Curing process equipment and treatment method of curing process

Abstract

The invention discloses curing process equipment and a treatment method. The curing process equipment comprises a process cavity, wherein a wafer of which the surface is to be subjected to film curing is placed in the process cavity; the lamp box is positioned at the upper part in the process cavity, and an ultraviolet light source is arranged in the lamp box and is used for providing ultraviolet light for curing the film; the rotating motor is connected with the lamp box and used for driving the lamp box to rotate to irradiate the wafer surface; the controller is configured to determine a preset rotation angle of the lamp box according to the curing process requirement in the process cavity; acquiring a current rotation angle of the lamp box; determining a rotation deviation coefficient based on the current rotation angle and a preset rotation angle; obtaining a comparison result between the rotation deviation coefficient and the deviation coefficient threshold range; and adjusting the rotation angle of the lamp box to the target rotation angle according to the comparison result, so that the illumination intensity of each area on the surface of the wafer is uniform. According to the invention, the service life of curing process equipment can be prolonged, and the accuracy and adjustability of curing illumination in the curing process can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a curing process device, a curing process processing method, and a computer-readable storage medium. Background Art

[0002] Thin film deposition is one of the three core steps in wafer manufacturing, and the technical parameters of the thin film directly affect chip performance.

[0003] After the dielectric material is attached to the wafer surface through the deposition process, the deposited film can be treated and its performance improved through a UV curing process, such as UV thermal treatment (UVTP), as a post-treatment process. For example, the porogen in the film can be removed by curing with UV light to obtain an ultra-low dielectric constant K. However, in the actual curing process, due to the uneven irradiation range, there will still be problems such as poor removal of porogens in the film in local areas and adverse effects on the cross-linking of the oxide grid.

[0004] At present, a rotatable light box assembly is used as a UV irradiation device in the curing process equipment, which is used for rotating irradiation during the curing process of the dielectric material layer film on the surface of the wafer. However, the rotating mechanism in the existing rotatable light box assembly uses a belt for rotation transmission to drive the UV lamp box to rotate. With long-term use, the belt will affect the accuracy of the light box rotation due to its limited service life, and there is also a risk of breakage in the belt transmission, which will directly affect the normal use of the equipment. Moreover, the current single rotating mechanism needs to drive two light boxes to rotate at the same time. Therefore, it is impossible to individually adjust the rotation mode of the corresponding light box according to the process conditions in each process chamber, and the adjustability of UV curing is poor.

[0005] In order to solve the above-mentioned problems existing in the prior art, the field is in urgent need of a processing technology for the curing process, which can remove interference factors of intermediate transmission media such as belts, extend the service life of curing process equipment, and improve the accuracy and adjustability of curing light during the curing process, thereby improving the uniformity of light on the cured surface. Summary of the invention

[0006] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0007] In order to overcome the above-mentioned defects of the prior art, the present invention provides a curing process equipment, a processing method of the curing process, and a computer-readable storage medium, which can remove the interference factors of intermediate transmission media such as belts, extend the service life of the curing process equipment, and improve the accuracy and adjustability of the curing light during the curing process, thereby improving the uniformity of light on the curing surface.

[0008] Specifically, the curing process equipment provided according to the first aspect of the present invention includes: a process chamber, inside which a wafer whose surface is to be cured by a thin film is placed; a light box, located above the process chamber, and provided with an ultraviolet light source inside, for providing ultraviolet light for curing the thin film; a rotating motor, connected to the light box, for driving the light box to rotate and irradiate the surface of the wafer; and a controller, configured to: determine a preset rotation angle of the light box according to the curing process requirements in the process chamber; obtain the current rotation angle of the light box; determine a rotation deviation coefficient according to the current rotation angle and the preset rotation angle; obtain a comparison result between the rotation deviation coefficient and a deviation coefficient threshold range; and adjust the rotation angle of the light box to a target rotation angle according to the comparison result, so that the light intensity of each area on the wafer surface is uniform.

[0009] Furthermore, in some embodiments of the present invention, it also includes: an encoder connected to the light box, used to obtain the rotation angle of the light box, and send a signal of the rotation angle of the light box to the controller.

[0010] Furthermore, in some embodiments of the present invention, the rotating motor includes a stator winding and a rotor, wherein the stator winding is fixed on the outside, the rotor is located on the inside of the stator winding and connected to the light box, and the rotor rotates according to the current passed through the stator winding to drive the light box to rotate.

[0011] Further, in some embodiments of the present invention, the step of determining the rotation deviation coefficient according to the current rotation angle and the preset rotation angle includes: obtaining the actual rotation angle of the light box at multiple moments in a time period T; and determining the rotation deviation coefficient according to the actual rotation angle and the preset rotation angle, in combination with a calculation formula for the deviation coefficient of the rotation angle, wherein the calculation formula for the deviation coefficient of the rotation angle is as follows:

[0012]

[0013] in, is the actual rotation angle of the light box, is the preset rotation angle of the light box, m represents the actual rotation angle of the light box at different times within the time T and the serial number of the preset rotation angle, m=1, 2, 3..., t is a positive integer.

[0014] Further, in some embodiments of the present invention, the step of obtaining a comparison result between the rotation deviation coefficient and the deviation coefficient threshold range includes: setting the deviation coefficient threshold range; determining whether the rotation deviation coefficient falls within the deviation coefficient threshold range; in response to the rotation deviation coefficient falling within the deviation coefficient threshold range, maintaining the current rotation angle of the light box; and in response to the rotation deviation coefficient falling outside the deviation coefficient threshold range, determining to adjust the current rotation angle of the light box.

[0015] Furthermore, in some embodiments of the present invention, the step of adjusting the rotation angle of the light box to a target rotation angle based on the comparison result so that the light intensity on the surface of the wafer is uniform includes: obtaining the difference between any deviation coefficient threshold within the deviation coefficient threshold range and the rotation deviation coefficient; determining a target adjustment current based on the difference; and passing the target adjustment current into the rotating motor so that the rotation angle of the light box is adjusted to the target rotation angle.

[0016] Furthermore, in some embodiments of the present invention, it also includes: a light detection device, which is arranged inside the process chamber and is used to detect the light intensity of each area on the surface of the wafer during the curing process of rotating irradiation of the light box.

[0017] Furthermore, in some embodiments of the present invention, a ventilation pipeline connected to the outside is provided in the light box for discharging ozone in the light box after the curing process is completed.

[0018] In addition, the processing method of the above-mentioned curing process provided according to the second aspect of the present invention includes the following steps: according to the curing process requirements in each process chamber in the above-mentioned curing process equipment provided by the first aspect of the present invention, determining the preset rotation angle of the light box in each process chamber; obtaining the current rotation angle of the light box in each process chamber; determining the rotation deviation coefficient of each light box according to each current rotation angle and each preset rotation angle; obtaining the comparison result between the rotation deviation coefficient of each light box and the deviation coefficient threshold range; and according to each comparison result, adjusting the rotation angle of each light box to the corresponding target rotation angle to make the light intensity on the surface of the wafer in each process chamber uniform.

[0019] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the processing method of the curing process provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0021] Figure 1 A schematic structural diagram of a curing process device provided according to some embodiments of the present invention is shown;

[0022] Figure 2 for Figure 1 The structural schematic diagram of the ventilation pipeline in the curing process equipment shown;

[0023] Figure 3 for Figure 1 A schematic top view of a light box and a rotating motor in the curing process equipment shown; and

[0024] Figure 4 A flow chart of a processing method of a curing process provided according to some embodiments of the present invention is shown.

[0025] Reference numerals:

[0026] 100 Curing process equipment;

[0027] 110 process chamber;

[0028] 120 light boxes;

[0029] 130 Rotating electrical machines;

[0030] 131 stator winding;

[0031] 132 rotor;

[0032] 140 Wafer tray;

[0033] 150 ventilation duct;

[0034] 151 convex structure;

[0035] 160 limiter;

[0036] 161 limit slot;

[0037] 162 sealing ring;

[0038] 200 wafers; and

[0039] Steps S410 to S450. DETAILED DESCRIPTION

[0040] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0043] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0044] As mentioned above, the rotating mechanism in the existing rotatable light box assembly uses a belt for rotation transmission to drive the UV light box to rotate. With long-term use, the belt will affect the accuracy of the light box rotation due to its limited service life, and there is also a risk of breakage in the belt transmission, which will directly affect the normal use of the equipment. Moreover, the current single rotating mechanism needs to drive two light boxes to rotate at the same time. Therefore, it is impossible to individually adjust the rotation mode of the corresponding light box according to the process conditions in each process chamber, and the adjustability of UV curing is poor.

[0045] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a curing process equipment, a processing method for a curing process, and a computer-readable storage medium, which can extend the service life of the curing process equipment and improve the accuracy and adjustability of the curing light during the curing process, thereby improving the uniformity of light on the curing surface.

[0046] In some non-limiting embodiments, the curing process equipment provided in the first aspect of the present invention can be used to implement the processing method of the curing process provided in the second aspect of the present invention. Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention has computer instructions stored thereon. When the computer instructions are executed by a processor, they can be used to implement the processing method of the curing process provided in the second aspect of the present invention.

[0047] The working principle of the above-mentioned curing process equipment will be described below in conjunction with some embodiments of the curing process treatment method. Those skilled in the art will understand that the embodiments of these curing process treatment methods are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the curing process equipment. Similarly, the curing process equipment is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these curing process treatment methods.

[0048] Please see Figure 1 , Figure 1 A schematic structural diagram of a curing process device provided according to some embodiments of the present invention is shown.

[0049] like Figure 1 As shown, in some embodiments of the present invention, the curing process equipment 100 may include a process chamber 110, in which a wafer 200 whose surface is to be cured is placed. A wafer tray 140 for supporting the wafer 200 is also provided in the process chamber 110, and, optionally, a wafer fixing component, a wafer heating component, etc. may be added to the wafer tray 140 according to process requirements. Further, in order to improve the output of the equipment, the curing process equipment 100 may include multiple process chambers 110 for simultaneously performing UV curing treatments for multiple wafers with different curing process requirements.

[0050] A light box 120 may be provided above the process chamber 110 of the curing process equipment 100. An ultraviolet light source, such as an ultraviolet lamp tube, is provided inside the light box 120 to provide ultraviolet light for curing the film.

[0051] Furthermore, at least one group of reflectors may be included in the light box 120 to increase the energy intensity irradiated to the wafer 200 below. Specifically, the light box 120 may include a first group of reflectors. Optionally, the first group of reflectors may include two arc-shaped reflectors, which are respectively arranged on both sides of the ultraviolet lamp tube, and a semi-enclosed reflector cover is formed above the ultraviolet lamp tube to reflect the ultraviolet light emitted from the ultraviolet lamp tube to both sides and above downward for the first time, and reflect it to the surface of the wafer 200, thereby improving the utilization rate of the ultraviolet light.

[0052] Preferably, a second set of reflectors may be provided between the first set of reflectors in the light box 120 and the wafer 200. Since the first set of reflectors is an arc-shaped reflective structure, part of the ultraviolet light reflected downward by the first set of reflectors will irradiate the outside of the wafer 200, and there is still a partial loss of ultraviolet light. Therefore, the second set of reflectors may be provided on the reflection path of the ultraviolet light reflected for the first time, and the ultraviolet light is reflected at least a second time by the second set of reflectors, thereby further improving the utilization rate of the ultraviolet light.

[0053] Specifically, optionally, the second group of reflectors can be relatively arranged below the first group of reflectors. The second group of reflectors can include two reflective combination mirrors formed by two sub-reflectors at an angle, wherein the upper sub-reflector in the reflective combination mirror on the first side can reflect the reflected light from the first group of reflectors for a second time, and the light after the second reflection can be received by the lower sub-reflector in the reflective combination mirror on the second side, and reflected for a third time, so as to reflect this part of the ultraviolet light to the surface of the wafer 200, thereby ensuring that the loss of ultraviolet light irradiated to the wafer 200 is minimized.

[0054] Those skilled in the art can understand that the solution of ultraviolet light reflection including the first group of reflectors and the second group of reflectors in the above-mentioned light box 120 is only a non-limiting implementation method provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific solution that is convenient for the public to implement, rather than to limit the protection scope of the present invention. Optionally, in other embodiments, those skilled in the art can also adopt other ultraviolet light reflection structures to reflect ultraviolet light based on the concept of the present invention to achieve the same technical effect.

[0055] like Figure 1 As shown, the light box 120 may also be provided with a ventilation line 150 connected to the outside, which is used to promptly discharge the ozone in the light box 120 after the curing process is completed. In addition, the ventilation line 150 may also allow external cooling air to flow in, so as to provide sufficient air flow rate to ensure the normal operation of any UV lamp and / or the related power source for the lamp.

[0056] Further, see Figure 2 , Figure 2 for Figure 1 The schematic diagram of the structure of the ventilation pipeline in the curing process equipment is shown in FIG. Figure 2 As shown, optionally, in order to better fix the ventilation duct 150, a limiting portion 160 may be provided on the outside of the ventilation duct 150. Specifically, a convex structure 151 may be provided on the outside of the ventilation duct 150. By completely snapping the convex structure 151 of the ventilation duct 150 into the external auxiliary limiting groove 161, it can be ensured that the ventilation duct 150 has been installed in the correct position and is firmly positioned, and will not be displaced during the subsequent rotation of the light box 120. Preferably, a sealing ring 162 may be provided between the convex structure 151 and the limiting groove 161 that is snap-fitted and fixed thereto, for sealing the ventilation duct 150.

[0057] Please continue as Figure 1 As shown, inside the process chamber 110, outside the light box 120, a rotating motor 130 may be included. The rotating motor 130 is connected to the light box 120, and is used to drive the light box 120 to rotate and irradiate the surface of the wafer 200. Compared with directly controlling the movement of the ultraviolet lamp tube, the rotating motor 130 controls the light box 120 to rotate as a whole. Since the light box 120 also includes an ultraviolet light reflection structure, the rotation of the light box 120 is adjusted as a whole, so that the irradiation range of the ultraviolet light is larger and the light intensity on the surface of the wafer 200 is more uniform. In addition, if the rotating motor 130 is set inside the light box 120, it is not only troublesome to disassemble, but also because ozone has a high oxidizing property, the rotating motor 130 is easily oxidized and corroded. Therefore, the rotating motor 130 provided outside the light box 120 can protect the rotating motor 130 and effectively extend its equipment life.

[0058] Further, see Figure 3 , Figure 3 for Figure 1 A schematic top view of a light box and a rotating motor in the curing process equipment is shown.

[0059] like Figure 3 As shown, since the rotating motor 130 needs to be connected to the light box 120, the rotating motor 130 can preferably be a ring-shaped coreless motor. The middle part of the coreless motor is a hollow structure, which can be sleeved at the interface between the light box 120 and the ventilation duct 150, thereby saving installation space.

[0060] Specifically, if Figure 3As shown, the rotating motor 130 may include a stator winding 131 and a rotor 132, wherein the stator winding 131 may be fixed on the outside, and the rotor 132 is a permanent magnet located on the inside of the stator winding 131, and is connected to the light box 120 via the ventilation duct 150, and the rotor 132 may rotate according to the current passed through the stator winding 131 to drive the light box 120 to rotate. In the rotating motor 130, by adjusting the magnitude of the current passed through the stator winding 131, the strength and direction of the magnetic field generated by the stator winding 131 may be adjusted. For example, increasing the current may enhance the strength of the magnetic field, increase the driving force between it and the rotor 132, and increase the torque and rotation speed of the rotor 132. Reducing the current will weaken the strength of the magnetic field, reduce the driving force and the torque and speed of the rotor 132. By adjusting the magnitude and direction of the current entering the stator winding 131 in real time, the controller can accurately adjust the magnetic field of the stator winding 131, thereby controlling the motion state of the rotor 132. This precise control capability enables the rotor 132 to rotate according to the expected target rotation angle and target rotation speed, thereby achieving precise control of the rotational positioning.

[0061] In this embodiment, since the weight and moment of inertia of the coreless motor are greatly reduced, the mechanical energy loss of the rotor 132 itself can be reduced. Due to the change in the structure of the rotor 132, the operation characteristics of the motor can be greatly improved, not only having outstanding energy-saving characteristics, but also having more sensitive control characteristics and stable operation characteristics, and is a highly efficient energy conversion device.

[0062] Furthermore, in the above-mentioned embodiment, the interference factors of the intermediate transmission medium such as the belt are eliminated, and the working condition of the rotating motor 130 is adjusted by the rotation angle of the light box 120, so that the curing process is more accurate and the response speed is faster.

[0063] In addition, the curing process equipment 100 provided by the present invention may also include a controller. The controller may be used to implement each step of the curing process processing method provided by another aspect of the present invention.

[0064] Specifically, see Figure 4 , Figure 4 A flow chart of a processing method of a curing process provided according to some embodiments of the present invention is shown.

[0065] like Figure 4 As shown, in some embodiments of the present invention, the curing process processing method may include the following steps: First, step S410 may be performed: according to the curing process requirements in the process chambers in the curing process equipment, the preset rotation angle of the light box in each process chamber is determined.

[0066] In some preferred embodiments, in order to improve the output of the equipment, the curing process equipment 100 may include multiple process chambers 110, which are used to perform UV curing treatments on multiple wafers with different curing process requirements. For example, the thin film requirement on the surface of the wafer in the first process chamber 110 is to complete the curing as soon as possible. At this time, the preset rotation speed of the light box 120 in the process chamber 110 can be set to a larger value to speed up the processing speed of UV curing. If the thin film requirement on the surface of the wafer in the remaining process chambers 110 is to obtain a more uniform curing effect, the preset rotation speed of the light box 120 in the remaining process chambers 110 can be set to a smaller value to ensure that the ultraviolet light is evenly irradiated in each area of ​​the wafer.

[0067] According to the curing process requirements in each process chamber, the preset rotation angles of the light box 120 at multiple moments in the T time period can be set and calibrated as Wherein, m represents the number of the preset rotation angle of the light box at different times within the time T, m=1, 2, 3...t, and t is a positive integer.

[0068] Next, step S420 may be performed: obtaining the current rotation angle of the light box in each process chamber.

[0069] Optionally, each process chamber 110 in the curing process equipment 100 may further include an encoder. The encoder may be connected to the light box 120 to obtain the rotation angle of the light box 120 and send a signal of the rotation angle of the light box 120 to the controller. The encoder may obtain the actual rotation angle of the corresponding light box 120 through the actual rotation angle of the rotor 132 in the rotating motor 130.

[0070] Specifically, the encoder can realize accurate monitoring and feedback of the actual rotation angle of the rotor 132 through the combination of the photoelectric conversion device and the encoding disk. During operation, the rotor 132 can be installed with an encoding disk, and the optical pattern or encoding line on the encoding disk will change with the rotation of the rotor 132. The photoelectric conversion device, such as a photodiode and a photodetector, can be fixed on a fixed structure, and the optical signal is converted into a corresponding electrical signal by detecting the change of the optical pattern or encoding line on the encoding disk. These electrical signals are then processed by the circuit inside the encoder, converted into digital signals, and output to the controller. The processing module in the controller can receive and analyze these signals in real time, so as to understand the current position and current rotation angle of the rotor 132.

[0071] The actual rotation angle of the light box 120 at multiple moments in the T time period can be obtained by the encoder and calibrated as Wherein, m represents the number of the actual rotation angle of the light box at different times within the time T, m=1, 2, 3...t, and t is a positive integer.

[0072] Next, step S430 may be performed: determining the rotation deviation coefficient of each light box according to each current rotation angle and each preset rotation angle.

[0073] Specifically, the actual rotation angle and preset rotation angles Combined with the rotation angle deviation coefficient calculation formula, the rotation deviation coefficient R is determined adc , where the calculation formula for the deviation coefficient of the rotation angle can be as follows:

[0074]

[0075] in, is the actual rotation angle of the light box, is the preset rotation angle of the light box, m represents the number of the actual rotation angle of the light box and the preset rotation angle at different times in time T, m=1, 2, 3..., t is a positive integer. In this embodiment, the rotation deviation coefficient R adc It refers to the difference between the actual rotation angle of the light box 120 and the preset rotation angle within the T time period. The greater the difference between the two, the greater the rotation deviation coefficient R adc The larger the value, the less accurate the rotation positioning of the light box 120 is, which will have a greater impact on the uniformity of light illumination for thin film curing on the wafer surface.

[0076] Next, step S440 may be performed: obtaining a comparison result between the rotation deviation coefficient of each light box and the deviation coefficient threshold range.

[0077] In some optional embodiments, the deviation coefficient threshold range can be set first. Then, the rotation deviation coefficient R can be determined by the processing module in the controller. adc Whether it falls within the deviation coefficient threshold range, if the rotation deviation coefficient falls within R adc If the value falls within the deviation coefficient threshold range, that is, the light box 120 does not have an inaccurate rotation positioning, the current rotation angle of the light box 120 can be maintained and the light box 120 continues to rotate. Specifically, the controller does not change the amount of current passed into the stator winding 131 of the rotating motor 130, thereby not changing the strength and direction of the magnetic field generated by the stator winding 131, and further does not change the driving force between the stator winding 131 and the rotor 132, that is, the torque and rotation speed of the rotor 132 are not adjusted.

[0078] If the rotation error coefficient R adc If the angle falls outside the deviation coefficient threshold range, that is, the light box 120 may be rotated inaccurately, it is determined that the current rotation angle of the light box 120 needs to be adjusted.

[0079] Next, step S450 may be performed: according to each comparison result, the rotation angle of each light box is adjusted to a corresponding target rotation angle, so that the light intensity on the surface of the wafer in each process chamber is uniform.

[0080] Specifically, in some embodiments, any deviation coefficient threshold within the deviation coefficient threshold range may be selected as a reference coefficient, and then the difference between the deviation coefficient threshold and the rotation deviation coefficient is obtained. Based on the difference between the two, the target adjustment current may be determined.

[0081] Specifically, the controller adjusts the current passed into the stator winding 131 in the rotating motor 130 to a target adjustment current, thereby changing the strength and direction of the magnetic field generated by the stator winding 131, and further changing the driving force between it and the rotor 132, that is, changing the torque and rotation speed of the rotor 132, so that the rotation angle of the light box 120 is adjusted to the target rotation angle.

[0082] Preferably, the median value within the deviation coefficient threshold range may be selected as the reference coefficient, so that the holding time of the rotation angle of the light box 120 after a single rotation angle adjustment can be prolonged.

[0083] Furthermore, in some optional embodiments of the present invention, the curing process equipment 100 may also include a light detection device. The light detection device may be disposed inside the process chamber 110 to detect the light intensity of each area on the surface of the wafer 200 in real time during the curing process of rotating irradiation of the light box 120.

[0084] In addition, optionally, the curing process equipment 100 may further include a transparent window. The transparent window may be located between the light box 120 and the wafer 200 in the process chamber 110, and is used to isolate the light box 120 and the wafer 200, thereby preventing the thin film on the surface of the wafer 200 from being contaminated by particles dropped from above due to the rotation of the light box 120 during the curing process of the wafer.

[0085] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0086] In summary, the present invention provides a curing process equipment, a processing method for a curing process, and a computer-readable storage medium, which can extend the service life of the curing process equipment and improve the accuracy and adjustability of the curing light during the curing process, thereby improving the uniformity of light on the curing surface.

[0087] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the universal principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A curing process equipment, characterized in that: include: A process chamber, in which a wafer whose surface is to be cured by a thin film is placed; A light box, located above the process chamber, having an ultraviolet light source therein for providing ultraviolet light for curing the film; A rotary motor connected to the light box and used to drive the light box to rotate and illuminate the surface of the wafer; as well as A controller is configured to: determine a preset rotation angle of the light box according to a curing process requirement in the process chamber; Get the current rotation angle of the light box; Determine a rotation deviation coefficient according to the current rotation angle and the preset rotation angle; obtain a comparison result between the rotation deviation coefficient and a deviation coefficient threshold range; And according to the comparison result, the rotation angle of the light box is adjusted to the target rotation angle to make the light intensity of each area on the wafer surface uniform.

2. The curing process equipment according to claim 1, characterized in that: Also includes: The encoder is connected to the light box and is used for acquiring the rotation angle of the light box and sending a signal of the rotation angle of the light box to the controller.

3. The curing process equipment according to claim 1, characterized in that: The rotating motor includes a stator winding and a rotor, wherein the stator winding is fixed on the outside, the rotor is located on the inside of the stator winding and connected to the light box, and the rotor rotates according to the current passed through the stator winding to drive the light box to rotate.

4. The curing process equipment according to claim 3, characterized in that: The step of determining the rotation deviation coefficient according to the current rotation angle and the preset rotation angle comprises: Acquire the actual rotation angle of the light box at multiple moments within the time period T; and The rotation deviation coefficient is determined according to the actual rotation angle and the preset rotation angle in combination with a rotation angle deviation coefficient calculation formula, wherein the rotation angle deviation coefficient calculation formula is as follows: in, is the actual rotation angle of the light box, is the preset rotation angle of the light box, m represents the actual rotation angle of the light box at different times within the time T and the serial number of the preset rotation angle, m=1, 2, 3..., t is a positive integer.

5. The curing process equipment according to claim 4, characterized in that: The step of obtaining a comparison result between the rotation deviation coefficient and the deviation coefficient threshold range comprises: Setting the deviation coefficient threshold range; Determining whether the rotation deviation coefficient falls within the deviation coefficient threshold range; In response to the rotation deviation coefficient falling within the deviation coefficient threshold range, maintaining the current rotation angle of the light box; and In response to the rotation deviation coefficient falling outside the deviation coefficient threshold range, it is determined to adjust the current rotation angle of the light box.

6. The curing process equipment according to claim 5, characterized in that: The step of adjusting the rotation angle of the light box to a target rotation angle according to the comparison result so as to make the illumination intensity of each area on the surface of the wafer uniform comprises: Obtaining a difference between any deviation coefficient threshold value within the deviation coefficient threshold range and the rotation deviation coefficient; Based on the difference, determining a target regulated current; and The target adjustment current is supplied to the rotating motor so that the rotation angle of the lamp box is adjusted to the target rotation angle.

7. The curing process equipment according to claim 1, characterized in that: Also includes: The light detection device is arranged inside the process chamber and is used to detect the light intensity of each area on the surface of the wafer during the curing process of the light box rotating and irradiating.

8. The curing process equipment according to claim 1, characterized in that: The light box is provided with a ventilation pipeline connected to the outside, which is used to discharge the ozone in the light box after the curing process is completed.

9. A method for curing process, characterized in that: The following steps are involved: According to the curing process requirements in each process chamber in the curing process equipment according to any one of claims 1 to 8, determining a preset rotation angle of the light box in each process chamber; Obtaining the current rotation angle of the light box in each process chamber; Determining a rotation deviation coefficient of each light box according to each current rotation angle and each preset rotation angle; Obtaining a comparison result between the rotation deviation coefficient of each light box and a deviation coefficient threshold range; as well as According to each of the comparison results, the rotation angle of each of the light boxes is adjusted to a corresponding target rotation angle so that the light intensity on the surface of the wafer in each of the process chambers is uniform.

10. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the curing process processing method as claimed in claim 9 is implemented.

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