grain boundary movement coefficient is determined and calculated.

[0091] Optionally, the characteristic thickness of the silver material grain boundary and the self-diffusion activation energy, the current ambient gas constant, the current silver material grain boundary absolute temperature, and the pre-stored silver material grain boundary self-diffusion coefficient are substituted into the formula: Determine the current silver material grain boundary movement coefficient. In the formula, M is the grain boundary movement coefficient; T is the absolute temperature of the grain boundary; R is the gas constant; δ is the characteristic thickness of the grain boundary; D is the grain boundary self-diffusion coefficient; Q is the grain boundary self-diffusion activation energy; k is the Boltzmann constant; e is the natural constant.

[0092] In order to make the arc deposition detection results more accurate, Figure 8 The process diagram for determining the arc deposition detection result provided for this application includes the following steps:

[0093] S801: acquiring a pre-saved target grain boundary migration coefficient according to the silver billet forging furnace identifier and the silver billet identifier;

[0094] S802: Determine a sixth ratio of the grain boundary movement coefficient to the target grain boundary movement coefficient, and if the sixth ratio belongs to a preset sixth ratio range, determine that the arc deposition detection result is normal arc deposition; otherwise, determine that the arc deposition detection result is abnormal arc deposition.

[0095] The electronic device pre-stores the corresponding relationship between the silver billet forging furnace identification and the silver billet identification and the target grain boundary movement coefficient. According to the silver billet forging furnace identification and the silver billet identification, the corresponding target grain boundary movement coefficient can be determined. Then, the sixth ratio of the grain boundary movement coefficient to the target grain boundary movement coefficient is determined. If the sixth ratio belongs to the preset sixth ratio range, it is determined that the arc deposition detection result is normal arc deposition, otherwise it is determined that the arc deposition detection result is abnormal arc deposition. The preset sixth ratio range is, for example, 88% to 112%.

[0096] In order to make the micro-rolling test results more accurate, Fig. 9The process diagram for determining the micro-rolling test result provided in this application includes the following steps:

[0097] S901: Acquire the current pressing height of the silver wire bonding device, and acquire the pre-saved target lattice parameters according to the pressing height and the silver blank identification;

[0098] S902: Determine a seventh ratio of the lattice parameter to the target lattice parameter, and if the seventh ratio belongs to a preset seventh ratio range, determine that the micro-rolling detection result is normal; otherwise, determine that the micro-rolling detection result is abnormal.

[0099] The electronic device first obtains the current depression height of the bonding silver wire device. The electronic device pre-saves the depression height and the silver billet mark, and the corresponding relationship with the target lattice parameters. Therefore, after determining the depression height and the silver billet mark, the corresponding target lattice parameters can be determined according to the above correspondence. Then determine the seventh ratio of the lattice parameter to the target lattice parameter. If the seventh ratio belongs to the preset seventh ratio range, determine that the micro-rolling detection result is normal, otherwise determine that the micro-rolling detection result is abnormal. The preset seventh ratio is, for example, 80% to 120%.

[0100] In this application, it is determined that the silver billet has been forged, and the silver billet is moved to the cleaning area. According to the displacement sensor movement feedback value, it is determined whether there is a problem with the current movement. It is determined that there is no problem with the movement of the silver billet, and the high-pressure pump cleaning is started. The water pressure sensor combination detects the water pressure of the high-pressure pump, and the normal water pressure data on the cloud is used to determine whether the current silver billet cleaning is abnormal. It is determined that the silver billet cleaning is completed without abnormality. The laser diameter gauge detects the diameter of the silver billet according to the unit distance of 100μm, and the adjacent diameter data is compared with the normal diameter data on the cloud to determine whether there is a problem with the quality of the silver billet. If there is no problem with the quality, the current silver billet is assigned an identification value according to the normal diameter data. It is determined that the current silver billet has an identification, and the current silver billet is subjected to the rough rolling-flying shear-intermediate rolling-water tank temperature control-flying shear-pre-micro-rolling process to form a silver material. The silver material that has completed the process is micro-rolled, and the current silver material grain boundary movement coefficient is determined and calculated according to the X-ray crystal analyzer, the gas constant measuring device, the infrared temperature sensor, the silver billet forging furnace number, and the identification of the current silver material, and the arc deposition is determined to be abnormal with the cloud data. Confirm that there is no abnormality in arc deposition, use X-ray crystal analyzer to detect the lattice parameters of current crystallization, and obtain the lattice parameters of normal crystallization based on the pressing height and the identification number of the current silver billet to determine whether there is a problem with the current micro-rolling of silver material.

[0101] Step S1-1: The intelligent silver wire bonding device is powered on, and the intelligent silver wire bonding device system creates thread 1, controls the silver billet to be added to the forging furnace, and the intelligent silver wire bonding device system reads that the current silver billet has been forged, and the intelligent silver wire bonding device system controls the silver billet to enter the cleaning area, reads the movement feedback value of the current silver wire bonding device displacement sensor, and determines it as the movement feedback value. The intelligent silver wire bonding device system reads the silver billet forging furnace identifier, and obtains the normal cleaning movement distance from the cloud according to the current silver billet forging furnace identifier, and determines it as the target movement feedback value. When the movement feedback value is greater than the target movement feedback value, it is determined that the silver billet has moved to the accurate cleaning area, and the intelligent silver wire bonding device system suspends the movement of the silver billet, and starts the water pressure sensor and the high-pressure pump. The intelligent silver wire bonding equipment system controls the high-pressure water generated by the high-pressure pump, and the high-pressure water jet formed by the high-pressure nozzle hits the silver billet. When the high-pressure water jet impacts the surface of the billet, the shear force generated by the different cooling shrinkage rates of the matrix material and the silver oxide skin, as well as the steam expansion and explosion generated by the water penetrating between the matrix material and the silver oxide skin, breaks the silver oxide skin into small pieces and quickly detaches from the matrix surface.

[0102] Step S1-2: The intelligent silver wire bonding equipment system reads the current number of water pressure sensor feedbacks. If there is 1 water pressure sensor, the high-pressure pump water pressure value is sampled once every 40ns. If there are 2 water pressure sensors combined and expanded, the high-pressure pump water pressure value is sampled once every 20ns. If there are 4 water pressure sensors combined and expanded, the high-pressure pump water pressure value is sampled once every 10ns. In this way, the high-pressure pump water pressure value data is sampled at a higher time resolution. If the number of water pressure sensor feedbacks is less than or equal to 2, the maintenance department is sent a message indicating that there is an abnormality in the water pressure sensor sampling, and the location of the abnormal cleaning area is sent to notify the maintenance personnel to perform maintenance. The intelligent silver wire bonding equipment system obtains the water pressure data of the high-pressure pump every 500ms from the water pressure sensor and calculates the average value and records it as a water pressure value. The intelligent silver wire bonding equipment system determines the 2s data of the water pressure sensor as the first water pressure value (0-500ms water pressure average value), the second water pressure value (500-1000ms water pressure average value), the third water pressure value (1000-1500ms water pressure average value), and the fourth water pressure value (1500-2000ms water pressure average value). The first, second, third, and fourth water pressure values ​​are matched with each other. If the first, second, third, and fourth water pressure values ​​have a matching ratio greater than 108%, or a matching ratio less than 92%, it is judged that the current high-pressure pump may be abnormal, and the intelligent silver wire bonding equipment system suspends the high-pressure pump and starts the standby high-pressure pump for cleaning. If the water pressure of the standby high-pressure pump is also abnormal, the silver blank cleaning is suspended, and the maintenance department is sent a message indicating that the high-pressure pump and the standby high-pressure pump are abnormal, and the location of the abnormal cleaning area is sent to notify the maintenance personnel to perform maintenance.

[0103] Step S1-3: If the first, second, third, and fourth water pressure values ​​are all less than or equal to 108% in the mutual matching ratio, and the matching ratio is equal to or greater than 92%, the first, second, third, and fourth water pressure values ​​are calculated as the average value, and determined as the fifth water pressure value. The intelligent bonding silver wire equipment system obtains the normal cleaning water pressure from the cloud according to the silver billet forging furnace identification, determines it as the target water pressure value, and matches the fifth water pressure value with the target water pressure value. If the fifth water pressure value is greater than 104% of the target water pressure value, or the fifth water pressure value is less than 96% of the target water pressure value, it is judged that the current high-pressure pump may be abnormal, and the intelligent bonding silver wire equipment system suspends the high-pressure pump and starts the standby high-pressure pump for cleaning. If the water pressure of the standby high-pressure pump is also abnormal, the silver billet cleaning is suspended, and the maintenance department is sent that the high-pressure pump and the standby high-pressure pump are abnormal, and the location of the abnormal cleaning area is sent to notify the maintenance personnel to perform maintenance. If the fifth water pressure value is less than or equal to 104% of the target water pressure value, and the fifth water pressure value is greater than or equal to 96% of the target water pressure value, it is judged that the current high-pressure pump cleaning state is normal.

[0104] Step S2-1: Determine that the cleaning state of the high-pressure pump is normal, create thread 2, and the intelligent bonding silver wire equipment system reads that the silver billet cleaning is completed, and starts the laser diameter gauge. The laser diameter gauge detects the diameter of the silver billet (cylindrical silver billet) according to the unit distance of 100μm, divides and multiplies the adjacent diameter data of the silver billet by 100%, and determines it as the first diameter ratio group. The intelligent bonding silver wire equipment system reads the current first diameter ratio group. If the first diameter ratio group is greater than 120%, or less than 80%, it is judged that there is a problem with the quality of the current silver billet, and the intelligent bonding silver wire equipment recycles and remakes the silver billet. If the first diameter ratio group is less than or equal to 120%, and is equal to or greater than 80%, the intelligent bonding silver wire equipment system obtains the laser diameter gauge detection data and calculates the average value every 500μm, and determines it as the first diameter data group.

[0105] Step S2-2: The intelligent bonding silver wire equipment system obtains the normal diameter of the silver billet after forging and cleaning from the cloud according to the number of the silver billet forging furnace, determines it as the second diameter data, matches the first diameter data group with the second diameter data, if the first diameter data group is greater than 105% of the second diameter data, or the first diameter data group is less than 95% of the second diameter data. It is judged that there is a problem with the quality of the current silver billet, and the intelligent bonding silver wire equipment recycles and remakes the silver billet. If the first diameter data group is less than or equal to 105% of the second diameter data, and the first diameter data group is equal to or greater than 95% of the second diameter data. It is judged that there is no problem with the quality of the current silver billet, the intelligent bonding silver wire equipment system calculates the average value of the first diameter data group, determines it as the third diameter data, divides the third diameter data by the second diameter data, and determines it as the second diameter ratio value. The silver blank marks 1 (105%-103%), 2 (103%-101%), 3 (101%-99%), 4 (99%-97%), and 5 (97%-95%) are set according to the second diameter ratio value.

[0106] Step S3-1: Determine that the cleaned silver billet has an identification, create thread 3, and the intelligent bonding silver wire equipment system controls the silver billet with the identification to perform the following steps: rough rolling-flying shear-intermediate rolling-water tank temperature control-flying shear-pre-micro rolling, determine that the silver billet has completed pre-micro rolling to become a silver material, and the intelligent bonding silver wire equipment controls the water tank temperature of the pre-micro rolled silver material. The intelligent bonding silver wire equipment system starts the infrared temperature sensor, and the infrared temperature sensor detects that the current pre-micro rolled silver material temperature is within the normal range. The intelligent bonding silver wire equipment performs arc melting-micro rolling on the silver material (the coarse grains in the pre-micro rolled silver material will Because of the strain and stress concentration during the rolling process, fracture and recrystallization occur, and then finer new grains are formed). The intelligent silver wire bonding equipment system starts the X-ray crystal analyzer and the gas constant measuring device. The X-ray crystal analyzer detects the characteristic thickness and self-diffusion activation energy of the current silver material grain boundary. The gas constant measuring device detects the current environmental gas constant. The infrared temperature sensor detects the current silver material grain boundary absolute temperature. The intelligent silver wire bonding equipment system obtains the normal silver material grain boundary self-diffusion coefficient according to the silver billet forging furnace number and the current silver billet identification number, and puts the obtained data into the following formula for calculation:

[0107]

[0108] Where M is the grain boundary mobility coefficient; T is the absolute temperature of the grain boundary; R is the gas constant; δ is the characteristic thickness of the grain boundary; D is the grain boundary self-diffusion coefficient; Q is the grain boundary self-diffusion activation energy; k is the Boltzmann constant; and e is a natural constant.

[0109] Step S3-2: The intelligent silver wire bonding equipment system obtains the current grain boundary movement coefficient of the silver material undergoing arc deposition-micro-rolling, and determines it as the first grain boundary movement coefficient. The intelligent silver wire bonding equipment system obtains the normal silver material grain boundary movement coefficient according to the silver billet forging furnace number and the identification number of the current silver billet, and determines it as the second grain boundary movement coefficient. The first grain boundary movement coefficient is matched with the second grain boundary movement coefficient. If the first grain boundary movement coefficient is greater than 112% of the second grain boundary movement coefficient, or the first grain boundary movement coefficient is less than 88% of the second grain boundary movement coefficient, it is judged that the current silver material arc deposition is abnormal. The intelligent bonding silver wire equipment system obtains the intelligent bonding silver wire equipment arc deposition spare parameters from the cloud according to the ratio between the first grain boundary movement coefficient and the second grain boundary movement coefficient, and determines it as the first equipment parameter. The current intelligent bonding silver wire equipment parameter is read and determined as the second equipment parameter. The first equipment parameter is matched with the second equipment parameter. If there is a difference, the first equipment parameter is replaced with the current intelligent bonding silver wire equipment arc deposition parameter (second equipment parameter), and the grain boundary movement coefficient is re-judged. If there is still an abnormality in the re-judgment of the grain boundary movement coefficient, or there is no difference between the first equipment parameter and the second equipment parameter, it is judged that the current intelligent bonding silver wire equipment hardware may be abnormal, and the intelligent bonding silver wire equipment system stops the operation of the intelligent bonding silver wire equipment, sends a message to the maintenance department that the intelligent bonding silver wire equipment is abnormal, and sends the abnormal equipment location, and the alarm notifies the maintenance personnel to perform maintenance. If the first grain boundary movement coefficient is less than or equal to 112% of the second grain boundary movement coefficient, and the first grain boundary movement coefficient is greater than or equal to 88% of the second grain boundary movement coefficient, it is determined that there is no abnormality in the current arc deposition of the silver material, and the saving control command is 1.

[0110] Step S3-3: Under the action of the residual heat of the molten heat source and the rolling pressure, recrystallized nuclei begin to appear continuously at the grain boundaries and gradually generate a layer of recrystallized equiaxed crystal regions. Determine that the current arc melting control command is 1, the X-ray crystal analyzer detects the lattice parameter of the current crystallization and determines it as the first lattice parameter. The intelligent bonding silver wire equipment system reads the current depression height, obtains the lattice parameter of normal crystallization from the cloud according to the current depression height and the identification number of the current silver material, and determines it as the second lattice parameter. Match the first lattice parameter with the second lattice parameter. If the first lattice parameter is greater than or equal to 120% of the second lattice parameter, or the first lattice parameter is less than or equal to 80% of the second lattice parameter, it is determined that there is an abnormality in the micro-rolling of the current intelligent bonding silver wire equipment. The intelligent bonding silver wire equipment system obtains the backup micro-rolling parameter of the intelligent bonding silver wire equipment from the cloud according to the identification number of the current silver material and determines it as the third equipment parameter. Read the current micro-rolling parameter of the intelligent bonding silver wire equipment and determine it as the fourth equipment parameter. Match the third equipment parameter with the fourth equipment parameter. If there is a difference, replace the current micro-rolling parameter of the intelligent bonding silver wire equipment (the fourth equipment parameter) with the third equipment parameter, and re-judge the crystallization lattice parameter. If the crystallization lattice parameter is re-judged and there is still an abnormality, or there is no difference between the third device parameter and the fourth device parameter, it is judged that the current intelligent bonding silver wire equipment hardware may be abnormal, and the intelligent bonding silver wire equipment system stops the operation of the intelligent bonding silver wire equipment, sends a message to the maintenance department indicating that the intelligent bonding silver wire equipment has an abnormality, and sends the abnormal device location, and the alarm notifies the maintenance personnel to perform repairs. If the first lattice parameter is less than 120% of the second lattice parameter, and the first lattice parameter is greater than 80% of the second lattice parameter. It is judged that there is no problem with the current micro-rolling of the silver material, and it is determined that the micro-rolling of the silver wire is completed. The intelligent bonding silver wire equipment system transmits the micro-rolling data to the console and focuses on the micro-rolling time, and uploads and saves the micro-rolling data to the cloud as an execution log for viewing.

[0111] Fig.10 The normal distribution diagram of recrystallization with a pressing height of 1.5 and 2 mm provided for this application is as follows: Fig.10 As shown in the figure, the farther away from the weld in the height direction, the smaller the average grain size, and then it reaches a basically stable value, and the final stable grain sizes of the two are basically the same; it can also be seen that a larger pressing height produces a larger recrystallization area and a more uniform grain size. This is caused by the increase in the pressing height making the nucleation position relatively uniform.

[0112] Fig.11 The schematic diagram of the structure of the micro-rolling control device for bonding silver wire equipment based on data monitoring provided in this application includes:

[0113] The first detection module 111 is used to determine that the silver billet has been forged during the production process of the silver wire bonding equipment, move the silver billet to a cleaning area, use a displacement sensor to determine a movement feedback value of the silver billet moving to the cleaning area, and determine a movement detection result according to the movement feedback value;

[0114] The second detection module 112 is used to start the high-pressure pump cleaning if the movement detection result is normal movement, use the water pressure sensor to determine the water pressure value of the high-pressure pump during the cleaning process, and determine the cleaning detection result according to the water pressure value of the high-pressure pump;

[0115] The third detection module 113 is used to determine the diameter of the silver blank after cleaning by using a laser diameter meter if the cleaning detection result is that the cleaning is normal, and determine the silver blank quality detection result according to the diameter of the silver blank;

[0116] The fourth detection module 114 is used for, if the quality detection result of the silver billet is normal, manufacturing the silver billet into silver material according to the process flow, performing micro-rolling on the silver material, determining the grain boundary migration coefficient of the silver material, and determining the arc deposition detection result according to the grain boundary migration coefficient;

[0117] The fifth detection module 115 is used to detect the lattice parameters of the current crystal by using an X-ray crystal analyzer if the arc deposition detection result is that the arc deposition is normal, and determine the micro-rolling detection result according to the lattice parameters.

[0118] The first detection module 111 is used to obtain the silver billet forging furnace identifier corresponding to the silver billet, and obtain a pre-saved target movement feedback value according to the silver billet forging furnace identifier; determine a first ratio of the movement feedback value to the target movement feedback value, and if the first ratio belongs to a preset first ratio range, determine that the movement detection result is normal movement, otherwise determine that the movement detection result is abnormal movement.

[0119] The second detection module 112 is used to collect the water pressure value of the high-pressure pump during the cleaning process using a water pressure sensor at a preset sampling frequency; for each preset time period, determine the average value of each high-pressure pump water pressure value collected within the time period as the first average water pressure value; determine the second ratio of the first average water pressure values ​​within any two time periods in each time period; if each second ratio belongs to the preset second ratio range, determine that the cleaning detection result is normal cleaning, otherwise determine that the cleaning detection result is abnormal cleaning.

[0120] The second detection module 112 is used to determine the average value of each first average water pressure value as the second average water pressure value; obtain the silver billet forging furnace identifier corresponding to the silver billet, and obtain the pre-saved target water pressure value according to the silver billet forging furnace identifier; determine a third ratio of the second average water pressure value to the target water pressure value, if the third ratio belongs to a preset third ratio range, determine that the cleaning detection result is normal cleaning, otherwise determine that the cleaning detection result is abnormal cleaning.

[0121] The third detection module 113 is used to determine two adjacent first sampling positions, wherein the distance between the two adjacent first sampling positions is a preset first distance; use a laser diameter gauge to determine the silver billet diameter of the two adjacent first sampling positions of the cleaned silver billet; use the two silver billet diameters as the first silver billet diameter and the second silver billet diameter respectively; determine a fourth ratio of the first silver billet diameter to the second silver billet diameter, and if the fourth ratio belongs to a preset fourth ratio range, determine that the silver billet quality detection result is normal in quality, otherwise determine that the silver billet quality detection result is abnormal in quality.

[0122] The third detection module 113 is used to determine each second sampling position on the cleaned silver billet with a preset second distance as the interval distance between adjacent sampling positions; use a laser diameter meter to determine the third silver billet diameter of each second sampling position, and determine the average value of each third silver billet diameter as the fourth silver billet diameter; obtain the silver billet forging furnace identification corresponding to the silver billet, and obtain the pre-saved target silver billet diameter according to the silver billet forging furnace identification; determine the fifth ratio of the fourth silver billet diameter to the target silver billet diameter, if the fifth ratio belongs to the preset fifth ratio range, determine that the silver billet quality detection result is normal quality, otherwise determine that the silver billet quality detection result is abnormal quality.

[0123] The fourth detection module 114 is used to micro-roll the silver material, detect the characteristic thickness and self-diffusion activation energy of the silver material grain boundary by using an X-ray crystal analyzer; detect the current environmental gas constant by using a gas constant measuring device; detect the current silver material grain boundary absolute temperature by using an infrared temperature sensor; determine the silver billet identification according to the fifth ratio; obtain the pre-saved silver material grain boundary self-diffusion coefficient according to the silver billet forging furnace identification and the silver billet identification; determine and calculate the current silver material grain boundary movement coefficient according to the characteristic thickness and self-diffusion activation energy of the silver material grain boundary, the current environmental gas constant, the current silver material grain boundary absolute temperature, and the pre-saved silver material grain boundary self-diffusion coefficient.

[0124] The fourth detection module 114 is used to obtain a pre-saved target grain boundary movement coefficient according to the silver billet forging furnace identification and the silver billet identification; determine a sixth ratio of the grain boundary movement coefficient to the target grain boundary movement coefficient, and if the sixth ratio belongs to a preset sixth ratio range, determine that the arc deposition detection result is normal arc deposition; otherwise, determine that the arc deposition detection result is abnormal arc deposition.

[0125] The fifth detection module 115 is used to obtain the current depression height of the bonding silver wire equipment, and obtain the pre-saved target lattice parameters according to the depression height and the silver billet identification; determine the seventh ratio of the lattice parameter to the target lattice parameter, if the seventh ratio belongs to the preset seventh ratio range, determine that the micro-rolling detection result is normal, otherwise determine that the micro-rolling detection result is abnormal.

[0126] The present application also provides an electronic device, such as Fig.12 As shown, it includes: a processor 121, a communication interface 122, a memory 123 and a communication bus 124, wherein the processor 121, the communication interface 122, and the memory 123 communicate with each other through the communication bus 124;

[0127] The memory 123 stores a computer program, and when the program is executed by the processor 121, the processor 121 executes any one of the above method steps.

[0128] The communication bus mentioned in the above electronic device can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The communication bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, only one thick line is used in the figure, but it does not mean that there is only one bus or one type of bus.

[0129] The communication interface 122 is used for communication between the electronic device and other devices.

[0130] The memory may include a random access memory (RAM) or a non-volatile memory (NVM), such as at least one disk memory. Optionally, the memory may also be at least one storage device located away from the aforementioned processor.

[0131] The above-mentioned processor can be a general-purpose processor, including a central processing unit, a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit, a field programmable gate array or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component, etc.

[0132] The present application also provides a computer storage readable storage medium, wherein the computer readable storage medium stores a computer program executable by an electronic device, and when the program runs on the electronic device, the electronic device implements any of the above method steps when executing.

[0133] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0134] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A micro-rolling control method for bonding silver wire equipment based on data monitoring, characterized in that: The method comprises: In the production process of the silver wire bonding equipment, it is determined that the silver billet has been forged, the silver billet is moved to a cleaning area, a displacement sensor is used to determine a movement feedback value of the silver billet moving to the cleaning area, and a movement detection result is determined according to the movement feedback value; If the movement detection result is that the movement is normal, start the high-pressure pump for cleaning, use the water pressure sensor to determine the water pressure value of the high-pressure pump during the cleaning process, and determine the cleaning detection result according to the water pressure value of the high-pressure pump; If the cleaning test result is that the cleaning is normal, the diameter of the silver blank after cleaning is determined by using a laser diameter gauge, and the silver blank quality test result is determined according to the diameter of the silver blank; If the silver billet quality test result is normal, the silver billet is made into silver material according to the process flow, the silver material is micro-rolled, the grain boundary migration coefficient of the silver material is determined, and the arc deposition test result is determined according to the grain boundary migration coefficient; If the arc deposition test result shows that the arc deposition is normal, an X-ray crystal analyzer is used to detect the lattice parameters of the current crystal, and the micro-rolling test result is determined according to the lattice parameters.

2. The method according to claim 1, characterized in that Determining the motion detection result according to the motion feedback value includes: Obtaining a silver billet forging furnace identifier corresponding to the silver billet, and obtaining a pre-saved target movement feedback value according to the silver billet forging furnace identifier; A first ratio of the movement feedback value to the target movement feedback value is determined, and if the first ratio belongs to a preset first ratio range, the movement detection result is determined to be normal movement, otherwise, the movement detection result is determined to be abnormal movement.

3. The method according to claim 1, characterized in that The method of using a water pressure sensor to determine the water pressure value of a high-pressure pump during the cleaning process and determining the cleaning detection result according to the water pressure value of the high-pressure pump comprises: According to the preset sampling frequency, the water pressure value of the high-pressure pump during the cleaning process is collected using a water pressure sensor; For each preset time period, determine the average value of each high-pressure pump water pressure value collected in the time period as the first average water pressure value; Determine the second ratio of the first average water pressure values ​​in any two time periods in the said each time period; if each second ratio belongs to the preset second ratio range, determine that the cleaning detection result is normal cleaning, otherwise determine that the cleaning detection result is abnormal cleaning.

4. The method according to claim 3, characterized in that If all the second ratios belong to the preset second ratio range, before determining that the cleaning detection result is normal cleaning, the method further includes: Determine an average value of each first average water pressure value as a second average water pressure value; Obtaining a silver billet forging furnace identifier corresponding to the silver billet, and obtaining a pre-saved target water pressure value according to the silver billet forging furnace identifier; A third ratio of the second average water pressure value to the target water pressure value is determined. If the third ratio belongs to a preset third ratio range, the cleaning detection result is determined to be normal cleaning; otherwise, the cleaning detection result is determined to be abnormal cleaning.

5. The method according to claim 1, characterized in that The method of determining the diameter of the cleaned silver blank by using a laser diameter meter and determining the silver blank quality test result according to the diameter of the silver blank comprises: Determine two adjacent first sampling positions, wherein the distance between the two adjacent first sampling positions is a preset first distance; Determine the diameters of the silver billet at the two adjacent first sampling positions of the cleaned silver billet using a laser diameter gauge; and use the two silver billet diameters as the first silver billet diameter and the second silver billet diameter respectively; A fourth ratio of the first silver billet diameter to the second silver billet diameter is determined. If the fourth ratio belongs to a preset fourth ratio range, the silver billet quality inspection result is determined to be normal in quality; otherwise, the silver billet quality inspection result is determined to be abnormal in quality.

6. The method according to claim 5, characterized in that If the fourth ratio falls within the preset fourth ratio range, before determining that the silver blank quality test result is normal, the method further includes: Taking the preset second distance as the interval distance between adjacent sampling positions, determining each second sampling position on the cleaned silver blank; Determine the diameter of the third silver billet at each second sampling position using a laser diameter gauge, and determine the average value of the diameters of the third silver billets as the fourth silver billet diameter; Obtaining a silver billet forging furnace identifier corresponding to the silver billet, and obtaining a pre-saved target silver billet diameter according to the silver billet forging furnace identifier; Determine a fifth ratio of the fourth silver billet diameter to the target silver billet diameter. If the fifth ratio belongs to a preset fifth ratio range, determine that the silver billet quality inspection result is normal; otherwise, determine that the silver billet quality inspection result is abnormal.

7. The method according to claim 6, characterized in that The silver material is subjected to micro-rolling to determine the grain boundary migration coefficient of the silver material, including: The silver material is micro-rolled, and the characteristic thickness and self-diffusion activation energy of the silver material grain boundary are detected by an X-ray crystal analyzer; the current environmental gas constant is detected by a gas constant measuring device; and the current silver material grain boundary absolute temperature is detected by an infrared temperature sensor; Determine the silver billet identification according to the fifth ratio; obtain the pre-stored silver material grain boundary self-diffusion coefficient according to the silver billet forging furnace identification and the silver billet identification; The current silver material grain boundary movement coefficient is determined and calculated according to the characteristic thickness and self-diffusion activation energy of the silver material grain boundary, the current ambient gas constant, the current silver material grain boundary absolute temperature, and the pre-saved silver material grain boundary self-diffusion coefficient.

8. The method according to claim 7, characterized in that According to the grain boundary migration coefficient, the arc deposition detection result is determined including: According to the silver billet forging furnace identifier and the silver billet identifier, obtaining a pre-saved target grain boundary migration coefficient; A sixth ratio of the grain boundary movement coefficient to the target grain boundary movement coefficient is determined, and if the sixth ratio belongs to a preset sixth ratio range, the arc deposition detection result is determined to be normal arc deposition, otherwise the arc deposition detection result is determined to be abnormal arc deposition.

9. The method according to claim 7, characterized in that Using an X-ray crystal analyzer to detect the lattice parameters of the crystal, and determining the micro-rolling test results according to the lattice parameters includes: Acquire the current pressing height of the silver wire bonding device, and acquire the pre-saved target lattice parameters according to the pressing height and the silver blank identification; A seventh ratio of the lattice parameter to the target lattice parameter is determined, and if the seventh ratio belongs to a preset seventh ratio range, the micro-rolling detection result is determined to be normal micro-rolling, otherwise the micro-rolling detection result is determined to be abnormal micro-rolling.

10. An electronic device, characterized in that: It includes a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus; Memory, used to store computer programs; A processor, for implementing the method steps described in any one of claims 1 to 9 when executing a program stored in a memory.

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