A grinding device for semiconductor wafer material

Abstract

The present invention discloses a grinding device for semiconductor wafer materials, which relates to the field of wafer material grinding equipment, including a receiving platform, a guide groove is provided at the center of the top of the receiving platform, a fixed column is vertically fixed at the center of the guide groove, a top plate is rotatably embedded and installed at the top of the fixed column, a stepping motor for assisting the rotation of the top plate is installed at the center of the top of the top plate, hydraulic rods are symmetrically and vertically installed at both ends of the top of the top plate, a mounting plate is fixed at the extended end of the hydraulic rod, a vacuum negative pressure rotating module is installed at the bottom of the mounting plate, a suction cup is installed at the bottom of the vacuum negative pressure rotating module, and a wafer body is adsorbed on the suction cup. The present invention can adjust the second mounting platform to a corresponding angle according to different work requirements during subsequent work, and adjust the mounting plate thereon to a corresponding angle, so that the edge of the wafer material can be effectively ground and processed, and the occurrence of insufficient or uneven grinding of the edge portion can be avoided as much as possible.

Description

Technical Field

[0001] The present invention relates to the field of wafer material polishing equipment, in particular to a semiconductor wafer material polishing device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, which are then slowly pulled out to form cylindrical silicon rods. The silicon rods are then ground, polished, and sliced ​​to form silicon wafers, which are wafers. It can be seen that grinding and polishing are one of the important steps in the wafer production process. In addition, for recycled wafers or wafers with scratches on the surface, the surface of the wafer also needs to be ground and polished so that it can be used again.

[0003] Existing wafer material polishing devices generally have the problem of fixed polishing table angle and lack of flexible adjustment. This limitation is particularly significant during the polishing process of the wafer edge, which can easily lead to insufficient or uneven polishing of the edge part, and often requires additional secondary processing to correct it, thereby increasing the complexity and time cost of the overall process. Therefore, a semiconductor wafer material polishing device is needed to help solve this problem. Summary of the Invention

[0004] Based on this, the purpose of the present invention is to provide a semiconductor wafer material grinding device to solve the existing wafer material grinding device. The current wafer material grinding device generally has the problem of fixed grinding table angle and lack of flexible adjustment. This limitation is particularly significant in the grinding process of the wafer edge, which can easily lead to insufficient or uneven grinding of the edge part, and often requires additional secondary processing to correct it, thereby increasing the complexity of the overall process and time cost technical problems.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a grinding device for semiconductor wafer materials, comprising a receiving platform, a guide groove is provided at the center of the top of the receiving platform, a fixed column is vertically fixed at the center of the guide groove, a top plate is rotatably embedded and installed at the top of the fixed column, a stepping motor for assisting the rotation of the top plate is installed at the center of the top of the top plate, hydraulic rods are symmetrically and vertically installed at both ends of the top of the top plate, an extending end of the hydraulic rod is fixed to a mounting plate, a vacuum negative pressure rotating module is installed at the bottom of the mounting plate, a suction cup is installed at the bottom of the vacuum negative pressure rotating module, and a wafer body is adsorbed on the suction cup;

[0006] A first mounting platform is symmetrically installed on the top of the receiving platform, a second mounting platform is supported and installed on the top of the first mounting platform, a rotating motor is installed at the center of the top of the second mounting platform, a rotating seat is installed at the front end of the shaft of the rotating motor, a mounting disk is clamped and installed at the top of the rotating seat, a first grinding pad is installed on the top of the mounting disk, and a second grinding pad for grinding with the wafer body is installed on the top of the first grinding pad.

[0007] The present invention is further configured such that the bottom of the second mounting platform is in an arc-shaped structure, a limiting groove is provided at the bottom of the second mounting platform, the top of the first mounting platform is in the shape of an arc groove, sliding blocks are symmetrically fixed at the top of the first mounting platform, the sliding blocks slide in cooperation with the limiting grooves, an adjustment cavity is provided inside the first mounting platform, and an adjustment component for assisting in adjusting the angle of the second mounting platform is installed in the adjustment cavity.

[0008] The present invention is further configured as follows: the adjustment assembly includes a fixing seat protruding and fixed on the outer plate of the first mounting platform, a rotating rod is installed horizontally through the fixing seat and the adjustment cavity, a ring is mounted on the rotating rod, and the rotating rod and the ring are threadedly engaged, a sliding rod is fixed at the top of the ring, a sliding sleeve is mounted on the sliding rod, and the top of the sliding sleeve is hingedly installed at the bottom center of the limiting groove, and a knob is fixed on the end of the rotating rod extending out of the fixing seat.

[0009] The present invention is further configured such that a scale plate is embedded and installed on one side of the arc-shaped side of the second mounting platform, and angle scale lines are symmetrically engraved on the scale plate. A pointer is protrudingly provided on one side of the arc-shaped side of the first mounting platform, and the pointer cooperates with the scale plate to point.

[0010] The present invention is further configured such that a clamping groove is provided at the outer edge of the top of the rotating seat, a clamping block is protrudingly provided at the bottom of the mounting plate, and the clamping groove and the clamping block are fitted and fixed.

[0011] The present invention is further configured as follows: there are four clamping grooves, which are arranged in a circular array with the center of the rotating seat as the center; there are four clamping blocks, which are arranged in a circular array with the center of the mounting plate as the center.

[0012] The present invention is further configured such that the engaging groove comprises a penetration opening for the engaging block to penetrate and a sliding groove for the engaging block to slide and engage, and the engaging block is in an inverted T-shape as a whole.

[0013] The present invention is further configured such that the vacuum negative pressure rotation module includes a hollow shaft motor, the suction cup is installed at the bottom shaft end of the hollow shaft motor, a negative pressure rotating connector is installed at the top of the hollow shaft motor, one end of the negative pressure rotating connector is connected to the negative pressure pump, and the air path at the other end of the negative pressure rotating connector is connected to the suction cup.

[0014] The present invention is further configured such that a mounting rod is vertically installed on one side of the top of the receiving platform corresponding to the first mounting platform, a liquid spray nozzle is hingedly installed on one end of the mounting rod facing the first mounting platform, the mounting rod and the liquid spray nozzle are connected by a conducting tube, a lifting cavity is vertically opened on the outer side of the mounting rod, and an auxiliary liquid spray nozzle adjustment lifting assembly is installed in the lifting cavity.

[0015] The present invention is further configured such that the lifting assembly includes a rotating rod vertically rotatably arranged in the lifting chamber, a slider is mounted on the rotating rod, the rotating rod and the slider are threadedly engaged, a turntable is fixed at the bottom of the rotating rod, a part of the turntable extends out of the mounting rod, and a support rod is hingedly mounted between the slider and the liquid spray nozzle.

[0016] In summary, the present invention mainly has the following beneficial effects: through the cooperation between the first mounting platform and the second mounting platform and the adjustment component, etc., which are arranged at the top of the receiving platform, when it is necessary to grind the edge of the wafer body, the knob drives the rotating rod to rotate, and the rotating rod and the collar are threadedly matched, so that the collar moves as a whole, and in the process of the collar moving, the sliding rod is driven to move, and the sliding sleeve is pushed or pulled, thereby effectively adjusting the overall inclination of the second mounting platform, and the second mounting platform can be adjusted to a corresponding angle according to different work requirements in subsequent work, and the mounting plate on it can be adjusted to a corresponding angle, so that the edge of the wafer material can be effectively polished, and the occurrence of insufficient or uneven grinding of the edge part can be avoided as much as possible;

[0017] By setting the first polishing pad and the second polishing pad, and by setting the first polishing pad to a low-density PU foam polishing pad, when the crystal edge of the wafer body is pressed down, the downward pressure of the wafer body causes the relatively low-density blue PU foam polishing pad to bend, causing the second polishing pad to bend downward, thereby increasing the area contacting the crystal edge and achieving a better crystal edge polishing effect;

[0018] Through the lifting assembly on the mounting rod, the turntable can be rotated during operation, and the turntable drives the rotating rod to rotate as a whole. The threaded connection between the rotating rod and the slider makes the slider move as a whole, thereby driving the support rod to drive the liquid spray nozzle to move, and then moving the liquid spray nozzle to a specified inclination angle, thereby achieving liquid spraying at different inclination angles during the grinding process, ensuring the smooth progress of subsequent grinding work, ensuring that the falling position of the liquid spray coincides with the grinding position between the wafer body and the second grinding pad, and ensuring the smooth progress of subsequent wafer grinding work. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention;

[0020] Figure 2 For the present invention Figure 1 Schematic diagram of the enlarged structure at A in the middle;

[0021] Figure 3 For the present invention Figure 1 Schematic diagram of the enlarged structure at B in the middle;

[0022] Figure 4 is a longitudinal sectional view of the first mounting platform of the present invention;

[0023] Figure 5 For the present invention Figure 1 Schematic diagram of the enlarged structure at point C in the middle.

[0024] Figure: 1, receiving platform; 2, guide groove; 3, fixed column; 4, top plate; 5, stepping motor; 6, hydraulic rod; 61, mounting plate; 7, vacuum negative pressure rotation module; 71, hollow shaft motor; 72, negative pressure rotation connector; 8, suction cup; 9, wafer body; 10, first mounting platform; 101, pointer; 102, sliding block; 11, second mounting platform; 111, scale plate; 112, limit groove; 12, rotating motor; 13, rotating Seat; 131, snap-fit ​​groove; 14, mounting plate; 141, first polishing pad; 142, second polishing pad; 143, snap-fit ​​block; 15, adjustment assembly; 151, fixed seat; 152, knob; 153, rotating rod; 154, collar; 155, slide rod; 156, sleeve; 16, mounting rod; 17, lifting assembly; 18, rotating rod; 181, turntable; 19, slider; 20, support rod; 21, liquid spray nozzle; 22, conducting tube. DETAILED DESCRIPTION

[0025] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0026] A grinding device for semiconductor wafer material, such as Figure 1 As shown, it includes a receiving platform 1, and a guide groove 2 is opened at the center of the top of the receiving platform 1. The guide groove 2 is set to assist in the diversion of the grinding liquid after it is sprayed out and used. A fixed column 3 is vertically fixed at the center of the guide groove 2, and a top plate 4 is rotatably embedded and installed at the top of the fixed column 3. A stepping motor 5 for assisting the rotation of the top plate 4 is installed at the center of the top of the top plate 4. The stepping motor 5 is fixed at the top of the top plate 4, and the front end of the shaft of the stepping motor 5 is fixed at the top of the top plate 4. Hydraulic rods 6 are symmetrically and vertically installed at both ends of the top of the top plate 4. The extending end of the hydraulic rod 6 is fixed with a mounting plate 61. A guide rod is vertically fixed on the mounting plate 61. The guide rod is passed through and installed at the top of the top plate 4. The set guide rod can ensure that the mounting plate 61 will not rotate during the rising and falling process during operation.

[0027] Reference Figure 1 and Figure 2 As shown, a vacuum negative pressure rotation module 7 is installed at the bottom of the mounting plate 61, a suction cup 8 is installed at the bottom of the vacuum negative pressure rotation module 7, the vacuum negative pressure rotation module 7 includes a hollow shaft motor 71, the suction cup 8 is installed at the bottom shaft end of the hollow shaft motor 71, and a negative pressure rotation connector 72 is installed at the top of the hollow shaft motor 71. One end of the negative pressure rotation connector 72 is connected to the negative pressure pump, and the air path of the other end of the negative pressure rotation connector 72 is connected to the suction cup 8, and a wafer body 9 is adsorbed on the suction cup 8.

[0028] By setting up the vacuum negative pressure rotating module 7, it can ensure that the wafer body 9 can be stably adsorbed during operation, and at the same time, the suction cup 8 can be stably rotated, which is convenient for the subsequent overall rotation and polishing of the wafer body 9.

[0029] Reference Figure 1 、 Figure 3 and Figure 4 As shown, a first mounting platform 10 is symmetrically installed on the top of the receiving platform 1, a second mounting platform 11 is installed on the top of the first mounting platform 10, a rotating motor 12 is installed at the center of the top of the second mounting platform 11, a rotating seat 13 is installed at the front end of the shaft of the rotating motor 12, a mounting disk 14 is clamped and installed at the top of the rotating seat 13, a first grinding pad 141 is installed at the top of the mounting disk 14, the first grinding pad 141 is a low-density PU foam grinding pad, a second grinding pad 142 for grinding with the wafer body 9 is installed on the top of the first grinding pad 141, and a plurality of cross-shaped staggered grooves are provided on the upper surface of the second grinding pad 142.

[0030] By setting up a first polishing pad 141 and a second polishing pad 142, and by setting the first polishing pad 141 to a low-density PU foam polishing pad, when the crystal edge of the wafer body 9 is pressed down, the downward pressure of the wafer body 9 will cause the relatively low-density blue PU foam polishing pad to bend, causing the second polishing pad 142 to bend downward, thereby contacting a larger area of ​​the crystal edge and achieving a better crystal edge polishing effect.

[0031] A snap-fitting groove 131 is provided at the outer edge of the top of the rotating seat 13. There are four snap-fitting grooves 131, which are arranged in a circular array with the center of the rotating seat 13 as the center. A snap-fitting block 143 is protruding from the bottom of the mounting disk 14. There are four snap-fitting blocks 143, which are arranged in a circular array with the center of the mounting disk 14 as the center. The snap-fitting grooves 131 and the snap-fitting blocks 143 are cooperated and fixed with each other. The snap-fitting groove 131 includes a penetration opening for the snap-fitting block 143 to penetrate and a slide groove for the snap-fitting block 143 to slide and engage. The snap-fitting block 143 is in an inverted T shape as a whole.

[0032] By providing a detachable design between the snap-in groove 131 and the snap-in block 143 , the first polishing pad 141 and the second polishing pad 142 can be quickly disassembled and replaced according to different polishing work requirements during work, ensuring that subsequent work proceeds smoothly.

[0033] The bottom of the second mounting platform 11 is an arc-shaped structure, and a limiting groove 112 is provided at the bottom of the second mounting platform 11. The top of the first mounting platform 10 is an arc-shaped groove. A sliding block 102 is symmetrically fixed at the top of the first mounting platform 10, and the sliding block 102 slides in cooperation with the limiting groove 112. An adjustment cavity is provided inside the first mounting platform 10, and an adjustment component 15 is installed in the adjustment cavity to assist in adjusting the angle of the second mounting platform 11. The adjustment component 15 includes a fixing seat 151 protruding and fixed on the outer plate of the first mounting platform 10, and a rotating rod 153 is installed horizontally through the fixing seat 151 and the adjusting cavity. A ring 154 is sleeved on the rotating rod 153, and the rotating rod 153 and the ring 154 are threadedly matched. A sliding rod 155 is fixed at the top of the ring 154, and a sliding sleeve 156 is sleeved on the sliding rod 155. The top of the sliding sleeve 156 is hingedly installed at the bottom center of the limiting groove 112, and a knob 152 is fixed on one end of the rotating rod 153 extending out of the fixing seat 151.

[0034] The present invention cooperates with the first mounting platform 10 and the second mounting platform 11 and the adjustment component 15 arranged at the top of the receiving platform 1. When it is necessary to grind the edge of the wafer body 9, the knob 152 drives the rotating rod 153 to rotate, and the rotating rod 153 and the ring 154 are threadedly engaged, so that the ring 154 moves as a whole. During the movement of the ring 154, the sliding rod 155 is driven to move, and the sliding sleeve 156 is pushed or pulled, thereby effectively adjusting the overall inclination of the second mounting platform 11. In subsequent work, the second mounting platform 11 can be adjusted to the corresponding angle according to different work requirements, and the mounting plate 14 on it can be adjusted to the corresponding angle, so that the edge of the wafer material can be effectively polished, and the occurrence of insufficient or uneven polishing of the edge part can be avoided as much as possible.

[0035] Furthermore, a scale plate 111 is embedded and installed on one side of the arc-shaped edge of the second mounting platform 11, and angle scale lines are symmetrically engraved on the scale plate 111. A pointer 101 is protrudingly set on one side of the arc-shaped edge of the first mounting platform 10, and the pointer 101 and the scale plate 111 cooperate to point.

[0036] Through the cooperation between the scale plate 111 and the pointer 101 , the overall inclination of the second mounting platform 11 can be effectively determined and interpreted after the second mounting platform 11 is adjusted.

[0037] Reference Figure 1 and Figure 5 As shown, a mounting rod 16 is vertically installed on one side of the first mounting platform 10 corresponding to the top of the receiving platform 1, and a liquid spray nozzle 21 is hingedly installed on one end of the mounting rod 16 facing the first mounting platform 10. The mounting rod 16 and the liquid spray nozzle 21 are connected by a conducting tube 22. A lifting cavity is vertically opened on the outer side of the mounting rod 16, and an auxiliary liquid spray nozzle 21 adjustment lifting assembly 17 is installed in the lifting cavity. The lifting assembly 17 includes a rotating rod 18 vertically arranged in the lifting cavity, a slider 19 is installed on the rotating rod 18, and the rotating rod 18 and the slider 19 are threadedly engaged. A turntable 181 is fixed at the bottom of the rotating rod 18, and a part of the turntable 181 extends out of the mounting rod 16, and a support rod 20 is hingedly installed between the slider 19 and the liquid spray nozzle 21.

[0038] By setting the lifting assembly 17 on the mounting rod 16, the turntable 181 can be rotated during operation, and the turntable 181 drives the rotating rod 18 to rotate as a whole. The rotating rod 18 and the slider 19 are threaded together, so that the slider 19 moves as a whole, and then drives the support rod 20 to drive the liquid spray nozzle 21 to move, and then moves the liquid spray nozzle 21 to a specified inclination angle, so that during the grinding process, liquid spraying at different inclination angles can be achieved, thereby ensuring the smooth progress of subsequent grinding work, ensuring that the falling position of the liquid spray coincides with the grinding position between the wafer body 9 and the second grinding pad 142, and ensuring the smooth progress of subsequent wafer grinding work.

[0039] During specific operation, the liquid nozzle 21 can spray out grinding liquid or polishing liquid. The grinding liquid is a slurry containing hard abrasive particles with a particle size of 500-5000 mesh. The hard abrasive particles are one or more of corundum, aluminum oxide, boron carbide, and diamond powder. The polishing liquid is a slurry containing silica sol with a particle size of 80-140nm.

[0040] Working principle of the present invention:

[0041] Before work, when it is necessary to adsorb the wafer body 9, the negative pressure rotating connector 72 is connected to the negative pressure pump, and then the wafer body 9 is assisted in adsorption through the suction cup 8, and the turntable 181 is rotated. The turntable 181 drives the rotating rod 18 to rotate as a whole. The rotating rod 18 and the slider 19 are threaded together, so that the slider 19 moves as a whole, and then drives the support rod 20 to drive the liquid nozzle 21 to move, and then moves the liquid nozzle 21 to the specified inclination angle.

[0042] During operation, the hydraulic rod 6 is extended as a whole, and the mounting plate 61 is driven to move during the extension process of the hydraulic rod 6, thereby driving the vacuum negative pressure rotating module 7 to move downward, and making the wafer body 9 fit on the top of the second grinding pad 142, and starting the hollow shaft motor 71. The hollow shaft motor 71 drives the suction cup 8 to rotate and drives the wafer body 9 to rotate counterclockwise as a whole. At the same time, the rotating motor 12 drives the rotating seat 13 to rotate clockwise, and the rotating seat 13 drives the mounting disk 14 to rotate, and the wafer body 9 is assisted in grinding by the second grinding pad 142 on the mounting disk 14.

[0043] When it is necessary to grind the edge of the wafer body 9, turn the knob 152, and the knob 152 drives the rotating rod 153 to rotate. The rotating rod 153 and the ring 154 are threaded together, so that the ring 154 moves as a whole. In the process of the movement of the ring 154, the sliding rod 155 is driven to move, and the sliding sleeve 156 is pushed or pulled, thereby effectively adjusting the overall inclination of the second mounting table 11. When the mounting plate 14 is in a tilted state, the edge of the wafer body 9 is pressed against the top of the second grinding pad 142. Since the first grinding pad 141 uses a low-density PU foam grinding pad, it can be ensured that the first grinding pad 141 is concave when encountering the pressure of the wafer body 9, so that the second grinding pad 142 is covered at the outer edge of the wafer body 9, thereby performing auxiliary grinding on the outer edge of the wafer body 9.

[0044] After the initial grinding, the stepper motor 5 is rotated to drive the top plate 4 to rotate 180 degrees, thereby rotating the wafer body 9 to the top of another mounting plate 14, and then performing a second fine grinding on the wafer body 9.

[0045] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiment without creative contribution as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A grinding device for semiconductor wafer material, comprising a receiving platform (1), characterized in that: A guide groove (2) is provided at the center of the top of the receiving platform (1), a fixed column (3) is vertically fixed at the center of the guide groove (2), a top plate (4) is rotatably embedded and installed at the top of the fixed column (3), a stepping motor (5) for assisting the top plate (4) to rotate is installed at the center of the top of the top plate (4), hydraulic rods (6) are symmetrically and vertically installed at both ends of the top of the top plate (4), a mounting plate (61) is fixed to the extended end of the hydraulic rod (6), a vacuum negative pressure rotating module (7) is installed at the bottom of the mounting plate (61), a suction cup (8) is installed at the bottom of the vacuum negative pressure rotating module (7), and a wafer body (9) is adsorbed and arranged on the suction cup (8); A first mounting platform (10) is symmetrically mounted on the top of the receiving platform (1), a second mounting platform (11) is mounted on the top of the first mounting platform (10), a rotating motor (12) is mounted at the center of the top of the second mounting platform (11), a rotating seat (13) is mounted on the front end of the shaft of the rotating motor (12), a mounting plate (14) is mounted on the top of the rotating seat (13), a first grinding pad (141) is mounted on the top of the mounting plate (14), the first grinding pad (141) is a low-density PU foam grinding pad, and a second grinding pad (142) for cooperating with the wafer body (9) for grinding is mounted on the top of the first grinding pad (141); The bottom of the second mounting platform (11) is in an arc-shaped structure, and a limiting groove (112) is provided at the bottom of the second mounting platform (11). The top of the first mounting platform (10) is in an arc-shaped groove shape, and a sliding block (102) is symmetrically fixed at the top of the first mounting platform (10), and the sliding block (102) slides in cooperation with the limiting groove (112). An adjustment cavity is provided inside the first mounting platform (10), and an adjustment component (15) for assisting the angle adjustment of the second mounting platform (11) is installed in the adjustment cavity; The adjustment assembly (15) includes a fixing seat (151) protruding and fixed on the outer plate of the first mounting platform (10), a rotating rod (153) is installed transversely through the fixing seat (151) and the adjustment cavity, a collar (154) is installed on the rotating rod (153), the rotating rod (153) and the collar (154) are threadedly engaged, a sliding rod (155) is fixed at the top of the collar (154), a sliding sleeve (156) is installed on the sliding rod (155), the top of the sliding sleeve (156) is hingedly installed at the bottom center of the limiting groove (112), and a knob (152) is fixed on one end of the rotating rod (153) extending out of the fixing seat (151); A scale plate (111) is embedded and mounted on one side of the second mounting platform (11), and angle scale lines are symmetrically engraved on the scale plate (111). A pointer (101) is protrudingly provided on one side of the first mounting platform (10), and the pointer (101) and the scale plate (111) cooperate to point. A snap-fit ​​groove (131) is provided at the outer edge of the top of the rotating seat (13), and a snap-fit ​​block (143) is protrudingly provided at the bottom of the mounting plate (14), wherein the snap-fit ​​groove (131) and the snap-fit ​​block (143) are fitted and fixed. Four clamping grooves (131) are provided, and the four clamping grooves (131) are arranged in a circular array with the center of the rotating seat (13) as the center. Four clamping blocks (143) are provided, and the four clamping blocks (143) are arranged in a circular array with the center of the mounting plate (14) as the center.

2. The semiconductor wafer polishing device according to claim 1, characterized in that: The clamping groove (131) comprises a penetration opening for the clamping block (143) to penetrate and a sliding groove for the clamping block (143) to slide and engage. The clamping block (143) is in an inverted T-shape as a whole.

3. The semiconductor wafer polishing device according to claim 1, wherein: The vacuum negative pressure rotating module (7) includes a hollow shaft motor (71), the suction cup (8) is installed at the bottom shaft end of the hollow shaft motor (71), and a negative pressure rotating connector (72) is installed at the top of the hollow shaft motor (71), one end of the negative pressure rotating connector (72) is connected to the negative pressure pump, and the air path of the other end of the negative pressure rotating connector (72) is connected to the suction cup (8).

4. The semiconductor wafer polishing device according to claim 1, wherein: A mounting rod (16) is vertically mounted on a side of the top of the receiving platform (1) corresponding to the first mounting platform (10); a liquid spray nozzle (21) is hingedly mounted on one end of the mounting rod (16) facing the first mounting platform (10); the mounting rod (16) and the liquid spray nozzle (21) are connected via a conducting tube (22); a lifting cavity is vertically opened on the outer side of the mounting rod (16); an auxiliary liquid spray nozzle (21) adjustment lifting assembly (17) is installed in the lifting cavity.

5. The semiconductor wafer polishing device according to claim 4, characterized in that: The lifting assembly (17) includes a rotating rod (18) vertically rotatably arranged in the lifting chamber, a slider (19) is sleeved and mounted on the rotating rod (18), the rotating rod (18) and the slider (19) are threadedly engaged with each other, a turntable (181) is fixed at the bottom of the rotating rod (18), a part of the turntable (181) extends out of the mounting rod (16), and a support rod (20) is hingedly mounted between the slider (19) and the liquid spraying nozzle (21).

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