Single-phase liquid cooling server and cooling circulation system

Abstract

The invention relates to a single-phase liquid cooling server and a cooling circulation system. The single-phase liquid cooling server comprises a main machine shell, a jet flow structure, a liquid inlet piece and a liquid outlet piece, the jet flow structure is arranged on the main machine shell, and a cooling medium is arranged in the jet flow structure; the liquid inlet piece is arranged on the main machine shell and connected with the jet flow structure, and the liquid inlet piece is used for driving the cooling medium to be jetted out of the jet flow structure so as to provide jet flow liquid cooling for the interior of the main machine shell; the liquid outlet piece is arranged on the main machine shell, and the cooling medium in the main machine shell is discharged out of the main machine shell through the liquid outlet piece. The jet flow structure carries out heat dissipation on the whole inner cavity, and heat exchange is carried out through the indirect cooling structure, the inner cavity and the outer cavity, so that indirect liquid cooling heat dissipation of the jet flow structure on the second heating element is realized, and liquid cooling heat dissipation is simply and efficiently provided for the single-phase liquid cooling server.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a single-phase liquid-cooled server and a cooling circulation system. Background Art

[0002] With the development of server technology, the trend of air-cooled servers turning to liquid-cooled servers is becoming more and more clear, but there is still a certain degree of difficulty in turning from traditional mature air-cooled servers to liquid-cooled servers. Due to the characteristics of liquid cooling fluids, it is impossible to directly upgrade traditional air-cooled servers, and some changes need to be made to the server to adapt to the characteristics of liquid cooling fluids.

[0003] In traditional technology, the liquid cooling servers that have been put into use include liquid cooling plate servers, spray liquid cooling servers, single-phase immersion liquid cooling servers, phase change immersion liquid cooling servers and other forms of liquid cooling servers. Different forms respond to different market demand pain points and have different focuses. Liquid cooling plate servers cannot cover a large number of dispersed small heat sources with liquid cooling plates or the cost of covering them is too high; the liquid output speed of spray liquid cooling servers is relatively low, so the spray heat dissipation performance is relatively low; single-phase immersion liquid cooling servers cannot focus on cooling high heat flux density heat sources, and have a large one-time demand for cooling fluids and a high investment cost; phase change immersion liquid cooling servers have high requirements for sealing, which greatly increases production and operation costs.

[0004] The various liquid-cooled server forms currently in operation have both obvious advantages and prominent shortcomings. The application of one of the above liquid cooling technologies in various fields can only make corresponding trade-offs. Summary of the invention

[0005] Based on this, a single-phase liquid cooling server and a cooling circulation system are provided to simply and efficiently solve the liquid cooling and heat dissipation problem of high-density servers.

[0006] The embodiment of the first aspect of the present application provides a single-phase liquid cooling server, comprising:

[0007] Main casing; and

[0008] A jet structure is arranged on the main housing, and a cooling medium is built in the jet structure. The jet structure can eject the cooling medium to provide jet liquid cooling for the inside of the main housing, and the cooling medium inside the main housing can be discharged from the main housing.

[0009] According to the single-phase liquid cooling server of the embodiment of the present application, the jet structure jets into the main housing, and the cooling medium quickly exchanges heat with the heating element in the main housing, taking away the heat of the heating element, so that the heating element can dissipate heat through the jet liquid cooling. The single-phase liquid cooling server has a simple overall structure and high heat dissipation efficiency.

[0010] In one embodiment, the main housing is provided with a jet cover plate, and the jet structure is integrated in the jet cover plate. The jet structure is integrated in the jet cover plate. Through this structural design, on the one hand, the overall structure of the single-phase liquid cooling server is more compact and simple, and the jet structure can be quickly adjusted according to different heat source distributions without discarding the cover plate, which is conducive to improving the utilization rate of the workpiece; on the other hand, it is also easy to install, making the installation work more simplified. The jet cover plate can be directly installed to simultaneously complete the installation of the jet structure in the single-phase liquid cooling server.

[0011] In one embodiment, the single-phase liquid cooling server further includes a liquid inlet, which is disposed on the main housing and connected to the jet structure, and is used to drive the cooling medium to be ejected from the jet structure to provide jet liquid cooling for the interior of the main housing. The liquid inlet provides jet power for the jet structure to ensure the jet cooling effect.

[0012] In one embodiment, the jet structure includes a liquid supply channel and a plurality of jet holes, the liquid supply channel is connected to the liquid inlet, and the jet holes are connected to the liquid supply channel and the inside of the main housing. Through the above arrangement, the liquid inlet provides cooling medium for the liquid supply channel, and the cooling medium is ejected into the inner cavity through the jet holes to realize jet liquid cooling.

[0013] In one embodiment, the jet cover plate includes a substrate and a jet plate, the liquid supply channel is arranged on the substrate, and the jet hole is arranged on the jet plate. The liquid supply channel and the jet hole are processed on the substrate and the jet plate respectively, and the jet hole on the jet plate can be processed with different jet hole structures according to the use requirements of different single-phase liquid cooling servers, which saves costs and makes the design and use of the jet cover plate more flexible.

[0014] In one embodiment, a liquid storage tank is provided on the jet plate, and the jet hole is provided in the liquid storage tank. Thus, the liquid storage tank provides a certain liquid storage space for the cooling medium supplied by the liquid supply channel, thereby ensuring the cooling medium usage of the jet hole during normal jetting, reducing the dependence on the stability of the liquid supply of the liquid inlet, and ensuring the jet cooling effect.

[0015] In one of the embodiments, the jet plate has jet areas with multiple jet intensities. The installation positions and heat dissipation requirements of the heating elements in the single-phase liquid cooling server are different. Different jet areas are set in the jet plate in a targeted manner, corresponding to the distribution density of the heating elements, to achieve accurate heat dissipation of the heat source at the lowest cost. For a heat source with high heat flux density, a jet area with high jet intensity is set to correspond to it; for a heat source with low heat flux density, a low jet intensity area is set to correspond to it. Reduce the overall heat dissipation energy consumption and improve the overall PUE (Power Usage Effectiveness) value.

[0016] In one embodiment, in the jet regions with different jet intensities, the arrangement density of the jet holes and / or the structure of the jet holes are different. The jet intensity can be changed by adjusting the arrangement density of the jet holes, and the denser the arrangement density of the jet holes, the higher the jet intensity; the jet intensity of a single jet hole can be changed by adjusting the structure of the jet holes, so that jet regions with the same jet hole density have different jet intensities; the arrangement density of the jet holes and the structure of the jet holes can also be changed simultaneously according to specific usage conditions to obtain jet regions with different jet intensities.

[0017] In one embodiment, the main housing includes a partition, an inner cavity and an outer cavity, the inner cavity and the outer cavity are separated by the partition, and the jet structure jets toward the inner cavity;

[0018] The single-phase liquid-cooled server also includes a first heating element and a second heating element, wherein the first heating element is arranged in the inner cavity, and the second heating element is arranged in the outer cavity. Through the above arrangement, the user can choose to install the heating element in the inner cavity or outer cavity of the single-phase liquid-cooled server according to the use requirements and heat dissipation requirements of different heating elements. The jet structure jets to the inner cavity, and part of the jet will directly jet to the first heating element. The cooling medium quickly exchanges heat with the first heating element, taking away the heat of the first heating element, so that the first heating element can dissipate heat through jet liquid cooling. The jet structure dissipates heat for the inner cavity as a whole, and through the indirect cooling structure, the inner cavity and the outer cavity exchange heat, thereby realizing indirect liquid cooling of the second heating element by the jet structure.

[0019] In one embodiment, the first heating element is configured as an element that can work normally after directly contacting the cooling medium, and the jet structure sprays fluid to the surface of the first type of emitting element. The first heating element is installed in the inner cavity, and no other sealing treatment is required for the first heating element, and it can directly contact the cooling medium. The jet structure directly sprays fluid on its surface, and can quickly exchange heat with the first heating element, further simplifying the internal structure of the single-phase liquid cooling server and further improving the heat dissipation efficiency.

[0020] In one embodiment, the second heating element is configured as an element that affects working performance after contacting the cooling medium. To ensure the normal operation of the second heating element, when it affects working performance after contacting the cooling medium, the second heating element is directly arranged in the outer cavity so that it does not directly contact the cooling medium, but is indirectly cooled through an indirect cooling structure, thereby ensuring that the structure of the single-phase liquid cooling server is simple, can be applied to a variety of different usage requirements, and at the same time ensures the heat dissipation effect.

[0021] In one embodiment, the second heating element is configured as a mechanical hard disk. The mechanical hard disk needs to be frequently plugged in or repaired during use. The mechanical hard disk is installed in the external cavity, on the one hand, to prevent the mechanical hard disk from direct contact with the cooling medium and to enable normal operation, and on the other hand, to facilitate the disassembly and assembly of the mechanical hard disk, which needs to be frequently plugged in or repaired during use.

[0022] In one embodiment, the indirect cooling structure includes a heat dissipation step disposed on the partition, one end face of the heat dissipation step is placed in the inner cavity, and the other end face is placed in the outer cavity, and the jet structure provides jet liquid cooling for the heat dissipation step. The jet structure directly sprays the jet step in the inner cavity to provide jet liquid cooling for the heat dissipation step, and the end face of the heat dissipation step placed in the outer cavity provides indirect cooling to the outer cavity.

[0023] In one embodiment, the outer cavity is provided with a hard disk bracket, the hard disk bracket is used to install the mechanical hard disk, and the hard disk bracket has a hollow liquid cooling cavity built in;

[0024] The heat dissipation step is provided with a liquid inlet slot communicating with the hollow liquid cooling cavity;

[0025] The partition is provided with a reflux port, which is lower than the liquid inlet slit, one end of which is connected to the hollow liquid cooling cavity, and the other end of which is connected to the inside of the inner cavity. The hard disk bracket facilitates the installation of the mechanical hard disk, and at the same time allows the cooling medium to enter the hollow liquid cooling cavity through the liquid inlet slit, so that the mechanical hard disk can be better cooled, further improving the heat dissipation effect in the outer cavity. After the cooling medium in the hollow liquid cooling cavity completes the heat exchange, it flows back to the inner cavity through the reflux port and is discharged from the inner cavity.

[0026] The embodiment of the second aspect of the present application provides a cooling circulation system, comprising:

[0027] A radiator connected to the liquid inlet of the single-phase liquid cooling server as described in any one of the above embodiments;

[0028] A liquid storage tank, connected to the interior of the main housing;

[0029] A pump station connects the radiator and the liquid storage tank.

[0030] In the above-mentioned cooling circulation system, the radiator is connected to the single-phase liquid-cooled server through the liquid inlet, providing the jet structure with cooling medium after heat dissipation and cooling. The cooling medium that is ejected into the inner cavity through the jet structure flows out of the main casing and is recovered into the liquid storage tank. The pump station transports the cooling medium in the liquid storage tank to the radiator, and the cooling medium that has been heat-dissipated and cooled enters the jet structure again through the liquid inlet, and so on and so forth, thereby realizing the recycling of the cooling medium, saving energy, and ensuring the jet liquid cooling effect of the single-phase liquid-cooled server.

[0031] In one embodiment, the air pressure in the liquid storage tank is lower than the air pressure inside the main housing. The air pressure in the liquid storage tank is negative pressure relative to the air pressure in the main housing, and there is a reflux pressure difference between the liquid storage tank and the inner cavity of the single-phase liquid cooling server, which makes the reflux of the cooling medium smoother, reduces the amount of liquid stored in the inner cavity, reduces the amount of liquid used and the weight of the cooling medium in the entire single-phase liquid cooling server, and reduces the operating cost.

[0032] In one embodiment, a filter is provided between the radiator and the jet structure, and the filter provides filtration for the cooling medium. The filter filters the cooling medium entering the jet structure, filters impurities in the cooling medium, improves the purity of the cooling medium, and improves the operating stability of the single-phase liquid cooling server. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a cross-sectional view of a single-phase liquid cooling server according to an embodiment of the present application.

[0034] Figure 2 This is a schematic diagram of the structure of a single-phase liquid cooling server according to an embodiment of the present application.

[0035] Figure 3 This is a structural schematic diagram of a single-phase liquid cooling server from another perspective of an embodiment of the present application.

[0036] Figure 4 This is a schematic diagram of the structure after the jet cover plate is removed in a single-phase liquid cooling server according to an embodiment of the present application.

[0037] Figure 5 This is a schematic diagram of the exploded structure of a single-phase liquid cooling server according to an embodiment of the present application.

[0038] Figure 6 A partial cross-sectional view of a jet cover plate of a single-phase liquid-cooled server according to an embodiment of the present application.

[0039] Figure 7 This is a schematic diagram of the exploded structure of a jet cover plate of a single-phase liquid cooling server according to an embodiment of the present application.

[0040] Figure 8 This is a schematic structural diagram of a liquid supply channel on a substrate of a single-phase liquid cooling server according to an embodiment of the present application.

[0041] Fig. 9 This is a cross-sectional view of different jet hole structures of a single-phase liquid cooling server according to an embodiment of the present application.

[0042] Fig.10 This is a schematic diagram of the partial structure of a single-phase liquid cooling server according to an embodiment of the present application in which the jet hole is a sunflower-shaped hole.

[0043] Fig.11This is a structural schematic diagram of a hard disk bracket of a single-phase liquid cooling server according to an embodiment of the present application.

[0044] Fig.12 A partial cross-sectional view of a single-phase liquid-cooled server according to an embodiment of the present application showing that a hollow liquid-cooling cavity in a hard disk bracket is connected to an inner cavity.

[0045] Fig.13 A partial cross-sectional view of a hollow liquid cooling cavity in a hard disk bracket of a single-phase liquid cooling server according to an embodiment of the present application.

[0046] Fig.14 This is a schematic diagram of the structure of a single-phase liquid cooling server according to an embodiment of the present application.

[0047] Fig.15 This is a structural schematic diagram of a single-phase liquid cooling server according to an embodiment of the present application when a constant pressure liquid supply tank is provided.

[0048] Reference numerals:

[0049] 1. Single-phase liquid cooling server;

[0050] 11. Main housing; 111. Partition; 1111. Heat dissipation step; 1111a. Liquid inlet; 1112. Return port; 112. Inner cavity; 113. Outer cavity; 1131. Hard disk bracket; 1311a. Hollow liquid cooling cavity; 114. Sealing ring; 115. Jet cover plate; 1151. Base plate; 1152. Jet plate; 1152a. Liquid storage tank; 116. Liquid inlet; 1161. Liquid inlet; 117. Liquid outlet; 1171. Liquid outlet; 118. Front panel; 1181. Front panel adapter plate; 119. Rear I / O board;

[0051] 12. first heating element; 121. main board; 122. memory module; 123. GPU; 124. expansion card; 125. CPU; 126. rear I / O adapter board;

[0052] 13. A second heating element; 131. A mechanical hard disk;

[0053] 14. jet structure; 141. liquid supply channel; 1411. main pipe; 1412. liquid distribution branch pipe; 142. jet hole; 1421. funnel-shaped hole; 1422. hourglass-shaped hole; 1423. sunflower-shaped hole;

[0054] 2. Cooling circulation system;

[0055] 21. Radiator;

[0056] 22. Liquid storage tank; 221. Air pressure regulating air pump; 222. Liquid filling port;

[0057] 23. Pumping station;

[0058] 24. Filter;

[0059] 25. Liquid inlet flow regulating valve;

[0060] 26. Waste heat recovery system;

[0061] 27. High temperature compressor heat exchanger;

[0062] 28. Pressure accumulator;

[0063] 29. Constant pressure liquid supply tank; 291. Constant pressure air pump. DETAILED DESCRIPTION

[0064] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0065] In the description of the present application, it should be understood that if the terms "length", "width", "thickness", "up", "down", "front", "back", "top", "bottom", "inside", "outside", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0066] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0067] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0068] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0069] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. If any.

[0070] See also Figure 1 and Figure 2 , Figure 1 A cross-sectional view of a single-phase liquid cooling server 1 according to an embodiment of the present application is shown. Figure 2 The schematic diagram of the structure of a single-phase liquid cooling server 1 of an embodiment of the present application is shown. The embodiment of the first aspect of the present application proposes a single-phase liquid cooling server 1, comprising a main housing 11 and a jet structure 14, wherein the jet structure 14 is arranged on the main housing 11, and the jet structure 14 has a cooling medium built therein, and the jet structure 14 can eject the cooling medium to provide jet liquid cooling for the inside of the main housing 11, and the cooling medium inside the main housing 11 can be discharged from the main housing 11.

[0071] According to the single-phase liquid-cooled server 1 of the embodiment of the present application, the jet structure 14 jets into the main housing 11, and the cooling medium quickly exchanges heat with the heating element in the main housing 11, taking away the heat of the heating element, so that the heating element can dissipate heat through the jet liquid cooling. The liquid inlet 116 provides the cooling medium for the jet structure 14, and the liquid outlet 117 discharges the cooling medium in the main housing 11, thereby realizing the overall single-phase liquid cooling of the single-phase liquid-cooled server 1, with a simple overall structure and high heat dissipation efficiency.

[0072] In some embodiments, the single-phase liquid cooling server 1 further includes a liquid inlet 116 and a liquid outlet 117. The liquid inlet 116 is disposed on the main housing 11 and connected to the jet structure 14. The liquid inlet 16 is used to drive the cooling medium to be ejected from the jet structure 14 to provide jet liquid cooling for the interior of the main housing 11. The liquid outlet 117 is disposed on the main housing 11, and the cooling medium inside the main housing 11 is discharged from the main housing 11 through the liquid outlet 117. The liquid inlet 116 provides cooling medium for the jet structure 14, and the liquid outlet 117 discharges the cooling medium in the main housing 11, thereby ensuring the jet cooling effect and improving the cooling efficiency.

[0073] In some embodiments, the cooling medium is configured as a high-boiling-point insulating fluorinated liquid with a boiling point above 100°C, which can inhibit the phase change of the working fluid and reduce the dissipation of the working fluid. Through the jet structure 14, a high-speed jet is applied to the surface of the first heating element 12 to achieve liquid cooling. In some embodiments, the jet speed of the jet structure 14 is higher than 10m / s, which can effectively reduce the liquid boundary layer on the heat exchange surface of the first heating element 12, and simply and efficiently achieve liquid cooling of the high-density single-phase liquid-cooled server 1.

[0074] The main housing 11 includes a partition 111, an inner cavity 112 and an outer cavity 113. The inner cavity 112 and the outer cavity 113 are separated by the partition 111, and the jet structure 14 jets fluid toward the inner cavity 112. The one-way liquid cooling server 1 also includes a first heating element 12 and a second heating element 13. The first heating element 12 is placed in the inner cavity 112, and the second heating element 13 is placed in the outer cavity 113.

[0075] Through the above arrangement, the user can choose to install the heating element in the inner cavity 112 or the outer cavity 113 of the single-phase liquid cooling server 1 according to the use requirements and heat dissipation requirements of different heating elements. The jet structure 14 jets the inner cavity 112, and part of the jet directly jets the first heating element 12. The cooling medium quickly exchanges heat with the first heating element 12, taking away the heat of the first heating element 12, so that the first heating element 12 can dissipate heat through jet liquid cooling. The jet structure 14 dissipates heat for the inner cavity 112 as a whole, and through the indirect cooling structure, the inner cavity 112 and the outer cavity 113 exchange heat, thereby realizing indirect liquid cooling of the second heating element 13 by the jet structure 14.

[0076] See also Figure 2 and Figure 3 , Figure 3 The schematic diagram of the structure of the single-phase liquid cooling server 1 of one embodiment of the present application from another perspective is shown. A rear I / O plate 119 is provided on one end face of the main housing 11, and a liquid inlet 116 and a liquid outlet 117 are provided on the same end face, which is convenient for connecting with external pipelines and improving the compactness of the structure. A front panel 118 is provided on the other end face of the main housing 11. A second heating element 1313 installed in the outer cavity 113 is provided on the end face.

[0077] The single-phase liquid-cooled server 1 in the embodiment of the present application continues the appearance structure of the traditional single-phase liquid-cooled server 1, while continuing the existing rack-type deployment method, retaining the usage habits of the existing air-cooled single-phase liquid-cooled server 1 to the greatest extent.

[0078] See also Figure 4 , Figure 4 The schematic diagram of the structure of the single-phase liquid cooling server 1 after removing the jet cover 115 in an embodiment of the present application is shown. In some embodiments, the first heating element 12 is configured as an element that can work normally after directly contacting the cooling medium, and the jet structure 14 jets toward the surface of the first type of emitting element.

[0079] In some embodiments, the first heating element 12 includes but is not limited to a motherboard 121, a memory bar 122, a GPU 123, an expansion card, a CPU 125, and a rear I / O adapter board 126. The first heating element 12 has a high heating density and can be directly installed in the inner cavity 112. No other sealing treatment is required for the first heating element 12, which can directly contact the cooling medium. The jet structure 14 directly jets the surface thereof, and can quickly exchange heat with the first heating element 12, further simplifying the internal structure of the single-phase liquid cooling server 1 and further improving the heat dissipation efficiency.

[0080] See also Figure 5 , Figure 6 and Figure 7 , Figure 6 A schematic diagram of the exploded structure of a single-phase liquid cooling server 1 according to an embodiment of the present application is shown. Figure 7 A partial cross-sectional view of a jet cover plate 115 of a single-phase liquid cooling server 1 according to an embodiment of the present application is shown. In some embodiments, the main housing 11 is provided with a jet cover plate 115, and the jet structure 14 is integrated in the jet cover plate 115. The jet structure 14 is integrated in the jet cover plate 115. Through this structural design, on the one hand, the overall structure of the single-phase liquid cooling server 1 is made more compact and simple, which is conducive to improving the utilization rate of the workpiece; on the other hand, it is also easy to install, making the installation work more simplified. The jet cover plate 115 can be directly installed to simultaneously complete the installation of the jet structure 14 in the single-phase liquid cooling server 1.

[0081] like Figure 5 As shown, a sealing ring 114 is provided between the inner cavity 112 and the jet cover plate 115 to achieve sealing isolation. Since the cooling medium is a single-phase heat exchange and does not generate steam, a high positive pressure will not be generated in the main housing 11, and the sealing is not easily damaged. Therefore, the sealing of the whole machine can be achieved through the sealing ring 114, and the jet cover plate 115 can be removed, so that the single-phase liquid cooling server 1 has flexible replacement and maintenance.

[0082] The external power supply and input / output interface are connected via the front panel adapter plate 1181. The single-phase liquid-cooled server 1 can be deployed in a blade structure or in a rack-shaped single-phase liquid-cooled server 1. The main housing 11 is supported by reinforced aluminum material, so that the sealing structure is not easily deformed during installation, thereby ensuring the overall sealing of the single-phase liquid-cooled server 1.

[0083] See also Figure 7 and Figure 8 , Figure 8 The exploded structural schematic diagram of the jet cover plate 115 of the single-phase liquid cooling server 1 in one embodiment of the present application is shown. In some embodiments, the jet structure 14 includes a liquid supply channel 141 and a plurality of jet holes 142, the liquid supply channel 141 is connected to the liquid inlet 116, and the jet holes 142 are connected to the liquid supply channel and the inner cavity 112. Through the above arrangement, the liquid inlet 116 provides cooling medium for the liquid supply channel 141, and the cooling medium is ejected into the inner cavity 112 through the jet holes 142 to realize the jet liquid cooling operation.

[0084] See also Figure 6 , Figure 6 The schematic diagram of the structure of the liquid supply channel 141 on the substrate 1151 of the single-phase liquid cooling server 1 of an embodiment of the present application is shown. The liquid supply channel 141 includes a main pipe 1411 and a plurality of liquid distribution branches 1412. The main pipe 1411 is connected to the liquid inlet 116 for liquid inlet. A plurality of liquid distribution straight pipes are connected to the main pipe 1411 for liquid distribution of the cooling medium in the main pipe 1411. In some embodiments, the substrate 1151 is rectangular, the main pipe 1411 is arranged near the edge of the main pipe 1411 along the length direction of the substrate 1151, and the liquid distribution branches 1412 are evenly arrayed along the width direction of the substrate 1151. The main pipe 1411 and the liquid distribution branches 1412 cooperate to form a comb-like shape to transport the cooling medium to every part of the substrate 1151 as much as possible. It can be understood that the liquid supply channel 141 with different shapes and / or densities can also be designed according to specific usage requirements.

[0085] See also Figure 7 and Figure 8In some embodiments, the jet cover plate 115 includes a substrate 1151 and a jet plate 1152, the liquid supply channel 141 is arranged on the substrate 1151, and the jet hole 142 is arranged on the jet plate 1152. The liquid supply channel 141 and the jet hole 142 are processed on the substrate 1151 and the jet plate 1152 respectively, and the jet hole 142 on the jet plate 1152 can be processed with different jet hole 142 structures according to the use requirements of different single-phase liquid cooling servers 1, which saves costs and makes the design and use of the jet cover plate 115 more flexible.

[0086] See also Figure 7 and Figure 8 In some embodiments, a liquid reservoir 1152a is provided on the jet plate 1152, and the jet hole 142 is provided in the liquid reservoir 1152a. Thus, the liquid reservoir 1152a provides a certain liquid storage space for the cooling medium supplied by the liquid supply channel 141, ensures the cooling medium usage of the jet hole 142 during normal jetting, reduces the dependence on the stability of the liquid supply of the liquid inlet 116, and ensures the jet cooling effect.

[0087] Specifically, in some embodiments, the substrate 1151 is made of aluminum alloy, and the substrate 1151 has a concave structure, and the jet plate 1152 is buckled inside. The substrate 1151 improves the structural strength of the overall jet cover 115, and is also better sealed and connected to the main housing 11. In some embodiments, the jet plate 1152 is made of plastic. Specifically, it is made of a plastic plate with a thickness of more than 4 mm, and the liquid storage tank 1152a is processed according to the distribution of the heat source, which is used to take liquid from the liquid distribution branch 1412. The jet plate 1152 is embedded in the substrate 1151 and fixed by screws. This kind of separate and detachable design of the substrate 1151 and the jet plate 1152 can enhance the versatility of the jet cover 115. Because the single-phase liquid-cooled server 1 has different main functions, the internal motherboard 121 design and electronic component layout will be greatly different. When the heat source distribution changes, only the plastic jet plate 1152 needs to be replaced, and the base plate 1151 can be retained and used, which greatly improves the versatility of the jet cover plate 115 and reduces the overall cost.

[0088] See also Figure 7 and Figure 8 In some embodiments, the jet plate 1152 has jet areas with various jet intensities. The installation positions and heat dissipation requirements of the heating elements in the single-phase liquid cooling server 1 are different. Different jet areas are set in the jet plate 1152 in a targeted manner, corresponding to the distribution density of the heating elements. Accurate heat dissipation of the heat source is achieved at the lowest cost. For a heat source with high heat flux density, a jet area with high jet intensity is set to correspond to it; for a heat source with low heat flux density, a low jet intensity area is set to correspond to it. Reduce the overall heat dissipation energy consumption and improve the overall PUE value.

[0089] See also Figure 8, Fig. 9 and Fig.10 , Fig. 9 A cross-sectional view of different jet hole 142 structures of a single-phase liquid cooling server 1 according to an embodiment of the present application is shown. Fig.10 The jet hole 142 of the single-phase liquid cooling server 1 of an embodiment of the present application shows a partial structural schematic diagram of a sunflower-shaped hole 1423. In some embodiments, in the jet regions of different jet intensities, the arrangement density of the jet holes 142 and / or the structure of the jet holes 142 are different. The jet holes 142 may be provided with funnel-shaped holes 1421, hourglass-shaped holes 1422, or sunflower-shaped holes 1423, etc., depending on the structure, without specific limitation.

[0090] The jet intensity can be changed by adjusting the arrangement density of the jet holes 142. The denser the arrangement density of the jet holes 142, the higher the jet intensity. The jet intensity of a single jet hole 142 can be changed by adjusting the structure of the jet holes 142, so that jet areas with the same density of jet holes 142 have different jet intensities. The arrangement density of the jet holes 142 and the structure of the jet holes 142 can also be changed simultaneously according to specific usage to obtain jet areas with different jet intensities.

[0091] Specifically, the jet structure 14 is integrated in the jet cover 115 and is arranged in a targeted manner according to the density of the heat source distribution in the main casing 11 to achieve accurate heat dissipation of the heat source at the lowest cost. The jet is mainly used for heat sources with high heat flux density, such as the heat dissipation of CPU125 and GPU123 chips; for low heat flux heat sources such as expansion cards, solid-state drives, power supplies, etc., the density of the jet holes 142 can be reduced or the outlet structure of the jet holes 142 can be improved to atomize the liquid and spray it onto the surface of the low heat flux source for heat dissipation, thereby reducing the use of liquid working fluids, reducing heat dissipation energy consumption, and improving the overall PUE value.

[0092] See also Figure 4 and Figure 7 In some embodiments, the liquid inlet 116 includes a liquid inlet 1161 disposed on the jet cover plate 115, and the liquid inlet 1161 is connected to the liquid supply channel 141; the liquid outlet 117 includes a liquid outlet 1171 disposed on the main housing 11, and the liquid outlet 1171 is connected to the inner cavity 112. Liquid is supplied to the liquid supply channel 141 in the jet cover plate 115 through the liquid inlet 1161, and the cooling medium in the inner cavity 112 leaves the inner cavity through the liquid outlet 1171, thereby realizing circulation.

[0093] In some embodiments, the second heating element 13 is configured as an element that affects working performance after contacting the cooling medium. To ensure the normal operation of the second heating element 13, when it affects working performance after contacting the cooling medium, the second heating element 13 is directly set in the outer cavity 113 so that it does not directly contact the cooling medium, but achieves indirect cooling through an indirect cooling structure, thereby ensuring that the structure of the single-phase liquid cooling server 1 is simple, can be applied to a variety of different usage requirements, and at the same time ensures the heat dissipation effect.

[0094] See also Figure 5 In some embodiments, the second heating element 13 is configured as a mechanical hard disk 131. The mechanical hard disk 131 needs to be frequently plugged in or repaired during use. The mechanical hard disk 131 is installed in the outer cavity 113. On the one hand, it is to prevent the mechanical hard disk 131 from directly contacting the cooling medium and to work normally. On the other hand, it is convenient for the disassembly and assembly of the mechanical hard disk 131. The mechanical hard disk 131 needs to be frequently plugged in or repaired during use.

[0095] See also Fig.11 and Fig.12 , Fig.11 A schematic structural diagram of a hard disk bracket 1131 of a single-phase liquid cooling server 1 according to an embodiment of the present application is shown. Fig.12 A partial cross-sectional view of a single-phase liquid-cooled server 1 in an embodiment of the present application showing that the hollow liquid-cooling cavity 1311a in the hard disk bracket 1131 is connected to the inner cavity 112 is shown. In some embodiments, the indirect cooling structure includes a heat dissipation step 1111 disposed on the partition 111, one end face of the heat dissipation step 1111 is disposed in the inner cavity 112, and the other end face is disposed in the outer cavity 113, and the jet structure 14 provides jet liquid cooling for the heat dissipation step 1111. The jet structure 14 directly jets the jet step in the inner cavity 112 to provide jet liquid cooling for the heat dissipation step 1111, and the end face of the heat dissipation step 1111 disposed in the outer cavity 113 provides indirect cooling to the outer cavity 113.

[0096] See also Fig.13 , Fig.13A partial cross-sectional view of a single-phase liquid-cooled server 1 in an embodiment of the present application, which embodies a hollow liquid-cooling cavity 1311a in a hard disk bracket 1131. In some embodiments, the outer cavity 113 is provided with a hard disk bracket 1131, and the hard disk bracket 1131 is used to install a mechanical hard disk 131, and the hard disk bracket 1131 has a hollow liquid-cooling cavity 1311a built in it. The mechanical hard disk 131 is installed in the single-phase liquid-cooled server 1 through the hard disk bracket 1131, and the heat of the mechanical hard disk 131 is introduced into the inner cavity 112 by heat conduction against the side wall to achieve indirect cooling. When the heat conduction path of the mechanical hard disk 131 is too long, the hard disk bracket 1131 is provided with a hollow liquid-cooling cavity 1311a. Through the hollow structure, the jet single-phase refrigerant enters the interior of the hard disk bracket 1131, so that the hard disk bracket 1131 has an effect similar to a liquid cooling plate, dissipating heat from the mechanical hard disk 131 and the outer cavity 113, further improving the heat dissipation and cooling effect of the single-phase liquid-cooled server 1.

[0097] See also Figure 4 The heat dissipation step 1111 is provided with a liquid inlet slit 1111a connected to the hollow liquid cooling cavity 1311a; the partition 111 is provided with a reflux port 1112, the reflux port 1112 is lower than the liquid inlet slit 1111a, one end of the reflux port 1112 is connected to the hollow liquid cooling cavity 1311a, and the other end is connected to the inside of the inner cavity 112. The hard disk bracket 1131 facilitates the installation of the mechanical hard disk 131, and at the same time allows the cooling medium to enter the hollow liquid cooling cavity 1311a through the liquid inlet slit 1111a, so that the mechanical hard disk 131 can be better cooled, further improving the heat dissipation effect in the outer cavity 113. After the heat exchange of the cooling medium in the hollow liquid cooling cavity 1311a is completed, it flows back to the inner cavity 112 through the reflux port 1112 and is discharged by the liquid outlet 117 in the inner cavity 112.

[0098] First, in traditional technology, liquid cooling plate servers are limited by the shape of the liquid cooling plate and the limitations of the connecting pipes. For a large number of dispersed heat sources, the liquid cooling plate cannot cover them. If all are covered, the covering cost will be too high. Therefore, the liquid cooling plate can only solve the heat dissipation problem of a small number of concentrated heat sources. For other small heat sources and heat sources that are inconvenient to install liquid cooling plates, such as expansion cards, air cooling is still used. Therefore, the liquid cooling plate server still needs to be equipped with a fan, which is actually a semi-liquid cooling server. In view of this, the heat dissipation and energy saving effect of the liquid cooling plate server is poor, and the PUE value can only be between 1.2-1.3.

[0099] The single-phase liquid-cooled server 1 of the embodiment of the present application is different from the liquid-cooled plate server. By setting the jet structure 14, different jet areas are set in the jet plate 1152 in a targeted manner, corresponding to the distribution density of the heating elements, and accurate heat dissipation of the heat source is achieved at the lowest cost. There is no need to install a fan. It is a fully liquid-cooled single-phase liquid-cooled server 1 with a simple structure and good heat dissipation and energy-saving effect. The single-phase liquid-cooled server 1 can meet the heat dissipation requirements of all heating elements in the single-phase liquid-cooled server 1, including the mechanical hard disk 131, completely remove the fan, and achieve an overall improvement in the overall PUE of the data center.

[0100] Secondly, in the traditional technology, the main solution for the spray liquid cooling server put into use is to change the air-cooled server 1 into a spray liquid cooling server. The spray form is similar to a shower, the liquid discharge speed is relatively low, and the spray heat dissipation performance is low, resulting in limited improvement in the performance of the spray liquid cooling server compared to air cooling; the casing sealing design is poor and cannot be completely sealed, and the mineral oil has strong wettability. After a period of use, it is easy to cause an oil layer on the outer shell of the spray liquid cooling server, which is not easy to clean. All spray liquid cooling servers are quite troublesome to maintain, which is a major test for after-sales maintenance.

[0101] The single-phase liquid-cooled server 1 of the embodiment of the present application is different from the spray liquid-cooled server. It sprays the cooling medium through the spray structure, and the liquid outlet speed is high, so as to achieve the effect of spraying and greatly improve the heat dissipation efficiency. The permissible single cabinet power density is higher. In addition, jet cooling allows a higher upper limit temperature of the liquid inlet, and less resources such as water or electricity are required for heat dissipation, and the overall PUE value is also higher. The single-phase liquid-cooled server 1 of the embodiment of the present application has better sealing performance and adopts a high-boiling-point fluorinated liquid working fluid, which is a liquid-phase refrigerant with low working fluid dissipation, easy to clean, and lower operation and after-sales maintenance costs. And the cooling medium only works in the inner cavity 112 of the single-phase liquid-cooled server 1, and will not contaminate the outer shell of the single-phase liquid-cooled server 1, which is convenient for after-sales and maintenance.

[0102] Thirdly, in traditional technology, the implementation form of single-phase immersion liquid cooling server is to install the server without the heat dissipation structure into a tank full of liquid. The coolant immerses all heat source components and relies on liquid convection heat exchange to take away the heat from the heat source. This form subverts the rack structure, but is limited by the cooling method. It is impossible to focus on cooling the heat source with high heat flux density. It belongs to large-scale water flooding liquid cooling. Therefore, the heat dissipation efficiency is not much improved compared to the air cooling method, and the performance improvement of the single-phase immersion liquid cooling server is limited; the single-phase immersion liquid cooling server is deployed in a horizontal water tank and is completely immersed in the liquid. Therefore, the one-time demand for cooling medium is large and the investment cost is high; the use of a large amount of liquid greatly increases the weight of the whole machine, puts forward better requirements on the strength of the infrastructure structure, and the construction cost is high.

[0103] The single-phase liquid-cooled server 1 of the embodiment of the present application is different from the single-phase immersion liquid-cooled server. The jet structure 14 is used to focus on cooling the high heat flux density heat source. The power density of the jet cooling single cabinet is higher, the use of cooling medium is greatly reduced, the investment cost is reduced, the overall weight is reduced, the requirement for the strength of the infrastructure structure is low, the construction cost is reduced, and the cooling effect is significantly improved.

[0104] Finally, in traditional technology, the mainstream application forms of phase change immersion liquid cooling servers include the same horizontal groove structure as single-phase immersion liquid cooling, and also the rack blade phase change immersion liquid cooling server structure. Regardless of the structural form, the essence of phase change heat dissipation of phase change immersion liquid cooling servers is to immerse the heat-generating electronic components in a low-temperature phase change working fluid. The working fluid will spontaneously change from liquid to gas on the surface of the heat source to take away the heat. Since the boiling point of the working fluid is generally around 50°C, it is very easy to volatilize. Therefore, in order to avoid the dissipation of the working fluid, the equipment housing needs to be sealed. Since the gaseous working fluid has strong permeability, it costs a high price to seal the equipment. In addition, the unit price of the phase change working fluid is high and the amount is also large. Although phase change heat dissipation can solve the heat dissipation needs of high heat flux heat sources, the construction and use costs are relatively high, which is difficult for general customers to accept; the working fluid and the electronic equipment are sealed in a shell, and the residual solid particles on the motherboard 121 will flow at different positions of the equipment with the convection of the working fluid. If there is a conductor, it is a risk to the electronic equipment and it is easy to cause a circuit short circuit failure.

[0105] The single-phase liquid cooling server 1 of the embodiment of the present application is different from the phase change immersion liquid cooling server. It uses a single-phase cooling medium. The jet cooling heat dissipation capacity is equivalent to that of the phase change immersion liquid cooling server. The heat dissipation capacity at the ideal liquid inlet temperature can even be higher than that of the phase change liquid cooling. Jet cooling heat dissipation uses an insulating fluorinated liquid with a boiling point higher than 100°C, and does not rely on phase change heat dissipation, so the system sealing level can be one level lower than the phase change liquid cooling sealing level. The high boiling point fluorinated liquid is used in small quantities and has a low unit price. The overall equipment weight is low, so the overall equipment investment cost is lower; in addition, the phase change immersion liquid cooling server has liquid working fluid entering and gaseous working fluid exiting. Impurities enter the single-phase liquid cooling server 1 equipment and are difficult to discharge. The clean liquid working fluid in the single-phase liquid cooling server 1 flushes the heating element, and the liquid working fluid flows out of the single-phase liquid cooling server 1, continuously taking away and filtering the impurities, making the system cleaner, with a lower failure rate caused by impurities and lower operating costs.

[0106] In summary, the single-phase liquid-cooled server 1 of the embodiment of the present application can take into account various requirements of the liquid-cooled server without obvious shortcomings, has a simple structure, and has low heat dissipation energy consumption. The single-phase liquid-cooled server 1 has high performance, good maintainability, and controllable costs.

[0107] See also Fig.14 , Fig.14The schematic diagram of the structure of a single-phase liquid cooling server 1 according to an embodiment of the present application is shown. The embodiment of the second aspect of the present application proposes a cooling circulation system 2, including a radiator 21, a liquid storage tank 22 and a pump station 23. The radiator 21 is connected to the liquid inlet 116 of the single-phase liquid cooling server 1 in any of the above embodiments. The liquid storage tank 22 is connected to the liquid outlet 117, and the pump station 23 connects the radiator 21 and the liquid storage tank 22.

[0108] In the above-mentioned cooling circulation system 2, the radiator 21 is connected to the single-phase liquid-cooled server 1 through the liquid inlet 116, providing the jet structure 14 with a cooling medium after heat dissipation and cooling. The cooling medium ejected into the inner cavity 112 through the jet structure 14 is recovered into the liquid storage tank 22 through the liquid outlet 1171. The pump station 23 transports the cooling medium in the liquid storage tank 22 to the radiator 21. The cooling medium after heat dissipation and cooling enters the jet structure 14 again through the liquid inlet 116, and so on and so forth, thereby realizing the recycling of the cooling medium, saving energy, and ensuring the jet liquid cooling effect of the single-phase liquid-cooled server 1.

[0109] Compared with the traditional technology, the cooling circulation system 2 in the embodiment of the present application also needs to install a CDU (Coolant Distribution Unit) in the computer room, and connect the CDU between the heat source of the single-phase liquid-cooled server 1 and the radiator 21, which belongs to a two-stage indirect heat exchange system. However, the present application uses a single-phase cooling medium. The jet heat dissipation of the single-phase liquid-cooled server 1 has a strong heat dissipation capacity, so the maximum liquid inlet temperature requirement becomes lower. There is no need to install a CDU. The cooling medium cooled by the radiator 21 can be directly delivered to the single-phase liquid-cooled server 1 for use, which simplifies the structure of the cooling circulation system 2 and achieves the effect of solving the cost problem. Compared with the two-stage indirect heat exchange system with two working fluids, this single-stage heat exchange system can save a first-stage heat exchange temperature difference, so while saving equipment and reducing investment costs, it also reduces the difficulty of heat dissipation and saves heat dissipation energy consumption.

[0110] See also Fig.14 In some embodiments, the air pressure in the liquid storage tank 22 is lower than the air pressure inside the main housing 11. In some embodiments, the liquid storage tank 22 is connected to an air pressure regulating air pump 221, and the air pressure regulating air pump 221 makes the liquid storage tank 22 negatively pressurized. When the liquid storage tank 22 is negatively pressurized, there is a reflux pressure difference between the liquid storage tank 22 and the inner cavity 112 of the single-phase liquid cooling server 1, which makes the reflux of the cooling medium smoother, reduces the amount of liquid stored in the inner cavity 112, reduces the amount and weight of the cooling medium in the entire single-phase liquid cooling server 1, and reduces the operating cost.

[0111] In some embodiments, the liquid storage tank 22 is disposed at a position lower than the inner cavity 112, so that the cooling medium in the inner cavity 112 can be quickly discharged under the action of gravity and negative pressure suction force. This makes it possible to keep very little cooling medium in the inner cavity 112, and expose the heating element to the gaseous medium as much as possible, thereby reducing the outflow resistance of the jet.

[0112] In some embodiments, during the operation of the system, a small amount of cooling medium loss accumulates and causes the amount of liquid in the cooling circulation system 2 to decrease continuously. In order to ensure the stable operation of the cooling circulation system 2, the liquid storage tank 22 is provided with a liquid replenishing port 222, through which the liquid storage tank 22 is replenished, and then the entire cooling circulation system 2 is replenished. This makes the liquid level in the liquid storage tank 22 highly stable, so that the liquid inlet stability of the pump station 23 is guaranteed.

[0113] In some embodiments, an electronic liquid level meter is provided in the liquid storage tank 22 . When the liquid level is lower than a preset lower limit, the valve at the liquid replenishing port 222 is opened to replenish the liquid in the liquid storage tank 22 .

[0114] In some embodiments, the pump station 23 is a constant pressure pump station, which is the power system of the entire cooling circulation system 2. The pump station 23 is composed of a series of variable frequency booster pumps and a constant pressure control system in parallel. By monitoring the outlet pressure of the pump station 23 and according to the pressure parameter feedback, the control system adjusts the number of pumps in operation and the operating frequency of the pumps to ensure the stability of the pump outlet pressure. In some embodiments, a pressure accumulator 28 is provided in the cooling circulation system 2. The pressure accumulator 28 is connected between the single-phase liquid cooling server 1 and the radiator 21 to balance the pressure fluctuations in the system caused by the fluctuations in the power system and stabilize the liquid pressure in the pipeline.

[0115] The cooling circulation system 2 also includes a waste heat recovery system 26, which is connected between the liquid storage tank 22 and the radiator 21. The waste heat recovery system 26 includes a waste heat heating heat exchanger, one end of which is connected to the liquid storage tank 22, and the other end is connected to the radiator 21. A valve is provided on the pipeline connecting the waste heat heating heat exchanger and the liquid storage tank 22, and another valve is provided between the pipeline connecting the waste heat heating heat exchanger and the radiator 21. When the weather is cold, the waste heat recovery system 26 can utilize the heat generated by the single-phase liquid cooling server 1, and recover the heat through the waste heat heating heat exchanger to supply the building or the building that needs to be kept warm, so as to improve the energy utilization rate of the data center. This waste heat recovery system 26 can be installed or not. According to the waste heat demand, the waste heat recovery of the two valves and the opening of the radiator 21 pipeline valve are controlled to realize the waste heat recovery on demand and reduce the heat dissipation energy consumption.

[0116] The radiator 21 includes two combinations, and the configuration of the radiator 21 is mainly based on water resources and ambient temperature. Specifically, for the southern region where water resources are relatively sufficient, it is only necessary to configure the radiator 21 as a closed cooling tower to meet the heat dissipation needs throughout the year, without the intervention of refrigeration equipment. This is due to the simplification of jet cooling and circulation systems. The jet heat dissipation of the single-phase liquid-cooled server 1 has a strong heat dissipation capacity, so the maximum inlet liquid temperature requirement becomes lower, and the maximum inlet liquid temperature can be allowed to reach 55°C. Most of the time throughout the year, pure air cooling can be used to achieve heat dissipation. For abnormally high temperature weather, it can be achieved by cooling by spraying water.

[0117] Another type of radiator 21 is often used in the arid and rainy north or northwest, where water resources are scarce. It mainly relies on air-cooled heat exchangers. If the environment has abundant cold resources, the high-temperature compressor heat exchanger 27 can be omitted, and the system heat dissipation can be completed by relying solely on the air-cooled radiator 21, such as Zhangbei, Inner Mongolia. For extremely high temperature areas such as the northwest, a high-temperature compressor heat exchanger 27 can be added as needed to ensure safe and efficient operation of the equipment throughout the year.

[0118] In order to further save the heat dissipation energy consumption of the single-phase liquid cooling server 1 system, according to the size of the single-phase liquid cooling server 1 operating load, that is, the change in the maximum temperature of the electronic components in the entire cabinet, a flow control valve is set on the cabinet liquid inlet pipeline to ensure that the entire equipment can adjust the flow supply according to the size of the operating load to ensure the minimum heat dissipation energy consumption. At present, due to the increase in the size of the control valve, only cabinet-level flow control can be achieved. If a smaller flow control valve is available, the cabinet-level flow control can be replaced by the control valve of the single-phase liquid cooling server 1.

[0119] In some embodiments, a filter 24 is provided between the radiator 21 and the jet structure 14, and the filter 24 provides filtration for the cooling medium. The filter 24 filters the cooling medium entering the jet structure 14, filters out impurities in the cooling medium, improves the purity of the cooling medium, and improves the operating stability of the single-phase liquid-cooled server 1. A filter 24 is provided at the liquid inlet 1161 of the single-phase liquid-cooled server 1 to filter various impurities in the liquid refrigerant, especially conductive substances. Since the liquid refrigerant is in direct contact with at least part of the electronic components in the single-phase liquid-cooled server 1, it is necessary to ensure the purity of the liquid refrigerant to achieve stable operation of the equipment. Among them, conductive impurities are most likely to cause short circuit failures in circuit boards, so the filtering of conductive impurities is strengthened, and the filter 24 is configured as a magnetic filter 24 to filter various impurities in the liquid refrigerant.

[0120] See also Fig.15 , Fig.15A structural schematic diagram is shown when a constant pressure liquid supply tank 29 is provided in a single-phase liquid cooling server 1 of an embodiment of the present application. In some embodiments, the combination of a constant pressure pump station and a pressure storage tank 28 can be replaced by a combination of an ordinary pump station 23 and a constant pressure liquid supply tank 29. The constant pressure liquid supply tank 29 is provided with a constant pressure air pump 291. Among them, the pump station 23 is only responsible for liquid supply, and it is sufficient to ensure that the liquid level of the constant pressure tank is not lower than the lower limit of the set value. The constant pressure liquid supply tank 29 has a cooling medium at the bottom and compressed air at the top, which has both the function of storing liquid and supplying liquid, and also has the function of an energy storage tank. Through the above-mentioned setting, the control of the pump station 23 is simplified, and there is no need for a complicated program to control the start and stop and working frequency of the pump. A simple control program can realize the constant pressure liquid supply of the system, which greatly improves the stability of the cooling circulation system 2.

[0121] The single-phase liquid-cooled server 1 and cooling circulation system 2 of the embodiment of the present application have the characteristics of high PUE value, good energy-saving effect, strong heat dissipation capacity, high deployment power density, simple structure, small footprint, relatively light weight, small one-time investment, high safety, simple operation and maintenance, and low operating cost. At the same time, the whole machine is compatible with storage and computing, and is more easy to use and maintain.

[0122] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A single-phase liquid cooling server, characterized in that: include: Mainframe case; as well as A jet structure is arranged on the main housing, and a cooling medium is built in the jet structure. The jet structure can eject the cooling medium to provide jet liquid cooling for the inside of the main housing, and the cooling medium inside the main housing can be discharged from the main housing.

2. The single-phase liquid cooling server according to claim 1, characterized in that: The main housing is provided with a jet cover plate, and the jet structure is integrated with the jet cover plate.

3. The single-phase liquid cooling server according to claim 2, characterized in that: The single-phase liquid-cooled server also includes a liquid inlet component, which is disposed on the main housing and connected to the jet structure. The liquid inlet component is used to drive the cooling medium to be ejected from the jet structure to provide jet liquid cooling for the interior of the main housing.

4. The single-phase liquid cooling server according to claim 3, characterized in that: The jet structure includes a liquid supply channel and a plurality of jet holes. The liquid supply channel is connected to the liquid inlet component, and the jet holes are connected to the liquid supply channel and the inside of the main housing.

5. The single-phase liquid cooling server according to claim 4, characterized in that: The jet cover plate comprises a substrate and a jet plate, the liquid supply channel is arranged on the substrate, and the jet hole is arranged on the jet plate.

6. The single-phase liquid cooling server according to claim 5, characterized in that: The jet plate is provided with a liquid storage tank, and the jet holes are provided in the liquid storage tank.

7. The single-phase liquid cooling server according to claim 5, characterized in that: The jet plate has jet areas with various jet intensities.

8. The single-phase liquid cooling server according to claim 7, characterized in that: In the jet regions with different jet intensities, the arrangement density of the jet holes and / or the structure of the jet holes are different.

9. The single-phase liquid cooling server according to claim 1, characterized in that: The main housing comprises a partition, an inner cavity and an outer cavity, the inner cavity and the outer cavity are separated by the partition, and the jet structure jets toward the inner cavity; The single-phase liquid cooling server further includes a first heating element and a second heating element, wherein the first heating element is disposed in the inner cavity, and the second heating element is disposed in the outer cavity.

10. The single-phase liquid cooling server according to claim 9, characterized in that: The first heating element is configured as an element that can work normally after directly contacting the cooling medium, and the jet structure jets toward the surface of the first type of emitting element.

11. The single-phase liquid cooling server according to claim 9, characterized in that: The second heating element is configured as an element that affects working performance after contacting the cooling medium.

12. The single-phase liquid cooling server according to claim 11, characterized in that: The second heating element is configured as a mechanical hard disk.

13. The single-phase liquid cooling server according to any one of claims 9 to 12, characterized in that: The partition is provided with a heat dissipation step, one end surface of the heat dissipation step is placed in the inner cavity, and the other end surface is placed in the outer cavity, and the jet structure jets toward the end surface of the heat dissipation step.

14. The single-phase liquid cooling server according to claim 13, characterized in that: The outer cavity is provided with a hard disk bracket, the hard disk bracket is used to install the mechanical hard disk, and the hard disk bracket has a hollow liquid cooling cavity built in; The heat dissipation step is provided with a liquid inlet slot communicating with the hollow liquid cooling cavity; The partition is provided with a reflux port, which is lower than the liquid inlet slit, one end of which is communicated with the hollow liquid cooling cavity, and the other end of which is communicated with the inside of the inner cavity.

15. A cooling circulation system, characterized in that: include: A radiator, connected to the liquid inlet of the single-phase liquid cooling server according to any one of claims 1 to 14; A liquid storage tank, connected to the interior of the main housing; A pump station connects the radiator and the liquid storage tank.

16. The cooling circulation system according to claim 15, characterized in that: The air pressure in the liquid storage tank is lower than the air pressure inside the main housing.

17. The cooling circulation system according to claim 15 or 16, characterized in that: A filter is arranged between the radiator and the liquid inlet, and the filter provides filtering for the cooling medium.

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