Silicon wafer bag folding device, silicon wafer bag folding method and silicon wafer packaging system

Abstract

The embodiment of the invention provides a silicon wafer bag folding device, a silicon wafer bag folding method and a silicon wafer packaging system. The silicon wafer bag folding device comprises a bearing platform used for bearing a silicon wafer sleeved with a packaging bag; the conveying mechanism is connected with the bearing platform, and the conveying mechanism is used for driving the bearing platform to move; the downward pressing mechanism is arranged close to the conveying mechanism, and under the condition that the conveying mechanism conveys the bearing platform to the downward pressing mechanism, the downward pressing mechanism is pressed on the silicon wafer so as to exhaust air in a packaging bag of the silicon wafer; the sealing mechanism is arranged close to the downward pressing mechanism, and the sealing mechanism is used for sealing the opening side of the packaging bag; and the bag folding mechanism is connected to the downward pressing mechanism, and the bag folding mechanism is used for carrying out bag folding on the sealed opening side. According to the silicon wafer bag folding device, automatic sealing and bag folding of the silicon wafer packaging bag can be achieved, the workload of operators is reduced, and the bag folding efficiency and the packaging efficiency of the silicon wafer are improved.

Description

Technical Field

[0001] The present application belongs to the field of photovoltaic processing technology, and specifically relates to a silicon wafer bag folding device, a silicon wafer bag folding method and a silicon wafer packaging system. Background Art

[0002] With the development of photovoltaic technology, silicon wafers are used more and more widely. In the production process of silicon wafers, when silicon wafers are transported in different production processes, they usually need to be packaged to improve the transportation safety of silicon wafers.

[0003] In the existing technology, silicon wafers are usually bagged manually after sorting, and the air in the bag is manually exhausted before folding the bag mouth and sealing. Since downstream production needs to take out the bagged products and continue production, heat shrink sealing technology cannot be used. In addition, silicon wafers are hard and fragile. In order to avoid damage to silicon wafers during the packaging process, manual bagging, folding and sealing are currently used. However, the manual bag folding method for packaging silicon wafers not only increases the workload of operators, but also has low bag folding efficiency, greatly reducing the packaging efficiency of silicon wafers. Summary of the invention

[0004] The present application aims to provide a silicon wafer bag folding device, a silicon wafer bag folding method and a silicon wafer packaging system to solve the problem of low efficiency of existing silicon wafer bag folding.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, the present application discloses a silicon wafer bag folding device, the silicon wafer bag folding device comprising:

[0007] A receiving platform, the receiving platform is used to receive the silicon wafers wrapped in packaging bags;

[0008] A conveying mechanism, the conveying mechanism is connected to the receiving platform, and the conveying mechanism is used to drive the receiving platform to move;

[0009] A pressing mechanism, wherein the pressing mechanism is arranged close to the conveying mechanism, and when the conveying mechanism conveys the receiving platform to the pressing mechanism, the pressing mechanism is pressed on the silicon wafer to discharge the air in the packaging bag of the silicon wafer;

[0010] A sealing mechanism, the sealing mechanism is arranged close to the pressing mechanism, and the sealing mechanism is used to seal the opening side of the packaging bag;

[0011] and a bag folding mechanism, wherein the bag folding mechanism is connected to the pressing mechanism and is used to fold the open side after sealing so that the open side is folded to a position where it fits with the silicon wafer.

[0012] Optionally, the bag folding mechanism comprises: a bag folding bracket, a lifting drive member, a first pressing plate, a second pressing plate and a flipping drive member; wherein,

[0013] The bag folding support is connected to the pressing mechanism, the lifting drive is connected to the bag folding support, the lifting drive is connected to the first pressing plate and the second pressing plate respectively, and the lifting drive is used to drive the first pressing plate and the second pressing plate to descend so as to press the sealed opening side down to a vertical state;

[0014] The flip driving member is connected to the bag folding bracket, and the flip driving member is connected to the second pressure plate. The flip driving member is used to drive the second pressure plate to flip so as to flip the opening side in the vertical state to a position that fits the bottom surface of the silicon wafer.

[0015] Optionally, the flip driving member includes: a flip cylinder and a connecting rod; wherein,

[0016] The flip cylinder is connected to the bag folding bracket, the output end of the flip cylinder is connected to the connecting rod, the connecting rod is connected to the second pressing plate, and the flip cylinder is used to drive the connecting rod to move, so as to drive the second pressing plate to flip through the connecting rod.

[0017] Optionally, the sealing mechanism comprises: a sealing base, a sealing support, a sealing drive and a sealing member; wherein,

[0018] The sealing base is arranged close to the pressing mechanism;

[0019] The sealing bracket is movably connected to the sealing base, and the sealing member is connected to the sealing bracket;

[0020] The sealing drive is connected to the sealing bracket, and is used to drive the sealing bracket to move on the sealing base to drive the sealing member to approach or move away from the opening side of the packaging bag to seal the opening side.

[0021] Optionally, the sealing member comprises: a clamping jaw and a clamping jaw driving member; wherein,

[0022] The clamping jaw is movably connected to the sealing bracket, and the clamping jaw driving member is connected to the clamping jaw. The clamping jaw driving member is used to drive the clamping jaw to clamp the opening side or release the clamping of the opening side to seal the opening side.

[0023] Optionally, the pressing mechanism comprises: a pressing bracket, a pressing driving member, a pressing arm and a pressing block;

[0024] The pressing bracket is arranged close to the conveying mechanism, the pressing arm is movably connected to the pressing bracket, the pressing driving member is connected to the pressing arm, and the pressing block is connected to the pressing arm;

[0025] Wherein, when the conveying mechanism conveys the receiving platform to the target position of the pressing mechanism, the pressing driving member drives the pressing arm to rotate to the target position and descend until the pressing block is pressed onto the silicon wafer to discharge the air in the packaging bag of the silicon wafer.

[0026] Optionally, the pressing mechanism also includes: a limit sensor, which is connected to the pressing bracket, and is used to detect the position of the receiving platform. When the limit sensor detects that the conveying mechanism conveys the receiving platform to the target position, the conveying mechanism stops conveying the receiving platform to keep the receiving platform at the target position.

[0027] In a second aspect, the present application further discloses a silicon wafer bag folding method, the silicon wafer bag folding method comprising:

[0028] The receiving platform is used to receive the silicon wafers with packaging bags;

[0029] The conveying mechanism is used to drive the receiving platform to be conveyed to the pressing mechanism;

[0030] The pressing mechanism is used to press the silicon wafer to discharge the air in the packaging bag of the silicon wafer;

[0031] The sealing mechanism is used to seal the opening side of the packaging bag;

[0032] A bag folding mechanism is used to fold the sealed open side so that the open side is folded to a position where it fits the silicon wafer.

[0033] Optionally, the step of using a bag folding mechanism to fold the sealed open side so that the open side is folded to a position where it fits with the silicon wafer includes:

[0034] The lifting drive member of the bag folding mechanism is used to drive the first pressing plate and the second pressing plate to descend, so as to press the sealed opening side down to a vertical state;

[0035] The flip driving member of the bag folding mechanism is used to drive the second pressing plate to flip, so as to flip the opening side in the vertical state to a position in contact with the bottom surface of the silicon wafer.

[0036] In a third aspect, the present application further discloses a silicon wafer packaging system, characterized in that the silicon wafer packaging system comprises the silicon wafer bag folding device described in any one of the above items.

[0037] In an embodiment of the present application, the receiving platform of the silicon wafer bag folding device can be used to receive the silicon wafer with the packaging bag. The conveying mechanism can be used to drive the receiving platform to move and convey the receiving platform to the pressing mechanism. The pressing mechanism can be pressed on the silicon wafer to discharge the air in the packaging bag of the silicon wafer. The sealing mechanism can be used to seal the open side of the packaging bag. The bag folding mechanism can be used to fold the sealed open side so that the open side is folded to a position that fits the silicon wafer. In this way, through the coordinated use of the receiving platform, the conveying mechanism, the pressing mechanism, the sealing mechanism and the bag folding mechanism, the automatic sealing and folding of the silicon wafer packaging bag can be achieved, reducing the workload of the operator and improving the bag folding efficiency and packaging efficiency of the silicon wafer.

[0038] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0040] Figure 1 It is a structural schematic diagram of a silicon wafer bag folding device described in an embodiment of the present application;

[0041] Figure 2 yes Figure 1 A schematic structural diagram of the silicon wafer bag folding device from another angle shown;

[0042] Figure 3 yes Figure 1 The schematic structural diagram of the silicon wafer bag folding device shown is from another angle;

[0043] Figure 4 It is a structural schematic diagram of a bag folding mechanism described in an embodiment of the present application;

[0044] Figure 5 yes Figure 4 A detailed structural diagram of the bag folding mechanism A shown;

[0045] Figure 6 It is a flow chart of the steps of a silicon wafer bag folding method described in an embodiment of the present application.

[0046] Figure numerals: 10 - receiving platform, 11 - conveying mechanism, 111 - supporting base, 112 - conveying line, 12 - pressing mechanism, 121 - pressing bracket, 122 - pressing drive member, 123 - pressing arm, 124 - pressing block, 13 - sealing mechanism, 131 - sealing base, 132 - sealing bracket, 133 - sealing drive member, 134 - sealing member, 14 - bag folding mechanism, 141 - bag folding bracket, 142 - lifting drive member, 143 - first pressing plate, 144 - second pressing plate, 145 - flipping drive member, 1451 - flipping cylinder, 1452 - connecting rod, 20 - silicon wafer. DETAILED DESCRIPTION

[0047] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0048] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0049] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0050] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] The embodiment of the present application provides a silicon wafer bag folding device, which can be used in a silicon wafer packaging system. Specifically, the silicon wafer bag folding device can be used to achieve automatic sealing and bag folding of silicon wafer packaging bags, reduce the workload of staff and improve the bag folding efficiency of the silicon wafer.

[0052] Reference Figure 1 , showing a schematic structural diagram of a silicon wafer bag folding device according to an embodiment of the present application, referring to Figure 2 , showing Figure 1 The schematic diagram of the structure of the silicon wafer bag folding device from another angle is shown in FIG. Figure 3 , showing Figure 1 The structure diagram of the silicon wafer bag folding device shown is shown at another angle.

[0053] like Figures 1 to 3 As shown, the silicon wafer bag folding device may specifically include: a receiving platform 10, which can be used to receive the silicon wafer 20 with a packaging bag; a conveying mechanism 11, which is connected to the receiving platform 10 and can be used to drive the receiving platform 10 to move; a pressing mechanism 12, which is arranged close to the conveying mechanism 11, and when the conveying mechanism 11 conveys the receiving platform 10 to the pressing mechanism 12, the pressing mechanism 12 is pressed on the silicon wafer 20 to discharge the air in the packaging bag of the silicon wafer 20; a sealing mechanism 13, which is arranged close to the pressing mechanism 12, and can be used to seal the opening side of the packaging bag; and a bag folding mechanism 14, which is connected to the pressing mechanism 12 and can be used to fold the sealed opening side so that the opening side is folded to a position that fits the silicon wafer 20.

[0054] In the embodiment of the present application, the receiving platform 10 of the silicon wafer bag folding device can be used to receive the silicon wafer 20 with the packaging bag. The conveying mechanism 11 can be used to drive the receiving platform 10 to move and convey the receiving platform 10 to the pressing mechanism 12. The pressing mechanism 12 can be pressed on the silicon wafer 20 to discharge the air in the packaging bag of the silicon wafer 20. The sealing mechanism 13 can be used to seal the open side of the packaging bag. The bag folding mechanism 14 can be used to fold the sealed open side so that the open side is folded to a position that fits the silicon wafer 20. In this way, through the coordinated use of the receiving platform 10, the conveying mechanism 11, the pressing mechanism 12, the sealing mechanism 13 and the bag folding mechanism 14, the automatic sealing and folding of the silicon wafer 20 packaging bag can be achieved, reducing the workload of the operator and improving the bag folding efficiency and packaging efficiency of the silicon wafer 20.

[0055] like Figure 1 As shown, the operator packs the bag ( Figure 1 After the packaging bag (not shown) is sleeved on the silicon wafer 20, the silicon wafer 20 with the packaging bag can be placed on the receiving platform 10. The receiving platform 10 is connected to the conveying mechanism 11 in a liftable manner. After the receiving platform 10 receives the silicon wafer 20, the receiving platform 10 can be lowered to a position flush with the conveying line 112 of the conveying mechanism 11, so that the conveying mechanism 11 can convey the receiving platform 10 to the pressing mechanism 12.

[0056] Specifically, the receiving platform 10 can achieve a lifting function through a liftable slide rail, chain, belt, etc. The embodiment of the present application does not specifically limit the lifting method of the receiving platform 10.

[0057] Optionally, the conveying mechanism 11 may include a support base 111 and a conveying line 112, and the support base 111 may be used to support the conveying line 112. The conveying line 112 may include at least one of a belt conveying line, a roller conveying line, and a chain conveying line, and the specific form of the conveying line 112 is not limited in the embodiment of the present application.

[0058] In some optional embodiments of the present application, the pressing mechanism 12 may specifically include: a pressing bracket 121, a pressing drive 122, a pressing arm 123, and a pressing block 124; the pressing bracket 121 is arranged close to the conveying mechanism 11, the pressing arm 123 is movably connected to the pressing bracket 121, the pressing drive 122 is connected to the pressing arm 123, and the pressing block 124 is connected to the pressing arm 123 by fasteners such as screws or bolts. When the conveying mechanism 11 conveys the receiving platform 10 to the target position of the pressing mechanism 12, the pressing drive 122 can drive the pressing arm 123 to rotate to the target position and descend until the pressing block 124 is pressed onto the silicon wafer 20 to discharge the air in the packaging bag of the silicon wafer 20.

[0059] Specifically, a vertical track is provided on the pressing support 121, and the pressing arm 123 can slide up and down along the track to achieve lifting. The pressing drive 122 can drive the pressing arm 123 to lift and rotate. In practical applications, after the conveying mechanism 11 conveys the receiving platform 10 to the pressing mechanism 12, the pressing drive 122 can drive the pressing arm 123 to rotate to the top of the silicon wafer 20, and then drive the pressing arm 123 to descend until the pressing block 124 is pressed on the silicon wafer 20, so that the air in the packaging bag of the silicon wafer 20 is discharged through the pressing block 124. After the packaging bag of the silicon wafer 20 is folded, the pressing drive 122 can drive the pressing arm 123 to rise and rotate outwards until it leaves the position just above the silicon wafer 20, so that the silicon wafer 20 can be clamped by a robot or other equipment to remove the silicon wafer 20 from the silicon wafer folding device.

[0060] For example, the pressing driving member 122 may include a rotating cylinder and a pressing cylinder, wherein the rotating cylinder may be used to drive the pressing arm 123 to rotate, and the pressing cylinder may be used to drive the pressing arm 123 to rise or fall.

[0061] Specifically, the target position is the position for sealing and bag folding the silicon wafer 20. When the conveying mechanism 11 conveys the silicon wafer 20 to the target position, the pressing mechanism 12 can press on the silicon wafer 20 to keep the silicon wafer 20 at the target position for subsequent sealing and bag folding operations.

[0062] Optionally, the pressing mechanism 12 may further include: a limit sensor ( Figure 1 (not shown in the figure), the limit sensor is connected to the lower pressure bracket 121, and the limit sensor can be used to detect the position of the receiving platform 10. When the limit sensor detects that the conveying mechanism 11 conveys the receiving platform 10 to the target position, the conveying mechanism 11 can stop conveying the receiving platform 10 to keep the receiving platform 10 at the target position. In actual applications, the position of the receiving platform 10 is detected by the limit sensor, so that the receiving platform 10 can be accurately transported to the required target position, thereby improving the position accuracy of subsequent sealing and bag folding operations and avoiding damage to the silicon wafer 20 caused by sealing and bag folding operations.

[0063] Specifically, the limit sensor may include but is not limited to at least one of an infrared sensor and a Hall sensor. The embodiment of the present application may not limit the specific type of the limit sensor.

[0064] In some optional embodiments of the present application, the sealing mechanism 13 may include: a sealing base 131, a sealing bracket 132, a sealing drive 133 and a sealing member 134; wherein the sealing base 131 is arranged close to the pressing mechanism 12; the sealing bracket 132 is movably connected to the sealing base 131, and the sealing member 134 is connected to the sealing bracket 132; the sealing drive 133 is connected to the sealing bracket 132, and the sealing drive 133 can be used to drive the sealing bracket 132 to move on the sealing base 131 to drive the sealing member 134 to approach or move away from the opening side of the packaging bag to seal the opening side.

[0065] In a specific application, the open side of the packaging table sleeved on the silicon wafer 20 usually has a redundant portion, so as to facilitate the sealing operation and bag folding operation at the redundant portion. In the subsequent process, by clamping the open side after bag folding, it is convenient to position the silicon wafer 20 and perform subsequent operations on the silicon wafer 20.

[0066] In the embodiment of the present application, after the pressing mechanism 12 discharges the air in the packaging bag, the sealing bracket 132 can move toward the pressing mechanism 12. The sealing drive 133 can drive the sealing member 134 to move closer to the opening side of the packaging bag until the sealing member 134 clamps the opening side to achieve the sealing effect. In practical applications, the opening side of the packaging bag is sealed before folding the packaging bag, which can further improve the accuracy of bag folding and the bag folding effect.

[0067] Optionally, the sealing member 134 may specifically include: a clamp and a clamp driving member; wherein the clamp is movably connected to the sealing bracket 132, and the clamp driving member is connected to the clamp, and the clamp driving member can be used to drive the clamp to clamp the opening side or release the clamping of the opening side to seal the opening side.

[0068] In a specific application, during the movement of the clamping jaws toward the opening side, the clamping jaws may be in an open state until the clamping jaws completely cover the opening side of the packaging bag. Then, the clamping jaws may be switched from an open state to a closed state until the clamping jaws clamp the opening side to achieve a sealing effect. After the opening side is sealed, the clamping jaws may be switched to an open state and leave the opening side of the packaging bag until they leave the opening side, so as to facilitate the subsequent bag folding operation on the opening side.

[0069] It should be noted that, in the embodiment of the present application, the use of the clamping jaws to clamp the opening side to achieve a sealing effect means that the clamping jaws are used to clamp the opening side so that the upper and lower surfaces of the opening side fit together to achieve a similar sealing effect, and it does not strictly mean that the upper and lower surfaces of the opening side are completely sealed.

[0070] Reference Figure 4 , showing a schematic diagram of the structure of a bag folding mechanism according to an embodiment of the present application, referring to Figure 5 , showing Figure 4 Detailed structural diagram of the position of the bag folding mechanism A shown in FIG. Specifically, the bag folding mechanism 14 may include: a bag folding support 141, a lifting drive 142, a first pressing plate 143, a second pressing plate 144, and a flipping drive 145; wherein the bag folding support 141 is connected to the pressing mechanism 12, the lifting drive 142 is connected to the bag folding support 141, the lifting drive 142 is connected to the first pressing plate 143 and the second pressing plate 144 respectively, and the lifting drive 142 can be used to drive the first pressing plate 143 and the second pressing plate 144 to descend, so as to press the sealed opening side from a horizontal state to Figure 3 The flip driving member 145 is connected to the bag folding support 141, and the flip driving member 145 is connected to the second pressing plate 144. The flip driving member 145 can be used to drive the second pressing plate 144 to flip, so as to flip the opening side in the vertical state to a position that fits the bottom surface of the silicon wafer 20 (such as Figure 4 and Figure 5 To complete the bag folding operation.

[0071] like Figure 5 As shown, the flipping drive 145 may include: a flipping cylinder 1451 and a connecting rod 1452; wherein, the flipping cylinder 1451 is connected to the bag folding bracket 141, and the output end of the flipping cylinder 1451 is connected to the connecting rod 1452, and the connecting rod 1452 is connected to the second pressure plate 144. The flipping cylinder 1451 can be used to drive the connecting rod 1452 to move, so as to drive the second pressure plate 144 to flip through the connecting rod 1452, so as to flip the opening side in the vertical state to a position that is in contact with the bottom surface of the silicon wafer 20, thereby completing the bag folding operation.

[0072] In practical applications, after the bag folding is completed, a robot arm or other equipment can be used to remove the silicon wafer 20 and load it into a transfer tool to transfer the silicon wafer 20 .

[0073] In summary, the silicon wafer bag folding device described in the embodiment of the present application can at least include the following advantages:

[0074] In an embodiment of the present application, the receiving platform of the silicon wafer bag folding device can be used to receive the silicon wafer with the packaging bag. The conveying mechanism can be used to drive the receiving platform to move and convey the receiving platform to the pressing mechanism. The pressing mechanism can be pressed on the silicon wafer to discharge the air in the packaging bag of the silicon wafer. The sealing mechanism can be used to seal the open side of the packaging bag. The bag folding mechanism can be used to fold the sealed open side so that the open side is folded to a position that fits the silicon wafer. In this way, through the coordinated use of the receiving platform, the conveying mechanism, the pressing mechanism, the sealing mechanism and the bag folding mechanism, the automatic sealing and folding of the silicon wafer packaging bag can be achieved, reducing the workload of the operator and improving the bag folding efficiency and packaging efficiency of the silicon wafer.

[0075] An embodiment of the present application further provides a silicon wafer packaging system, which may specifically include the silicon wafer bag folding device shown in any of the above embodiments.

[0076] It should be noted that in the embodiment of the present application, the structure of the silicon wafer bag folding device is the same as that of the silicon wafer bag folding device described in any of the above embodiments, and its beneficial effects are also similar, and the embodiment of the present application does not limit this.

[0077] Reference Figure 6 , shows a flow chart of the steps of a silicon wafer bag folding method described in an embodiment of the present application, such as Figure 6 As shown, the silicon wafer bag folding method may specifically include:

[0078] Step 601: Use a receiving platform to receive the silicon wafers enclosed in the packaging bag.

[0079] In a specific application, after the operator puts the packaging bag on the silicon wafer 20 , the operator can place the silicon wafer 20 with the packaging bag on the receiving platform 10 .

[0080] Step 602: Use a conveying mechanism to drive the receiving platform to be conveyed to a pressing mechanism.

[0081] In the embodiment of the present application, the receiving platform 10 is connected to the conveying mechanism 11 in a liftable manner. After the receiving platform 10 receives the silicon wafer 20, the receiving platform 10 can be lowered to a position flush with the conveying line 112 of the conveying mechanism 11, so that the conveying mechanism 11 can convey the receiving platform 10 to the pressing mechanism 12.

[0082] Step 603: Use the pressing mechanism to press on the silicon wafer to expel the air in the packaging bag of the silicon wafer.

[0083] In the embodiment of the present application, the pressing mechanism 12 may specifically include: a pressing support 121, a pressing drive 122, a pressing arm 123, and a pressing block 124; the pressing support 121 is arranged close to the conveying mechanism 11, the pressing arm 123 is movably connected to the pressing support 121, the pressing drive 122 is connected to the pressing arm 123, and the pressing block 124 is connected to the pressing arm 123. When the conveying mechanism 11 conveys the receiving platform 10 to the target position of the pressing mechanism 12, the pressing drive 122 can drive the pressing arm 123 to rotate to the target position and descend until the pressing block 124 is pressed onto the silicon wafer 20 to discharge the air in the packaging bag of the silicon wafer 20.

[0084] Step 604: Use the sealing mechanism to seal the open side of the packaging bag.

[0085] In a specific application, the open side of the packaging table sleeved on the silicon wafer 20 usually has a redundant portion, so as to facilitate the sealing operation and bag folding operation at the redundant portion. In the subsequent process, by clamping the open side after bag folding, it is convenient to position the silicon wafer 20 and perform subsequent operations on the silicon wafer 20.

[0086] In the embodiment of the present application, after the pressing mechanism 12 discharges the air in the packaging bag, the sealing bracket 132 of the sealing mechanism 13 can move toward the pressing mechanism 12. The sealing drive 133 can drive the sealing member 134 to move closer to the opening side of the packaging bag until the sealing member 134 clamps the opening side to achieve the sealing effect. In practical applications, the opening side of the packaging bag is sealed before folding the packaging bag, which can further improve the accuracy of bag folding and the bag folding effect.

[0087] Step 605: Use a bag folding mechanism to fold the sealed open side so that the open side is folded to a position that fits the silicon wafer.

[0088] Specifically, the bag folding mechanism 14 may include: a bag folding bracket 141, a lifting drive 142, a first pressure plate 143, a second pressure plate 144 and a flipping drive 145; wherein the bag folding bracket 141 is connected to the pressing mechanism 12, the lifting drive 142 is connected to the bag folding bracket 141, and the lifting drive 142 is respectively connected to the first pressure plate 143 and the second pressure plate 144; the flipping drive 145 is connected to the bag folding bracket 141, and the flipping drive 145 is connected to the second pressure plate 144.

[0089] In some optional embodiments of the present application, the step of using a bag folding mechanism to fold the sealed open side so that the open side is folded to a position where it fits with the silicon wafer may include the following sub-steps:

[0090] Sub-step S11: using the lifting drive member of the bag folding mechanism to drive the first pressing plate and the second pressing plate to descend, so as to press the sealed opening side down to a vertical state.

[0091] Specifically, during the process of folding the packaging bag of the silicon wafer 20, the lifting drive 142 can drive the first pressing plate 143 and the second pressing plate 144 to descend, so as to press the sealed opening side from a horizontal state to a vertical state (such as Figure 3 shown).

[0092] Sub-step S11: using the flipping driving member of the bag folding mechanism to drive the second pressing plate to flip, so as to flip the opening side in the vertical state to a position in contact with the bottom surface of the silicon wafer.

[0093] In the embodiment of the present application, after the first pressing plate 143 and the second pressing plate 144 press the sealed opening side downward to a vertical state, the flip driving member 143 can drive the second pressing plate 144 to flip, so as to flip the opening side in the vertical state to a position that is in contact with the bottom surface of the silicon wafer 20 (such as Figure 4 and Figure 5 To complete the bag folding operation.

[0094] In summary, the silicon wafer bag folding method described in the embodiment of the present application can at least include the following advantages:

[0095] In an embodiment of the present application, the receiving platform of the silicon wafer bag folding device can be used to receive the silicon wafer with the packaging bag. The conveying mechanism can be used to drive the receiving platform to move and convey the receiving platform to the pressing mechanism. The pressing mechanism can be pressed on the silicon wafer to discharge the air in the packaging bag of the silicon wafer. The sealing mechanism can be used to seal the open side of the packaging bag. The bag folding mechanism can be used to fold the sealed open side so that the open side is folded to a position that fits the silicon wafer. In this way, through the coordinated use of the receiving platform, the conveying mechanism, the pressing mechanism, the sealing mechanism and the bag folding mechanism, the automatic sealing and folding of the silicon wafer packaging bag can be achieved, reducing the workload of the operator and improving the bag folding efficiency and packaging efficiency of the silicon wafer.

[0096] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0097] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A silicon wafer bag folding device, characterized in that: The silicon wafer bag folding device comprises: A receiving platform, the receiving platform is used to receive the silicon wafers wrapped in packaging bags; A conveying mechanism, the conveying mechanism is connected to the receiving platform, and the conveying mechanism is used to drive the receiving platform to move; A pressing mechanism, wherein the pressing mechanism is arranged close to the conveying mechanism, and when the conveying mechanism conveys the receiving platform to the pressing mechanism, the pressing mechanism is pressed on the silicon wafer to discharge the air in the packaging bag of the silicon wafer; A sealing mechanism, the sealing mechanism is arranged close to the pressing mechanism, and the sealing mechanism is used to seal the opening side of the packaging bag; and a bag folding mechanism, wherein the bag folding mechanism is connected to the pressing mechanism and is used to fold the open side after sealing so that the open side is folded to a position where it fits the silicon wafer.

2. The silicon wafer bag folding device according to claim 1, characterized in that: The bag folding mechanism comprises: a bag folding bracket, a lifting drive member, a first pressing plate, a second pressing plate and a flipping drive member; wherein, The bag folding support is connected to the pressing mechanism, the lifting drive is connected to the bag folding support, the lifting drive is connected to the first pressing plate and the second pressing plate respectively, and the lifting drive is used to drive the first pressing plate and the second pressing plate to descend so as to press the sealed opening side down to a vertical state; The flip driving member is connected to the bag folding bracket, and the flip driving member is connected to the second pressure plate. The flip driving member is used to drive the second pressure plate to flip so as to flip the opening side in the vertical state to a position that fits the bottom surface of the silicon wafer.

3. The silicon wafer bag folding device according to claim 2, characterized in that: The flip driving member includes: a flip cylinder and a connecting rod; wherein, The flip cylinder is connected to the bag folding bracket, the output end of the flip cylinder is connected to the connecting rod, the connecting rod is connected to the second pressing plate, and the flip cylinder is used to drive the connecting rod to move, so as to drive the second pressing plate to flip through the connecting rod.

4. The silicon wafer bag folding device according to claim 1, characterized in that: The sealing mechanism comprises: a sealing base, a sealing bracket, a sealing drive and a sealing member; wherein, The sealing base is arranged close to the pressing mechanism; The sealing bracket is movably connected to the sealing base, and the sealing member is connected to the sealing bracket; The sealing drive is connected to the sealing bracket, and is used to drive the sealing bracket to move on the sealing base to drive the sealing member to approach or move away from the opening side of the packaging bag to seal the opening side.

5. The silicon wafer bag folding device according to claim 4, characterized in that: The sealing member includes: a clamp and a clamp driving member; wherein, The clamping jaw is movably connected to the sealing bracket, and the clamping jaw driving member is connected to the clamping jaw. The clamping jaw driving member is used to drive the clamping jaw to clamp the opening side or release the clamping of the opening side to seal the opening side.

6. The bag folding device according to claim 1, characterized in that: The pressing mechanism comprises: a pressing bracket, a pressing driving member, a pressing arm and a pressing block; The pressing bracket is arranged close to the conveying mechanism, the pressing arm is movably connected to the pressing bracket, the pressing driving member is connected to the pressing arm, and the pressing block is connected to the pressing arm; Wherein, when the conveying mechanism conveys the receiving platform to the target position of the pressing mechanism, the pressing driving member drives the pressing arm to rotate to the target position and descend until the pressing block is pressed onto the silicon wafer to discharge the air in the packaging bag of the silicon wafer.

7. The bag folding device according to claim 6, characterized in that: The pressing mechanism also includes: a limit sensor, which is connected to the pressing bracket, and is used to detect the position of the receiving platform. When the limit sensor detects that the conveying mechanism conveys the receiving platform to the target position, the conveying mechanism stops conveying the receiving platform to keep the receiving platform at the target position.

8. A method for folding silicon wafer bags, characterized in that: The silicon wafer bag folding method comprises: The receiving platform is used to receive the silicon wafers with packaging bags; The conveying mechanism is used to drive the receiving platform to be conveyed to the pressing mechanism; The pressing mechanism is used to press the silicon wafer to discharge the air in the packaging bag of the silicon wafer; The sealing mechanism is used to seal the opening side of the packaging bag; A bag folding mechanism is used to fold the sealed open side so that the open side is folded to a position where it fits the silicon wafer.

9. The silicon wafer bag folding method according to claim 8, characterized in that: The step of using a bag folding mechanism to fold the sealed open side so that the open side is folded to a position where it fits with the silicon wafer comprises: The lifting drive member of the bag folding mechanism is used to drive the first pressing plate and the second pressing plate to descend, so as to press the sealed opening side down to a vertical state; The flip driving member of the bag folding mechanism is used to drive the second pressing plate to flip, so as to flip the opening side in the vertical state to a position in contact with the bottom surface of the silicon wafer.

10. A silicon wafer packaging system, characterized in that: The silicon wafer packaging system comprises the silicon wafer bag folding device according to any one of claims 1 to 7.

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