Manufacturing process of QSFP-DD optical module shell structural member

Abstract

The invention relates to a manufacturing process of a QSFP-DD optical module shell structural member. The manufacturing process comprises the following steps that the TOP face of an optical module to be machined is thickened by 0.2 mm; manufacturing a die casting through the die-casting die, and performing sand blasting treatment; the die casting obtained after sand blasting is fixed to a grinding machine, the TOP face of the die casting is thinned by 0.2 mm through the grinding machine, and the planeness and roughness of the TOP face are guaranteed during thinning; cleaning the thinned die casting and carrying out electroplating treatment; the grinding machine has the advantages that parts which are subjected to precise die casting and sand blasting are fixed through the jig and then directly subjected to CNC machining through the programmed grinding machine, the production efficiency is high, and large-scale mass production can be achieved; the indexes such as the size, the flatness and the roughness of the part subjected to CNC machining of the grinding machine can meet the product requirements; due to the fact that manufacturing is conducted through precise molds and mature equipment in most processes, the yield can be greatly improved, manpower is reduced, and the manufacturing cost is low.

Description

Technical Field

[0001] The present invention relates to the field of optical communications, and in particular to a manufacturing process of a QSFP-DD optical module housing structure. Background Art

[0002] like Figure 1 As shown in the figure, it is the thickness dimension of the QSFP-DD optical module. The flatness of its TOP surface is generally 0.075mm, and the surface roughness is generally required to be 1.6um. The manufacturing processes include: precision die-casting, sandblasting, and electroplating.

[0003] As AI applications become more and more widespread, people's requirements for bandwidth for data transmission have also increased dramatically, resulting in a geometric increase in the power consumption of this type of optical module and higher and higher requirements for heat dissipation. Figure 2 As shown, the flatness (0.025mm) and roughness (0.4um) requirements for the TOP surface of the high power consumption module.

[0004] Since the optical module housing made by traditional technology cannot meet this requirement, some manufacturers dig out a part of the TOP surface and then glue a machined part to meet the requirements of flatness and roughness. Figure 3 However, gluing requires special glue (resistant to high temperature of 85°, low temperature of 0°, and resistant to hot and cold cycles, etc.), which is costly and has a complicated process (it needs to be placed in a temperature box for baking and curing after gluing). Moreover, due to uneven force after curing, the flatness consistency is poor and the yield is low, making this process impossible to achieve mass production.

[0005] As an improvement, Figure 4 As shown, some manufacturers use screw fixing to improve the solution. First, a part of the TOP surface is dug out, and a support is installed inside with screws and screw holes. Then, the machined insert is installed and fixed with screws. This solution is slightly cheaper than the adhesive solution, but the screws occupy more internal space, which seriously hinders the internal design of the module. At the same time, it causes the compatibility of the structural parts to deteriorate. After the screws are tightened, the insert is deformed and the flatness cannot be guaranteed. Therefore, this solution is not feasible.

[0006] Based on this, this case is brought forward. Summary of the invention

[0007] The object of the present invention is to provide a manufacturing process for a QSFP-DD optical module housing structure, which can meet the flatness (0.025 mm) and roughness (0.4 um) requirements of a high power consumption module.

[0008] In order to achieve the above object, the technical solution of the present invention is as follows:

[0009] A manufacturing process of a QSFP-DD optical module housing structure comprises the following steps:

[0010] S1. Thicken the TOP surface of the optical module to be processed by 0.2mm;

[0011] S2. Making a die casting by a die casting mold;

[0012] S3. Sandblasting the die casting;

[0013] S4. Fix the die-casting after sandblasting on the grinder, and use the grinder to thin the TOP surface of the die-casting by 0.2mm. During thinning, ensure that the flatness of the TOP surface is not greater than 0.025mm and the roughness is not greater than 0.4um;

[0014] S5. Clean the thinned die casting and perform electroplating.

[0015] Furthermore, the grinding machine adopts CNC numerical control machine tool

[0016] The advantages of the present invention are:

[0017] 1. The shell structure can be mass-produced: the parts that have been precision-die-cast and sandblasted can be directly processed by a programmed grinder CNC after being fixed by a jig, which has high production efficiency and can achieve mass production;

[0018] 2. Good quality assurance effect: After the parts are processed by CNC grinding machine, the size, flatness, roughness and other indicators can meet the product requirements;

[0019] 3. Low production cost: Since most processes are made through precision molds and mature equipment, the yield rate can be greatly improved and manpower can be reduced, so the production cost is relatively low. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the appearance and structure of the current QSFP-DD optical module;

[0021] Figure 2 The roughness and flatness requirements of the current QSFP-DD optical module;

[0022] Figure 3 It is a schematic diagram of the improvement scheme of the current gluing;

[0023] Figure 4 This is a schematic diagram of the improved solution for current screw locking;

[0024] Figure 5 It is a schematic diagram of the size change of the embodiment scheme;

[0025] Figure 6 This is a schematic diagram of the surface condition of the product after sandblasting in the embodiment;

[0026] Figure 7This is a schematic diagram of the situation in which the CNC grinding wheel of the grinder grinds the surface of the product in the embodiment;

[0027] Description of symbols

[0028] 1. TOP surface; 2. Support parts; 3. Screws; 4. PCB. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the embodiments. It should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" herein are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention.

[0030] This embodiment proposes a manufacturing process for a QSFP-DD optical module housing structure. Figure 5 As shown, the following steps are included:

[0031] S1. Thicken the TOP surface of the optical module to be processed by 0.2mm (the 0.2mm includes the size after electroplating);

[0032] S2. Making a die casting by a die casting mold;

[0033] S3. Sandblasting the die casting;

[0034] S4. Fix the die-casting after sandblasting on the CNC machine tool, and use the programmed grinder CNC processing to thin the TOP surface of the die-casting by 0.2mm (the 0.2mm includes the size after electroplating). During thinning, ensure that the flatness of the TOP surface is 0.025mm and the roughness is 0.4um;

[0035] S5. Clean the thinned die casting and perform electroplating.

[0036] The CNC machining flatness and roughness of the grinder can reach 0.02mm and 0.01~0.2um respectively, so the values ​​required by the module protocol can be guaranteed.

[0037] In this embodiment, the TOP surface of the optical module is thickened by 0.2 mm because the next process of the part is sandblasting, which will form a slightly uneven frosted surface on the surface. Figure 6As shown in the figure, the thickness of the frosted surface is within 0.1mm, the flatness is generally 0.075mm, and the surface roughness is generally 1.6um, which does not meet the requirements of high-power optical modules. It needs to be ground off with a precision grinder CNC to form the required flatness and roughness. When grinding with a grinding wheel, a material with a thickness of 0.1mm is required to form the required flatness and roughness. Therefore, the thickening data is set to 0.2mm to facilitate the "one-time" machining of the precision grinder CNC, that is, the grinding wheel can complete the process by grinding the surface of the part once, which improves efficiency. Figure 7 shown.

[0038] The above embodiments are only used to explain the concept of the present invention, rather than to limit the protection of the rights of the present invention. Any non-substantial changes to the present invention using this concept shall fall within the protection scope of the present invention.

Claims

1. A manufacturing process for a QSFP-DD optical module housing structure, characterized in that: The following steps are involved: S1. Thicken the TOP surface of the optical module to be processed by 0.2mm; S2. Making a die casting by a die casting mold; S3. Sandblasting the die casting; S4. Fix the die-casting after sandblasting on the grinder, and use the grinder to thin the TOP surface of the die-casting by 0.2mm. During thinning, ensure that the flatness of the TOP surface is not greater than 0.025mm and the roughness is not greater than 0.4um; S5. Clean the thinned die casting and perform electroplating.

2. A manufacturing process for a QSFP-DD optical module housing structure as claimed in claim 1, characterized in that: The grinding machine adopts a CNC numerically controlled machine tool.

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