Loading chamber of semiconductor process equipment

Abstract

The embodiment of the invention provides a loading cavity of semiconductor process equipment. The loading cavity comprises a cavity body, a door body and a sealing ring, the cavity is provided with an opening, the door body located at the door closing position is opposite to the opening, the sealing ring is located in a gap area between the door body and the periphery of the opening, the sealing ring comprises a top end and a bottom end which are far away from each other in the height direction of the sealing ring, and a first sealing cavity is formed in the sealing ring. The first sealing cavity is arranged in the surrounding direction of the sealing ring, the pressure in the first sealing cavity can be adjusted, and the distance between the top end and the bottom end is increased along with the increase of the pressure in the first sealing cavity; the bottom end is arranged on one of the door body and the periphery of the opening, and the top end is used for abutting against the other one of the door body and the periphery of the opening.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a loading chamber of a semiconductor process equipment. Background Art

[0002] In the field of semiconductor technology, depending on process requirements, it is sometimes necessary to place semiconductor process equipment in a sealed loading chamber.

[0003] In the related art, the cavity of the loading chamber is provided with an opening, and a door body is provided at the opening. In the process of sealing the opening with the door body, the door body can first be moved to a position opposite to the opening, and then the door body can be further driven to move toward the opening, so that the sealing ring on the door body abuts against the outer periphery of the opening, thereby using the sealing ring to seal the gap between the door body and the opening.

[0004] In the related art, the door body needs to be provided with at least two sets of driving devices, one set of driving devices is used to drive the door body to move to a position opposite to the opening, and the other set of driving devices is used to drive the door body to move toward the opening. Thus, the loading chamber has a problem of a more complicated door body driving structure. Summary of the invention

[0005] An embodiment of the present application provides a loading chamber of a semiconductor process equipment to solve the problem of how to simplify the driving structure of a door body.

[0006] The loading chamber of the semiconductor process equipment provided in the embodiment of the present application includes: a cavity, a door body and a sealing ring; the cavity is provided with an opening, the door body in the closed position is opposite to the opening, the sealing ring is located in the gap area between the door body and the outer periphery of the opening, the sealing ring includes a top end and a bottom end which are away from each other along its own height direction, the sealing ring has a first sealing cavity inside, the first sealing cavity is arranged along the circumferential direction of the sealing ring, the pressure inside the first sealing cavity is adjustable, and the distance between the top end and the bottom end increases with the increase of the pressure inside the first sealing cavity; the bottom end is arranged at one of the door body and the outer periphery of the opening, and the top end is used to abut against the other of the door body and the outer periphery of the opening.

[0007] Optionally, when the loading chamber of the semiconductor process equipment is in a sealed state, the door body is in the closed position, and the pressure inside the first sealed chamber increases to a first pressure, causing the sealing ring to expand so that the distance between the top end and the bottom end increases to a first distance; during the process of switching the loading chamber of the semiconductor process equipment from the sealed state to the open state, the pressure inside the first sealed chamber decreases to a second pressure, causing the sealing ring to contract so that the distance between the top end and the bottom end decreases from the first distance to the second distance, and the door body moves from the closed position to the open position and is offset from the opening.

[0008] Optionally, the outer side of the sealing ring includes a first side portion and a second side portion facing away from each other, and the first side portion and the second side portion are respectively located between the top end and the bottom end; the first side portion is provided with a plurality of first protruding portions, and the second side portion is provided with a plurality of second protruding portions, and the first protruding portions and the second protruding portions extend in directions facing away from each other, and in the extending direction of the first protruding portion, the top surface of the first protruding portion is inclined in a direction away from the top end, and in the extending direction of the second protruding portion, the top surface of the second protruding portion is inclined in a direction away from the top end.

[0009] Optionally, the top surface of the adjacent first extending portion and the bottom surface of the first extending portion form a first V-shaped surface, and the top surface of the adjacent second extending portion and the bottom surface of the second extending portion form a second V-shaped surface, and the opening direction of the first V-shaped surface and the opening direction of the second V-shaped surface deviate from each other.

[0010] Optionally, the door body is provided with a receiving groove, and the opening of the receiving groove gradually decreases along the direction from the groove bottom toward the groove opening, and the receiving groove is used to clamp the bottom end.

[0011] Optionally, the bottom end has a second sealed cavity, which is arranged along the circumferential direction of the sealing ring, and the first sealed cavity is arranged between the second sealed cavity and the top end; when the bottom end is clamped in the accommodating groove, the pressure in the second sealed cavity can be increased to a third pressure so that the bottom end is expanded and connected in the accommodating groove; the pressure in the second sealed cavity can be reduced from the third pressure to a fourth pressure so that the bottom end can shrink.

[0012] Optionally, the loading chamber of the semiconductor process equipment also includes a guide shaft, which is connected to the chamber, and the extension direction of the guide shaft is parallel to the target plane, wherein the target plane is perpendicular to the thickness direction of the door body, and the door body is slidably connected to the guide shaft, and the door body can slide in a direction parallel to the extension direction of the guide shaft to switch between the closed position and the open position.

[0013] Optionally, the loading chamber of the semiconductor process equipment further comprises a door frame, wherein the door frame is connected to the cavity, the door frame is arranged around the periphery of the opening, the guide shaft is arranged in the door frame, and the door body is located in the area surrounded by the door frame.

[0014] Optionally, the loading chamber of the semiconductor process equipment also includes a door closing buffer, which is arranged on the door frame. The door closing buffer includes a telescopic rod, which is arranged in a direction parallel to the guide axis. The protruding end of the telescopic rod faces the door body, and when the door body is switched to the closed position, the door body abuts against the protruding end and drives the telescopic rod to retract.

[0015] Optionally, the loading chamber of the semiconductor process equipment also includes a door adjustment frame, a plurality of connecting parts and a plurality of threaded top screws. In the thickness direction of the door body, the door adjustment frame is arranged side by side with the door body, and the door adjustment frame is connected to the door body through the connecting parts. The connecting parts are distributed at intervals along the circumference of the door adjustment frame, and the threaded top screws are distributed at intervals along the circumference of the door adjustment frame. The threaded top screws are respectively located between adjacent connecting parts, and the threaded top screws are threadedly connected to the door adjustment frame, and the end of the threaded top screw facing the door body abuts against the door body.

[0016] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects:

[0017] In an embodiment of the present application, a sealing ring can be disposed at the opening of a door body or a cavity, and the distance between the top and the bottom can be increased by increasing the pressure in the first sealed cavity, so that the top of the sealing ring abuts against the opening of the cavity or the door body. Thus, the sealing ring can be used to seal the gap between the door body and the opening of the cavity. In this way, by adopting the solution provided in an embodiment of the present application, the distance between the top and the bottom of the sealing ring can be adjusted according to the pressure in the first sealed cavity, thereby eliminating the driving device used in the related art for driving the door body to move toward the opening, and simplifying the driving structure of the door body. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1A schematic diagram of a loading chamber of a semiconductor process equipment provided by an embodiment of the present application;

[0020] Figure 2 for Figure 1 A partial enlarged schematic diagram of region A of a loading chamber of a semiconductor process equipment shown in FIG.

[0021] Figure 3 A schematic cross-sectional view of a sealing ring provided in an embodiment of the present application;

[0022] Figure 4 A schematic diagram of a sealing ring and a door body provided in an embodiment of the present application, which shows a situation where the top end of the sealing ring is in a retracted state;

[0023] Figure 5 A schematic diagram of a sealing ring and a door body provided in an embodiment of the present application, which shows a situation where the top end of the sealing ring is in an expanded state;

[0024] Figure 6 A schematic diagram of a sealing ring and an air valve provided in an embodiment of the present application, which shows a situation where the top end of the sealing ring is in a contracted state;

[0025] Figure 7 A schematic diagram of a sealing ring and an air valve provided in an embodiment of the present application, which shows a situation where the top end of the sealing ring is in an expanded state;

[0026] Figure 8 for Figure 1 FIG. 1 is a schematic partial enlarged diagram of region B of a loading chamber of a semiconductor process equipment.

[0027] Description of reference numerals:

[0028] 100-loading chamber of semiconductor process equipment; 110-chamber; 120-door body; 121-accommodating groove; 130-sealing ring; 131-top; 132-bottom; 133-first sealed chamber; 134-first side; 1341-first extension; 1342-top surface of the first extension; 1343-bottom surface of the first extension; 135-second side; 1351-second extension; 1352-top surface of the second extension; 1353-bottom surface of the second extension; 136-second sealed chamber; 140-guide shaft; 150-door frame; 160-door closing buffer; 170-door body adjustment frame; 171-connecting piece; 172-threaded top screw; 180-air valve. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0032] Furthermore, it is required that the present application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0033] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0034] The present application embodiment provides a loading chamber of a semiconductor process equipment. Figures 1 to 8 The loading chamber 100 of the semiconductor process equipment provided in the embodiment of the present application may include: a cavity 110 , a door 120 and a sealing ring 130 .

[0035] The cavity 110 is provided with an opening, and the door body 120 in the closed position is opposite to the opening; the sealing ring 130 is located in the gap area between the door body 120 and the outer periphery of the opening.

[0036] The sealing ring 130 includes a top end 131 and a bottom end 132 that are away from each other along its own height direction. The sealing ring 130 has a first sealing cavity 133 therein, and the first sealing cavity 133 is arranged along the circumferential direction of the sealing ring 130. The pressure in the first sealing cavity 133 is adjustable, and the distance between the top end 131 and the bottom end 132 increases as the pressure in the first sealing cavity 133 increases.

[0037] The bottom end 132 is disposed at one of the door body 120 and the outer periphery of the opening, and the top end 131 is used to abut against the other of the door body 120 and the outer periphery of the opening. In other words, in some embodiments, when the door body 120 is in the closed position, the bottom end 132 is disposed at the door body 120, and the top end 131 is used to abut against the outer periphery of the opening. In this way, when the pressure in the first sealing cavity 133 increases and the top end 131 abuts against the outer periphery of the opening, the sealing ring 130 can be used to seal the gap between the door body 120 and the opening. Alternatively, in some embodiments, when the door body 120 is in the closed position, the bottom end 132 is disposed at the outer periphery of the opening, and the top end 131 is used to abut against the door body 120. In this way, when the pressure in the first sealing cavity 133 increases and the top end 131 abuts against the door body 120, the sealing ring 130 can be used to seal the gap between the door body 120 and the opening.

[0038] In this way, in the embodiment of the present application, the sealing ring 130 can be arranged at the opening of the door body or the cavity 110, and the distance between the top end 131 and the bottom end 132 can be increased by increasing the pressure in the first sealing cavity 133, so that the top end 131 of the sealing ring 130 abuts against the opening of the cavity 110 or the door body. Thus, the sealing ring 130 can be used to seal the gap between the door body 120 and the opening of the cavity 110. In this way, by adopting the solution provided in the embodiment of the present application, the distance between the top end 131 and the bottom end 132 of the sealing ring 130 can be adjusted according to the pressure in the first sealing cavity 133, thereby eliminating the driving device used in the related art to drive the door body to move toward the opening, and simplifying the driving structure of the door body.

[0039] In the embodiment of the present application, when the loading chamber 100 of the semiconductor process equipment is in a sealed state, the door body 120 is in a closed position, and the pressure in the first sealed cavity 133 increases to a first pressure, so that the sealing ring 130 expands, so that the distance between the top end 131 and the bottom end 132 increases to a first distance. For example, when the door body 120 is in a closed position and the bottom end 132 is disposed on the door body 120, the pressure in the first sealed cavity 133 increases to the first pressure, and the top end 131 can move in a direction away from the bottom end 132 and abut against the outer periphery of the opening. In this way, the expanded sealing ring 130 can be used to seal the gap between the door body 120 and the opening.

[0040] In the process of switching the loading chamber 100 of the semiconductor process equipment from the sealed state to the open state, the pressure in the first sealed cavity 133 is reduced to the second pressure, so that the sealing ring 130 is contracted, so that the distance between the top end 131 and the bottom end 132 is reduced from the first distance to the second distance, and the door body 120 moves from the closed position to the open position, and is staggered with the opening. For example, when the door body 120 is in the closed position and the bottom end 132 is arranged on the door body 120, the pressure in the first sealed cavity 133 is reduced to the second pressure, and the top end 131 can move in the direction close to the bottom end 132 and separate from the outer periphery of the opening. Therefore, in the process of opening the door body 120, the pressure in the first sealed cavity 133 can be reduced first, so that the top end 131 is separated from the outer periphery of the opening first. Further, the door body 120 can be driven to move from the closed position to the open position, and staggered with the opening.

[0041] refer to Figures 3 to 5 In some embodiments, the outer side of the sealing ring 130 includes a first side portion 134 and a second side portion 135 which are away from each other, and the first side portion 134 and the second side portion 135 are respectively located between the top end 131 and the bottom end 132. In other words, one end of the first side portion 134 is connected to the top end 131, and the other end is connected to the bottom end 132, and one end of the second side portion 135 is connected to the top end 131, and the other end is connected to the bottom end 132. The first side portion 134 is provided with a plurality of first extension portions 1341, and the second side portion 135 is provided with a plurality of second extension portions 1351. The first extension portions 1341 and the second extension portions 1351 extend in directions away from each other.

[0042] In the extension direction of the first extension part 1341, the top surface 1342 of the first extension part 1341 is inclined in the direction away from the top end 131, and in the extension direction of the second extension part 1351, the top surface 1352 of the second extension part 1351 is inclined in the direction away from the top end 131. In this way, the extension parts on both sides of the sealing ring 130 can be made into a tower structure, so that the top end 131 and the bottom end 132 can be brought closer to each other when the pressure in the first sealing cavity 133 is reduced.

[0043] In some embodiments, the top surface 1342 of the adjacent first extension portion 1341 and the bottom surface 1343 of the first extension portion 1341 form a first V-shaped surface, and the top surface 1352 of the adjacent second extension portion 1351 and the bottom surface 1353 of the second extension portion 1351 form a second V-shaped surface. The opening direction of the first V-shaped surface and the opening direction of the second V-shaped surface are opposite to each other. In this way, when the pressure in the first sealed cavity 133 decreases, the top end 131 can better shrink toward the direction close to the bottom end 132.

[0044] In some embodiments, the wall thickness of the top 131 can be set according to the material of the sealing ring 130. For example, when the material of the sealing ring 130 is relatively flexible, the wall thickness of the top 131 can be slightly increased so that the top 131 does not collapse too easily. When the material of the sealing ring 130 is relatively flexible, the wall thickness of the top 131 can be slightly reduced to improve the deformation performance of the top 131. Of course, in other embodiments, the wall thickness of the top 131 can also be flexibly set according to actual needs, which will not be described in detail here.

[0045] In some embodiments, the top 131 includes an arc-shaped top surface. In this way, when the top 131 is in sealing contact with the butt joint of the periphery of the opening, the top 131 and the butt joint of the periphery of the opening can be substantially in line contact, which can improve the sealing effect of the sealing ring 130.

[0046] refer to Figure 4 and Figure 5 In some embodiments, the door body 120 is provided with a receiving groove 121. The opening of the receiving groove 121 gradually decreases along the groove bottom toward the groove opening, and the receiving groove 121 is used to clamp the bottom end 132. Exemplarily, the receiving groove 121 can be set as a dovetail groove, and the bottom end 132 can be clamped in the dovetail groove, so that the sealing ring 130 will not fall out of the receiving groove 121 at will.

[0047] In some embodiments, a receiving cavity is further provided at a portion of the door body 120 located outside the receiving groove 121. When the loading chamber 100 of the semiconductor process equipment is in an open state, the sealing ring 130 can be in a retracted state, and the top 131 of the sealing ring 130 in the retracted state can be accommodated in the receiving cavity. In this way, the problem that the top 131 of the sealing ring 130 is easily damaged due to being exposed to the outside when the loading chamber 100 of the semiconductor process equipment is in an open state can be avoided.

[0048] Of course, it is understandable that when the loading chamber 100 of the semiconductor process equipment is in a sealed state, the top 131 of the sealing ring 130 can protrude from the receiving cavity, so that the top 131 of the sealing ring 130 can abut against the periphery of the opening.

[0049] refer to Figures 3 to 5 In some embodiments, the bottom end 132 of the sealing ring 130 has a second sealing cavity 136. The second sealing cavity 136 is arranged along the circumferential direction of the sealing ring 130, and the first sealing cavity 133 is arranged between the second sealing cavity 136 and the top end 131. When the bottom end 132 is clamped in the receiving groove 121, the pressure in the second sealing cavity 136 increases to the third pressure, so that the bottom end 132 is tightly connected to the receiving groove 121.

[0050] The pressure in the second sealing cavity 136 can be reduced from the third pressure to the fourth pressure, so that the bottom end 132 shrinks, so that when the sealing ring 130 needs to be replaced, it is convenient to withdraw the bottom end 132 from the receiving groove 121. In other words, when the bottom end 132 needs to be withdrawn from the receiving groove 121, the pressure in the second sealing cavity 136 can be reduced from the third pressure to the fourth pressure, so that when the sealing ring 130 needs to be replaced, it is convenient to withdraw the sealing ring 130 to be replaced from the receiving groove 121. Exemplarily, the third pressure can be equal to the first pressure, and the fourth pressure can be equal to the second pressure.

[0051] refer to Figure 1 In some embodiments, the loading chamber 100 of the semiconductor process equipment may further include a guide shaft 140. The guide shaft 140 is connected to the chamber 110, and the extension direction of the guide shaft 140 is parallel to the target plane, wherein the target plane is perpendicular to the thickness direction of the door body. The door body 120 is slidably connected to the guide shaft 140, and the door body 120 can slide in a direction parallel to the extension direction of the guide shaft 140 to switch between a closed position and an open position.

[0052] Exemplarily, the door body 120 extends in the vertical direction, the guide shaft 140 may be arranged horizontally, and the guide shaft 140 may be parallel to a plane perpendicular to the thickness direction of the door body 120, so that the door body 120 may move horizontally under the guidance of the guide shaft 140 and switch between the door closing position and the door opening position. Alternatively, the door body 120 extends in the vertical direction, the guide shaft 140 may be arranged vertically, and the guide shaft 140 may be parallel to a plane perpendicular to the thickness direction of the door body 120, so that the door body 120 may move vertically under the guidance of the guide shaft 140 and switch between the door closing position and the door opening position. Of course, the guide shaft 140 may also be arranged obliquely, and the guide shaft 140 may be parallel to a plane perpendicular to the thickness direction of the door body 120, so that the door body 120 may move obliquely under the guidance of the guide shaft 140 and switch between the door closing position and the door opening position.

[0053] refer to Figure 1 In some embodiments, the loading chamber 100 of the semiconductor process equipment may further include a door frame 150. The door frame 150 is connected to the chamber 110, and is disposed around the outer periphery of the opening. The guide shaft 140 is disposed in the door frame 150, and the door body 120 is located in the area surrounded by the door frame 150. In this way, it is convenient to adjust the position of the door body 120 by adjusting the position of the door frame 150, so that when the door body 120 is in the closed position, the door body 120 can better block the opening.

[0054] In some embodiments, the loading chamber 100 of the semiconductor process equipment may further include a door driving device which may be drivingly connected to the door 120 to drive the door 120 to reciprocate along the extending direction of the guide shaft 140, thereby realizing automatic door opening and closing.

[0055] The door driving device may be a device capable of outputting a linear driving force, such as a linear motor, an air cylinder or a hydraulic cylinder. Alternatively, the door driving device may include: a device capable of outputting a rotary driving force, such as a rotary motor, an air motor or a hydraulic motor, and a transmission mechanism capable of converting a rotary motion into a linear motion, such as a lead screw thread transmission mechanism or a gear rack mechanism. Exemplarily, in one embodiment, the door driving device is mainly composed of an air cylinder with a limit detection device.

[0056] In some embodiments, the loading chamber 100 of the semiconductor process equipment may further include a door closing buffer 160. The door closing buffer 160 may be disposed on the door frame 150. The door closing buffer 160 may include a telescopic rod, which is disposed in a direction parallel to the guide shaft 140, and the extended end of the telescopic rod faces the door body 120. When the door body 120 is switched to the door closing position, the door body 120 abuts against the extended end and drives the telescopic rod to retract. In this way, the door closing buffer 160 can be used to prevent the door body 120 from colliding with the door frame 150 during the process of closing the door body 120.

[0057] refer to Figure 1 and Figure 8 In some embodiments, the loading chamber 100 of the semiconductor process equipment may further include a door adjustment frame 170, a plurality of connectors 171, and a plurality of threaded top screws 172. The door adjustment frame 170 is arranged side by side with the door 120 in the thickness direction of the door 120. The door adjustment frame 170 is connected to the door 120 through the connectors 171, and the connectors 171 are distributed at intervals along the circumference of the door adjustment frame 170. The threaded top screws 172 are distributed at intervals along the circumference of the door adjustment frame 170, and the threaded top screws 172 are respectively located between adjacent connectors 171. The threaded top screws 172 are threadedly connected to the door adjustment frame 170, and the ends of the threaded top screws 172 facing the door 120 abut against the door 120.

[0058] For example, if an area of ​​the door body 120 is concave relative to the door body adjustment frame 170, the threaded top screw 172 of the concave portion can be screwed in to move the concave portion of the door body 120 away from the door body adjustment frame 170 until the concave portion of the door body 120 is adjusted to a straight state.

[0059] refer to Figure 6 and Figure 7In some embodiments, the loading chamber 100 of the semiconductor process equipment may further include a gas valve 180 . The gas valve 180 may be connected to the gas supply port and the gas exhaust port, and the gas valve 180 may also be connected to the first sealed cavity 133 and the second sealed cavity 136 .

[0060] refer to Figure 6 When the air valve 180 is in the first state, the air valve 180 can connect the first sealed cavity 133 with the exhaust port, thereby connecting the second sealed cavity 136 with the air supply port. In this way, the top end 131 of the sealing ring 130 can be contracted to release the sealing state; the bottom end 132 of the sealing ring 130 can be expanded, so that the sealing ring 130 will not automatically withdraw from the receiving groove 121 of the door body 120.

[0061] refer to Figure 7 When the air valve 180 is in the second state, the air valve 180 can connect the first sealed cavity 133 and the second sealed cavity 136 to the air supply port. In this way, the top end 131 of the sealing ring 130 can be expanded to switch to the sealing state; the bottom end 132 of the sealing ring 130 can be expanded, so that the sealing ring 130 will not automatically withdraw from the receiving groove 121 of the door body 120.

[0062] In addition, the air valve 180 can also be switched to a third state. When the air valve 180 is in the third state, the air valve 180 can connect the first sealing cavity 133 and the second sealing cavity 136 to the exhaust port. In this way, the top end 131 of the sealing ring 130 can be contracted, and the bottom end 132 of the sealing ring 130 can be contracted, so that it is easy to replace the sealing ring 130 that needs to be replaced.

[0063] Exemplarily, in some embodiments, the air valve 180 can be a three-position four-way electromagnetic reversing valve. When sealing is required, the air valve 180 can be switched to the second state. When the seal needs to be released, the air valve 180 can be switched to the first state. When the sealing ring 130 needs to be replaced, the air valve 180 can be switched to the third state. The air supply port can be connected to a high-pressure air source, the exhaust port can be connected to the atmosphere, or the exhaust port can be connected to a negative pressure source. Of course, in other embodiments, for example, the pressure of the first sealed cavity 133 and the second sealed cavity 136 can also be adjusted by supplying pressure liquid to the first sealed cavity 133 and the second sealed cavity 136.

[0064] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0065] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A loading chamber of a semiconductor process equipment, characterized in that: include: A cavity (110), a door (120) and a sealing ring (130); The cavity (110) is provided with an opening, the door body (120) in the closed position is opposite to the opening, and the sealing ring (130) is located in a gap area between the door body (120) and the outer periphery of the opening. The sealing ring (130) comprises a top end (131) and a bottom end (132) which are away from each other along its own height direction, and a first sealing cavity (133) is provided inside the sealing ring (130). The first sealing cavity (133) is arranged along the circumferential direction of the sealing ring (130), and the pressure inside the first sealing cavity (133) is adjustable, and the distance between the top end (131) and the bottom end (132) increases as the pressure inside the first sealing cavity (133) increases; The bottom end (132) is disposed on one of the door body (120) and the outer periphery of the opening, and the top end (131) is used to abut against the other of the door body (120) and the outer periphery of the opening.

2. The loading chamber of the semiconductor process equipment according to claim 1, characterized in that: When the loading chamber of the semiconductor process equipment is in a sealed state, the door body (120) is in the closed position, and the pressure in the first sealed cavity (133) increases to a first pressure, so that the sealing ring (130) expands, so that the distance between the top end (131) and the bottom end (132) increases to a first distance; During the process of switching the loading chamber of the semiconductor process equipment from the sealed state to the open state, the pressure inside the first sealed cavity (133) is reduced to a second pressure, causing the sealing ring (130) to shrink, so that the distance between the top end (131) and the bottom end (132) is reduced from the first distance to the second distance, and the door body (120) moves from the closed position to the open position and is offset from the opening.

3. The loading chamber of the semiconductor process equipment according to claim 1, characterized in that: The outer side of the sealing ring (130) comprises a first side portion (134) and a second side portion (135) which are separated from each other. ， The first side portion (134) and the second side portion (135) are respectively located between the top end (131) and the bottom end (132); The first side portion (134) is provided with a plurality of first extending portions (1341), and the second side portion (135) is provided with a plurality of second extending portions (1351), wherein the first extending portions (1341) and the second extending portions (1351) extend in directions away from each other. In the extending direction of the first extending portion (1341), the top surface (1342) of the first extending portion (1341) is inclined in a direction away from the top end (131), and in the extending direction of the second extending portion (1351), the top surface (1352) of the second extending portion (1351) is inclined in a direction away from the top end (131).

4. The loading chamber of the semiconductor process equipment according to claim 3, characterized in that: The top surface (1342) of the adjacent first protruding portion (1341) and the bottom surface (1343) of the first protruding portion (1341) form a first V-shaped surface, and the top surface (1352) of the adjacent second protruding portion (1351) and the bottom surface (1353) of the second protruding portion (1351) form a second V-shaped surface, and the opening direction of the first V-shaped surface and the opening direction of the second V-shaped surface deviate from each other.

5. The loading chamber of the semiconductor process equipment according to claim 1, characterized in that: The door body (120) is provided with a receiving groove (121), and the opening of the receiving groove (121) gradually decreases along the groove bottom toward the groove opening of the receiving groove (121), and the receiving groove (121) is used to clamp the bottom end (132).

6. The loading chamber of the semiconductor process equipment according to claim 5, characterized in that: The bottom end (132) has a second sealing cavity (136) therein, the second sealing cavity (136) is arranged along the circumferential direction of the sealing ring (130), and the first sealing cavity (133) is arranged between the second sealing cavity (136) and the top end (131); When the bottom end (132) is clamped in the receiving groove (121), the pressure in the second sealed cavity (136) can be increased to a third pressure, so that the bottom end (132) is tightly connected to the receiving groove (121); The pressure in the second sealed cavity (136) can be reduced from the third pressure to a fourth pressure to shrink the bottom end (132).

7. The loading chamber of the semiconductor process equipment according to claim 1, characterized in that: The loading chamber of the semiconductor process equipment also includes a guide shaft (140), which is connected to the cavity (110), and the extension direction of the guide shaft (140) is parallel to the target plane, wherein the target plane is perpendicular to the thickness direction of the door body, and the door body (120) is slidably connected to the guide shaft (140), and the door body (120) can slide in a direction parallel to the extension direction of the guide shaft (140) to switch between the closed position and the open position.

8. The loading chamber of the semiconductor process equipment according to claim 7, characterized in that: The loading chamber of the semiconductor process equipment also includes a door frame (150), which is connected to the cavity (110), and the door frame (150) is arranged around the outer periphery of the opening. The guide shaft (140) is arranged in the door frame (150), and the door body (120) is located in the area surrounded by the door frame (150).

9. The loading chamber of the semiconductor process equipment according to claim 8, characterized in that: The loading chamber of the semiconductor process equipment also includes a door closing buffer (160), which is arranged on the door frame (150). The door closing buffer (160) includes a telescopic rod, which is arranged in a direction parallel to the guide axis (140). The extended end of the telescopic rod faces the door body (120). When the door body (120) is switched to the closed position, the door body (120) abuts against the extended end and drives the telescopic rod to retract.

10. The loading chamber of the semiconductor process equipment according to claim 1, characterized in that: The loading chamber of the semiconductor process equipment further comprises a door adjustment frame (170), a plurality of connecting pieces (171) and a plurality of threaded top screws (172); in the thickness direction of the door (120), the door adjustment frame (170) and the door (120) are arranged side by side; the door adjustment frame (170) is connected to the door (120) via the connecting piece (171); the connecting piece (171) is distributed at intervals along the circumference of the door adjustment frame (170); The threaded top screws (172) are distributed at intervals along the circumference of the door body adjustment frame (170), and the threaded top screws (172) are respectively located between adjacent connecting parts (171). The threaded top screws (172) are threadedly connected to the door body adjustment frame (170), and the end of the threaded top screw (172) facing the door body (120) abuts against the door body (120).

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