Lap process and lap process product
By setting the resistive paint on the substrate and removing the resistive paint after the metal layer is integrated in the circuit trace channel, the problem that non-scaling areas are also decaled in the prior art is solved, and the product quality and metal layer are improved Thickness and corrosion resistance.
Patent Information
- Application Number
- CN202411129461.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2024-12-17
AI Technical Summary
When the existing LAP process is used to decontaminate the metal layer in the circuit trace groove of the substrate, it is easy to decontaminate the non-plating area with a metal layer, resulting in a decline in product quality.
The substrate surface is equipped with a resistive paint, and after making the circuit trace groove, there is a resistive paint in the non-scaling area to prevent the metal layer from adhering to the non-scaling area during the decomposition process, thereby removing the resistive paint after the decomposition metal layer is decomposed. , ensure that the metal layer is only formed in the circuit trace duct.
It effectively avoids metal adhesion in non-plating areas, improves product quality and yield, reduces resource waste, and improves the thickness and corrosion resistance of the electrolyte-plating metal layer.
Smart Images
Figure CN119155909A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of antenna technology, and in particular to LAP technology and LAP technology products. Background Art
[0002] As mobile communication devices and smart wearable devices develop towards miniaturization and intelligence, the antennas used in the above devices need to integrate a large number of functions such as WIFI and Bluetooth in an extremely limited space.
[0003] The LAP (Laser Activating Plating) process is a process that selectively metallizes ordinary plastic substrates by inducing lasers. It can produce circuits and interconnect devices with electrical functions on any molding surface, so it has significant advantages in antenna manufacturing. However, the LAP process currently on the market is prone to chemically plate a layer of metal on the non-chemically plated area of the substrate surface when the metal layer is chemically plated in the circuit routing groove of the substrate, thereby reducing product quality. Summary of the invention
[0004] The main purpose of the present application is to provide a LAP process and a LAP process product, aiming to reduce the probability of chemically plating a metal layer on a non-chemically plated area during chemical plating.
[0005] To achieve the above object, the present application proposes a LAP process, which includes the following steps:
[0006] S1, first obtain a substrate;
[0007] S2, providing a plating resistance paint on the surface of the substrate;
[0008] S3, making a circuit wiring groove on the surface of the substrate provided with the resist paint;
[0009] S4, chemically plating a metal layer in the circuit routing groove on the substrate;
[0010] S5, removing the plating resistance paint on the surface of the substrate.
[0011] In one embodiment, the plating resistance paint is disposed on the surface of the substrate by spraying.
[0012] In one embodiment, the anti-plating paint is UV paint.
[0013] In one embodiment, step S5 uses a chemical dissolution method to remove the plating resist on the surface of the substrate.
[0014] In one embodiment, the solvent used in the chemical dissolution method is dimethyl adipate reagent or DBE.
[0015] In one embodiment, before performing step S4, the method further includes step S31: activating the substrate on which the circuit wiring grooves are formed.
[0016] In one embodiment, the metal layer is gold, copper or nickel.
[0017] In one embodiment, when the metal layer is copper, the activation treatment reagent is a colloidal palladium activation solution; or
[0018] When the metal layer is nickel, the reagent for the activation treatment is an acidic PdCl2 solution; or
[0019] When the metal layer is gold, the reagent for activation treatment is palladium activation solution.
[0020] In one embodiment, a laser engraving process is used when manufacturing the circuit wiring grooves on the substrate.
[0021] The present invention also provides a LAP process product, which is prepared by the above-mentioned LAP process.
[0022] The technical solution proposed in this application has at least the following technical effects:
[0023] Before making the circuit wiring groove on the surface of the substrate, this scheme first sets a layer of anti-plating paint on the surface of the substrate. Therefore, after the circuit wiring groove is made on the surface with the anti-plating paint, the surface of the circuit wiring groove is free of the anti-plating paint, while the surfaces of other non-plated areas are set with the anti-plating paint. Therefore, when the chemical plating step is performed, a metal layer will be chemically plated in the circuit wiring groove, and because the surfaces of other non-plated areas are set with the anti-plating paint, metal is prevented from adhering to the non-plated area, that is, it can prevent the non-plated area from being chemically plated with a metal layer, thereby improving product quality, increasing product yield, and reducing resource waste caused by poor product quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0026] Figure 1 A schematic diagram of the process flow provided for the first embodiment of the LAP process of the present application;
[0027] Figure 2 The structure of the LAP process product for this application.
[0028] Description of Figure Numbers:
[0029] 1. Substrate; 2. Metal layer.
[0030] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0031] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.
[0032] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.
[0033] Reference Figure 1 and Figure 2 The main solution of the embodiment of the present application is: before chemically plating the metal layer 2 in the circuit wiring groove, first set a layer of plating resistance paint in the non-plating area, and then remove the plating resistance paint after chemically plating the metal layer 2 in the circuit wiring groove.
[0034] In the prior art, when chemically plating the metal layer 2 in the circuit wiring groove, it is easy to chemically plate the non-plated area with a layer of chemically plated metal layer 2, and it is easy to chemically plate the non-plated area on the surface of the substrate with a layer of metal layer, thereby reducing product quality.
[0035] Based on this, the embodiment of the present application provides a LAP process, referring to Figure 1 , Figure 1 Schematic diagram of the process of an embodiment of the LAP process of the present application.
[0036] In this embodiment, the LAP process includes steps S1 to S5:
[0037] S1, first obtain a substrate 1;
[0038] S2, providing a plating resistance paint on the surface of the substrate 1;
[0039] S3, making a circuit wiring groove on the surface of the substrate 1 provided with the resist paint;
[0040] S4, chemically plating a metal layer 2 in the circuit routing groove on the substrate 1;
[0041] S5, removing the plating resistance paint on the surface of the substrate 1.
[0042] It should be noted that the plating resist is used to prevent the chemically plated metal from adhering to the non-chemically plated area when the circuit wiring groove is chemically plated, that is, the plating resist is a substance that reduces the adhesion of the chemically plated metal. The substrate 1 is a plastic substrate 1.
[0043] It can be understood that, since a layer of anti-plating paint is first provided on the surface of the substrate 1 before the circuit wiring groove is made on the surface of the substrate 1, after the circuit wiring groove is made on the surface provided with the anti-plating paint, the surface of the circuit wiring groove has no anti-plating paint, while the surfaces of other non-plated areas are provided with anti-plating paint. Therefore, when the chemical plating step is performed, a metal layer 2 will be chemically plated in the circuit wiring groove, and since the surfaces of other non-plated areas are provided with anti-plating paint, metal is prevented from adhering to the non-plated areas, that is, it is possible to prevent the non-plated areas from being chemically plated with metal, thereby improving product quality, increasing product yield, and reducing the waste of resources caused by poor product quality.
[0044] This solution first sets anti-plating paint on the surface of the substrate 1 and then makes the circuit wiring groove. Compared with the solution of first making the circuit wiring groove and then setting anti-plating paint on the non-plating surface of the substrate, the process is simpler and can reduce the protection process of the circuit wiring groove made first, thereby improving the process efficiency.
[0045] Secondly, after the metal layer 2 is chemically plated in the circuit wiring groove on the substrate 1, the resist paint on the surface of the substrate 1 is removed. Since the groove depth of the circuit wiring groove includes the layer thickness of the resist paint, after removing the resist paint, the metal layer 2 will protrude from the surface of the substrate 1. Compared with the chemically plated metal layer 2 in the prior art, this solution will increase the thickness of the chemically plated metal layer 2 and improve the corrosion resistance and current carrying capacity. Of course, when the metal layer 2 is chemically plated in the circuit wiring groove on the substrate 1, the entire circuit wiring groove may not be filled. As long as the metal in the circuit wiring groove reaches a certain layer thickness or is flush with the bottom surface of the resist paint, the chemical plating step can be stopped.
[0046] Further, the anti-plating paint is disposed on the surface of the substrate 1 by spraying, because the coating formed by the spraying method is uniform and fine, avoiding the problems of brush marks and rolling marks that may be generated by brushing or rolling. This uniform coating not only has a beautiful appearance, but also improves the overall performance of the coating. Secondly, the spraying method has a strong covering ability, and the spraying can easily cover the small cracks and uneven parts of the wall, improving the covering power and adhesion of the anti-plating paint. Moreover, the thickness of the spraying method is controllable, and the thickness and amount of the anti-plating paint can be accurately controlled during the spraying process to ensure the uniformity and consistency of the thickness of the anti-plating paint, avoid waste and uneven thickness problems, and most importantly, in the subsequent process of removing the anti-plating paint, the uneven thickness of the anti-plating paint is reduced. When removing the anti-plating paint, the influence on the substrate 1 is reduced, for example, when the anti-plating paint is removed by grinding, part of the anti-plating paint is not removed, or the substrate 1 is partially over-grinded. Of course, the present invention is not limited to this. In some other embodiments, the anti-plating paint can also be disposed on the surface of the substrate 1 by coating (such as brushing or rolling).
[0047] Optionally, the anti-plating paint is UV paint; this is because the metal surface is dense, which makes it difficult for UV paint to penetrate and absorb, and the effective contact surface is small, so the adhesion of the chemically plated metal to the UV paint is weak, and it is not easy to directly adhere to the UV paint, which can reduce the probability of the chemically plated metal adhering to the anti-plating paint. Of course, the present invention is not limited to this, and in some other embodiments, the anti-plating paint can also be an oxide film.
[0048] Moreover, UV paint usually takes only a few seconds to a few minutes to cure under ultraviolet light, which greatly improves process efficiency. No heating is required during curing, and it can be cured quickly at room temperature, saving energy.
[0049] In one embodiment, step S5 uses a chemical dissolution method to remove the plating resist on the surface of the substrate 1, because the chemical dissolution method has high removal efficiency and little impact on the substrate 1. Of course, the present invention is not limited to this, and in some other embodiments, step S5 may also use a physical method to remove the plating resist, such as a scraping method or a sandpaper polishing method.
[0050] Optionally, the solvent used in the chemical dissolution method is dimethyl adipate reagent or DBE.
[0051] In one embodiment, the solvent used in the chemical dissolution method is dimethyl adipate reagent, which is environmentally friendly. At present, dimethyl adipate reagent is considered to be a relatively environmentally friendly solvent, with low volatility and relatively small impact on the environment. Compared with some traditional organic solvents, dimethyl adipate may be more in line with environmental protection requirements. Secondly, dimethyl adipate has a certain solubility for UV paint, and can effectively remove the UV paint layer attached to the plastic surface. Moreover, the operation of using dimethyl adipate to remove UV paint is relatively simple, and only an appropriate amount of solvent needs to be applied to the UV paint surface and wiped clean after it is dissolved.
[0052] In the second embodiment, the solvent used in the chemical dissolution method is DBE (divalent acid ester reagent). This is because DBE has good solubility. As an organic solvent, DBE has good solubility for coatings such as UV paint. It can effectively penetrate and dissolve the UV paint layer, making it loose and easy to remove. Secondly, DBE is environmentally friendly. DBE is considered to be an environmentally friendly solvent with the advantages of non-toxic, odorless, and pollution-free. Compared with some traditional organic solvents, DBE has less impact on the environment during use and is more in line with modern environmental protection requirements. Moreover, DBE has a high boiling point and a relatively slow volatilization rate, which helps to maintain the stability of the solvent during the removal of UV paint and reduce the waste and environmental pollution caused by volatilization. At the same time, the slow drying of DBE also gives DBE more time to react with the UV paint, improving the removal effect. More importantly, when using DBE to remove UV paint, the operation is relatively simple. Just apply an appropriate amount of DBE on the surface of the UV paint and wipe it clean after it dissolves.
[0053] Of course, the present invention is not limited thereto. In some other embodiments, the solvent used in the chemical dissolution method may also be acetone reagent or ethanol solution.
[0054] In one embodiment, before performing step S4, it also includes S31: activating the substrate 1 with the circuit wiring groove. It can be understood that the present scheme can effectively remove the pollutants in the circuit wiring groove through the activation treatment, and provide a clean and impurity-free surface for the subsequent chemical metal deposition. Secondly, the activation treatment will form a thin oxide layer or a rough microstructure on the surface of the circuit wiring groove. This surface morphology helps to increase the mechanical bite force between the chemically plated metal and the substrate 1, thereby improving the adhesion of the chemically plated metal. The activation treatment will also adsorb some catalytically active substances (such as precious metal ions) on the surface of the circuit wiring groove. These catalytic substances play a key role in the subsequent chemical metal deposition process, which can accelerate the formation of the metal layer 2 and improve its quality. Furthermore, the activation treatment can also improve the wettability of the circuit wiring groove, making it easier for the plating solution to spread and deposit on the surface of the circuit wiring groove to form a uniform and dense chemical metal layer 2.
[0055] Optionally, the electroless-plated metal layer 2 is gold, copper or nickel.
[0056] Among them, in one embodiment, the electroless plated metal layer 2 is gold. This is because gold not only has good conductivity, effectively reduces resistance, and improves the power transmission efficiency of the device, but also has good corrosion resistance, hardness, and wear resistance, and can maintain the gloss and aesthetics of the metal layer 2.
[0057] In the second embodiment, the electroless metal layer 2 is copper, because copper not only has good electrical conductivity, but also does not require external current during the copper plating process, so it is not limited by current distribution, and metal plating can be performed on various substrates 1, including semiconductors and non-conductors such as glass, ceramics, plastics, etc. This allows greater flexibility in material selection for the substrate 1.
[0058] In the third embodiment, the electroless plated metal layer 2 is nickel, because nickel not only has good electrical conductivity, but also has good corrosion resistance, hardness, and wear resistance, and can maintain the gloss and beauty of the metal layer 2, can remain stable in harsh environments, and effectively resist chemical corrosion and atmospheric corrosion. More importantly, the electroless nickel layer can withstand high temperatures and is suitable for applications exposed to high temperature environments.
[0059] Among them, when the metal layer 2 is copper, the reagent for the activation treatment adopts colloidal palladium activation liquid; this is because, firstly, the colloidal palladium activation liquid has excellent catalytic activity, and the palladium particles in the colloidal palladium activation liquid have extremely high catalytic activity, which can quickly form a layer of catalytic active centers on the surface of the substrate 1, and promote the reduction and deposition of copper ions during chemical copper plating. This efficient catalytic action helps to obtain a uniform and dense copper plating layer. Moreover, the colloidal palladium activation liquid has a low induction time, and the colloidal palladium activation liquid can significantly shorten the induction time of chemical copper plating and improve production efficiency. Secondly, the colloidal palladium activation liquid has good adhesion and can enhance the bonding force. The colloidal palladium activation can improve the wettability and activity of the surface of the substrate 1, thereby enhancing the bonding force between the copper plating layer and the substrate 1. This strong bonding force helps to reduce the risk of the copper plating layer falling off and improve the reliability and durability of the product. Thirdly, the colloidal palladium activation liquid has high process stability and controllability. The colloidal palladium activation liquid usually has good stability and can maintain its catalytic activity during the treatment process to avoid the catalytic effect from decreasing due to decomposition or precipitation. Of course, the present invention is not limited thereto. In other embodiments, when the metal layer 2 is copper, the activation agent may also be a colloidal copper activation solution.
[0060] When the metal layer 2 is nickel, the reagent for the activation treatment adopts an acidic PdCl2 solution; this is because the palladium ions in the acidic PdCl2 solution have extremely strong catalytic activity and can quickly form a layer of catalytic active centers on the surface of the substrate 1, and these active centers can effectively promote the reduction and deposition process of nickel ions. This efficient catalytic action helps to shorten the induction time of chemical nickel plating and improve production efficiency. Secondly, the acidic PdCl2 solution has good adhesion and can enhance the bonding force. Through the activation treatment of the acidic PdCl2 solution, the wettability and activity of the surface of the substrate 1 are improved, and the bonding force between the nickel-plated layer and the substrate 1 is significantly enhanced. This strong bonding force helps to prevent the coating from falling off and improve the reliability and durability of the product. Of course, the present invention is not limited to this. In some other embodiments, when the metal layer 2 is nickel, the reagent for the activation treatment adopts a palladium activator.
[0061] When the metal layer 2 is gold, the reagent for the activation treatment adopts a palladium activation solution. First, due to the high catalytic activity of the palladium activation solution, the palladium ions in the palladium activation solution can act as a catalyst to form an active palladium layer in the circuit wiring groove, which greatly promotes the reduction and deposition of metal ions in the subsequent gold plating process, so that the coating can be evenly and densely covered on the surface of the substrate 1. Moreover, the high catalytic activity of the palladium activation solution helps to reduce the defects and pores in the gold-plated layer, improve the density and uniformity of the gold-plated layer, and thus improve the quality and performance of the gold-plated layer. Second, the palladium activation solution can enhance the bonding between the groove wall of the circuit wiring groove and the gold plating layer: the palladium activation solution can improve the wettability and activity of the surface of the substrate 1, so that the gold plating layer and the substrate 1 form a stronger bonding force, reducing the risk of the coating falling off. Third, the palladium activation solution has good process controllability and is easy to adjust. By adjusting the concentration, temperature, pH value and other process parameters of the palladium activation solution, the catalytic effect and coating quality can be flexibly controlled to meet the needs of different application scenarios. Fourth, the palladium activation solution has good stability. The palladium activation solution has good stability under appropriate conditions, which can ensure the accuracy and consistency of process parameters and reduce fluctuations and uncertainties in the production process. Fifth, the palladium activation solution is environmentally friendly and can reduce pollution. The palladium activation solution can usually be used in a relatively closed environment, reducing pollution to the environment. At the same time, as a precious metal, palladium has high economic value in recycling and reuse. Sixth, the palladium element in the palladium activation solution can improve the performance of the plating layer, and the palladium element in the gold-plated layer can improve the corrosion resistance of the plating layer, so that the gold-plated product can maintain stable performance in a more severe environment. Seventh, the palladium activation solution can also improve the conductivity of the plated gold. For application scenarios that require high conductivity (such as electronic devices), the gold-plated layer treated with palladium activation solution can provide better conductivity.
[0062] In one embodiment, laser engraving is used when making the circuit wiring groove on the substrate 1; this is because the processing accuracy of the laser engraving process can reach 0.02mm, which can meet the high-precision processing requirements of the circuit wiring groove. Secondly, laser engraving uses a non-contact processing method, which will not cause mechanical extrusion or stress on the substrate 1, avoiding material deformation or damage caused by mechanical processing. Moreover, the processing speed is fast, which can significantly improve production efficiency. Of course, the present invention is not limited to this. In some other embodiments, mechanical engraving can also be used when making the circuit wiring groove on the substrate 1.
[0063] It should be noted that the above examples are only used to understand the present application and do not constitute a limitation on the LAP process of the present application. More simple transformations based on this technical concept are all within the scope of protection of the present application.
[0064] The present application also provides a LAP process product, which is prepared using the above-mentioned LAP process.
[0065] The LAP process product provided by the present application can reduce the probability of chemically plating a metal layer on the non-chemically plated area during chemical plating. Compared with the prior art, the beneficial effects of the LAP process product provided by the present application are the same as the beneficial effects of the LAP process provided by the above embodiment, which will not be repeated here.
[0066] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect applications in other related technical fields are included in the patent protection scope of the present application.
Claims
1. A LAP process, characterized in that: The LAP process comprises the following steps: S1, first obtain a substrate; S2, providing a plating resistance paint on the surface of the substrate; S3, making a circuit wiring groove on the surface of the substrate provided with the resist paint; S4, chemically plating a metal layer in the circuit routing groove on the substrate; S5, removing the plating resistance paint on the surface of the substrate.
2. The LAP process according to claim 1, characterized in that The plating resistance paint is disposed on the surface of the substrate by spraying.
3. The LAP process according to claim 1, characterized in that The anti-plating paint is UV paint.
4. The LAP process according to claim 3, characterized in that In step S5, the resist on the surface of the substrate is removed by chemical dissolution.
5. The LAP process according to claim 4, characterized in that The solvent used in the chemical dissolution method is dimethyl adipate reagent or DBE.
6. The LAP process according to claim 1, characterized in that Before performing step S4, the method further includes step S31: activating the substrate on which the circuit wiring grooves are made.
7. The LAP process according to claim 6, characterized in that The metal layer is gold, copper or nickel.
8. The LAP process according to claim 7, characterized in that When the metal layer is copper, the activation treatment reagent is a colloidal palladium activation solution; or When the metal layer is nickel, the reagent for the activation treatment is an acidic PdCl2 solution; or When the metal layer is gold, the reagent for activation treatment is palladium activation solution.
9. The LAP process according to any one of claims 1 to 8, characterized in that: A laser engraving process is used when making circuit wiring grooves on the substrate.
10. A LAP process product, characterized in that: The product is prepared by the LAP process according to any one of claims 1 to 9.