Wireless charging device

Abstract

The invention relates to the technical field of wireless charging, and provides a wireless charging device which comprises a shell and a heat dissipation structure, and the shell is provided with a charging position. The heat dissipation structure is arranged on the shell and provided with an airflow channel allowing airflow to flow, one end of the airflow channel is communicated to the charging position so that the airflow in the airflow channel can flow to the charging position, and the electronic equipment on the charging position is located on the flowing path of the airflow. The heat dissipation structure further comprises a refrigeration assembly and a first air supply piece, the first air supply piece can drive airflow to flow towards the charging position in the airflow channel, and the refrigeration assembly is located in the airflow channel and can reduce the temperature of the flowing airflow in the airflow channel. The heat dissipation structure arranged on the wireless charging device breaks through a traditional mode of conducting heat through attachment for heat dissipation, cold air flow processed by the refrigeration assembly is used for conducting heat dissipation on a mobile phone in charging, the heat dissipation effect can be obviously improved, and the problems of high-temperature charging interruption and low high-temperature charging efficiency in the charging process of the mobile phone are not prone to occurring.

Description

Technical Field

[0001] The present application relates to the technical field of wireless charging, and in particular to a wireless charging device. Background Art

[0002] In recent years, wireless charging technology has gradually developed. Wireless charging technology mainly uses electromagnetic induction to form an electron flow on the charging coil, which can charge electrical devices. At present, wireless charging technology can be applied to mobile devices such as smartphones. As users' demand for charging speed and the number of devices charged at a single time increases, the charging power will also increase exponentially. With the increase of wireless charging power, in addition to the increase in heat generated by the wireless charging module itself, the heat generated by mobile devices such as terminal phones will also increase dramatically.

[0003] The related technology provides a heat dissipation structure for wireless charging equipment to dissipate heat for mobile devices during charging. However, the heat dissipation effect of the heat dissipation structure in the related technology is poor, which will cause the mobile device to charge under high temperature conditions, which can easily cause high temperature charging interruption and low charging efficiency. Summary of the invention

[0004] The present application provides a wireless charging device, which can prevent a mobile phone from being disconnected from charging due to high temperature and having low charging efficiency due to high temperature during charging.

[0005] The present application provides a wireless charging device, comprising:

[0006] A housing, wherein a charging position is provided on the housing, and an electronic device can be placed in the charging position for charging; and

[0007] a heat dissipation structure, the heat dissipation structure being arranged on the housing, the heat dissipation structure having an airflow channel for airflow, one end of the airflow channel being connected to the charging position so that the airflow in the airflow channel can flow to the charging position, and the electronic device on the charging position is located on the flow path of the airflow;

[0008] The heat dissipation structure also includes a refrigeration component and a first air supply component. The first air supply component can drive the airflow in the airflow channel toward the charging position. The refrigeration component is located in the airflow channel and can reduce the temperature of the airflow flowing in the airflow channel.

[0009] According to the wireless charging device described in the first aspect of the present application, by setting an airflow channel, an airflow path can be limited, and the airflow in the airflow channel can flow along the path to the charging position. When the airflow needs to flow to the charging position, the first air supply member can create an environment with different pressure differences between the front and the back in the airflow channel, thereby driving the airflow to flow along the airflow channel to the charging position. The present application also provides a refrigeration component, and at least the refrigeration part of the refrigeration component is located in the airflow channel, which can refrigerate the airflow in the channel. The refrigerated airflow can then be delivered to the charging position via the first air supply member to charge the mobile phone charging at the charging position. Therefore, the heat dissipation structure provided in the wireless charging device of the present application breaks the traditional heat dissipation method of using bonding conduction heat, and uses the cold airflow whose temperature is lower than the ambient temperature after being processed by the refrigeration component to dissipate the heat of the charging mobile phone. The heat dissipation effect can be significantly improved, so that the mobile phone is not prone to high-temperature disconnection and low high-temperature charging efficiency during the charging process. Moreover, since the heat dissipation structure in the present application utilizes cold air to dissipate heat, when it is applied to a charging device utilizing magnetic wireless charging, it will not reduce the contact area as in the related art where the coil arrangement position of the magnetic component needs to be considered. Of course, there will be no situation in which the heat dissipation effect is reduced due to the reduction in contact area. Therefore, the heat dissipation structure of the present application can be adapted to both magnetic wireless charging and non-magnetic wireless charging.

[0010] In a possible implementation, the heat dissipation structure includes a first accommodating portion, a first accommodating cavity is provided in the first accommodating portion, and at least part of the structure of the refrigeration component and the first air supply member is located in the first accommodating cavity.

[0011] In a possible implementation, the refrigeration assembly includes a semiconductor refrigeration component and a first heat conducting component connected to each other, the first accommodating portion is provided with a first mounting opening communicating with the first accommodating cavity, and the first heat conducting component is mounted at the first mounting opening.

[0012] In one possible implementation, the first temperature conduction component includes a first temperature conduction plate and a plurality of first temperature conduction fins, the first temperature conduction plate is connected to the cooling end of the semiconductor refrigeration component, the plurality of first temperature conduction fins are connected to the first temperature conduction plate, and the plurality of first temperature conduction fins are located in the accommodating cavity.

[0013] In one possible implementation, the heat dissipation structure also includes a first ventilation portion, which is connected to the first accommodating portion, a first air duct connected to the first accommodating cavity is arranged in the first ventilation portion, the first accommodating cavity and the first air duct form the airflow channel, a first inlet connected to the first accommodating cavity is arranged on the first accommodating portion, a first outlet connected to the first air duct is arranged on the first ventilation portion, and the first outlet is connected to the charging position.

[0014] In a possible implementation, a heat dissipation structure is further included, which includes a second temperature conducting component and a second air supply component, wherein the second temperature conducting component is connected to the heating end of the semiconductor refrigeration component, and the second air supply component can blow air to the second temperature conducting component.

[0015] In a possible implementation, the second temperature conducting component includes a second temperature conducting plate and a plurality of second temperature conducting fins, the second temperature conducting plate is connected to the semiconductor refrigeration component, and the plurality of second temperature conducting fins are connected to the second temperature conducting plate.

[0016] In a possible implementation, the heat exhaust structure includes a heat exhaust channel, the second temperature conducting component is located in the heat exhaust channel, and the second air supply component can blow air into the heat exhaust channel.

[0017] In one possible implementation, the heat dissipation structure includes a second accommodating portion and a second ventilation portion that are connected to each other, a second accommodating cavity is provided in the second accommodating portion, a second air duct communicating with the second accommodating cavity is provided in the second ventilation portion, the second accommodating cavity and the second air duct form the heat dissipation channel, and the second temperature conductive component is located in the second accommodating cavity.

[0018] In a possible implementation, the shell further includes a bottom plate, the bottom plate is provided with a heat dissipation port connected to the outside, and the second ventilation portion is provided with a second outlet connected to the heat dissipation port.

[0019] In one possible implementation, the heat exhaust structure includes an air inlet portion, which is connected to the second accommodating portion, the air inlet portion includes a plurality of enclosures, the plurality of enclosures are arranged to form an air inlet duct, the second accommodating portion is provided with a second inlet, the second inlet is connected to the air inlet duct, and the second air supply member is connected to the air inlet portion.

[0020] In one possible implementation, the shell includes a cover plate, the charging position is arranged on the cover plate, an air outlet is arranged on the cover plate, one end of the air outlet is connected to the charging position, and the other end is connected to the air flow channel.

[0021] In one possible implementation, a support platform is provided on the charging position, and the support platform includes a first overlapping portion, the first overlapping portion covers the air outlet, the first overlapping portion has a ventilation groove, one end of the ventilation groove is connected to the air outlet, and the other end of the ventilation groove is connected to the charging position.

[0022] In one possible implementation, the support platform also includes a second overlapping portion, one end of the second overlapping portion is connected to the first overlapping portion, and the other end of the second overlapping portion is arranged away from the first overlapping portion, and the height of the second overlapping portion gradually decreases from an end close to the first overlapping portion to an end away from the first overlapping portion.

[0023] In a possible implementation, a mounting cavity is provided in the shell, the heat dissipation structure is located in the mounting cavity, and an air inlet communicating with the mounting cavity is also provided on the shell.

[0024] In a possible implementation, a charging module is further included. The charging module is located inside the shell and is connected to a position on the shell corresponding to the charging position.

[0025] In one possible implementation, the first air supply member is a fan structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A cross-sectional view of a wireless charging device provided in some embodiments of the present application is shown;

[0028] Figure 2 A schematic diagram of an exploded structure of a wireless charging device provided in some embodiments of the present application is shown;

[0029] Figure 3 A cross-sectional view of the first receiving portion and the first ventilation portion installation structure provided in some embodiments of the present application is shown;

[0030] Figure 4 A schematic diagram of the structure of a support platform provided in some embodiments of the present application is shown;

[0031] Figure 5 A cross-sectional view of a portion of the heat dissipation structure provided in some embodiments of the present application is shown.

[0032] Reference numerals:

[0033] 10. Shell; 110. Cover plate; 111. Charging position; 112. Air inlet; 113. Air outlet; 120. Bottom plate; 121. Heat exhaust port; 130. Installation cavity; 20. Support platform; 210. First overlap portion; 211. Ventilation slot; 220. Second overlap portion; 30. Charging module; 40. Heat dissipation structure; 410. First accommodating portion; 411. First accommodating cavity; 412. First inlet; 413. First installation port; 420. First ventilation portion; 421. First air duct; 422. First outlet; 430. First air supply member; 44 0. Refrigeration component; 441. Semiconductor refrigeration component; 442. First thermal conductive component; 4421. First thermal conductive plate; 4422. First thermal conductive fin; 50. Heat dissipation structure; 510. Second accommodating portion; 511. Second inlet; 512. Second mounting port; 513. Second accommodating cavity; 520. Second ventilation portion; 521. Second outlet; 522. Second air duct; 530. Air inlet portion; 531. Air inlet duct; 532. Enclosure; 540. Second air supply component; 550. Second thermal conductive component; 551. Second thermal conductive plate; 552. Second thermal conductive fin. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] Nowadays, almost all electronic devices, such as mobile phones, tablets and laptops, are charged mainly by wired power transmission, that is, one end is connected to the AC power supply and the other end is connected to the charging battery of the portable electronic device. This method has many disadvantages. First, frequent plugging and unplugging can easily damage the motherboard interface. In addition, carelessness may also cause the risk of electric shock.

[0036] Wireless charging uses a new type of energy transmission technology - wireless power supply technology. This technology frees the charger from the limitations of the line and completely separates the appliance from the power supply. It has better advantages than traditional chargers in terms of safety and flexibility. With the rapid development of science and technology today, wireless charging has shown broad development prospects. Wireless charging technology based on magnetic coupling is widely used in charging portable electronic devices such as mobile phones because of its high charging efficiency and relatively small and thin receiving coils.

[0037] In this application, the wireless charging device of a mobile phone is used as an example for explanation. In recent years, new energy vehicles have shown a blowout development, consumers' demand for flexible charging has increased, and in-vehicle wireless charging has developed rapidly. As users' demand for the speed of wireless charging of mobile phones and the number of single-chargeable mobile phones gradually increases, the charging power has also increased exponentially. The increase in wireless charging power, in addition to the increase in heat generation of the wireless charging module itself, the heat generation on the terminal mobile phone side will also increase dramatically, especially in the high temperature conditions in the car in summer. Excessive temperature leads to reduced charging efficiency or even disconnection, which seriously affects customer experience and product safety.

[0038] In the related art, the heat dissipation technology of wireless charging is to use the mobile phone to fit the magnetic charging component, and the magnetic charging component then conducts the heat to the heat dissipation structure. However, considering that the magnetic component and charging panel of the whole machine are usually plastic parts with extremely low thermal conductivity, it is difficult for the heat of the mobile phone to be conducted away through the magnetic component; in addition, there are multiple coupled wireless charging coils under the magnetic component. In order to avoid interfering with the transmission of electromagnetic signals, the heat dissipation structure is not allowed to be arranged within the range of the coil. Therefore, the contact area between the heat dissipation structure and the magnetic charging component is greatly reduced, which further affects the thermal conductivity efficiency and greatly reduces the heat dissipation effect.

[0039] The purpose of this application is to provide a wireless charging device that can be used for in-vehicle wireless charging. The wireless charging device of this application has a heat dissipation structure, which is used to dissipate heat from the mobile phone during in-vehicle wireless charging to prevent the mobile phone from overheating and causing charging efficiency problems. The heat dissipation structure of this application does not use the traditional heat conduction heat dissipation method, but creates cold air below the ambient temperature. By blowing cold air on the mobile phone, it can effectively dissipate heat from the mobile phone during charging, overcoming the problems of mobile phone disconnection and low charging efficiency in high temperature environments.

[0040] In one embodiment, see Figure 1 and Figure 2 A wireless charging device provided in the present application includes a shell 10 and a heat dissipation structure 40. The shell 10 is the main structure of the wireless charging device, which not only provides an installation environment for the heat dissipation structure 40, but also provides a charging environment for charging a mobile phone.

[0041] The housing 10 is provided with a charging position 111, and the electronic device can be placed in the charging position 111 for charging. It is worth mentioning that the charging module 30 for charging the mobile phone can be arranged corresponding to the charging position 111, so that when the mobile phone is located in the charging position 111, the charging module 30 can smoothly charge the mobile phone. It should also be noted that the charging module 30 is a mobile phone wireless charging structure that has appeared on the market. Please refer to the prior art for the specific structure and principle, and no further elaboration will be made here.

[0042] The heat dissipation structure 40 is disposed on the housing 10. The heat dissipation structure 40 is used to dissipate heat from the mobile phone during charging. The heat dissipation structure 40 of the present application can be applied not only to the non-magnetic charging structure, but also to the magnetic charging structure. The heat dissipation structure 40 has an airflow channel for airflow, one end of which is connected to the charging position 111, so that the airflow in the airflow channel can flow to the charging position 111, and the electronic device on the charging position 111 is located on the flow path of the airflow.

[0043] It should be noted here that the airflow channel is equivalent to a space that guides the airflow path. When the airflow flows along the airflow channel, it can flow from the position where it is connected with the charging position 111 to the charging position 111. In particular, if the pressure of the airflow in the airflow channel is increased to a certain extent, the airflow flowing to the charging position 111 can flow toward the mobile phone being charged at the charging position 111.

[0044] In order to cool the airflow in the airflow channel to make its temperature lower than the ambient temperature, and to drive the airflow to flow, the heat dissipation structure 40 also includes a cooling component 440 and a first air supply member 430. The first air supply member 430 can drive the airflow to flow toward the charging position 111 in the airflow channel. The first air supply member 430 mainly uses the pressure difference at both ends to make the airflow flow to the side with lower pressure, that is, the direction of the charging position 111. The cooling component 440 is located in the airflow channel, or at least the cooling part of the cooling component 440 is located in the airflow channel to reduce the temperature of the airflow flowing in the airflow channel.

[0045] The position of the refrigeration component 440 in the air flow channel is not limited. It can be located between the first air supply member 430 and the connection position between the first air supply member 430 and the charging position 111, or the first air supply member 430 can be sandwiched between the connection position between the first air supply member 430 and the charging position 111. In other words, the former setting method is to refrigerate the airflow after being driven by the first air supply member 430, and the latter setting method is to refrigerate the airflow that has not passed through the first air supply member 430, and then drive it toward the charging position 111 through the first air supply member 430 after refrigeration. Which method to choose is determined according to actual conditions.

[0046] The wireless charging device of the present application can limit an airflow path by setting an airflow channel, and the airflow in the airflow channel can flow to the charging position 111 along the path. When the airflow needs to flow to the charging position 111, the first air supply member 430 can be used to create an environment with different pressure differences between the front and the back in the airflow channel, thereby driving the airflow to flow to the charging position 111 along the airflow channel. The present application also has a refrigeration component 440, and at least the refrigeration part of the refrigeration component 440 is located in the airflow channel, which can refrigerate the airflow in the channel. The refrigerated airflow can be transported to the charging position 111 through the first air supply member 430 to charge the mobile phone charging at the charging position 111. Therefore, the heat dissipation structure 40 provided in the wireless charging device of the present application breaks the traditional heat dissipation method of using bonding conduction heat, and uses the cold airflow with a temperature lower than the ambient temperature after being processed by the refrigeration component 440 to dissipate the heat of the charging mobile phone, and the heat dissipation effect can be significantly improved, so that the mobile phone is not prone to high-temperature disconnection and low high-temperature charging efficiency during the charging process. Moreover, since the heat dissipation structure 40 in the present application utilizes cold air to dissipate heat, when it is applied to a charging device utilizing magnetic wireless charging, it will not reduce the contact area by considering the coil arrangement position of the magnetic component as in the related art. Of course, there will be no situation in which the heat dissipation effect is reduced due to the reduction in contact area. Therefore, the heat dissipation structure 40 in the present application can be adapted to both magnetic wireless charging and non-magnetic wireless charging.

[0047] In one embodiment, see Figure 1 and Figure 2 The heat dissipation structure 40 includes a first accommodating portion 410, in which a first accommodating cavity 411 is provided, and at least part of the structure of the refrigeration component 440 and the first air supply member 430 is located in the first accommodating cavity 411. It can be understood that the first accommodating portion 410, as a part of the heat dissipation structure 40, is not only used to accommodate the refrigeration component 440 and the first air supply member 430, but also mainly provides space for the formation of the air flow channel, that is, the first accommodating cavity 411 can be used as a part of the air flow channel. The structure of the first air supply member 430 located in the first accommodating cavity 411 must be a structure that can cause the air flow in the first accommodating cavity 411, and the structure of the refrigeration component 440 located in the first accommodating cavity 411 must be a structure that can cool the air flow in the first accommodating cavity 411. In this way, the first air supply member 430 can drive the air flow in the first accommodating cavity 411, and the refrigeration component 440 can cool the air flow.

[0048] It should be noted that the first air supply structure is a fan structure, for example, it may be an axial flow fan or a centrifugal fan. In the present embodiment, the first air supply structure is a centrifugal fan.

[0049] In one possible embodiment, please refer to Figure 1, the opening path of the first accommodating chamber 411 is the flow path of the airflow, and the refrigeration component 440 and the first air supply member 430 are arranged at intervals along the opening path of the first accommodating chamber 411, and the refrigeration component 440 is located on the left side of the first air supply member 430, and the first air supply member 430 is arranged near the connection position between the airflow channel and the charging position 111. When the first air supply member 430 is a centrifugal fan, its air inlet end is perpendicular to the flow path of the airflow, that is, perpendicular to the opening path of the first accommodating chamber 411, and its air outlet end is parallel to the opening path of the accommodating chamber, so that the first air supply member 430 can transport the airflow after cooling by the refrigeration component 440 to the charging position 111.

[0050] In a possible embodiment, please combine Figure 3 The refrigeration assembly 440 includes a semiconductor refrigeration component 441 and a first heat conducting component 442 connected to each other. The first accommodating portion 410 is provided with a first mounting opening 413 communicating with the first accommodating cavity 411 , and the first heat conducting component 442 is mounted at the first mounting opening 413 .

[0051] In this embodiment, the semiconductor cooling element 441 is a semiconductor cooling sheet made of N-type semiconductor material and P-type semiconductor material. According to the Peltier effect, when a current flows through a thermocouple pair formed by connecting a piece of N-type semiconductor material and a piece of P-type semiconductor material, heat transfer will occur between the two ends, and heat will be transferred from one end to the other end, thereby generating a temperature difference to form a cold end and a hot end.

[0052] It can be understood that the first temperature conducting component 442 of the present application is connected to the cooling end of the semiconductor refrigeration component 441, and the low temperature of the cooling end can be transferred to the first temperature conducting component 442, so that the temperature of the first temperature conducting component 442 is reduced. Therefore, when the air flow in the accommodating cavity passes through the first temperature conducting component 442, the first temperature conducting component 442 can reduce the temperature of the air flow.

[0053] Specifically, the first thermal conduction component 442 includes a first thermal conduction plate 4421 and a plurality of first thermal conduction fins 4422 . The first thermal conduction plate 4421 is connected to the cooling end of the semiconductor refrigeration component 441 . The first thermal conduction plate 4421 is attached to the cooling end of the semiconductor refrigeration component 441 so that the semiconductor refrigeration component 441 transfers the low temperature to the first thermal conduction plate 4421 .

[0054] The first heat conduction plate 4421 is assembled at the first mounting opening 413 of the first accommodating portion 410, and can be fixedly connected to the first accommodating portion 410 by gluing or by a snap-fit ​​structure, a buckle structure, a screw or the like. Alternatively, the size of the first mounting opening 413 can be set to be smaller than the size of the first heat conduction plate 4421, and the first heat conduction plate 4421 can be set at the first mounting opening 413 by means of interference fit.

[0055] It should be noted that multiple first temperature-conducting fins 4422 are connected to the end surface of the first temperature-conducting plate 4421 facing away from the semiconductor refrigeration component 441, and the multiple first temperature-conducting fins 4422 are located in the accommodating cavity. In this way, the cooling end of the semiconductor refrigeration component 441 can reduce the temperature of the first temperature-conducting component 442, and the low temperature of the first temperature-conducting component 442 can be transferred to the multiple first temperature-conducting fins 4422, so that the temperature of the first temperature-conducting fins 4422 is reduced. The first temperature-conducting fins 4422 are located in the first accommodating cavity 411. When the airflow flows through the multiple first temperature-conducting fins 4422, the temperature of the first temperature-conducting fins 4422 can reduce the temperature of the airflow.

[0056] In order to ensure that the airflow can flow smoothly through the multiple first heat-conducting fins 4422, the multiple first heat-conducting fins 4422 are arranged at intervals, and in a possible embodiment, the multiple first heat-conducting fins 4422 are arranged in parallel, and the spacing between two adjacent first heat-conducting fins 4422 can be the same or different, which is not limited here. It should also be noted that the gap between two adjacent first heat-conducting fins 4422 extends along the path of the first accommodating cavity 411, so that the airflow in the first accommodating cavity 411 can pass through the gap.

[0057] In some possible implementations, the first heat conducting plate 4421 and the first heat conducting fins 4422 are both made of materials with good thermal conductivity and low corrosion resistance, such as stainless steel, copper, and aluminum.

[0058] In one embodiment, see Figures 1 to 3 The heat dissipation structure 40 further includes a first ventilation portion 420, which is connected to the first accommodation portion 410. A first air duct 421 connected to the first accommodation cavity 411 is provided in the first ventilation portion 420. The first accommodation cavity 411 and the first air duct 421 form an air flow channel. The first air supply member 430 can drive the air flow in the first accommodation cavity 411 and the first air duct 421. Please refer to Figure 1 , Figure 1 The dotted arrows in the first accommodating cavity 411 and the first air duct 421 indicate the direction and path of the airflow when the mobile phone is cooled.

[0059] The first accommodating portion 410 is provided with a first inlet 412 connected to the first accommodating cavity 411 at one end away from the first ventilation portion 420, and the first ventilation portion 420 is provided with a first outlet 422 connected to the first air duct 421 at one end away from the first accommodating portion 410, and the first outlet 422 is connected to the charging position 111. In this way, the airflow channel runs through the first accommodating cavity 411 and the first air duct 421 along the path of the first accommodating cavity 411 and the first air duct 421, and when the first air supply member 430 drives the airflow, the airflow can enter the first accommodating cavity 411 from the first inlet 412 to supplement the airflow in the first accommodating cavity 411, and the first air supply member 430 can also discharge the airflow from the first outlet 422, so that the airflow flows to the charging position 111.

[0060] It should be noted that the first ventilation portion 420 and the first receiving portion 410 can be integrally formed, or the two can be detachably connected, such as by a snap-on structure, a buckle structure, or by screws, and the detachable connection makes it easy to disassemble and replace the first ventilation portion 420 and the first receiving portion 410. In addition, the first ventilation portion 420 can also be detachably connected to the housing 10, and the first ventilation portion 420 connected to the housing 10 can stabilize the position of the entire heat dissipation structure 40.

[0061] In a possible implementation, a plurality of charging positions 111 may be provided on a charging device as required to charge a plurality of mobile phones at the same time. The plurality of charging positions 111 are arranged at intervals on the housing 10, and a plurality of heat dissipation structures 40 may be provided on the housing 10 accordingly. Each charging structure dissipates heat for the mobile phone on the corresponding charging position 111.

[0062] In a possible implementation, a mounting cavity 130 is provided in the housing 10, and the heat dissipation structure 40 is located in the mounting cavity 130. It is worth mentioning here that the charging module 30 mentioned above is also located in the mounting cavity 130 of the housing 10, and the charging module 30 is connected to a position on the housing 10 corresponding to the charging position 111, and the position of the heat dissipation structure 40 in the mounting cavity 130 is relatively far away from the charging position 111 relative to the charging module 30, that is, the heat dissipation structure 40 is located below the charging module 30.

[0063] When setting the heat dissipation structure 40, in order to reasonably utilize the space of the installation cavity 130, the position and shape of the first accommodating portion 410 and the first ventilation portion 420 can also be designed. For example, the first accommodating portion 410 can be set as a straight line as a whole, and the first accommodating portion 410 can be placed flat in the installation cavity 130. At this time, the extension path of the first accommodating cavity 411 is roughly parallel to the plane where the charging position 111 is located. In order to enable the airflow in the first accommodating cavity 411 to flow to the charging position 111, the first ventilation portion 420 is bent, for example, the first ventilation portion 420 can be bent 90° from its middle position, and the corresponding first air duct 421 is also bent and opened in the first ventilation portion 420. One section of the first ventilation portion 420 is parallel to the first accommodating portion 410, and the other section extends toward the charging position 111. In this way, the end of the first ventilation portion 420 parallel to the first accommodating portion 410 can be connected to the first accommodating portion 410, and the end extending toward the charging position 111 can be connected to the charging position 111.

[0064] By bending the first ventilation portion 420, the vertical end of the first ventilation portion 420 can be used to connect to the charging position 111, and the lateral end of the first ventilation portion 420 can be connected to the first accommodating portion 410 placed horizontally in the installation cavity 130, thereby making full use of the lateral and vertical spaces in the installation cavity 130. In this way, compared with the structure that only occupies the lateral space or the vertical space in the installation cavity 130, the heat dissipation structure 40 in this embodiment does not have high requirements for space.

[0065] In one embodiment, see Figure 1 and Figure 2 The housing 10 includes a cover plate 110, which is disposed on the top of the housing 10. A charging position 111 is disposed on the cover plate 110. The charging position 111 can be formed by a groove opened on the cover plate 110. The shape and size of the groove are adapted to the mobile phone, or can be slightly larger than the size of the mobile phone, so that the mobile phone can be directly placed in the groove. In addition, the charging position 111 can also be deformed by the middle position of the cover plate 110 to form a recessed portion, and mobile phones and other electronic devices can be placed in the recessed portion. The formation method of the charging position 111 is not limited in this application. The charging position 111 is mainly designed to meet the requirement that the mobile phone is not easy to offset or the offset distance is not too large. Therefore, the charging position 111 can be set to a structure that is recessed toward the inside of the housing 10 to facilitate the placement of the mobile phone.

[0066] An air outlet 113 is provided on the cover plate 110, and the air outlet 113 is provided at the end of the cover plate 110. One end of the air outlet 113 is connected to the charging position 111, and the other end is used to connect the air flow channel. For example, the end of the first ventilation portion 420 provided with the first outlet 422 can be connected to the position where the air outlet 113 is provided on the cover plate 110, so that the first outlet 422 is connected to the air outlet 113, and then the first air duct 421 can be connected to the charging position 111.

[0067] It is worth mentioning that a fine grid structure may be provided at the air outlet 113 to prevent fine objects from falling into the shell 10 and causing dust accumulation inside the shell 10 .

[0068] Since the end surface of the charging position 111 is a plane, when the mobile phone is placed on the charging position 111, the back of the mobile phone fits with the end surface of the charging position 111. At this time, the airflow flowing out of the air outlet 113 mostly flows along the side of the mobile phone, and there is very little airflow flowing through the end surface where the mobile phone fits with the charging position 111, which may cause a low convective heat transfer coefficient on the back of the mobile phone.

[0069] To increase the convective heat transfer coefficient on the back of the phone, please combine Figure 4 , a support platform 20 is also provided on the charging position 111. The support platform 20 is provided at one end of the cover plate 110. One end face of the support platform 20 abuts against the charging position 111. The end face of the support platform 20 facing away from the charging position 111 is at a certain distance from the charging position 111. When the mobile phone is placed at the charging position 111 for charging, one end of the back of the mobile phone abuts against the charging position 111, and the other end can be overlapped on the support platform 20, so that one end of the back of the mobile phone can be lifted to a certain height, so that there is a certain gap between the end of the back of the mobile phone and the charging position 111. It should be noted that the support platform 20 is provided at a position of the cover plate 110 close to the air outlet 113, that is, the back of the mobile phone close to the air outlet 113 is lifted, so that the airflow flowing out of the air outlet 113 can fully flow to the back of the mobile phone, increase the convective heat transfer coefficient of the back of the mobile phone, and further improve the heat dissipation effect of the mobile phone when charging.

[0070] In a possible embodiment, the support platform 20 can be configured as a support structure spanning the air outlet 113, and a ventilation slot 211 is provided at the position of the support platform 20 corresponding to the air outlet 113, the ventilation slot 211 can be connected to the air outlet 113, and the ventilation slot 211 is connected to the charging position 111, so that the airflow of the air outlet 113 can flow to the charging position 111 through the ventilation slot 211.

[0071] In another possible embodiment, the support platform 20 can be composed of two spaced sub-parts, and the mobile phone can be overlapped on the two sub-parts. The gap between the two sub-parts is connected to the air outlet 113, so that the airflow flowing out of the air outlet 113 can flow to the mobile phone through the gap between the two sub-parts.

[0072] In the present application, the support platform 20 includes a first overlapping portion 210 , which covers the air outlet 113 , and the first overlapping portion 210 is provided with a ventilation slot 211 , one end of the ventilation slot 211 is connected to the air outlet 113 , and the other end of the ventilation slot 211 is connected to the charging position 111 .

[0073] The support platform 20 also includes a second overlap portion 220, and two second overlap portions 220 are provided. The two second overlap portions 220 are arranged at intervals, and one end of the two second overlap portions 220 is connected to the first overlap portion 210, and the other ends of the two second overlap portions 220 are extended in a direction away from the first overlap portion 210, and the ventilation groove 211 is located between the two second overlap portions 220.

[0074] It is worth mentioning that, if the distance between the end face of the second overlap portion 220 away from the charging position 111 and the end face in contact with the charging position 111 is set as the height of the second overlap portion 220, then the height of the second overlap portion 220 gradually decreases from one end close to the first overlap portion 210 to one end away from the first overlap portion 210, that is, the second overlap portion 220 is set to be wedge-shaped, and when the mobile phone is placed in the charging position 111, its back can abut against the wedge-shaped surface of the second overlap portion 220. In addition, the opposite end faces between the two second overlap portions 220 are set to be inclined surfaces, one end of the inclined surface is connected to the wedge-shaped surface of the second overlap portion 220, and the other end is connected to the end face of the second overlap portion 220 abutting against the charging position 111, so that the airflow flowing out of the ventilation slot 211 can flow to the back of the mobile phone under the guidance of the inclined surface.

[0075] In a possible embodiment, the housing 10 is further provided with an air inlet 112, which is arranged on the cover plate 110. The air inlet 112 is arranged through the cover plate 110 so that the air inlet 112 can be connected with the installation cavity 130. The air inlet 112 is arranged at one end of the cover plate 110 away from the air outlet 113. By providing the air inlet 112, the installation cavity 130 can be connected with the outside through the air inlet 112 to supplement the air flow in the installation cavity 130. When the charging device is used in a vehicle and the air conditioner is turned on in the vehicle, the cold air in the vehicle can enter the installation cavity 130 through the air inlet 112. The cold air can also enter the first accommodating cavity 411 from the first inlet 412, and then flow to the mobile phone charged at the charging position 111 through the first air duct 421 and the air outlet 113.

[0076] The main cooling element of the present application is a semiconductor cooling element 441. In addition to being able to cool, the other end of the semiconductor cooling element 441 will generate heat. If the heat generated by the semiconductor cooling element 441 is not discharged in time, it will affect the temperature of the airflow for cooling the mobile phone.

[0077] Therefore, in one embodiment, please refer to Figure 1 , Figure 2 and Figure 5 The wireless charging device of the present application further includes a heat dissipation structure 50 , which is used to discharge the heat generated by the semiconductor cooling element 441 out of the housing 10 .

[0078] Specifically, the heat dissipation structure 50 includes a second temperature conducting component 550 and a second air supply component 540. The second temperature conducting component 550 is connected to the heating end of the semiconductor refrigeration component 441. The temperature of the heating end can be transferred to the second temperature conducting component 550. The second air supply component 540 can blow air to the second temperature conducting component 550. The temperature on the second temperature conducting component 550 is discharged through the air flow driven by the second air supply component 540.

[0079] It should be noted that the heat exhaust structure 50 includes a heat exhaust channel, which is connected to the outside of the shell 10. The second temperature conductor 550 is located in the heat exhaust channel. The second air supply member 540 can blow air into the heat exhaust channel. The second air supply member 540 can drive the air flow in the heat exhaust channel. During the air flow, the heat on the second temperature conductor 550 can be taken away and can flow out of the shell 10 along the heat exhaust channel.

[0080] The second heat conducting member 550 includes a second heat conducting plate 551 and a plurality of second heat conducting fins 552. One end of the second heat conducting plate 551 is connected to the heating end of the semiconductor refrigeration member 441. The end surface of the second heat conducting plate 551 is in contact with the heating end surface of the semiconductor refrigeration member 441. The heat generated by the heating end of the semiconductor refrigeration member 441 can be transferred to the second heat conducting plate 551. The plurality of second heat conducting fins 552 are connected to the end of the second heat conducting plate 551 facing away from the semiconductor refrigeration member 441. The plurality of second heat conducting fins 552 are located in the heat exhaust passage and on the path of the air flow driven by the second air supply member 540. By providing the second heat conducting plate 551 and the plurality of second heat conducting fins 552, the heat generated by the semiconductor refrigeration member 441 can be transferred to the plurality of second heat conducting fins 552. When the airflow flowing in the heat exhaust passage passes through the second heat conducting fins 552, the heat of the second heat conducting fins 552 can be taken away. By providing the second heat conducting member 550 and the second heat conducting fins 552 , the heat of the semiconductor cooling member 441 can be transferred to the second heat conducting fins 552 which can generate a larger contact surface, so as to achieve a better heat dissipation effect on the semiconductor cooling member 441 .

[0081] In order to ensure that the air can fully contact the second thermal conductive fins 552 when flowing, the multiple second thermal conductive fins 552 are all configured as a flat plate structure, and the multiple second thermal conductive fins 552 are spaced apart, two adjacent second thermal conductive fins 552 are parallel, and the gap between two adjacent second thermal conductive fins 552 extends along the path of the heat exhaust channel.

[0082] In a possible embodiment, the heat dissipation structure 50 includes a second accommodating portion 510 and a second ventilation portion 520 that are connected to each other. The second accommodating portion 510 and the second ventilation portion 520 can be integrally formed, or the second accommodating portion 510 and the second ventilation portion 520 can also be detachably connected, for example, the second accommodating portion 510 and the second ventilation portion 520 are connected together by plugging, or are connected together by a buckle structure, a clamping structure, and a screw structure.

[0083] The second accommodating portion 510 is provided with a second accommodating cavity 513, and the second ventilation portion 520 is provided with a second air duct 522 communicating with the second accommodating cavity 513. The second accommodating cavity 513 and the second air duct 522 form a heat exhaust channel. Figure 1 When the semiconductor refrigeration element 441 is cooled, the dotted arrows in the second accommodating cavity 513 and the second air duct 522 can represent the air flow path and direction.

[0084] The second accommodating portion 510 has a second mounting opening 512 in communication with the second accommodating cavity 513 at one end thereof facing the semiconductor refrigerating element 441. The second thermal conductive plate 551 can be mounted in the second mounting opening 512, and the second thermal conductive fin 552 is located in the second accommodating cavity 513. The second thermal conductive plate 551 is relatively fixed to the second accommodating portion 510. The second thermal conductive plate 551 can be detachably connected to the second mounting opening 512 by a buckle structure, a clamping structure or a screw structure, or the size of the second mounting opening 512 can be set to be smaller than the size of the second thermal conductive plate 551, and the second thermal conductive plate 551 can be fixed to the second accommodating portion 510 by an interference fit. In addition, the second thermal conductive plate 551 is also fixedly connected to the semiconductor refrigerating element 441. Therefore, when the heat dissipation structure 40 is fixed in the mounting cavity 130, the heat exhaust structure 50 can also be fixed in the mounting cavity 130.

[0085] In order to increase the heat dissipation efficiency, the spatial size of the accommodating cavity is set to match the size of the second heat-conducting fin 552, that is, the distance from the end of the second heat-conducting fin 552 connected to the second heat-conducting plate 551 to the end away from the second heat-conducting plate 551 is adapted to the size of the second accommodating cavity 513 in this direction. In this way, the airflow in the second accommodating cavity 513 has no extra flow space and is fully in contact with the second heat-conducting fin 552.

[0086] It should be noted that the shell 10 also includes a bottom plate 120, and one end of the second ventilation portion 520 away from the second accommodating portion 510 can extend to abut the bottom plate 120, or can be connected to the bottom plate 120. A heat exhaust port 121 connected to the outside is penetrated at a position on the bottom plate 120 corresponding to the second air duct 522, and the second ventilation portion 520 is provided with a second outlet 521, and the second outlet 521 is connected to the heat exhaust port 121. The airflow that absorbs the temperature of the second heat conduction fin 552 flows out of the shell 10 from the heat exhaust port 121 along the second air duct 522.

[0087] In one possible implementation, please refer to Figure 1 , Figure 2 and Figure 5 The second accommodating portion 510 is provided with a second inlet 511 at the end away from the second ventilation portion 520, and the second air supply member 540 can drive air to flow from the second inlet 511 to the second accommodating chamber 513. The heat dissipation structure 50 also includes an air inlet 530, which is connected to one end of the second accommodating portion 510 provided with the second inlet 511, and the air inlet 530 includes a plurality of enclosures 532, and the plurality of enclosures 532 are connected end to end to form an air inlet duct 531. The air inlet duct 531 formed by the plurality of enclosures 532 runs through the air inlet duct 530, so that the air inlet duct 531 is open on both sides. When the air inlet duct 530 is connected to the second accommodating portion 510, the opening of the air inlet duct 531 close to the second accommodating portion 510 is connected to the second inlet 511.

[0088] The second air supply member 540 is an axial flow fan, which is connected to one end of the air inlet portion 530 away from the second accommodating portion 510, and the air outlet end of the second air supply member 540 is arranged opposite to the opening of the air inlet duct 531. Specifically, the second air supply member 540 is detachably connected to the air inlet portion 530, and the end of the second air supply member 540 abuts against the end of the air inlet portion 530 away from the second accommodating portion 510, and the end of the second air supply member 540 is arranged opposite to the opening of the air inlet duct 531, and the end of the second air supply member 540 can cover the opening of the air inlet duct 531 along the opening edge of the air inlet duct 531, the air outlet end of the second air supply member 540 is connected to the air inlet duct 531, and the end of the second air supply member 540 is sealed between the edge of the opening of the air inlet portion 530.

[0089] In a specific embodiment, the two openings of the air inlet 531 are set to different sizes. For example, the size of the opening of the air inlet 531 communicating with the second inlet 511 is smaller than the size of the opening of the air inlet 531 communicating with the air outlet of the second air supply member 540. By setting the opening sizes at both ends of the air inlet 531, the air inlet 531 can be set to a constricted structure. When the second air supply member 540 drives the air to flow, the opening of the air entering the air inlet 531 is smaller than the opening of the air flowing out of the air inlet 531, which can increase the flow rate of the air when it flows out of the air inlet 531.

[0090] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0091] In the description of the present application, it should be understood that the terms "including" and "having" and any variations thereof used in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or apparatuses.

[0092] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense, for example, it can be a fixed connection, it can also be a detachable connection, or it can be integrated; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can make the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wireless charging device, characterized in that: include: A housing, wherein a charging position is provided on the housing, and an electronic device can be placed in the charging position for charging; as well as a heat dissipation structure, the heat dissipation structure being arranged on the housing, the heat dissipation structure having an airflow channel for airflow, one end of the airflow channel being connected to the charging position so that the airflow in the airflow channel can flow to the charging position, and the electronic device on the charging position is located on the flow path of the airflow; The heat dissipation structure also includes a refrigeration component and a first air supply component. The first air supply component can drive the airflow in the airflow channel toward the charging position. The refrigeration component is located in the airflow channel and can reduce the temperature of the airflow flowing in the airflow channel.

2. The wireless charging device according to claim 1, characterized in that: The heat dissipation structure includes a first accommodating portion, a first accommodating cavity is provided in the first accommodating portion, and at least part of the structure of the refrigeration component and the first air supply member is located in the first accommodating cavity.

3. The wireless charging device according to claim 2, characterized in that: The refrigeration assembly includes a semiconductor refrigeration component and a first heat-conducting component connected to each other. The first accommodating portion is provided with a first mounting opening communicating with the first accommodating cavity, and the first heat-conducting component is mounted on the first mounting opening.

4. The wireless charging device according to claim 3, characterized in that: The first heat conduction component includes a first heat conduction plate and a plurality of first heat conduction fins. The first heat conduction plate is connected to the cooling end of the semiconductor refrigeration component. The plurality of first heat conduction fins are connected to the first heat conduction plate. The plurality of first heat conduction fins are located in the accommodating cavity.

5. The wireless charging device according to any one of claims 2 to 4, characterized in that: The heat dissipation structure also includes a first ventilation part, which is connected to the first accommodating part. A first air duct connected to the first accommodating cavity is arranged in the first ventilation part. The first accommodating cavity and the first air duct form the airflow channel. A first inlet connected to the first accommodating cavity is arranged on the first accommodating part. A first outlet connected to the first air duct is arranged on the first ventilation part. The first outlet is connected to the charging position.

6. The wireless charging device according to claim 3, characterized in that: It also includes a heat dissipation structure, which includes a second temperature-conducting component and a second air supply component. The second temperature-conducting component is connected to the heating end of the semiconductor refrigeration component, and the second air supply component can blow air to the second temperature-conducting component.

7. The wireless charging device according to claim 6, characterized in that: The second temperature conducting component comprises a second temperature conducting plate and a plurality of second temperature conducting fins. The second temperature conducting plate is connected to the semiconductor refrigeration component, and the plurality of second temperature conducting fins are connected to the second temperature conducting plate.

8. The wireless charging device according to claim 6, characterized in that: The heat exhaust structure includes a heat exhaust channel, the second temperature conducting component is located in the heat exhaust channel, and the second air supply component can blow air into the heat exhaust channel.

9. The wireless charging device according to claim 8, characterized in that: The heat dissipation structure includes a second accommodating portion and a second ventilation portion connected to each other, a second accommodating cavity is provided in the second accommodating portion, a second air duct communicating with the second accommodating cavity is provided in the second ventilation portion, the second accommodating cavity and the second air duct form the heat dissipation channel, and the second temperature conductive member is located in the second accommodating cavity.

10. The wireless charging device according to claim 9, characterized in that: The shell also includes a bottom plate, a heat dissipation port communicating with the outside is formed on the bottom plate, and the second ventilation portion is provided with a second outlet, which is communicated with the heat dissipation port.

11. The wireless charging device according to claim 9, characterized in that: The heat exhaust structure includes an air inlet portion, which is connected to the second accommodating portion. The air inlet portion includes a plurality of enclosures, which are arranged to form an air inlet duct. The second accommodating portion is provided with a second inlet, which is connected to the air inlet duct. The second air supply member is connected to the air inlet portion.

12. The wireless charging device according to claim 1, characterized in that: The shell includes a cover plate, the charging position is arranged on the cover plate, an air outlet is arranged on the cover plate, one end of the air outlet is connected to the charging position, and the other end is connected to the air flow channel.

13. The wireless charging device according to claim 12, characterized in that: A support platform is provided on the charging position, and the support platform includes a first overlapping portion, the first overlapping portion covers the air outlet, the first overlapping portion has a ventilation slot, one end of the ventilation slot is connected to the air outlet, and the other end of the ventilation slot is connected to the charging position.

14. The wireless charging device according to claim 13, characterized in that: The support platform also includes a second overlapping portion, one end of which is connected to the first overlapping portion, and the other end of the second overlapping portion is arranged away from the first overlapping portion, and the height of the second overlapping portion gradually decreases from an end close to the first overlapping portion to an end away from the first overlapping portion.

15. The wireless charging device according to claim 1, characterized in that: An installation cavity is arranged in the shell, the heat dissipation structure is located in the installation cavity, and an air inlet communicating with the installation cavity is also arranged on the shell.

16. The wireless charging device according to claim 1, characterized in that: It also includes a charging module, which is located in the shell and connected to a position on the shell corresponding to the charging position.

17. The wireless charging device according to claim 1, characterized in that: The first air supply member is a fan structure.

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