High-precision edge grinding device for cadmium zinc telluride single crystal epitaxial wafer

Abstract

The invention relates to the technical field of epitaxial wafer processing, and discloses a tellurium-zinc-cadmium single crystal epitaxial wafer high-precision edge grinding device which comprises a grinding box, a feeding port is formed in the front face of the grinding box, a bidirectional threaded rod is installed in the grinding box in a threaded mode, and the top end of the bidirectional threaded rod extends out of the grinding box. A first rotating disc is fixedly installed at the top end of the bidirectional threaded rod, the positioning mechanism comprises a round disc arranged on the bidirectional threaded rod in a threaded and sleeving mode, a plurality of strip-shaped grooves are formed in the bottom of the round disc, and strip-shaped rods are slidably installed in the strip-shaped grooves correspondingly. Arc-shaped positioning blocks are fixedly mounted at the ends, away from each other, of the multiple strip-shaped rods correspondingly. By arranging the positioning mechanism and arranging a rubber block on the placing circular plate, the friction force of the epitaxial wafer can be increased, the placing circular plate and the epitaxial wafer are prevented from deviating in the rotating process of the placing circular plate, and the edge grinding stability and reliability are effectively improved.

Description

Technical Field

[0001] The invention relates to the technical field of epitaxial wafer processing equipment, in particular to a high-precision edge grinding device for a cadmium zinc telluride single crystal epitaxial wafer. Background Art

[0002] Cadmium zinc telluride single crystal epitaxial wafer is a substrate for growing zincide semiconductor materials. Zincide semiconductor materials have important applications in the field of optoelectronic devices, such as LEDs, laser diodes, etc. Cadmium zinc telluride refers to a broken zinc pot, which is usually broken by rapid cooling at high temperature or by external force. The surface structure of cadmium zinc telluride is special, which helps to form single crystal epitaxial wafers. Single crystal epitaxial wafers are single crystal thin slices grown on zinc pots and can be used as substrates for semiconductor materials. During the epitaxial process, the zincide material will gradually form a single crystal structure on the surface of cadmium zinc telluride, thereby obtaining a thin slice with excellent crystal quality.

[0003] In the process of edge grinding of epitaxial wafers, especially circular epitaxial wafers, the center of the circle must be located first. Otherwise, the epitaxial wafer formed after edge grinding will have an irregular shape. In addition, the processed epitaxial wafer must be complete, so a special method is required to locate the center of the circular epitaxial wafer. Summary of the invention

[0004] The object of the present invention is to provide a high-precision edge grinding device for a cadmium zinc telluride single crystal epitaxial wafer, so as to solve the problem that the center of the circle needs to be positioned, otherwise the epitaxial wafer formed after edge grinding will have an irregular shape.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a high-precision edge grinding device for cadmium zinc telluride single crystal epitaxial wafers, comprising a grinding box, a feed port is provided on the front of the grinding box, a bidirectional threaded rod is installed in the inner thread of the grinding box, the top of the bidirectional threaded rod extends outside the grinding box, a turntable 1 is fixedly installed on the top of the bidirectional threaded rod, and further comprising:

[0007] The positioning mechanism comprises a circular disk threadedly mounted on a bidirectional threaded rod, a plurality of strip grooves being provided at the bottom of the circular disk, strip rods being slidably mounted in the plurality of strip grooves, arc-shaped positioning blocks being fixedly mounted at the ends of the plurality of strip rods away from each other, limiting rods being fixedly mounted at the bottoms of the plurality of strip rods, and the bottom ends of the plurality of limiting rods extending outside the plurality of strip grooves.

[0008] Furthermore, an adjustment mechanism is provided at the bottom of the circular disk, and the adjustment mechanism includes a cylinder rotatably mounted on the bottom of the circular disk, a circular plate is fixedly sleeved on the outer wall of the cylinder, a plurality of curved limit grooves are opened on the circular plate, the bottom ends of a plurality of the limit rods respectively extend into the plurality of curved limit grooves and are respectively adapted to the plurality of curved limit grooves, and a plurality of teeth are fixedly mounted on the outer wall of the circular plate.

[0009] Furthermore, the circular disk has an opening and closing mechanism, which includes a rotating rod slidably mounted on the top of the polishing box, a rotating disk 2 is fixedly mounted on the top of the rotating rod, the rotating rod passes through the circular disk and is rotatably connected to the circular disk, a gear is fixedly sleeved on the rotating rod, and the gear is meshed with a plurality of teeth.

[0010] Furthermore, a rotating mechanism is provided in the polishing box, and the rotating mechanism includes a plurality of support rods fixedly mounted on the bottom inner wall of the polishing box, a mounting plate fixedly mounted on the top of the plurality of support rods, a worm rotatably mounted on the top of the mounting plate, a driving motor fixedly mounted on the bottom inner wall of the polishing box, the worm passing through the mounting plate and fixedly connected to the output shaft of the driving motor.

[0011] Furthermore, a fixing mechanism is provided at the top of the worm, and the fixing mechanism includes a circular plate fixedly mounted on the top of the worm, a plurality of rubber blocks are provided on the circular plate, an epitaxial wafer is provided on the top of the circular plate, a clamping plate is provided on the top of the epitaxial wafer, the clamping plate is in contact with the epitaxial wafer, and the top of the clamping plate is rotatably connected to the bidirectional threaded rod.

[0012] Furthermore, two transmission mechanisms are arranged in the polishing box, and the transmission mechanism includes a rotating shaft rotatably installed in the polishing box, a turbine is fixedly sleeved on the rotating shaft, the turbine is meshed with the worm, and a telescopic cylinder is fixedly sleeved on the rotating shaft.

[0013] Furthermore, two pushing mechanisms are arranged in the grinding box, and the pushing mechanism includes a hydraulic cylinder fixedly mounted on the right inner wall of the grinding box, a movable plate is fixedly mounted on the output shaft of the hydraulic cylinder, a rotating shaft is rotatably mounted on the left side of the movable plate, a grinding wheel is fixedly sleeved on the rotating shaft, a sliding rod is fixedly mounted in the grinding box, the sliding rod passes through the movable plate and is slidably connected to the movable plate, pulleys are fixedly sleeved on the rotating shaft and the telescopic cylinder, and synchronous belts are wound around the two pulleys.

[0014] Furthermore, a cooling mechanism is provided on the top of the polishing box, and the cooling mechanism includes a cooling box fixedly installed on the top of the polishing box, a water pump is fixedly installed on the back of the polishing box, a water inlet pipe is fixedly installed on the back of the water pump, the top of the water inlet pipe is fixedly connected to the cooling box, a water outlet pipe is fixedly installed on the front of the water pump, and the front end of the water outlet pipe extends into the polishing box, a plurality of slopes are opened on the inner wall of the bottom of the polishing box, and a plurality of collecting boxes are fixedly installed on the outer wall of the polishing box, and the plurality of slopes are respectively communicated with a plurality of collecting boxes.

[0015] The present invention has the following beneficial effects:

[0016] (1) The present invention provides a high-precision edge grinding device for a cadmium zinc telluride single crystal epitaxial wafer. First, a turntable 1 is rotated, and the turntable 1 drives a bidirectional threaded rod to rotate. The bidirectional threaded rod moves upward under the action of the bidirectional thread. At this time, a circular disk moves downward under the action of the bidirectional thread. When the circular disk drives the arc-shaped positioning block to move to a suitable position, a turntable 2 is rotated, and the turntable 2 drives a rotating rod to rotate. The rotating rod drives a gear to rotate. The gear drives a circular plate to rotate under the action of a plurality of teeth. When the circular plate rotates, it drives a plurality of curved limiting grooves to move. The curved limiting grooves drive the limiting rods to approach each other toward the center of the circular disk. At this time, a plurality of limiting rods drive a plurality of strip rods to move. A plurality of strip rods drive a plurality of arc-shaped positioning blocks to approach each other and position the epitaxial wafer, thereby effectively positioning the processing position of the epitaxial wafer and preventing the epitaxial wafer from deviating from the circle, resulting in ineffective edge grinding.

[0017] (2) The present invention provides a high-precision edge grinding device for a cadmium zinc telluride single crystal epitaxial wafer. After positioning is completed, the bidirectional threaded rod rotates in the opposite direction, and the bidirectional threaded rod drives the circular plate to move upward. Conversely, the bidirectional threaded rod moves downward, and the bidirectional threaded rod drives the clamping plate to move downward until it squeezes the epitaxial wafer. By setting a rubber block on the placement circular plate, the friction force of the epitaxial wafer can be increased, and the placement circular plate and the epitaxial wafer can be prevented from offsetting during the rotation of the placement circular plate, thereby effectively improving the stability and reliability of edge grinding.

[0018] (3) The present invention provides a high-precision edge grinding device for cadmium zinc telluride single crystal epitaxial wafers. During the edge grinding process, the driving motor is first started, the driving motor drives the worm to rotate, the worm drives the placement circular plate to rotate, the placement circular plate drives the epitaxial wafer to rotate, the worm also drives the two rotating shafts to rotate at the same time under the action of two turbines, the two rotating shafts drive the two telescopic cylinders to rotate, under the action of the pulley and the synchronous belt, the two telescopic cylinders drive the two rotating shafts to rotate, the two rotating shafts drive the two edge grinding wheels to rotate at the same time, and then the two hydraulic cylinders are started according to the size of the edge grinding required, the two hydraulic cylinders drive the two movable plates to approach each other at the same time, under the action of the two telescopic cylinders, the two pulleys and the two synchronous belts move synchronously, the two movable plates drive the two edge grinding wheels to approach each other at the same time, and when the two edge grinding wheels contact the epitaxial wafer, the rotating epitaxial wafer will be ground, effectively improving the grinding accuracy;

[0019] (4) The present invention provides a high-precision edge grinding device for cadmium zinc telluride single crystal epitaxial wafers. During the grinding process, a water pump is started. The water pump sprays the coolant in the cooling box onto the epitaxial wafer through the water outlet pipe, thereby cooling the heat generated during the edge grinding process of the epitaxial wafer to avoid damage to the epitaxial wafer due to excessive temperature during edge grinding. The cooled coolant falls on the bottom inner wall of the grinding box, and then flows into a plurality of collection boxes through a plurality of slopes for collection.

[0020] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a side cross-sectional structural schematic diagram of the present invention;

[0024] Figure 3 For the present invention Figure 2 A is a schematic diagram of the enlarged structure of the middle part;

[0025] Figure 4 It is a front cross-sectional structural schematic diagram of the present invention;

[0026] Figure 5 For the present invention Figure 4 Schematic diagram of the enlarged structure of B;

[0027] Figure 6 For the present invention Figure 2 Schematic diagram of the enlarged structure of C;

[0028] Figure 7 It is a schematic diagram of the internal structure of the present invention;

[0029] Figure 8 For the present invention Figure 7 Schematic diagram of the enlarged structure of D in the figure.

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] In the figure: 1, grinding box; 101, feed port; 2, bidirectional threaded rod; 3, turntable 1; 4, round plate; 5, strip groove; 6, strip rod; 7, arc-shaped positioning block; 8, limit rod; 9, cylinder; 10, round plate; 11, curved limit groove; 12, teeth; 13, turn rod; 14, turntable 2; 15, gear; 16, support rod; 17, mounting plate; 18, worm; 19, drive motor; 20. Placement circular plate; 21. Rubber block; 22. Epitaxial wafer; 23. Clamping plate; 24. Rotating shaft; 25. Turbine; 26. Telescopic cylinder; 27. Hydraulic cylinder; 28. Movable plate; 29. ​​Rotating shaft; 30. Edge grinding wheel; 31. Sliding rod; 32. Pulley; 33. Synchronous belt; 34. Cooling box; 35. Water pump; 36. Water inlet pipe; 37. Water outlet pipe; 38. Slope; 39. Collecting box. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-Figure 8 As shown, the present invention is a high-precision edge grinding device for cadmium zinc telluride single crystal epitaxial wafers, comprising a grinding box 1, a feed port 101 is provided on the front of the grinding box 1, a bidirectional threaded rod 2 is installed in the internal thread of the grinding box 1, the top of the bidirectional threaded rod 2 extends to the outside of the grinding box 1, a turntable 3 is fixedly installed on the top of the bidirectional threaded rod 2, and further comprising:

[0034] The positioning mechanism includes a circular disk 4 threadedly sleeved on a bidirectional threaded rod 2, a plurality of strip grooves 5 are provided at the bottom of the circular disk 4, strip rods 6 are slidably installed in the plurality of strip grooves 5, arc-shaped positioning blocks 7 are fixedly installed at the ends of the plurality of strip rods 6 that are away from each other, and limiting rods 8 are fixedly installed at the bottoms of the plurality of strip rods 6, and the bottom ends of the plurality of limiting rods 8 extend outside the plurality of strip grooves 5 respectively.

[0035] As shown in Figure 3, an adjustment mechanism is provided at the bottom of the circular disk 4, and the adjustment mechanism includes a cylinder 9 rotatably mounted on the bottom of the circular disk 4, a circular plate 10 is fixedly sleeved on the outer wall of the cylinder 9, a plurality of curved limit grooves 11 are opened on the circular plate 10, the bottom ends of a plurality of limit rods 8 extend into the plurality of curved limit grooves 11 respectively and are respectively matched with the plurality of curved limit grooves 11, and a plurality of teeth 12 are fixedly mounted on the outer wall of the circular plate 10.

[0036] By setting up an adjustment mechanism, the circular plate 10 can drive several curved limit grooves 11 to move when it rotates, and the curved limit grooves 11 drive the limit rods 8 to approach each other toward the center of the circular disk 4. At this time, several limit rods 8 drive several strip rods 6 to move, and several strip rods 6 drive several arc-shaped positioning blocks 7 to approach each other and position the epitaxial wafer 22, effectively positioning the processing position of the epitaxial wafer 22, and avoiding the epitaxial wafer 22 from deviating from the circle, resulting in invalid processing and edging.

[0037] like Figure 1 and Figure 5 As shown, the circular disk 4 has an opening and closing mechanism, which includes a rotating rod 13 slidably mounted on the top of the grinding box 1, a rotating disk 14 is fixedly mounted on the top of the rotating rod 13, the rotating rod 13 passes through the circular disk 4 and is rotatably connected to the circular disk 4, a gear 15 is fixedly sleeved on the rotating rod 13, and the gear 15 is meshed with a plurality of teeth 12.

[0038] By setting up the opening and closing mechanism, the turntable 14 can be rotated, the turntable 14 drives the rotating rod 13 to rotate, the rotating rod 13 drives the gear 15 to rotate, and the gear 15 drives the circular plate 10 to rotate under the action of the plurality of teeth 12, so that the plurality of arc-shaped positioning blocks 7 move closer and farther away.

[0039] like Figure 6 As shown, a rotating mechanism is provided in the grinding box 1, and the rotating mechanism includes a plurality of support rods 16 fixedly mounted on the bottom inner wall of the grinding box 1, a mounting plate 17 is fixedly mounted on the top of the plurality of support rods 16, a worm 18 is rotatably mounted on the top of the mounting plate 17, a driving motor 19 is fixedly mounted on the bottom inner wall of the grinding box 1, the worm 18 penetrates the mounting plate 17 and is fixedly connected to the output shaft of the driving motor 19.

[0040] By providing a rotating mechanism, the second rotating disk 14 can be rotated, the second rotating disk 14 drives the rotating rod 13 to rotate, and the rotating rod 13 drives the gear 15 to rotate, thereby providing a power source for the opening and closing mechanism.

[0041] like Figure 5As shown, a fixing mechanism is provided at the top of the worm 18, and the fixing mechanism includes a circular plate 20 fixedly mounted on the top of the worm 18, a plurality of rubber blocks 21 are provided on the circular plate 20, an epitaxial wafer 22 is provided on the top of the circular plate 20, a clamping plate 23 is provided on the top of the epitaxial wafer 22, the clamping plate 23 is in contact with the epitaxial wafer 22, and the top of the clamping plate 23 is rotatably connected to the bidirectional threaded rod 2.

[0042] By setting up a fixing mechanism, the bidirectional threaded rod 2 can be rotated, and the bidirectional threaded rod 2 drives the circular disk 4 to move upward. Conversely, the bidirectional threaded rod 2 will move downward, and the bidirectional threaded rod 2 drives the clamping plate 23 to move downward until it squeezes the epitaxial wafer 22, thereby completing the fixation of the epitaxial wafer 22.

[0043] like Figure 7 As shown, two transmission mechanisms are arranged in the polishing box 1, and the transmission mechanism includes a rotating shaft 24 rotatably installed in the polishing box 1, a turbine 25 is fixedly sleeved on the rotating shaft 24, the turbine 25 is meshed with the worm 18, and a telescopic cylinder 26 is fixedly sleeved on the rotating shaft 24.

[0044] By setting up the transmission mechanism, the worm 18 can also drive the two rotating shafts 24 to rotate at the same time under the action of the two turbines 25, and the two rotating shafts 24 drive the two telescopic cylinders 26 to rotate, thereby providing power for edge grinding.

[0045] like Figure 8 As shown, two pushing mechanisms are arranged in the grinding box 1, and the pushing mechanisms include a hydraulic cylinder 27 fixedly mounted on the right inner wall of the grinding box 1, a movable plate 28 is fixedly mounted on the output shaft of the hydraulic cylinder 27, a rotating shaft 29 is rotatably mounted on the left side of the movable plate 28, an edging wheel 30 is fixedly sleeved on the rotating shaft 29, a sliding rod 31 is fixedly mounted in the grinding box 1, the sliding rod 31 passes through the movable plate 28 and is slidably connected with the movable plate 28, pulleys 32 are fixedly sleeved on the rotating shaft 29 and the telescopic cylinder 26, and synchronous belts 33 are wound around the two pulleys 32.

[0046] By setting up a pushing mechanism, the two telescopic cylinders 26 can drive the two rotating shafts 29 to rotate, and the two rotating shafts 29 can drive the two edge grinding wheels 30 to rotate at the same time, and then the two hydraulic cylinders 27 are started according to the required edge grinding size, and the two hydraulic cylinders 27 can drive the two movable plates 28 to approach each other at the same time. Under the action of the two telescopic cylinders 26, the two pulleys 32 and the two synchronous belts 33 can move synchronously, and the two movable plates 28 can drive the two edge grinding wheels 30 to approach each other at the same time. When the two edge grinding wheels 30 contact the epitaxial wafer 22, the rotating epitaxial wafer 22 will be polished, thereby effectively improving the grinding accuracy.

[0047] like Figure 2As shown, a cooling mechanism is provided on the top of the polishing box 1, and the cooling mechanism includes a cooling box 34 fixedly installed on the top of the polishing box 1, a water pump 35 is fixedly installed on the back of the polishing box 1, a water inlet pipe 36 is fixedly installed on the back of the water pump 35, the top of the water inlet pipe 36 is fixedly connected to the cooling box 34, a water outlet pipe 37 is fixedly installed on the front of the water pump 35, and the front end of the water outlet pipe 37 extends into the polishing box 1, a plurality of slopes 38 are opened on the inner wall of the bottom of the polishing box 1, and a plurality of collecting boxes 39 are fixedly installed on the outer wall of the polishing box 1, and the plurality of slopes 38 are respectively communicated with the plurality of collecting boxes 39.

[0048] By setting up a cooling mechanism, the water pump 35 can be started during the grinding process. The water pump 35 sprays the coolant in the cooling box 34 onto the epitaxial wafer 22 through the outlet pipe 37, so as to cool down the heat generated during the edge grinding of the epitaxial wafer 22, thereby avoiding damage to the epitaxial wafer 22 due to excessive temperature during edge grinding.

[0049] When in use, first rotate the turntable 1 3, the turntable 1 3 drives the bidirectional threaded rod 2 to rotate, and the bidirectional threaded rod 2 moves upward under the action of the bidirectional thread. At this time, the circular disk 4 moves downward under the action of the bidirectional thread. When the circular disk 4 drives the arc-shaped positioning block 7 to move to a suitable position, rotate the turntable 2 14, the turntable 2 14 drives the rotating rod 13 to rotate, the rotating rod 13 drives the gear 15 to rotate, and the gear 15 drives the circular plate 10 to rotate under the action of a plurality of teeth 12. When the circular plate 10 rotates, it drives a plurality of curved limit grooves 11 to move, and the curved limit grooves 11 drive the limit rods 8 to approach each other to the center position of the circular disk 4. At this time, a plurality of limit rods 8 drive a plurality of strip rods 6 to move, and a plurality of strip rods 6 move. The bidirectional threaded rod 6 drives several arc-shaped positioning blocks 7 to approach each other and position the epitaxial wafer 22, effectively positioning the processing position of the epitaxial wafer 22, and preventing the epitaxial wafer 22 from deviating from the circle, resulting in invalid processing and edge grinding; after the positioning is completed, the bidirectional threaded rod 2 is rotated in the opposite direction, and the bidirectional threaded rod 2 drives the circular plate 4 to move upward, and vice versa, the bidirectional threaded rod 2 will move downward, and the bidirectional threaded rod 2 drives the clamping plate 23 to move downward until it squeezes the epitaxial wafer 22. The friction force of the epitaxial wafer 22 can be increased by setting the rubber block 21 on the placement circular plate 20, so as to prevent the placement circular plate 20 and the epitaxial wafer 22 from offsetting during the rotation of the placement circular plate 20, and effectively improve the stability and reliability of edge grinding;

[0050] During the edging process, the drive motor 19 is first started, the drive motor 19 drives the worm 18 to rotate, the worm 18 drives the placement circular plate 20 to rotate, the placement circular plate 20 drives the epitaxial wafer 22 to rotate, the worm 18 also drives the two rotating shafts 24 to rotate at the same time under the action of the two turbines 25, the two rotating shafts 24 drive the two telescopic cylinders 26 to rotate, under the action of the pulley 32 and the synchronous belt 33, the two telescopic cylinders 26 will drive the two rotating shafts 29 to rotate, the two rotating shafts 29 will drive the two edging wheels 30 to rotate at the same time, and then the two hydraulic cylinders 27 are started according to the required edging size, the two hydraulic cylinders 27 simultaneously drive the two movable plates 28 to move closer to each other, under the action of the two telescopic cylinders 26 The two pulleys 32 and the two synchronous belts 33 will move synchronously, and the two movable plates 28 will simultaneously drive the two edge grinding wheels 30 to approach each other. When the two edge grinding wheels 30 contact the epitaxial wafer 22, the rotating epitaxial wafer 22 will be ground, effectively improving the grinding accuracy; during the grinding process, the water pump 35 is started, and the water pump 35 sprays the coolant in the cooling box 34 onto the epitaxial wafer 22 through the outlet pipe 37, and cools down the heat generated during the edge grinding of the epitaxial wafer 22, so as to avoid the epitaxial wafer 22 being damaged due to excessive temperature during edge grinding. The cooled coolant falls on the bottom inner wall of the grinding box 1, and then flows into several collecting boxes 39 through several slopes 38 for collection.

[0051] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A high-precision edge grinding device for cadmium zinc telluride single crystal epitaxial wafers, comprising a grinding box (1), a feed port (101) is provided on the front of the grinding box (1), a bidirectional threaded rod (2) is internally threadedly installed in the grinding box (1), the top end of the bidirectional threaded rod (2) extends to the outside of the grinding box (1), and a turntable (3) is fixedly installed on the top end of the bidirectional threaded rod (2), characterized in that: Also includes: The positioning mechanism comprises a circular plate (4) threadedly sleeved on a bidirectional threaded rod (2), a plurality of strip grooves (5) being provided at the bottom of the circular plate (4), strip rods (6) being slidably mounted in the plurality of strip grooves (5), arc-shaped positioning blocks (7) being fixedly mounted at the ends of the plurality of strip rods (6) which are away from each other, limiting rods (8) being fixedly mounted at the bottoms of the plurality of strip rods (6), and the bottom ends of the plurality of limiting rods (8) extending out of the plurality of strip grooves (5).

2. The high-precision edge grinding device for CdZnTe single crystal epitaxial wafer according to claim 1, characterized in that: An adjusting mechanism is provided at the bottom of the circular disk (4), and the adjusting mechanism comprises a cylinder (9) rotatably mounted at the bottom of the circular disk (4); a circular plate (10) is fixedly sleeved on the outer wall of the cylinder (9); a plurality of curved limit grooves (11) are provided on the circular plate (10); the bottom ends of a plurality of limit rods (8) respectively extend into the plurality of curved limit grooves (11) and respectively match the plurality of curved limit grooves (11); a plurality of teeth (12) are fixedly mounted on the outer wall of the circular plate (10).

3. The high-precision edge grinding device for CdZnTe single crystal epitaxial wafer according to claim 2, characterized in that: The circular disk (4) is provided with an opening and closing mechanism, the opening and closing mechanism comprising a rotating rod (13) slidably mounted on the top of the polishing box (1), a rotating disk 2 (14) being fixedly mounted on the top of the rotating rod (13), the rotating rod (13) passing through the circular disk (4) and being rotatably connected to the circular disk (4), a gear (15) being fixedly sleeved on the rotating rod (13), the gear (15) being meshed with a plurality of teeth (12).

4. The high-precision edge grinding device for CdZnTe single crystal epitaxial wafer according to claim 1, characterized in that: A rotating mechanism is arranged inside the polishing box (1), and the rotating mechanism comprises a plurality of support rods (16) fixedly mounted on the inner wall of the bottom of the polishing box (1), a mounting plate (17) fixedly mounted on the top of the plurality of support rods (16), a worm (18) rotatably mounted on the top of the mounting plate (17), a driving motor (19) fixedly mounted on the inner wall of the bottom of the polishing box (1), and the worm (18) penetrates the mounting plate (17) and is fixedly connected to the output shaft of the driving motor (19).

5. The high-precision edge grinding device for CdZnTe single crystal epitaxial wafer according to claim 4, characterized in that: The top of the worm (18) is provided with a fixing mechanism, the fixing mechanism comprising a circular plate (20) fixedly mounted on the top of the worm (18), a plurality of rubber blocks (21) being provided on the circular plate (20), an epitaxial wafer (22) being provided on the top of the circular plate (20), a clamping plate (23) being provided on the top of the epitaxial wafer (22), the clamping plate (23) being in contact with the epitaxial wafer (22), and the top of the clamping plate (23) being rotatably connected to the bidirectional threaded rod (2).

6. The high-precision edge grinding device for CdZnTe single crystal epitaxial wafer according to claim 4, characterized in that: Two transmission mechanisms are arranged in the polishing box (1), and the transmission mechanism comprises a rotating shaft (24) rotatably mounted in the polishing box (1), a turbine (25) is fixedly sleeved on the rotating shaft (24), the turbine (25) is meshed with the worm (18), and a telescopic cylinder (26) is fixedly sleeved on the rotating shaft (24).

7. The high-precision edge grinding device for CdZnTe single crystal epitaxial wafer according to claim 6, characterized in that: Two pushing mechanisms are arranged in the polishing box (1), and the pushing mechanisms include a hydraulic cylinder (27) fixedly mounted on the right inner wall of the polishing box (1), a movable plate (28) fixedly mounted on the output shaft of the hydraulic cylinder (27), a rotating shaft (29) rotatably mounted on the left side of the movable plate (28), an edging wheel (30) fixedly sleeved on the rotating shaft (29), a sliding rod (31) fixedly mounted in the polishing box (1), the sliding rod (31) passes through the movable plate (28) and is slidably connected to the movable plate (28), pulleys (32) are fixedly sleeved on the rotating shaft (29) and the telescopic cylinder (26), and synchronous belts (33) are wound around the two pulleys (32).

8. The high-precision edge grinding device for CdZnTe single crystal epitaxial wafer according to claim 1, characterized in that: A cooling mechanism is arranged on the top of the polishing box (1), and the cooling mechanism comprises a cooling box (34) fixedly mounted on the top of the polishing box (1); a water pump (35) is fixedly mounted on the back of the polishing box (1); a water inlet pipe (36) is fixedly mounted on the back of the water pump (35); the top of the water inlet pipe (36) is fixedly connected to the cooling box (34); a water outlet pipe (37) is fixedly mounted on the front of the water pump (35); the front end of the water outlet pipe (37) extends into the polishing box (1); a plurality of slopes (38) are provided on the inner wall of the bottom of the polishing box (1); a plurality of collecting boxes (39) are fixedly mounted on the outer wall of the polishing box (1); and a plurality of the slopes (38) are respectively connected to a plurality of collecting boxes (39).

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