Double ring connector, power unit and charging pile

Abstract

The present invention relates to the technical field of charging piles, and provides a dual-ring plug-in component, a power unit and a charging pile, wherein the dual-ring plug-in component comprises an insulating substrate, a bus assembly and a plug-in layer arranged on the insulating substrate, wherein the bus assembly is formed by stacking the first to N bus layers, and each bus layer is provided with concentric AC bus rings and DC bus rings; the plug-in layer is arranged above the bus assembly, the plug-in layer is an insulating layer, and a plurality of through holes are provided on the plug-in layer, so that the AC column and the DC column pass through the through holes and connect with the power module. The present invention combines the DC bus ring and the AC bus ring in the bus assembly, so that the power module only needs to be directly plugged with the DC column and the AC column extending from the plug-in layer, so that the power module can be quickly installed, thereby improving the wiring efficiency and reducing the error rate; multiple power modules will be radially distributed to the outer ring of the dual-ring plug-in component with the center of the bus ring as the center, which can improve the heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of charging piles, and in particular to a double-ring connector, a power unit and a charging pile. Background Art

[0002] At present, the AC input and DC output lines of the power modules of electric vehicle charging piles are mostly connected by wires and cables, with up to hundreds of wires in one device. Wiring is very time-consuming and prone to wiring errors. At the same time, the wiring process is demanding. If any line is broken or missed, it will take a lot of time to troubleshoot. Moreover, most power modules are distributed in a matrix, and the heat dissipation effect is poor. Summary of the invention

[0003] In order to solve the above-mentioned technical problems, the present invention provides a dual-ring connector, a power unit and a charging pile, which can realize the rapid installation of the power module, improve the wiring efficiency and reduce the error rate; multiple power modules will be radially distributed toward the outer ring of the dual-ring connector with the center of the bus ring as the center, which can improve the heat dissipation efficiency.

[0004] The technical solution adopted by the present invention is as follows:

[0005] A double-ring connector comprises: an insulating substrate, a bus assembly and a plug-in layer, wherein the bus assembly is formed by stacking first to N bus layers, the bus assembly is arranged on the insulating substrate, each bus layer is provided with concentric AC bus rings and DC bus rings, one side of each AC bus ring is electrically connected to M AC columns distributed along the circumference, the other side of each AC bus ring is electrically connected to the AC wire, one side of each DC bus ring is electrically connected to M DC columns distributed along the circumference, the other side of each DC bus ring is electrically connected to the DC wire, and the outer surface of each AC bus ring and each DC bus ring is covered with insulating material, wherein N and M are integers greater than or equal to 2; the plug-in layer is arranged above the bus assembly, the plug-in layer is an insulating layer, and a plurality of through holes are opened on the plug-in layer so that the AC column and the DC column pass through the through holes to connect with a power module.

[0006] In addition, the double-ring connector proposed above according to the present invention may also have the following additional technical features:

[0007] According to an embodiment of the present invention, the insulating substrate is provided with a fan-shaped ventilation area along its circumference.

[0008] According to an embodiment of the present invention, the AC columns and the DC columns on each bus layer are aligned along the diameter of the AC bus ring.

[0009] According to an embodiment of the present invention, a plurality of insulating plates are connected between the AC bus ring and the DC bus ring, one end of the insulating plate faces the AC column, and the other end of the insulating plate faces the DC column.

[0010] According to one embodiment of the present invention, the AC bus rings in each bus layer have the same size, and the AC bus ring in the i+1th bus layer is provided with i*M AC insulating through holes, so that the AC columns extending from the AC bus rings of the first to i bus layers can pass through the AC bus rings of the i+1th bus layer, wherein i is an integer greater than or equal to 1 and less than or equal to N-1.

[0011] According to one embodiment of the present invention, the outer diameter of the AC bus ring is smaller than the inner diameter of the DC bus ring, and a plurality of first conductor channels are provided in the insulating substrate and the bus assembly so that the plurality of AC conductors are respectively connected to the AC bus rings in the multi-layer bus layer through the insulating substrate; and a second conductor channel is provided on one side of each bus layer so that the DC conductor is connected to the DC bus ring in the bus layer.

[0012] According to one embodiment of the present invention, the bus assembly is formed by stacking first to fourth bus layers, the AC bus rings of the first to fourth bus layers are respectively A-phase bus ring, B-phase bus ring, C-phase bus ring and N-phase bus ring, and the DC bus rings of the first to fourth bus layers are respectively DC positive bus ring, DC negative bus ring, first communication bus ring and second communication bus ring.

[0013] In addition, to achieve the above objective, the present invention also provides a power unit.

[0014] A power unit comprises the double-ring connector as described above.

[0015] In addition, the power unit proposed above according to the present invention may also have the following additional technical features:

[0016] According to one embodiment of the present invention, the power unit also includes a liquid cooling plate, which is circumferentially installed on the plug-in layer of the double-ring connector. When the power module is connected to the AC column and the DC column, the liquid cooling plate is located on both sides of the power module.

[0017] In addition, to achieve the above-mentioned purpose, the present invention also proposes a charging pile.

[0018] A charging pile comprises the power unit as described above.

[0019] Beneficial effects of the present invention:

[0020] The dual-ring connector of the embodiment of the present invention combines a DC bus ring and an AC bus ring in a bus assembly, so that the power module only needs to be directly plugged into the DC column and the AC column extending from the plug-in layer, thereby realizing rapid installation of the power module, improving wiring efficiency and reducing error rate; since the DC bus ring and the AC bus ring are concentric rings, multiple power modules will be radially distributed toward the outer ring of the dual-ring connector with the center of the bus ring as the center, which can avoid matrix distribution of the power modules and improve heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a cross-sectional view of a double-ring connector according to an embodiment of the present invention;

[0022] Figure 2 A top view of a double-ring connector according to an embodiment of the present invention;

[0023] Figure 3 A partial enlarged view of an AC bus ring according to an embodiment of the present invention;

[0024] Figure 4 is a cross-sectional view of an insulating substrate according to an embodiment of the present invention;

[0025] Figure 5 is a cross-sectional view of a first busbar layer according to an embodiment of the present invention;

[0026] Figure 6 is a cross-sectional view of a second bus layer according to an embodiment of the present invention;

[0027] Figure 7 is a cross-sectional view of a third bus layer according to an embodiment of the present invention;

[0028] Figure 8 is a cross-sectional view of a fourth bus layer according to an embodiment of the present invention;

[0029] Fig. 9 is a cross-sectional view of an intercalation layer according to an embodiment of the present invention;

[0030] Fig.10 The figure is a schematic diagram of the structure of a power unit according to an embodiment of the present invention.

[0031] Reference numerals;

[0032] 10. Insulating substrate, 20. Bus assembly, 201. First bus layer, 202. Second bus layer, 203. Third bus layer, 204. Fourth bus layer, 21. AC bus ring, 211. AC column, 212. AC insulating through hole, 22. DC bus ring, 221. DC column, 222. DC insulating through hole, 30. Plug-in layer, 40. Insulating plate, 50. Liquid cooling plate, 51. Liquid cooling tube. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] like Figure 1 and 2 As shown, the double-ring connector of the embodiment of the present invention comprises: an insulating substrate 10, a bus assembly 20 and a plug-in layer 30, wherein the bus assembly 20 is formed by stacking the first to N bus layers, the bus assembly 20 is arranged on the insulating substrate 10, and each bus layer is provided with concentric AC bus rings 21 and DC bus rings 22, one side of each AC bus ring 21 is electrically connected to M AC columns 211 distributed along the circumference, and the other side of each AC bus ring 21 is electrically connected to the AC conductor A, and each DC One side of the bus ring 22 is electrically connected to M DC columns 221 distributed along the circumference, and the other side of each DC bus ring 22 is electrically connected to the DC conductor B. The outer surfaces of each AC bus ring 21 and each DC bus ring 22 are covered with insulating materials, wherein N and M are integers greater than or equal to 2; the plug-in layer 30 is arranged above the bus assembly 20, and the plug-in layer 30 is an insulating layer. A plurality of through holes are provided on the plug-in layer 30, so that the AC column 211 and the DC column 221 pass through the through holes to connect with the power module. Among them, the AC bus ring 21 can be an inner ring, and the corresponding DC bus ring 22 is an outer ring (such as Figure 1 As shown); the AC bus ring 21 can also be an outer ring, and the corresponding DC bus ring 22 is an inner ring, which can be adjusted according to the position of the power module interface, and this embodiment is not limited.

[0035] It can be understood that since the dual-ring connector of the embodiment of the present invention combines the AC bus ring 21 and the DC bus ring 22 in the bus assembly 20, the power module only needs to be directly plugged into the AC column 211 and the DC column 221 extending from the plug-in layer 30, so that the power module can be quickly installed, which solves the tediousness and error rate of dozens or hundreds of wiring connections, improves wiring efficiency and reduces error rate; since the AC bus ring 21 and the DC bus ring 22 are concentric rings, multiple power modules will be radially distributed toward the outer ring (AC bus ring 21 or DC bus ring 22) of the dual-ring connector with the center of the circle as the center, which can avoid the poor heat dissipation effect caused by the matrix distribution of the power modules.

[0036] In one embodiment of the present invention, the insulating substrate 10 may be provided with a fan-shaped ventilation area along the circumference, so that the heat inside the double-ring connector can be quickly discharged through the fan-shaped ventilation area, thereby enhancing the heat dissipation capacity. In some embodiments of the present invention, a fan may also be provided outside the insulating substrate 10 to further improve the heat dissipation efficiency.

[0037] like Figure 1 As shown, in one embodiment of the present invention, the AC columns 211 and the DC columns 221 on each bus layer can be aligned along the diameter of the AC bus ring 21 to facilitate the rapid plugging of the power module. In some other embodiments of the present invention, the AC columns 211 and the DC columns 221 can be staggered along the diameter of the AC bus ring 21 to avoid the power module being plugged in reverse, etc., and this embodiment is not limited thereto.

[0038] like Figure 2 As shown, in one embodiment of the present invention, the AC columns 211 can be evenly distributed along the circumference, and the DC columns 221 can be evenly distributed along the circumference. Since the AC columns 211 and the DC columns 221 are both circularly symmetrical structures, the similarity of electrical performance impedance can be ensured, and the relative consistency of heat dissipation can also be ensured.

[0039] like Figure 2 As shown, in one embodiment of the present invention, a plurality of insulating plates 40 may be connected between the AC bus ring 21 and the DC bus ring 22, with one end of the insulating plate 40 facing the AC column 211 and the other end of the insulating plate 40 facing the DC column 221. By providing the insulating plate 40 between the AC bus ring 21 and the DC bus ring 22, the stability of the internal structure of the double-ring connector can be improved, and the deformation of the AC bus ring 21 or the DC bus ring 22 caused by uneven force during the plugging process can be avoided, thereby affecting the stability of the device.

[0040] like Figure 3 As shown, in one embodiment of the present invention, the size of the AC bus ring 21 in each bus layer can be the same, which is convenient for mass production, wherein the AC bus ring 21 in the i+1th bus layer is provided with i*M AC insulating through holes 212, so that the AC columns 211 extending from the AC bus rings 21 of the first to i bus layers pass through the AC bus ring 21 of the i+1th bus layer, wherein i is an integer greater than or equal to 1 and less than or equal to N-1. The DC bus ring 22 of the present invention can also adopt a similar design to provide a DC insulating through hole 222 (such as Figure 1 shown), which will not be described here in detail.

[0041] In some other embodiments of the present invention, the difference between the inner diameter and the outer diameter of the AC bus ring 21 in the bus assembly 20 can also be reduced from bottom to top, and the thickness of the AC bus ring 21 can be increased from bottom to top, so that when the cross-sectional area is the same, the AC column 211 on each AC bus ring 21 can be directly extended from the plug-in layer 30 without drilling holes in the AC bus ring 21. The DC bus ring 22 in the bus assembly 20 can also adopt a similar design, which will not be repeated here.

[0042] like Figure 1 As shown, in one embodiment of the present invention, the outer diameter of the AC bus ring 21 may be smaller than the inner diameter of the DC bus ring 22. In this case, the AC bus ring 21 is the inner ring, and the DC bus ring 22 is the outer ring. Multiple first conductor channels may be provided in the insulating substrate 10 and the bus assembly 20, so that multiple AC conductors A are respectively connected to the AC bus rings 21 in the multi-layer bus layer through the insulating substrate 10; a second conductor channel may be provided on one side of each bus layer, so that the DC conductor B is connected to the DC bus ring 22 in the bus layer. It can be understood that Figure 1 Only one way of setting the first wire channel and the second wire channel is shown. In some other embodiments of the present invention, the layout of the first wire channel and the second wire channel can also be adjusted according to actual production requirements. For example, the second wire channel can also pass through the insulating layer, etc. This embodiment is not limited.

[0043] like Figure 3 As shown, in one embodiment of the present invention, the bus assembly 20 can be formed by stacking the first to fourth bus layers, the AC bus rings 21 of the first to fourth bus layers are respectively A-phase bus ring, B-phase bus ring, C-phase bus ring and N-phase bus ring, and the DC bus rings 22 of the first to fourth bus layers are respectively DC positive bus ring, DC negative bus ring, first communication bus ring and second communication bus ring.

[0044] like Figures 3~9As shown, in a specific embodiment of the present invention, the bus assembly 20 can be stacked by a first bus layer 201, a second bus layer 202, a third bus layer 203 and a fourth bus layer 204. The AC wires A passing through the insulating substrate 10 from the first wire channel and connected to the AC bus ring 21 are respectively A-phase wire A1, B-phase wire A2, C-phase wire A3 and N-phase wire A4, and the DC wires B entering the second wire channel and connected to the DC bus ring 22 are respectively DC positive wire B1, DC negative wire B2, first communication wire B3 and second communication wire B4. Among them, the first communication wire B3 and the second communication wire B4 are used for communication between the power module and the external control module (such as the MCU board), so as to realize the start, stop, power output adjustment, parameter setting, etc. of the power module. Specifically, the first communication bus ring and the second communication bus ring can transmit information through backflow.

[0045] The sizes of the AC bus rings 21 on the first bus layer 201, the second bus layer 202, the third bus layer 203 and the fourth bus layer 204 are all consistent, and the sizes of the DC bus rings 22 are all consistent. Since the first bus layer 201 is the lowest layer in the bus assembly 20, there is no need to provide AC insulation through holes 212 on the AC bus rings 21 and the DC bus rings 22 on the first bus layer 201. In order to allow the AC columns 211 extending from the AC bus rings 21 of the lower bus layer and the DC columns 221 extending from the DC bus rings 22 to pass through the plug-in layer 30, the AC bus rings 21 of the second bus layer 202 are provided with the same number of AC insulation through holes 212 as the AC columns 211 of the first bus layer 201, and the DC bus rings 22 are also provided with the same number of DC insulation through holes 222 as the DC columns 221 of the first bus layer 201.

[0046] In this embodiment, the number of AC columns 211 and DC columns 221 on the first bus layer 201 are both 8, from which it can be inferred that the number of AC insulating through holes 212 opened on the AC bus ring 21 on the second bus layer 202 is 8, and the number of DC insulating through holes 222 opened on the DC bus ring 22 is 8; the number of AC insulating through holes 212 opened on the AC bus ring 21 on the third bus layer 203 is 16, and the number of DC insulating through holes 222 opened on the DC bus ring 22 is 16; the number of AC insulating through holes 212 opened on the AC bus ring 21 on the fourth bus layer 204 is 24, and the number of DC insulating through holes 222 opened on the DC bus ring 22 is 24, so that 8 groups of 32 AC columns 211 and 32 DC columns 221 extend from the plug-in layer 30, and up to 8 power modules can be plugged in at the same time.

[0047] According to the dual-ring connector of the embodiment of the present invention, by combining the DC bus ring and the AC bus ring in the bus assembly, the power module only needs to be directly plugged into the DC column and the AC column extending from the plug-in layer, so that the power module can be quickly installed, thereby improving the wiring efficiency and reducing the error rate; because the DC bus ring and the AC bus ring are concentric rings, multiple power modules will be radially distributed toward the outer ring of the dual-ring connector with the center of the bus ring as the center, which can avoid the matrix distribution of the power modules and improve the heat dissipation efficiency.

[0048] In addition, to achieve the above objective, the present invention also provides a power unit.

[0049] The power unit according to the embodiment of the present invention includes the double-ring connector as described above.

[0050] like Fig.10 As shown, in one embodiment of the present invention, the power unit may further include a liquid cooling plate 50, which is circumferentially mounted on the plug-in layer of the double-ring plug-in component. When the power module is connected to the AC column 211 and the DC column 221, the liquid cooling plate 50 is located on both sides of the power module, so that the liquid cooling plate 50 dissipates heat for the power module. The liquid cooling plate 50 itself can also provide positioning and support for the power module, which facilitates the installation of the power module and ensures stable operation of the equipment.

[0051] Specifically, Fig.10 As shown, a liquid cooling tube 51 may be provided on the liquid cooling plate 50, and the liquid cooling tube 51 may be distributed in a fence shape to increase the coverage area of ​​the liquid cooling tube 51 on the liquid cooling plate 50 and enhance the heat dissipation effect. A liquid cooling pump may be installed on one side of the power unit, and the liquid cooling pump may be connected to the inlet and outlet of the liquid cooling tube 51, so that the condensed liquid can be quickly cooled through the liquid cooling tube 51 and the liquid cooling pump.

[0052] In one embodiment of the present invention, the power unit may further include an MCU board, on which a device for insulation detection may be installed, and each AC bus ring and DC bus ring of the double-ring connector may lead out an AC conductor and a DC conductor to be connected to the MCU board, so that the MCU board can detect whether the insulation of each bus ring is within the standard range when the bus ring is not energized. The communication line in the DC conductor of the double-ring connector may be connected to the MCU board to realize the control of the power module by the MCU board.

[0053] The power unit of the embodiment of the present invention also has the above-mentioned beneficial effects because it includes the double-ring connector as described above.

[0054] In addition, to achieve the above-mentioned purpose, the present invention also proposes a charging pile.

[0055] The charging pile of the embodiment of the present invention includes the power unit as described above. The DC conductor of the power unit can be connected to the DC output line of the charging pile through the DC relay inside the charging pile, and the AC conductor of the power unit can be connected to the AC input line of the charging pile through the AC switch device inside the charging pile, so that the charging pile can control the DC output of the power unit by controlling the opening and closing of the DC relay, and control the AC input of the power unit by controlling the opening and closing of the AC switch device.

[0056] The charging pile according to the embodiment of the present invention also has the above-mentioned beneficial effects because it includes the power unit described above.

[0057] In the description of the present invention, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0058] In the present invention, unless otherwise clearly specified and limited, terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements.

[0059] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

Claims

1. A double-ring connector, characterized in that: include: Insulating substrate (10); A bus assembly (20) formed by stacking first to N bus layers, the bus assembly (20) being arranged on an insulating substrate (10), each bus layer being provided with concentric AC bus rings (21) and DC bus rings (22), one side of each AC bus ring (21) being electrically connected to M AC columns (211) distributed along a circumference, the other side of each AC bus ring (21) being electrically connected to an AC conductor, one side of each DC bus ring (22) being electrically connected to M DC columns (221) distributed along a circumference, the other side of each DC bus ring (22) being electrically connected to a DC conductor, and the outer surfaces of each AC bus ring (21) and each DC bus ring (22) being covered with insulating material, wherein N and M are integers greater than or equal to 2; A plug-in layer (30), the plug-in layer (30) being arranged above the busbar assembly (20), the plug-in layer (30) being an insulating layer, and a plurality of through holes being provided on the plug-in layer (30) so that the AC column (211) and the DC column (221) can pass through the through holes to be connected to a power module.

2. The double-ring connector according to claim 1, characterized in that: The insulating substrate (10) is provided with a fan-shaped ventilation area along its circumference.

3. The double-ring connector according to claim 1, characterized in that: The AC columns (211) and the DC columns (221) on each bus layer are aligned along the diameter of the AC bus ring (21).

4. The double-ring connector according to claim 3, characterized in that: A plurality of insulating plates (40) are connected between the AC bus ring (21) and the DC bus ring (22), one end of the insulating plate (40) faces the AC column (211), and the other end of the insulating plate (40) faces the DC column (221).

5. The double-ring connector according to claim 1, characterized in that: The AC bus rings (21) in each bus layer have the same size, and the AC bus ring (21) in the (i+1)th bus layer is provided with i*M AC insulating through holes (212) so that the AC columns (211) extending from the AC bus rings (21) of the first to i bus layers pass through the AC bus rings (21) of the (i+1)th bus layer, wherein i is an integer greater than or equal to 1 and less than or equal to N-1.

6. The double-ring connector according to claim 1, characterized in that: The outer diameter of the AC bus ring (21) is smaller than the inner diameter of the DC bus ring (22); a plurality of first conductor channels are provided in the insulating substrate (10) and the bus assembly (20), so that the plurality of AC conductors are respectively connected to the AC bus rings (21) in the multiple bus layers through the insulating substrate (10); and a second conductor channel is provided on one side of each bus layer, so that the DC conductor is connected to the DC bus ring (22) in the bus layer.

7. The double-ring connector according to claim 1, characterized in that: The bus assembly (20) is formed by stacking first to fourth bus layers, wherein the AC bus rings (21) of the first to fourth bus layers are respectively an A-phase bus ring, a B-phase bus ring, a C-phase bus ring and an N-phase bus ring, and the DC bus rings of the first to fourth bus layers are respectively a DC positive bus ring, a DC negative bus ring, a first communication bus ring and a second communication bus ring.

8. A power unit, characterized in that: It comprises a double-ring connector according to any one of claims 1 to 7.

9. The power unit according to claim 8, characterized in that: Also includes: A liquid cooling plate (50), the liquid cooling plate (50) being mounted on the plug-in layer of the double-ring plug-in component along a circumference, and when the power module is connected to the AC column (211) and the DC column (221), the liquid cooling plate (50) is located on both sides of the power module.

10. A charging pile, characterized in that: Comprising a power unit according to claim 8 or 9.

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