Blade for cutting packaging material and packaging material pressing and cutting device applying same

Abstract

The invention relates to a blade for cutting a packaging material and a packaging material pressing and cutting device applying the same. According to one embodiment of the present invention, the sealing material press-cutting device press-cuts a sealing material by moving an upper cutting head in the vertical direction, and comprises: a plate detachably attached to the upper cutting head; the blade is embedded into the plate, one end of the blade protrudes out of the embedded plate, and the shape and the size of the blade correspond to the shape and the size of the packaging material for the OLED panel to be cut; the inner side supporting plate is located on one surface of the plate and formed along the inner circumferential surface of the blade, and the surface of the blade can be coated with a diamond-like carbon film formed in a physical vapor deposition mode.

Description

Technical Field

[0001] The present invention relates to a blade for cutting packaging materials and a packaging material pressing and cutting device using the same, and more particularly to a packaging material pressing and cutting device, which comprises a blade for cutting packaging materials (FSPM) for OLED panels, wherein the hardness and durability of the blade are improved by coating a diamond-like carbon (DLC) film, and the device also comprises a structure for reducing defects in the packaging materials when cutting the packaging materials for OLED panels. Background Art

[0002] Organic light emitting diode (OLED) is a light emitting diode whose light emitting layer is formed by thin film organic compounds. It uses the electroluminescence phenomenon that generates light by passing current through fluorescent organic compounds. This type of organic light emitting diode generally realizes the main colors by three-color (red, green, blue) independent pixel method, biological conversion method (CCM), color filter method, etc., and is divided into low-molecular organic light emitting diode and high-molecular organic light emitting diode according to the amount of organic substances contained in the light emitting material used. In addition, it can be divided into passive drive method and active drive method according to the driving method.

[0003] This organic light-emitting diode has the characteristics of high efficiency based on self-luminescence, low voltage drive, and simple drive, so it has the advantage of being able to express high-quality video. In addition, the application of flexible displays and organic electronic components that utilize the flexibility of organic materials is also highly anticipated.

[0004] Organic light-emitting diodes are manufactured by stacking organic compounds as light-emitting layers in a thin film on a substrate. However, organic compounds used in organic light-emitting diodes are very sensitive to impurities, oxygen, and moisture, and thus have the problem of easily deteriorating their properties due to exposure to the outside or penetration of moisture and oxygen. This organic degradation phenomenon affects the light-emitting properties of organic light-emitting diodes and shortens their lifespan. In order to prevent this phenomenon, a thin film encapsulation process (Thin Film Encapsulation) is required to prevent oxygen, moisture, etc. from flowing into the interior of organic electronic devices.

[0005] Korean Publication Patent No. 10-2006-0030718 (2006.04.11) is an invention related to an existing packaging method, in which an existing metal can or glass is processed into a lid with a groove, and a desiccant for absorbing moisture is loaded in the groove in a powdered form. However, this method has the problem of being difficult to simultaneously achieve the following effects due to the encapsulated organic electronic device: removing moisture to the target level; blocking moisture, impurities and other undesirable substances from approaching the organic electronic device; preventing interlayer delamination that may occur when removing moisture; and having excellent moisture resistance and heat resistance.

[0006] Furthermore, as another existing method for manufacturing packaging materials for organic electronic devices, the packaging materials are manufactured by using a CO2 laser cutting method to cut the packaging resin layer and the release layer for the first time, and then using a fiber laser to cut the metal layer for the second time. However, the production process of this existing laser cutting method is complicated and requires a long production time. A thermal deformation area occurs between the packaging resin layer and the release layer (a bulge is formed on the upper part of the release layer and residues occur on the cut surfaces of the packaging resin layer and the release layer), which makes it difficult to remove the release layer. In addition, burrs occur on the cut cross section due to heat damage, and since an off-set area occurs during the second cutting, there is a problem that the life of the organic electronic device is shortened corresponding to the off-set area.

[0007] In order to solve the above problems, a press cutting (punching) process using a blade for cutting packaging materials is being studied recently, but the problems of bending of corners and large dimensional deviations still need to be solved.

[0008] In addition, due to the characteristics of the press cutting (punching) process, when the process is repeated, there occurs a problem that it is difficult to produce a high-quality packaging material due to damage to the blade. Summary of the invention

[0009] Technical issues

[0010] The present invention aims to solve the above-mentioned problems and provide a packaging material cutting blade having improved hardness, wear resistance and sliding properties and a packaging material pressing and cutting device using the same.

[0011] However, the technical problems to be solved by this embodiment are not limited to the above-mentioned technical problems, and there may be other technical problems.

[0012] Technical Solution

[0013] A packaging material pressing and cutting device according to an embodiment of the present invention presses and cuts packaging materials by moving an upper cutting head in the up and down directions, and comprises: a plate, detachably mounted on the upper cutting head; a blade, embedded in the plate, one end of which protrudes from the embedded plate and is formed to correspond to the shape and size of the packaging material for the OLED panel to be cut; and an inner support plate, located on one surface of the plate and formed along the inner circumferential surface of the blade, on the surface of the blade may be coated with a diamond-like carbon (DLC) film formed by physical vapor deposition (PVD).

[0014] In addition, the coating thickness of the diamond-like carbon film of the blade may be 100 to 2000 nm.

[0015] In addition, the blade is arranged on the plate in a quadrangular shape, and the edge corners of the blade can be rounded with a predetermined R value.

[0016] In addition, one of the two adjacent blades of the corner may be extended to fill a space between the two adjacent blade edges formed at the corner.

[0017] In addition, an adhesive resin may be filled between the embedded blade and the plate.

[0018] In addition, the inner support plate includes a first inner support component adjacent to the packaging material for the OLED panel to be cut and a second inner support component stacked on the first inner support component, and the second inner support component can be a material that can be elastically deformed.

[0019] In addition, the first inner supporting member may be connected to a virtual axis extending from one end of the blade in a vertical direction.

[0020] In addition, a filler is further included, and the filler is used to fill the space formed between the first inner support member, the second inner support member and the blade. The filler is an elastically deformable material, and its elastic modulus can be greater than the elastic modulus of the second inner support member.

[0021] In addition, an outer support plate formed along the outer peripheral surface of the blade may be further included.

[0022] In addition, pores and air passages may be formed on the other surface of the plate, wherein the pores penetrate from the other surface of the plate to one surface to allow air circulation, and the air passages are recessed from the other surface of the plate to one surface to discharge the air in the pores to the outside.

[0023] In addition, the plate is detachably mounted on the upper cutting head by a predetermined combining method, and the predetermined combining method may be at least one of a bolting method, a chucking method, a bonding method, and a combination thereof.

[0024] Effects of the Invention

[0025] The packaging material cutting blade and the packaging material pressing and cutting device using the same of the present invention can improve the hardness and durability of the coated blade by coating a diamond-like carbon (DLC) film on the blade.

[0026] In addition, by including an inner support plate formed along the inner peripheral surface of the blade, the inner support plate presses the packaging material, thereby reducing defects in the packaging material after cutting.

[0027] In addition, by further including an outer support plate formed along the outer peripheral surface of the blade, the problem of enlarged gap between the plate and the blade in the cutting device and the problem of bending / deformation of the corners of the product can be effectively solved.

[0028] In addition, by changing the shape of the blade so that a predetermined space is not formed at the corner, it is possible to prevent the corner of the product from being bent or deformed.

[0029] Furthermore, by filling the adhesive resin between the blade and the plate, deformation of the blade can be prevented.

[0030] However, the effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand the effects not mentioned based on this specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic overall stereoscopic diagram of a packaging material pressing and cutting device for an OLED panel according to an embodiment of the present invention.

[0032] Figure 2 4 is a schematic top view of a packaging material pressing and cutting device according to an embodiment of the present invention.

[0033] Figure 3 It is a schematic diagram showing the cutting process of the packaging material pressing and cutting device of the prior invention.

[0034] Figure 4 Schematic diagram showing the cutting process of the packaging material pressing and cutting device according to an embodiment of the present invention.

[0035] Figure 5 It is a diagram for explaining an inner support plate of a packaging material pressing and cutting device according to an embodiment of the present invention.

[0036] Figure 6 It is a diagram for explaining a filler of a packaging material pressing and cutting device according to an embodiment of the present invention.

[0037] Figure 7 It is a diagram for explaining an outer supporting plate of a packaging material pressing and cutting device according to an embodiment of the present invention.

[0038] Figure 8 This is a diagram for explaining the filling of adhesive resin between the blade and the plate of the packaging material pressing and cutting device according to one embodiment of the present invention.

[0039] Figures 9 to 11 It is a diagram for comparing a conventional packaging material cutting method and a cutting method using the packaging material press-cutting device of the present invention.

[0040] Fig.12 is a graph showing the extent of damage to an uncoated insert.

[0041] Fig.13 The figure shows the degree of damage of a blade coated with a diamond-like carbon (DLC) film.

[0042] Fig.14 is a diagram showing an SEM image of a blade coated with a diamond-like carbon film.

[0043] Reference numerals

[0044] W: Packaging materials for OLED panels 1: Packaging material pressing and cutting device

[0045] 10: Upper fixed plate 20: Plate

[0046] 30: Blade 40: Inner support plate

[0047] 41: first inner supporting member 42: second inner supporting member

[0048] 50: Outer support plate 60: Filler

[0049] P10: Stoma P20: Airway Specific implementation methods

[0051] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the concept of the present invention is not limited to the proposed embodiments, and those skilled in the art who understand the concept of the present invention can easily propose other inventions or other embodiments within the scope of the concept of the present invention by adding, changing, deleting, etc. other components within the same concept, but this is also within the scope of the concept of the present invention.

[0052] In addition, the terms used in the present invention are only used to illustrate specific embodiments and are not intended to limit the present invention. Unless the context clearly stipulates otherwise, singular expressions include plural expressions. Throughout the specification, unless otherwise stated, "comprising" a certain constituent element means that another constituent element may be further included, rather than excluding another constituent element.

[0053] Figure 1 is a schematic overall stereogram of a packaging material pressing and cutting device 1 according to an embodiment of the present invention, Figure 2 1 is a schematic top view of a packaging material pressing and cutting device 1 according to an embodiment of the present invention.

[0054] Reference Figure 1 and Figure 2 , an OLED panel packaging material pressing and cutting device 1 according to an embodiment of the present invention presses and cuts the packaging material W by moving the upper cutting head in the up and down directions, and may include: a plate 20, which is detachably mounted on the upper cutting head; a blade 30, which is embedded in the plate 20, one end of which protrudes from the embedded plate 20 and is formed to correspond to the shape and size of the OLED panel packaging material W to be cut; and an inner support plate 40, which is located on one surface of the plate 20 and is formed along the inner circumferential surface of the blade 30.

[0055] The packaging material W may be a FSPM (Face Seal Pressure Sensitive Adhesive Metal) film. That is, the FSPM film is a semi-finished product of a laminate of an FSP film and a metal, and has high strength. Therefore, when it is cut, problems such as an enlarged gap between the plate and the blade of the cutting device and bending / deformation of the corners of the product may occur. Therefore, the packaging material pressing and cutting device 1 of the present invention may have the effect of preventing the above problems through the structure described later.

[0056] The plate 20 is not particularly limited as long as it is a material that can be embedded in the blade 30. For example, it can be at least one material selected from wood, polyvinyl chloride (PVC), metal, and a combination thereof.

[0057] In addition, the shape or size of the plate 20 can also be appropriately selected and designed according to the shape and size of the packaging material (W) for the OLED panel to be cut.

[0058] In addition, the plate 20 may have a through hole H10 formed on the back or inclined surface, and the plate 20 may be detachably mounted on a hole (not shown) formed on the upper fixing plate 10 coupled to the upper cutting head by bolts.

[0059] As an example, the plate 20 can be detachably mounted on the upper cutting head by a predetermined combination method, and the predetermined combination method can be at least one of a bolt connection method, a clamping method, a bonding method, and a combination thereof. At this time, the bolt connection and bonding methods may require the use of the upper fixing plate 10, and the clamping method does not use the upper fixing plate 10, but is not limited thereto, and the upper fixing plate 10 can be variously deformed at a level that is obvious to those skilled in the art.

[0060] In the prior art, the plate 20 is combined with the upper cutting head or the upper fixing plate 10 combined with the upper cutting head by adding an adhesive material such as tape between the plate 20 and the upper cutting head or the upper fixing plate 10 combined with the upper cutting head. Therefore, the plate 20 and the upper cutting head or the upper fixing plate 10 combined with the upper cutting head are separated by the thickness of the adhesive material between the plate 20 and the upper cutting head or the upper fixing plate 10 combined with the upper cutting head. As time goes by, a gap is generated in the space between the plate 20 and the upper cutting head or the upper fixing plate 10 combined with the upper cutting head, thereby affecting the production of high-quality packaging materials.

[0061] On the contrary, the packaging material pressing and cutting device 1 for OLED panels of the present invention can make the plate 20 and the upper cutting head or the upper fixing plate 10 combined with the upper cutting head tightly attached in a space-less manner through various combining methods such as bolt connection other than bonding, thereby being able to produce packaging materials of better quality than the prior art.

[0062] In addition, air holes P10 and air passages P20 may be formed on the other surface of the plate 20. The air holes P10 penetrate from the other surface of the plate 20 to one surface to allow air circulation, and the air passages P20 are recessed from the other surface of the plate 20 to one surface to discharge the air in the air holes P20 to the outside. On the other hand, when the air holes P10 and the air passages P20 are not formed, internal pressure is generated due to air squeezing and the like, thereby continuously generating a load on the cutting device 1, which may cause the cutting device 1 to malfunction or affect the production of high-quality packaging materials. In order to solve these problems, the present invention is provided with the air holes P10 and the air passages P20 to discharge air to the outside to reduce the occurrence of internal pressure, thereby enabling the cutting device 1 to smoothly cut the packaging material.

[0063] At this time, the number of the pores P10 may be four, but is not limited thereto. The shape, size and number of the pores P10 may be appropriately selected according to the shape and size of the packaging material W for the OLED panel so as to facilitate the removal of internal pressure.

[0064] In addition, the air channel P20 may be formed between the plurality of air holes P10, and the air channel P20 may extend to the side of the plate 20 so as to discharge air to the outside, but is not limited thereto, and the shape, size and number of the air channel P20 may be appropriately selected according to the shape and size of the packaging material W for the OLED panel so as to easily remove the internal pressure.

[0065] In addition, the packaging material pressing and cutting device 1 of one embodiment of the present invention can further stack a base reinforcing plate on the upper surface or the lower surface of the plate 20. At this time, the base reinforcing plate is further stacked to prevent the gap between the plate 20 and the blade 30 embedded therein from expanding. The material of the base reinforcing plate is not particularly limited as long as it has appropriate strength. As an example, it can be formed of polyvinyl chloride or steel. At this time, the thickness of the base reinforcing plate can be formed to 1T to 10T, and the base reinforcing plate is also formed with a prescribed hole at a position corresponding to the hole H10 of the plate 20, so that it can be bolted to the upper fixing plate 10.

[0066] The blade 30 is embedded in the plate 20, and one end thereof protrudes from the embedded plate 20 and is formed to correspond to the shape and size of the packaging material for the OLED panel to be cut. At this time, the material of the blade 30 is not particularly limited, as long as it is a material commonly used for cutting the packaging material W for OLED panels. Preferably, a material having the strength to cut FSPM (Face Seal Pressure Sensitive Adhesive Metal) film can be used. At this time, the present invention can be coated with a diamond-like carbon film formed by physical vapor deposition (PVD) on the surface of the blade 30 to give the blade 30 appropriate strength.

[0067] In addition, in the cross-sectional shape of the blade 30 , one end protruding outward may be formed sharply because it needs to cut the packaging material W for the OLED panel, and the other end may be formed to have a certain width and height so as to be embedded in the plate 20 .

[0068] In addition, the blades 30 may be arranged in a quadrangular shape on the plate 20, and in this case, a gap may be formed on the blades of two adjacent blades 30 at the corner. In the blades 30 of the present invention, one of the two adjacent blades 30 at the corner may be extended to fill the space between the two adjacent blades 30 formed at the corner. In addition, the blades 30 may be in a skewed shape to fill the corner.

[0069] In this way, the problem that the cut packaging material W bends toward the space can be effectively solved.

[0070] In addition, the corners of the blade 30 may be rounded with a predetermined R value.

[0071] For example, the corner of the blade 30 bears the force of two adjacent blades 30 at the corner, so when the corner of the blade 30 is a right angle, the blade 30 may be easily damaged or the gap may be enlarged. In this regard, in the present invention, the corner of the blade 30 is rounded at a specified R value, thereby preventing the blade 30 from being damaged or the gap from being enlarged due to the force generated at the corner of the blade 30, and producing high-quality packaging material W.

[0072] In addition, the surface of the blade 30 may be coated with a diamond-like carbon film formed by physical vapor deposition, and the coating thickness of the diamond-like carbon film of the blade 30 may be 100 to 2000 nm.

[0073] Specifically, the diamond-like carbon film coating of the blade 30 is a special form of coating applied to the blade edge of the blade 30. By coating the diamond-like carbon film, the blade 30 can make the packaging material W have a hardness suitable for pressing (punching) and improve durability. By improving the friction of the blade edge of the blade 30, the packaging material W can be cut more easily and accurately.

[0074] Among them, diamond-like carbon (DLC) as an amorphous carbon-based film has physical and chemical properties similar to diamond, and for example has a hardness similar to diamond, and therefore can provide higher wear resistance and corrosion resistance than other substances. Therefore, the life of the blade 30 can be extended, and the maintenance cost such as replacement can be reduced, thereby improving the productivity of high-quality packaging materials.

[0075] In addition, diamond-like carbon has a low friction coefficient, so the blade 30 coated with diamond-like carbon forms a smooth and soft surface, thereby reducing friction and generating a sliding effect. Therefore, when the blade 30 is punched, the action when it contacts the packaging material W is smooth and has little resistance, thereby reducing the defects of the packaging material W being cut, and being able to produce high-quality packaging materials.

[0076] In addition, as a coating method, a sputtering method can be performed, whereby the bonding strength of the diamond-like carbon film coating layer can be improved and the coating density can be increased.

[0077] Among them, sputtering is a physical vapor deposition method, which accelerates high-energy particles and collides with the substance to be deposited (coating material), so that multiple atoms in the substance to be deposited are deposited on the surface of the substrate (coating target). Since it is a solid deposition method, it can improve the bonding strength of the coating layer, thereby improving the durability and quality of the coated surface.

[0078] In order to achieve appropriate hardness for cutting the packaging material W, the present invention uses a sputtering method to coat the blade 30 with a diamond-like carbon film, and the thickness of the diamond-like carbon film can be 100 to 2000 nm.

[0079] The inner support plate 40 is stacked on one surface of the plate 20 and may be formed along the inner circumferential surface of the blade 30 .

[0080] Reference Figure 3 The prior art does not have the inner support plate 40, but only has the plate 20 and the blade 30. As the number of punching (pressing and cutting) of the packaging material W increases, a gap problem occurs between the plate 20 and the blade 30 embedded in the plate 20. Moreover, when the blade 30 is inserted into the packaging material W for punching (pressing and cutting) the packaging material W, due to the toughness of the packaging material W, a protruding portion T10 is formed on the upper part of the cutting surface, resulting in uneven cutting of the final packaging material W, and bulging or irreversible problems.

[0081] Therefore, the present invention includes the inner support plate 40, so as to solve the above-mentioned problem.

[0082] Specifically, refer to Figure 4 The inner support plate 40 is formed along the inner circumferential surface of the blade 30, thereby preventing the gap between the blade 30 and the plate 20 from expanding due to repeated external force, and pressing the packaging material W with strong pressure can prevent the other part of the packaging material W from bulging corresponding to the space where the blade 30 is inserted into the packaging material.

[0083] In addition, the material of the inner support plate 40 is not particularly limited, as long as it has appropriate strength, and is preferably made of an elastic material, for example, it may include a cushioning material such as sponge and at least one selected from polyvinyl chloride (PVC), silicone, polyethylene terephthalate (PET), metals and combinations thereof. In addition, the thickness of the inner support plate 40 may be about 1T to 10T.

[0084] In addition, as described above, the inner support plate 40 plays a role in pressing the packaging material W with a strong pressure. According to the situation, in order to play the above role, one end of the inner support plate 40 can be formed to be the same as or more convex than one end of the blade 30. That is, even if one end of the inner support plate 40 is formed to be more convex than one end of the blade 30, since the inner support plate 40 is made of elastic material, the inner support plate 40 is compressed, so that the blade 30 can be connected to the packaging material W, and the packaging material W can be cut. In addition, the inner support plate 40 can be formed to be the same as or more concave than one end of the blade 30. At this time, the concave depth of the inner support plate 40 can be the same as the thickness of the packaging material W or less concave than the thickness of the packaging material W. This is to make the inner support plate 40 play a role in pressing the packaging material W with a strong pressure. However, it is not limited to this, and the inner support plate 40 can be variously deformed at a level that is obvious to those skilled in the art.

[0085] In addition, refer to Figure 5 The inner support plate 40 may include a first inner support member 41 adjacent to the OLED panel encapsulation material W to be cut and a second inner support member 42 stacked on the first inner support member 41. At this time, the second inner support member 42 may be a material capable of elastic deformation.

[0086] As an example, the first inner supporting member 41 may be made of polyethylene terephthalate or polyvinyl chloride, and the second inner supporting member 42 may be made of sponge. In this case, the thickness of the first inner supporting member 41 may be about 0.075T to 1.0T.

[0087] Therefore, even if one end of the inner support plate 40 is formed to be higher than one end of the blade 30 , it can be compressed, so that the blade 30 can contact the packaging material W and cut the packaging material W.

[0088] In addition, the first inner support member 41 is connected to a virtual axis C20 extending from one end of the blade 30 in the up and down directions. Therefore, the first inner support member 41 presses the packaging material W, so that the first inner support member 41 can effectively prevent the packaging material W from bulging toward the space S10 formed between the first inner support member 41, the second inner support member 42 and the blade 30.

[0089] In addition, refer to Figure 6The packaging material pressing and cutting device 1 of the present invention may further include a filler 60 , and the filler 60 is used to fill the space S10 formed between the first inner supporting member 41 , the second inner supporting member 42 and the blade 30 .

[0090] At this time, the filler 60 is an elastically deformable material and its elastic modulus may be greater than the elastic modulus of the second inner supporting member 42 . As an example, the filler 60 is silicone-based, but is not limited thereto.

[0091] Therefore, the filler 60 is located in the space S10, so that the first inner support member 41 can be effectively prevented from being pushed into the space S10 due to the swelling of the packaging material W during punching (pressing and cutting). This is because the first inner support member 41 can more smoothly play the role of pressing the packaging material W with a strong pressure during punching (pressing and cutting).

[0092] On the other hand, in addition to the structure further including the filler 60, as Figure 6 As shown in (b), the shape of the second inner supporting member 42 may be protruded to fill the space S10.

[0093] In addition, the OLED panel encapsulation material pressing and cutting device 1 according to an embodiment of the present invention may further include an outer supporting plate 50 formed along the outer peripheral surface of the blade 30 .

[0094] Specifically, refer to Figure 7 (a), the outer support plate 50 is formed along the outer peripheral surface of the blade 30, so that it can prevent the gap between the blade 30 and the plate 20 from expanding due to repeated external forces together with the inner support plate 40, and by pressing the packaging material W with a strong pressure, the movement of the packaging material W that may occur during punching (pressing and cutting) is blocked from the root. At this time, the material of the outer support plate 50 is not particularly limited, as long as it has an appropriate strength that can block the movement of the packaging material W. As an example, it can include a cushioning material such as sponge and at least one material selected from polyvinyl chloride, silicone, polyethylene terephthalate, metals and combinations thereof. In addition, the thickness of the outer support plate 50 can be about 1T to 10T.

[0095] In addition, one end of the outer support plate 50 may be formed to be the same as or more protruding than one end of the blade 30. That is, even if one end of the outer support plate 50 is formed to be more protruding than one end of the blade 30, since the outer support plate 50 is made of an elastic material, the outer support plate 50 is compressed, so that the blade 30 can be brought into contact with the packaging material W and the packaging material W can be cut.

[0096] In addition, one end of the outer support plate 50 may be formed to be more recessed than one end of the blade 30 .

[0097] In addition, refer to Figure 7 (b), the outer support plate 50 may include a first outer support member 51 adjacent to the packaging material W for the OLED panel to be cut and a second outer support member 52 stacked on the first outer support member 51. At this time, the first outer support member 51 may be an elastically deformable material. As an example, the first outer support member 51 may be a sponge, and the second outer support member 52 may be polyvinyl chloride. Therefore, while solving the problem of the gap expansion of the blade 30, even if one end of the outer support plate 50 is formed more protruding than one end of the blade 30, since the second outer support member 52 is made of an elastic material, the second outer support member 52 is compressed, so that the blade 30 can be connected to the packaging material W, and the packaging material W can be cut.

[0098] In addition, refer to Figure 8 , the space between the blade 30 embedded in the plate 20 and the plate 20 may be filled with adhesive resin B10. At this time, the adhesive resin B10 may be a polymer resin with adhesive force, preferably, an epoxy resin. That is, the adhesive resin B10 is injected into the space between the blade 30 and the plate 20 and cured, thereby effectively solving the problem of the gap between the blade 30 and the plate 20 expanding.

[0099] Figures 9 to 11 It is a diagram for comparing a conventional packaging material cutting method and a cutting method using the packaging material press-cutting device 1 of the present invention.

[0100] Fig. 9 is a schematic diagram of the display module. Fig. 9 (a) is a diagram showing a display module formed by a conventional laser cutting method; Fig. 9 (b) is a diagram showing a display module formed by the existing slitting & sharing cutting method; Fig. 9 (c) is a diagram showing a display module formed by a cutting method using the packaging material press-cutting device 1 of the present invention.

[0101] Reference Fig. 9 (a) and Fig. 9 (b) According to the existing laser cutting method and the slitting & sharing cutting method, the end of the packaging material is cut into a sharp right angle, so the possibility of line defects (Line Defect; LD) such as damage to various lines (1ine) entering the display module is relatively high.

[0102] However, refer to Fig. 9 (c) The cutting method using the packaging material pressing and cutting device 1 of the present invention can confirm that the end of the packaging material is rounded in a taper shape, and the possibility of line defects (LD) such as damage to various lines entering the display module is relatively low because the blade 30 coated with the diamond-like carbon film has appropriate hardness and cuts the packaging material in a slightly pressed manner. This can be confirmed by Fig.10 The profile of the cut surface of the packaging material is confirmed by referring to Fig.10 (a) and Fig.10 (b) shows that no other curves are shown between the yellow intervals. Fig.10 In (c), it can be confirmed that a sloped graph is formed between the yellow intervals.

[0103] in addition, Fig.11 is a diagram showing a SEM (scanning electron microscope) image of a cut surface of a packaging material. Fig.11 (a)) and Slitting & Sharing Cutting Method (refer to Fig.11 (b)) It is difficult to round and cut the edges of the packaging material to the specified R value, but refer to Fig.11 (c) The cutting method using the packaging material pressing and cutting device 1 of the present invention can apply a specified R value to the corners of the blade 30, thereby facilitating the rounding of the corners of the packaging material.

[0104] Therefore, compared with the existing cutting method, when the cutting method using the packaging material pressing and cutting device 1 of the present invention is implemented, the defects of the packaging material W and the product defects caused by the packaging material W can be reduced, thereby producing high-quality packaging materials.

[0105] Hereinafter, the experimental examples and / or embodiments of the present invention are described in detail so that those skilled in the art can easily implement them. However, the present invention can be implemented in various forms and is not limited to the experimental examples and / or embodiments described herein.

[0106] Experimental Example 1. Damage Evaluation of Uncoated Blades

[0107] The FSPM packaging material is punched (pressed) a predetermined number of times using the blade products of Company A, Company B, and Company C.

[0108] Fig.12 : is a graph showing the degree of damage of the uncoated blades. Compared with before punching, the blades of companies A to C were all damaged after punching, and the damage of the blades was observed in the 1st to 4th sections.

[0109] Experimental Example 2. Damage Evaluation of Coated Blades

[0110] The diamond-like carbon film was coated on the blade product of Company A by sputtering. At this time, the coating thickness of the diamond-like carbon film was 500 nm. In addition, according to the conditions of Experimental Example 1, the FSPM packaging material was punched (press-cut) a predetermined number of times.

[0111] Fig.13 3 is a graph showing the degree of damage of the insert coated with the diamond-like carbon film. When the damage of the insert is compared before and after punching, it can be confirmed that the damage of the insert is significantly reduced.

[0112] Experimental Example 3. Measurement of average surface hardness according to different coating thicknesses

[0113] The Korea Institute of Industrial Technology measured the average surface hardness of the diamond-like carbon film according to the different coating thicknesses (unit: nm). The analysis equipment was a nanoindenter (model name: HM200LT), and the analysis conditions and results are as follows.

[0114] Analysis conditions

[0115] Indenter: Diamond Indenter

[0116] Load and pressing time: 10mN, 10s

[0117] Number of measurements: 5 times (result value: average value of 10 times excluding maximum and minimum values)

[0118] Analyze the results

[0119] Table 1:

[0120]

[0121] Experimental Example 4. Measurement of coating thickness

[0122] We commissioned an external organization to measure the thickness of the diamond-like carbon film. The measurement was performed using a profiler. The sample names and actual coating thicknesses are as follows.

[0123] Table 2:

[0124]

[0125] The results of Experimental Examples 3 and 4 show that the average surface hardness of Sample 500-1, which has a diamond-like carbon film coating thickness of 500 nm, is the best. In addition, it is confirmed that the increase in average surface hardness is minimal when a diamond-like carbon film with a thickness of 200 to 400 nm is coated.

[0126] in addition, Fig.141 is a diagram showing an SEM image of a blade coated with a diamond-like carbon film. The coating was performed by sputtering, and it was confirmed that the coating density and coating quality were excellent.

[0127] In order to more clearly express the technical concept of the present invention, structures that are not relevant or insufficiently relevant to the technical concept of the present invention are briefly expressed or omitted in the drawings.

[0128] The above describes the structure and features of the present invention based on the embodiments of the present invention, but the present invention is not limited thereto. Those skilled in the art know that various changes or modifications can be made within the concept and scope of the present invention, and therefore such changes or modifications fall within the scope of the attached claims.

Claims

1. A packaging material pressing and cutting device, which presses and cuts packaging materials by moving an upper cutting head in an up-and-down direction, characterized in that: include: a plate, detachably mounted on the upper cutting head; a blade embedded in the plate, one end of which protrudes from the embedded plate and is formed to correspond to the shape and size of the packaging material for the OLED panel to be cut; and An inner support plate is located on one surface of the plate and is formed along the inner peripheral surface of the blade. The surface of the blade is coated with a diamond-like carbon film formed by physical vapor deposition.

2. The packaging material pressing and cutting device according to claim 1, characterized in that: The coating thickness of the diamond-like carbon film of the blade is 100 to 2000 nm.

3. The packaging material pressing and cutting device according to claim 1, characterized in that: The blade is arranged on the plate in a quadrangular shape, and the edge corners of the blade are rounded with a predetermined R value.

4. The packaging material pressing and cutting device according to claim 3, characterized in that: One of the two adjacent blades at the corner is extended to fill a space between the two adjacent cutting edges formed at the corner.

5. The packaging material pressing and cutting device according to claim 1, characterized in that: Adhesive resin is filled between the embedded blade and the plate.

6. The packaging material pressing and cutting device according to claim 1, characterized in that: The inner support plate includes a first inner support component adjacent to the OLED panel packaging material to be cut and a second inner support component stacked on the first inner support component. The second inner supporting component is made of elastically deformable material.

7. The packaging material pressing and cutting device according to claim 6, characterized in that: The first inner supporting member is in contact with a virtual axis extending from one end of the blade in a vertical direction.

8. The packaging material pressing and cutting device according to claim 7, characterized in that: further comprising a filler, the filler being used to fill a space formed between the first inner supporting member, the second inner supporting member and the blade, The filler is an elastically deformable material, and an elastic modulus thereof is greater than an elastic modulus of the second inner supporting component.

9. The packaging material pressing and cutting device according to claim 1, characterized in that: Further included is an outer support plate formed along an outer peripheral surface of the blade.

10. The packaging material pressing and cutting device according to claim 1, characterized in that: The other surface of the plate is formed with air holes and air passages. The air holes penetrate from the other surface of the plate to one surface to allow air to circulate, and the air passages are recessed from the other surface of the plate to one surface to discharge the air in the air holes to the outside.

11. The packaging material pressing and cutting device according to claim 1, characterized in that: The plate is detachably mounted on the upper cutting head by a predetermined combining method, wherein the predetermined combining method is at least one of a bolt connection method, a clamping method, a bonding method and a combination thereof.

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